CN110160660A - High-temperature component Multi spectral thermometry method and system based on light-field camera - Google Patents
High-temperature component Multi spectral thermometry method and system based on light-field camera Download PDFInfo
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- CN110160660A CN110160660A CN201910463400.9A CN201910463400A CN110160660A CN 110160660 A CN110160660 A CN 110160660A CN 201910463400 A CN201910463400 A CN 201910463400A CN 110160660 A CN110160660 A CN 110160660A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0803—Arrangements for time-dependent attenuation of radiation signals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/48—Thermography; Techniques using wholly visual means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/80—Calibration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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Abstract
The present invention provides the high-temperature component radiative thermometric methods and system based on light-field camera in a kind of technical field of temperature measurement, include the following steps: S1, are demarcated using normal temperature source to light-field camera Multi spectral thermometry system；S2 uses calibrated Multi spectral thermometry system acquisition high-temperature component light field multispectral image；S3 decouples high-temperature component light field multispectral image, obtains decoupling data；S4 utilizes decoupling data acquisition high-temperature component object point true temperature.This invention simplifies the optical system for collecting in traditional Multi spectral thermometry method, combine the advantages of Multi spectral thermometry is with face battle array thermometric, two-dimentional true temperature field can be resolved, for pushing the development of multispectral thermometry technology to have certain meaning.
Description
Technical field
The invention belongs to technical field of temperature measurement, in particular to a kind of high-temperature component radiation temperature measurement based on light-field camera
Method and system.
Background technique
Currently, the thermometric mode of high-temperature component can be divided into contact temperature-measuring and contactless temperature-measuring.Wherein, contactless survey
Temperature have on testee without influence, dynamic response is good, output signal is larger, measurement accuracy is higher, wider range etc. of measurement
Advantage and be concerned, contactless temperature-measuring mainly based on radiative thermometric method, including radiance thermometry, two-color thermometry with
And multispectral thermometry method etc..
Wherein, Multi spectral thermometry method passes through the radiance for measuring multiple wavelength (several to dozens of are differed), according to
Emissivity solving target is very warm, in radiation temperature measurement field using relatively broad.The generally point measurement of the multispectral pyrometer of tradition or
Person's measured zone is smaller, it is difficult to can obtain measured object entire surface two-dimensional temperature field, not can avoid measured object local error.Flying
When row device, turbine blade and other high-temperature component surface temperature measurements, to obtain high-temperature component surface two-dimensional temperature field, keep away
Exempt from local error, is more clear accurately assessment high-temperature component overall work state, researcher and proposes based on area array CCD
The optical system of (Charge-coupled Device) thermometric and its applicable algorithm.
In recent years, with the rapid development of computer vision field software and hardware, both at home and abroad about area array CCD radiation temperature measurement side
The research of method is achieved compared with much progress.But current one piece of color sensitive chip can only at most acquire the more of three wave bands (RGB)
Spectrum, if realizing, more multi-optical spectrum image collecting needs by the way of camera array or multichannel light splitting, optical system for collecting
It still can be extremely complex, it is difficult to which practical, constructing multi-optical spectrum imaging system appropriate is still the major issue for perplexing the field.
Through retrieving to the prior art, Chinese invention patent number is CN201310633736.8, a kind of entitled mostly light
Radiative thermometric method is composed, is characterized in that: characterized by comprising the following steps: [1] spectrometer records to obtain pulse wide spectrum light source
Spectral signal V1 (λ) in light out；[2] spectral signal under spectrometer recording impulse wide spectrum light source and flame act on simultaneously,
Obtain the spectral signal V3 (λ) under the signal V2 (λ) and flame that flame individually irradiate to spectrometer are acted on simultaneously with wide spectrum light source；
[3] flame emission rate coefficient ε (λ)=(V2 (λ)+V1 (λ)-V3 (λ))/V1 (λ) is calculated；[4] data are carried out to formula to intend
It closes, obtains the temperature value on flame path of integration；Wherein λ is operation wavelength, and T is operating temperature, and C1 and C2 are respectively the first spoke
Constant and second radiation constant are penetrated, k is system compensation constant；[5] the flame temperature parameter under different moments is calculated.The hair
The device that bright method uses is complex, to be really temperature field temperature calculation accuracy it is lower.
Summary of the invention
For the defects in the prior art, the object of the present invention is to provide a kind of high-temperature component based on light-field camera mostly light
Compose temp measuring method and system.
A kind of high-temperature component Multi spectral thermometry method based on light-field camera provided according to the present invention, including walk as follows
It is rapid:
S1 demarcates light-field camera Multi spectral thermometry system using normal temperature source；
S2 uses calibrated Multi spectral thermometry system acquisition high-temperature component light field multispectral image；
S3 decouples high-temperature component light field multispectral image, obtains decoupling data；
S4 utilizes decoupling data acquisition high-temperature component object point true temperature.
In some embodiments, light-field camera is using multispectral filtering chip arrays and microlens array coupling in the step S1
Modulation is closed, normal temperature source multi-optical spectrum image collecting is realized, determines corresponding relationship between gray value and temperature value.
In some embodiments, when in the step S2 to unit under test thermometric, temperature-measuring range, precision and filtering chip arrays
Selection match and correspond to, for example, realize 1% temperature measurement accuracy, 4 × 4 filtering chip arrays can be used, acquire under 16 wave bands mostly light
Spectrogram picture；If realized higher temperature measurement accuracy, more filter plates can be used, acquire more multiband multispectral image.
It is by the multispectral figure of two dimension that high-temperature component light field multispectral image is decoupled in some embodiments, in the step S3
As decoupling is single dimension multispectral image.
In some embodiments, the resolving of the step S4 high temperature component object point true temperature is obtained by following formula:
Wherein, C2For second radiation constant；λiFor the effective wavelength in i-th of channel；T is the true temperature of target；ε(λi,
T) be target true temperature T spectral emissivity；ViFor the output signal strength in i-th of channel；T ' is reference temperature, Vi' for
The output signal strength in lower i-th of the channel reference temperature T '.
A kind of high-temperature component Multi spectral thermometry system based on light-field camera, using the high temperature based on light-field camera
Component Multi spectral thermometry method, comprising: light-field camera Multi spectral thermometry system calibrating module, Multi spectral thermometry system imaging mould
Block, multispectral image decoupling module, object point true temperature obtain module；
The light-field camera Multi spectral thermometry system calibrating module is using normal temperature source to light-field camera Multi spectral thermometry
System is demarcated；
The Multi spectral thermometry system imaging module uses calibrated Multi spectral thermometry system acquisition high-temperature component light field
Multispectral image；
The multispectral image decoupling module obtains decoupling data by decoupling high-temperature component light field multispectral image；
The object point true temperature obtains module using decoupling data acquisition high-temperature component object point true temperature.
In some embodiments, the light-field camera in the light-field camera Multi spectral thermometry system calibrating module is using mostly light
Spectral filter chip arrays and microlens array coupling modulation realize normal temperature source multi-optical spectrum image collecting, determine gray value and temperature
Corresponding relationship between angle value.
In some embodiments, the normal temperature source that the light-field camera Multi spectral thermometry system calibrating module uses is black
Body furnace or tengsten lamp.
In some embodiments, the multispectral image decoupling module is by decoupling two-dimentional multispectral image for single dimension
Multispectral image obtains decoupling data.
In some embodiments, when in the Multi spectral thermometry system imaging module imaging process to unit under test thermometric,
Temperature-measuring range, precision are corresponding with the filtering selection matching of chip arrays.
Compared with prior art, the present invention have it is following the utility model has the advantages that
1, the present patent application proposes a kind of high-temperature component Multi spectral thermometry method based on light-field camera, and this method is using single
Lens optical system realizes that Multi spectral thermometry, optical system structure are simple.
2, this invention simplifies the optical system for collecting in traditional Multi spectral thermometry method, Multi spectral thermometry and face are combined
The advantages of battle array thermometric, two-dimentional true temperature field can be resolved, for pushing the development of multispectral thermometry technology to have centainly
Meaning.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon:
Basic flow chart Fig. 1 of the invention；
Light-field camera Multi spectral thermometry System Working Principle schematic diagram Fig. 2 of the invention；
Light-field camera multispectral image schematic diagram in Fig. 3 present invention.
Light field multispectral image Uncoupled procedure schematic diagram in Fig. 4 present invention.
Specific embodiment
The present invention is described in detail combined with specific embodiments below.Following embodiment will be helpful to the technology of this field
Personnel further understand the present invention, but the invention is not limited in any way.It should be pointed out that the ordinary skill of this field
For personnel, without departing from the inventive concept of the premise, several changes and improvements can also be made.These belong to the present invention
Protection scope.
Embodiment 1
The basic operation process of the invention patent is as shown in Fig. 1, and the multispectral light-field camera imaging system of use is basic
Framework is as shown in Figure 2.
Firstly, normal temperature source is heated to appropriate high temperature T ' (such as being heated to 1000K), normal temperature source is black matrix
Furnace or tengsten lamp etc., as shown in Fig. 2, using the light-field camera after multispectral filter plate array modulation to normal temperature source into
Row imaging, calibration for cameras is in different-waveband λiLower output signal strength Vi' between normal temperature T ' corresponding relationship, because of general feelings
Under conditionThen
Wherein,For calibration factor, value is sensor sensitivity coefficient, absorption coefficient and the first constant constant of radiation
Product；ε(λi, T) be target true temperature T spectral emissivity；C2For second radiation constant；λiFor the effective of i-th channel
Wavelength；T ' is for the reference temperature in normal temperature source.
Multispectral light-field image under the normal temperature is saved as into nominal data.
Secondly, tested high-temperature component is imaged using calibrated multispectral light-field camera, basic framework is imaged
As shown in Fig. 2, high-temperature component light field multispectral image is acquired, original image schematic diagram is as shown in Fig. 3, is wherein in box
Macro pixel multispectral image.
Again, according to light-field camera multispectral imaging process and light-field camera multi-view image decoupling method, decoupling mostly light
Original image is composed, decouples the macro pixel image of picture point S ' in figure 4 as an example, assuming macro pixel image by 4 as shown in the figure
× 4 pixels composition, is the two-dimentional multispectral image of 16 wave bands, by by from left to right from top to bottom in the way of decouple and be
The multispectral image in single dimension direction.
Finally, according to Theory of Multi-Spectral Radiation Thermometry and multispectral image Uncoupled procedure, the output signal in i-th of channel is strong
Spend ViIt can be denoted as:
Wherein,For calibration factor, value is sensor sensitivity coefficient, absorption coefficient and the first constant constant of radiation
Product；ε(λi, T) be target true temperature T spectral emissivity；C2For second radiation constant；λiFor the significant wave in i-th of channel
It is long；T is the true temperature of target.
After completing multispectral image decoupling, single object point true temperature solution process are as follows:
(1) (2) formula is divided by and takes logarithm and arranges:
Equation similar to above formula can be obtained for different wave length, just by the formed equation group of equation under 16 wave bands of solution
True temperature T can be resolved, resolves object point true temperature on high-temperature component one by one, it is true can finally to obtain tested high-temperature component two dimension
Real temperature field.
Embodiment 2
As shown in Figs 1-4, the high-temperature component Multi spectral thermometry system based on light-field camera that the present invention provides a kind of uses
The high-temperature component Multi spectral thermometry method based on light-field camera in embodiment 1, comprising: light-field camera Multi spectral thermometry system mark
Cover half block, Multi spectral thermometry system imaging module, multispectral image decoupling module, object point true temperature obtain module；
The light-field camera Multi spectral thermometry system calibrating module is using normal temperature source to light-field camera Multi spectral thermometry
System is demarcated；
The Multi spectral thermometry system imaging module uses calibrated Multi spectral thermometry system acquisition high-temperature component light field
Multispectral image；
The multispectral image decoupling module obtains decoupling data by decoupling high-temperature component light field multispectral image；
The object point true temperature obtains module using decoupling data acquisition high-temperature component object point true temperature.
Light-field camera in the light-field camera Multi spectral thermometry system calibrating module using multispectral filtering chip arrays and
Microlens array coupling modulation realizes normal temperature source multi-optical spectrum image collecting, determines corresponding pass between gray value and temperature value
System.
The normal temperature source that the light-field camera Multi spectral thermometry system calibrating module uses is blackbody furnace or tengsten lamp.
The multispectral image decoupling module is by decoupling two-dimentional multispectral image for single dimension multispectral image, acquisition
Decouple data.
When in the Multi spectral thermometry system imaging module imaging process to unit under test thermometric, temperature-measuring range, precision with
The selection for filtering chip arrays, which matches, to be corresponded to.
Corresponding solution procedure and embodiment 1 in the present embodiment 2 is consistent, and details are not described herein.
In conclusion the invention patent was imaged by the way that filter plate array modulation light-field camera is added in light-field camera
Journey proposes that a kind of high-temperature component Multi spectral thermometry method based on light-field camera, this method are realized using single-lens optical system
Multi spectral thermometry, optical system are relatively easy；This invention simplifies the optical system for collecting in traditional Multi spectral thermometry method, knots
The advantages of having closed Multi spectral thermometry and face battle array thermometric, can resolve two-dimentional true temperature field, for pushing multispectral thermometry skill
The development of art has certain meaning.
One skilled in the art will appreciate that in addition to realizing system provided by the invention in a manner of pure computer readable program code
It, completely can be by the way that method and step be carried out programming in logic come so that provided by the invention other than system, device and its modules
System, device and its modules are declined with logic gate, switch, specific integrated circuit, programmable logic controller (PLC) and insertion
The form of controller etc. realizes identical program.So system provided by the invention, device and its modules may be considered that
It is a kind of hardware component, and the knot that the module for realizing various programs for including in it can also be considered as in hardware component
Structure；It can also will be considered as realizing the module of various functions either the software program of implementation method can be Hardware Subdivision again
Structure in part.
Claims (10)
1. a kind of high-temperature component Multi spectral thermometry method based on light-field camera, which comprises the steps of:
S1 demarcates light-field camera Multi spectral thermometry system using normal temperature source；
S2 uses calibrated Multi spectral thermometry system acquisition high-temperature component light field multispectral image；
S3 decouples high-temperature component light field multispectral image, obtains decoupling data；
S4 utilizes decoupling data acquisition high-temperature component object point true temperature.
2. the high-temperature component Multi spectral thermometry method according to claim 1 based on light-field camera, which is characterized in that described
Light-field camera realizes that normal temperature source is multispectral using multispectral filtering chip arrays and microlens array coupling modulation in step S1
Image Acquisition determines corresponding relationship between gray value and temperature value.
3. the high-temperature component Multi spectral thermometry method according to claim 1 based on light-field camera, which is characterized in that described
When in step S2 to unit under test thermometric, temperature-measuring range, precision are corresponding with the filtering selection matching of chip arrays.
4. the high-temperature component Multi spectral thermometry method according to claim 1 based on light-field camera, which is characterized in that described
High-temperature component light field multispectral image is decoupled in step S3 to be decoupled two-dimentional multispectral image as single dimension multispectral image.
5. the high-temperature component Multi spectral thermometry method according to claim 1 based on light-field camera, which is characterized in that described
The resolving of step S4 high temperature component object point true temperature is obtained by following formula:
Wherein, C2For second radiation constant；λiFor the effective wavelength in i-th of channel；T is the true temperature of target；ε(λi, T) be
The spectral emissivity of target true temperature T；ViFor the output signal strength in i-th of channel；T ' is reference temperature, Vi' it is to refer to
The output signal strength in lower i-th of the channel temperature T '.
6. a kind of high-temperature component Multi spectral thermometry system based on light-field camera, which is characterized in that any using claim 1-5
The high-temperature component Multi spectral thermometry method based on light-field camera, comprising: light-field camera Multi spectral thermometry system calibrating mould
Block, Multi spectral thermometry system imaging module, multispectral image decoupling module, object point true temperature obtain module；
The light-field camera Multi spectral thermometry system calibrating module is using normal temperature source to light-field camera Multi spectral thermometry system
It is demarcated；
The Multi spectral thermometry system imaging module uses calibrated Multi spectral thermometry system acquisition high-temperature component light field mostly light
Spectrogram picture；
The multispectral image decoupling module obtains decoupling data by decoupling high-temperature component light field multispectral image；
The object point true temperature obtains module using decoupling data acquisition high-temperature component object point true temperature.
7. the high-temperature component Multi spectral thermometry system according to claim 6 based on light-field camera, which is characterized in that described
Light-field camera in light-field camera Multi spectral thermometry system calibrating module is using multispectral filtering chip arrays and microlens array coupling
Modulation is closed, normal temperature source multi-optical spectrum image collecting is realized, determines corresponding relationship between gray value and temperature value.
8. the high-temperature component Multi spectral thermometry system according to claim 6 based on light-field camera, which is characterized in that described
The normal temperature source that light-field camera Multi spectral thermometry system calibrating module uses is blackbody furnace or tengsten lamp.
9. the high-temperature component Multi spectral thermometry system according to claim 6 based on light-field camera, which is characterized in that described
Multispectral image decoupling module is by decoupling two-dimentional multispectral image for single dimension multispectral image, acquisition decoupling data.
10. the high-temperature component Multi spectral thermometry system according to claim 6 based on light-field camera, which is characterized in that institute
When stating in Multi spectral thermometry system imaging module imaging process to unit under test thermometric, temperature-measuring range, precision and filtering chip arrays
Selection match correspond to.
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| CN111351578A (en) * | 2020-02-27 | 2020-06-30 | 北京理工大学 | Temperature measurement system and method based on pixelized dual-waveband narrow-band optical filter array |
| CN111458051A (en) * | 2020-03-09 | 2020-07-28 | 西安电子科技大学 | Three-dimensional temperature field measuring system and method based on pixel-level spectral photodetector |
| CN113237559A (en) * | 2021-04-25 | 2021-08-10 | 哈尔滨工业大学 | Multispectral radiation temperature measuring device and using method |
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| CN107478267A (en) * | 2017-07-11 | 2017-12-15 | 上海交通大学 | The temperature field of three-dimensional flow field based on light-field camera and velocity field synchronous detecting method |
| CN108507674A (en) * | 2018-03-13 | 2018-09-07 | 北京航空航天大学 | A kind of nominal data processing method of light field light spectrum image-forming spectrometer |
| CN109115348A (en) * | 2018-07-24 | 2019-01-01 | 哈尔滨工业大学 | A kind of three dimensional temperature reconstruction integrated processes based on flame light field refocusing image |
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| CN107478267A (en) * | 2017-07-11 | 2017-12-15 | 上海交通大学 | The temperature field of three-dimensional flow field based on light-field camera and velocity field synchronous detecting method |
| CN108507674A (en) * | 2018-03-13 | 2018-09-07 | 北京航空航天大学 | A kind of nominal data processing method of light field light spectrum image-forming spectrometer |
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| CN111351578A (en) * | 2020-02-27 | 2020-06-30 | 北京理工大学 | Temperature measurement system and method based on pixelized dual-waveband narrow-band optical filter array |
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| CN111458051A (en) * | 2020-03-09 | 2020-07-28 | 西安电子科技大学 | Three-dimensional temperature field measuring system and method based on pixel-level spectral photodetector |
| CN111458051B (en) * | 2020-03-09 | 2021-11-09 | 西安电子科技大学 | Three-dimensional temperature field measuring system and method based on pixel-level spectral photodetector |
| CN113237559A (en) * | 2021-04-25 | 2021-08-10 | 哈尔滨工业大学 | Multispectral radiation temperature measuring device and using method |
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Address after: Room 102, 1st Floor, Building 98, No. 1441 Humin Road, Minhang District, Shanghai, 2019; Room 302, 3rd Floor, Building 98; Room 402, 4th Floor, Building 98 Patentee after: Yimu (Shanghai) Technology Co.,Ltd. Address before: 201109 room 1206, building 1, No. 951, Jianchuan Road, Minhang District, Shanghai Patentee before: Yimu (Shanghai) Technology Co.,Ltd. |