CN110211999B - Display panel preparation method and display panel - Google Patents
Display panel preparation method and display panel Download PDFInfo
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- CN110211999B CN110211999B CN201910472086.0A CN201910472086A CN110211999B CN 110211999 B CN110211999 B CN 110211999B CN 201910472086 A CN201910472086 A CN 201910472086A CN 110211999 B CN110211999 B CN 110211999B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention discloses a display panel and a preparation method thereof. The preparation method of the display panel comprises the following steps: providing a display panel mother board, wherein the display panel mother board is provided with a plurality of display areas distributed in an array manner and packaging areas distributed around the display areas, the display panel mother board comprises an array mother substrate and a mother cover plate which are arranged oppositely, packaging materials are arranged between the array mother substrate and the mother cover plate corresponding to the packaging areas, and light-emitting modules are arranged corresponding to the display areas; pre-packaging, namely performing semi-curing treatment on the packaging material to form first packaging glue; cutting the display panel mother board, presetting a cutting track between adjacent packaging areas, and cutting the display panel mother board along the cutting track; and packaging, namely curing the first packaging adhesive to form second packaging adhesive so as to obtain the display panel. The preparation method of the display panel provided by the invention can improve the packaging performance of the display panel and effectively prevent oxygen, water vapor and the like from entering the display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a preparation method thereof.
Background
With the wide application of Organic Light-Emitting Diode (OLED) display panels, people have higher and higher requirements for the display performance of OLED display panels. If the packaging effect of the display panel is poor, oxygen or water vapor and the like can easily enter the display panel, so that devices in the display panel are corroded, and the display performance of the OLED display panel is further influenced.
Disclosure of Invention
The embodiment of the invention provides a display panel and a preparation method thereof, wherein the preparation method of the display panel aims to improve the packaging performance of the display panel and further prevent oxygen or water vapor from entering the display panel to influence the display performance of the display panel.
In a first aspect, a method for manufacturing a display panel according to an embodiment of the present invention includes: providing a display panel mother board, wherein the display panel mother board is provided with a plurality of display areas distributed in an array manner and packaging areas distributed around the display areas, the display panel mother board comprises an array mother substrate and a mother cover plate which are arranged oppositely, packaging materials are arranged between the array mother substrate and the mother cover plate corresponding to the packaging areas, and light-emitting modules are arranged corresponding to the display areas; pre-packaging, namely performing semi-curing treatment on the packaging material to form first packaging glue; cutting the display panel mother board, presetting a cutting track between adjacent packaging areas, and cutting the display panel mother board along the cutting track; and packaging, namely curing the first packaging adhesive to form second packaging adhesive so as to obtain the display panel, wherein the curing degree of the first packaging adhesive is 30% -70% of that of the second packaging adhesive.
According to an aspect of the present invention, optionally, the curing degree of the first encapsulation adhesive is 40% to 55% of the curing degree of the second encapsulation adhesive.
According to an aspect of the present invention, in the pre-encapsulating step, the pre-encapsulating includes performing a semi-curing process on the encapsulating material by ultraviolet irradiation; wherein the moving speed of the ultraviolet radiation source is 4-15 mm/S, and the ultraviolet dose is 4.5(μ W.S/cm)2)～6.5(μW·S/cm2)。
According to an aspect of the present invention, the cutting of the mother substrate for a display panel includes: and cutting at least one of the array mother substrate and the mother cover plate along the cutting track to form a partition area on the mother display panel.
According to an aspect of the invention, after the encapsulating step, further comprising: and a cutting step of cutting the display panel mother board again to form a plurality of display panels, wherein the cutting is performed again along the cutting area according to the cutting track.
According to an aspect of the present invention, in at least one of the step of cutting the array mother substrate and the mother substrate along the cutting trace: cutting the array mother substrate along the cutting track to a depth h1And the thickness h of the array mother substrate2Satisfies the following conditions: 1/4 is less than or equal to h1/h2Less than or equal to 1/2; or cutting the female cover plate along the cutting track to a depth h3And the thickness h of the female cover plate4Satisfies the following conditions: 1/4 is less than or equal to h3/h4≤1/2。
According to an aspect of the present invention, in the cutting of the mother substrate of the display panel, the cutting and breaking are performed along a cutting track to form a plurality of display units; in the packaging process, the first packaging adhesive on the display unit is cured to form second packaging adhesive so as to obtain the display panel.
According to an aspect of the present invention, before providing the display panel mother board, the method further includes: providing a bearing plate, wherein the bearing plate is provided with a bearing surface and used for placing a display panel mother board; optionally, the supporting plate is made of an antistatic material or the carrying surface is provided with a conductive layer.
According to one aspect of the invention, the encapsulating material is a glass frit.
In a second aspect, an embodiment of the present invention provides a display panel, which is manufactured by the above display panel manufacturing method.
The display panel preparation method provided by the embodiment of the invention is characterized in that a mother board of the display panel is pre-packaged, so that a packaging material arranged between an array mother board and a mother cover board is semi-cured to obtain a first packaging adhesive, the first packaging adhesive has adhesive property at the moment, the array mother board and the mother cover board are connected through the first packaging adhesive, the mother board of the display panel is cut after the pre-packaging, the curing degree of the first packaging adhesive is lower at the moment, when the cutting force is applied when the mother board of the display panel is cut, the first packaging adhesive can absorb partial cutting force to reduce the damage of the cutting to the first packaging adhesive, the first packaging adhesive is cured to form a second packaging adhesive after the mother board of the display panel is cut to obtain the display panel, and the cutting is carried out after the pre-packaging step, so that the damage of the cutting force to the second packaging adhesive on the display panel can be effectively reduced, and further, the packaging strength and the product yield of the display panel can be improved.
Drawings
In the following, brief descriptions will be given to the drawings required to be used in the embodiments of the present invention, and those skilled in the art can obtain other drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;
FIGS. 2a to 2e are schematic views illustrating a manufacturing process of one embodiment of a method for manufacturing a display panel according to the present invention;
FIG. 3 is a schematic cross-sectional view A-A of FIG. 2 c;
FIGS. 4a to 4e are schematic views illustrating a manufacturing process of another embodiment of a method for manufacturing a display panel according to the present invention;
fig. 5 is a display panel manufactured by the display panel method according to the embodiment of the present invention.
Description of the labeling:
wherein:
1-display panel mother board; 10-an array mother substrate; 11-an array substrate; 20-a female cover plate; 21-cover plate; 31-first packaging glue; 32-second packaging glue; 40-a display area; 50-a packaging area; 60-a partition; 2-a cutting device; 3-a display panel; 33-an organic light emitting module; 4-display unit.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
The OLED display panel is generally constructed by disposing an organic layer including an emission layer between a first electrode and a second electrode. Specifically, a first electrode is formed on the array substrate, the first electrode may be an anode having a function of injecting holes, an organic layer is stacked on the first electrode, and then a second electrode is formed on the organic layer, the second electrode being disposed opposite to the first electrode, the second electrode may be a cathode having a function of injecting electrons, and the organic layer generally includes functional layers such as a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer, in addition to the organic light emitting material layer. However, organic materials are easy to react with water and oxygen, and the display effect is affected, so that the OLED display panel has very high requirements on the encapsulation effect.
The current glass cement packaging method generally comprises the following steps: the screen printing machine coats the packaging glue on the mother cover plate, after high-temperature baking and shaping, the array mother substrate and the mother cover plate are pressed through pressing equipment, then the packaging glue is sintered, the packaging glue is solidified to complete the packaging of the mother plate of the display panel, and finally the mother plate of the display panel is cut to form the display panel with the corresponding size. However, in the method, the packaging adhesive is brittle after being cured, and the thermal expansion coefficient and the thermal conductivity of the packaging material and the array mother substrate or the mother cover plate are not completely the same, so that a shearing force is generated on a contact surface of the packaging adhesive and the array mother substrate or the mother cover plate in a cutting process, the packaging adhesive is damaged by the shearing force, the packaging failure of a product is caused, further, water vapor or oxygen enters from a damaged position of the packaging adhesive, pixels are corroded, poor display such as black spots is generated, the display performance of the display panel is affected, and even the service life of the display panel is shortened.
In order to solve the above problems, embodiments of the present invention provide a method for manufacturing a display panel, which aims to improve the packaging performance of the display panel, and further improve the display performance and the service life of the display panel. The display panel may be manufactured individually or in batch, where the method of manufacturing individually is similar to that of manufacturing in batch, and the embodiment of the present invention is described by taking a manufacturing method of producing display panels in batch as an example. Fig. 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention.
Referring to fig. 1, a method for manufacturing a display panel according to an embodiment of the present invention includes:
s110, a display panel mother board is provided, the display panel mother board is provided with a plurality of display areas distributed in an array mode and packaging areas distributed around the display areas, the display panel mother board comprises an array mother board and a mother cover board which are arranged oppositely, packaging materials are arranged between the array mother board and the mother cover board corresponding to the packaging areas, and light emitting modules are arranged corresponding to the display areas.
And S120, pre-packaging, and performing semi-curing treatment on the packaging material to form first packaging glue.
And S130, cutting the display panel mother board, presetting a cutting track between adjacent packaging areas, and cutting the display panel mother board along the cutting track.
And S140, packaging, namely curing the first packaging adhesive to form second packaging adhesive so as to obtain the display panel.
The display panel preparation method provided by the embodiment of the invention pre-encapsulates the display panel motherboard to semi-cure the encapsulating material arranged between the array motherboard and the motherboard to form first encapsulating glue, at the moment, the first encapsulating glue has adhesive property, so that the array motherboard is connected with the motherboard through the first encapsulating glue, the motherboard of the display panel is cut after pre-encapsulation, at the moment, the curing degree of the first encapsulating glue is lower, when the cutting force is applied when the motherboard of the display panel is cut, the first encapsulating glue can absorb partial cutting force to reduce the damage to the first encapsulating glue, the first encapsulating glue is cured after the motherboard of the display panel is cut to form second encapsulating glue to form the display panel, and because the cutting is performed after the pre-encapsulation step, the damage to the second encapsulating glue on the display panel caused by the cutting force can be effectively reduced, and further, the packaging strength and the product yield of the display panel can be improved.
The array mother substrate comprises a substrate and a pixel driving circuit formed on the substrate, wherein the substrate can be glass, a polymer substrate such as a Polyimide (PI) film and the like, or a substrate containing a polymer material such as PI and the like.
In an alternative embodiment, the curing degree of the first encapsulating glue is 30% to 70% of the curing degree of the second encapsulating glue, further, the curing degree of the first encapsulating glue is 40% to 55% of the curing degree of the second encapsulating glue, and further, the curing degree of the first encapsulating glue may be 45%, 47%, 48%, 49% or 50% of the curing degree of the second encapsulating glue. Through the solidification degree of controlling first encapsulation glue in the encapsulation in advance, when can making first encapsulation glue bond array mother substrate and mother apron, better absorption stress in the cutting process to the damage of cutting stress to first encapsulation glue that produces when effectively reducing the cutting display panel mother board.
Specifically, in step S110, an array mother substrate is provided, where the array mother substrate includes a plurality of display areas distributed in an array and a package area distributed around each display area; wherein, an organic light-emitting module is arranged in the display area of the array mother substrate; then providing a female cover plate; and finally, arranging packaging materials in the corresponding packaging area of the array mother substrate, and aligning the array mother substrate and the mother cover plate to obtain the display panel mother plate. The packaging material in the embodiment of the invention is glass powder, the glass powder can be correspondingly arranged in the packaging area of the array mother substrate, and the packaging can be realized by processing the glass powder. It can be understood that, the mother cover plate may be further provided with a packaging material corresponding to the packaging region, or the peripheral region of the packaging region on the mother cover plate may be provided with a packaging material, or the mother display panel may be prepared by other methods, which is not limited in this disclosure.
In some alternative embodiments, the encapsulating material may also be a frit material or an encapsulating material containing glass particles. The glass particles may comprise one or several of the following compounds: magnesium oxide, calcium oxide, barium oxide, lithium oxide, sodium oxide, potassium oxide, boron oxide, vanadium pentoxide, zinc oxide, aluminum oxide, silicon dioxide, lead oxide, tin oxide, phosphorus pentoxide, lead borate glass, tin phosphate glass, vanadate glass, borosilicate, and the like. The average diameter of the glass particles is in the range of about 2 μm to about 30 μm, and further, the average diameter of the glass particles may be in the range of about 5 μm to about 10 μm, which may be set as required.
In step S120, the packaging material is semi-cured to form a first packaging adhesive, and the array mother substrate and the mother cover are aligned and bonded together by the first packaging adhesive through the pressing function of the pressing device, so as to pre-package the organic light emitting module in the display area.
The packaging material is subjected to semi-curing treatment through ultraviolet irradiation so as to pre-package the display panel motherboard, and the pre-packaging can be performed by controlling at least one of the moving speed and the ultraviolet dose of an ultraviolet irradiation source; wherein the moving speed of the ultraviolet radiation source is 4-15 mm/S, and the ultraviolet dose is 4.5(μ W.S/cm)2)～6.5(μW·S/cm2). Specifically, the packaging material is irradiated by an ultraviolet irradiation source to perform semi-curing treatment on the packaging material to obtain a first packaging adhesive. The first packaging adhesive is formed by sintering the packaging material through ultraviolet rays, has viscosity and is in a semi-curing state. In the process of sintering the packaging material by the ultraviolet rays, the ultraviolet irradiation source moves along the packaging area, and the packaging material arranged in the packaging area is sintered to form first packaging glue.
The first packaging adhesive has better adhesionThe nature can carry out better connection and fixed with array mother substrate and mother apron, and the solidification degree that first encapsulation was glued this moment is lower moreover, and absorption stress that can be better prevents to glue the damage of cutting stress to first encapsulation in the cutting process to array mother substrate or mother apron. Alternatively, in the present example, the dose of the ultraviolet ray passing light was 5(μ W · S/cm)2) The ultraviolet irradiation source is used for sintering the packaging material, and the moving speed of the ultraviolet irradiation source is 10mm/s, so as to pre-package the display panel motherboard. It is of course understood that it is also possible to vary the dose of the uv light to be increased or the speed of movement of the uv light source to obtain the first encapsulating glue.
In step S130, a cutting device, such as a laser cutting machine or a cutter wheel, is used to cut the display panel mother board, and during cutting, the cutting device is controlled to cut according to a predetermined track. Specifically, the predetermined track corresponds to the size of the display panel, the predetermined track may be formed by marking on one of the array mother substrate or the mother cover plate in advance, and the cutting depth of the display panel mother plate is controlled by controlling the cutting device.
In the embodiment of the invention, the width of the second sealant in the display panel can be properly increased by controlling the pressing force of the pressing equipment and arranging a large amount of packaging materials on the display panel motherboard, so that the packaging performance of the display panel is further improved.
In an optional embodiment, the display panel is encapsulated by the second encapsulation adhesive, and a glass adhesive is firstly used to form an encapsulation material with a specific shape, and then the encapsulation material is inserted between the array mother substrate and the mother cover plate, so as to form the corresponding display panel by the display panel preparation method. In some embodiments, the glass paste may be pre-cured or pre-sintered on one of the array mother substrate and the mother cover plate, after the mother cover plate, the array mother substrate and the glass paste are assembled, a corresponding region of the glass paste is heated to melt at least a portion of the glass paste to pre-encapsulate the mother substrate of the display panel, and then the glass paste is re-cured to complete encapsulation, so that a reliable connection is formed between the array mother substrate and the mother cover plate, thereby preventing the organic light emitting module from being exposed to oxygen and water.
The following describes the embodiments of the present application in further detail through examples and schematic diagrams of manufacturing processes.
Fig. 2a to fig. 2e are schematic views illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application.
Referring to fig. 2a to 2e, the method for manufacturing the display panel 3 of embodiment 1 includes:
as shown in fig. 2a and 2b, the display panel mother substrate 1 is pre-packaged in steps S110 and S120, the display panel mother substrate 1 is provided in step S110, and an encapsulating material is disposed between the array mother substrate 10 and the mother cover 20, and the organic light emitting module is disposed on the array mother substrate 10 to form the display region 40. In the embodiment of the present invention, the sealing material is glass powder, and in step S120, the semi-curing sealing material forms a first sealing glue, and the sealing material can be sintered by an ultraviolet radiation source to achieve semi-curing, wherein the moving speed of the ultraviolet radiation source is 4 mm/S-15 mm/S, and the dose of ultraviolet radiation is 4.5(μ W · S/cm)2)～6.5(μW·S/cm2) Specifically, the moving speed of the ultraviolet irradiation source may be set to 4mm/S, 10mm/S, 12mm/S, or the like, and the dose of ultraviolet rays may be set to 4.5(μ W · S/cm)2)、5(μW·S/cm2) Or 5.5 (. mu.W.S/cm)2) And forming a first packaging adhesive 31 by using a semi-curing packaging material in the pre-packaging step so as to bond the array mother substrate 10 and the mother cover plate 20, wherein the first packaging adhesive 31, the array mother substrate 10 and the mother cover plate 20 form a closed space so as to pre-package the organic light-emitting module on the display panel mother plate 1.
As shown in fig. 2c and fig. 3, the display panel motherboard 1 is cut in step S130, and specifically, the step of cutting the display panel motherboard 1 includes: a cutting track is preset between adjacent packaging areas 50, and at least one of the array mother substrate 10 and the mother cover plate 20 is cut along the cutting track by using a cutting device 2, so that the display panel mother substrate 1 forms a dividing area 60, wherein the array mother substrate 10 is cut by a depth h1Is less than the thickness h of the array mother substrate 102Depth h of first cutting of the female cover plate 203Is less than the thickness h of the cover plate 214At this time, the thickness of the display panel mother board 1 in the dividing region 60 is smaller than that of the display region 40. Further, the step of cutting at least one of the array mother substrate 10 and the mother substrate 20 along the cutting trace includes: cutting the array mother substrate 10 along the cutting track, and controlling the cutting depth of the laser cutting machine or the cutter wheel to make the depth h of the array mother substrate 10 cut1And thickness h of the array mother substrate 102Satisfies the following conditions: 1/4 is less than or equal to h1/h2Less than or equal to 1/2; alternatively, the female cover plate 20 is cut along the cutting path to a depth h of the female cover plate 203And the thickness h of the female cover plate 204Satisfies the following conditions: 1/4 is less than or equal to h3/h4Less than or equal to 1/2. The cutting depth of the array mother substrate 10 or the mother cover plate 20 is controlled by the cutting equipment 2, so that the thickness of the partition area 60 of the display panel mother substrate 1 is reasonable, the array mother substrate 10 or the mother cover plate 20 is prevented from being broken due to the fact that the cutting depth of the array mother substrate 10 or the mother cover plate 20 is too deep, and the strength of the array mother substrate 10 and the mother cover plate 20 is effectively guaranteed.
As shown in fig. 2d, the display panel motherboard 1 is packaged by using the step S140. The display panel mother board 1 forming the partition 60 is encapsulated again by using the ultraviolet radiation source, and at this time, the ultraviolet radiation source can perform ultraviolet radiation at the corresponding position of the first encapsulation glue 31, so that the first encapsulation glue 31 is completely cured to form the second encapsulation glue 32, and the encapsulation of the display panel 3 is completed. In the display preparation method provided in the embodiment of the present invention, the curing degree of the first encapsulation adhesive 31 is 30% to 70% of the curing degree of the second encapsulation adhesive 32, and optionally, the curing degree of the first encapsulation adhesive 31 is 40% to 55% of the curing degree of the second encapsulation adhesive 32.
As shown in fig. 2e, the method for manufacturing the display panel 3 in the embodiment of the present invention further includes a dividing step. After the packaging of the display panel mother substrate 1 is completed, the display panel mother substrate 1 is cut again by the cutting device 2 to form a plurality of display panels 3 by cutting again in the cutting track at the cutting area 60. Specifically, the display panel mother board 1 is cut again by using a laser cutting machine or a cutter wheel until the thickness along the thickness direction of the display panel mother board 1 is cut to form a plurality of display panels 3, wherein the display panels 3 include an array substrate 11, a cover plate 21 and a second packaging adhesive 32, and the array substrate 11 and the cover plate 21 are formed by cutting the array mother substrate 10 and the mother cover plate 20 respectively.
In the embodiment of the present invention, the display panel motherboard 1 is cut for the first time after the pre-encapsulation, so that the dividing region 60 is formed on the display panel motherboard 1, and the display panel motherboard 1 is cut for the second time after the complete encapsulation, at this time, since the display panel motherboard 1 is cut for the first time in the pre-encapsulation state, since the stress between the first encapsulation glue 31 semi-cured in the pre-encapsulation state and the display panel motherboard 1 is relatively small, and the first encapsulation glue 31 has an absorption effect on the cutting stress, the cutting stress during the first cutting has little damage to the first encapsulation glue 31, and the first encapsulation glue 31 can be further cured to form the second encapsulation glue 32 during the complete encapsulation. The depth of cutting is smaller when the second cutting is carried out through the effect of the first cutting, the damage of cutting stress to the second packaging adhesive 32 can be reduced, the packaging performance of the display panel 3 is effectively improved, and the display performance and the product yield of the display panel 3 are further improved.
Fig. 4a to 4e are schematic diagrams illustrating a manufacturing process of a method for manufacturing a display panel 3 according to another embodiment of the present application.
Referring to fig. 4a and 4e, a method 100 for manufacturing a display panel 3 according to embodiment 2 includes:
as shown in fig. 4a and 4b, step S110 and step S120 are used to pre-package the display panel motherboard 1, and the process is the same as the manufacturing process of embodiment 1 and is not repeated.
As shown in fig. 4c and 4d, the display panel mother substrate 1 is cut using step S130. In the step of cutting the mother substrate 1 of the display panel, a cutting track is preset between adjacent package areas 50, and the cutting track is cut and broken by the cutting device 2 to form a plurality of display units 4.
As shown in fig. 4e, the display unit 4 is packaged using step S140. Specifically, the first packaging adhesive 31 on the display unit 4 is sintered by an ultraviolet irradiation light source, and the first packaging adhesive 31 is cured to form the second packaging adhesive 32, so as to obtain the display panel 3, wherein the display panel 3 includes the array substrate 11, the cover plate 21 and the second packaging adhesive 32, and the array substrate 11 and the cover plate 21 are formed by cutting the array mother substrate 10 and the mother cover plate 20, respectively.
In this embodiment, the thickness of the complete display panel motherboard 1 is directly cut when the display panel motherboard 1 is cut, so that the display panel motherboard 1 is broken to form a plurality of display units 4, wherein the shape and size of the display units 4 are similar to the shape and size of the display panel 3, because the first packaging adhesive 31 on the display units 4 is sintered and cured to form the second packaging adhesive 32, and the sizes of the first packaging adhesive 31 and the second packaging adhesive 32 are slightly changed.
Further, in the embodiment of the present invention, before providing the display panel mother board 1 in step S110, a supporting plate having a supporting surface for placing the display panel mother board 1 may be provided. Optionally, the supporting plate is made of an antistatic material or the carrying surface is provided with a conductive layer. By providing the supporting plate, the preparation process of the display panel 3 can be performed on the supporting plate, specifically, in this embodiment, steps S110 to S140 are performed on the supporting plate. Furthermore, the supporting plate can simultaneously encapsulate the plurality of display units 4 to form the plurality of display panels 3, so that the preparation efficiency of the display panels 3 is effectively improved. In addition, the support plate has an anti-static function, so that the influence of static electricity generated on the support plate on the preparation of the display panel 3 can be avoided, and the reliability of the display panel 3 is effectively improved.
The support plate may be made of an anti-static acrylic plate, an anti-static polyvinyl chloride plate, and an anti-static polycarbonate plate, and a conductive layer may also be formed on the support surface, wherein the conductive layer may be, but is not limited to, Indium Tin Oxide (ITO).
Referring to fig. 5, fig. 5 is a schematic cross-sectional view of the display panel 3. It is to be understood that some of the layers are shown hidden for clarity in illustrating the structures associated with the present invention.
As shown in fig. 5, an embodiment of the present invention further provides a display panel 3, including an array substrate 11, an organic light emitting module 33, a cover plate 21, and a second packaging adhesive 32, where the array substrate 11, the cover plate 21, and the second packaging adhesive 32 form a closed accommodating cavity, the organic light emitting module 33 is disposed on the array substrate 11 and located in the accommodating cavity, and the display panel 3 is manufactured by using the display panel 3 manufacturing method according to the embodiment of the present invention.
Specifically, the display panel 3 according to the embodiment of the present invention provides the display panel mother board 1, where the display panel mother board 1 has a plurality of display areas 40 distributed in an array and package areas 50 distributed around the display areas 40, and the display panel mother board 1 includes an array mother board 10, a mother cover board 20, and package materials arranged between the array mother board 10 and the mother cover board 20 and corresponding to the package areas 50; performing semi-curing treatment on the packaging material to obtain first packaging glue 31, so that the mother cover plate 20 is connected with the array mother substrate 10 through the first packaging glue 31; a cutting track is preset between the adjacent packaging areas 50, the array mother substrate 10 is cut along the cutting track, and the depth h of the array mother substrate 10 is cut1And thickness h of the array mother substrate 102Satisfies the following conditions: 1/4 is less than or equal to h1/h2Less than or equal to 1/2; or the cutting track cuts the female cover plate 20 to a depth h of the female cover plate 203And the thickness h of the female cover plate 204Satisfies the following conditions: 1/4 is less than or equal to h3/h4Less than or equal to 1/2; then, curing the first packaging adhesive 31 to form a second packaging adhesive 32, and completing packaging of the display panel motherboard 1, wherein the curing degree of the first packaging adhesive 31 is 30% -70% of the curing degree of the second packaging adhesive 32; finally, the display panel mother board 1 is cut again to form a plurality of display panels 3.
Therefore, the display panel 3 provided by the embodiment of the invention cuts the display panel motherboard 1 in the pre-packaging process, so that the cutting depth of the display panel motherboard 1 after being completely packaged is reduced, the damage of the cutting force to the second packaging adhesive 32 can be effectively reduced, and the packaging performance of the display panel 3 is obviously improved.
In the display panel 3 provided in the embodiment of the invention, the width of the orthogonal projection of the second encapsulant 32 on the array substrate 11 is about 300 μm to 3000 μm, and further, the width of the second encapsulant 32 is about 500 μm to 1500 μm. Specifically, the width of the second encapsulant 32 may not be exactly the same in the thickness direction of the display panel 3. In some embodiments, the width of the second encapsulant 32 is the largest on the contact surface between the second encapsulant 32 and the array substrate 11 or the cover plate 21, which can effectively improve the sealing performance of the display panel 3. Further, the extending distance of the second encapsulant 32 in the thickness direction of the display panel 3 is about 2 μm to 30 μm, and optionally, the extending distance is about 10 μm to 15 μm.
In the embodiment of the present invention, the second encapsulant 32 and the organic light emitting module 33 in the display panel 3 are disposed at intervals, in some optional embodiments, the second encapsulant 32 may also be disposed adjacent to the organic light emitting module 33, wherein the cross-sectional shape of the second encapsulant 32 may be a closed structure surrounded by a rectangular or irregular polygon or a curve, which is not limited in the present invention.
It is to be understood that relational terms such as "first," "second," and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation or arrangement in sequences other than those illustrated or otherwise described herein.
The present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Also, different features that are present in different embodiments may be combined to advantage. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art upon studying the drawings, the specification, and the claims.
Claims (11)
1. A method for manufacturing a display panel includes:
providing a display panel mother board, wherein the display panel mother board is provided with a plurality of display areas distributed in an array manner and packaging areas distributed around the display areas, the display panel mother board comprises an array mother substrate and a mother cover plate which are arranged oppositely, packaging materials are arranged between the array mother substrate and the mother cover plate corresponding to the packaging areas, and light-emitting modules are arranged corresponding to the display areas;
pre-packaging, namely performing semi-curing treatment on the packaging material to form first packaging glue;
cutting a display panel mother board, presetting a cutting track between adjacent packaging areas, and cutting the display panel mother board along the cutting track;
and packaging, namely curing the first packaging adhesive to form second packaging adhesive so as to obtain the display panel, wherein the curing degree of the first packaging adhesive is 30% -70% of that of the second packaging adhesive.
2. The method for manufacturing a display panel according to claim 1,
the curing degree of the first packaging adhesive is 40% -55% of the curing degree of the second packaging adhesive.
3. The method for manufacturing a display panel according to claim 1, wherein the pre-encapsulating includes performing a semi-curing process on the encapsulating material by ultraviolet irradiation;
wherein the moving speed of the ultraviolet radiation source is 4-15 mm/S, and the ultraviolet dose is 4.5(μ W.S/cm)2)～6.5(μW·S/cm2)。
4. The method for manufacturing a display panel according to claim 1, wherein the step of cutting the mother substrate of the display panel comprises: at least one of the array mother substrate and the mother cover plate is cut along the cutting track so that the display panel mother plate forms a partition area.
5. The method for manufacturing a display panel according to claim 4, further comprising, after the encapsulating step:
and a cutting step of cutting the display panel mother board again to form a plurality of display panels, wherein the cutting is performed again along the cutting track along the cutting area during cutting.
6. The method for manufacturing a display panel according to claim 4, wherein in the step of cutting at least one of the array mother substrate and the mother substrate along the cutting trace:
cutting the array mother substrate along the cutting track, wherein the cutting depth h of the array mother substrate is equal to1And a thickness h of the array mother substrate2Satisfies the following conditions: 1/4 is less than or equal to h1/h2Less than or equal to 1/2; alternatively, the first and second electrodes may be,
cutting the female cover plate along the cutting track, and cutting the female cover plate to a depth h3And the thickness h of the female cover plate4Satisfies the following conditions: 1/4 is less than or equal to h3/h4≤1/2。
7. The method for manufacturing a display panel according to claim 1, wherein in the step of cutting the mother substrate of the display panel, the cutting and breaking are performed along the cutting track to form a plurality of display units;
in the packaging process, the first packaging adhesive on the display unit is cured to form second packaging adhesive so as to obtain the display panel.
8. The method for manufacturing a display panel according to claim 7, wherein before the providing the display panel mother board, the method further comprises:
and providing a bearing plate, wherein the bearing plate is provided with a bearing surface and used for placing the display panel mother board.
9. The method for manufacturing a display panel according to claim 8,
the bearing plate is made of an anti-static material or a conducting layer is arranged on the bearing surface.
10. The method for manufacturing a display panel according to any one of claims 1 to 9, wherein the sealing material is glass frit.
11. A display panel produced by the method for producing a display panel according to any one of claims 1 to 10.
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| CN111261647B (en) * | 2020-01-20 | 2021-06-08 | 甬矽电子(宁波)股份有限公司 | Light-transmitting cover plate, optical sensor and manufacturing method thereof |
| CN111477770A (en) * | 2020-04-16 | 2020-07-31 | 合肥京东方卓印科技有限公司 | Packaging method of special-shaped display panel, special-shaped display panel and display device |
| CN114973976A (en) * | 2021-02-22 | 2022-08-30 | 深圳市柔宇科技股份有限公司 | Manufacturing method of seamless splicing display screen |
| CN112863371B (en) * | 2021-02-26 | 2023-08-29 | 京东方科技集团股份有限公司 | Manufacturing method of spliced display screen and spliced display screen |
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