CN110112185A - A kind of flexible display panels and preparation method thereof - Google Patents
A kind of flexible display panels and preparation method thereof Download PDFInfo
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- CN110112185A CN110112185A CN201910313441.XA CN201910313441A CN110112185A CN 110112185 A CN110112185 A CN 110112185A CN 201910313441 A CN201910313441 A CN 201910313441A CN 110112185 A CN110112185 A CN 110112185A
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- base
- expander
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention provides a kind of flexible display panels, comprising: the first base；First buffer layer is overlying in first base；Second base is overlying in the first buffer layer；Second buffer layer is overlying in second base；Tft layer is set on the buffer layer；And functional layer, it is set on the tft layer；Wherein, first base includes an at least expander, and the expander is set in first base, and after expander expansion, the expander protrudes from the surface of first base far from the first buffer layer.The present invention absorbs the heat expansion that the first base described in laser irradiation generates by the expander and struts the glass substrate, improves peeling effect, to improve laser lift-off yield.
Description
Technical field
The present invention relates to flexible display technologies field, especially a kind of flexible display panels and preparation method thereof.
Background technique
In flexible display panels design, PI (polyimides) material of high tensile is generallyd use as lining flexible
Bottom material.During the preparation process, first be coated on glass substrate with PI liquid, after film-forming again above carry out driving element,
The production of display device.The heat resistance of PI material ensure that display panel is not damaged in processing procedure high temperature (> 400 DEG C), PI material
The low thermal coefficient of expansion characteristic of material ensure that high-res (> 300ppi) and the processing procedure aligning accuracy needed for panel processing procedure.
Finally using PI material to the strong absorption characteristic of ultraviolet light, it is allowed to shell through glass radiation PI material using ultraviolet band laser
From flexible display panels are finally prepared.
After the key of laser lift-off is laser irradiation PI base, the surface layer PI can be heated, and to generate enough dissociations broken
Piece and gas, this will lead to volume and sharply expands and wash PI base and glass open.After removing, between glass and PI base wash open
Gap need to make Dissociation fragment cooling enough, and otherwise Dissociation fragment can still bond PI base and glass, or the gas generated it is insufficient and
Negative pressure of vacuum is formed between PI base and glass, causes to pull PI base generation stress when subsequent removing flexible display panels simultaneously
It is transferred to OLED device.So as to be damaged, cause product bad.
The structure design of existing flexible display panels has the base layer structure of single or double layer to design.In single layer laser lift-off
In the process, ultraviolet laser penetrates glass radiation PI base, and PI substrate surface absorbs photochemistry/photothermy dissociation after laser, and
Heat is generated internally to transmit；After generating thermal dissociation fragment and gas after PI dissociation, PI base and glass are washed in volume expansion open
Glass forms gap, and cooling anchors at PI and glass surface to Dissociation fragment respectively.
But if defect (foreign matter, scuffing, bubble etc.) and PI liquid impurity itself etc. inside and outside Laser Energy Change, glass
It will lead to that PI layer surface region does not generate enough Dissociation fragments and gas washes enough gaps open, again by PI after Dissociation fragment is cooling
Layer and glassy bond.This can only be by mechanically decoupled glass and flexible display panels, and at this time bonding point or negative pressuren zone generate drawing
Stress.This will affect removing, can also make device impaired.
Summary of the invention
The object of the present invention is to provide flexible display panels and preparation method thereof, and it is soft can effectively to solve laser lift-off
The effect of property substrate is poor, and the problems such as the stress for pullling generation by external force will affect the function of display device.
To solve the above-mentioned problems, the present invention provides a kind of flexible display panels, comprising: the first base；First buffer layer,
It is overlying in first base；Second base is overlying in the first buffer layer；Second buffer layer is overlying on second base
On；Tft layer is set on the buffer layer；And functional layer, it is set on the tft layer；Wherein, described
First base includes an at least expander, and the expander is set in first base, and after expander expansion, institute
It states expander and protrudes from the surface of first base far from the first buffer layer.
Further, the expander is a sphere, comprising: spherical inner core and spherical housing coat in the spherical shape
Core；The diameter of the expander is 1~5um.
Further, the material of the spherical housing is plastic macromolecule polymer；The ball material of the expander
For hydrocarbon；The gasification temperature of the hydrocarbon is 80~150 DEG C.
Further, the plastic macromolecule polymer is acrylonitrile copolymer；The hydrocarbon is liquid hydrocarbon, packet
Include ethylene, natural gas or propylene etc..
Further, the functional layer includes: display device structure sheaf, is set on the tft layer；And it is thin
Film encapsulated layer is set to the display device structure sheaf.
Another object of the present invention provides a kind of flexible display panels preparation method, comprising: provides a glass substrate；It will expansion
Body is spread in a surface of the glass substrate；The one side that the first base has the expander in the glass substrate is formed,
And the expander is coated in first base；The second base is formed in first base；Formed buffer layer in
In second base；Tft layer is formed on the buffer layer；Each functional layer is formed in the tft layer
On；The glass substrate is heated, the expander is expanded；After expander expansion, the expander protrudes from described
Surface of first base far from the first buffer layer, so as to form gap between the glass substrate and first base；
The glass substrate is removed from first base.
Further, the expander is a sphere, including spherical inner core and spherical housing, is coated in the spherical shape
Core；In the heating glass substrate step, by glass substrate described in ultraviolet light, described in the UV light permeability
Glass substrate is simultaneously irradiated to the expander, keeps the spherical housing and the spherical inner core heated, the spherical housing by
Thermal softening, the spherical inner core expand the spherical housing by thermal evaporation, first base and the glass substrate are supportted
It opens, so as to form gap between the glass substrate and first base.
Further, in the first base of the formation in the one side step that the glass substrate has the expander,
Including the first polyimide solution to be coated on the glass substrate, and carry out being heating and curing to form one first base for the first time
Layer；Described first is coated in the first buffer layer step, including by the second polyimide solution forming the second base
It on buffer layer, and is heating and curing to form one second base for the second time, the second polyimide solution concentration is greater than described
First polyimide solution concentration.
Further, the heating temperature that the first time is heating and curing is 100~200 DEG C；It is described to be heating and curing for the second time
Heating temperature be 200~300 DEG C.
Further, after heating the glass substrate, the spherical housing of the expander is cooling and maintains after expanding
Volume, to support the glass substrate.
The beneficial effects of the present invention are: the present invention provides a kind of flexible display panels and preparation method thereof, invention proposes one
The design of kind of novel double-layer base layer structure by design different stretch intensity but is resistant to processing procedure high temperature, low thermal coefficient of expansion
The collocation of Liang Zhong base.
Wherein, adhesive layer and sacrificial layer serve as in low the first base of tensile strength, and the second base of high tensile meets normal
Flexible bending demand, and multiple expanders are equipped in the first base, it is absorbed first described in laser irradiation by the expander
The heat expansion that base generates struts the glass substrate, improves peeling effect, to improve laser lift-off yield.And
A buffer layer is equipped between one base and the second base, to mitigate the thermal stress of laser emission generation.
Detailed description of the invention
The invention will be further described with reference to the accompanying drawings and examples.
Fig. 1 is flexible display panels structural schematic diagram provided by the invention；
Fig. 2 is the structural schematic diagram of expander provided by the invention；
Fig. 3 is the preparation method of flexible display panels provided by the invention；
Fig. 4 is the structural schematic diagram of flexible display panels provided by the invention and glass substrate；
Fig. 5 is the structural schematic diagram of laser irradiation glass substrate provided by the invention；
Fig. 6 is the structural schematic diagram that expander provided by the invention expansion struts first base.
Flexible display panels 100；
Glass substrate 10；Expander 11；Functional layer 13
First base 101；First buffer layer 102；Second base 103；
Second buffer layer 104；Tft layer 105；Spherical inner core 111
Spherical housing 112；Display device structure sheaf 106；Thin-film encapsulation layer 107
Specific embodiment
The explanation for being below each embodiment is can to use the specific reality implemented to illustrate the present invention with reference to additional schema
Apply example.The direction term that the present invention is previously mentioned, for example, above and below, front, rear, left and right, inside and outside, side etc., be only with reference to accompanying drawings
Direction.The element title that the present invention mentions, such as first, second etc., it is only to discriminate between different components, it can better table
It reaches.
The similar unit of structure is given the same reference numerals in the figure.
Herein with reference to the accompanying drawings to detailed description of the present invention embodiment.However, it is possible to implement in many different forms
The present invention, and the present invention should not be construed as limited to the specific embodiment illustrated here.These embodiments are provided on the contrary
It is in order to explain practical application of the invention, to make others skilled in the art it will be appreciated that various implementations of the invention
Example and the various modifications for being suitable for specific intended application.
As shown in Figure 1, in embodiment, the present invention provides a kind of flexible display panels 100, comprising: the first base 101,
First buffer layer 102, the second base 103, second buffer layer 104, tft layer 105 and functional layer 13.
The fusing point of first base 101 is 400~1000 DEG C, first base 101 with a thickness of 1~10um, this
It invents optimal for 5um, or 2um, 4um, 6um or 8um.
The tensile strength of first base 101 is 1~200MPa, and optimal tensile strength is 100MPa, or
50MPa, 80MPa, 150MPa or 180MPa.First base, 101 tensile strength do not answer it is excessive, prevent peeling liner bottom when
The excessive damage for leading to display device of standby power.
First base 101 is made by being coated with polyimide solution, and first base 101 is heat-resisting material,
In the present invention other devices can be prepared in first base 101.
First base 101 includes an at least expander 11, and the expander 11 is set in first base 101,
And after the expander 11 expansion, the expander 11 protrudes from first base 101 far from the first buffer layer 102
Surface.
As shown in Fig. 2, the expander 11 is a sphere, comprising: spherical inner core 111 and spherical housing 112.It is described
The diameter of expander 11 is 1~5um, and optimal is 5um, or 2um, 3um or 4um.
The spherical housing 112 coats 111 institute of spherical inner core, and the material for stating spherical housing 112 is plasticity high score
Sub- polymer；The plastic macromolecule polymer is acrylonitrile copolymer.
The ball material of the expander 11 is hydrocarbon；The gasification temperature of the hydrocarbon is 80~150
℃.The hydrocarbon is liquid hydrocarbon, including ethylene, natural gas or propylene etc..
The tensile strength of first base 101 is smaller, makes first base after 11 expanded by heating of expander
101 are easy to be strutted by the expander 11, can be easier to carry out operating in the step of removing glass substrate 10.
The first buffer layer 102 is overlying on side of first base 101 far from the expander 11, and described first is slow
Rushing 102 material of layer is the inorganic material such as silicon oxide or silicon nitride；The first buffer layer 102 is to buffer the expander 11
Expand the expansive force generated, be also prevented from excessive heat transmit downwards and mitigate up and down different film layers because of thermal stress caused by the temperature difference.
Second base 103 is overlying in the first buffer layer 102；The fusing point of second base 103 be 400~
1000℃；Second base 103 with a thickness of 1~10um, the optimal present invention is 5um, or 2um, 4um, 6um or
8um。
The tensile strength of second base 103 is 200~400Mpa.Optimal tensile strength is 300 MPa, or
250MPa, 280MPa, 350MPa or 380MPa.
Second base 103 is made by being coated with polyimide solution, and second base 103 is heat-resisting material,
In the present invention other devices can be prepared in second base 103.Prepare the polyimide solution of second base 103
Concentration is different from the polyimide solution concentration for preparing first base 101, the big stretching of general polyimide solution concentration
Intensity is then big.
The tensile strength of second base 103 meets the high-strength flexible form of display panel after removing, such as bending, folding
It folds.
The second buffer layer is overlying in second base 103；The second buffer layer 104 is silicon oxide or silicon nitride
Etc. inorganic material be made, transmitted downwards to prevent laser lift-off from generating excessive heat, can mitigate up and down different film layers because of temperature
Thermal stress caused by difference.
The tft layer 105 is set on the buffer layer；The tft layer 105 is generally low-temperature polysilicon
Silicon thin film transistor (LTPS-TFT), thin film transistor (TFT) (TFT) or oxide thin film transistor.The tft layer 105
It can be used for flexible display panels 100 to be shown.
The functional layer 13 is set on the tft layer 105；The functional layer 13 includes display device structure sheaf
106 and thin-film encapsulation layer 107, the functional layer 13 is set on the tft layer 105.
The display device structure sheaf 106 mainly includes anode, hole injection layer, hole transmission layer, luminescent layer electronics biography
Defeated layer, electron injecting layer and cathode；The anode is overlying on the tft layer 105 far from buffer layer side；The hole
Implanted layer is overlying on the anode far from 105 side of tft layer, and the hole transmission layer is overlying on the hole injection
Layer is overlying on the hole transmission layer far from the hole injection layer side, the electricity far from the anode side, the luminescent layer
Sub- transport layer is overlying on the luminescent layer far from the hole transmission layer side, and the electron injecting layer is overlying on the electron transfer layer
Far from the luminescent layer side, the cathode is overlying on the electron injecting layer far from the electron transfer layer side.
The thin-film encapsulation layer 107 is set on the display device structure sheaf 106, the preparation of the thin-film encapsulation layer 107
Method can be chemical vapor deposition method, Atomic layer deposition method or inkjet printing methods, and the present invention is preferably that chemical vapor is heavy
Product method.Thin-film encapsulation layer 107 primarily serves the effect of exclusion of water and oxygen, can be used for protecting the display device structure sheaf
106 related devices.
As shown in figure 3, another object of the present invention provides a kind of 100 preparation method of flexible display panels, including step S1~
S10:
S1, as shown in figure 4, provide a glass substrate 10, and to the surface of the glass substrate 10 carry out plasma treatment,
The attachment degree of polyimide solution described in step S2 can be improved in this.
S2, the surface that expander 11 is spread in the glass substrate 10, the expander 11 are a sphere, comprising:
Spherical inner core 111 and spherical housing 112.
The diameter of the expander 11 is 1~5um, and optimal is 5um, or 2um, 3um or 4um.
The spherical housing 112 coats 111 institute of spherical inner core, and the material for stating spherical housing 112 is plasticity high score
Sub- polymer；The plastic macromolecule polymer is acrylonitrile copolymer.
The ball material of the expander 11 is hydrocarbon；The gasification temperature of the hydrocarbon is 80~150
℃.The hydrocarbon is liquid hydrocarbon, including ethylene, natural gas or propylene etc..
S3, the surface that the first base 101 has the expander 11 in the glass substrate 10 is formed；Mainly by
One polyimide solution is coated on the glass substrate 10, and carries out being heating and curing to form one first base 101 for the first time
Semi-finished product.Wherein, the expander 11 is covered by semi-finished product.
First base 101 with a thickness of 1~10um, the optimal present invention is 5um, or 2um, 4um, 6um or
8um。
The temperature that the first time is heating and curing is 200~300 DEG C；The first time, which is heating and curing, may be implemented described
One base 101 is fully cured, but temperature is also unsuitable excessively high, no more than 101 melting temperature of the first base.
S4, first buffer layer 102 is formed in 101 surface of the first base；102 material of first buffer layer is oxygen
The inorganic material such as SiClx or silicon nitride；The expansive force that the first buffer layer 102 is generated to buffer the expansion of expander 11,
Be also prevented from excessive heat transmit downwards and mitigate up and down different film layers because of thermal stress caused by the temperature difference.
S5, the second base 103 is formed in the first buffer layer 102, mainly by applying the second polyimide solution
It is distributed on the semi-finished product of first base 101.
The fusing point of second base 103 is 400~500 DEG C；First base 101 with a thickness of 1~10um, this
It invents optimal for 5um, or 2um, 4um, 6um or 8um.
The temperature cured again is 200~300 DEG C, and the complete of second base 103 may be implemented in current solidifying
All solidstate, but temperature is also unsuitable excessively high, no more than the melting temperature of first base 101 and second base 103.
The stretching of second base 103 is slightly 200~400Mpa.Optimal tensile strength is 300 MPa, or
250MPa, 280MPa, 350MPa or 380MPa, to bear the folding or bending of flexible display panels 100.
It prepares the polyimide solution concentration of second base 103 and prepares the polyimides of first base 101
Solution concentration is different, and general polyimide solution concentration is big, and tensile strength is big.
The tensile strength of first base 101 is less than the tensile strength of second base 103.This makes by outer
When power removes substrate generation stress, lesser first base 101 of tensile strength is used as sacrificial layer, blocks the transmitting of stress,
And the first buffer layer 102 can absorbed glass substrate 10 again stress, to protect other devices will not be by stress
It is influenced.
S6, second buffer layer 104 is formed in second base 103；The cushioning layer material is silica or nitridation
The inorganic material such as silicon.Function element of the second buffer layer 104 to protect flexible display panels, be also prevented from excessive heat to
Lower transmitting and mitigate up and down different film layers because of thermal stress caused by the temperature difference.
S7, tft layer 105 is formed on the buffer layer；It is more that the tft layer 105 is generally low temperature
Polycrystal silicon film transistor (LTPS-TFT), thin film transistor (TFT) (TFT) or oxide thin film transistor.The tft layer
105, which can be used for flexible display panels 100, is shown.
S8, each functional layer 13 is formed on the tft layer 105；It specifically includes:
Display device structure sheaf 106 is formed on the tft layer 105；The display device structure sheaf 106 is main
It to include anode, hole injection layer, hole transmission layer, luminescent layer electron transfer layer, electron injecting layer and cathode；The anode covers
In the tft layer 105 far from buffer layer side；It is brilliant far from the film that the hole injection layer is overlying on the anode
105 side of body tube layer, the hole transmission layer are overlying on the hole injection layer far from the anode side, and the luminescent layer is overlying on
For the hole transmission layer far from the hole injection layer side, the electron transfer layer is overlying on the luminescent layer far from the hole
Transport layer side, the electron injecting layer are overlying on the electron transfer layer far from the luminescent layer side, and the cathode is overlying on institute
Electron injecting layer is stated far from the electron transfer layer side.
Thin-film encapsulation layer 107 is formed on the display device structure sheaf 106；The preparation side of the thin-film encapsulation layer 107
Method can be chemical vapor deposition method, Atomic layer deposition method or inkjet printing methods, and the present invention is preferably chemical meteorology deposition
Method.Thin-film encapsulation layer 107 primarily serves the effect of exclusion of water and oxygen, can be used for protecting the display device structure sheaf 106
Related device.
S9, as shown in figure 5, heating the glass substrate 10.Especially by glass substrate 10 described in laser irradiation, make ultraviolet
Light is through the glass substrate 10 and irradiates first base 101, and by external force pull first base 101 be allowed to from
It is removed on the glass substrate 10.
When the glass substrate 10 described in the laser light irradiates first base 101,101 surface of the first base is inhaled
Photothermy dissociation is carried out after receiving laser, the temperature on surface reaches 1000 DEG C, and generates heat and internally transmit.
As shown in fig. 6, first base 101 generates thermal dissociation fragment and gas, 11 body of expander after dissociating
Product expansion washes first base 101 open and forms gap 14 with the glass substrate 10.Dissociation causes 101 quilt of the first base
Certain thickness is etched away, and exposes a part of expander 11.
First base 101 has certain thermoplasticity due to absorbing heat by glass side, but can not limit institute
The synchronous expansion for absorbing heat and occurring of expander 11 is stated, the expander is expanded first base 101 and the glass
Glass substrate 10 struts, and the spherical housing 112 after expansion is gradually cooling still to maintain volume after expanding, the sustainable support glass base
Plate 10 forms gap.Again because the spherical housing 112 is not up to melting temperature without bonding glass, after not will cause
Continuous separation of glasses forms pulling force.Due to the presence in gap, Dissociation fragment will not be attached to first base 101 and the glass again
On glass substrate 10, outside air, which can also be directly entered gap, may be not present negative pressure of vacuum influence, so as to improve peeling effect.
The first buffer layer 102 is also prevented from excessive heat with the second buffer layer 104 and transmits downwards, and mitigates up and down
Different film layers are because of thermal stress caused by the temperature difference.
S10, finally the glass substrate 10 removed from first base 101.
The present invention proposes a kind of design of novel double-layer base layer structure, by different stretch intensity but is resistant to processing procedure height
The Liang Zhong base collocation of temperature, low thermal coefficient of expansion.Wherein, adhesive layer and sacrificial layer serve as in low the first base of tensile strength 101,
The second base of high tensile 103 meets normal flexible bending demand.The expander is mixed in first base 101
11, the heat expansion that the first base 101 described in laser irradiation generates is absorbed by the expander 11 and struts the glass substrate
10, improve peeling effect, to improve laser lift-off yield.
It should be pointed out that can also have the embodiment of a variety of transformation and remodeling for the present invention through absolutely proving,
It is not limited to the specific embodiment of above embodiment.Above-described embodiment as just explanation of the invention, rather than to this
The limitation of invention.In short, protection scope of the present invention should include that those are apparent to those skilled in the art
Transformation or substitution and remodeling.
Claims (10)
1. a kind of flexible display panels characterized by comprising
First base；
First buffer layer is overlying in first base；
Second base is overlying in the first buffer layer；
Second buffer layer is overlying in second base；
Tft layer is set on the buffer layer；And
Functional layer is set on the tft layer；
Wherein, first base includes an at least expander, and the expander is set in first base, and when described swollen
After swollen body expansion, the expander protrudes from the surface of first base far from the first buffer layer.
2. flexible display panels according to claim 1, which is characterized in that
The expander is a sphere, including
Spherical inner core, and
Spherical housing coats the spherical inner core；
The diameter of the expander is 1~5um.
3. flexible display panels according to claim 2, which is characterized in that
The material of the spherical housing is plastic macromolecule polymer；
The ball material of the expander is hydrocarbon；
The gasification temperature of the hydrocarbon is 80~150 DEG C.
4. flexible display panels according to claim 3, which is characterized in that
The plastic macromolecule polymer is acrylonitrile copolymer；
The hydrocarbon is liquid hydrocarbon, including ethylene, natural gas or propylene etc..
5. flexible display panels according to claim 1, which is characterized in that
The functional layer includes
Display device structure sheaf is set on the tft layer；And
Thin-film encapsulation layer is set to the display device structure sheaf.
6. a kind of flexible display panels preparation method characterized by comprising
One glass substrate is provided；
Expander is spread in a surface of the glass substrate；
The one side that the first base has the expander in the glass substrate is formed, and the expander is coated on described the
In one base；
First buffer layer is formed in first base
The second base is formed in the first buffer layer；
Second buffer layer is formed in second base；
Tft layer is formed in the second buffer layer；
Each functional layer is formed on the tft layer；
The glass substrate is heated, the expander is expanded；After expander expansion, the expander protrudes from described
Surface of first base far from the first buffer layer, so as to form gap between the glass substrate and first base；
The glass substrate is removed from first base.
7. flexible display panels preparation method according to claim 6, which is characterized in that the expander is a sphere,
Including spherical inner core, and
Spherical housing coats the spherical inner core；
In the heating glass substrate step, by glass substrate described in ultraviolet light, the UV light permeability institute
It states glass substrate and is irradiated to the expander, keep the spherical housing and the spherical inner core heated, the spherical housing
By thermal softening, the spherical inner core expands the spherical housing by thermal evaporation, by first base and the glass substrate
It struts, so as to form gap between the glass substrate and first base.
8. flexible display panels preparation method according to claim 6, which is characterized in that the first base of the formation in
The glass substrate has in the one side step of the expander, including the first polyimide solution is coated on the glass base
On plate, and carry out being heating and curing to form one first base for the first time；
Described first is coated in the first buffer layer step, including by the second polyimide solution forming the second base
On buffer layer, and it is heating and curing to form one second base for the second time；
Wherein, the second polyimide solution concentration is greater than the first polyimide solution concentration.
9. flexible display panels preparation method according to claim 6, which is characterized in that
The heating temperature that the first time is heating and curing is 200~300 DEG C；
The heating temperature being heating and curing for the second time is 200~300 DEG C.
10. flexible display panels preparation method according to claim 8, which is characterized in that heating the glass substrate
Afterwards, the spherical housing of the expander is cooling and maintains the volume after expansion, to support the glass substrate.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110634403A (en) * | 2019-08-29 | 2019-12-31 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and manufacturing method thereof |
| WO2021082065A1 (en) * | 2019-10-31 | 2021-05-06 | 深圳市华星光电半导体显示技术有限公司 | Flexible display device substrate and manufacturing method therefor |
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| US11670639B2 (en) | 2019-10-31 | 2023-06-06 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flexible display substrate and preparation method thereof |
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