CN110161977B

CN110161977B - Measuring system and measuring method thereof

Info

Publication number: CN110161977B
Application number: CN201810150393.2A
Authority: CN
Inventors: 林祐瑄; 刘大纲
Original assignee: King Yuan Electronics Co Ltd
Current assignee: King Yuan Electronics Co Ltd
Priority date: 2018-02-13
Filing date: 2018-02-13
Publication date: 2022-04-12
Anticipated expiration: 2038-02-13
Also published as: CN110161977A

Abstract

The present invention provides a measurement system, comprising: a master control device and a plurality of measuring workstations. Each measuring workstation is respectively connected with the main control device and respectively corresponds to an element to be measured; the measuring workstations simultaneously perform common project measuring procedures on the corresponding elements to be measured according to the instructions of the main control device, and also respectively perform specific project measuring procedures of adjustable measuring projects according to the requirements of the corresponding elements to be measured, wherein the running periods of at least two specific project measuring procedures are overlapped.

Description

Measuring system and measuring method thereof

Technical Field

The present invention relates to a measurement system and a measurement method thereof, and more particularly, to a measurement system and a measurement method thereof suitable for measuring a plurality of integrated circuits.

Background

Although the conventional Integrated Circuits (ICs) can perform measurement simultaneously, the measurement items must be performed sequentially except for the common measurement items, that is, the measurement of one IC is completed before the next IC is started, and thus, a lot of time and cost are required if the number of ICs is large. In addition, the IC may require a response time after receiving the measurement signal, and the conventional measurement mechanism must wait until the response time of all ICs is over before performing the subsequent measurement, which consumes much latency because the response time of each IC is not always the same. In addition, some IC characteristics must be measured immediately after the reaction time is over, so the existing measurement mechanism for these ICs must be that the reaction time and measurement item of one IC are over, and then the reaction time and measurement item of the next IC are over, which takes more time and causes very low efficiency.

The present invention provides a measurement system and a measurement method thereof to solve the above problems.

Disclosure of Invention

An object of the present invention is to provide a measurement system, comprising: a master control device and a plurality of measuring workstations. The measuring workstations are respectively connected with the main control device and respectively correspond to an element to be measured; the measuring workstations simultaneously perform a common project measuring program on the corresponding elements to be measured according to the instruction of the main control device, and the measuring workstations further respectively perform a specific project measuring program of an adjustable measuring project according to the requirements of the corresponding elements to be measured, wherein the running periods of at least two specific project measuring programs are overlapped. Therefore, the invention can save a great deal of time cost.

In one embodiment, the measurement workstations each transmit a measurement result to the host device after the common project measurement procedure and the specific project measurement procedure of the DUT are completed. In one embodiment, project-specific measurement procedures for the dut are performed between two common project measurement procedures. In one embodiment, the common item measurement procedure or the specific item measurement procedure includes a signal reaction period and an actual measurement period of the integrated circuit. In one embodiment, the measurement workstations each perform a project-specific measurement procedure. In one embodiment, after the common item measurement process of the dut is completed, each metrology workstation further adjusts the specific item measurement process of the dut according to the measurement result of the common item measurement process of the corresponding dut. Furthermore, after the specific item measurement program of each device under test is adjusted, the devices under test respectively receive a measurement signal corresponding to the specific item measurement program, enter respective signal reaction periods, and enter respective specific item measurement programs after the signal reaction periods are finished; when the signal reaction of one of the devices to be measured is abnormal, the other devices to be measured continuously perform the corresponding signal reaction period, and enter the respective specific item measurement program after the signal reaction period is finished.

Another objective of the present invention is to provide a measurement method performed by a measurement system, wherein the measurement system includes a main control device and a plurality of measurement workstations connected to the main control device, and each of the measurement workstations corresponds to a device under test, and the measurement method includes the following steps: enabling the measurement workstation to simultaneously perform a common project measurement program on the corresponding elements to be measured according to the instruction of the main control device; and enabling the measurement workstations to respectively perform a specific project measurement procedure of the adjustable measurement project according to the requirements of the corresponding device to be measured, wherein the performing periods of at least two specific project measurement procedures are overlapped. Therefore, the invention can save a great deal of time cost.

In one embodiment, the method further comprises the steps of: when the common project measuring procedure and the specific project measuring procedure of the element to be measured are completed, a measuring result is transmitted to the main control device by the measuring workstation. In one embodiment, project-specific measurement procedures for the dut are performed between two common project measurement procedures. In one embodiment, the common item measurement procedure or the specific item measurement procedure includes a signal response period and an actual measurement period of the integrated circuit. In one embodiment, the measurement workstations each perform the project-specific measurement procedure. In one embodiment, the step of enabling each metrology workstation to perform a project-specific measurement procedure for an adjustable measurement project according to the requirements of the corresponding dut further comprises the sub-steps of: after the common item measurement procedure of the devices to be tested is completed, the specific item measurement procedure of each device to be tested is adjusted according to the measurement result of the common item measurement procedure of each device to be tested. Furthermore, after the specific item measurement program of each device under test is adjusted, each device under test receives a measurement signal corresponding to the specific item measurement program thereof, enters a respective signal reaction period, and enters the respective specific item measurement program after the signal reaction period is finished; when the signal reaction of the element to be measured is abnormal, the other elements to be measured are continuously carried out in the corresponding signal reaction period, and the measurement program of the specific item is carried out after the signal reaction period is finished.

Drawings

FIG. 1 is a schematic system architecture diagram of a measurement system according to a first embodiment of the present invention;

FIG. 2 is a flowchart of the steps of a measurement method performed by the measurement system of the first embodiment of the present invention;

fig. 3(a) is a detailed flowchart of a measurement method of the measurement system of the first embodiment of the present invention;

FIG. 3(B) is a diagram illustrating the measurement situation of the first embodiment of the present invention and the operation situation of the prior art;

fig. 4(a) is a detailed flowchart of a measurement method of a measurement system of a second embodiment of the present invention;

FIG. 4(B) is a diagram illustrating the measurement situation of the second embodiment of the present invention compared with the operation situation of the prior art;

fig. 5(a) is a detailed flowchart of a measurement method of a measurement system of a third embodiment of the present invention;

FIG. 5(B) is a diagram illustrating the measurement situation of the third embodiment of the present invention compared with the operation situation of the prior art;

fig. 6(a) is a detailed flowchart of a measurement method of a measurement system according to a fourth embodiment of the invention, and fig. 6(B) is a schematic diagram of an operation of the measurement method according to the fourth embodiment of the invention.

[ Main element ]

1 measuring system

10 Master control device

21-24 measuring workstation

30 measuring machine

41-44 DUT

50 server

S21-S25

Test _ com common item measurement program

Test _1 to Test _4 specific item measurement program

O1 overlap period

S31-S36

S41-S47

S51-S56

S61-S66

Detailed Description

The following description will be made of embodiments and operating principles of the measuring device of the present invention by way of various embodiments. Those skilled in the art can appreciate the features and effects of the present invention from the above-described embodiments, and can make combinations, modifications, substitutions or alterations based on the spirit of the present invention.

The term "coupled" as used herein includes, but is not limited to, directly coupled or indirectly coupled. The term "when," "when," as used herein, means "when, before, or after," and is not limiting. In addition, when a plurality of functions (or elements) are described in the present invention, if the word "or" is used between the plurality of functions (or elements), it means that the functions (or elements) may exist independently, but it does not exclude the form in which the plurality of functions (or elements) may exist simultaneously. In the present invention, the term "connection" means a form including direct connection and wireless connection. Furthermore, the use of ordinal numbers such as "first embodiment", "second embodiment", etc., in the description to modify an embodiment of the invention is not intended to imply any previous ordinal numbers to the embodiment, nor is the order in which an embodiment is presented to another embodiment, and the use of such ordinal numbers is merely to modify a different embodiment and is not intended to limit the invention to only those embodiments.

Fig. 1 is a schematic system architecture diagram of a measurement system 1 according to a first embodiment of the present invention. As shown in FIG. 1, the measurement system 1 includes a main control device 10 and a plurality of measurement workstations 21-24. The master control device 10 can be connected to the measurement workstations 21-24, so that the measurement workstations 21-24 can receive the command transmitted by the master control device 10. The measurement workstations 21-24 can correspond to a plurality of devices 41-44 to be tested, wherein each measurement workstation 21-24 can correspond to one device 41-44 to be tested, for example, the measurement workstation 21 can correspond to the device 41 to be tested, and each measurement workstation 21-24 can control the measurement procedure of one device 41-44 to be tested. The measurement workstations 21-24 can simultaneously perform a common project measurement procedure according to the instruction of the main control device 10, so that the devices 41-44 to be measured can perform common project measurement. In addition, the measurement workstations 21-24 can respectively perform a specific project measurement procedure according to the requirements of the corresponding devices 41-44 to be measured, and the measurement items of the specific project measurement procedure can be dynamically adjusted according to the measurement results of the common project of each device 41-44 to be measured (for example, the measurement workstation 21 can correspondingly adjust the measurement items according to the measurement results of the common project of the device 41 to be measured). In addition, the partial ongoing periods of the project-specific measurement programs of at least two measurement workstations (e.g., measurement workstation 21 and measurement workstation 22) may overlap. It should be noted that the number of the measurement workstations 21-24 and the devices 41-44 to be tested in this embodiment is only an example, and the present invention may have a larger or smaller number. The elements and features of the present invention will be described in more detail below.

In one embodiment, the host device 10 may be a network-enabled electronic device, and may have a processor or controller, such as a desktop computer, an industrial computer, a notebook computer, a smart phone, a tablet computer, or other similar devices, without limitation. In another embodiment, the main control device 10 can also be implemented in other forms, such as a workstation or a platform mounted on a server, or a main program installed on an electronic device, and is not limited thereto. In order to make the present invention more clear, the following description will take the host 10 as a computer as an example.

In one embodiment, the measurement workstations 21-24 may be network-enabled electronic devices and may have a processor or controller, such as a desktop computer, an industrial computer, a laptop computer, a smart phone, a tablet computer, or other similar devices, without limitation. In another embodiment, the measurement workstations 21-24 can be implemented in other forms, such as a workstation, a platform, and a web page mounted on a server, or a main program installed on an electronic device, or can be directly installed on the measurement machine as a control program of the measurement machine, and is not limited thereto. For the sake of clarity, the following description will take the measurement workstations 21-24 as computers as examples. In addition, in one embodiment, one metrology station may correspond to a dut, but in other embodiments, one metrology station may correspond to multiple duts, and thus the description of "each metrology station corresponds to a dut" does not imply that the invention is limited to one metrology station corresponding to only one dut. In order to make the present invention more clear, a measurement workstation corresponding to a device under test is taken as an example for description below.

In one embodiment, the DUT 41-44 may be an Integrated Circuit (IC) or other electronic device requiring electrical testing. In order to make the present invention clearer, the following description will take the devices 41-44 to be tested as ICs. In one embodiment, the devices 41 to 44 to be tested can be disposed on a carrier of the measuring machine 30, and each of the devices 41 to 44 to be tested can have a plurality of PINs (PINs) electrically connected to the signal output terminal of the measuring machine 30, i.e., the measuring machine 30 can transmit signals to the PINs of the devices 41 to 44 to be tested to test whether the PINs are normal. In an embodiment, one measurement machine 30 can measure a plurality of devices 41 to 44 simultaneously, and the measurement machine 30 can be divided into a plurality of subsections, each of which can perform different measurements on the devices 41 to 44 respectively, that is, each of the subsections can transmit different measurement signals according to the measurement results of the common items of each of the devices 41 to 44, but is not limited thereto. In addition, the metrology tool 30 can be controlled by the metrology workstations 21-24, such as the metrology workstations 21-24 executing a metrology process to control the metrology tool 30 to perform actual measurements, thereby completing the metrology process, but is not limited thereto.

In an embodiment, the measurement system 1 may further include a server 50. The server 50 can store a test program containing a plurality of test items, the main control device 10 can download the test program from the server 50 through the network, and the measurement workstations 21-24 can obtain the test program from the main control device 10 and find out the corresponding test items according to the corresponding devices 41-44 to be tested, thereby performing the test program. It should be noted that the server 50 is not limited to store only a single test program, i.e. different measurement items can be integrated in the same test program or can be distributed into multiple test programs.

In one embodiment, the common item measurement process can be defined as an item to be tested for all the DUT 41-44, so the DUT 41-44 can also perform the common item measurement process simultaneously. In one embodiment, the project-specific measurement process may adjust the measurement projects according to the characteristics of each DUT 41-44, so that the project-specific measurement process may have different measurement projects for the DUT 41-44. In addition, according to the characteristics of the DUT 41-44, after receiving the measurement signal, a certain signal response time is required to respond to the measurement signal, so the specific item measurement procedure of this type of DUT 41-44 may include, but is not limited to, the signal response period of the IC and the actual measurement period of the specific measurement item.

Next, the measuring method of the present invention will be described in detail. Fig. 2 is a flowchart of steps of a measurement method performed by the measurement system 1 according to the first embodiment of the present invention, and please refer to fig. 1 at the same time. First, step S21 is executed, the main control device 10 downloads the test program from the server 50 and transmits the test program to the measurement workstations 21-24. Then, step S22 is executed, the main control device 10 transmits information to the measurement workstations 21-24 to inform the measurement workstations 21-24 to enter the measurement procedure. Then, step S23 is executed, the measurement workstations 21-24 execute the test procedure and control the measurement machine 30 to perform the common project measurement procedure on the devices 41-44 to be tested. Thereafter, step S24 is executed, after the common project measurement of the DUT 41-44 is completed, the measurement workstations 21-24 respectively perform a specific project measurement procedure, wherein the measurement project of the specific project measurement procedure can be adjusted according to the requirement of each DUT 41-44, and the specific project measurement procedure of each DUT 41-44 can be performed synchronously, but not limited thereto. Then, step S25 is executed, and after the measurement is completed, the measurement workstations 21-24 transmit the measurement results to the main control device 10, and the main control device 10 collects the measurement results.

It should be noted that although the common item measurement procedure is performed earlier than the specific item measurement procedure in the present embodiment, in other embodiments, the specific item measurement procedure may be performed first, and the common item measurement procedure may be performed after the specific item measurement procedures of the dut 41 to 44 are completed. In addition, in one embodiment, the specific-item measurement processes of the DUT 41-44 may be performed between two common-item measurement processes, and in another embodiment, the common-item measurement processes may be performed between two specific-item measurement processes, and is not limited thereto.

Thus, the measurement workstations 21-24 control the measurement of the devices 41-44 to be measured respectively, and the present invention can perform specific measurement items respectively and synchronously according to the requirements of the devices 41-44 to be measured, so as to save a lot of time.

The flow of the measurement method of the present invention and the difference between the prior art and the prior art will be described in detail with several embodiments. These examples are given by way of illustration only and are not intended to be limiting.

First, the first embodiment is explained. Fig. 3(a) is a detailed flowchart of the measurement method of the measurement system 1 according to the first embodiment of the present invention, and fig. 3(B) is a schematic diagram comparing the measurement method of the measurement system 1 according to the first embodiment of the present invention with the operation of the prior art, and please refer to fig. 1 to fig. 3(B) at the same time.

As shown in fig. 3(a) and 3(B), the measurement method of the first embodiment first executes step S31, and the main control device 10 downloads the test program from the server 50 and transmits the test program to the measurement workstations 21-24. Then, step S32 is executed, the main control device 10 transmits information to the measurement workstations 21-24 to inform the measurement workstations 21-24 to enter the measurement procedure. Then, step S33 is executed, the measurement workstations 21-24 execute the test procedure and control the measurement machine 30 to perform the common project measurement procedure on the devices 41-44 to be tested. Steps S31 to S33 are similar to steps S21 to S23 of FIG. 2, and thus are not described in detail, and the common item measurement procedure (Test _ com) of the DUT 41-44 is performed simultaneously. Thereafter, step S34 is executed to adjust the specific item measurement programs (Test _ 1-Test _4) of the DUT 41-44 according to the requirements of each DUT 41-44 (e.g., according to the measurement result of the common item measurement program (Test _ com), but not limited thereto). Then, step S35 is executed to synchronously perform the specific item measurement procedures (Test _1 to Test _4) of the devices 41 to 44 to be measured, and then step S36 is executed to transmit the measurement results to the main control device 10 by the measurement workstations 21 to 24, respectively, and the measurement results are collected by the main control device 10.

In this embodiment, the DUT's 41-44 are assumed to be four same DUT types, whereas the prior art assumes that the measurement of all DUT's 41-44 is controlled by a single computer device. After the common item measurement procedure (Test _ com) is completed, the single computer device of the prior art can only sequentially perform the specific item measurement procedures (Test _ 1-Test _4) of the devices 41-44 to be tested, and must wait for the specific item measurement procedure (e.g., Test _1) of the same type of device to be tested (e.g., device to be tested 41) to be completed before performing the specific item measurement procedure (e.g., Test _2) of the next type of device to be tested (e.g., device to be tested 42). In contrast, the measurement system 1 of the present invention can include a plurality of measurement workstations 21-24, and the measurement workstations 21-24 respectively control the measurement of the devices 41-44 to be measured, so that after the common project measurement procedure (Test _ com) is completed, the measurement workstations 21-24 can respectively and synchronously perform the specific project measurement procedures (Test _ 1-Test _4) for the devices 41-44 to be measured. As shown in fig. 3, the present invention can greatly reduce the measurement time of the prior art.

The second embodiment is explained next. Fig. 4(a) is a detailed flowchart of a measurement method of the measurement system 1 according to the second embodiment of the present invention, and fig. 4(B) is a schematic diagram comparing the measurement method of the measurement system 1 according to the second embodiment of the present invention with the operation of the prior art, and please refer to fig. 1, fig. 2, fig. 4(a) and fig. 4(B) at the same time.

As shown in fig. 4(a) and 4(B), the measurement method of the second embodiment first performs steps S41 to S43; since steps S41 to S43 are similar to steps S21 to S23 of fig. 2, detailed description thereof is omitted. Thereafter, step S44 is executed to adjust the specific item measurement programs (Test _1 to Test _4) of the devices 41 to 44 according to the requirements of the devices 41 to 44 (for example, but not limited to the measurement results of the common item measurement program (Test _ com)) after the completion of the common item measurement program (Test _ com) of the devices 41 to 44. Then, step S45 is executed, and the dut 41 to 44 respectively receive the measurement signals corresponding to the measurement programs (Test _1 to Test _4) of the specific items and enter the respective signal response times. If there is an abnormality in the signal response of the device under test (e.g., the device under test 44), step S45(b) is performed, in which the device under test 44 waits for the signal abnormality to end, and the remaining devices under test (the devices under test 41 to 43) continue to perform the signal response time and subsequent measurements. Thereafter, step S46 is executed, after the signal reaction is completed, the dut with normal signal reaction (e.g., Test _1 to Test _3) respectively performs the specific item measurement procedure (Test _1 to Test _3), so the dut with normal signal reaction completed earlier will directly perform the specific item measurement procedure. Thereafter, step S47 is executed, and when the specific project measurement procedures (Test _1 to Test _4) of each dut 41 to 44 are completed, the measurement workstations 21 to 24 respectively transmit the measurement results to the main control device 10, and the main control device 10 collects the measurement results.

In this embodiment, the DUT 41-44 are four DUT of the same type and have different signal response periods for the same or different measurement signals, so the DUT 41-44 must wait for the signal response period to end before performing the actual measurement. In addition, in the prior art, a single computer device controls the measurement of all the devices 41-44 to be measured. During measurement (e.g., the specific item measurement programs Test _1 to Test _4), the computer device in the prior art controls the measurement machine (not shown in fig. 4B) to transmit the measurement signals to the devices 41 to 44 to be measured, and the devices 41 to 44 to be measured need to wait for the response of the measurement signals, and at this time, it is necessary to wait for the signal response periods of all the devices 41 to 44 to be measured to end before actual measurement is performed, so that the prior art will consume a lot of time for the devices 41 to 44 to be measured to react to the signals. In addition, when there is an abnormality in the response of the dut (e.g., dut 44), although the signal response periods of the other duts 41-43 are over, it is still necessary to wait until the abnormality of the dut 44 is over before the actual measurement is performed, which consumes more time and cost. In contrast, the measurement system 1 of the present invention has a plurality of measurement workstations 21-24, and the measurement workstations 21-24 control the measurement of the devices 41-44 to be measured, so that the signal response period and the actual measurement period of the devices 41-44 to be measured can be performed respectively. Thus, even if the response of the DUT 44 is abnormal, the other DUTs 41-43 can still perform their respective actual measurements, thereby saving a lot of time and cost.

It should be noted that although the specific measurement procedures Test _1 to Test _4 are used to illustrate the signal response period in the embodiment of fig. 4B, those skilled in the art will appreciate that the common measurement procedure may need to wait for the signal response period to end before starting the measurement, and is not limited thereto.

Next, a third embodiment will be described. Fig. 5(a) is a detailed flowchart of a measurement method of the measurement system 1 according to the third embodiment of the present invention, and fig. 5(B) is a schematic diagram comparing the measurement method of the measurement system 1 according to the third embodiment of the present invention with the operation of the prior art, and please refer to fig. 1, fig. 2, fig. 5(a) and fig. 5(B) at the same time. It should be noted that the DUT 41-44 in the third embodiment is of a type that needs to be measured immediately after the signal response time is over.

As shown in fig. 5(a) and 5(B), the measurement method of the third embodiment first performs steps S51 to S53; since steps S51 to S53 are similar to steps S21 to S23 of fig. 2, detailed description thereof is omitted. Thereafter, step S54 is executed to adjust the specific item measurement programs (Test _1 to Test _4) of the devices 41 to 44 according to the requirements of the devices 41 to 44 (for example, but not limited to the measurement results of the common item measurement program (Test _ com)) after the completion of the common item measurement program (Test _ com) of the devices 41 to 44. Then, step S55 is executed, the dut 41 to 44 receives the measurement signals corresponding to the specific item measurement procedures (Test _1 to Test _4) synchronously and respectively, and enters the respective signal response time, and each dut 41 to 44 performs the specific item measurement procedure immediately after the signal response time is over. Thereafter, step S56 is executed, and when the specific project measurement procedures (Test _1 to Test _4) of each dut 41 to 44 are completed, the measurement workstations 21 to 24 respectively transmit the measurement results to the main control device 10, and the main control device 10 collects the measurement results.

In this embodiment, the DUT 41-44 are four DUT of the same type, and have different response times for the same or different measurement signals, and the DUT 41-44 has the characteristic that the measurement must be performed immediately after the response time is over. Since the measurement of all the devices 41-44 to be measured is controlled by a single computer device in the prior art, it is necessary to wait for the signal response period of the devices 41-44 to be measured to end before the actual measurement, and since the devices 41-44 to be measured must be measured immediately after the response period ends, the architecture thereof must be configured to wait for the signal response period and the actual measurement period of the devices to be measured (e.g., the device 41 to be measured) of the same type to end in sequence before the signal response period and the actual measurement period of the next device to be measured (e.g., the device 42 to be measured) can be performed; it can be seen that the measurement time of the present embodiment is longer than that of the previous embodiment, and therefore, the time cost is more. In contrast, the measurement system 1 of the present invention comprises a plurality of measurement workstations 21-24, and the measurement workstations 21-24 control the measurement processes of the devices 41-44 to be measured respectively, so that the signal response periods of the devices 41-44 to be measured and the actual measurement periods adjacent to the signal response periods can be performed respectively. Therefore, even if the DUT 41-44 must perform measurement immediately after the signal response is completed, the DUT 41-43 can still perform measurement independently, so that a lot of time and cost can be saved.

Next, a fourth embodiment will be described. Fig. 6(a) is a detailed flowchart of a measurement method of the measurement system 1 according to the fourth embodiment of the invention, and fig. 6(B) is a schematic diagram of an operation of the measurement method according to the fourth embodiment of the invention, and please refer to fig. 3 at the same time.

As shown in fig. 6(a) and 6(B), first, steps S61 to S63 are performed; since steps S61 to S63 are similar to steps S21 to S23 of fig. 2, they will not be described in detail. Then, step S64 is executed, when the common project measurement of the DUT 41-44 is completed, the measurement workstations 21-24 respectively perform a specific project measurement procedure, wherein the measurement project of the specific project measurement procedure can be adjusted according to the requirement of each DUT 41-44. Then, step S65 is executed, in which the devices 41 to 44 each perform the specific item measurement procedures (Test _1 to Test _4), and the performing periods of the specific item measurement procedures (Test _1 and Test _2) of at least two devices under Test (for example, the devices 41 and 42) at least partially overlap. After step S66 is executed, when the specific item measurement procedures (Test _1 to Test _4) of each dut 41 to 44 are completed, the measurement workstations 21 to 24 respectively transmit the measurement results to the main control device 10, and the main control device 10 collects the measurement results.

In this embodiment, the project-specific measurement procedures of the DUT 41-44 can be performed individually, and are not limited to being performed simultaneously. For example, the specific item measurement procedure (Test _2) of the dut 42 may be started after a period of time after the specific item measurement procedure (Test _1) of the dut 41 is started, and is not limited thereto. Therefore, the measurement method of the present invention can be defined as that the partial running periods of the measurement procedures (e.g., Test _1 and Test _2) of the specific items of at least two devices under Test (e.g., the

devices

41 and 42 under Test) are overlapped (e.g., the overlapped period O1).

Therefore, the invention can respectively carry out the specific item measuring program of the element to be measured synchronously, is applicable to various types of elements to be measured, can greatly reduce the measuring time and improve the measuring efficiency.

The above-described embodiments are merely exemplary for convenience in explanation, and the scope of the claims of the present invention should be determined by the claims rather than by the limitations of the above-described embodiments.

Claims

1. A measurement system, comprising:

a master control device; and

the plurality of measuring workstations are respectively connected with the main control device, and each measuring workstation respectively corresponds to an element to be measured;

the measuring workstations simultaneously perform a common project measuring program on the corresponding element to be measured according to an instruction of the main control device, and respectively perform a specific project measuring program of an adjustable measuring project according to the requirement of the corresponding element to be measured, wherein the performing periods of at least two specific project measuring programs are overlapped;

the common item measurement program is defined as the item to be tested for all the devices to be tested, and the specific item measurement program adjusts the measurement items according to the characteristics of each device to be tested.

2. The measurement system of claim 1, wherein each of the metrology workstations transmits a measurement result to the host device after the common project measurement procedure and the specific project measurement procedure of the DUT are completed.

3. The measurement system of claim 1, wherein the project-specific measurement process of the dut is performed between two common project measurement processes.

4. The measurement system of claim 1, wherein the common item measurement process or the specific item measurement process comprises a signal reaction period and an actual measurement period of an integrated circuit.

5. The measurement system of claim 1, wherein the metrology workstations are synchronized to perform the project-specific measurement process.

6. The measurement system of claim 1, wherein each metrology workstation further adjusts the project-specific metrology process of the dut according to the measurement results of the common project metrology process of the corresponding dut after the common project metrology process of the dut is completed.

7. The measurement system of claim 6, wherein after the specific item measurement process of each DUT is adjusted, each DUT receives a measurement signal corresponding to its specific item measurement process, enters its respective signal reaction period, and enters its respective specific item measurement process after the signal reaction period ends;

when the signal reaction of one of the devices to be measured is abnormal, the other devices to be measured continuously perform the corresponding signal reaction period, and enter the respective specific item measurement program after the signal reaction period is finished.

8. A measurement method is executed by a measurement system, wherein the measurement system comprises a main control device and a plurality of measurement workstations connected with the main control device, each measurement workstation corresponds to a to-be-measured element, and the measurement method comprises the following steps:

enabling each measurement workstation to simultaneously perform a common project measurement program on the corresponding element to be measured according to an instruction of the main control device; and

enabling each measurement workstation to respectively perform a specific project measurement procedure of an adjustable measurement project according to the requirement of the corresponding element to be measured, wherein the performing periods of at least two specific project measurement procedures are overlapped;

9. The measuring method according to claim 8, further comprising the steps of:

when the common project measuring procedure and the specific project measuring procedure of the elements to be measured are completed, a measuring result is transmitted to the main control device by the measuring workstations.

10. The method of claim 8, wherein the project-specific measurement process of the dut is performed between two common project measurement processes.

11. The method of claim 8, wherein the common item measurement process or the specific item measurement process comprises a signal reaction period and an actual measurement period of an integrated circuit.

12. The method of claim 11, wherein the metrology workstations are synchronized to perform the project-specific metrology process.

13. The measurement method according to claim 8, wherein the step of enabling each measurement workstation to perform a project-specific measurement procedure capable of adjusting measurement projects according to the requirements of the corresponding dut further comprises the sub-steps of:

after the common item measurement procedure of the devices to be tested is completed, the specific item measurement procedure of each device to be tested is adjusted according to the measurement result of the common item measurement procedure of each device to be tested.

14. The measuring method according to claim 13, wherein the step of enabling each measuring station to perform a project-specific measuring procedure capable of adjusting the measuring project according to the requirement of the corresponding device under test further comprises the sub-steps of:

after the specific item measurement program of each element to be measured is adjusted, each element to be measured respectively receives a measurement signal corresponding to the specific item measurement program, enters a respective signal reaction period, and enters the respective specific item measurement program after the signal reaction period is finished;

when the signal reaction of one element to be measured is abnormal, the other elements to be measured are continuously carried out in the corresponding signal reaction period, and the measurement program of the specific item is carried out after the signal reaction period is finished.