CN110133895B - Display substrate, manufacturing method thereof and display device - Google Patents
Display substrate, manufacturing method thereof and display device Download PDFInfo
- Publication number
- CN110133895B CN110133895B CN201910497875.XA CN201910497875A CN110133895B CN 110133895 B CN110133895 B CN 110133895B CN 201910497875 A CN201910497875 A CN 201910497875A CN 110133895 B CN110133895 B CN 110133895B
- Authority
- CN
- China
- Prior art keywords
- insulating layer
- layer
- insulating
- substrate
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display substrate, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display substrate comprises a first insulating layer located on a substrate, a conductive wire located on one side, away from the substrate, of the first insulating layer, and a second insulating layer located on one side, away from the substrate, of the conductive wire, wherein at least part of the surface, facing the second insulating layer, of the first insulating layer is uneven. The technical scheme of the invention can improve the reliability of the display device.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a manufacturing method thereof and a display device.
Background
The traditional display has the defects that the wiring density of the wiring area is high, the effective contact area between the insulating film layers on the upper side and the lower side of the wiring is influenced, the film layer falling phenomenon is easy to occur, and the reliability of a display device is influenced.
Disclosure of Invention
The invention aims to provide a display substrate, a manufacturing method thereof and a display device, which can improve the reliability of a display device.
To solve the above technical problem, embodiments of the present invention provide the following technical solutions:
in one aspect, a display substrate is provided, where the display substrate includes a first insulating layer on a substrate, a conductive trace on a side of the first insulating layer away from the substrate, and a second insulating layer on a side of the conductive trace away from the substrate, and at least a partial area of a surface of the first insulating layer facing the second insulating layer is uneven.
Optionally, the first insulating layer is an interlayer insulating layer, the second insulating layer is a flat layer, and the conductive trace is a source-drain metal trace.
Optionally, the at least partial region is located in a routing area of the display substrate.
Optionally, a plurality of grooves arranged in an array are formed in a surface of one side, facing the second insulating layer, of the first insulating layer.
Optionally, a plurality of strip-shaped grooves parallel to each other are formed in a surface of one side, facing the second insulating layer, of the first insulating layer.
Optionally, the first insulating layer includes a first insulating film layer and a second insulating film layer, which are stacked, the second insulating film layer is located between the substrate and the first insulating film layer, and the depth of the groove does not exceed the thickness of the first insulating film layer.
Optionally, the depth of the groove is equal to the thickness of the first insulating film layer.
Optionally, the depth of the groove is one third to one half of the thickness of the first insulating layer.
The embodiment of the invention also provides a display device which comprises the display substrate.
The embodiment of the invention also provides a manufacturing method of the display substrate, which comprises the following steps:
forming a first insulating layer with an uneven surface on a substrate base plate;
forming a conductive trace on the first insulating layer;
and forming a second insulating layer covering the conductive routing.
Optionally, the forming the first insulating layer having the surface unevenness on the base substrate includes:
forming a first insulating material layer on the substrate base plate;
coating photoresist on the first insulating material layer;
exposing the photoresist by using a half-tone mask plate, wherein the half-tone mask plate comprises a light transmitting area corresponding to the through hole area of the first insulating layer, a partial light transmitting area corresponding to the groove of the first insulating layer and a shading area corresponding to other areas of the first insulating layer;
forming a photoresist complete reserving area, a photoresist partial reserving area and a photoresist removing area after developing;
etching the first insulating material layer in the photoresist removing area to form a through hole penetrating through the first insulating layer;
removing the photoresist in the photoresist part reserving area;
etching the first insulating material layer in the photoresist part reserved area to form a groove on the surface of the first insulating layer;
and removing the photoresist in the photoresist complete reserved area.
The embodiment of the invention has the following beneficial effects:
in the above scheme, at least a partial region of the first insulating layer facing to one side surface of the second insulating layer is uneven, so that the contact area between the first insulating layer and the second insulating layer can be increased, the binding force between the first insulating layer and the second insulating layer is increased, the phenomenon of film falling is avoided, and the reliability of the display substrate can be improved.
Drawings
FIG. 1 is a diagram illustrating a routing area of a display substrate according to the related art;
FIG. 2 is a schematic cross-sectional view of FIG. 1 in the direction AA;
FIG. 3 is a diagram illustrating a wiring region of a display substrate according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of FIG. 3 in the direction AA;
FIG. 5 is a schematic diagram of a wiring region of a display substrate according to another embodiment of the invention;
FIG. 6 is a schematic cross-sectional view of FIG. 5 in the direction AA;
FIG. 7 is a schematic diagram of a wiring region of a display substrate according to yet another embodiment of the present invention;
fig. 8-11 are diagrams illustrating the formation of an interlayer insulating layer according to an embodiment of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description is made with reference to the accompanying drawings and specific embodiments.
The routing density of the display routing area is large, effective contact area between insulating film layers on the upper side and the lower side of the routing is affected, and a film falling phenomenon easily occurs, as shown in fig. 1 and fig. 2, in a display substrate of the related art, a source drain metal routing 2 is arranged on an interlayer insulating layer 1, one side, away from the interlayer insulating layer 1, of the source drain metal routing 2 is provided with a flat layer 3, due to the fact that the routing density of the source drain metal routing 2 in the routing area is large, the effective contact area between the interlayer insulating layer 1 and the flat layer 3 is small, in the process of carrying out a display reliability complete machine falling test, the falling phenomenon of the flat layer 3 easily occurs, external air enters the display from the falling part of the flat layer 3, bubbles are generated, the display is poor in black clusters, and the reliability of the display device is affected.
Embodiments of the present invention provide a display substrate, a method for manufacturing the same, and a display device, which can improve reliability of a display device.
The embodiment of the invention provides a display substrate, which comprises a first insulating layer, a conductive wire and a second insulating layer, wherein the first insulating layer is positioned on a substrate, the conductive wire is positioned on one side of the first insulating layer, which is far away from the substrate, the second insulating layer is positioned on one side of the conductive wire, which is far away from the substrate, and at least part of the surface of the first insulating layer, which faces the second insulating layer, is uneven.
In this embodiment, at least a partial region of the first insulating layer facing the second insulating layer is uneven, so that the contact area between the first insulating layer and the second insulating layer can be increased, the binding force between the first insulating layer and the second insulating layer is increased, the film falling phenomenon is avoided, and the reliability of the display substrate can be improved.
The whole area of the first insulating layer facing to the second insulating layer side surface can be uneven, and the partial area of the first insulating layer facing to the second insulating layer side surface can be uneven, so that the contact area of the first insulating layer and the second insulating layer can be increased, and the binding force between the first insulating layer and the second insulating layer is increased.
Because the wiring density of the wiring area is high, the film layer is easy to fall off, therefore, the part of the first insulating layer facing the surface of the second insulating layer, which is located in the wiring area, is preferably rugged, i.e. at least part of the area is located in the wiring area of the display substrate.
In a specific embodiment, the first insulating layer may be an interlayer insulating layer, the second insulating layer may be a planar layer, and the conductive trace may be a source-drain metal trace. Certainly, the first insulating layer is not limited to an interlayer insulating layer, the second insulating layer is not limited to a flat layer, the conductive traces are not limited to source-drain metal traces, and other films and other signal lines can be used.
In a specific embodiment, a plurality of grooves arranged in an array may be disposed on a side surface of the first insulating layer facing the second insulating layer, and the side surface of the first insulating layer facing the second insulating layer is uneven through the plurality of grooves arranged in an array.
In another specific embodiment, a plurality of parallel strip-shaped grooves may be formed in a surface of the first insulating layer facing the second insulating layer, and the surface of the first insulating layer facing the second insulating layer is uneven through the plurality of parallel strip-shaped grooves.
Certainly, the technical solution of the present invention is not limited to that the surface of the first insulating layer facing the second insulating layer is uneven through the groove, and a plurality of protrusions may be disposed on the surface of the first insulating layer facing the second insulating layer, so that the surface of the first insulating layer facing the second insulating layer is uneven. In addition, the grooves on the surface of the first insulating layer facing the second insulating layer do not need to be regularly arranged, and may also be irregularly arranged.
In a specific embodiment, the first insulating layer includes a first insulating film layer and a second insulating film layer which are stacked, the second insulating film layer is located between the substrate and the first insulating film layer, and since a groove needs to be formed through an etching process, and the first insulating film layer and the second insulating film layer are different in material and different in applicable etching process parameters, simultaneous etching of the first insulating film layer and the second insulating film layer is not easy to control, it is preferable that the groove is formed only within a range of the first insulating film layer, that is, the depth of the groove does not exceed the thickness of the first insulating film layer.
Specifically, the depth of the groove may be equal to the thickness of the first insulating film layer.
The greater the depth of recess, then the area of contact between first insulating layer and the second insulating layer is bigger, but the unsmooth degree grow of first insulating layer surface simultaneously, and the length of forming the electrically conductive line on the first insulating layer also can increase, can lead to the electrically conductive resistance grow of walking the line, consequently, the depth of recess should not be too big yet, preferably, the depth of recess can be one third to one half of the thickness of first insulating layer, can compromise the area of contact between first insulating layer and the second insulating layer and the electrically conductive electric conductive property of walking the line like this.
In a specific embodiment, as shown in fig. 3 and 4, the first insulating layer is an interlayer insulating layer 2, the second insulating layer is a flat layer 3, the conductive trace is a source-drain metal trace 2, and a plurality of grooves 4 arranged in an array are formed in the surface of the interlayer insulating layer 2 contacting the flat layer 3, so that the contact area between the interlayer insulating layer 2 and the flat layer 3 can be increased, and the flat layer 3 is not easy to fall off in the process of performing a complete machine drop test on the reliability of the display.
In another embodiment, as shown in fig. 5-7, the first insulating layer is an interlayer insulating layer 2, the second insulating layer is a flat layer 3, the conductive trace is a source-drain metal trace 2, and a plurality of strip-shaped grooves 4 arranged in parallel are formed on the surface of the interlayer insulating layer 2 contacting the flat layer 3, so that the contact area between the interlayer insulating layer 2 and the flat layer 3 can be increased, and the flat layer 3 is not easy to fall off during the whole machine drop test of the display reliability.
As shown in fig. 5, the extending direction of the strip-shaped groove 4 may be parallel to the edge of the substrate base plate; alternatively, as shown in fig. 6, the extension direction of the strip-shaped groove 4 may be at an angle to the edge of the substrate base plate.
The embodiment of the invention also provides a display device which comprises the display substrate. The display device includes but is not limited to: radio frequency unit, network module, audio output unit, input unit, sensor, display unit, user input unit, interface unit, memory, processor, and power supply. It will be appreciated by those skilled in the art that the above described configuration of the display device does not constitute a limitation of the display device, and that the display device may comprise more or less of the components described above, or some components may be combined, or a different arrangement of components. In the embodiment of the present invention, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.
The display device may be: the display device comprises any product or component with a display function, such as a liquid crystal television, a liquid crystal display, a digital photo frame, a mobile phone, a tablet personal computer and the like, wherein the display device further comprises a flexible circuit board, a printed circuit board and a back plate.
The embodiment of the invention also provides a manufacturing method of the display substrate, which comprises the following steps:
forming a first insulating layer with an uneven surface on a substrate;
forming a conductive trace on the first insulating layer;
and forming a second insulating layer covering the conductive routing.
In this embodiment, the first insulating layer is unevenness towards the at least subregion of second insulating layer side surface, can increase the area of contact of first insulating layer and second insulating layer like this, and then increases the cohesion between first insulating layer and the second insulating layer, avoids taking place the rete phenomenon of coming off, can improve display substrates's reliability.
The whole area of the first insulating layer facing to the second insulating layer side surface can be uneven, and the partial area of the first insulating layer facing to the second insulating layer side surface can be uneven, so that the contact area of the first insulating layer and the second insulating layer can be increased, and the binding force between the first insulating layer and the second insulating layer is increased.
Because the wiring density of the wiring area is high, the film layer is easy to fall off, therefore, the part of the first insulating layer facing the surface of the second insulating layer, which is positioned in the wiring area, is preferably rugged, that is, at least part of the area is positioned in the wiring area of the display substrate.
In a specific embodiment, the first insulating layer may be an interlayer insulating layer, the second insulating layer may be a planar layer, and the conductive trace may be a source-drain metal trace. Certainly, the first insulating layer is not limited to an interlayer insulating layer, the second insulating layer is not limited to a flat layer, the conductive traces are not limited to source-drain metal traces, and other films and other signal lines can be used.
In a specific embodiment, a plurality of grooves arranged in an array may be disposed on a side surface of the first insulating layer facing the second insulating layer, and the side surface of the first insulating layer facing the second insulating layer is uneven through the plurality of grooves arranged in an array.
In another specific embodiment, a plurality of parallel strip-shaped grooves may be formed in a surface of the first insulating layer facing the second insulating layer, and the surface of the first insulating layer facing the second insulating layer is uneven through the plurality of parallel strip-shaped grooves.
Specifically, the forming of the first insulating layer having the surface unevenness on the base substrate includes:
as shown in fig. 8, a first insulating material layer 5 is formed on the substrate, and a photoresist 6 is coated on the first insulating material layer 5; exposing the photoresist 6 by using a half-tone mask 7, wherein the half-tone mask 7 comprises a light transmitting area 73 corresponding to a through hole area of the first insulating layer, a partial light transmitting area 72 corresponding to a groove of the first insulating layer and a light shielding area 71 corresponding to other areas of the first insulating layer; the via hole region of the first insulating layer may be located in the display region or the wiring region of the display substrate, and the groove of the first insulating layer may be located only in the wiring region, or may be located in both the display region and the wiring region of the display substrate;
as shown in fig. 9, after development, a photoresist complete remaining region a, a photoresist partial remaining region B, and a photoresist removal region C are formed;
as shown in fig. 10, the first insulating material layer 5 in the photoresist removing region C is etched to form a via hole penetrating through the first insulating layer; removing the photoresist in the photoresist part reserving area;
as shown in fig. 11, the first insulating material layer 5 in the photoresist portion retention region B is etched to form a groove on the surface of the first insulating layer;
and finally, removing the photoresist of the photoresist complete remaining area A.
Through the steps, the groove can be formed on the surface of one side, facing the second insulating layer, of the first insulating layer.
Certainly, the technical solution of the present invention is not limited to that the surface of the first insulating layer facing the second insulating layer is uneven through the groove, and a plurality of protrusions may be disposed on the surface of the first insulating layer facing the second insulating layer, so that the surface of the first insulating layer facing the second insulating layer is uneven. In addition, the grooves on the surface of the first insulating layer facing the second insulating layer do not have to be regularly arranged, and may also be irregularly arranged.
In a specific embodiment, the first insulating layer includes a first insulating film layer and a second insulating film layer which are stacked, the second insulating film layer is located between the substrate and the first insulating film layer, and since a groove needs to be formed through an etching process, and the first insulating film layer and the second insulating film layer are different in material and different in applicable etching process parameters, simultaneous etching of the first insulating film layer and the second insulating film layer is not easy to control, it is preferable that the groove is formed only within a range of the first insulating film layer, that is, the depth of the groove does not exceed the thickness of the first insulating film layer.
Specifically, the depth of the groove may be equal to the thickness of the first insulating film layer.
The greater the depth of recess, then the area of contact between first insulating layer and the second insulating layer is bigger, but the unsmooth degree grow of first insulating layer surface simultaneously, and the length of forming the electrically conductive line on the first insulating layer also can increase, can lead to the electrically conductive resistance grow of walking the line, consequently, the depth of recess should not be too big yet, preferably, the depth of recess can be one third to one half of the thickness of first insulating layer, can compromise the area of contact between first insulating layer and the second insulating layer and the electrically conductive electric conductive property of walking the line like this.
In a specific embodiment, as shown in fig. 3 and 4, the first insulating layer is an interlayer insulating layer 2, the second insulating layer is a flat layer 3, the conductive trace is a source-drain metal trace 2, and a plurality of grooves 4 arranged in an array are formed in the surface of the interlayer insulating layer 2 contacting the flat layer 3, so that the contact area between the interlayer insulating layer 2 and the flat layer 3 can be increased, and the flat layer 3 is not easy to fall off in the process of performing a complete machine drop test on the reliability of the display.
In another embodiment, as shown in fig. 5-7, the first insulating layer is an interlayer insulating layer 2, the second insulating layer is a flat layer 3, the conductive trace is a source-drain metal trace 2, and a plurality of strip-shaped grooves 4 arranged in parallel are formed on the surface of the interlayer insulating layer 2 contacting the flat layer 3, so that the contact area between the interlayer insulating layer 2 and the flat layer 3 can be increased, and the flat layer 3 is not easy to fall off during the whole machine drop test of the display reliability.
As shown in fig. 5, the extending direction of the strip-shaped groove 4 may be parallel to the edge of the substrate base plate; alternatively, as shown in fig. 6, the extension direction of the strip-shaped groove 4 may be at an angle with the edge of the substrate base plate.
It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is simple, and reference may be made to the partial description of the product embodiments for relevant points.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used only to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present disclosure, and shall cover the scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.
Claims (5)
1. A display substrate comprises a first insulating layer positioned on a substrate, a conductive wire positioned on one side of the first insulating layer, which is far away from the substrate, and a second insulating layer positioned on one side of the conductive wire, which is far away from the substrate, wherein at least part of the surface of the first insulating layer, which is contacted with the second insulating layer, is uneven;
a plurality of grooves arranged in an array are formed in the surface of one side, contacting the second insulating layer, of the first insulating layer; or
A plurality of parallel strip-shaped grooves are formed in the surface of one side, contacting the second insulating layer, of the first insulating layer; the first insulating layer comprises a first insulating film layer and a second insulating film layer which are arranged in a stacked mode, the second insulating film layer is located between the substrate and the first insulating film layer, and the depth of the groove does not exceed the thickness of the first insulating film layer; wherein the depth of the groove is one third to one half of the thickness of the first insulating layer;
the first insulating layer is an interlayer insulating layer, the second insulating layer is a flat layer, and the conductive wires are source-drain metal wires.
2. The display substrate of claim 1, wherein the at least partial area is located in a routing area of the display substrate.
3. A display device comprising the display substrate according to any one of claims 1 to 2.
4. A method for manufacturing a display substrate is characterized by comprising the following steps:
forming a first insulating layer with an uneven surface on a substrate;
forming a conductive trace on the first insulating layer;
forming a second insulating layer covering the conductive trace;
a plurality of grooves arranged in an array are formed in the surface of one side, contacting the second insulating layer, of the first insulating layer; or
A plurality of mutually parallel strip-shaped grooves are formed in the surface of one side, contacting the second insulating layer, of the first insulating layer; the first insulating layer comprises a first insulating film layer and a second insulating film layer which are stacked, the second insulating film layer is positioned between the substrate and the first insulating film layer, and the depth of the groove does not exceed the thickness of the first insulating film layer; wherein the depth of the groove is one third to one half of the thickness of the first insulating layer; the first insulating layer is an interlayer insulating layer, the second insulating layer is a flat layer, and the conductive wires are source drain metal wires.
5. The method of manufacturing a display substrate according to claim 4, wherein the forming of the first insulating layer having the surface irregularities on the substrate comprises:
forming a first insulating material layer on the substrate base plate;
coating photoresist on the first insulating material layer;
exposing the photoresist by using a half-tone mask plate, wherein the half-tone mask plate comprises a light-transmitting area corresponding to the through hole area of the first insulating layer, a partial light-transmitting area corresponding to the groove of the first insulating layer and a shading area corresponding to other areas of the first insulating layer;
forming a photoresist complete reserving area, a photoresist partial reserving area and a photoresist removing area after developing;
etching the first insulating material layer in the photoresist removing area to form a through hole penetrating through the first insulating layer;
removing the photoresist in the photoresist part reserving area;
etching the first insulating material layer in the photoresist part reserved area to form a groove on the surface of the first insulating layer;
and removing the photoresist in the photoresist complete reserved area.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910497875.XA CN110133895B (en) | 2019-06-10 | 2019-06-10 | Display substrate, manufacturing method thereof and display device |
| PCT/CN2020/086105 WO2020248722A1 (en) | 2019-06-10 | 2020-04-22 | Display substrate and manufacturing method therefor, and display apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910497875.XA CN110133895B (en) | 2019-06-10 | 2019-06-10 | Display substrate, manufacturing method thereof and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110133895A CN110133895A (en) | 2019-08-16 |
| CN110133895B true CN110133895B (en) | 2022-12-20 |
Family
ID=67580999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910497875.XA Active CN110133895B (en) | 2019-06-10 | 2019-06-10 | Display substrate, manufacturing method thereof and display device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110133895B (en) |
| WO (1) | WO2020248722A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110133895B (en) * | 2019-06-10 | 2022-12-20 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and display device |
| CN113168046B (en) * | 2019-10-24 | 2023-08-25 | 京东方科技集团股份有限公司 | Driving substrate, manufacturing method thereof and display device |
| CN111584551B (en) * | 2020-05-06 | 2023-12-01 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN111583812B (en) * | 2020-05-26 | 2023-09-22 | 京东方科技集团股份有限公司 | Connection substrate, preparation method, spliced screen and display device |
| CN114489377B (en) * | 2021-12-31 | 2024-02-27 | 湖北长江新型显示产业创新中心有限公司 | Touch display panel and touch display device |
| CN115206180B (en) * | 2022-07-25 | 2023-08-01 | 武汉华星光电技术有限公司 | Display panel and display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102394238A (en) * | 2011-06-16 | 2012-03-28 | 友达光电股份有限公司 | Manufacturing procedure of electric conduction structure |
| CN105974696A (en) * | 2016-07-25 | 2016-09-28 | 京东方科技集团股份有限公司 | Display panel |
| CN107705704A (en) * | 2017-06-16 | 2018-02-16 | 友达光电股份有限公司 | Display device and method of manufacturing the same |
| CN207517287U (en) * | 2017-11-30 | 2018-06-19 | 云谷（固安）科技有限公司 | Array substrate and display screen |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977279B (en) * | 2016-07-07 | 2020-12-01 | 京东方科技集团股份有限公司 | Organic light-emitting diode substrate, preparation method thereof and display device |
| KR20180067754A (en) * | 2016-12-12 | 2018-06-21 | 삼성디스플레이 주식회사 | Display device |
| US10811488B2 (en) * | 2017-09-22 | 2020-10-20 | Sharp Kabushiki Kaisha | Display device |
| CN207852664U (en) * | 2018-02-08 | 2018-09-11 | 颀中科技（苏州）有限公司 | Anti-dropout reroutes structure and the semiconductor packing device with the rewiring structure |
| CN109671745B (en) * | 2018-12-11 | 2021-06-22 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN110133895B (en) * | 2019-06-10 | 2022-12-20 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and display device |
-
2019
- 2019-06-10 CN CN201910497875.XA patent/CN110133895B/en active Active
-
2020
- 2020-04-22 WO PCT/CN2020/086105 patent/WO2020248722A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102394238A (en) * | 2011-06-16 | 2012-03-28 | 友达光电股份有限公司 | Manufacturing procedure of electric conduction structure |
| CN105974696A (en) * | 2016-07-25 | 2016-09-28 | 京东方科技集团股份有限公司 | Display panel |
| CN107705704A (en) * | 2017-06-16 | 2018-02-16 | 友达光电股份有限公司 | Display device and method of manufacturing the same |
| CN207517287U (en) * | 2017-11-30 | 2018-06-19 | 云谷（固安）科技有限公司 | Array substrate and display screen |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110133895A (en) | 2019-08-16 |
| WO2020248722A1 (en) | 2020-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110133895B (en) | Display substrate, manufacturing method thereof and display device | |
| RU2506627C2 (en) | Touch panel and method for production thereof | |
| CN111162199B (en) | Display panel and display device | |
| JP2018503847A (en) | Array substrate, manufacturing method and driving method thereof, and display device | |
| TW201719352A (en) | Touch module with transparent antenna and touch display apparatus using same | |
| CN109634467B (en) | Array substrate and preparation method thereof | |
| CN111952323B (en) | Preparation method of display substrate, display substrate and display device | |
| WO2018000480A1 (en) | Array substrate, touch display, and electronic device | |
| CN104793802B (en) | Array base palte and its manufacture method, display panel and display device | |
| US20220406868A1 (en) | Display substrate, fabrication method thereof and display apparatus | |
| CN100369258C (en) | Active component array substrate | |
| CN109461403B (en) | Display device, preparation method thereof and display device | |
| CN109960438B (en) | Substrate, manufacturing method thereof and touch display device | |
| US10620735B2 (en) | Force touch module, manufacturing method thereof, display screen and display device | |
| CN109118956B (en) | Transparent display panel, display device and manufacturing method of transparent display panel | |
| US11086460B2 (en) | Touch substrate, method for manufacturing same, and touch device | |
| CN111653594A (en) | Display substrate, manufacturing method thereof and display device | |
| CN111399684A (en) | Touch substrate, manufacturing method thereof, display panel and display device | |
| CN103576951B (en) | Contact panel, its manufacture method and display device thereof | |
| KR20220012831A (en) | Photosensitive sensors, array boards and electronic devices | |
| CN110098236A (en) | Display base plate and preparation method thereof, display device | |
| CN111210730A (en) | Display panel and display device | |
| WO2021170042A1 (en) | Display substrate and method for manufacturing same, and display apparatus | |
| US20220271059A1 (en) | Display substrate, display device, display substrate, method of forming display substrate, and method of forming display device | |
| CN111969128B (en) | OLED display substrate, manufacturing method thereof and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |