CN110070406A - Client chip fast custom method - Google Patents
Client chip fast custom method Download PDFInfo
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- CN110070406A CN110070406A CN201810064584.7A CN201810064584A CN110070406A CN 110070406 A CN110070406 A CN 110070406A CN 201810064584 A CN201810064584 A CN 201810064584A CN 110070406 A CN110070406 A CN 110070406A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q30/00—Commerce
- G06Q30/06—Buying, selling or leasing transactions
- G06Q30/0601—Electronic shopping [e-shopping]
- G06Q30/0621—Item configuration or customization
Abstract
The present invention relates to a kind of client chip fast custom methods comprising step: transmission chip customized demand；Receive an at least alternative；Select an alternative as production decision；Send the production decision.Above-mentioned client chip fast custom method, the mode that chip fast custom produces can be provided from user terminal for various users, so that the realization of personalized chip production demand facilitates just as using APP on mobile phone, on the one hand it can develop a variety of different individual needs for small chip with quick response modern technologies, on the other hand the plenty of time can be saved for user and a large amount of expenses, the tool for dramatically accelerating product show the period.
Description
Technical field
The present invention relates to the customizations of client chip, more particularly to client chip fast custom method.
Background technique
IC (integrated circuit, integrated circuit) is that a kind of microelectronic device or component, the IC of encapsulation are also known as
Chip.Using certain technique, the elements such as transistor, resistance, capacitor and inductance needed for a circuit and wiring are interconnected
Together, it is produced on a fritter or a few fritter semiconductor wafers or dielectric substrate, is then encapsulated in a shell, becoming has
The microstructure of required circuit function；Wherein all elements have formed a whole in structure, make electronic component towards small
Major step has been strided forward in terms of type, low-power consumption, intelligence and high reliability.It uses alphabetical " IC " to indicate in circuit.Integrated electricity
Road inventor is that the Kiel Jack 〃 ratio (integrated circuit based on germanium) and Robert's 〃 noy think (integrated circuit based on silicon).Now
The application of most of semi-conductor industry is the integrated circuit based on silicon.
IC is a kind of semiconductor device to grow up one sixties of later period the 1950s.It is through peroxide
The semiconductor fabrication process such as change, photoetching, diffusion, extension, evaporation of aluminum, semiconductor needed for composition is had the circuit of certain function,
The elements such as resistance, capacitor and the connecting wire between them are fully integrated on a fritter silicon wafer, and then welding is encapsulated in one
Electronic device in shell.Its package casing has the diversified forms such as round shell-type, flat or dual inline type.Integrated circuit technique
Including chip fabrication techniques and designing technique, it is mainly reflected in process equipment, processing technology, packaging and testing are produced in batches and set
In the ability for counting innovation.
China is making greater efforts to promote IC industry development, and still, traditional IC is usually more than one-year age from manufacture is designed into, past
Toward needing 1 to two years, and usually realize that preceding period cost is very high using 14nm or technology below, often beyond 7 digits,
On a wafer according to the design scheme of chip carry out circuit etching with it is integrated, again be cut into a large amount of small chip by encapsulation factory into
Row encapsulation, is tested after the completion of encapsulation, and then flow is produced as a trial, and last flow (passes through series of process as assembly line
Step manufactures chip) large-scale production.
But for chip simple for some structures, such as Internet of Things chip etc., because its structure is simple and function is more
Sample, market demands fast reaction, so traditional production method is not able to satisfy the demand quickly produced, it is intended that from client
End provides a kind of settling mode.
Summary of the invention
Based on this, it is necessary to provide a kind of client chip fast custom method.
A kind of client chip fast custom method comprising step:
Transmission chip customized demand；
Receive an at least alternative；
Select an alternative as production decision；
Send the production decision.
Above-mentioned client chip fast custom method can provide the production of chip fast custom from user terminal for various users
Mode on the one hand can be fast so that the realization of personalized chip production demand facilitates just as using APP on mobile phone
Speed response modern technologies development is for a variety of different individual needs of small chip, when on the other hand can be that user saves a large amount of
Between and a large amount of expenses, the tool for dramatically accelerating product shows the period.
After sending the production decision in one of the embodiments, the client chip fast custom method is also
Comprising steps of obtaining custom chip sample.
After obtaining chip sample in one of the embodiments, the client chip fast custom method further includes
Step: judge whether the custom chip sample meets the chip customized demand.
When judging chip customized demand described in the custom chip samples met in one of the embodiments, the visitor
Family end chip fast custom method further comprises the steps of: the production requirement for sending custom chip.
After the production requirement for sending custom chip in one of the embodiments, the client chip fast custom
Method, which further comprises the steps of:, obtains the custom chip.
There are the chip customized demand of technical solution for transmission in one of the embodiments, and directly with the chip
Technical solution in customized demand is as the production decision.
After receiving an at least alternative in one of the embodiments, and select an alternative as
Before production decision, the client chip fast custom method, which further comprises the steps of:, modifies to an alternative；
Also, select an alternative as production decision, specifically: the modified alternative of selection is made
For production decision.
After sending the production decision in one of the embodiments, the client chip fast custom method is also
Comprising steps of obtaining the verification information of the production decision.
After the verification information for obtaining the production decision in one of the embodiments, the client chip is quick
Method for customizing further comprises the steps of: judge whether the verification information of the production decision is normal, otherwise retransmits the producer
Case.
When judging that the verification information of the production decision is normal in one of the embodiments, described in retransmitting
Production decision.
The chip customized demand includes structure design in one of the embodiments, wherein the structure, which designs, includes
Silicon substrate, structural body, packaging body and several pins, the structural body is between the silicon substrate and the packaging body, often
One end of one pin connects the structural body and the other end is located at except the silicon substrate and the packaging body；Also, institute
Stating structural body includes multiple structures, and the multiple structure is stacked inside the silicon substrate and is divided at least two layers.
Detailed description of the invention
Fig. 1 is the schematic diagram of one embodiment of the invention.
Fig. 2 is the schematic diagram of another embodiment of the present invention.
Fig. 3 is the schematic diagram of another embodiment of the present invention.
Fig. 4 is the schematic diagram of another embodiment of the present invention.
Fig. 5 is the schematic diagram of another embodiment of the present invention.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case where violating intension of the present invention, therefore the present invention is not limited by the specific embodiments disclosed below.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be with
It is directly to another element or may be simultaneously present centering elements.Term as used herein " vertically ", " level
", "left", "right" and similar statement for illustrative purposes only, be not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
As shown in Figure 1, one embodiment of the present of invention is, a kind of client chip fast custom method comprising step:
Transmission chip customized demand；Receive an at least alternative；Select an alternative as production decision；Send the life
Production scheme.Above-mentioned client chip fast custom method can provide the production of chip fast custom from user terminal for various users
Mode on the one hand can be fast so that the realization of personalized chip production demand facilitates just as using APP on mobile phone
Speed response modern technologies development is for a variety of different individual needs of small chip, when on the other hand can be that user saves a large amount of
Between and a large amount of expenses, the tool for dramatically accelerating product shows the period.
Further, the chip customized demand includes target type and Functional Design, wherein the target type is core
The type of the target application of piece, the Functional Design are the objective function of chip.For example, the target type includes that safety is set
Standby, payment devices, communication apparatus, identification equipment, authenticating device, control equipment and/or wearable device etc.；For example, described can
Wearable device includes Intelligent bracelet, intelligent necklace, intelligent necklace and/or intelligent jewelry etc.；For example, the chip is Internet of Things steel wire rack
Piece；For example, the chip includes safety chip, mobile payment chip, communication radio frequency chip, identification chip and/or single
Software function chip etc..For example, the objective function of chip designs according to actual needs, information, output are including but not limited to received
Signal, monitoring blood pressure, monitoring heartbeat, induction gravity, induction movement and/or temperature sensor etc..Further, the chip customization
Demand further includes chip size, chip energy consumption, chip pin (pin) and/or chip package form etc..
The chip customized demand includes structure design in one of the embodiments, wherein the structure, which designs, includes
Silicon substrate, structural body, packaging body and several pins, the structural body is between the silicon substrate and the packaging body, often
One end of one pin connects the structural body and the other end is located at except the silicon substrate and the packaging body；Also, institute
Stating structural body includes multiple structures, and the multiple structure is stacked inside the silicon substrate and is divided at least two layers.For example,
Chip, that is, custom chip are at least two layers of chip, and further, the chip customized demand includes or further includes that structure is set
Meter, further, structure design include silicon substrate, structural body and its number of plies setting of chip, packaging body and several draw
Foot.For example, the chip is the chip of two layers of chip, three layers of chip or more；For example, the structure design includes silicon substrate
Body, structural body, packaging body and several pins, the structural body include multiple structures, and the multiple structure forms three-decker,
I.e. multiple structures are divided into three layers, that is, multiple structures are respectively set and are integrally formed three layers, in this way, three layers of chip can be customized.
Below by taking two layers of chip as an example, it will be understood that the following examples are equally applicable to the chip of three layers of chip or more.Example
Such as, the structure design includes silicon substrate, structural body, packaging body and several pins, and the structural body includes multiple structures, institute
It states multiple structures and forms two-layer structures, i.e., multiple structures are divided into two layers, that is, multiple structures are respectively set and are integrally formed two layers,
In this way, two layers of chip can be customized.For example, groove is offered inside the silicon substrate, the structural body, that is, two-layer structure
It is stacked in the groove inside the silicon substrate；The multiple structure include processor, memory, communication module with
Sensor；The two-layer structure includes first layer structure and the second layer structure for being located at the first layer superstructure；Described
One layer of structure includes the processor and memory being connected；The second layer structure includes communication module and sensor, and described
Communication module and the sensor are connected with the processor respectively；The processor and the memory, the communication mould
Each connection structure of block and the sensor is respectively positioned on inside the silicon substrate；Further, the multiple structure can also wrap
Include other structures, such as timing topology, construction of switch and/or storage structure etc.；For another example, memory is nonvolatile storage or deposits
Reservoir includes nonvolatile storage；For another example, construction of switch is triode or construction of switch includes triode；For another example, storage structure
It include capacitor for capacitor or storage structure；And so on.Further, each connection structure includes the first connection structure, the second company
Binding structure and third connection structure, the processor are connected with the memory by the first connection structure；The processor
It is connected with the communication module by the second connection structure；The processor passes through third connection structure phase with the sensor
Connection.Further, structure design further includes packaging body and several pins, the structural body be located at the silicon substrate and
Between the packaging body；That is, the two-layer structure is between the silicon substrate and the packaging body；The one of each pin
End connects the structural body and the other end is located at except the silicon substrate and the packaging body；A specific example is, described
It include the first pin, second pin, third pin and the 4th pin in several pins, described in one end of first pin connects
Communication module and the other end are located at except the silicon substrate and the packaging body, and one end of the second pin connects the processing
Device and the other end are located at except the silicon substrate and the packaging body, and one end of the third pin connects the sensor and another
One end is located at except the silicon substrate and the packaging body, and one end of the 4th pin connects the memory and other end position
Except the silicon substrate and the packaging body；For example, the first pin, second pin, third pin wrap respectively with the 4th pin
A pin, two pins or more pins are included, pin number is designed according to actual needs, can more fully utilize
Space structure, while may insure that signal transmits, it can also realize certain heat dissipation effect.For example, each pin includes at least
It between vacant or each sub- pin is the silicon substrate between the sub- pin of two mutually insulateds, such as each sub- pin；It is appreciated that
When each pin only has one, which is pin, and when each pin includes several sub- pins, then the sub- pin is
Pin, sub- pin each at this time are 1pin.In each embodiment, it is described it is several include at least three, i.e., several pins are at least three to draw
Foot.In this way, the silicon substrate and the packaging body enclose a packaging area jointly or are encapsulating structure, the structure
Body, each minor structure including the structural body, between the silicon substrate and the packaging body, so that the Internet of Things
Net fast custom chip becomes an entirety, is convenient for manufacture, offering for sale, sale and use.Further, at least two are drawn
One end of foot connects the communication module.And/or one end of at least two pins connects institute in one of the embodiments,
State sensor.For example, one end of at least two pins connects the sensor.And/or in one of the embodiments, at least
One end of two pins connects the processor.For example, one end of at least two pins connects the processor.Further
Ground, the processor, the memory, the communication module and the sensor are arranged in the one side of the silicon substrate；
Alternatively, the processor, the memory, the communication module and the sensor are arranged at the same face of the silicon substrate
On；Alternatively, the processor, the memory, the communication module are separately positioned on the silicon substrate phase with the sensor
Pair two sides on, for example, the same face of the silicon substrate is arranged in the processor, the memory and the communication module
On, the sensor is arranged on the another side of the silicon substrate.Further, the processor passes through gold thread respectively and connects institute
State memory, the communication module and the sensor.Alternatively, the processor passes through respectively described in the connection of metal deposit structure
Memory, the communication module and the sensor.In this manner it is achieved that the processor and the memory, the communication
The connection of module, the sensor, to realize electric signal transmission.Effect is preferably sensed in order to obtain, wherein a reality
It applies in example, the quantity of the sensor is multiple.And/or at least two sensors are adjacent sets in one of the embodiments,
It sets.And/or multiple sensors are located on the same floor in one of the embodiments,.In order to obtain preferable heat dissipation effect,
The client chip fast custom method further includes radiator in one of the embodiments, and the radiator is located at described
Between silicon substrate and the packaging body；And/or the radiator is between the structural body and the packaging body, that is, structure
Body is located at the side of radiator, and packaging body is located at the other side of radiator or silicon substrate and structural body are located at the one of radiator
Side, packaging body are located at the other side of radiator.In order to obtain stronger installation effect, avoids loosening, extend the effective of chip
Service life, for another example, the silicon substrate are provided with several groove structures, and the edge of the radiator is in the groove structure
In, in order to promote chip interior heat-sinking capability, the client chip fast custom method is in institute in one of the embodiments,
State also be respectively set in groove the first radiator structure being in contact with the first layer structure and with the second layer structure phase
Second radiator structure of contact.The design of two layers of radiator structure is conducive to realize from inner space and radiate, is particularly suitable for the present invention
Stacked system design chip.In order to obtain stronger installation effect, avoids loosening, extend the effective of chip and use the longevity
Life, further, the client chip fast custom method are provided with two groups of groove structures, the first heat dissipation in the silicon substrate
Structure is fixed in first group of groove structure and is in contact with the first layer structure, the second radiator structure be fixed on second group it is recessed
It is in contact in slot structure and with the second layer structure.In this way, making the installation of the radiator more firm, it is particularly suitable for answering
It, can be while obtaining preferable heat dissipation effect, it is ensured that the normal service life of product for carry-on equipment.In order to obtain more
Good heat dissipation effect, further, the radiator also have the freedom extended except the silicon substrate and the packaging body
End.Further, the radiator has the multiple free ends extended except the silicon substrate and the packaging body, into
One step, multiple free ends are uniformly distributed setting, for example, the radiator have extend the silicon substrate with it is described
Eight free ends except packaging body, eight free ends are located at respectively at eight vertex positions of an octagon.This
Sample, it can be ensured that chip has good heat dissipation effect；For the small area chip of stack design, since area is small, collection
It is high at degree, heat dissipation problem be it is more serious, using the design of above-mentioned radiator, heat dissipation can be largely overcoming and asked
Topic, reaches good heat dissipation effect.
Further, in the structure design, the groove setting and the processor, the memory, the communication
Each sub- cavity that module and the shape of the sensor match.That is, the shape of each sub- cavity respectively with the place
Reason device, the memory, the communication module, the sensor shape match.Further, the processor, described
Memory, the communication module, the sensor and each connection structure are respectively arranged in each sub- cavity, often
One sub- cavity is used to accommodate the dependency structure to match with its shape, and the dependency structure includes the processor, the storage
Device, the communication module, the sensor and/or each connection structure.Further, each sub- cavity is interconnected and sets
It sets, that is, each sub- cavity is directly connected to or by other sub- cavity indirect communications；It is appreciated that each sub- cavity phase
Intercommunicated setting refers to that the processor, the memory, the communication module, the sensor and each institute is being arranged
Before stating connection structure, each sub- cavity, which is interconnected, to be arranged；Also, the processor, memory, described is being set
After communication module, the sensor and each connection structure, each sub- cavity can be interconnected setting, can also be with
In the state blocked by dependency structure.In this way, the trench interiors structure can be made more to agree with the processor, institute
Memory, the communication module, the sensor and each connection structure are stated, so that the client chip is quick
Method for customizing can have stronger structure, and then ensure the service life of product.Further, the silicon substrate is in its institute
It states and is provided with wall portion at groove, the wall portion has rectangular shape.The wall portion offers logical in one of the embodiments,
Slot.Further, the wall portion offers multiple through slots.For example, each through slot draws a pin or a root is drawn
Foot a, that is, pin or a root pin wear a through slot.Further, a pin or a root pin with
Filling mode wears a through slot.It is appreciated that in each embodiment, the alternative, the technical solution or the life
Production scheme meets the chip customized demand, such as the alternative, the technical solution or the production decision have institute
State the target type, the Functional Design and/or the structure design of chip customized demand.
Wherein, the alternative is alternative technical solution；Further, the alternative includes functional module choosing
It selects, for example, the alternative has multiple optional function modules and its connection type, and/or, the alternative includes.
In this way, user voluntarily can be adjusted or select or modify to the alternative.Further, the alternative is
Technical solution by verifying or by flow of testing or succeed.Further, the alternative further includes in chip
Line and/or radiator structure between the layout of portion's functional module, each functional module etc.；Further, the alternative is also
Three-dimensional connection relationship and/or three-dimensional heat dissipation between three-dimensional space layout, each functional module including chip interior functional module
Structure etc..In this way, the chip of the interior layer stacked of production small area can be designed.
After sending the production decision in one of the embodiments, the client chip fast custom method is also
Comprising steps of obtaining custom chip sample.For example, a kind of client chip fast custom method comprising step: transmission chip
Customized demand；Receive an at least alternative；Select an alternative as production decision；Send the production decision；
Obtain custom chip sample.In this way, user can obtain custom chip sample after sending the production decision.
After obtaining chip sample in one of the embodiments, the client chip fast custom method further includes
Step: judge whether the custom chip sample meets the chip customized demand.For example, a kind of client chip fast custom
Method comprising step: transmission chip customized demand；Receive an at least alternative；Select an alternative as life
Production scheme；Send the production decision；Custom chip sample is obtained, judges whether the custom chip sample meets the chip
Customized demand.In this way, user after obtaining custom chip sample, can be determined by modes such as test custom chip samples
Whether the custom chip sample meets the chip customized demand.
When judging chip customized demand described in the custom chip samples met in one of the embodiments, the visitor
Family end chip fast custom method further comprises the steps of: the production requirement for sending custom chip.For example, as shown in Fig. 2, a kind of client
Hold chip fast custom method comprising step: transmission chip customized demand；Receive an at least alternative；Described in selection one
Alternative is as production decision；Send the production decision；Custom chip sample is obtained, judges that the custom chip sample is
It is no to meet the chip customized demand, it is the production requirement for sending custom chip.In this way, user is judging the custom chip
Described in samples met when chip customized demand, production requirement can be sent, it is desirable that production custom chip.
After the production requirement for sending custom chip in one of the embodiments, the client chip fast custom
Method, which further comprises the steps of:, obtains the custom chip.For example, a kind of client chip fast custom method comprising step: hair
Send chip customized demand；Receive an at least alternative；Select an alternative as production decision；Send the production
Scheme；Custom chip sample is obtained, judges whether the custom chip sample meets the chip customized demand, is then to send to determine
The production requirement of coremaking piece；Obtain the custom chip.In this way, user send custom chip production requirement after, can
The a large amount of custom chip produced is obtained, to realize the streamlined customized production from customized demand to extensive flow
Mode.
There are the chip customized demand of technical solution for transmission in one of the embodiments, and directly with the chip
Technical solution in customized demand is as the production decision.For example, a kind of client chip fast custom method comprising step
Rapid: there are the chip customized demand of technical solution for transmission；Using in the chip customized demand when sending the production decision
Technical solution is as the production decision.For another example, as shown in figure 3, a kind of client chip fast custom method comprising step
Rapid: there are the chip customized demand of technical solution for transmission；Using in the chip customized demand when sending the production decision
Technical solution is as the production decision；Custom chip sample is obtained, judges whether the custom chip sample meets the core
Piece customized demand is the production requirement for sending custom chip；Obtain the custom chip.Other embodiments and so on are i.e.
It can.In this way, no longer needing to receive, select or modify alternative, directly requiring to press when user has had reliable technical solution by oneself
Technical solution is produced, and the instantiated of laboratory technique is particularly suitable for, and greatly improves the existing efficiency of tool, is reduced
Experimental manufacturing cost shortens the trial-production period.
After receiving an at least alternative in one of the embodiments, and select an alternative as
Before production decision, the client chip fast custom method, which further comprises the steps of:, modifies to an alternative；And
And select an alternative as production decision, specifically: select the modified alternative as producer
Case.For example, a kind of client chip fast custom method comprising step: transmission chip customized demand；It is alternative to receive at least one
Scheme；It modifies to an alternative；Select the modified alternative as production decision；Send the life
Production scheme.For another example, a kind of client chip fast custom method comprising step: transmission chip customized demand；Receive at least one
Alternative；It modifies to an alternative；Select the modified alternative as production decision；Send institute
State production decision；Obtain custom chip sample.For another example, a kind of client chip fast custom method comprising step: core is sent
Piece customized demand；Receive an at least alternative；It modifies to an alternative；Select the modified alternative side
Case is as production decision；Send the production decision；Custom chip sample is obtained, judges whether the custom chip sample meets
The chip customized demand.For another example, a kind of client chip fast custom method comprising step: transmission chip customized demand；
Receive an at least alternative；It modifies to an alternative；Select the modified alternative as production
Scheme；Send the production decision；Custom chip sample is obtained, it is fixed to judge whether the custom chip sample meets the chip
Demand processed is the production requirement for sending custom chip.For another example, as shown in figure 4, a kind of client chip fast custom method,
It is comprising steps of transmission chip customized demand；Receive an at least alternative；It modifies to an alternative；Selection
The modified alternative is as production decision；Send the production decision；Custom chip sample is obtained, it is described fixed to judge
Whether chip sample processed meets the chip customized demand, is the production requirement for sending custom chip；Obtain the customization core
Piece.Other embodiments and so on.In this way, user is when being unsatisfied with alternative, it can also be voluntarily to alternative
It modifies, to meet the individual demand of user, to realize the ever-changing of product, prominent distinguished function is set
Meter.
After sending the production decision in one of the embodiments, the client chip fast custom method is also
Comprising steps of obtaining the verification information of the production decision.For example, a kind of client chip fast custom method comprising step
It is rapid: transmission chip customized demand；Receive an at least alternative；It modifies to an alternative；It selects modified
The alternative is as production decision；Send the production decision；Obtain the verification information of the production decision.For another example, one
Kind client chip fast custom method comprising step: transmission chip customized demand；Receive an at least alternative；To one
The alternative is modified；Select the modified alternative as production decision；Send the production decision；It obtains
Take the verification information of the production decision；Obtain custom chip sample.For another example, a kind of client chip fast custom method,
Comprising steps of transmission chip customized demand；Receive an at least alternative；It modifies to an alternative；Selection is repaired
The alternative after changing is as production decision；Send the production decision；Obtain the verification information of the production decision；It obtains
Custom chip sample is taken, judges whether the custom chip sample meets the chip customized demand.For another example, a kind of client core
Piece fast custom method comprising step: transmission chip customized demand；Receive an at least alternative；To an alternative side
Case is modified；Select the modified alternative as production decision；Send the production decision；Obtain the production
The verification information of scheme；Custom chip sample is obtained, judges whether the custom chip sample meets the chip customized demand,
It is the production requirement for sending custom chip.For another example, a kind of client chip fast custom method comprising step: core is sent
Piece customized demand；Receive an at least alternative；It modifies to an alternative；Select the modified alternative side
Case is as production decision；Send the production decision；Obtain the verification information of the production decision；Custom chip sample is obtained,
Judge whether the custom chip sample meets the chip customized demand, is the production requirement for sending custom chip；It obtains
The custom chip.Other embodiments and so on.In such manner, it is possible to after user modifies to alternative, user
The verification information that the production decision can be obtained determines whether production decision is feasible, or at least whether determines production decision
It is theoretically feasible, to give the chance of user one adjustment, avoid wasting time and resource.
After the verification information for obtaining the production decision in one of the embodiments, the client chip is quick
Method for customizing further comprises the steps of: judge whether the verification information of the production decision is normal, otherwise retransmits the producer
Case；For example, judging whether the verification information of the production decision is normal, it is directly to execute subsequent step, otherwise retransmits
The production decision.For example, a kind of client chip fast custom method comprising step: transmission chip customized demand；It receives
An at least alternative；It modifies to an alternative；Select the modified alternative as production decision；
Send the production decision；Obtain the verification information of the production decision；Whether just to judge the verification information of the production decision
Often, the production decision is otherwise retransmitted.For another example, a kind of client chip fast custom method comprising step: core is sent
Piece customized demand；Receive an at least alternative；It modifies to an alternative；Select the modified alternative side
Case is as production decision；Send the production decision；Obtain the verification information of the production decision；Judge the production decision
Whether verification information is normal, otherwise retransmits the production decision；Obtain custom chip sample.For another example, a kind of client core
Piece fast custom method comprising step: transmission chip customized demand；Receive an at least alternative；To an alternative side
Case is modified；Select the modified alternative as production decision；Send the production decision；Obtain the production
The verification information of scheme；Judge whether the verification information of the production decision is normal, otherwise retransmits the production decision；It obtains
Custom chip sample is taken, judges whether the custom chip sample meets the chip customized demand.For another example, a kind of client core
Piece fast custom method comprising step: transmission chip customized demand；Receive an at least alternative；To an alternative side
Case is modified；Select the modified alternative as production decision；Send the production decision；Obtain the production
The verification information of scheme；Judge whether the verification information of the production decision is normal, otherwise retransmits the production decision；It obtains
Custom chip sample is taken, judges whether the custom chip sample meets the chip customized demand, is to send custom chip
Production requirement.For another example, as shown in figure 5, a kind of client chip fast custom method comprising step: transmission chip customization
Demand；Receive an at least alternative；It modifies to an alternative；Select the modified alternative as
Production decision；Send the production decision；Obtain the verification information of the production decision；Judge the verifying letter of the production decision
Whether breath is normal, is directly to execute subsequent step, otherwise retransmits the production decision；Custom chip sample is obtained, is sentenced
Whether the custom chip sample that breaks meets the chip customized demand, is the production requirement for sending custom chip；Obtain institute
State custom chip.Other embodiments and so on.In this way, when user has found the verification information exception of production decision, energy
It is enough voluntarily to adjust or check, it,, can be with if readjusting production without information it is required that produce if confident to oneself
Understand, it is described here to retransmit the production decision, it include adjustment or unregulated production decision, for example, sentencing
Whether the verification information for the production decision of breaking is normal, otherwise retransmits the production decision, specifically: judge the production
Whether the verification information of scheme is normal, is otherwise adjusted to the production decision and retransmits the production decision；For example,
Judge whether the verification information of the production decision normal, be directly to execute subsequent step, otherwise to the production decision into
Row adjusts and retransmits the production decision.
When judging that the verification information of the production decision is normal in one of the embodiments, described in retransmitting
Production decision.For example, a kind of client chip fast custom method comprising step: transmission chip customized demand；It receives at least
One alternative；It modifies to an alternative；Select the modified alternative as production decision；It sends
The production decision；Obtain the verification information of the production decision；Judge whether the verification information of the production decision is normal, is
Then without retransmitting the production decision, the production decision is otherwise retransmitted.For another example, a kind of client chip is quickly fixed
Method processed comprising step: transmission chip customized demand；Receive an at least alternative；One alternative is repaired
Change；Select the modified alternative as production decision；Send the production decision；Obtain testing for the production decision
Demonstrate,prove information；Judge whether the verification information of the production decision is normal, is, without retransmitting the production decision, otherwise weighs
Newly send the production decision；Obtain custom chip sample.For another example, a kind of client chip fast custom method comprising step
It is rapid: transmission chip customized demand；Receive an at least alternative；It modifies to an alternative；It selects modified
The alternative is as production decision；Send the production decision；Obtain the verification information of the production decision；Described in judgement
Whether the verification information of production decision is normal, is, without retransmitting the production decision, otherwise retransmits the production
Scheme；Custom chip sample is obtained, judges whether the custom chip sample meets the chip customized demand.For another example, a kind of
Client chip fast custom method comprising step: transmission chip customized demand；Receive an at least alternative；To an institute
Alternative is stated to modify；Select the modified alternative as production decision；Send the production decision；It obtains
The verification information of the production decision；Judge whether the verification information of the production decision is normal, is, without retransmitting institute
Production decision is stated, the production decision is otherwise retransmitted；Custom chip sample is obtained, whether judges the custom chip sample
Meet the chip customized demand, is the production requirement for sending custom chip.For another example, a kind of client chip fast custom side
Method comprising step: transmission chip customized demand；Receive an at least alternative；It modifies to an alternative；Choosing
The modified alternative is selected as production decision；Send the production decision；Obtain the verifying letter of the production decision
Breath；Judge whether the verification information of the production decision is normal, is, without retransmitting the production decision, otherwise sends out again
Send the production decision；Custom chip sample is obtained, judges whether the custom chip sample meets the chip customized demand,
It is the production requirement for sending custom chip；Obtain the custom chip.Other embodiments and so on.
Further, in each embodiment, after transmission chip customized demand, and before a reception at least alternative,
The client chip fast custom method is further comprised the steps of: into digitlization customization space, selection function module and its space
Connection relationship between position and each functional module.For example, a kind of client chip fast custom method comprising step:
Transmission chip customized demand；Customize space into digitlization, selection function module and its spatial position and each functional module it
Between connection relationship；Receive an at least alternative；Select an alternative as production decision；Send the producer
Case.Other embodiments and so on.In this way, can be mentioned into service side after user provides chip customized demand
Perhaps virtual environment is provided just as three-dimensional building or playing with building blocks in service side for the APP of confession, website, Virtual Space
In APP, website, Virtual Space or virtual environment, it is described fixed to construct under the constraint of building rule with certain freedom degree
Coremaking piece is particularly suitable for some simple structures of design so that the thinking of user is easier to implement, and smaller by being limited
Personalizing chip.
It is further, described to enter digitlization customization space, specifically: according to the chip customized demand into compliance with institute
The digitlization customization space for stating chip customized demand, is customized alternatively, being entered according to the chip customized demand using the chip
Digitlization after demand optimization customizes space.That is, digitlization customization space is not unalterable, according to
The chip customized demand optimizes the digitlization customization space for perhaps customizing or selecting adaptation, in this way, user can be given
Preferably service is provided, so that user more saves worry when carrying out chip design in digitlization customization space, to promote design effect
Rate.
For example, digitlization customization space is according to the target type and the function in the chip customized demand
Design is designed or adjusts, for example, for safety equipment, payment devices, communication apparatus, identification equipment, authenticating device, control
The target types such as equipment and/or wearable device, and receive information, output signal, monitoring blood pressure, monitoring heartbeat, induction weight
The Functional Designs such as power, induction movement and/or temperature sensor, digitlization customization space are different, in this way, can be difference
Chip provide more precisely efficient design space so that user design or selection it is highly efficient, accurate.
Further, described after receiving an at least alternative, and before modifying to an alternative
Client chip fast custom method further comprise the steps of: obtain received each alternative feedback information；For example, described anti-
Feedforward information includes matching degree of each alternative relative to the chip customized demand, and the performance indicator of each alternative is each standby
Select adjustment possibility and/or the expense budget of each alternative etc. of scheme.For example, the matching degree is percent value.For another example,
The matching degree is the schematic diagram at least three directions of system evaluation, for example, the matching degree is the three of system evaluation
Star chart, there are three directions for tool, and three directions include structural stability, chip realizability and heat dissipation performance；For another example, institute
Five star charts that matching degree is system evaluation are stated, there are five directions for tool, and five directions include structural stability, need satisfaction
Degree, Cost evaluating value, chip realizability and heat dissipation performance.Other embodiments and so on.In this way, user can basis
Feedback information selection adjusts the alternative, using as the production decision.
Further, in each embodiment, after transmission chip customized demand, and before a reception at least alternative,
The client chip fast custom method, which further comprises the steps of:, obtains advanced charge information, and according to the advanced charge information
Pay advanced charge；In this way, service side can obtain certain advanced charge before providing alternative, in order to avoid done nothing
Hard, user can also more treasure the chance of client chip fast custom by advanced charge, to facilitate development clothes
The chip fast custom platform of business side, preferably provides service for users, and then achieve the effect that two-win.For another example, it sends
After chip customized demand, and enter before digitlization customization space, the client chip fast custom method further includes
Step: advanced charge information is obtained, and advanced charge is paid according to the advanced charge information.For another example, it is customized into digitlization
After space, and before a reception at least alternative, the client chip fast custom method further comprises the steps of: acquisition
Advanced charge information, and advanced charge is paid according to the advanced charge information.Other embodiments and so on.
Further, in each embodiment, after sending the production decision, the client chip fast custom method is also
Comprising steps of obtaining payment information, and producing cost is paid according to the payment information.In this way, service side determines in user to be needed
When producing chip, by reasonably charging, subsequently into production procedure.For another example, it after sending the production decision, and obtains
Before taking custom chip sample, the client chip fast custom method further comprises the steps of: acquisition payment information, and according to institute
State payment information payment producing cost.Further, in each embodiment, after sending the production requirement of custom chip, the visitor
Family end chip fast custom method further comprises the steps of: acquisition scale flow cost information, and is believed according to the scale flow expense
Breath payment flow expense.In this way, service side user determine need to produce a large amount of chips when, by reasonably charging, then into
Enter mass production process.And it is possible to realize different charges in the different stages, facilitate user trial and trial-production chip, from
And the research and development cost of user is significantly reduced, preceding period cost can reduce by 80% to 95% from 7 digits (often dollar).Such as
The fruit present invention can be promoted and applied widely, it is possible to promote China's IC industry further to develop, especially in small chip
The realization of (chip of simple structure) and its application field is developed by leaps and bounds.
Some embodiments are provided, again below to make more detailed description to the present invention.
For example, a kind of fast custom chip method comprising following steps: user's transmission chip customized demand；It can be
Multiple users send identical or different chip customized demand from different distal ends respectively；Service side receives chip customized demand；
It can be service side while receiving multiple identical or different chip customized demand；Service side judges that the chip customized demand is
It is no to can be achieved, it is to execute subsequent step；For example, then executing subsequent step when judging that the chip customized demand can be realized；
For example, user is then informed when judging that the chip customized demand can not be realized, so that user knows the chip customized demand
It can not realize；Service side provides an at least alternative according to the chip customized demand；User receives an at least alternative；
User selects an alternative as production decision；User sends the production decision；Service side's reception is selected alternative
Scheme is as production decision；Service side exports the production decision.Other embodiments and so on.In such manner, it is possible to pass through
One customization platform of server-side, different customization services is provided for various users, so as to realize a large amount of different chips
Design scheme can produce on a wafer simultaneously, on the one hand can develop the diversification for small chip with quick response technology
Demand, on the other hand can save time and expense, the tool for dramatically accelerating product for these users and show the period.Into
One step, in each embodiment, judge whether the chip customized demand can be realized, comprising: limit according to existing production technology, material
System or history failure experience judge whether the chip customized demand can be realized.Further, judge that the chip customization needs
Seeking Truth is no to be can be achieved to be to execute subsequent step, comprising: judge whether the chip customized demand can be realized, be execute it is subsequent
Otherwise step no longer executes subsequent step；It is to execute subsequent step alternatively, judging whether the chip customized demand can be realized
Suddenly, the not achievable return information of the chip customized demand is otherwise sent；That is, the return information includes the chip customization
The not achievable information of demand；It further, further include the letter for requiring to modify the chip customized demand in the return information
Breath；It further, further include the information for the reason of chip customized demand can not be realized in the return information.In this way, with
Family is when receiving the return information, it is known that unsuccessfully being passed through according to existing production technology or material limitation or history
It tests, the reason of chip customized demand can not be realized, and the direction of modification, facilitates user's use, help to be promoted and use
The exploitation design efficiency at family.
For another example, a kind of fast custom chip method comprising following steps: user's transmission chip customized demand；Service side
Receive chip customized demand；Service side judges whether the chip customized demand can be realized, is to execute subsequent step；Service side
An at least alternative is provided according to the chip customized demand；User receives an at least alternative；Described in user's selection one
Alternative is as production decision；User sends the production decision；Service side receives selected alternative as producer
Case；Service side exports the production decision；Service side produces custom chip sample according to the production decision；User obtains customization
Chip sample.Other embodiments and so on.In this embodiment, what user obtained is custom chip sample.In this way, defeated
Out after the production decision, service side, also referred to as service provider can be directly realized by the role of manufacturer, Huo Zhetong
Manufacturer is crossed, custom chip sample is produced according to the production decision, so that more perfect integrity service is provided for user, so that
User just works closely with service side from exploitation design, so that user and service side's viscosity are bigger, helps to promote clothes
Quality of being engaged in and efficiency.
For another example, a kind of fast custom chip method comprising following steps: user's transmission chip customized demand；Service side
Receive chip customized demand；Service side judges whether the chip customized demand can be realized, is to execute subsequent step；Service side
An at least alternative is provided according to the chip customized demand；User receives an at least alternative；Described in user's selection one
Alternative is as production decision；User sends the production decision；Service side receives selected alternative as producer
Case；Service side exports the production decision；Service side produces custom chip sample according to the production decision；User obtains customization
Chip sample；User judges whether the custom chip sample meets the chip customized demand；User sends custom chip
Production requirement；Service side receives production requirement, produces custom chip according to the production requirement；User obtains the customization core
Piece.Other embodiments and so on.In this embodiment, chip customized demand is treated respectively with production requirement, and user is fixed
It requires to produce again when chip customized demand described in coremaking piece samples met, obtains custom chip.In this way, user confirms the customization
When whether chip sample meets the chip customized demand, the production requirement of custom chip is sent to service side, service side receives
After production requirement, custom chip can be produced according to the production requirement, to facilitate user from being customized to one of production
The work of imperial whole design chip.
For another example, a kind of fast custom chip method comprising following steps: user's transmission chip customized demand；Service side
Receive chip customized demand；Service side judges whether the chip customized demand can be realized, is to execute subsequent step；Service side
An at least alternative is provided according to the chip customized demand；User receives an at least alternative；Described in user's selection one
Alternative is as production decision；User sends the production decision；Service side receives selected alternative as producer
Case；Service side exports the production decision；Service side produces custom chip sample according to the production decision；Service side tests institute
It states whether custom chip sample meets the chip customized demand, is that custom chip is then produced according to the chip customized demand；
User obtains the custom chip.Other embodiments and so on.In this embodiment, chip customized demand includes production
Demand, service side when chip customized demand, directly produce according to the chip customized demand described in custom chip samples met
Custom chip.In this way, service side is when testing chip customized demand described in the custom chip samples met, so that it may according to institute
Chip customized demand production custom chip is stated, can ensure the success rate and validity of custom chip to a certain extent, especially
It is suitble to the instantiated of laboratory technique, and greatly improves the existing efficiency of tool, reduces experimental manufacturing cost, shorten the trial-production period.
For another example, a kind of fast custom chip method comprising following steps: user's transmission chip customized demand；Service side
Receive chip customized demand；Service side judges whether the chip customized demand can be realized, is to execute subsequent step；Service side
An at least alternative is provided according to the chip customized demand；User receives an at least alternative；Described in user's selection one
Alternative is as production decision；User sends the production decision；Service side receives selected alternative as producer
Case；Service side exports the production decision；Service side produces custom chip sample according to the production decision；Service side tests institute
It states whether custom chip sample meets the chip customized demand, is to send conjunction rule notice；User receive close rule notice and
Obtain custom chip sample；User judges whether the custom chip sample meets the chip customized demand；User sends fixed
The production requirement of coremaking piece；Service side receives production requirement, produces custom chip according to the production requirement；Described in user obtains
Custom chip.Other embodiments and so on.In this way, when chip customized demand described in the custom chip samples met,
Service side can further notify user, and user is allowed to realize right to know.
For another example, a kind of fast custom chip method comprising following steps: there are the chips of technical solution to determine for user's transmission
Demand processed, and directly using the technical solution in the chip customized demand as the production decision；Service side receives chip
Customized demand；Service side judges whether the chip customized demand can be realized, is to execute subsequent step；Described in service side's output
Production decision；Service side produces custom chip sample according to the production decision；Service side tests the custom chip sample
It is no to meet the chip customized demand, it is to send conjunction rule notice；User, which receives, closes rule notice and acquisition custom chip sample；
User judges whether the custom chip sample meets the chip customized demand；The production requirement of user's transmission custom chip；
Service side receives production requirement, produces custom chip according to the production requirement；User obtains the custom chip.Other implementations
Example and so on.In this way, for there is the user on certain basis, it can be voluntarily directly with the skill in the chip customized demand
Art scheme is as the production decision, to improve design efficiency.
For another example, a kind of fast custom chip method comprising following steps: user's transmission chip customized demand；Service side
Receive chip customized demand；Service side judges whether the chip customized demand can be realized, is to execute subsequent step；Service side
An at least alternative is provided according to the chip customized demand；User receives an at least alternative；User is described standby to one
Scheme is selected to modify；User selects the modified alternative as production decision；User sends the production decision；
Service side receives selected alternative as production decision；Service side judges whether the alternative is modified, otherwise
Subsequent step is executed, is further to verify modified alternative, and execute subsequent step when being verified；Service side
Export the production decision；Service side produces custom chip sample according to the production decision；Service side tests the customization core
Whether piece sample meets the chip customized demand, is to send conjunction rule notice；User, which receives, closes rule notice and acquisition customization
Chip sample；User judges whether the custom chip sample meets the chip customized demand；User sends custom chip
Production requirement；Service side receives production requirement, produces custom chip according to the production requirement；User obtains the customization core
Piece.Other embodiments and so on.In this way, can be after selected alternative be as production decision, as user couple
It when alternative is unsatisfied with or has new idea, does not need to totally repudiate and restart, it is only necessary to which further verifying is repaired
Alternative after changing, and subsequent step is executed when being verified, to save operating procedure, avoid waste early period
Achievement.
For another example, a kind of client chip fast custom method comprising following steps: user's transmission chip customized demand；
Service side receives chip customized demand；Service side judges whether the chip customized demand can be realized, is to execute subsequent step；
Service side provides an at least alternative according to the chip customized demand；User receives an at least alternative；User is to one
The alternative is modified；User selects the modified alternative as production decision；User sends the life
Production scheme；Service side receives selected alternative as production decision；Service side judges whether the alternative repairs
Change, otherwise execute subsequent step, be, further verify modified alternative, and executes subsequent step when being verified
Suddenly；User obtains the verification information of the production decision；User judges whether the verification information of the production decision is normal, otherwise
Retransmit the production decision；Service side exports the production decision；Service side produces customization core according to the production decision
Piece sample；Service side tests whether the custom chip sample meets the chip customized demand, is to send conjunction rule notice；With
Family, which receives, closes rule notice and acquisition custom chip sample；It is fixed that user judges whether the custom chip sample meets the chip
Demand processed；The production requirement of user's transmission custom chip；Service side receives production requirement, is produced and is customized according to the production requirement
Chip；User obtains the custom chip.Other embodiments and so on.In this way, can make in selected alternative
After production decision, when user has found that the verification information of the production decision is deposited when abnormal, it can remodify and send
The production decision economizes on resources to avoid waste experimental manufacturing cost.
For another example, a kind of client chip fast custom method comprising following steps: user's transmission chip customized demand；
Service side receives chip customized demand；Service side judges whether the chip customized demand can be realized, is to execute subsequent step；
Service side provides an at least alternative according to the chip customized demand；User receives an at least alternative；User's selection
One alternative is as production decision；User sends the production decision；Service side receives selected alternative conduct
Production decision；Service side judges whether the chip customized demand is modified, and otherwise executes subsequent step, is, returns to execution
Judge the whether achievable step of the chip customized demand；Service side exports the production decision；Service side is according to the life
Production scheme produces custom chip sample；Service side tests whether the custom chip sample meets the chip customized demand, is
Then send conjunction rule notice；User, which receives, closes rule notice and acquisition custom chip sample；User judges the custom chip sample
Whether the chip customized demand is met；The production requirement of user's transmission custom chip；Service side receives production requirement, according to institute
State production requirement production custom chip；User obtains the custom chip.Other embodiments and so on.In this way, when using
After family receives selected alternative as production decision, the chance of one more modification and adjustment chip customized demand is kept away
Exempt to make a new start, reduces and flog a dead horse and waste design resource, so that client chip fast custom method more meets use
Family actual needs.
For another example, a kind of client chip fast custom method comprising following steps: user's transmission chip customized demand；
Service side receives chip customized demand；Service side judges whether the chip customized demand can be realized, is to execute subsequent step；
Service side judges the chip customized demand with the presence or absence of technical solution, otherwise executes service side according to the chip customized demand
The step of providing an at least alternative is to verify the technical solution, and service root is directly executed when being verified
The step of exporting the production decision according to the technical solution；Service side provides at least one alternatively according to the chip customized demand
Scheme；User receives an at least alternative；User selects an alternative as production decision；User sends the life
Production scheme；Service side receives selected alternative as production decision；Service side exports the life according to the technical solution
Production scheme；Service side produces custom chip sample according to the production decision；Whether service side tests the custom chip sample
Meet the chip customized demand, is to send conjunction rule notice；User, which receives, closes rule notice and acquisition custom chip sample；With
Family judges whether the custom chip sample meets the chip customized demand；The production requirement of user's transmission custom chip；Clothes
Business side receives production requirement, produces custom chip according to the production requirement；User obtains the custom chip.Other embodiments
And so on, the statement that those skilled in the art has the ability according to the above embodiments is realized in above-described embodiment
Each all possible combination of technical characteristic herein as space is limited, is repeated no more with forming other embodiments of the invention.
It should be noted that other embodiments of the invention further include, the mutually group of the technical characteristic in the various embodiments described above
Close the client chip fast custom method that is formed by, can implement.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of client chip fast custom method, which is characterized in that comprising steps of
Transmission chip customized demand；
Receive an at least alternative；
Select an alternative as production decision；
Send the production decision.
2. client chip fast custom method according to claim 1, which is characterized in that send the production decision it
Afterwards, the client chip fast custom method, which further comprises the steps of:, obtains custom chip sample.
3. client chip fast custom method according to claim 2, which is characterized in that after obtaining chip sample, institute
It states client chip fast custom method and further comprises the steps of: and judge whether the custom chip sample meets the chip customization and need
It asks.
4. client chip fast custom method according to claim 3, which is characterized in that judge the custom chip sample
When meeting the chip customized demand, the client chip fast custom method further comprises the steps of: the life for sending custom chip
Production demand.
5. client chip fast custom method according to claim 4, which is characterized in that the production for sending custom chip needs
After asking, the client chip fast custom method, which further comprises the steps of:, obtains the custom chip.
6. client chip fast custom method according to claim 1, which is characterized in that there are the cores of technical solution for transmission
Piece customized demand, and directly using the technical solution in the chip customized demand as the production decision.
7. client chip fast custom method according to claim 1, which is characterized in that receive an at least alternative it
Afterwards, and select an alternative as production decision before, the client chip fast custom method further include step
It is rapid: to modify to an alternative；
Also, select an alternative as production decision, specifically: select the modified alternative as life
Production scheme.
8. client chip fast custom method according to claim 7, which is characterized in that send the production decision it
Afterwards, the client chip fast custom method further comprises the steps of: the verification information for obtaining the production decision.
9. client chip fast custom method according to claim 8, which is characterized in that obtain testing for the production decision
After demonstrate,proving information, the client chip fast custom method, which further comprises the steps of:, judges that the verification information of the production decision is
It is no normal, otherwise retransmit the production decision.
10. according to claim 1 to client chip fast custom method described in any one of 9, which is characterized in that the chip
Customized demand includes structure design, wherein the structure design includes silicon substrate, structural body, packaging body and several pins, institute
Structural body is stated between the silicon substrate and the packaging body, one end of each pin connects the structural body and another
End is located at except the silicon substrate and the packaging body；Also, the structural body includes multiple structures, the multiple structure stacking
It is arranged inside the silicon substrate and is divided at least two layers.
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