CN109692828B - Wafer selection jig suitable for 1210 encapsulation size - Google Patents
Wafer selection jig suitable for 1210 encapsulation size Download PDFInfo
- Publication number
- CN109692828B CN109692828B CN201910119450.5A CN201910119450A CN109692828B CN 109692828 B CN109692828 B CN 109692828B CN 201910119450 A CN201910119450 A CN 201910119450A CN 109692828 B CN109692828 B CN 109692828B
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- Prior art keywords
- wafer
- strip
- mask
- bar recess
- shaped grooves
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005538 encapsulation Methods 0.000 title claims description 3
- 235000012431 wafers Nutrition 0.000 claims abstract description 79
- 238000000034 method Methods 0.000 claims abstract description 16
- 230000008569 process Effects 0.000 claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 5
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C7/00—Sorting by hand only e.g. of mail
- B07C7/04—Apparatus or accessories for hand picking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C7/00—Sorting by hand only e.g. of mail
- B07C7/02—Compartmented furniture, e.g. pigeon-holes
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer selecting jig suitable for 1210 packaging size, which comprises a cover plate, a first mask plate, a second mask plate and a base for placing wafers, wherein the first mask plate is adhered to the bottom surface of the cover plate, a plurality of first strip-shaped grooves, second strip-shaped grooves and third strip-shaped grooves are uniformly arranged in the base at intervals, the lengths of the first strip-shaped grooves and the third strip-shaped grooves are equal and larger than those of the second strip-shaped grooves, a first frame groove and a second frame groove are respectively arranged at two ends of the second strip-shaped grooves, and the second mask plate is adhered to the first strip-shaped grooves, the second strip-shaped grooves and the third strip-shaped grooves respectively. The invention can avoid the displacement of the wafer in the process of selecting, accurately position the wafer and provide a reliable supporting and protecting structure, and can greatly reduce the possibility of damaging the wafer in the process of manually removing the unqualified wafer.
Description
Technical Field
The invention belongs to the technical field of wafer selecting jigs, and particularly relates to a wafer selecting jig suitable for 1210 packaging sizes.
Background
In recent years, the sales of quartz crystal products worldwide have increased at a rate of about 15% each year. Along with the high-speed development of information industry, quartz crystal oscillators are widely used in various intelligent devices due to the characteristics of small volume, light weight, high reliability and high frequency stability, for example: communication devices, industrial devices, gaming devices, home appliances, and the like. In the production of quartz crystals, it is often necessary to remove wafers having poor appearance. A 33mm 25.1mm wafer often contains hundreds of dies.
In the prior art, in the appearance selecting link, a wafer with bad appearance needs to be observed by a microscope and manually removed, but the thickness of the wafer is extremely thin and is about 20-80 microns, and the wafer can be damaged by slight external force, so that the wafer is extremely damaged during manual removal, and serious loss is brought to actual production activities. In addition, a certain displacement is often generated in the process of selecting the wafer, so that accurate positioning of the wafer is difficult to realize.
Disclosure of Invention
The invention aims to provide a wafer selecting jig suitable for 1210 packaging size, which can avoid displacement of wafers in the selecting process, accurately position the wafers and provide a reliable supporting and protecting structure, and greatly reduce the possibility of damaging the wafers in the process of manually removing unqualified wafers.
The embodiment of the invention provides a wafer selecting jig suitable for 1210 packaging size, which comprises a cover plate, a first mask plate, a second mask plate and a base for placing wafers, wherein the first mask plate is adhered to the bottom surface of the cover plate, the bottom surface of the cover plate is covered on the base, a plurality of first strip-shaped grooves, second strip-shaped grooves and third strip-shaped grooves are uniformly arranged in the base at intervals, the first strip-shaped grooves, the second strip-shaped grooves and the third strip-shaped grooves are sequentially arranged adjacently, the lengths of the first strip-shaped grooves and the third strip-shaped grooves are equal and are larger than the length of the second strip-shaped grooves, a first frame groove and a second frame groove are respectively arranged at two ends of the second strip-shaped grooves, the second mask plate is adhered to the bottom surface of the first strip-shaped grooves, the second strip-shaped grooves and the third strip-shaped grooves respectively, a plurality of wafers are borne on the wafers, a plurality of through holes corresponding to the wafers are respectively arranged on the first strip-shaped grooves, the second strip-shaped grooves and the third strip-shaped grooves are used for highlighting the wafers.
Further, a clamping groove for positioning the wafer is further formed in the upper portion of the peripheral edge of the base, and the wafer is placed in the base through the clamping groove.
Further, a first groove corresponding to the first frame groove and a second groove corresponding to the second frame groove are respectively formed in two opposite sides of the first mask plate and the second mask plate.
Further, the first mask plate is adhered to the bottom surface of the cover plate through anaerobic adhesive.
Further, the second mask plate is respectively bonded with the first strip-shaped groove, the second strip-shaped groove and the third strip-shaped groove through anaerobic adhesive.
Further, the through holes are rectangular through holes, and the through holes are arranged in a rectangular shape.
Further, the through holes are manufactured by adopting an etching processing technology.
Further, the wafer selecting jig is made of a metal material and is manufactured by adopting an anodic oxidation process.
Further, the package size of the wafer selecting jig is 1.2mm by 1.0mm.
In summary, according to the invention, the first mask plate is adhered to the bottom surface of the cover plate, the bottom surface of the cover plate is covered on the base, a plurality of first strip-shaped grooves, second strip-shaped grooves and third strip-shaped grooves are uniformly arranged in the base at intervals, and the first strip-shaped grooves, the second strip-shaped grooves and the third strip-shaped grooves are sequentially arranged adjacently. The length of the first strip-shaped groove and the length of the third strip-shaped groove are equal to each other and are larger than that of the second strip-shaped groove, a first frame groove and a second frame groove are respectively arranged at two ends of the second strip-shaped groove, and the second mask plate is respectively bonded with the first strip-shaped groove, the second strip-shaped groove and the third strip-shaped groove. The wafer is provided with a plurality of chips, a plurality of through holes corresponding to the chips are respectively penetrated through the first mask plate and the second mask plate, and the through holes are used for highlighting and exposing the chips. Therefore, the displacement of the wafer in the selection process can be avoided, the wafer is accurately positioned, a reliable supporting and protecting structure is provided, and the possibility of damaging the wafer in the process of manually removing the unqualified wafer can be greatly reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and should not be considered limiting the scope, and that other related drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of a base in a wafer selecting jig with a 1210 package size according to an embodiment of the present invention.
Fig. 2 is a schematic plan view of a base in a wafer pick-up jig with a 1210 package size according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a cover plate in a wafer selecting jig suitable for 1210 packaging size according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a first mask in a wafer picking jig suitable for 1210 packaging size according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a second mask in a wafer pick-up jig suitable for 1210 package size according to an embodiment of the present invention.
Icon:
a cover plate 100; a first mask plate 200; a second mask 300; a base 400; a first bar-shaped groove 101;
a second bar-shaped groove 102; a third bar-shaped groove 103; a first frame recess 104; a second bezel recess 105;
a through hole 106; a card slot 201; a first groove 202; and a second groove 203.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present invention, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
As shown in fig. 1 to 5, a wafer selecting jig suitable for 1210 packaging size provided in an embodiment of the present invention may include a cover plate 100, a first mask plate 200, a second mask plate 300, and a base 400. The bottom surface of the cover plate 100 is covered on the base 400, and the first mask plate 200 is adhered to the bottom surface of the cover plate 100, so as to fix the first mask plate 200 to the cover plate 100. The pedestal 400 is used for placing a wafer, on which a plurality of dies are carried. In addition, the package size of the wafer selecting jig may be 1.2mm×1.0mm. Preferably, the first mask 200 is adhered to the bottom surface of the cover plate 100 by anaerobic adhesive.
In this embodiment, a plurality of first strip-shaped grooves 101, second strip-shaped grooves 102 and third strip-shaped grooves 103 are uniformly arranged in the base 400 at intervals. The first strip-shaped groove 101, the second strip-shaped groove 102 and the third strip-shaped groove 103 are sequentially and adjacently arranged.
Specifically, the lengths of the first strip-shaped groove 101 and the third strip-shaped groove 103 are equal and greater than the length of the second strip-shaped groove 102, and two ends of the second strip-shaped groove 102 are respectively provided with a first frame groove 104 and a second frame groove 105. In order to fix the second mask 300, the second mask 300 is bonded to the first bar-shaped groove 101, the second bar-shaped groove 102, and the third bar-shaped groove 103, respectively. Preferably, the second mask 300 is adhered to the first, second and third bar grooves 101, 102 and 103 by anaerobic adhesive.
When the wafer selecting jig is implemented, the wafer selecting jig is placed under a microscope, and a needle is used for removing unqualified wafers. Therefore, a reliable supporting and protecting structure can be provided for the wafer, and the wafer can be conveniently moved and observed under a microscope; and the possibility of damaging the wafer during the process of manually removing the failed chip can be greatly reduced.
In order to highlight and expose the wafers, the first mask 200 is provided with a plurality of through holes 106 corresponding to the wafers, and the second mask 300 is also provided with a plurality of through holes 106 corresponding to the wafers. The through holes 106 may be rectangular through holes 106, and the plurality of through holes 106 are arranged in a rectangular shape. In practice, the through-holes 106 are preferably formed using an etching process.
Further, a clamping groove 201 for positioning the wafer is further provided at the upper part of the peripheral edge of the base 400, and the wafer is placed in the base 400 through the clamping groove 201, so as to prevent the wafer from being displaced in the process of selecting the wafer, thereby being capable of accurately positioning the wafer.
Opposite sides of the first mask 200 and the second mask 300 are respectively provided with a first groove 202 corresponding to the first frame groove 104 and a second groove 203 corresponding to the second frame groove 105. The first frame groove 104, the first groove 202, the second frame groove 105 and the second groove 203 are matched with each other, so that the edge of the wafer can be conveniently clamped, and the operation is convenient.
Preferably, the wafer selecting jig is mainly made of metal materials, so that the wafer selecting jig has the characteristics of high strength and reusability. The wafer selecting jig is also manufactured by adopting an anodic oxidation process so as to prevent secondary damage to the plurality of wafers and the like.
In summary, in the present invention, the first mask 200 is adhered to the bottom surface of the cover plate 100, the bottom surface of the cover plate 100 is covered on the base 400, a plurality of first strip-shaped grooves 101, second strip-shaped grooves 102 and third strip-shaped grooves 103 are uniformly arranged in the base 400 at intervals, and the first strip-shaped grooves 101, the second strip-shaped grooves 102 and the third strip-shaped grooves 103 are sequentially adjacent to each other. The lengths of the first strip-shaped groove 101 and the third strip-shaped groove 103 are equal to and greater than the length of the second strip-shaped groove 102, a first frame groove 104 and a second frame groove 105 are respectively arranged at two ends of the second strip-shaped groove 102, and the second mask 300 is respectively bonded with the first strip-shaped groove 101, the second strip-shaped groove 102 and the third strip-shaped groove 103. The wafer is loaded with a plurality of chips, and the first mask 200 and the second mask 300 are respectively provided with a plurality of through holes 106 corresponding to the plurality of chips in a penetrating manner, and the plurality of through holes 106 are used for exposing the plurality of chips. Therefore, the displacement of the wafer in the selection process can be avoided, the wafer is accurately positioned, a reliable supporting and protecting structure is provided, and the possibility of damaging the wafer in the process of manually removing the unqualified wafer can be greatly reduced.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, and various modifications and variations may be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a wafer selection tool suitable for 1210 encapsulation size, its characterized in that includes apron, first mask, second mask and is used for placing the base of wafer, first mask with the bottom surface bonding of apron, the bottom surface lid of apron closes on the base, even interval is provided with a plurality of first bar recess, second bar recess and third bar recess in the base, first bar recess, second bar recess and third bar recess set up adjacently in proper order, wherein, the length of first bar recess and third bar recess equals and is greater than the length of second bar recess, the both ends of second bar recess are provided with first frame recess and second frame recess respectively, the second mask with first bar recess, second bar recess and third bar recess bond respectively, bear a plurality of wafers on the wafer, a plurality of through-holes that correspond with a plurality of wafers are run through respectively on first mask and the second mask, a plurality of through-holes are used for showing the multiple wafers are exposed;
the upper part of the peripheral edge of the base is also provided with a clamping groove for positioning the wafer, and the wafer is placed in the base through the clamping groove;
and the opposite sides of the first mask plate and the second mask plate are respectively provided with a first groove corresponding to the first frame groove and a second groove corresponding to the second frame groove.
2. The wafer picking jig of claim 1, wherein the first mask is bonded to the bottom surface of the cover plate by anaerobic adhesive.
3. The wafer picking jig suitable for 1210 packaging size of claim 1, wherein the second mask plate is adhered to the first, second and third bar grooves respectively by anaerobic adhesive.
4. The die pick jig of claim 1, wherein the through holes are rectangular through holes and the plurality of through holes are arranged in a rectangular pattern.
5. The die pick tool of claim 4 wherein the through holes are formed by an etching process.
6. The die pick tool of claim 1 adapted for 1210 package sizes, wherein the die pick tool is a metal material and is fabricated using an anodic oxidation process.
7. The die picking jig of any one of claims 1-6 adapted for use in 1210 package sizes, wherein the die picking jig has a package size of 1.2mm by 1.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910119450.5A CN109692828B (en) | 2019-02-18 | 2019-02-18 | Wafer selection jig suitable for 1210 encapsulation size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910119450.5A CN109692828B (en) | 2019-02-18 | 2019-02-18 | Wafer selection jig suitable for 1210 encapsulation size |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109692828A CN109692828A (en) | 2019-04-30 |
| CN109692828B true CN109692828B (en) | 2024-01-23 |
Family
ID=66233406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910119450.5A Active CN109692828B (en) | 2019-02-18 | 2019-02-18 | Wafer selection jig suitable for 1210 encapsulation size |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109692828B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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2019
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|---|---|---|---|---|
| JPH09298356A (en) * | 1996-03-08 | 1997-11-18 | Hitachi Ltd | Method for forming bumps and its apparatus and electronic device formed thereby |
| CN101710581A (en) * | 2009-10-16 | 2010-05-19 | 晶方半导体科技（苏州）有限公司 | Encapsulating structure of semiconductor chip and manufacturing technology thereof |
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| Publication number | Publication date |
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| CN109692828A (en) | 2019-04-30 |
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