CN110049419A - Silicon microphone - Google Patents
Silicon microphone Download PDFInfo
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- CN110049419A CN110049419A CN201910293041.7A CN201910293041A CN110049419A CN 110049419 A CN110049419 A CN 110049419A CN 201910293041 A CN201910293041 A CN 201910293041A CN 110049419 A CN110049419 A CN 110049419A
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- barrier plate
- silicon microphone
- main aperture
- gap
- fixed station
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 74
- 239000010703 silicon Substances 0.000 title claims abstract description 74
- 230000004888 barrier function Effects 0.000 claims abstract description 75
- 230000003447 ipsilateral effect Effects 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 230000035939 shock Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 210000001364 upper extremity Anatomy 0.000 description 3
- 206010064024 Intestinal malrotation Diseases 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The present invention provides a kind of silicon microphone, it includes a sound hole, barrier plate, barrier plate and circuit board or shell are arranged in the sound hole has difference in height, forms an airflow clearance using the difference in height, the circulating direction into the air-flow of sound hole can be changed, for example, longitudinal air flow is changed to crossflow, to avoid the vibrating diaphragm of the direct shock transducer of external air flow, and the barrier plate can also play barrier effect to external foreign matter, improve product reliability.
Description
Technical field
The present invention relates to acoustics and encapsulation field more particularly to a kind of silicon microphones.
Background technique
MEMS (Micro-Electro-Mechanical System, MEMS) technology is high speed development in recent years
A new and high technology, it uses advanced semiconductor fabrication process, realize the batch micro operations of sensor, the devices such as driver,
Compared with corresponding traditional devices, MEMS device is in volume, power consumption, weight and in price has a fairly obvious advantage.City
On field, the main application example of MEMS device includes pressure sensor, accelerometer and silicon microphone etc..
Silicon microphone is also known as MEMS microphone, is the microphone based on MEMS technology manufacture.Since it is in miniaturization, property
There is suitable advantage with ECM ratio in energy, reliability, environmental resistance, cost and volume production ability, captures mobile phone, PDA, MP3 rapidly
And the consumption electronic product markets such as hearing aid.
Circuit board composition of the silicon microphone by MEMS sensor, asic chip, sound chamber and with RF suppression circuit.MEMS is passed
Sensor is the button capacitor being made of silicon vibrating diaphragm and silicon back pole plate, can convert sound pressure variations to capacitance variations, then
It is converted into electric signal by asic chip drop capacitance variations, realizes " sound -- sound " conversion.
The shortcomings that existing silicon microphone, is that external air flow is directly entered sound chamber without stopping, and easily causes to sensor
Impact；And external foreign matter is easy to enter inside the silicon microphone from sound hole, and the spacing of silicon vibrating diaphragm and silicon back pole plate is smaller,
It is very sensitive to small foreign particles.This be also it is current restrict silicon microphone packaging and lead to that silicon microphone fails it is main because
Element.
Currently, the general method for avoiding foreign matter from entering in silicon microphone is:
1, it reduces sound hole size, increase sound hole quantity, enter inside silicon microphone to avoid foreign matter from sound hole.It should
The shortcomings that kind of method, is that inner cavity is still perpendicular in acoustic aperture channel and air-flow, for sound hole foreign matter without any blocking effect.
2, Air Filter is pasted on the outside of the sound hole of circuit board, entered inside silicon microphone to avoid foreign matter from sound hole.It should
The shortcomings that kind method, is, increases the thickness of sound hole on the outside of circuit board, for bottom into the product of sound, influences in client
The attachment of product.
3, Air Filter is pasted on the inside of the sound hole of circuit board, entered inside silicon microphone to avoid foreign matter from sound hole.It should
The shortcomings that kind method, is, because of material tolerances, placement accuracy is difficult to control, and there are a certain proportion of patches partially, malrotation, leads
It causes to generate leakage problem when subsequent attachment MEMS sensor.
4, Air Filter is pasted on the inside of the sound hole of shell, entered inside silicon microphone to avoid foreign matter from sound hole.This kind
The shortcomings that method, is, because of material tolerances, placement accuracy is difficult to control, and there are a certain proportion of inclined, malrotation of patch etc. to lack
It falls into.
Wherein, Air Filter is mounted using automatic placement machine mostly at present, and dust-proof thickness of net is too thin, easily leads to absorption and loses
It loses；If Air Filter thickeies, it is obstructed into volume；And clast lousiness, the excessive glue etc. that Air Filter itself generates also can be to products
It can cause different degrees of influence.
Therefore, a kind of silicon microphone is needed, impact of the external air flow to sensor can be reduced, and can be avoided the external world
Foreign matter enters inside silicon microphone.
Summary of the invention
The technical problem to be solved by the invention is to provide a kind of silicon microphones, can reduce external air flow to sensing
The impact of device, and can be avoided external foreign matter and enter inside silicon microphone.
To solve the above-mentioned problems, the present invention provides a kind of silicon microphones, including a sound hole, are arranged in a component
On, the sound hole includes: a main aperture, runs through the component；One barrier plate is arranged in the main aperture, and the barrier plate
Side wall and the main aperture side wall between have one first gap；One fixed station is provided projectingly on the side wall of the main aperture,
The fixed station surround the side wall one week and surrounds an opening, on the axis direction of the main aperture, the barrier plate and institute
It states fixed station to be set in sequence, the area in barrier plate orthographic projection region is greater than the area in the opening orthographic projection region, and institute
State opening orthographic projection region described in barrier plate orthographic projection region overlay；Multiple spaced connecting columns, the two of the connecting column
End is separately connected the fixed station and the barrier plate, to be formed between one second between the fixed station and the barrier plate
Gap；First gap, second gap and the open communication, to form airflow channel, external air-flow can be along institute
It states airflow channel to enter in the silicon microphone, the air-flow circulates along a first direction in first gap, described
The air-flow circulates along a second direction in second gap, and the first direction and the second direction have one to be less than 180 degree
Angle.
In one embodiment, the axle center in the axle center of the main aperture, the axle center of the barrier plate and the opening is overlapped.
In one embodiment, the lower part of the main aperture is arranged in the fixed station, and the barrier plate is arranged in the main aperture
Top.
In one embodiment, the top of the main aperture is arranged in the fixed station, and the barrier plate is arranged in the main aperture
Lower part.
In one embodiment, the barrier plate is flat away from a surface of the fixed station and the ipsilateral edge of the main aperture
Together, or the edge ipsilateral lower than the main aperture.
In one embodiment, the height in second gap is less than 100 microns.
In one embodiment, multiple connecting column equidistant interval settings.
In one embodiment, the angle is 90 degree.
In one embodiment, the silicon microphone further includes a circuit board and a sensor, the sensor and the electricity
Road plate forms a sound chamber, and the sound hole is arranged on the circuit board, and corresponding with the sound chamber, and the main aperture is through described
Circuit board.
In one embodiment, the silicon microphone further includes a shell and a sensor, and the sensor is arranged described
In shell, form a sound chamber between the sensor and the shell, the sound hole setting on the housing, and with it is described
Sound chamber is corresponding, and the main aperture runs through the shell.
It is an advantage of the current invention that barrier plate is arranged in the sound hole, barrier plate has with circuit board or shell
Difference in height forms an airflow clearance using the difference in height, can change the circulating direction into the air-flow of sound hole, for example, will
Longitudinal air flow is changed to crossflow, to avoid the vibrating diaphragm of the direct shock transducer of external air flow, and the barrier plate can also
Barrier effect is played to external foreign matter, improves product reliability.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the first embodiment of silicon microphone of the present invention；
Fig. 2 is the enlarged diagram at the sound hole of the first embodiment of silicon microphone of the present invention；
Fig. 3 is the stereoscopic schematic diagram that the connecting column is connect with the barrier plate；
Fig. 4 is the enlarged diagram at the sound hole of the second embodiment of silicon microphone of the present invention；
Fig. 5 is the structural schematic diagram of the 3rd embodiment of silicon microphone of the present invention；
Fig. 6 is the enlarged diagram at the sound hole of the 3rd embodiment of silicon microphone of the present invention
Fig. 7 is the enlarged diagram at the sound hole of the fourth embodiment of silicon microphone of the present invention.
Specific embodiment
It elaborates with reference to the accompanying drawing to the specific embodiment of silicon microphone provided by the invention.
Fig. 1 is the structural schematic diagram of the first embodiment of silicon microphone of the present invention.
Referring to Fig. 1, silicon microphone of the present invention includes a sound hole 1, a circuit board 2, a sensor 3, an asic chip 4
An and shell 5.The sound hole 1 is arranged on a component, and the component is circuit board 2 or shell 5.The sensor 3 is set
It sets on the circuit board 2, and forms one first sound chamber 6 between the sensor 3 and the circuit board 2.The asic chip 4
It is arranged on the circuit board 2.The asic chip 4 is electrically connected with the circuit board 2 and the sensor 3, sound-electric to carry out
The transmission of signal.The shell 5 covers the circuit board 2, and forms one between the circuit board 2 and the shell 5 and accommodate
Chamber.The sensor 3 and the asic chip 4 are located in the accommodating chamber, and shape between the sensor 3 and the shell 5
At one second sound chamber 7.Wherein, the substrate of the circuit board 2 includes but is not limited to FR4, ceramic substrate, the substrate of the shell 5
Including but not limited to metal, macromolecule, FR4 material.The circuit board 2, the sensor 3, the asic chip 4 and described outer
Shell 5 is this field conventional structure, and the sound transfer principle of silicon microphone is also principle well known to those skilled in the art, no longer
It repeats.
In the present embodiment, the sound hole 1 is arranged on the circuit board 2, and corresponding with the first sound chamber 6.Tool
Body says that extraneous air-flow enters the first sound chamber 6 by the sound hole 1, to be perceived by the sensor 3.
Fig. 2 is the enlarged diagram at the sound hole 1 of the first embodiment of silicon microphone of the present invention.
Fig. 1 and Fig. 2 is please referred to, the sound hole 1 includes a main aperture 10, a barrier plate 11, a fixed station 12 and multiple companies
Connect column 14.
The main aperture 10 runs through the circuit board 2 along a first direction.In the present embodiment, the first direction is the side Y
To.
The barrier plate 11 is arranged in the main aperture 10.It wherein, in the present embodiment, can be by the way that the barrier plate be arranged
11 diameter is less than the diameter of the main aperture 10, and the barrier plate 11 is arranged in the main aperture 10.Described
There is one first gap A between the side wall of barrier plate 11 and the side wall of the main aperture 10.The first gap A allows air-flow along institute
State first direction circulation.Specifically, in the present embodiment, the first gap A allows air-flow along the vertical direction (for example, the side Y
To) circulation.
The fixed station 12 is provided projectingly on the side wall of the main aperture 10.Specifically, the fixed station 12 is described in
The side wall of main aperture 10 is prominent towards the axle center of the main aperture 10.Wherein, the fixed station 12 can with 2 one of the circuit board at
Type.The fixed station 12 surround the side wall one week and surrounds an opening 13.
On the axis direction of the main aperture 10, the barrier plate 11 is set gradually with the fixed station 12.Specifically,
In the present embodiment, the top of the main aperture 10 is arranged in the barrier plate 11, and the fixed station 12 is arranged in the main aperture 10
Lower part, the fixed station 12 and the barrier plate 11 are set gradually along Y-direction.
Preferably, the fixed station 12 is concordant with the lower edge of the main aperture 10 away from the surface of the barrier plate 11, will not
Increase the thickness at 2 outside sound hole 1 of circuit board, to avoid influencing the flatness of silicon microphone appearance, and then avoids influencing
Installation of the silicon microphone in client.In other embodiments of the present invention, the fixed station 12 deviates from the table of the barrier plate 11
Face can also be lower than the lower edge of the main aperture 10, i.e., the described fixed station 12 is located at the main aperture away from the surface of the barrier plate 11
Within 10 lower edge.
Preferably, the barrier plate 11 is concordant with the upper limb of the main aperture 10 away from the surface of the fixed station 12, will not
Increase the thickness at 2 inside sound hole 1 of circuit board, so that the barrier plate 11 be avoided to occupy the space of the first sound chamber 6, and then keeps away
Exempting from the barrier plate 11 influences the performance of the first sound chamber 6.In other embodiments of the present invention, the barrier plate 11 deviates from institute
The surface for stating fixed station 12 can also be lower than the upper limb of the main aperture 10, i.e., the described barrier plate 11 deviates from the table of the fixed station 12
Face is located within the upper limb of the main aperture 10.
On the direction in the axle center of the main aperture 10, the area in the 11 orthographic projection region of barrier plate is greater than the opening 13
The area in orthographic projection region, and the 13 orthographic projection regions that are open described in 11 orthographic projection region overlay of the barrier plate.That is,
On the direction in the axle center of the main aperture 10, the barrier plate 11 partly overlaps with the fixed station 12.Specifically, in this implementation
In example, in the Y direction, the area in the 11 orthographic projection region of barrier plate is greater than the area in 13 orthographic projection regions of the opening, and
Be open 13 orthographic projection regions described in the 11 orthographic projection region overlay of barrier plate.It wherein, can be by the way that the barrier plate 11 be arranged
Diameter is greater than the diameter of the opening 13 and makes the area in the 11 orthographic projection region of barrier plate be greater than the opening 13 and just throw
The area in shadow zone domain, and the 13 orthographic projection regions that are open described in 11 orthographic projection region overlay of the barrier plate.
Fig. 3 is the stereoscopic schematic diagram that the connecting column 14 is connect with the barrier plate 11.Fig. 1, Fig. 2 and Fig. 3 are please referred to, it is more
A connecting column 14 is alternatively arranged.Described be alternatively arranged refers to adjacent connecting column 14 and is not connected with have gap between the two.It is excellent
Selection of land, multiple 14 equidistant interval of connecting column settings, to form equally distributed gap.
In the present embodiment, the connecting column 14 extends along Y-direction.In the Y direction, the both ends difference of the connecting column 14
Connect the fixed station 12 and the barrier plate 11.One effect of the connecting column 14 is for the barrier plate 11 to be fixed on
On the fixed station 12, another effect of the connecting column 14 is to be formed between the fixed station 12 and the barrier plate 11
One second gap B.That is, the fixed station 12 is not pasted with the barrier plate 11 due to the presence of the connecting column 14
Dress, but separate and form one second gap B.The second gap B allows the air-flow to circulate along a second direction, wherein institute
Stating first direction and the second direction has an angle for being less than 180 degree.Specifically, in the present embodiment, described first
Direction is Y-direction, and the second direction is X-direction, and the first direction and the angle of the second direction are 90 degree.At other
In embodiment, the angle of the first direction and the second direction may be the angle that other are less than 180 degree, the present invention couple
This is without limiting.In the present embodiment, the second gap B allows the air-flow to flow in the horizontal direction (for example, X-direction)
It is logical.
The first gap A, the second gap B and 13 connection of the opening, to form airflow channel, the silicon Mike
Air-flow outside wind can enter in the silicon microphone along the airflow channel.That is, outside the silicon microphone
Air-flow enters inside the silicon microphone through the first gap A, the second gap B or described opening 12 or the silicon Mike
Air-flow outside wind enters inside the silicon microphone through the opening 13, the second gap B and the first gap A.
In the present embodiment, referring to Fig. 2, air flow direction uses arrows.Air-flow warp outside the silicon microphone
The opening 13, the second gap B and the first gap A enter the first sound chamber 6.Specifically, outer gas stream passes through
The barrier effect after the opening 13 due to the barrier plate 11 is crossed, which changes direction, become crossflow, from described the
Two gap B outflow, then enter the first sound chamber 6 through the first gap A, sensing is directly impacted so as to avoid outer gas stream
Device 3 can buffer to playing compared with air blast, improve the reliability of product.Meanwhile foreign can be also blocked, from
And foreign is avoided to enter in the silicon microphone.
Preferably, in the present embodiment, the height of the second gap B is less than 100 microns, so as to guarantee air-flow just
Often enter silicon microphone and foreign matter be blocked in it is outer.The axle center of the main aperture 10, the axle center of the barrier plate 11 and the opening
13 axle center is overlapped, and then improves the uniformity for entering the air-flow of the silicon microphone.Certainly, in other embodiments of the invention
In, the height of the second gap B can be also configured according to actual needs, and the invention does not limit this.
Fig. 4 is the enlarged diagram at the sound hole of the second embodiment of silicon microphone of the present invention.Referring to Fig. 4, this
The difference of two embodiments and first embodiment is that barrier plate 11 is different from the relative position of fixed station 12.Specifically, at this
In embodiment, in the present embodiment, the lower part of the main aperture 10 is arranged in the barrier plate 11, and the fixed station 12 is arranged in institute
The top of main aperture 10 is stated, the barrier plate 11 and the fixed station 12 are set gradually along Y-direction.
In the present embodiment, referring to Fig. 4, air flow direction uses arrows.Air-flow warp outside the silicon microphone
The first gap A, the second gap B and the opening 13 enter the first sound chamber 6.Specifically, due to barrier plate
11 barrier effect, outer gas stream enters through the first gap A, and the blocking by fixed station 12, so that air-flow change side
To, become crossflow, from the second gap B flow out, then through it is described opening 13 enter the first sound chambers 6, to avoid
Outer gas stream direct shock transducer 3, can buffer to playing compared with air blast, improve the reliability of product.Meanwhile outside
Portion's foreign matter can be also blocked, so that foreign be avoided to enter in the silicon microphone.
Fig. 5 is the structural schematic diagram of the 3rd embodiment of silicon microphone of the present invention, and Fig. 6 is the third of silicon microphone of the present invention
Enlarged diagram at the sound hole of embodiment.Fig. 5 and Fig. 6 is please referred to, the difference of the 3rd embodiment and first embodiment exists
In the setting position of sound hole 1 is different.Specifically, in the present embodiment, the sound hole 1 is arranged on shell 5, and with
The second sound chamber 7 is corresponding, and the main aperture 10 runs through the shell 5.Specifically, extraneous air-flow passes through the sound hole 1
Into the second sound chamber 7, to be perceived by the sensor 3.
In the present embodiment, the structure of the sound hole 1 is identical as the structure of the sound hole of first embodiment, air-flow stream
To being also identical with the first embodiment.Specifically, referring to Fig. 6, air flow direction uses arrows.Outside the silicon microphone
Air-flow enter the second sound chamber 7 through the opening 13, the second gap B and the first gap A.Specifically, outside
Due to the barrier effect of the barrier plate 11 after the opening 13, which changes direction, becomes crossflow portion's air-flow,
It is flowed out from the second gap B, then enters the second sound chamber 7 through the first gap A, it is direct so as to avoid outer gas stream
Shock transducer 3 can buffer to playing compared with air blast, improve the reliability of product.Meanwhile foreign also can be by
Stop, so that foreign be avoided to enter in the silicon microphone.
Fig. 7 is the enlarged diagram at the sound hole of the fourth embodiment of silicon microphone of the present invention.Referring to Fig. 7, this
The difference of four embodiments and 3rd embodiment is that barrier plate 11 is different from the relative position of fixed station 12.Specifically, at this
In embodiment, in the present embodiment, the lower part of the main aperture 10 is arranged in the barrier plate 11, and the fixed station 12 is arranged in institute
The top of main aperture 10 is stated, the barrier plate 11 and the fixed station 12 are set gradually along Y-direction.
In the present embodiment, referring to Fig. 7, air flow direction uses arrows.Air-flow warp outside the silicon microphone
The first gap A, the second gap B and the opening 13 enter the second sound chamber 7.Specifically, due to barrier plate
11 barrier effect, outer gas stream enters through the first gap A, and the blocking by fixed station 12, so that air-flow change side
To, become crossflow, from the second gap B flow out, then through it is described opening 13 enter the second sound chambers 7, to avoid
Outer gas stream direct shock transducer 3, can buffer to playing compared with air blast, improve the reliability of product.Meanwhile outside
Portion's foreign matter can be also blocked, so that foreign be avoided to enter in the silicon microphone.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (10)
1. a kind of silicon microphone, including a sound hole, it is arranged on a component, which is characterized in that the sound hole includes:
One main aperture runs through the component；
One barrier plate is arranged in the main aperture, and has one the between the side wall of the barrier plate and the side wall of the main aperture
One gap；
One fixed station is provided projectingly on the side wall of the main aperture, and the fixed station surround the side wall one week and surrounds one and open
Mouthful, on the axis direction of the main aperture, the barrier plate is set in sequence with the fixed station, barrier plate orthographic projection region
Area be greater than the area in the opening orthographic projection region, and the forward projection region that is open described in the barrier plate orthographic projection region overlay
Domain；
Multiple spaced connecting columns, the both ends of the connecting column are separately connected the fixed station and the barrier plate, with
One second gap is formed between the fixed station and the barrier plate；
First gap, second gap and the open communication, to form airflow channel, external air-flow can be along institute
It states airflow channel to enter in the silicon microphone, the air-flow circulates along a first direction in first gap, described
The air-flow circulates along a second direction in second gap, and the first direction and the second direction have one to be less than 180 degree
Angle.
2. silicon microphone according to claim 1, which is characterized in that the axle center of the main aperture, the barrier plate axle center
And the axle center of the opening is overlapped.
3. silicon microphone according to claim 1, which is characterized in that the lower part of the main aperture is arranged in the fixed station,
The top of the main aperture is arranged in the barrier plate.
4. silicon microphone according to claim 1, which is characterized in that the top of the main aperture is arranged in the fixed station,
The lower part of the main aperture is arranged in the barrier plate.
5. silicon microphone according to claim 1, which is characterized in that the barrier plate deviates from a surface of the fixed station
Edge concordant with the ipsilateral edge of the main aperture or ipsilateral lower than the main aperture.
6. silicon microphone according to claim 1, which is characterized in that the height in second gap is less than 100 microns.
7. silicon microphone according to claim 1, which is characterized in that multiple connecting column equidistant interval settings.
8. silicon microphone according to claim 1, which is characterized in that the angle is 90 degree.
9. silicon microphone described in any one according to claim 1~8, which is characterized in that the silicon microphone further includes one
Circuit board and a sensor, the sensor and the circuit board form a sound chamber, and the component is the circuit board, it is described into
Acoustic aperture is arranged on the circuit board, and corresponding with the sound chamber, and the main aperture runs through the circuit board.
10. silicon microphone described in any one according to claim 1~8, which is characterized in that the silicon microphone further includes one
Shell and a sensor, the sensor are arranged in the shell, and a sound chamber is formed between the sensor and the shell,
The component is the shell, and the sound hole is arranged on the housing, and corresponding with the sound chamber, and the main aperture runs through institute
State shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910293041.7A CN110049419A (en) | 2019-04-12 | 2019-04-12 | Silicon microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910293041.7A CN110049419A (en) | 2019-04-12 | 2019-04-12 | Silicon microphone |
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| Publication Number | Publication Date |
|---|---|
| CN110049419A true CN110049419A (en) | 2019-07-23 |
Family
ID=67276907
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|---|---|---|---|
| CN201910293041.7A Pending CN110049419A (en) | 2019-04-12 | 2019-04-12 | Silicon microphone |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021039888A1 (en) * | 2019-08-30 | 2021-03-04 | Tdk株式会社 | Package substrate for sensor, sensor module including same, and method of manufacturing package substrate for sensor |
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| CN201563214U (en) * | 2009-10-19 | 2010-08-25 | 瑞声声学科技(深圳)有限公司 | microphone |
| CN102395093A (en) * | 2011-10-31 | 2012-03-28 | 歌尔声学股份有限公司 | Silicic miniature microphone |
| CN203407016U (en) * | 2013-08-22 | 2014-01-22 | 歌尔声学股份有限公司 | Micro-electro-mechanic system (MEMS) microphone |
| CN105493519A (en) * | 2014-08-27 | 2016-04-13 | 歌尔声学股份有限公司 | MEMS device with valve mechanism |
| CN204733381U (en) * | 2015-03-31 | 2015-10-28 | 北京卓锐微技术有限公司 | A kind of integrated silicon capacitor microphone |
| CN109196882A (en) * | 2016-04-06 | 2019-01-11 | W.L.戈尔及同仁股份有限公司 | Pressure balance for non-porous sound film constructs |
| CN210202085U (en) * | 2019-04-12 | 2020-03-27 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021039888A1 (en) * | 2019-08-30 | 2021-03-04 | Tdk株式会社 | Package substrate for sensor, sensor module including same, and method of manufacturing package substrate for sensor |
| JP7384205B2 (en) | 2019-08-30 | 2023-11-21 | Tdk株式会社 | A sensor package substrate, a sensor module including the same, and a method for manufacturing a sensor package substrate |
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Inventor after: Mei Jiaxin Inventor after: Zhang Min Inventor before: Tang Xingming Inventor before: Mei Jiaxin Inventor before: Zhang Min |