CN110049655A - Heat dissipating method, radiator and terminal - Google Patents
Heat dissipating method, radiator and terminal Download PDFInfo
- Publication number
- CN110049655A CN110049655A CN201810035247.5A CN201810035247A CN110049655A CN 110049655 A CN110049655 A CN 110049655A CN 201810035247 A CN201810035247 A CN 201810035247A CN 110049655 A CN110049655 A CN 110049655A
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- Prior art keywords
- heater
- combinations device
- semiconductor
- semiconductor combinations
- temperature information
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Control Of Resistance Heating (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application proposes a kind of heat dissipating method, radiator and terminal.Heat dissipating method includes: the temperature information for obtaining heater；Temperature information controls semiconductor combinations device when meeting and radiating entry condition and transfers out the heat of heater outward, to promote the radiating rate of heater, so that the heat of heater quickly reduces.
Description
Technical field
The present invention relates to intelligent terminal technical field of heat dissipation, and in particular to a kind of heat dissipating method, a kind of radiator, one kind
Radiator and a kind of terminal.
Background technique
For some heaters (such as: smartwatch, Intelligent bracelet, mobile phone, plate, heating block, radiating block), certainly
The thermal diffusivity of body be not very well, and by its internal structure or its internal structure of matching used equipment limited,
Its heat dissipation performance can not be promoted by way of increasing internal heat dissipation structures, here it is these heater poor radiations
Main cause.Especially when heater is the smart terminal product of small size, performance is easier because its own heat dissipation is too late
When and decline.
Cooling measure used by current smart terminal product is mainly: the shell using the metal of intelligent terminal main body is made
Metal is utilized in mainboard adstante febre by the mainboard of intelligent terminal body interior together with cage connection for radiator structure part
Flash heat transfer conducts heat to shell, heat is outwardly quickly shed by shell, but in shell and human contact,
The thermal diffusivity of contact site will be greatly lowered.
By taking heater is smartwatch or Intelligent bracelet as an example, the small volume of main body, and body interior has more
To completely cut off body interior and body exterior, (while it is outside also to completely cut off internal heat to a certain extent for stringent structurally waterproof design
Transmitting), because main body have the display business that executes, talk business, model of data service etc. ability, execute above-mentioned business (with
And carry out wired charging, wireless charging) when main body calorific value it is larger, and the heat of body interior is only capable of through the outer of main body
Shell outwardly transfers out, and shell is contacted with human skin when wearing heater, can reduce the radiating efficiency of shell, not shed
Heat be gathered in body interior, cause subjectivity property to decline, main body will appear slow in reacting, heat shutoff etc. and ask under serious conditions
Topic.
Summary of the invention
The embodiment of the invention provides a kind of heat dissipating methods, comprising: obtains the temperature information of heater；The temperature information
Semiconductor combinations device is controlled when meeting and radiating entry condition to transfer out the heat of the heater outward.
The embodiment of the invention also provides a kind of radiators, comprising: semiconductor combinations device is set as heater
Heat transfers out outward；And second controller, the semiconductor combinations device are electrically connected with the second controller, described second
Controller is set as obtaining the temperature information of the heater, and controls when the temperature information meets heat dissipation entry condition
The semiconductor combinations device transfers out the heat of the heater outward, carries out heat dissipation drop to the heater to realize
Temperature.
The embodiment of the invention also provides a kind of radiators, comprising: with the semiconductor group of cold and hot end after energization
Clutch part, cold end are set as being in contact with the contact portion of heater, and hot end is arranged except the contact portion；Control described half
The second controller of conductor combination device on-off is electrically connected with the semiconductor combinations device, and the second controller has
With the interface of heater communication.
The embodiment of the invention also provides a kind of terminals, include radiator described in any of the above-described embodiment.
The embodiment of the present invention is compared with the relevant technologies, is had the following beneficial effects:
The technical solution of the embodiment of the present invention obtains the temperature information of heater, meets heat dissipation trip bar in temperature information
When part, control semiconductor combinations device transfers out the heat of heater outward, promotes the radiating rate of heater, so that fever
The heat of body quickly reduces.
Detailed description of the invention
Fig. 1 is the flow chart of one of embodiment one heat dissipating method；
Fig. 2 is the structural block diagram of one of embodiment two radiator；
Fig. 3 is the structural block diagram of another radiator in embodiment two；
Fig. 4 is the structural schematic diagram after one of embodiment three radiator and heater assembling；
Fig. 5 is the structural representation circuit diagram after the semiconductor combinations device in Fig. 4 is electrically connected with second controller.
Specific embodiment
To keep goal of the invention of the invention, technical scheme and beneficial effects more clear, with reference to the accompanying drawing to this
The embodiment of invention is illustrated, it should be noted that in the absence of conflict, in the embodiment and embodiment in the application
Feature can mutual any combination.
Embodiment one
The embodiment of the invention provides a kind of heat dissipating methods, as shown in Figure 1, comprising: obtain the temperature information of heater；Institute
Temperature information control semiconductor combinations device when meeting heat dissipation entry condition is stated to transfer out the heat of the heater outward.
Wherein, the heater can be smartwatch main body, the main body of Intelligent bracelet, mobile phone, plate, heating block,
Radiating block etc..
The embodiment acquires the temperature information of heater, when temperature information meets heat dissipation entry condition, control half
Conductor combination device transfers out the heat of heater outward, to promote the radiating rate of heater, so that the heat of heater
Quickly reduce.When heater is intelligent terminal, because its heat loss is fast, temperature is low, additionally it is possible to ensure intelligent terminal main body
Performance prevents intelligent terminal main body from the problem of slow in reacting, heat shutoff etc. occur.
First specific implementation of the present embodiment are as follows: the temperature information is temperature value, the heat dissipation entry condition
It is not less than preset temperature threshold for the temperature value.Temperature value can be the temperature value of the shell of heater, be also possible to generate heat
Its internal temperature value (heater of such mode is intelligent terminal main body) of body transmission, by comparing temperature value and default temperature
Degree threshold value is powered or powers off to control semiconductor combinations device.That is: judging result is that temperature value is not less than preset temperature threshold,
Meet heat dissipation entry condition, control semiconductor combinations device energization quickly transfers out the heat of heater, to realize to hair
Hot body carries out fast cooling.
Second specific implementation of the present embodiment are as follows: the temperature information is the state of heater, and the heat dissipation is opened
Dynamic condition is that the state is identical as preset state.If the state of heater includes solid-state and liquid, preset state is liquid, is led to
It crosses and judges whether the state of heater and preset state are identical, is powered or powers off to control semiconductor combinations device.Such as obtaining
Heater state be liquid when, control semiconductor combinations device be powered, with realize to heater carry out fast cooling.
The third specific implementation of the present embodiment are as follows: the temperature information is pulse signal (that is: " 1 " or " 0 "), institute
Stating heat dissipation entry condition is the pulse signal for controlling the semiconductor combinations break-over of device, and heater detects its internal temperature letter
Breath, corresponding pulse signal is generated according to the temperature information, control semiconductor combinations device according to the pulse signal and be powered or
Power-off.Semiconductor combinations device is controlled if pulse signal is " 1 " to be powered, and controls semiconductor combinations if pulse signal is " 0 "
Device power-off, no longer needing to specially to be arranged contrast module, (such mode heater can be intelligent terminal main body, intelligent terminal main body
It can be used as the power supply of semiconductor combinations device, certain semiconductor combinations device can also be independently matched with power supply).
The purpose of the application can be achieved in three of the above implementation, objective without departing from design philosophy of the invention,
This is repeated no more, in the protection scope that should belong to the application.
Optionally, the heater is intelligent terminal main body；Obtain the temperature information of the heater are as follows: pass through wired biography
Defeated mode or wireless transmission method obtain temperature information from the first control module of the intelligent terminal body interior, and described first
Control module also passes through wire transmission mode and powers to the semiconductor combinations device.
Wherein, wire transmission mode realizes that wireless transmission method is such as connect by WiFi such as by way of USB interface
The mode of mouth, blue tooth interface, ZigBee interface etc. is realized.
Optionally, the semiconductor combinations device is the semiconductor combinations device with cold and hot end after direct current conducting；
It includes: the control semiconductor combinations device that the control semiconductor combinations device transfers out the heat of the heater outward
Direct current conducting, so that the cold end of the semiconductor combinations device absorbs the heat of the heater, cools down to heater,
The hot end outwardly heat release of the semiconductor combinations device, is quickly transferred to the external world for the heat in hot end, so realizes continuous
Cool down to heater.
Embodiment two
The embodiment of the invention provides a kind of radiators, as shown in Figure 2, comprising: semiconductor combinations device, be set as by
The heat of heater transfers out outward；And second controller, the semiconductor combinations device are electrically connected with the second controller,
The second controller is set as obtaining the temperature information of the heater, and meets heat dissipation trip bar in the temperature information
The semiconductor combinations device is controlled when part to transfer out the heat of the heater outward, and the heater is carried out with realizing
Radiating and cooling.
Wherein, the heater can be smartwatch main body, the main body of Intelligent bracelet, mobile phone, plate, heating block,
Radiating block etc..
The embodiment, second controller acquire the temperature information of heater, meet heat dissipation trip bar in temperature information
When part, second controller control semiconductor combinations device transfers out the heat of heater outward, to promote the heat dissipation of heater
Speed, so that the heat of heater quickly reduces.When heater is intelligent terminal, because its heat loss is fast, temperature is low, moreover it is possible to
The performance for enough ensuring intelligent terminal main body prevents the problem of slow in reacting, heat shutoff etc..
First specific implementation of the present embodiment are as follows: the temperature information is temperature value, the heat dissipation entry condition
For the temperature value not less than in the second control module preset temperature threshold, the second controller control is described at this time partly leads
Body assembling device is powered, when the temperature value is less than preset temperature threshold, the second controller control the semiconductor combinations
Device power-off.
Second specific implementation of the present embodiment are as follows: the temperature information is the state of heater, and the heat dissipation is opened
Dynamic condition is that the state is identical as preset state, the second controller controls the semiconductor combinations device and is powered at this time,
When the state and preset state be not identical, the second controller controls the semiconductor combinations device and powers off.
The third specific implementation of the present embodiment are as follows: the temperature information is pulse signal, the second controller
The pulse signal is obtained from the heater, the semiconductor combinations device energization is controlled by the pulse signal or is broken
Electricity, the heat dissipation entry condition are the pulse signal that the control semiconductor combinations device is powered.Pulse signal include " 1 " and
" 0 ", control semiconductor combinations device is powered after second controller receives the pulse signal if pulse signal is " 1 ", such as arteries and veins
Rushing signal is that " 0 " then second controller receives control semiconductor combinations device power-off after the pulse signal, no longer needs to specially set
Setting contrast module, (such mode heater can be intelligent terminal main body, and intelligent terminal main body can be used as semiconductor group
The power supply of clutch part, semiconductor combinations device can also be independently matched with power supply).Being also possible to second controller is semiconductor,
When the temperature of heater reaches set temperature, the semiconductor contacted with heater can be connected, so where semiconductor combinations device
Circuit conducting and realize to heater radiate, when temperature is not up to set temperature, the semiconductor contacted with heater is not led
Logical, the down circuitry where semiconductor combinations device, semiconductor combinations device does not radiate to heater at this time.
Optionally, the heater is intelligent terminal main body, and the intelligent terminal main body is internally provided with the first control
Module；The second controller passes through USB interface, blue tooth interface, WIFI interface or Zigbee interface and the first control mould
Block is communicated, to obtain temperature information, and first control module also passes through USB interface and powers to the second controller,
The second controller controls the semiconductor combinations device according to the temperature information and is powered or powers off.Such as: the interface packet
Include the USB interface for being powered and communicating；Or；The interface includes the USB interface for energization, and the bluetooth for communication
Interface, WIFI interface or Zigbee interface etc.；The purpose of the application can be achieved, objective is thought without departing from design of the invention
Think, details are not described herein, and in the protection scope that should belong to the application, this scheme is not necessarily to that power supply is arranged on second controller,
The volume of radiator can make smaller.
Optionally, the semiconductor combinations device is the semiconductor combinations device with cold and hot end after direct current conducting,
The second controller controls the semiconductor combinations device direct current conducting, so that the cold end of the semiconductor combinations device absorbs
The heat of the heater cools down to the heater, the heat transfer that cold end absorbs to hot end, the semiconductor group
The heat in hot end is quickly transferred to the external world by the outwardly heat release of the hot end of clutch part, is so realized and is continuously cooled down to heater.
Optionally, it as shown in figure 3, the second controller includes: contrast module, is electrically connected with the second control module, if
It is set to and compares the heat dissipation entry condition and the temperature information；With second control module, also with the semiconductor combinations
Device electrical connection is set as receiving the temperature information, and compares to obtain temperature information satisfaction heat dissipation in the contrast module
When entry condition, control the semiconductor combinations device direct current conducting.
Wherein, it may also is that heater identify its internal temperature and with the preset temperature threshold in the first control module into
After row comparison, the comparing result of "Yes" or "No" is obtained, which is transferred to the second control module, contrast module passes through
The comparing result and heat dissipation unlocking condition (only "Yes" or only "No") preset in the second control module are compared,
When comparing result is identical as preset heat dissipation entry condition (such as: being "Yes" or be "No"), the second control module control half
Conductor combination device is powered, and semiconductor combinations device radiates to heater, in comparing result and preset heat dissipation trip bar
When part is not identical, the second control module controls the power-off of semiconductor combinations device, and semiconductor combinations device does not carry out heater scattered
Heat.Radiator made of such mode can be applied to different heaters, can heat radiation device productivity and versatility,
Such as the watchband of smartwatch or as the annulus of Intelligent bracelet.It further include that state monitoring module and comparison are sentenced inside heater
Disconnected module, state monitoring module are used to detect the internal temperature of heater, and comparison judgment module is used to compare the inside of heater
Temperature and preset temperature threshold (preset temperature threshold in the first control module), the first control module are used for the second control mould
Block transmiting contrast structure ("Yes" or "No").
Embodiment three
The embodiment of the invention provides a kind of radiator (shown in Figure 4), comprising: has cold end a and heat after energization
The semiconductor combinations device 1 of b is held, cold end is set as being in contact with the contact portion of heater 2, and hot end is arranged in the contact portion
Except；The second controller 3 for controlling 1 on-off of semiconductor combinations device, is electrically connected (such as with the semiconductor combinations device 1
Shown in Fig. 5), and the second controller 3 has the interface communicated with the heater 2, second controller 3 is by obtaining fever
The temperature information of body 2 is powered or powers off to control semiconductor combinations device 1.It is logical that second controller 3 controls semiconductor combinations device 1
The cold end spontaneous heating body 2 of electricity, semiconductor combinations device 1 absorbs heat, cools down to heater 2, and the heat that cold end absorbs passes
It is handed to hot end, heat thereon is quickly transferred to the external world by the hot end of semiconductor combinations device 1.
Optionally, as shown in figure 5, the semiconductor combinations device 1 includes the multiple semiconductors being connected, multiple described half
Conductor includes at least the N-type semiconductor and P-type semiconductor being connected in series；When 1 direct current of semiconductor combinations device is connected, electric current
By one end that N-type semiconductor flows to P-type semiconductor be cold end, to flow to one end of N-type semiconductor by P-type semiconductor be hot end.
As shown in figure 5, semiconductor includes multiple N shape semiconductors and multiple p-shaped semiconductors, multiple N-type semiconductors and multiple P
Type semiconductor is alternately connected in series.Semiconductor combinations device 1 can also be arranged in parallel or be arranged in series multiple, achievable promotion
The purpose of the heat dissipation performance of heater 2, the radiating rate of heater 2 faster, radiating efficiency it is more preferable.
Optionally, as shown in figure 4, the radiator further include: radiating piece 4, the setting of radiating piece 4 are partly led described
On the hot end of body assembling device 1；Thermal insulator 5, the semiconductor combinations device 1 are arranged in the thermal insulator 5；With decoration 6,
It is arranged on the semiconductor combinations device 1 and the thermal insulator 5, the second controller 3 is arranged in the semiconductor combinations
In the cold end of device 1, to carry out fast cooling to second controller 3 simultaneously, it is ensured that the better performances of second controller 3；It is described
Interface includes the USB interface for being powered and communicating；Or；The interface includes the USB interface for energization, and for communicating
Blue tooth interface, WIFI interface or Zigbee interface；The purpose of the application can be achieved, objective is without departing from design of the invention
Thought, details are not described herein, in the protection scope that should belong to the application.Radiating piece 4 is preferably that aluminium, aluminium alloy or copper etc. are made
Heat-conducting medium so that heat is faster dissipated in outside air, the material of thermal insulator 5 can be plastics, silica gel, rubber,
Leather etc., the material of decoration 6 can be metal, plastics, leather, silica gel or rubber etc..
In a specific embodiment of the invention, the semiconductor combinations device 1 and the thermal insulator 5 elongated
Shape, the second controller 3 are arranged on the first surface of the semiconductor combinations device 1, and the heater 2 is set as and institute
The first surface for stating semiconductor combinations device 1 is in contact, and the another of the semiconductor combinations device 1 is arranged in the thermal insulator 5
On surface, prevents semiconductor combinations device 1 and human contact and scald human body, semiconductor combinations device 1 is arranged in decoration 6
The aesthetics of heat radiation device is used on the exposed surface of the thermal insulator 5 of first surface.The radiator is preferably intelligent hand
The watchband of table or the annulus of Intelligent bracelet.
Optionally, the heater 2 is intelligent terminal main body, the semiconductor combinations device 1 and the second controller 3
It is symmetrically arranged two groups on the length direction of the thermal insulator 5, the adjoining cold end of two semiconductor combinations devices 1
Be connected, two second controllers 3 separately, the heater 2 be set as being mounted on two second controllers 3 it
Between, and the side of two second controllers 3 towards the heaters 2 closes on the heater 2 and is connected to USB interface
On, symmetrically arranged mode can heat radiation device aesthetics.
Moreover, radiator is preferably the watchband or Intelligent bracelet of smartwatch for smartwatch or Intelligent bracelet
Annulus needs sensor sensing human skin, semiconductor combinations when having the functions such as heart rate detection in intelligent terminal main body
On device 1 and thermal insulator 5 can respective sensor open up the structures such as through-hole or the notch of detection, for realizing heart rate detection
Etc. functions.
Example IV
The embodiment of the invention provides a kind of terminals, as shown in figure 4, including the dress that radiates described in any of the above-described embodiment
It sets.
Terminal provided by the invention has all advantages of radiator described in any of the above-described embodiment, herein no longer
It repeats.
Wherein, the terminal is smartwatch, and the radiator is watchband, and the watchband is mounted on the smartwatch
Ontology on.Either, the terminal is Intelligent bracelet, and the radiator is annulus, and the annulus is mounted on the intelligence
On the ontology of bracelet.
The embodiment of the present invention is compared with the relevant technologies, is had the following beneficial effects:
The technical solution of the embodiment of the present invention acquires the temperature information of heater, meets heat dissipation in temperature information and opens
When dynamic condition, control semiconductor combinations device transfers out the heat of heater outward, promotes the radiating rate of heater, so that
The heat of heater quickly reduces.
Although disclosed embodiment is as above, its content is only to facilitate understand technical side of the invention
Case and the embodiment used, are not intended to limit the present invention.Any those skilled in the art to which this invention pertains, not
Under the premise of being detached from disclosed core technology scheme, any modification and change can be made in form and details in implementation
Change, but protection scope defined by the present invention, the range that the appended claims that must still be subject to limits.
Claims (20)
1. a kind of heat dissipating method characterized by comprising
Obtain the temperature information of heater；
The temperature information controls semiconductor combinations device when meeting and radiating entry condition, and the heat of the heater is outside
It transfers out.
2. heat dissipating method according to claim 1, which is characterized in that
The temperature information is temperature value, and the heat dissipation entry condition is that the temperature value is not less than preset temperature threshold；Or
The temperature information is the state of heater, and the heat dissipation entry condition is that the state is identical as preset state；Or
The temperature information is pulse signal, and the heat dissipation entry condition is to control the pulse of the semiconductor combinations break-over of device
Signal.
3. heat dissipating method according to claim 1, which is characterized in that the heater is intelligent terminal main body；Obtain institute
State the temperature information of heater are as follows: by wire transmission mode or wireless transmission method from the of the intelligent terminal body interior
One control module obtains temperature information, and first control module also passes through wire transmission mode to the semiconductor combinations device
Power supply.
4. heat dissipating method according to claim 1, which is characterized in that the semiconductor combinations device is to have after direct current is connected
There is the semiconductor combinations device of cold and hot end；The control includes: the control semiconductor combinations device direct current conducting, so that
The cold end of the semiconductor combinations device absorbs the heat of the heater, and the hot end of the semiconductor combinations device is outwardly put
Heat.
5. a kind of radiator characterized by comprising
Semiconductor combinations device is set as outward transferring out the heat of heater；With
Second controller, the semiconductor combinations device are electrically connected with the second controller, and the second controller is set as
The temperature information of the heater is obtained, and controls the semiconductor group when the temperature information meets heat dissipation entry condition
Clutch part transfers out the heat of the heater outward, carries out radiating and cooling to the heater to realize.
6. radiator according to claim 5, which is characterized in that
The temperature information is temperature value, and the heat dissipation entry condition is that the temperature value is not less than preset temperature threshold, at this time
The second controller controls the semiconductor combinations device and is powered, when the temperature value is less than preset temperature threshold, described the
Two controllers control the semiconductor combinations device power-off；Or
The temperature information is the state of heater, and the heat dissipation entry condition is identical as preset state, at this time for the state
The second controller controls the semiconductor combinations device and is powered, when the state and preset state be not identical, described second
Controller controls the semiconductor combinations device power-off；Or
The temperature information is pulse signal, and the second controller controls the semiconductor group clutch by the pulse signal
Part is powered or power-off, and the heat dissipation entry condition is the pulse signal that the control semiconductor combinations device is powered.
7. radiator according to claim 5, which is characterized in that the heater is intelligent terminal main body, the intelligence
Energy terminal body is internally provided with the first control module；The second controller is connect by USB interface, blue tooth interface, WIFI
Mouth or Zigbee interface and first control module are communicated, to obtain temperature information, and first control module is also logical
It crosses USB interface to power to the second controller, the second controller controls the semiconductor combinations device and is powered or powers off.
8. radiator according to claim 5, which is characterized in that the semiconductor combinations device is to have after direct current is connected
There is the semiconductor combinations device of cold and hot end, the second controller controls the semiconductor combinations device direct current conducting, with
The cold end of the semiconductor combinations device is set to absorb the heat of the heater, the hot end of the semiconductor combinations device is outwardly
Heat release.
9. radiator according to claim 7 or 8, which is characterized in that the second controller includes:
Contrast module is electrically connected with the second control module, is set as comparing the heat dissipation entry condition and the temperature information；With
Second control module is also electrically connected with the semiconductor combinations device, is set as receiving the temperature information, and
The contrast module compare to obtain temperature information meet heat dissipation entry condition when, the control semiconductor combinations device direct current leads
It is logical.
10. a kind of radiator characterized by comprising
There is the semiconductor combinations device of cold and hot end after energization, cold end is set as being in contact with the contact portion of heater,
Hot end is arranged except the contact portion；
The second controller for controlling the semiconductor combinations device on-off is electrically connected with the semiconductor combinations device, and described
Second controller has the interface communicated with the heater.
11. radiator according to claim 10, which is characterized in that the semiconductor combinations device includes being connected
Multiple semiconductors, multiple semiconductors include at least the N-type semiconductor and P-type semiconductor being connected in series；
Wherein, when the semiconductor combinations device direct current is connected, electric current is cold by one end that N-type semiconductor flows to P-type semiconductor
End, one end that N-type semiconductor is flowed to by P-type semiconductor are hot end.
12. radiator described in 0 or 11 according to claim 1, which is characterized in that further include:
Radiating piece, the radiating piece are arranged on the hot end of the semiconductor combinations device.
13. radiator described in 0 or 11 according to claim 1, which is characterized in that further include
Thermal insulator, the semiconductor combinations device are arranged in the thermal insulator.
14. radiator described in 0 or 11 according to claim 1, which is characterized in that further include
Decoration is arranged on the semiconductor combinations device.
15. radiator described in 0 or 11 according to claim 1, which is characterized in that
The second controller is arranged in the cold end of the semiconductor combinations device；
The interface includes the USB interface for being powered and communicating, or, the interface includes the USB interface for energization, and
For the blue tooth interface of communication, WIFI interface or Zigbee interface.
16. radiator according to claim 13, which is characterized in that the semiconductor combinations device and the thermal insulator
Elongated sheet, the second controller are arranged on the first surface of the semiconductor combinations device, the heater
It is set as being in contact with the first surface of the semiconductor combinations device, the thermal insulator is arranged in the semiconductor combinations device
Another surface on.
17. radiator according to claim 16, which is characterized in that the heater is intelligent terminal main body, described
Semiconductor combinations device and the second controller are two institutes symmetrically arranged two groups on the length direction of the thermal insulator
It states the adjoining cold end of semiconductor combinations device to be connected, separately, the heater is set as two second controllers
Be mounted between two second controllers, and the side of two second controllers towards the heaters close on it is described
Heater.
18. a kind of terminal, which is characterized in that including just like radiator described in any one of claim 10 to 17.
19. terminal according to claim 18, which is characterized in that the radiator is watchband.
20. terminal according to claim 18, which is characterized in that the terminal is smartwatch or Intelligent bracelet.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810035247.5A CN110049655A (en) | 2018-01-15 | 2018-01-15 | Heat dissipating method, radiator and terminal |
| PCT/CN2018/114698 WO2019137085A1 (en) | 2018-01-15 | 2018-11-09 | Heat dissipation method, heat dissipation apparatus and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810035247.5A CN110049655A (en) | 2018-01-15 | 2018-01-15 | Heat dissipating method, radiator and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110049655A true CN110049655A (en) | 2019-07-23 |
Family
ID=67219304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810035247.5A Pending CN110049655A (en) | 2018-01-15 | 2018-01-15 | Heat dissipating method, radiator and terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110049655A (en) |
| WO (1) | WO2019137085A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112954966A (en) * | 2021-02-01 | 2021-06-11 | 读书郎教育科技有限公司 | External heat dissipation equipment of intelligence wrist-watch |
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| CN106292773A (en) * | 2016-08-19 | 2017-01-04 | 青岛海信移动通信技术股份有限公司 | Temperature adjustment device and method for regulating temperature |
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| WO2019137085A1 (en) | 2019-07-18 |
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