CN109994642A - Encapsulating structure and preparation method thereof and Organnic electroluminescent device - Google Patents
Encapsulating structure and preparation method thereof and Organnic electroluminescent device Download PDFInfo
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- CN109994642A CN109994642A CN201711476949.9A CN201711476949A CN109994642A CN 109994642 A CN109994642 A CN 109994642A CN 201711476949 A CN201711476949 A CN 201711476949A CN 109994642 A CN109994642 A CN 109994642A
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- 239000002274 desiccant Substances 0.000 claims abstract description 86
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims description 31
- 238000009413 insulation Methods 0.000 claims description 12
- 239000010409 thin film Substances 0.000 claims description 10
- 239000010408 film Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910010272 inorganic material Inorganic materials 0.000 claims description 4
- 239000011147 inorganic material Substances 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 230000001154 acute effect Effects 0.000 claims description 3
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 2
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- 229910052760 oxygen Inorganic materials 0.000 abstract description 24
- 239000001301 oxygen Substances 0.000 abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 16
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to field of display technology, a kind of encapsulating structure and preparation method thereof and Organnic electroluminescent device are disclosed.Wherein, the encapsulating structure includes: the first substrate being oppositely arranged and the second substrate；The body to be packaged being formed between the first substrate and the second substrate；Form the encapsulated layer being covered on the body exposed surface to be packaged on the first substrate and continuously；And it is folded in the desiccant layer between the encapsulated layer and the second substrate, the desiccant layer is the desiccant layer of gel state.The present invention forms the desiccant layer of gel state by solidifying the method for liquid desiccant between encapsulated layer and the second substrate, the thickness of desiccant layer is not required, therefore the water oxygen obstructing capacity of the encapsulating structure on the basis of not increasing the encapsulating structure thickness, can be increased.
Description
Technical field
The present invention relates to field of display technology, and in particular to a kind of encapsulating structure and preparation method thereof and organic electroluminescent
Device.
Background technique
Organnic electroluminescent device (Organic Light-Emitting Display, referred to as OLED) is relative to liquid crystal
Display device has many advantages, such as that self-luminous, reaction is fast, visual angle is wide, brightness is high, color is gorgeous, frivolous, it is considered to be next generation's display
Technology.
The organic material of Organnic electroluminescent device is very sensitive to water oxygen, and micro water oxygen, which will result in display screen, to be had
The deterioration of the oxidation of machine material, crystallization perhaps electrode influences the service life of display screen or directly results in the damage of display screen.
It is general using solid-state drying sheet is attached on case chip in the prior art, realize the purpose of absorption water oxygen.Such as Fig. 1 institute
Show, which includes substrate 10, and OLED device layer 30 and encapsulation cover plate 20 on the substrate 10 is arranged.
By slotting in encapsulation cover plate 20, solid-state drying sheet 50 is attached.For guarantee Organnic electroluminescent device packaging effect, to institute
The thickness of the drying sheet 50 of attaching has certain requirement, i.e., has minimum thickness limitation to the thickness of encapsulation cover plate 20.
However in above-mentioned technical proposal, since the thickness of encapsulation cover plate 20 limits, the thickness of encapsulation cover plate 20 will lead to not
It can be thinned, and then will limit the thickness of the Organnic electroluminescent device, be unfavorable for lightening, the flexibility of product.
Summary of the invention
Technical problem to be solved by the present invention lies in the thickness of Organnic electroluminescent device in the prior art is biggish
Problem does not meet demand of the Vehicles Collected from Market to lightening flexibility luminescent device.
In consideration of it, the present invention provides a kind of encapsulating structure, which includes: the first substrate being oppositely arranged and second
Substrate；Body to be packaged between the first substrate and the second substrate is set；It is formed on the first substrate and continuous
It is covered on the encapsulated layer of the exposed surface of the body to be packaged；And it is folded between the encapsulated layer and the second substrate
Desiccant layer；Wherein the desiccant layer is the desiccant layer of gel state.
Optionally, the viscosity of the desiccant of the gel state in the desiccant layer is 50000-800000mPas.
Optionally, the encapsulating structure further includes the packaging ring around the body edge setting to be packaged, the packaging ring
Setting surrounds airtight cavity, the desiccant layer setting between the first substrate or the encapsulated layer and the second substrate
In the airtight cavity.
Optionally, the desiccant layer is filled up completely the airtight cavity.
Optionally, the encapsulated layer is inorganic material layer；
Optionally, the encapsulated layer includes at least one layer of inorganic thin film layer；
Optionally, each inorganic thin film layer is separately selected from silicon nitride film or silicon oxide film.
Optionally, the encapsulated layer with a thickness of 1 μm to 2 μm.
Meanwhile a kind of preparation method of encapsulating structure is additionally provided in the present invention, which comprises provide the first base
Plate is formed with body to be packaged on the surface of the first substrate；It is formed on the first substrate and continuously covers body to be packaged
The encapsulated layer of exposed surface；Envelope is set around the neighboring of the body to be packaged on the first substrate or the encapsulated layer
Ring is filled, to be formed on the encapsulated layer and optional first substrate using packaging ring as the desiccant filled cavity of side wall；Institute
It states in desiccant filled cavity and is packed into liquid desiccant；The second substrate is pressed, so that the second substrate is to the desiccant
Filled cavity carries out closed, formation airtight cavity；Solidify the liquid desiccant, forms it into gel state desiccant.
Preferably, the gel state desiccant is full of the airtight cavity.
Optionally, the viscosity of the desiccant of the gel state is 50000-800000mPas.
In addition, additionally providing a kind of Organnic electroluminescent device in the present invention, which includes envelope according to the present invention
Assembling structure, the body to be packaged are organic light emitting array layer.
Optionally, the organic light emitting array layer include: first electrode layer and be arranged in the first electrode layer every
It include multiple first electrode items arranged in parallel, the extending direction of the insulated column and institute from column, the first electrode layer
The extending direction for stating the first show electrode is vertical；Wherein the insulated column has along the extending direction of the first electrode item is in
The cross section of reverse trapezoid shape, the acute angle between the side the cross section Zhong Meitiao and first electrode layer are 45 ° -70 °.
It optionally, further include multiple insulation strips in the first electrode layer, the insulation strip and the insulated column one are a pair of
That answers is arranged in the lower section of the insulated column, and the first electrode item is separated by the insulation strip to be prolonged along the first electrode item
Stretch multiple sub- first electrodes of directional spreding.
Technical solution of the present invention has the advantages that
1. encapsulating structure provided in an embodiment of the present invention can be right by forming the encapsulated layer for covering body to be packaged
Body to be packaged forms encapsulation, and encapsulated layer and the second substrate is avoided to be formed by the influence that water oxygen in cavity treats packaging body；In addition,
Method by solidifying liquid desiccant forms intracorporal for obstructing external environment and chamber between encapsulated layer and the second substrate
The desiccant layer of steam and oxygen does not require the thickness of desiccant layer, can not increase the encapsulating structure thickness
On the basis of, increase the water oxygen obstructing capacity of the encapsulating structure.
2. encapsulating structure provided in an embodiment of the present invention, dry using gel state by selecting the desiccant layer of gel state
Certain ductility possessed by agent relatively uniform can be distributed between encapsulated layer and the second substrate, treat each of packaging body
Realize that identical encapsulation degree can be more effective preferably to absorb external environment and the intracorporal steam of chamber and oxygen in orientation
Avoid water oxygen from invading body to be packaged, and structure is simply easy to industrially prepared；Furthermore the desiccant layer of gel state is by external force
Shape can be changed during impact, discharge stress, buffer function is played for body to be packaged, with the technique for simplifying subsequent operation
Difficulty, and improve the impact resistance of corresponding product.
3. encapsulating structure provided in an embodiment of the present invention, under preferable case, by setting packaging ring as side wall, to seal
Airtight cavity is formed between dress layer and the second substrate, without etching confined layer, technique is not only simplified, also helps reduction encapsulation
The thickness of structure, to be adapted to product miniaturization, demand miniaturization.
4. encapsulating structure provided in an embodiment of the present invention, under preferable case, encapsulated layer is at least one layer of inorganic thin film layer, i.e.,
Form encapsulated layer by inorganic material avoids extraneous steam from treating the influence of packaging body for completely cutting off steam and oxygen.
5. the preparation method of Organnic electroluminescent device provided in an embodiment of the present invention, by the way that the closed glue of liquid to be filled in
Closed glue filled cavity, resolidification form gel state or solid closed glue, do not need etching encapsulated layer not only, simplify operating procedure
And operation difficulty relatively uniform can be distributed in closed glue filled cavity moreover, the closed glue of liquid has certain mobility
In；And during liquid closed adhesive curing, with the variation of the closed colloid product of liquid, can more completely it be filled in
Within airtight cavity, to form better closed environment.As it can be seen that this method is conducive to before not increasing the encapsulating structure thickness
It puts, improves its water oxygen isolation capacity, it is easy to accomplish the ultrathin of corresponding Organnic electroluminescent device.
6. Organnic electroluminescent device provided in an embodiment of the present invention, by being formed for covering organic electroluminescence device
The encapsulated layer of layer can form organic electroluminescence device layer and encapsulate, encapsulated layer and the second substrate is avoided to be formed by cavity
Influence of the interior water oxygen to the organic light emitting array layer；In addition, outer for obstructing by being formed between encapsulated layer and the second substrate
The desiccant layer of boundary's environment and chamber intracorporal steam and oxygen does not require the thickness of desiccant layer, can not increase
On the basis of adding the Organnic electroluminescent device thickness, increase the water oxygen obstructing capacity of the Organnic electroluminescent device.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is a structural schematic diagram specifically illustrated of display device in the prior art；
Fig. 2 is a structural schematic diagram specifically illustrated of encapsulating structure in the embodiment of the present invention 1；
A structural schematic diagram specifically illustrated of Organnic electroluminescent device in Fig. 3 embodiment of the present invention 2；
Appended drawing reference:
Fig. 1: 10- substrate；20- encapsulation cover plate；30-OLED device layer；40-UV encapsulation；50- drying sheet；
- Fig. 3: 10- first substrate of Fig. 2；20- the second substrate；30- body to be packaged；40- packaging ring；50- desiccant layer；60-
Encapsulated layer；71- insulation strip；72- insulated column.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " on ", "lower", "vertical", "horizontal", "inner", "outside" etc.
The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of the description present invention and letter
Change description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation construct and
Operation, therefore be not considered as limiting the invention.In addition, term " first ", " second ", " third " are only used for description mesh
, it is not understood to indicate or imply relative importance.
The present invention can be embodied in many different forms, and should not be construed as limited to embodiment set forth herein.
On the contrary, providing these embodiments, so that the disclosure will be thorough and complete, and design of the invention will be fully conveyed to
Those skilled in the art, the present invention will only be defined by the appended claims.In the accompanying drawings, for clarity, the area Ceng He can be exaggerated
The size and relative size in domain.It should be understood that when element such as layer, region or substrate are referred to as " being formed in " or " setting
" another element "upper" or when " stacking ", which can be arranged directly on another element, or there may also be in
Between element.On the contrary, when element is referred to as on " being formed directly into " or " being set up directly on " another element or when " directly stacking ", no
There are intermediary elements.
As long as in addition, the non-structure each other of technical characteristic involved in invention described below different embodiments
It can be combined with each other at conflict.
Embodiment 1
The embodiment of the present invention provides a kind of encapsulating structure, as shown in Fig. 2, including the first substrate 10 that is oppositely arranged and the
Two substrates 20；Body to be packaged 30 between first substrate 10 and the second substrate 20 is set, and is formed in the first substrate
On 10 and continuously it is covered on the encapsulated layer 60 of the exposed surface of the body to be packaged 30；Wherein body 30 to be packaged is formed in institute
It states on first substrate 10, and the body to be packaged 30 forms the exposed surface relative to the outside of the first substrate 10；This
Outside, packaging ring 40, the encapsulation are additionally provided with around 30 neighboring of body to be packaged on first substrate 10 or encapsulated layer 60
The setting of ring 40 surrounds airtight cavity between the first substrate 10 (or encapsulated layer 60) and the second substrate 20.Wherein, it is sealing
Desiccant layer 50 is folded between dress layer 60 and the second substrate 20.The desiccant layer is the desiccant layer of gel state.
By forming the encapsulated layer 60 for covering body 30 to be packaged, packaging body 30 can be treated and form encapsulation, avoid sealing
Dress layer 60 and the second substrate 20 are formed by the influence that water oxygen in cavity treats packaging body 30；In addition, dry by solidification liquid
The method of agent forms the drying for obstructing external environment and chamber intracorporal steam and oxygen between encapsulated layer and the second substrate
Oxidant layer does not require the thickness of desiccant layer, therefore can be on the basis of not increasing the encapsulating structure thickness, and increasing should
The water oxygen obstructing capacity of encapsulating structure.
As shown in Fig. 2, encapsulated layer 60 covers body 30 to be packaged, and extend to 10 surface of first substrate；I.e. encapsulated layer 60 with
First substrate 10 forms airtight cavity, and body 30 to be packaged is arranged in the airtight cavity, and opposite two tables of body to be packaged 30
Face is bonded setting with encapsulated layer 60 or first substrate 10 respectively.In addition, arrow x direction is the length of first substrate 10 in Fig. 2
Direction is spent, arrow y direction is the thickness direction of encapsulated layer 60.
In this embodiment, under preferable case, the viscosity of the gel state desiccant is 50000-800000mPas.Control
The viscosity of desiccant processed is conducive to keep the gel state of desiccant, transformable stereochemical structure is made it have, by external force
Shape can be changed during impact, discharge stress, buffer function is played for body to be packaged, with the technique for simplifying subsequent operation
Difficulty, and improve the impact resistance of corresponding product.
In this embodiment, encapsulated layer 60 is inorganic material layer, may include at least one layer of inorganic thin film layer, such as can
Think the overlaying structure of one layer of electrodeless coating layer or two layers or three layers inorganic thin film layer；Each inorganic thin film layer difference is only
On the spot it is selected from silicon nitride film or silicon oxide film.Encapsulated layer 60 is one layer of inorganic thin film layer in the present embodiment.For example, can be with
For layer of sinxFilm layer or one layer of SiO2Film layer.
In this embodiment, the thickness of encapsulated layer 60 does not have a particular/special requirement, however in order to be adapted to miniaturization, flexibility
Growth requirement, the encapsulated layer 60 with a thickness of 0.5 μm to 3 μm, in the present embodiment, encapsulated layer 60 be one layer of inorganic thin film
Layer, with a thickness of 1 μm.
In this embodiment, packaging ring 40 is to be arranged on first substrate 10 and around the neighboring of body 30 to be packaged；
I.e. packaging ring 40 is the ring structure for surrounding the closure of body 30 to be packaged.Wherein, packaging ring 40 is the glass by laser curing
Slurry (frit), can also be expressed as packaging ring 40 is inorganic encapsulated ring.
As shown in Fig. 2, first substrate 10, encapsulated layer 60, packaging ring 40 and the second substrate 20 form airtight cavity, in institute
Desiccant layer 50 is provided in the airtight cavity of formation.Wherein, which is the desiccant layer of gel state.Preferable case
Under, the desiccant layer 50 of gel state is filled up completely and is uniformly distributed in the airtight cavity, by way of avoiding gap from generating, energy
It is enough dramatically to absorb external environment and the intracorporal steam of the closed chamber and oxygen, it is to be packaged to can be avoided water oxygen intrusion
Body.
The gel state desiccant layer 50 can for Futaba company OleDry F type desiccant or other have barrier
The liquid desiccant material of water oxygen ability is raw material, by being formed by curing, need to only be guaranteed finally formed solidifying in the desiccant layer
The viscosity of the desiccant of colloidal state is 80000-500000mPas.
As a kind of optional embodiment of the present embodiment, encapsulated layer 60 is covered outside body 30 to be packaged, also along first substrate
10 length direction extends, until extending to the edge of first substrate 10.That is, encapsulated layer 60 fits over body 30 to be packaged and edge
Extend to the edge of first substrate 10.At this point, packaging ring 40 is arranged on encapsulated layer 60, with encapsulated layer 60 and the second substrate
20 form airtight cavity, and desiccant layer 50 is provided in the airtight cavity.
As the alternative embodiments of packaging ring 40 in the present embodiment, packaging ring can be organic matter (the cured ring of UV
Oxygen resin) ring.
As the optional embodiment of body 30 to be packaged in the present embodiment, body 30 to be packaged can be organic electroluminescence
Part layer or other structures for needing realization to encapsulate.
Embodiment 2
The embodiment of the present invention provides a kind of Organnic electroluminescent device, is with the difference of embodiment 1, and body 30 to be packaged is
Organic light emitting array layer.
As shown in figure 3, the organic light emitting array layer includes: first electrode layer and insulated column 72, the first electrode layer
Including multiple first electrode items (first electrode layer is anode layer, such as ITO layer in such as figure) arranged in parallel, the isolation
The extending direction of column 72 is vertical with the extending direction of first show electrode；Wherein the insulated column 72 is along the first electrode
There is the cross section in reverse trapezoid shape, between the side the cross section Zhong Meitiao and first electrode layer on the extending direction of item
Acute angle is 45 ° -70 °.This structure is set by insulated column 72 in the present invention to be conducive to play well corresponding second electrode
Compartmentation, and be not easy to collapse, short circuit or adjacent second between corresponding second electrode and first electrode can be effectively prevent
The problem of being electrical connected between electrode.
It further, further include multiple insulation strips 71 in the first electrode layer, the insulation strip 71 and the insulated column
72 are arranged in the lower section of the insulated column 72 correspondingly, and the first electrode item is separated into along described by the insulation strip 71
Multiple sub- first electrodes of first electrode extending direction distribution.It can by the double-layer structure of setting insulation strip 71 and insulated column
More effectively pixel in organic light emitting array layer is separated with pixel, to improve display effect.Wherein insulation strip 71 can be with
It is prepared using polyimide material；Insulated column 72 is using conventional isolation column material preparation.
Further, the first electrode layer is anode layer, the second electrode lay is cathode layer.
It wherein, further include functional layer and the second electricity in organic light emitting array layer other than first electrode layer, insulated column 72
Pole layer, wherein in the first electrode layer include a plurality of parallel arrangement first electrode item, the insulated column 72 be it is multiple, mutually
Parallel setting is in the first electrode layer, and the extending direction phase of the extending direction of insulated column 72 and the first electrode item
Vertically, the functional layer is formed in the first electrode layer and between each insulated column 72, the second electrode lay
It is formed on the functional layer, and between each insulated column 72.Under preferable case, the insulated column 72 is far from first
The surface of electrode layer side, the surface higher than the second electrode lay far from first electrode layer side.
Wherein, functional layer include second electrode be sequentially stacked to first electrode direction optional electron injecting layer, can
It is the electron transfer layer of choosing, optional hole blocking layer, luminescent layer, optional electronic barrier layer, optional hole transmission layer, optional
Hole injection layer.
Encapsulated layer 60 is continuously covered on organic light emitting array layer and (is continuously covered on the table of second electrode and barrier layer
Face) on, under preferable case, desiccant layer 50 is full of the closed cavity between encapsulated layer 60 and the second substrate 20.
In addition, the height of packaging ring 40 be higher than insulated column height, i.e., between first substrate 10 and the second substrate 20 between
Away from the height for depending on packaging ring 40.
In this embodiment, first substrate 10 and the second substrate 20 can be hard substrate, such as glass.First substrate 10
For glass substrate, the second substrate 20 is glass cover-plate.As first substrate 10 and the alternative embodiments of the second substrate 20,
It can be flexible substrate.Polyesters, polyimide compound-material or foil preparation can be used in flexible substrate.
It in this embodiment, can be to organic by forming the encapsulated layer 60 for covering organic electroluminescence device layer
Electroluminescent device layers form encapsulation, avoid encapsulated layer 60 and the second substrate 20 is formed by cavity water oxygen to the organic light emission
The influence of array layer；In addition, being formed between encapsulated layer and the second substrate for obstructing by the method for solidifying liquid desiccant
The gel state desiccant layer of external environment and the intracorporal steam of chamber and oxygen does not require the thickness of desiccant layer, can
Enough on the basis of not increasing the encapsulating structure thickness, increase the water oxygen obstructing capacity of the encapsulating structure.
It should be noted that the insulated column in the present embodiment is not limited to insulated column shown in Fig. 3, or other shapes
Shape only need to guarantee that adjacent Organic Light Emitting Diode can be isolated in insulated column.
The CONSTRUCTED SPECIFICATION for the encapsulating structure not being described in detail in the present embodiment please refers to embodiment 1, no longer superfluous herein
It states.
Embodiment 3
The embodiment of the present invention provides a kind of preparation method of Organnic electroluminescent device, comprising the following steps:
Step S11 prepares organic light emitting array layer on the first substrate, and the structure of organic light emitting array layer is referring to front
Description；
Step S12 forms continuous covering organic light emitting array layer exposed surface (far from described first on the first substrate
The surface of substrate side) encapsulated layer.
The encapsulated layer 60 on the separate first substrate surface of continuous covering organic light emitting array layer is formed, which extends
To 10 surface of first substrate, so that it is formed airtight cavity with first substrate 10, organic light emitting array layer is encapsulated in the closed chamber
In vivo.
Packaging ring is arranged around the neighboring of organic light emitting array layer on encapsulated layer, in the encapsulation in step S13
It is formed on layer using packaging ring as the desiccant filled cavity of side wall.
It is formed by the glass paste of laser curing (frit) around the periphery of organic light emitting array layer on encapsulated layer 60
The packaging ring 40 at edge forms using 60 upper surface of encapsulated layer as bottom surface, is the desiccant filled cavity of side wall with packaging ring 40.
Step S14 is packed into liquid desiccant layer in the desiccant filled cavity.
Liquid desiccant layer is packed into the desiccant filled cavity, coated liquid drier dosage can be after
The volume of the continuous airtight cavity formed calculates, so that liquid drier can be completely filled in institute after expanding in the curing process
State airtight cavity.
In addition, being selected from but unlimited in the coating figure that first substrate 10 or 60 surface of encapsulated layer are formed by liquid desiccant
In " returning " font or serpentine.The coating of the shape can guarantee the case where liquid desiccant layer 50 is filled up completely airtight cavity
Under, the amount of required liquid desiccant is minimum, to achieve the purpose that save the cost.
It optionally, can be according to the surface of organic light emitting array layer when 20 surface of the second substrate coats desiccant layer 50
The coating figure of desiccant layer 50 is arranged in figure, and to guarantee in subsequent pressing step, desiccant layer 50 can be filled up completely
Cavity between the second substrate 20 and organic light emitting array layer.
Step S15, it is closed that pressing the second substrate carries out the second substrate to the desiccant filled cavity, forms closed chamber
Body.
Encapsulation pressing the second substrate 20, so that the second substrate 20 is contacted and fitted closely with 40 top surface of packaging ring, in turn
It is closed to realize that the second substrate 20 carries out the desiccant filled cavity, forms airtight cavity.
Step S16 solidifies the liquid desiccant, forms it into gel state desiccant, and be full of the airtight cavity.
Curing process is carried out to liquid desiccant, by controlling condition of cure, so that liquid desiccant forms gel state and does
Drying prescription, and it is full of the seal cavity.Wherein condition of cure can be selected according to the case where liquid desiccant curing reaction, with control
System is formed by the gel state and volume of desiccant, while being filled up completely the airtight cavity, so that the drying of gel state
The viscosity of agent is within the scope of 50000-800000mPas.For example, when the coating thickness of OleDry F type liquid desiccant is 20
When between to 40 μm, it can be toasted 1 hour at 80 DEG C, so that liquid desiccant reaches perfect filling effect.
The specific device architecture not being described in detail in the present embodiment please refers to embodiment 1 or embodiment 2, herein no longer
It repeats.Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.For
For those of ordinary skill in the art, other various forms of variations or change can also be made on the basis of the above description
It is dynamic.There is no necessity and possibility to exhaust all the enbodiments.And obvious variation extended from this or change
It moves still within the protection scope of the invention.
Claims (10)
1. a kind of encapsulating structure characterized by comprising
The first substrate and the second substrate being oppositely arranged；
Body to be packaged is arranged between the first substrate and the second substrate；
Encapsulated layer forms the exposed surface for being covered on the body to be packaged on the first substrate and continuously；
Desiccant layer is folded between the encapsulated layer and the second substrate, and the desiccant layer is the desiccant of gel state
Layer.
2. encapsulating structure according to claim 1, which is characterized in that the desiccant of the gel state in the desiccant layer
Viscosity is 50000-800000mPas.
3. encapsulating structure according to claim 1 or 2, which is characterized in that the encapsulating structure further include around it is described to
The packaging ring of peripheral edge setting is encapsulated, the packaging ring is arranged in the first substrate or the encapsulated layer and described second
Airtight cavity is surrounded between substrate, the desiccant layer is arranged in the airtight cavity.
4. encapsulating structure according to claim 3, which is characterized in that the desiccant layer is filled up completely the closed chamber
Body.
5. encapsulating structure according to any one of claim 1 to 4, which is characterized in that the encapsulated layer is inorganic material
Layer；Preferably, the encapsulated layer includes at least one layer of inorganic thin film layer；Preferably, each inorganic thin film layer is separately
Selected from silicon nitride film or silicon oxide film.
6. encapsulating structure according to any one of claim 1 to 4, which is characterized in that the encapsulated layer with a thickness of 0.5
μm to 3 μm.
7. a kind of preparation method of encapsulating structure, which is characterized in that the described method includes:
First substrate is provided, is formed with body to be packaged on the surface of the first substrate；
The encapsulated layer for continuously covering body exposed surface to be packaged is formed on the first substrate；
Packaging ring is set around the neighboring of the body to be packaged on the first substrate or the encapsulated layer, described
It is formed on encapsulated layer and optional first substrate using packaging ring as the desiccant filled cavity of side wall；
Liquid desiccant is packed into the desiccant filled cavity；
The second substrate is pressed, so that the second substrate carries out closed, formation airtight cavity to the desiccant filled cavity；
Solidify the liquid desiccant, forms it into gel state desiccant；
Preferably, the gel state desiccant is full of the airtight cavity；
Preferably, the viscosity of the desiccant of the gel state is 50000-800000mPas.
8. a kind of Organnic electroluminescent device, which is characterized in that described device includes described in any one of claims 1 to 6
Encapsulating structure, the body to be packaged are organic light emitting array layer.
9. Organnic electroluminescent device according to claim 8, which is characterized in that the organic light emitting array layer includes:
First electrode layer and the insulated column being arranged in the first electrode layer, the first electrode layer include arranged in parallel more
A first electrode item, the extending direction of the insulated column are vertical with the extending direction of first show electrode；Wherein it is described every
There is along the extending direction of the first electrode item cross section in reverse trapezoid shape, the side the cross section Zhong Meitiao from column
Acute angle between first electrode layer is 45 ° -70 °.
10. Organnic electroluminescent device according to claim 9, which is characterized in that further include in the first electrode layer
The lower section of the insulated column, the insulation strip is arranged in multiple insulation strips, the insulation strip and the insulated column correspondingly
The first electrode item is separated into multiple sub- first electrodes along first electrode extending direction distribution.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711476949.9A CN109994642A (en) | 2017-12-29 | 2017-12-29 | Encapsulating structure and preparation method thereof and Organnic electroluminescent device |
| PCT/CN2018/086070 WO2019128032A1 (en) | 2017-12-29 | 2018-05-08 | Package structure, preparation method thereof and organic electroluminescence device |
| TW107118132A TW201830750A (en) | 2017-12-29 | 2018-05-28 | Package structure, preparation method thereof and organic electroluminescence device capable of increasing water and oxygen barrier capability of the package structure without increasing the thickness of the package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711476949.9A CN109994642A (en) | 2017-12-29 | 2017-12-29 | Encapsulating structure and preparation method thereof and Organnic electroluminescent device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109994642A true CN109994642A (en) | 2019-07-09 |
Family
ID=63960625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711476949.9A Pending CN109994642A (en) | 2017-12-29 | 2017-12-29 | Encapsulating structure and preparation method thereof and Organnic electroluminescent device |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN109994642A (en) |
| TW (1) | TW201830750A (en) |
| WO (1) | WO2019128032A1 (en) |
Cited By (3)
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| CN110993819A (en) * | 2019-12-04 | 2020-04-10 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN111048687A (en) * | 2019-11-20 | 2020-04-21 | Tcl华星光电技术有限公司 | Packaging structure and display device |
| CN111312931A (en) * | 2020-04-08 | 2020-06-19 | Tcl华星光电技术有限公司 | Packaging structure, packaging structure manufacturing method and display panel |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110782799B (en) | 2019-11-21 | 2022-01-04 | 昆山国显光电有限公司 | Display panel and preparation method thereof |
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Also Published As
| Publication number | Publication date |
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| WO2019128032A1 (en) | 2019-07-04 |
| TW201830750A (en) | 2018-08-16 |
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