CN110233122A - Semiconductor production line MES system and its experimental method - Google Patents
Semiconductor production line MES system and its experimental method Download PDFInfo
- Publication number
- CN110233122A CN110233122A CN201910481991.2A CN201910481991A CN110233122A CN 110233122 A CN110233122 A CN 110233122A CN 201910481991 A CN201910481991 A CN 201910481991A CN 110233122 A CN110233122 A CN 110233122A
- Authority
- CN
- China
- Prior art keywords
- production line
- mes system
- management module
- semiconductor production
- equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- General Factory Administration (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Abstract
The invention discloses a kind of semiconductor production line MES systems, it include: MES core, the MES core includes: that process control module is communicated with device talk terminal, master data management module, scheduler, scheduler module respectively, wherein, it further include experiment management module, the experiment management module is communicated with the master data management module, the process control module.A kind of experimental method of semiconductor production line MES system, wherein experiment management module obtains the main process flow in MES system, and one or more in main process flow processing step is replaced with experimental technique step by experiment management module.The present invention increases independent experiment management module in existing MES system; the available main process flow of experiment management module; and it can according to need and the processing step in main process flow is replaced with into experimental technique step; to the experiment model that the present invention can be automated on the basis of non-stop-machine.
Description
Technical field
The present invention relates to a kind of semiconductor system and experimental method more particularly to a kind of semiconductor production line MES system and
Its experimental method.
Background technique
The manufacturing process of semiconductor is complicated, and process can reach hundreds of steps, transistor, diode, capacitor, resistance on wafer
It is formed Deng being etched after the film for repeatedly covering special material on wafer.Therefore to the thickness of plated film and etching after
Thickness product quality and precision are crucial, be important recipe and (menu: disk done in production process every
One step processing specification) parameter.
MES system (the Manufacturing Execution System, i.e. manufacturing enterprise's production process of semicon industry
Execution system is the production information management system of a set of Manufacture Enterprise workshop execution level.) can be to all process steps
Recipe is managed, and with each production equipment by network connection, while managing production equipment, recipe is sent to
Equipment is collected simultaneously the processing result of equipment.
Since the production process of semiconductor is very fine and complicated, cause often not producing and design identical
Product, therefore to select most suitable production process and recipe most important to the production of semiconductor factory by experiment.And with
Production progress, once most suitable equipment and recipe parameter can drift about with the time, cause the deviation of quality, this
It is as caused by ageing equipment.Therefore, it is necessary to re-start experiment periodically to ensure the optimization of equipment Yu recipe parameter.
In the prior art, due to the increase of semiconductor die size, automation conveying uses more extensive.Recipe's
Number of parameters is more, during causing to manually set and being tested, the mistake that will cause often.In order to improve the production efficiency, it needs
The mobility of automation equipment is provided.
Under normal circumstances in order to guarantee factory arrange production efficiency, the production scheduling of each process and automatically send with charge free by
MES system is managed, while the scheduling of point inspection and the periodically maintenance of equipment is also managed in system, and is upset this
The reason of management includes the emergency cases such as equipment fault, but maximum the reason is that manual operation outside system control, causes producing line
Whole efficiency reduces.
Process when usually being tested is as follows:
Step 1: reservation Hold being carried out to product (Lot) before experimental procedure;
Step 2: operator is operated manually in system, i.e.,
Step 2.1: equipment is switched to off-line mode (not controlled by Upper system);
Step 2.2: Wafer (wafer) being put into different carriers for each Recipe;
Step 2.3: each Recipe, the Recipe for manually setting equipment are processed;
Step 2.4: after all Wafer (wafer) terminate, the processing result of the process being entered manually into the picture of MES
In face;
Step 2.5: all experiment Wafer (wafer) are put back into the carrier of script;
Step 2.6: the Hold of product is released, back in normal process flow;
Although automatic production line, but still need a large amount of manual operations.
Therefore, this invention address that providing a kind of method that the operation of experiment is also incorporated into automatic management.
Summary of the invention
Above-mentioned purpose of the invention is achieved through the following technical solutions:
A kind of semiconductor production line MES system, comprising: MES core, the MES core include: process control module
It is communicated respectively with device talk terminal, master data management module, scheduler, scheduler module, wherein further include experiment management
Module, the experiment management module are communicated with the master data management module, the process control module.
Semiconductor production line MES system as described above, wherein the device talk terminal is connected with production measurement and sets
It is standby;The scheduler connects haulage equipment.
A kind of experimental method of semiconductor production line MES system, wherein experiment management module obtains the master in MES system
One or more in main process flow processing step is replaced with experimental technique step by process flow, experiment management module.
The experimental method of semiconductor production line MES system as described above, wherein experiment management module is by process, menu
As experimental technique step typing MES system.
The experimental method of semiconductor production line MES system as described above, wherein experimental technique corresponding to each wafer
Step is defined.
The experimental method of semiconductor production line MES system as described above, wherein the production of the specified experiment of experiment management module
It product and is tested after executing the product of the experimental technique step, experiment management module collection processing result.
The experimental method of semiconductor production line MES system as described above, wherein device category is judged, if
For the equipment for specifying menu to wafer, then the location information and menu of each wafer are sent.
The experimental method of semiconductor production line MES system as described above, wherein device category is judged, if
Equipment to specify wafer processing, then send menu, same carrier is repeatedly processed in same equipment.
The experimental method of semiconductor production line MES system as described above, wherein device category is judged, if
For the equipment that wafer can not be specified to process, then product separation is carried out before carrying out experimental technique step, after completing experimental technique step,
Product merging is carried out, is returned in next main process flow.
The experimental method of semiconductor production line MES system as described above, wherein if it is needing using chip sorter
Equipment, then separate and merge technique in product is specified.
In conclusion the present invention increases independent experiment management module, experiment management module in existing MES system
Available main process flow, and can according to need and the processing step in main process flow is replaced with into experimental technique step,
To the experiment model that the present invention can be automated on the basis of non-stop-machine.Invention replaces original artificial realities
Operation mode is tested, the whole production efficiency of engineering is greatly improved.
Detailed description of the invention
Fig. 1 is the system block diagram of semiconductor production line MES system of the present invention;
Fig. 2 is the experiment flow figure of the experimental method of semiconductor production line MES system of the present invention;
Fig. 3 is the flow chart of the embodiment one of the experimental method of semiconductor production line MES system of the present invention;
Fig. 4 is the flow chart of the embodiment two of the experimental method of semiconductor production line MES system of the present invention;
Fig. 5 is the flow chart of the embodiment three of the experimental method of semiconductor production line MES system of the present invention.
Specific embodiment
The present invention is described further with reference to the accompanying drawings and examples:
Fig. 1 is the system block diagram of semiconductor production line MES system of the present invention, referring to Figure 1, a kind of semiconductor production line
MES system, comprising: MES core 1, MES core 1 include: process control module 13 respectively with device talk terminal 16, main
Data management module 11, scheduler 15, scheduler module 14 communicate, wherein further include experiment management module 12, experiment management
Module 12 is communicated with master data management module 11, process control module 13.
The present invention adds the functional module of experiment management, the module and other module phases in MES system in MES system
To independence, it is set for managing by experiment flow.Experiment flow is set, together referring to the main process flow information in MES
When, possess for the product (Lot) tested, starts the function of experimental procedure.Traditional is needed to stop by the present invention
The mode of process flow manual operation replaces with full automatic experiment model, greatly improves working efficiency.It is replaced in experiment flow
The process changed and the process of main flow are unanimously corresponding, and difference is only that parameter in Recipe, or the equipment chamber used, or
The equipment used is different, and the difference of recipe or chamber or equipment room are found with this.
Specifically, the abbreviation of relevant device module of the present invention is respectively as follows: 16 (ECT:Equipment of device talk terminal
Communication Terminal), master data management module 11 (MDM:Master Data Management), experiment management
Module 12 (EXC:Experiment Control Module), (the PFC:Process Flow of process control module 13
Control), scheduler 15 (DSP:Dispatcher), scheduler module 14 (SCH:Scheduler).
Further, device talk terminal 16 is connected with production measurement equipment 2;Scheduler 15 connects haulage equipment 3.The portion
Divide and uses production line in the prior art.
Fig. 2 is the experiment flow figure of the experimental method of semiconductor production line MES system of the present invention, refers to Fig. 2, the present invention
Also disclose a kind of experimental method of semiconductor production line MES system, wherein experiment management module obtains the master in MES system
One or more in main process flow processing step is replaced with experimental technique step by process flow, experiment management module.This
Invention can according to need the step of replacing main process flow, to realize the purpose of the experiment of automation.Experiment management module
It can according to need and one or more steps in main process flow are replaced.
The present invention is for the full-automatic production line such as semiconductor, the automatic system for carrying out following experiential function.To specific work
Recipe (the menu of sequence.Each step processing specification that disk is done in production process) small change is carried out, by subsequent
The measured value of process is measured to select the most suitable Recipe of the process.For same Recipe, equipment is adjusted, or to same
One equipment changes the position of Chamber (vacuum chamber, reaction chamber) or cassette, selects most suitable Chamber or cassette.
Further, experiment management module regard process, menu (Recipe) as experimental technique step typing MES system.
Further, the corresponding experimental technique step of each wafer is defined.
Further, it is carried out in fact after the specified product tested of experiment management module and the product for executing the experimental technique step
It tests, experiment management module collection processing result.
The present invention can according to need creation experiment model, using process, Recipe as basic data inputting into system,
The process carried out and each Wafer is needed to need to be defined in the processing (Recipe) that the process carries out experiment.Simultaneously
Define main process flow (needing the master operation replaced with experimental procedure) corresponding to the experiment model.
Further, the present invention can specify experiment Lot, and the specified Lot for needing to be implemented the experiment is tested, according to
The experiment flow of setting sends Lot with charge free, separates, processing, sending with charge free, and (processing step specifically used is according to different equipment classes
Type is selected, and embodiment later is discussed in greater detail) and collect processing result.
Fig. 3 is the flow chart of the embodiment one of the experimental method of semiconductor production line MES system of the present invention, refers to Fig. 3,
Device category is judged, if it is the equipment (equipment that Recipe can be specified to Wafer) for specifying menu to wafer, is sent out
Send the location information and menu of each wafer.
Specifically, in this case, need by each wafer (position when practical application by wafer in carrier, i.e.,
Slot No.) and corresponding Recipe be sent to equipment.
Such as:
Recipe:
Slot01~10:RecipeB '
Slot11~25:RecipeB "
Recipe:
Slot01~10:RecipeC '
Slot11~25:RecipeC "
Fig. 4 is the flow chart of the embodiment two of the experimental method of semiconductor production line MES system of the present invention, refers to Fig. 4,
Device category is judged, if it is the equipment of specified wafer processing, sends menu, same carrier in same equipment into
Row repeatedly processing.
Specifically, can specify the equipment that Wafer No. (practical is the Slot No. of carrier) is processed.Time processing
There can only be a Recipe.Such case is presented as that B ' process, B " process, C ' process, C " process are (same in experiment flow
Carrier is processed repeatedly on one device).
Fig. 5 is the flow chart of the embodiment three of the experimental method of semiconductor production line MES system of the present invention, refers to Fig. 5,
Device category is judged, the equipment if it is wafer can not be specified to process carries out product before carrying out experimental technique step
Separation after completing experimental technique step, carries out product merging, returns in next main process flow.
Further, if it is the equipment needed using chip sorter, separate and merge in technique to product into
Row is specified.
Specifically, for the equipment that Wafer can not be specified to process in embodiment three.Advance in the B process of above-mentioned example
Row Lot separation, and after C process, Lot is merged into the Lot of script.Separation/merging is needed using Wafer Sorter
Equipment, need specified Slot separate/merge.
The preferred embodiment of the present invention has been described in detail above.It should be appreciated that those skilled in the art or
Be universal model fan may not need creative work or by software programming can it is according to the present invention design make
Many modifications and variations.Therefore, all technician in the art or universal model fan exist under this invention's idea
It, all should be by weighing by the available technical solution of logical analysis, reasoning, or a limited experiment on the basis of the prior art
In protection scope determined by sharp claim.
Claims (10)
1. a kind of semiconductor production line MES system, comprising: MES core, the MES core include: process control module point
It is not communicated with device talk terminal, master data management module, scheduler, scheduler module, which is characterized in that further include experiment
Management module, the experiment management module are communicated with the master data management module, the process control module.
2. semiconductor production line MES system according to claim 1, which is characterized in that the device talk terminal connection
There is production measurement equipment;The scheduler connects haulage equipment.
3. a kind of experimental method of semiconductor production line MES system, which is characterized in that experiment management module obtains in MES system
Main process flow, experiment management module by one or more in main process flow processing step replace with experimental technique walk
Suddenly.
4. the experimental method of semiconductor production line MES system according to claim 1, which is characterized in that experiment management mould
Block is using process, menu as experimental technique step typing MES system.
5. the experimental method of semiconductor production line MES system according to claim 1, which is characterized in that each wafer
Corresponding experimental technique step is defined.
6. the experimental method of semiconductor production line MES system according to claim 1, which is characterized in that experiment management mould
It is tested after the specified product tested of block and the product for executing the experimental technique step, experiment management module collection processing knot
Fruit.
7. the experimental method of semiconductor production line MES system according to claim 1, which is characterized in that device category
Judged, the equipment if it is menu is specified to wafer, sends the location information and menu of each wafer.
8. the experimental method of semiconductor production line MES system according to claim 1, which is characterized in that device category
Judged, if it is the equipment of specified wafer processing, sends menu, same carrier carries out repeatedly adding in same equipment
Work.
9. the experimental method of semiconductor production line MES system according to claim 1, which is characterized in that device category
Judged, the equipment if it is wafer can not be specified to process, carry out product separation before carrying out experimental technique step, is completed real
After testing processing step, product merging is carried out, is returned in next main process flow.
10. the experimental method of semiconductor production line MES system according to claim 9, which is characterized in that if it is needs
Using the equipment of chip sorter, then product is specified in separation and merging technique.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910481991.2A CN110233122A (en) | 2019-06-04 | 2019-06-04 | Semiconductor production line MES system and its experimental method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910481991.2A CN110233122A (en) | 2019-06-04 | 2019-06-04 | Semiconductor production line MES system and its experimental method |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110233122A true CN110233122A (en) | 2019-09-13 |
Family
ID=67858399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910481991.2A Pending CN110233122A (en) | 2019-06-04 | 2019-06-04 | Semiconductor production line MES system and its experimental method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110233122A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117434871A (en) * | 2023-12-07 | 2024-01-23 | 成都芯极客科技有限公司 | Dynamic process parameter management method for experimental batch |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1541348A (en) * | 2001-08-14 | 2004-10-27 | 应用材料有限公司 | Experiment management system, method and medium |
CN103824136A (en) * | 2014-03-13 | 2014-05-28 | 西安工业大学 | MES (Manufacturing Execution System) dynamic workshop scheduling and manufacturing execution system |
CN103870587A (en) * | 2014-03-27 | 2014-06-18 | 上海华力微电子有限公司 | Method for establishing semiconductor manufacturing test technological processes |
US20150153723A1 (en) * | 2013-12-03 | 2015-06-04 | Siemens Aktiengesellschaft | Method, system and computer readable medium for managing design updates in a manufacturing execution system |
CN105045243B (en) * | 2015-08-05 | 2017-08-25 | 同济大学 | A kind of Dynamic Schedule of Semiconductor Fabrication Line device |
-
2019
- 2019-06-04 CN CN201910481991.2A patent/CN110233122A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1541348A (en) * | 2001-08-14 | 2004-10-27 | 应用材料有限公司 | Experiment management system, method and medium |
US20150153723A1 (en) * | 2013-12-03 | 2015-06-04 | Siemens Aktiengesellschaft | Method, system and computer readable medium for managing design updates in a manufacturing execution system |
CN103824136A (en) * | 2014-03-13 | 2014-05-28 | 西安工业大学 | MES (Manufacturing Execution System) dynamic workshop scheduling and manufacturing execution system |
CN103870587A (en) * | 2014-03-27 | 2014-06-18 | 上海华力微电子有限公司 | Method for establishing semiconductor manufacturing test technological processes |
CN105045243B (en) * | 2015-08-05 | 2017-08-25 | 同济大学 | A kind of Dynamic Schedule of Semiconductor Fabrication Line device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117434871A (en) * | 2023-12-07 | 2024-01-23 | 成都芯极客科技有限公司 | Dynamic process parameter management method for experimental batch |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1910955B1 (en) | Automated job management | |
US6360133B1 (en) | Method and apparatus for automatic routing for reentrant process | |
CN101128786B (en) | Automated throughput control system and method of operating the same | |
CN100394442C (en) | Executing system of semiconductor crystal circle manufacture with composition distribution and management database | |
CN100367140C (en) | Method and apparatus for controlling tool using baseline control script | |
TW201931228A (en) | Automatic equipment management system and method thereof | |
CN112435937B (en) | Automatic control system and method for wafer test | |
US8504186B2 (en) | Method for automatic generation of throughput models for semiconductor tools | |
CN100362479C (en) | System and method for testing measured object based on automatic test script | |
US20140143006A1 (en) | Systems and Methods to Enhance Product Yield for Semiconductor Manufacturing | |
JP3275968B2 (en) | Equipment control method in production line | |
CN104425300A (en) | Work-in-process measurement sampling method and device | |
CN111240935A (en) | Automatic intelligent operation and maintenance system and operation and maintenance method | |
CN110233122A (en) | Semiconductor production line MES system and its experimental method | |
US6909933B2 (en) | Method, device, computer-readable memory and computer program element for the computer-aided monitoring and controlling of a manufacturing process | |
CN107168253A (en) | Computer integrated manufacturing system and its manufacture method | |
CN112292644A (en) | Constrained programming using block-based workflows | |
US20020168806A1 (en) | Automated processing method and system for product wafer and non product wafer, and recording medium in which the method is recorded | |
US20230078371A1 (en) | Method and apparatus for controlling wafer preparation | |
US6556882B1 (en) | Method and apparatus for generating real-time data from static files | |
US7206653B1 (en) | Wafer-based planning methods and systems for batch-based processing tools | |
CN103578901A (en) | Sequencer for combining automated and manual-assistance jobs in a charged particle beam device | |
US20020198617A1 (en) | System and method for controlling priority of lots employed in MES | |
CN114004446B (en) | Method for measuring and calculating working hours of multi-variety small-batch hybrid integrated circuit products | |
CN112262350A (en) | Block-based prediction for manufacturing environments |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190913 |
|
RJ01 | Rejection of invention patent application after publication |