CN110224085A - The manufacturing method of lateral choke encapsulating structure - Google Patents
The manufacturing method of lateral choke encapsulating structure Download PDFInfo
- Publication number
- CN110224085A CN110224085A CN201910655184.8A CN201910655184A CN110224085A CN 110224085 A CN110224085 A CN 110224085A CN 201910655184 A CN201910655184 A CN 201910655184A CN 110224085 A CN110224085 A CN 110224085A
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- China
- Prior art keywords
- choke
- lateral
- manufacturing
- encapsulating structure
- optical cement
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Packaging Frangible Articles (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of manufacturing method of lateral choke encapsulating structure, first the liquid optical cement through polarization process is coated on substrate, and by the mode of Electrostatic Absorption, choke predecessor is allowed to be able to the liquid optical cement surface adsorbed and be fixed on around substrate through electrostatic disk, also change the pattern of liquid optical cement simultaneously, it is incorporated into choke predecessor above liquid optical cement and forms lateral gas barrier layer via precuring again, then, barrier layer in covering, solidification is fully sealed after carrying out again to reach, to complete to encapsulate.Known yellow light process is omitted in this production method, helps to realize one-stop encapsulation process, not only can effective choke, can more shorten processing time, reduce production cost.
Description
Technical field
The present disclosure generally relates to a kind of gas barrier film encapsulation technologies, and the lateral resistance of yellow light process can be omitted in particular to one kind
The manufacturing method of sealing gland assembling structure.
Background technique
In order to meet modern consumer for lightweight, pliability required by electronic product, impact resistance and can carry
The surcharges such as property, the technology trends in display material, have been gradually replaced by plastic base traditional in recent years
Glass substrate.
For Organic Light Emitting Diode (OLED) display, using glass substrate despite highly reliable, but lack
Weary flexibility, it is not light enough, it is difficult to meet every demand of flexible display.Fig. 1 is please referred to, it is aobvious in known bendable OLED
Show in the basic structure of device, using plastic base 10 replace rigid OLED displays in glass substrate, can provide it is frivolous, can
It scratches and the characteristic of impact resistance, but plastic base 10 is bad for the aqueous vapor of external environment and the barrier performance of oxygen, leads to OLED
Element 20 is easily damaged, it is therefore desirable to increase lateral air-block structure (Side Wall Barrier) 30, to ensure OLED element 20
Function and service life.
However, as shown in Figures 2 to 4, current uses the encapsulation procedure of the OLED display of lateral air-block structure 30,
It is first to produce the convex block 31 (see Fig. 2) that height is the left and right 200 nanometers (nm) around with yellow light process, is coated choke forerunner
Object 32 (see Fig. 3) obtains lateral air-block structure 30 after baking, and use the sheet type glue material of low air release property as barrier layer 40 into
Row sealing (see Fig. 4).
The encapsulation process of known techniques is complex, after first need to carrying out yellow light process, then carries out screen printing processing, needs to move
In different processing procedure website makings, speed of production is not only limited, the promotion for also resulting in production efficiency is difficult, and production cost is also difficult
It reduces.Therefore a kind of optimization processing procedure in need for seeking lateral choke encapsulating structure.
Summary of the invention
In view of this, the main purpose of the present invention is to provide a kind of manufacturing method of lateral choke encapsulating structure, be by
Lateral gas barrier layer is formed by Electrostatic Absorption mode, can achieve effective choke, and helps to realize one-stop encapsulation process, from
And processing procedure can be simplified, time and cost are reduced, the various missings of above-mentioned prior art can be thoroughly solved.
Therefore, in order to achieve the above object, the present invention proposes a kind of manufacturing method of lateral choke encapsulating structure, firstly, will be through
The liquid optical cement of polarization process is coated on substrate, and choke predecessor is coated on around the adsorption plane of electrostatic disk, choke
There is an electrostatic adsorption force between predecessor and adsorption plane.Then, connect choke predecessor close to substrate the adsorption plane of electrostatic disk
The liquid optical cement around substrate is touched, meanwhile, change the pattern of the liquid optical cement around substrate by electrostatic adsorption force.It releases
Electrostatic adsorption force removes electrostatic disk, leaves choke predecessor and be covered on liquid optical cement, and carry out precuring, to form side
To gas barrier layer.Finally, barrier layer is covered in above substrate by lateral gas barrier layer, then solidify after carrying out, to complete to encapsulate.
Embodiment according to the present invention, the aforementioned liquid optical cement through polarization process are to make liquid optics by application voltage
The surface of glue generates obtained by polarization charge.
Embodiment according to the present invention, aforesaid base plate can be glass substrate or plastic base.
Embodiment according to the present invention, foregoing plastics substrate can be polyimides (PI), polycarbonate (PC), polyether sulfone
(PES), polyacrylate (PA), polynorbornene (PNB), polyethylene terephthalate (PET), poly- diether ketone
(PEEK), polyethylene naphthalate (PEN) or polyetherimide (PEI).
Embodiment according to the present invention, the height of aforementioned lateral gas barrier layer are 100~200 nanometers (nm).
Embodiment according to the present invention, the height that aforementioned choke predecessor is covered on the liquid optical cement around substrate are
20~50 nanometers (nm).
Embodiment according to the present invention, aforesaid base plate is equipped with light-emitting component, and lateral gas barrier layer is located at light-emitting component week
It encloses；Preferably, light-emitting component can be active organic light-emitting diode (AMOLED) or micro- light emitting diode (Micro LED).
Embodiment according to the present invention, aforementioned liquid optical cement can be thermohardening type liquid optical cement or ultraviolet hardening
Liquid optical cement.
Embodiment according to the present invention, aforementioned barrier layer can be selected from silica, silicon nitride, silicon oxynitride and aluminum oxide
At least one.
Embodiment according to the present invention, aforementioned electrostatic disk can be rectangular, round or triangle.
Compared to the encapsulation procedure of known techniques, the manufacturing method of lateral choke encapsulating structure provided by the present invention is saved
Yellow light process has been omited, but by the mode of Electrostatic Absorption, choke predecessor is adsorbed and is fixed on the liquid through polarization process
On optical cement, while also changing the pattern of liquid optical cement, so that choke predecessor and liquid optical cement after hardening being capable of shapes
At lateral gas barrier layer, to reach the encapsulation of effective choke.Therefore, the present invention is having one-stop encapsulation process, make manufacture at
This is greatly reduced with the production time.
The beneath figure elaborate appended by specific embodiment cooperation, when purpose, the technology for being easier to understand the present invention
Content, feature and its it is reached the effect of.
Detailed description of the invention
Fig. 1 is a kind of basic structure of known bendable OLED display.
Fig. 2 to Fig. 4 is the encapsulation procedure of the known OLED display using lateral air-block structure.
Fig. 5 is the flow chart of the manufacturing method of the lateral choke encapsulating structure of the embodiment of the present invention.
Fig. 6 to Figure 11 corresponds to the structure of each step in the manufacturing method for the lateral choke encapsulating structure of the embodiment of the present invention
Schematic diagram.
Figure 12 is the enlarged cross-sectional view of the obtained lateral gas barrier layer of the embodiment of the present invention.
Figure 13 uses schematic diagram for the obtained lateral choke encapsulating structure of the embodiment of the present invention.
Figure 14 and Figure 15 is the schematic diagram that electrostatic disk of different shapes is used in the embodiment of the present invention.
Appended drawing reference:
10 plastic bases
20 OLED elements
30 sides are to air-block structure
31 convex blocks
32 choke predecessors
40 barrier layers
110 substrates
111 glass support plates
112 polyimide films
120 liquid optical cements
130 electrostatic disks
130A circle electrostatic disk
130B triangle electrostatic disk
131 adsorption planes
140 choke predecessors
150 sides are to gas barrier layer
160 barrier layers
170 light-emitting components
Specific embodiment
The invention discloses a kind of manufacturing method of lateral choke encapsulating structure, this lateral choke encapsulating structure is applied to display
The encapsulation of light-emitting component in device enters to block aqueous vapor or gas.
Referring to Fig. 5, it illustrates the manufacturing method and his like for the lateral choke encapsulating structure that embodiments of the present invention provide
Cheng Tu；Meanwhile Fig. 6 to Figure 11 is please referred to, by the manufacturing method for the lateral choke encapsulating structure that embodiments of the present invention provide
The structural schematic diagram of middle each step of correspondence.
Firstly, step S10 is seen, as shown in fig. 6, providing the liquid optical cement once polarization (Polarization) processing
(LOCA is commonly called as glue) 120, by liquid optical cement 120 in being coated on substrate 110 comprehensively.
In the present embodiment, the liquid optical cement 120 through polarization process is to make its table by applying a voltage to liquid optical cement
Face generates polarization charge and provided later, and is coated on substrate 110 via coating machine.Wherein, liquid optical cement 120 can be
Thermohardening type liquid optical cement or ultraviolet hardening liquid optical cement.In addition, the operating condition of polarization process includes: polarization electricity
Pressure is 0.5~5 kilovolt (kV), and the polarization time is 3~8 seconds.
In the present embodiment, using strata acid imide (polyimide, a PI) film 112 is coated in glass support plate 111 in advance
For substrate 110.And in practical application, the substrate 110 of the present invention can be glass substrate or plastic base, the material of plastic base
It may be, for example, polyimides (polyimide, PI), polycarbonate (polycarbonate, PC), polyether sulfone
(polyethersulfone, PES), polyacrylate (polyacrylate, PA), polynorbornene (polynorbornene,
PNB), polyethylene terephthalate (polyethyleneterephthalate, PET), poly- diether ketone
(polyetheretherketone, PEEK), polyethylene naphthalate (polyethylenenaphthalate, PEN) or
Polyetherimide (polyetherimide, PEI).
See step S20, as shown in fig. 7, providing an electrostatic disk 130, then as shown in figure 8, choke predecessor 140 is coated on
Around the adsorption plane 131 of 130 lower section of electrostatic disk, so that having an electrostatic adsorption force between choke predecessor 140 and adsorption plane 131.
Then, step S30 is seen, as shown in figure 9, by the adsorption plane 131 of electrostatic disk 130 close to substrate 110, so that before choke
It drives object 140 and just contacts 120 surface of liquid optical cement around substrate 110, and can will be around substrate 110 by electrostatic adsorption force
Liquid optical cement 120 change pattern.
Later, see step S40, as shown in Figure 10, electrostatic adsorption force is released, and remove electrostatic disk 130, to leave liquid light
Glue 120 and choke predecessor 140 are learned on substrate 110, and choke predecessor 140 is covered in the liquid optics around substrate 110
120 top of glue, then precuring is carried out with choke predecessor 140 for the liquid optical cement 120 on substrate 110, to form side
To gas barrier layer 150.
In the present embodiment, the height D of lateral gas barrier layer 150 is about 100~200 nanometers (nm), and choke predecessor 140 covers
The height d for being placed on 120 top of liquid optical cement around substrate 110 is about 20~50 nanometers (nm), as shown in figure 12.
Finally, seeing step S50, as shown in figure 11, barrier layer 160 is covered on substrate 110 by lateral gas barrier layer 150
Side, then solidify after carrying out, to complete to encapsulate.
In the present embodiment, the material of barrier layer 160 can be selected from silica, silicon nitride, silicon oxynitride and aluminum oxide extremely
It is one of few.
Figure 13 is please referred to, be painted the obtained lateral choke encapsulating structure of the embodiment of the present invention uses schematic diagram.
In the lateral choke encapsulating structure of the present embodiment, in a light-emitting component 170, and lateral resistance can be equipped on substrate 110
Gas-bearing formation 150 is located at around light-emitting component 170, acts on by the choke of lateral gas barrier layer 150, so that barrier layer 160 and substrate 110
Between form a confined space, with closed light-emitting component 170, thus prevent external environment aqueous vapor and oxygen enter the confined space
It is interior, to ensure the efficiency and service life of light-emitting component 170.Any display architectures that present invention can apply to need to encapsulate, it is special
It is not also applied on flexible display now prevailing, light-emitting component 170 may be, for example, active organic light-emitting diode
(AMOLED) or micro- light emitting diode (Micro LED).
In addition, above-described embodiment uses frame-type electrostatic disk 130, and it is frame type, and block form is presented with coating and surrounds
Choke predecessor 140 (see Fig. 8)；In practice, frame-type electrostatic disk 130 can be designed according to the shape of different encapsulating structures, be removed
The arbitrarily encapsulation boundary figure such as circle, triangle can be also presented in rectangular frame-type electrostatic disk.As shown in Figure 14 and Figure 15,
It is painted round electrostatic disk 130A and triangle electrostatic disk 130B respectively.
In conclusion the manufacturing method of the lateral choke encapsulating structure disclosed by according to the present invention, is utilizing Electrostatic Absorption
Mode, allow choke predecessor to be fixed on the liquid optical cement surface through polarization process, while also changing liquid by electrostatic
The pattern of optical cement after then eliminating electrostatic adsorption force, can leave choke predecessor and be covered on liquid optical cement, and then be made
Lateral gas barrier layer with choke ability.Compared to known techniques, present invention omits known yellow light processes, need not only adopt
One-stop encapsulation process is helped to realize without different processing procedure websites are displaced into expensive equipment and complicated step,
But also manufacturing cost will be greatly reduced with the production time.
The embodiment of the above is only technical idea and feature to illustrate the invention, and purpose makes to be familiar with this skill
The personage of skill can understand the content of the present invention and implement accordingly, when cannot with the restriction present invention the scope of the patents, i.e., generally
The equivalent change or modification made according to disclosed spirit, should cover in the scope of the patents of the present invention.
Claims (11)
1. a kind of manufacturing method of lateral choke encapsulating structure, which is characterized in that comprise the steps of
It will be coated on a substrate once the liquid optical cement of polarization process；
One choke predecessor is coated on around an adsorption plane of an electrostatic disk, has one between the choke predecessor and the adsorption plane
Electrostatic adsorption force；
By the adsorption plane of the electrostatic disk close to the substrate, make the liquid optics around the choke Precursor exposure substrate
Glue, and change by the electrostatic adsorption force pattern of the liquid optical cement around the substrate；
The electrostatic adsorption force is released, the choke predecessor is left and is covered on the liquid optical cement, and carry out precuring, to be formed
One side is to gas barrier layer；And
One barrier layer is covered in above the substrate by the lateral gas barrier layer, then is solidified after carrying out, to complete to encapsulate.
2. the manufacturing method of lateral choke encapsulating structure as described in claim 1, the wherein liquid optics through polarization process
Glue, which is applied voltage by a liquid optical cement, provides its surface generation polarization charge.
3. the manufacturing method of lateral choke encapsulating structure as described in claim 1, wherein the substrate is glass substrate or plastics
Substrate.
4. the manufacturing method of lateral choke encapsulating structure as claimed in claim 3, wherein the plastic base is polyimides, gathers
Carbonic ester, polyether sulfone, polyacrylate, polynorbornene, polyethylene terephthalate, poly- diether ketone, poly- naphthalenedicarboxylic acid
Glycol ester or polyetherimide.
5. the manufacturing method of lateral choke encapsulating structure as described in claim 1, wherein the height of the lateral gas barrier layer is 100
~200 nanometers.
6. the manufacturing method of lateral choke encapsulating structure as described in claim 1, wherein the choke predecessor is covered in the base
The height on the liquid optical cement around plate is 20~50 nanometers.
7. the manufacturing method of lateral choke encapsulating structure as described in claim 1, wherein the substrate is equipped with a light-emitting component,
And the lateral gas barrier layer is located at around the light-emitting component.
8. the manufacturing method of lateral choke encapsulating structure as claimed in claim 7, wherein the light-emitting component is active organic
Light emitting diode or micro- light emitting diode.
9. the manufacturing method of lateral choke encapsulating structure as described in claim 1, wherein the liquid optical cement is thermohardening type
Liquid optical cement or ultraviolet hardening liquid optical cement.
10. the manufacturing method of lateral choke encapsulating structure as described in claim 1, wherein the barrier layer is selected from silica, nitrogen
SiClx, silicon oxynitride and aluminum oxide at least one.
11. the manufacturing method of lateral choke encapsulating structure as described in claim 1, wherein the electrostatic disk to be rectangular, round or
Triangle.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910655184.8A CN110224085B (en) | 2019-07-19 | 2019-07-19 | Manufacturing method of lateral air-barrier packaging structure |
| TW108126213A TWI695532B (en) | 2019-07-19 | 2019-07-24 | Method for manufacturing side wall barrier package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910655184.8A CN110224085B (en) | 2019-07-19 | 2019-07-19 | Manufacturing method of lateral air-barrier packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110224085A true CN110224085A (en) | 2019-09-10 |
| CN110224085B CN110224085B (en) | 2021-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910655184.8A Active CN110224085B (en) | 2019-07-19 | 2019-07-19 | Manufacturing method of lateral air-barrier packaging structure |
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| TW (1) | TWI695532B (en) |
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| KR20140061095A (en) * | 2012-11-13 | 2014-05-21 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus and method of manufacturing the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW202105794A (en) | 2021-02-01 |
| CN110224085B (en) | 2021-06-11 |
| TWI695532B (en) | 2020-06-01 |
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