CN109986779B - Additive manufacturing extrusion device of circuit board, additive manufacturing device using same and using method of additive manufacturing extrusion device - Google Patents
Additive manufacturing extrusion device of circuit board, additive manufacturing device using same and using method of additive manufacturing extrusion device Download PDFInfo
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- CN109986779B CN109986779B CN201910280971.9A CN201910280971A CN109986779B CN 109986779 B CN109986779 B CN 109986779B CN 201910280971 A CN201910280971 A CN 201910280971A CN 109986779 B CN109986779 B CN 109986779B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/118—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
Abstract
The invention provides an additive manufacturing extrusion device of a circuit board, an additive manufacturing device using the same and a using method thereof, wherein the additive manufacturing extrusion device comprises a feeding pipeline and an extrusion head communicated with the feeding pipeline; the feeding pipeline comprises a fused deposition feeding pipeline and a photocuring feeding pipeline which are independent from each other; the extrusion head is provided with a fused deposition extrusion port communicated with the fused deposition feeding pipeline; the extrusion head is also provided with a photocuring extrusion port communicated with the photocuring feeding pipeline. The additive manufacturing extrusion device provided by the invention ensures that the additive processing process of the conductive circuit can be quickly formed according to requirements, and the problem of short circuit is avoided. Meanwhile, the additive manufacturing mode is adopted, and only the patterns of each layer need to be processed and molded, so the processing difficulty and the processing cost cannot rise along with the rise of the processing complexity, and the processing of a complex structure and the multilayer metal wiring can be realized.
Description
Technical Field
The invention belongs to the technical field of circuit board printing, relates to additive manufacturing equipment and a using method thereof, and particularly relates to an additive manufacturing extrusion device of a circuit board, an additive manufacturing device using the additive manufacturing extrusion device and a using method thereof.
Background
The existing circuit board adopts a printed circuit mode. One or more metal layers, typically copper foil, are bonded to the dielectric substrate or insulating layer. And carrying out pattern transfer on the metal layer according to the wiring condition in a photoetching mode. And corroding and removing unnecessary metal through corrosive liquid to define the wiring condition of the metal layer. And then manufacturing through holes, bonding pads and the like to finish the processing of the printed circuit board.
Existing bi-material fused deposition three-dimensional additive manufacturing devices use two heated extrusion structures. The two extrusion structures melt-extrude two resin materials, respectively. The heating nozzle moves on a horizontal plane according to the profile information of the horizontal section of the workpiece, and meanwhile, according to the set material, the molten resin consumable material is extruded by the extrusion structure and coated on the bottom plate platform of the printer to form a layer of pattern. And after the completion, the distance between the platform and the spray head is increased by one layer height under the control of the motor, and the next layer of pattern is continuously formed. And the layers are arranged in a layer mode until the processing is finished.
However, the existing circuit board processing and manufacturing process has the following technical defects;
(1) the conventional circuit board manufacturing process involves operations with high risks such as metal corrosion, and can be performed only in a large scale in a specific factory.
(2) The existing circuit board processing method is a material reduction manufacturing method, so that a large amount of metal waste and discharge of waste liquid containing heavy metal ions are caused.
(3) Existing circuit board processing methods involve metal corrosion. The corrosion process of the interlayer metal is difficult in the process of processing the multilayer circuit board, and the current industry can only achieve the processing complexity of four layers of metal.
(4) According to the existing double-material fused deposition three-dimensional additive manufacturing equipment, due to the fact that the Teflon pipe is used as a backflow preventing structure, the heating temperature can only reach 270 ℃, and only a limited number of resin materials can be processed, wherein the resin materials do not comprise conductive materials. Meanwhile, in order to achieve higher precision, the extrusion pore diameter of the extrusion structure is smaller, and particles in the resin material are easy to block an extrusion head, so that the conductive resin material containing the metal powder is difficult to process.
CN108264756A provides a three-dimensional laser deposition modeling 3D printing material and apparatus. The 3D printing material and equipment comprise a feeding device, a photocuring device and a three-dimensional motion platform, wherein the feeding device comprises an air pump, a charging barrel, a pressure controller, a needle head, a charging barrel cover and a support, the output end of the air pump is connected with the input end of the pressure controller through a plastic pipe, the output end of the pressure controller is communicated with the charging barrel through the plastic pipe, the upper end of the needle head is connected with the lower end of the charging barrel through an internal thread buckle, the charging barrel cover is connected with the charging barrel through a thread buckle, the charging barrel is fixed on the support, and the lower end of the support is fixed on a frame body of the three-dimensional motion platform; the light curing device adopts an ultraviolet light emitter, the wavelength is 200-400 nm, the included angle between a light beam emitted by the ultraviolet light emitter and the needle head is forty degrees, the included angle between the light beam emitted by the ultraviolet light emitter and the R-axis rotating table is fifty degrees, and the center of the ultraviolet light is located 5-8 mm right behind the needle head; the three-dimensional motion platform consists of three-axis displacement sensors, an R-axis rotating platform and a driving motor, wherein the three-axis displacement sensors, the R-axis rotating platform and the driving motor are connected with a motion control card, the operation of the driving motor is controlled by a motor controller on the motion control card, the R-axis rotating platform is fixed on a Z axis, and the rotation of a stepping motor is meshed with a gear at the bottom of the R-axis rotating platform to drive the R-axis rotating platform.
CN108748975A discloses a nanometer-level high-precision additive manufacturing apparatus, comprising: the printing device comprises a printing platform and a printing spray head arranged right above the printing platform, wherein a high-voltage pulse power supply is applied between the printing platform and a conductive nozzle of the printing spray head; the printing platform and the printing nozzle are also provided with uniform magnetic fields perpendicular to the printing platform, and the distance between the printing platform and the printing nozzle meets the characteristic requirements.
CN107139485A discloses a 3D printing system for making printed circuit board and printing method thereof, 3D printing system including Arduino controller, the input and the computer link of Arduino controller, the output and the step motor-shower nozzle drive circuit of Arduino controller are connected, step motor-shower nozzle drive circuit is connected with the circuit board manufacturing mechanism based on 3D printing technique.
Analyzing the structure of the additive manufacturing apparatus disclosed in the prior art, when the conductive circuit portion is printed, an inevitable overflow phenomenon of the conductive photosensitive material may occur, which may eventually result in a short circuit situation, and therefore, it is necessary to improve the additive manufacturing apparatus disclosed in the prior art to solve the above technical problem.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide the additive manufacturing extrusion device of the circuit board, the additive manufacturing device using the additive manufacturing extrusion device and the using method of the additive manufacturing extrusion device. Meanwhile, the additive manufacturing mode is adopted, and only the circuit patterns of each layer need to be processed and molded, so the processing difficulty and the processing cost cannot rise along with the rise of the processing complexity, and the processing of a complex structure and the multilayer metal wiring can be realized.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides an additive manufacturing extrusion apparatus for a circuit board, the additive manufacturing extrusion apparatus comprising a feed conduit and an extrusion head in communication with the feed conduit.
The feeding pipeline comprises a fused deposition feeding pipeline and a photocuring feeding pipeline which are independent from each other.
The extrusion head is provided with a fused deposition extrusion port communicated with the fused deposition feeding pipeline.
And the extrusion head is provided with a photocuring extrusion port communicated with the photocuring feeding pipeline.
As a preferred embodiment of the present invention, the fused deposition feed conduit comprises a first fused deposition feed conduit and a second fused deposition feed conduit independently communicating with the extrusion head.
Preferably, the first and second fused deposition feed conduits are symmetrically disposed on opposite sides of the photocuring feed conduit.
Preferably, the extrusion head is provided with a first fused deposition extrusion port communicated with the first fused deposition feeding pipeline.
Preferably, the extrusion head is provided with a second fused deposition extrusion port communicated with the second fused deposition feeding pipeline.
Preferably, the additive manufacturing extrusion device further comprises a heating and melting device arranged at the inlet end of the fused deposition feeding pipeline, and the heating and melting device is used for carrying out melting and heating on the insulating base material entering the fused deposition feeding pipeline.
Preferably, the heating and melting device comprises a first heating and melting device arranged at the inlet end of the first fused deposition feeding pipeline and a second heating and melting device arranged at the inlet end of the second fused deposition feeding pipeline.
Preferably, the first heating and melting device and the second heating and melting device are both heating and sensing copper blocks.
As a preferred technical solution of the present invention, the additive manufacturing extrusion apparatus further includes a light source disposed above the extrusion head.
Preferably, the light source is sleeved at the outlet end of the photocuring extrusion pipeline.
Preferably, the light source is a laser light source or an LED light source.
Preferably, the light source has a wavelength of 405 nm.
As a preferred technical solution of the present invention, a horizontal waveguide is embedded in the extrusion head, and the horizontal waveguide is used for guiding the light emitted by the light source and adjusting the light path to irradiate onto the conductive photosensitive material extruded from the photocuring extrusion port.
Preferably, the horizontal waveguide surrounds the light-curing extrusion port and is embedded in the extrusion head.
Preferably, the material of the horizontal waveguide is silicon dioxide.
In a second aspect, the present disclosure provides an additive manufacturing apparatus for a circuit board, the additive manufacturing apparatus including a base and a transmission assembly fixed to the base.
The transmission assembly comprises a horizontal transmission assembly and a vertical transmission assembly.
The additive manufacturing device further comprises a platform group arranged on the horizontal direction transmission assembly, and the platform group is driven by the horizontal direction transmission assembly to move in a horizontal plane.
The additive manufacturing device further comprises an additive manufacturing extrusion device fixed on the vertical direction transmission assembly, the additive manufacturing extrusion device is located above the platform set and vertically moves under the driving of the vertical direction transmission assembly, and the additive manufacturing extrusion device adopts the additive manufacturing extrusion device according to the first aspect.
As a preferred technical scheme, the platform group comprises a processing platform, a rotary steering engine and a bottom platform which are sequentially arranged from top to bottom.
Preferably, the rotary steering engine is used for driving the machining platform to rotate.
Preferably, the bottom platform is connected with the horizontal transmission assembly and used for driving the processing platform and the rotary steering engine to move in a horizontal plane under the transmission of the horizontal transmission assembly.
Preferably, the rotational movement of the processing platform and the movement in the horizontal plane are performed independently.
As a preferable technical solution of the present invention, the horizontal direction transmission assembly includes a first transmission member and a second transmission member, and the first transmission member and the second transmission member are mutually matched to drive the bottom platform to move in a horizontal plane.
Preferably, the first transmission part comprises a first motor fixed on the base and a first transmission screw rod horizontally connected with the first motor, and the first transmission part is used for driving the bottom platform to do reciprocating linear motion along the direction of the first transmission screw rod.
Preferably, the second transmission part comprises a second motor fixed on the base and a second transmission screw rod horizontally connected with the second motor, and the second transmission part is used for driving the bottom platform to do reciprocating linear motion along the direction of the second transmission screw rod.
Preferably, the first transmission screw rod and the second transmission screw rod are perpendicular to each other and arranged in the same horizontal plane.
Preferably, the vertical transmission assembly comprises two groups of third motors fixed on the base and two third transmission screw rods respectively and vertically connected with the two groups of third motors, and the vertical transmission assembly further comprises a transmission cross beam connected with the two third transmission screw rods, and the transmission cross beam is driven by the third motors to do reciprocating linear motion along the directions of the third transmission screw rods.
The additive manufacturing extrusion device is fixed in the middle of the transmission cross beam and is driven by the transmission cross beam to do reciprocating linear motion along the direction of the third transmission screw rod.
Preferably, the additive manufacturing extrusion device is detachably connected to the middle of the transmission cross beam, and further preferably, the additive manufacturing extrusion device is detachably connected with the transmission cross beam through threads.
Preferably, the two third transmission screw rods are respectively arranged at the diagonal positions of the base.
As a preferable technical scheme of the invention, the additive manufacturing device further comprises a control system, and the control system is electrically connected with the transmission assembly, the rotary steering engine, the light source, the feeding pipeline, the first heating and melting device and the second heating and melting device.
Preferably, the control system is a microcontroller, and further preferably, the microcontroller is selected from one or a combination of at least two of Arduino, STM32, FPGA, raspberry pie, banana pie, C51, or virtual valley.
In a third aspect, the invention provides a method of additive manufacturing of a circuit board, the method being performed in an additive manufacturing apparatus according to the second aspect.
The additive manufacturing method comprises the following steps:
the circuit board is fixed on the platform group, and the horizontal transmission assembly drives the platform group to move to a preset position of a conductive circuit in the layer;
(II) extruding the conductive photosensitive material and the insulating base material by the additive manufacturing extrusion device while the platform group moves, and processing the conductive circuit on the layer by additive manufacturing;
(III) the horizontal direction transmission assembly drives the platform group to move to a preset position of the dielectric insulation part in the layer, the additive manufacturing extrusion device extrudes an insulation base material while the platform group moves, and the dielectric insulation part of the layer is processed in an additive mode;
and (IV) driving the additive manufacturing extrusion device to move upwards by the vertical direction transmission assembly, repeating the steps (I) to (III), and performing additive processing on the next layer until all conductive circuits and dielectric insulation parts with preset layers are completed to obtain the circuit board.
As a preferable technical scheme of the invention, the moving direction of the platform group in the step (II) is a direction perpendicular to a connecting line of a fused deposition extrusion port and a photocuring extrusion port of the additive manufacturing extrusion device. The adjustment to the direction of movement is intended to prevent mixing of the insulating substrate extruded from the fused deposition extrusion orifice and the conductive photosensitive material extruded from the photocurable extrusion orifice.
Preferably, the moving direction of the platform set in the step (ii) is controlled by a first transmission component, a second transmission component and a rotary steering engine.
Preferably, the additive manufacturing process of step (ii) comprises: and the heating and melting device melts the insulating base materials in the fused deposition feeding pipeline, the conductive photosensitive material and the insulating base materials on the two sides are simultaneously extruded and paved to the preset position of the conductive circuit through the additive manufacturing and extruding device, the light source is started, and the conductive photosensitive material is solidified and molded to form the conducting wire circuit with the insulating tapes on the two sides.
Preferably, the additive manufacturing of step (iii) comprises: and melting the insulating base material in the fused deposition feeding pipeline by the heating and melting device, extruding the melted insulating base material by the extruding device, paving the extruded insulating base material to a preset position of the dielectric insulating part, and forming the dielectric insulating part after solidification and molding.
Preferably, the conductive photosensitive material of step (ii) is a modified powder material.
Preferably, the powder material is selected from any one or a combination of at least two of graphite, graphene, copper, aluminum, gallium, indium or gold.
Preferably, the insulating base material in step (II) and step (III) is selected from acrylonitrile/butadiene/styrene terpolymer or polylactic acid.
Compared with the prior art, the invention has the beneficial effects that:
1. the additive manufacturing extrusion device for the circuit board provided by the invention adopts one photocuring feeding pipeline and two symmetrically distributed fused deposition feeding pipelines, so that the processing of the conductive circuit is realized, in the additive manufacturing process of the conductive circuit, the fused insulating base material and the conductive photosensitive material are simultaneously extruded, the flow of photocuring conductive consumables can be blocked after the fused insulating base material is molded, the conductive part can be rapidly molded as required, and the short circuit condition is avoided.
2. The additive manufacturing process of the circuit board can be independently completed by the additive manufacturing device provided by the invention, the process does not involve operation with danger coefficients, the limitation on the use field and the operation requirement is low, and the additive manufacturing device can be widely applied to environments such as student activity places, engineering studios, science and technology companies and the like.
3. The additive manufacturing device provided by the invention adopts an additive manufacturing technology, the material utilization rate can reach 100% theoretically, and the problems of consumable waste and heavy metal pollution are avoided.
4. The additive manufacturing mode adopted by the invention only needs to process and form the patterns of each layer, and the complexity of the structure has no special influence on the forming process, so that the processing difficulty and the processing cost cannot rise along with the rise of the processing complexity, and the processing of a complex structure and the multilayer metal wiring can be realized.
Drawings
Fig. 1 is a schematic front view of an additive manufacturing extrusion apparatus according to an embodiment of the present invention;
fig. 2 is a schematic top perspective view of an additive manufacturing extrusion apparatus according to an embodiment of the present invention;
fig. 3 is a schematic bottom perspective view of an additive manufacturing extrusion apparatus according to an embodiment of the present invention;
fig. 4 is a schematic perspective view of an additive manufacturing apparatus according to an embodiment of the present invention;
fig. 5 is a schematic front view of an additive manufacturing apparatus according to an embodiment of the present invention;
fig. 6 is a schematic top view of an additive manufacturing apparatus according to an embodiment of the present invention.
Wherein, 1-additive manufacturing extrusion device; 11-a feed conduit; 111-a first fused deposition feed conduit; 112-a second fused deposition feed conduit; 113-a photocuring feed line; 12-an extrusion head; 121-a first fused deposition extrusion orifice; 122-second fused deposition extrusion orifice; 123-photocuring extrusion port; 13-a heat melting device; 131-a first heating and melting device; 132-a second heat melting device; 14-a light source; 15-horizontal waveguide; 2-a horizontal direction transmission component; 21-a first transmission member; 211-a first motor; 212-first drive screw; 22-a second transmission member; 221-a second motor; 222-a second drive screw; 3-a vertical direction transmission assembly; 31-a third motor; 32-a third drive screw; 33-a drive beam; 4-platform group; 41-processing a platform; 42-a rotary steering engine; 43-bottom platform.
Detailed Description
The technical solutions provided by the present invention will be clearly and completely described below with reference to the accompanying drawings in the detailed description of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the scope of the present disclosure and protection.
In a specific embodiment, the present invention provides an additive manufacturing extrusion apparatus 1 as shown in fig. 1, 2 and 3, said additive manufacturing extrusion apparatus 1 comprising a feed conduit 11 and an extrusion head 12 in communication with said feed conduit 11. The feed line 11 comprises a fused deposition feed line and a photocuring feed line 113 that are independent of each other. The extrusion head 12 is provided with a fused deposition extrusion port communicated with the fused deposition feeding pipeline. The extrusion head 12 is provided with a photocuring extrusion port 123 communicated with the photocuring feeding pipeline 113.
The fused deposition feed line comprises a first fused deposition feed line 111 and a second fused deposition feed line 112 which are independently communicated with the extrusion head 12, and the first fused deposition feed line 111 and the second fused deposition feed line 112 are symmetrically arranged at two sides of the light-cured feed line 113. The extrusion head 12 is provided with a first fused deposition extrusion port 121 communicated with the first fused deposition feeding pipeline 111. The extrusion head 12 is provided with a second fused deposition extrusion port 122 communicated with the second fused deposition feeding pipeline 112. (specific construction referring to FIGS. 2 and 3, FIG. 2 shows the specific construction of the feed conduit in detail, and FIG. 3 shows the specific construction of the extrusion head in detail)
The inlet end of the fused deposition feed pipe is provided with a heating and melting device 13, the inlet end of the first fused deposition feed pipe 111 is provided with a first heating and melting device 131, and the first heating and melting device 131 is used for melting and heating the insulating substrate entering the first fused deposition feed pipe 111. The inlet end of the second fused deposition feed line 112 is provided with a second heated melting device 132, and the second heated melting device 132 is used for melting and heating the insulating substrate entering the second fused deposition feed line 112. The first heating and melting device 131 and the second heating and melting device 132 are both heating and sensing copper blocks. (specific construction referring to FIG. 1, FIG. 1 shows in detail the connection between the heating and melting apparatus 13 and the feed pipe)
The additive manufacturing extrusion device 1 further comprises a light source 14 arranged above the extrusion head 12, and the light source 14 is sleeved at the outlet end of the photocuring feeding pipeline 113. The horizontal waveguide 15 is embedded in the extrusion head 12, the horizontal waveguide 15 is used for conducting light emitted by the light source 14 and adjusting a light path to irradiate on the conductive photosensitive material extruded by the photocuring extrusion port 123, and the horizontal waveguide 15 surrounds the photocuring extrusion port 123 and is embedded in the extrusion head 12.
In another embodiment, the present invention further provides an additive manufacturing apparatus for a circuit board as shown in fig. 4, 5 and 6, the additive manufacturing apparatus comprising a base and a driving assembly fixed to the base, wherein the driving assembly comprises a horizontal driving assembly 2 and a vertical driving assembly 3. The additive manufacturing device further comprises a platform group 4 arranged on the horizontal direction transmission assembly 2, and the platform group 4 is driven by the horizontal direction transmission assembly 2 to move on the horizontal plane. The additive manufacturing device further comprises an additive manufacturing extrusion device 1 fixed on the vertical direction transmission assembly 3, and the additive manufacturing extrusion device 1 is located above the platform group 4 and driven by the vertical direction transmission assembly 3 to vertically move.
The horizontal direction transmission assembly 2 comprises a first transmission part 21 and a second transmission part 22, and the first transmission part 21 and the second transmission part 22 are mutually matched for driving the bottom platform 43 to move in a horizontal plane. The first transmission part 21 comprises a first motor 211 fixed on the base and a first transmission screw 212 horizontally connected with the first motor 211, and the first transmission part 21 is used for driving the bottom platform 43 to do reciprocating linear motion along the direction of the first transmission screw 212. The second transmission component 22 includes a second motor 221 fixed on the base and a second transmission screw 222 horizontally connected with the second motor 221, and the second transmission component 22 is used for driving the bottom platform 43 to make reciprocating linear motion along the direction of the second transmission screw 222. The first transmission screw 212 and the second transmission screw 222 are vertically arranged in the same horizontal plane (see fig. 4 and 5, and fig. 5 shows the specific structures of the first transmission part 21 and the second transmission part 22 and the connection relationship between the first transmission part and the second transmission part and the base in detail).
The vertical direction transmission assembly 3 comprises two groups of third motors 31 fixed on the base and two third transmission screw rods 32 respectively and vertically connected with the two groups of third motors 31, the vertical direction transmission assembly 3 further comprises a transmission cross beam 33 connected with the two third transmission screw rods 32, and the transmission cross beam 33 is driven by the third motors 31 to do reciprocating linear motion along the directions of the third transmission screw rods 32.
The additive manufacturing extrusion device 1 is fixed in the middle of the transmission cross beam 33 and is driven by the transmission cross beam 33 to do reciprocating linear motion along the direction of the third transmission screw rod 32. The extrusion device is detachably connected to the middle of the transmission beam 33, and further preferably, the extrusion device is detachably connected with the transmission beam 33 through threads. The two third transmission screw rods 32 are respectively arranged at the diagonal positions of the base.
The platform group 4 comprises a processing platform 41, a rotary steering gear 42 and a bottom platform 43 which are sequentially arranged from top to bottom, wherein the rotary steering gear 42 is used for driving the processing platform 41 to rotate; the bottom platform 43 is connected with the horizontal transmission component 2 and is used for driving the processing platform 41 and the rotary steering engine 42 to move in a horizontal plane under the transmission of the horizontal transmission component 2; the rotation movement of the processing platform 41 and the movement in the horizontal plane are performed independently (see fig. 6 for a specific structure, and fig. 6 shows the specific structure of the platform set 4 and the connection relationship between the platform set and the transmission assembly in detail).
The additive manufacturing equipment of the circuit board further comprises a control system, and the control system is electrically connected with the transmission assembly, the rotary steering engine 42, the light source 14, the feeding pipeline 11, the first heating and melting device 131 and the second heating and melting device 132.
The additive manufacturing device of the circuit board can realize the following functions:
1. the bottom platform 43 moves horizontally in the horizontal plane under the control of the first motor 211 and the second motor 221 and the transmission action of the timing belt.
2. The rotary steering gear 42 is fixed on the bottom platform 43, the bottom platform 43 moves in the horizontal plane and drives the rotary steering gear 42 on the bottom platform to move in the horizontal plane, the machining platform 41 is fixed on the rotary steering gear 42, and the rotary steering gear 42 drives the machining platform 41 to rotate.
3. The additive manufacturing extrusion device 1 is fixed on a transmission beam 33, and the transmission beam 33 can perform reciprocating linear motion in the vertical direction through the transmission of a third transmission screw 32 and the control of a third motor 31.
4. In the additive manufacturing extrusion apparatus 1, the insulating substrate may be fed into the extrusion head 12 from the first fused deposition feed pipe 111 and the second fused deposition feed pipe 112 by a commercially available wire feeding device, heated and melted by the first heated and melted device 131 and the second heated and melted device 132, and extruded through the first fused deposition extrusion port 121 and the second fused deposition extrusion port 122.
5. In the additive manufacturing extrusion apparatus 1, the conductive photosensitive material may be fed into the extrusion head 12 from the photocurable feeding pipe 113 by a commercially available liquid pump or the like, and extruded from the photocurable extrusion port 123.
6. The light source 14 may be controllable by the microcontroller to emit light that cures the conductive photosensitive material, the light source 14 may have a wavelength of 405nm, and the light source 14 may be, but is not limited to, a laser, an LED, a gallium nitride based Micro-LED, or other light source filtered through a filter.
7. The light emitted from the light source 14 enters from the light inlet of the horizontal waveguide 15 and exits from the light outlet of the horizontal waveguide 15, and the light path is adjusted by the horizontal waveguide 15, so that the light path accurately irradiates on the conductive photosensitive material extruded from the photocuring extrusion port 123, and the conductive photosensitive material is cured and molded.
8. The movement of all motors (including the first motor 211, the second motor 221 and the third motor 31), the rotation of the rotary steering engine 42, the turning on or off of the light source 14, and whether the conductive photosensitive material and the insulating substrate are fed or not are controlled by the control system. Microcontrollers include, but are not limited to, one or a combination of at least two of Arduino, STM32, FPGA, raspberry pie, banana pie, C51, or virtual valley number.
9. The additive manufacturing device provided by the invention switches between two working modes under the control of a processing system according to the parameters of a circuit board to be processed: firstly, a circuit processing mode and secondly, a mechanical processing mode; in the circuit processing mode, the device can process conductive circuits on the circuit substrate in an additive mode; in the machining mode, the apparatus may additively machine the dielectric insulation portion in the remainder of the circuit board substrate.
The working flow of the additive manufacturing device of the circuit board provided by the invention is as follows:
starting the additive manufacturing device provided by the invention, the driving beam 33 moves in the vertical direction and is adjusted to a proper height, so that the distance between the first fused deposition extrusion port 121, the second fused deposition extrusion port 122 and the light-cured extrusion port 123 in the additive manufacturing extrusion device 1 and the processing platform 41 is one line layer high. At this time, the additive manufacturing apparatus enters a line processing mode, in which the additive manufacturing apparatus performs additive processing on the circuit substrate to form the conductive line in the layer. After the machining, the additive manufacturing device enters a machining mode, and in the machining mode, the additive manufacturing device conducts additive machining on the dielectric insulating part which is not conductive in the layer in the rest part of the circuit substrate. After the machining is completed, the driving beam 33 is raised in the vertical direction by a line level height, and the line machining mode and the machining mode are repeated continuously. And circularly processing upwards layer by layer until the additive processing process with the preset layers is completed, so as to obtain the additive processed circuit board.
Specifically, in the line processing mode, the microcontroller controls the temperature of the first heating and melting device 131 and the second heating and melting device 132 to be kept above the melting point of the insulating substrate, so as to ensure that the insulating substrate entering the extrusion head 12 can be melted. The microprocessor controls the insulation base material in a molten state to be extruded from the first fused deposition extrusion port 121 and the second fused deposition extrusion port 122 respectively, the conductive photosensitive material is also extruded from the photocuring extrusion port 123 and paved to a preset position of a conductive circuit on the circuit substrate (the position of the processing platform 41 is adjusted through the horizontal direction transmission component 2), and the microprocessor controls the light source 14 to be started to perform curing molding on the conductive photosensitive material.
It is noted that in the line processing mode, the extrusion of the conductive photosensitive material and the insulating substrate is performed simultaneously while stopping. While the conductive photosensitive material and the insulating substrate are extruded, the processing platform 41 is horizontally moved in the horizontal plane under the control of the first motor 211 and the second motor 221 so as to adjust the processing platform 41 to a proper conductive circuit preset position. Meanwhile, the rotary steering engine 42 drives the processing platform 41 to rotate. When the processing platform 41 moves to a preset position of the conductive circuit (i.e. the preset position is located right below the additive manufacturing extrusion apparatus 1), the conductive photosensitive material and the melted insulating base material are simultaneously extruded by the extrusion head 12 and are solidified and molded. The insulating base material can obstruct the flow of the conductive photosensitive material after extrusion molding, and the short circuit of the circuit is avoided.
In the machining mode, the light-curing feeding pipe 113 stops feeding, and the rotary steering engine 42 stops rotating. The microprocessor controls the temperature of the heating and melting device 13 to be higher than the melting point of the insulating base material, and heats and melts the insulating base material. Under the control of the first motor 211 and the second motor 221, the processing platform 41 moves in a horizontal plane, when the processing platform moves to a preset position where a dielectric insulation part is needed (i.e. the preset position is located right below the additive manufacturing extrusion device 1), the microprocessor controls the insulation base material in a molten state to be extruded from any one fused deposition extrusion outlet of the first fused deposition extrusion outlet 121 and the second fused deposition extrusion outlet 122 or to be extruded from both fused deposition extrusion outlets simultaneously, and the molten insulation base material is laid to the preset position of the dielectric insulation part of the circuit substrate and is solidified and molded.
Every layer of circuit layer all carries out a circuit course of working and machining process, and after one layer of circuit layer vibration material disk processing was accomplished, transmission crossbeam 33 drove vibration material disk extrusion device 1 and rises the distance of a circuit layer height under the control of third motor 31, carries out the circuit course of working and the machining process of next layer, and the circuit course of working and the machining process of all predetermineeing the number of piles is accomplished until accomplishing, finally obtains vibration material disk's circuit board.
The applicant declares that the above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be understood by those skilled in the art that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are within the scope and disclosure of the present invention.
Claims (34)
1. The additive manufacturing device of the circuit board is characterized by comprising a base and a transmission assembly fixed with the base;
the transmission assembly comprises a horizontal transmission assembly and a vertical transmission assembly;
the additive manufacturing device also comprises a platform group arranged on the horizontal transmission assembly, and the platform group is driven by the horizontal transmission assembly to move in a horizontal plane;
the additive manufacturing device also comprises an additive manufacturing extrusion device fixed on the vertical direction transmission assembly, and the additive manufacturing extrusion device is positioned above the platform set and vertically moves under the driving of the vertical direction transmission assembly;
the additive manufacturing extrusion device comprises a feeding pipeline and an extrusion head communicated with the feeding pipeline; the feeding pipeline comprises a fused deposition feeding pipeline and a photocuring feeding pipeline which are independent from each other; the extrusion head is provided with a fused deposition extrusion port communicated with the fused deposition feeding pipeline; the extrusion head is also provided with a photocuring extrusion port communicated with the photocuring feeding pipeline;
the fused deposition feed pipe comprises a first fused deposition feed pipe and a second fused deposition feed pipe which are independently communicated with the extrusion head, and the first fused deposition feed pipe and the second fused deposition feed pipe are symmetrically arranged on two sides of the photocuring feed pipe;
the method for additive manufacturing by adopting the additive manufacturing device comprises the following steps:
the method comprises the following steps that (I) a circuit substrate is fixed on a platform set, and a horizontal transmission assembly drives the platform set to move to a preset position of a conductive circuit on a first layer of a circuit board;
(II) extruding the conductive photosensitive material and the insulating base material by the additive manufacturing extrusion device while the platform group moves, and processing a conductive circuit on the first layer of the circuit board by additive manufacturing;
the additive processing comprises: the heating and melting device melts the insulating base materials in the fused deposition feeding pipeline, the conductive photosensitive material and the insulating base materials on the two sides are simultaneously extruded and laid to the preset position of the conductive circuit through the additive manufacturing extrusion device, the light source is started, and the conductive photosensitive material is solidified and molded to form a conducting wire circuit with insulating tapes on the two sides;
(III) the horizontal transmission assembly drives the platform group to move to a preset position of a dielectric insulation part of the first layer of the circuit board, the additive manufacturing extrusion device extrudes an insulation base material while the platform group moves, and the dielectric insulation part of the first layer of the circuit board is processed in an additive mode;
and (IV) driving the additive manufacturing extrusion device to move upwards by the vertical direction transmission assembly, repeating the steps (I) to (III), and performing additive processing on the next layer until all conductive circuits and dielectric insulation parts with preset layers are completed to obtain the circuit board.
2. The additive manufacturing apparatus of claim 1 wherein said extrusion head defines a first fused deposition extrusion orifice in communication with said first fused deposition feed conduit.
3. The additive manufacturing apparatus of claim 1 wherein said extrusion head defines a second fused deposition extrusion orifice in communication with said second fused deposition feed conduit.
4. The additive manufacturing apparatus of claim 1, wherein the additive manufacturing extrusion apparatus further comprises a heating and melting device disposed at an inlet end of the fused deposition feed conduit, the heating and melting device configured to melt heat the insulating substrate entering the fused deposition feed conduit.
5. The additive manufacturing apparatus of claim 4, wherein the heating and melting device comprises a first heating and melting device disposed at an inlet end of the first fused deposition feed conduit and a second heating and melting device disposed at an inlet end of the second fused deposition feed conduit.
6. The additive manufacturing apparatus of claim 5 wherein the first and second heat and melt apparatuses are both heat and sense copper blocks.
7. The additive manufacturing apparatus of claim 1, wherein the additive manufacturing extrusion apparatus further comprises a light source disposed above the extrusion head.
8. The additive manufacturing apparatus of claim 7 wherein the light source is sleeved at an exit end of the photocuring extrusion conduit.
9. Additive manufacturing device according to claim 7, wherein the light source is a laser light source or an LED light source.
10. Additive manufacturing device according to claim 7, wherein the wavelength of the light source is 405 nm.
11. The additive manufacturing apparatus of claim 7, wherein a horizontal waveguide is embedded in the extrusion head, and the horizontal waveguide is used for guiding light emitted by the light source and adjusting a light path to irradiate the conductive photosensitive material extruded by the photocuring extrusion opening.
12. The additive manufacturing apparatus of claim 11, wherein the horizontal waveguide surrounds the photocuring extrusion orifice and is embedded in the extrusion head.
13. The additive manufacturing apparatus of claim 11 wherein the material of the horizontal waveguide is silicon dioxide.
14. The additive manufacturing device of claim 1, wherein the platform set comprises a processing platform, a rotary steering engine, and a bottom platform arranged in sequence from top to bottom.
15. The additive manufacturing apparatus of claim 14 wherein the rotary actuator is configured to rotate the processing platform.
16. The additive manufacturing device according to claim 14, wherein the bottom platform is connected to the horizontal transmission assembly and is configured to drive the processing platform and the rotary steering engine to move in a horizontal plane under transmission of the horizontal transmission assembly.
17. Additive manufacturing device according to claim 14, wherein the rotational movement and the movement in the horizontal plane of the processing platform are performed independently.
18. The additive manufacturing apparatus of claim 14 wherein said horizontal drive assembly comprises a first drive member and a second drive member, said first drive member and said second drive member cooperating to move said bottom platform in a horizontal plane.
19. The additive manufacturing apparatus of claim 18, wherein the first transmission member comprises a first motor fixed to the base and a first transmission screw horizontally connected to the first motor, and the first transmission member is configured to drive the bottom platform to perform a reciprocating linear motion along a direction of the first transmission screw.
20. The additive manufacturing apparatus of claim 19, wherein the second transmission member comprises a second motor fixed to the base and a second transmission screw horizontally connected to the second motor, and the second transmission member is configured to drive the bottom platform to perform a reciprocating linear motion along a direction of the second transmission screw.
21. The additive manufacturing apparatus of claim 20, wherein the first drive screw and the second drive screw are disposed perpendicular to each other in a same horizontal plane.
22. The additive manufacturing device according to claim 1, wherein the vertical direction transmission assembly comprises two groups of third motors fixed on the base and two third transmission screw rods vertically connected with the two groups of third motors respectively, and further comprises a transmission beam connected with the two third transmission screw rods, and the transmission beam is driven by the third motors to perform reciprocating linear motion along the directions of the third transmission screw rods;
the additive manufacturing extrusion device is fixed in the middle of the transmission cross beam and is driven by the transmission cross beam to do reciprocating linear motion along the direction of the third transmission screw rod.
23. The additive manufacturing apparatus of claim 22 wherein the additive manufacturing extrusion apparatus is removably attached to the drive beam midsection.
24. The additive manufacturing apparatus of claim 23, wherein the additive manufacturing extrusion apparatus is removably connected to the drive beam by threads.
25. The additive manufacturing apparatus of claim 22, wherein the two third drive screws are respectively disposed at diagonal positions of the base.
26. The additive manufacturing device of claim 1, further comprising a control system, wherein the control system is electrically connected to the transmission assembly, the rotary steering engine, the light source, the feed conduit, the first heating and melting device, and the second heating and melting device.
27. An additive manufacturing apparatus according to claim 26, wherein the control system is a microcontroller.
28. Additive manufacturing apparatus according to claim 27, wherein the microcontroller is selected from one or a combination of at least two of Arduino, STM32, FPGA, raspberry pie, banana pie, C51, or virtual valley.
29. The additive manufacturing apparatus according to claim 1, wherein the moving direction of the stage group in the step (ii) is a direction perpendicular to a line connecting the fused deposition extrusion outlet and the photocuring extrusion outlet of the additive manufacturing extrusion apparatus.
30. The additive manufacturing device according to claim 1, wherein the moving direction of the platform group in the step (II) is controlled by a first transmission component, a second transmission component and a rotary steering engine.
31. The additive manufacturing apparatus of claim 1, wherein the additive processing of step (iii) comprises: and melting the insulating base material in the fused deposition feeding pipeline by the heating and melting device, extruding the melted insulating base material by the extruding device, paving the extruded insulating base material to a preset position of the dielectric insulating part, and forming the dielectric insulating part after solidification and molding.
32. The additive manufacturing apparatus according to claim 1, wherein the conductive photosensitive material of step (ii) is a modified powder material.
33. An additive manufacturing device according to claim 32, wherein the powder material is selected from any one or a combination of at least two of graphite, graphene, copper, aluminium, gallium, indium or gold.
34. The additive manufacturing apparatus of claim 1, wherein the insulating substrate of step (ii) and step (iii) is selected from an acrylonitrile/butadiene/styrene terpolymer or polylactic acid.
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