CN109688398B - Image sensor that 3D piled up - Google Patents
Image sensor that 3D piled up Download PDFInfo
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- CN109688398B CN109688398B CN201811509310.0A CN201811509310A CN109688398B CN 109688398 B CN109688398 B CN 109688398B CN 201811509310 A CN201811509310 A CN 201811509310A CN 109688398 B CN109688398 B CN 109688398B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
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Abstract
The invention discloses a 3D stacked image sensor which comprises a pixel array, an analog-to-digital conversion unit array and a memory array. The image sensor is composed of an upper chip and a lower chip which are stacked up and down. The pixel array includes a plurality of pixel units for converting an optical signal into an analog electrical signal, which is located on the upper chip. The analog-to-digital conversion unit array comprises a plurality of analog-to-digital conversion units, is used for converting the analog electric signals into digital electric signals, and is positioned on the lower chip. The memory array includes a memory cell array including a plurality of memory cells for storing the converted digital electrical signals, and a logic circuit array including a plurality of logic circuits for controlling reading and writing of the plurality of memory cells. The memory cell array is located on the upper chip and below the pixel array, and the logic circuit array of the memory array is located on the upper chip or the lower chip. The invention can improve the frame rate of the image sensor.
Description
Technical Field
The invention relates to the field of integrated circuit design, in particular to a 3D stacked CMOS image sensor.
Background
With the development of the CMOS integrated circuit technology, the electronic products are more and more widely applied in daily life, and the image sensor is used as an information acquisition port of the electronic product, thereby providing an essential technical support for the development of various fields such as daily life, traffic, aerospace research, AI intelligent application, and the like. In practical application, the image sensor with high frame rate can provide more accurate real-time image information, and can play an important role in the fields of intelligent driving, quick identification, accurate capture and the like. However, in the existing product, since the image data is read and transmitted line by line, the frame rate of the image sensor is determined by the conversion and reading time of each line of data and the number of lines, and for the current high-definition large pixel array, the frame rate is greatly limited due to the restrictions of the line time and the total number of lines.
High integration and low cost are always important trends in the development of the field of integrated circuit chip design, besides the continuous reduction of the size and simplification of the circuit design from the aspect of the process, another existing technology adopts a 3D stacking technology, and particularly in the field of CMOS image sensors, the 3D stacking technology can achieve high integration and high filling rate, and provides better imaging performance. However, the existing 3D stacking architecture and the 3D stacking architecture commonly used in smart devices such as mobile phones are formed by stacking an upper layer chip and a lower layer chip (as shown in fig. 1), wherein the upper layer chip is a pixel array, the lower layer chip is a logic circuit for driving reading and the like, and the two layers of chips are connected by bonding or interconnection. However, the existing double-layer 3D stacked chip still adopts a row-by-row or grouped multi-row reading mode, and since the data transmission speed is relatively slow, the data transmission of the next frame of image can be performed only after the data transmission is completed after the previous frame of image is exposed, so that the existing double-layer 3D stacked chip is limited by the chip area although the integration level is improved, and the frame rate is not greatly improved.
Disclosure of Invention
The main object of the present invention is to overcome the drawbacks of the prior art and to provide a high frame rate image sensor based on 3D stacking.
To achieve the above objective, the present invention provides a 3D stacked image sensor, which includes a pixel array, an analog-to-digital conversion unit array and a memory array. The image sensor consists of an upper layer chip and a lower layer chip which are stacked up and down; the pixel array comprises a plurality of pixel units, is used for converting optical signals into analog electric signals and is positioned on the upper layer chip; the analog-to-digital conversion unit array comprises a plurality of analog-to-digital conversion units, is used for converting the analog electric signals into digital electric signals and is positioned on the lower chip; the memory array comprises a memory cell array and a logic circuit array, wherein the memory cell array comprises a plurality of memory cells for storing the digital electric signals, and the logic circuit array comprises a plurality of logic circuits for controlling reading and writing of the plurality of memory cells; the memory cell array is located on the upper chip and below the pixel array, and the logic circuit array of the memory array is located on the upper chip or the lower chip.
Preferably, the memory cell array is epitaxially grown under the pixel array by a back-illuminated process.
Preferably, each pixel unit corresponds to one analog-to-digital conversion unit and one memory, and each memory comprises at least one storage unit and at least one logic circuit.
Preferably, the memory cell is a resistance change memory cell.
Preferably, the logic circuit array of the memory array is located on the upper chip, and the logic circuit array is connected with the analog-to-digital conversion unit array through hybrid bonding.
Preferably, the logic circuit array of the memory array is located on the lower chip, and the logic circuit array is connected with the memory cell array through hybrid bonding.
Preferably, the pixel array is connected to the analog-to-digital conversion unit array by hybrid bonding.
Preferably, the lower chip further includes a first driving circuit, configured to drive each logic circuit of the memory array to be turned on simultaneously, so that each digital electrical signal converted by the analog-to-digital conversion unit array is output to the memory unit array in parallel.
Preferably, the lower chip further comprises: the second driving circuit is used for driving each pixel unit and converting received optical signals into analog electric signals; and a third driving circuit for driving each of the analog-to-digital conversion units while converting each of the analog electrical signals into a digital electrical signal.
Compared with the prior art, the 3D stacked image sensor forms the memory array on the back surface of the upper layer chip, and the digital electric signals after analog-to-digital conversion can be directly stored in the memory array, so that the exposure of the subsequent frame image is not influenced. Furthermore, because the memory array is epitaxially grown on the back surface of the upper chip through a back-illuminated process, a separately arranged memory chip is not required, and the manufacturing process is simpler. Furthermore, the pixel units, the analog-to-digital conversion units and the memories are in one-to-one correspondence, so that one frame of image data can be transmitted at the same time, and the frame rate of the image sensor is greatly improved.
Drawings
FIG. 1 is a schematic diagram of a 3D stacked image sensor of the prior art;
FIG. 2 is a schematic structural diagram of a 3D stacked image sensor according to an embodiment of the invention;
fig. 3 is a schematic connection diagram of an upper chip and a lower chip of a 3D stacked image sensor according to an embodiment of the invention;
FIG. 4 is a schematic diagram illustrating connection between an upper chip and a lower chip of a 3D stacked image sensor according to another embodiment of the invention;
FIG. 5 is a signal connection diagram of a 3D stacked image sensor according to an embodiment of the invention;
FIG. 6 is a schematic diagram illustrating an operating state of a 3D stacked image sensor according to an embodiment of the invention;
FIG. 7 is a schematic diagram of a single pixel 10-bit ADC single-value storage of a 3D stacked image sensor according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a single pixel 10-bit ADC single-value storage of a 3D stacked image sensor according to another embodiment of the present invention.
Detailed Description
In order to make the contents of the present invention more comprehensible, the present invention is further described below with reference to the accompanying drawings. The invention is of course not limited to this particular embodiment, and general alternatives known to those skilled in the art are also covered by the scope of the invention.
The invention is described in further detail below with reference to figures 2-8 and specific examples. It should be noted that the drawings are in a simplified form and are not to precise scale, and are only used for conveniently and clearly achieving the purpose of assisting in describing the embodiment.
Referring to fig. 2, 3 and 4, fig. 2 is a schematic structural diagram of a 3D stacked image sensor according to an embodiment of the invention, fig. 3 is a schematic connection diagram of an upper chip and a lower chip of the 3D stacked image sensor according to the embodiment of the invention, and fig. 4 is a schematic connection diagram of an upper chip and a lower chip of the 3D stacked image sensor according to another embodiment of the invention. The 3D stacked image sensor is composed of two chips 11 and 12 stacked one on another, and includes a pixel array 21, an analog-to-digital conversion unit array 22, and a memory array 23. Wherein the pixel array 21 is located on the upper chip 11, and the pixel array includes a plurality of pixel units 211 for converting optical signals into analog electrical signals. The analog-to-digital conversion unit array 22 is located on the lower chip 12, and the analog-to-digital conversion unit array 22 includes a plurality of analog-to-digital conversion units 221 for converting analog electrical signals into digital electrical signals. Of course, other circuits may be provided on the lower chip, as will be further described below. The image sensor of the present invention also includes a memory array 23. The memory array 23 includes a memory cell array including a plurality of memory cells 231 for storing digital electrical signals and a logic circuit array including a plurality of logic circuits 232 for controlling reading and writing of the memory cells. In this embodiment, the memory cell is a resistance change memory cell RRAM. The resistance-variable memory unit is composed of special material layers, each memory unit can realize the change of resistance under the control of a specific voltage and current time sequence, and different resistance values are generated corresponding to different voltage signals through a logic circuit so as to realize the storage of 0 and 1. In this embodiment, the resistance change memory cell may be single-valued or multi-valued.
The memory cell array is positioned below the upper chip 11 and the pixel array. The logic circuit array may be located on an upper chip or a lower chip, and in the embodiment shown in fig. 3, the logic circuit array is located on the upper chip 11, that is, the entire memory array 23 is located in the upper chip.
As can be seen from the above, in the chip architecture stacked in two layers and stacked up and down in the prior art, the present invention forms a memory cell array on the back of the upper chip pixel array, and the digital electrical signal after analog-to-digital conversion can be directly stored in the memory cell array on the signal transmission path. Therefore, the data of the previous frame is directly stored in the memory cell array and then is slowly output from the memory cell array without spending long time to serially output signals from the analog-to-digital conversion unit in sequence, so that the operations of exposure, signal reading and the like of the next frame can be carried out in time, and the frame rate is improved. In a specific implementation process, the memory cell array can be epitaxially grown under the pixel array, for example, between any two metal layers under the pixel array through a BSI backside illumination process, and an additional memory chip is not required to be separately added, so that the wiring is more flexible, the process is simpler, and the manufacturing cost is lower. The lower chip may use conventional FSI front-lit technology to fabricate the analog-to-digital conversion cell array and logic circuit array and other circuits. The image sensor is manufactured through a 3D stacking process. The upper chip and the lower chip can be connected by adopting a hybrid bonding mode. Specifically, in fig. 3, the logic circuit array of the memory array is located on the upper chip, the logic circuit array is connected with the analog-to-digital conversion unit array through hybrid bonding, and the pixel array is connected with the analog-to-digital conversion unit array through hybrid bonding. The logic circuit array and the memory cell array are located on the upper chip and are connected by the existing on-chip connection mode, such as metal wire. In the embodiment shown in fig. 4, the logic circuit array of the memory array is located on the lower chip, the logic circuit array is connected with the memory cell array through hybrid bonding, and the pixel array is connected with the analog-to-digital conversion cell array through hybrid bonding. The analog-to-digital conversion unit array and the logic circuit array are both positioned on a lower chip and are connected in the conventional on-chip connection mode, such as a metal wire mode. The hybrid bonding described herein is a bonding process in which a metal and an insulator are simultaneously provided at a die bonding interface, and thus, a better bonding strength can be provided.
Although the positions of the logic circuit arrays are different and the connection modes of the parts in the upper and lower chips are different in the embodiments shown in fig. 3 and 4, the operation principles of the image sensor are the same. Specifically, the analog-to-digital conversion unit may include two parts, a comparison circuit and a quantization circuit, wherein the comparison circuit includes two input terminals and an output terminal, the two input terminals respectively receive the pixel unit signal and the reference voltage signal, a comparison result of the comparison circuit is output to the quantization circuit to be converted into a digital electrical signal, and finally the quantization circuit outputs the converted digital electrical signal. The storage unit stores digital electric signals obtained by conversion of the analog-to-digital conversion unit, and the logic circuit mainly comprises a read-write time sequence control module, a sensitive amplifier module, a power management subunit module and the like and is mainly responsible for signal writing and reading of the storage unit.
In a preferred embodiment of the present invention, each pixel unit corresponds to an analog-to-digital conversion unit and a memory, where the memory includes at least one storage unit and at least one logic circuit. Thus, one pixel unit, one analog-to-digital conversion unit, and one memory can be regarded as one sub-unit, and as shown in fig. 5, the image sensor can be regarded as an array of these sub-units. Each pixel unit 211 is connected to an analog-to-digital conversion unit 221, and each analog-to-digital conversion unit 221 is connected to a memory. Further, the lower chip also comprises a first driving circuit, a second driving circuit and a third driving circuit. The first drive circuit is used for driving all logic circuits of the memory array to be conducted simultaneously so as to enable all digital electric signals converted by the analog-to-digital conversion unit array to be output to the memory unit array in parallel; the second driving circuit is used for driving each pixel unit and converting the received optical signals into analog electric signals; the third driving circuit is used for driving each analog-to-digital conversion unit and converting each analog electric signal into a digital electric signal. Therefore, all the subunits can work simultaneously, and the working efficiency of the image sensor is remarkably improved.
In the present invention, the driving signals of the pixel units may be independent, or may be partially or completely connected together. The independent wiring of the driving signals can make the use of the image sensor more flexible, and in this connection mode, each pixel unit needs one first driving circuit, namely, the number of the first driving circuits is the same as that of the pixel units. However, the first driving circuit occupies a large area of the lower chip. The driving signals of the pixel units can be connected together, all the pixel units of the pixel array can be exposed and read at the same time, and in the connection mode, the whole pixel array only needs one first driving circuit, but the first driving circuit needs enough driving capability. The driving of the pixel units can also be partially connected in groups, in which the number of the first driving circuits required for the whole pixel array is equal to the number of groups of driving, which is a compromise between driving capability and area, but in the case of group driving, different groups of timing matching should be required. Similarly, the driving signals of the analog-to-digital conversion units of the lower chip can be independent, can be all connected together, and can also be driven in groups. The driving signals need more second driving circuits independently, the driving signals need a second driving circuit with larger driving capability when being connected together, and the driving signals need to be connected in groups to ensure the matching of driving time sequences among different groups. The number of the third driving circuits of the memory array of the lower chip may also be set to one, the same as the number of the memories, or multiple groups according to the requirement, which is not described herein.
Referring to fig. 6, it is a schematic diagram showing the operation state of the image sensor, since the image sensor can be regarded as an array of a plurality of sub-units working simultaneously, the operation state of the image sensor is the same as that of a single sub-unit. The operation state of one sub-unit can be divided into 3 stages, namely exposure, frame front and signal readout, assuming that the exposure time is T _ exp, the frame front time is T _ fot, and the signal readout time of one pixel unit is T _ row, then the total time for reading out one frame of signal is T _ total ═ T _ exp + T _ fot + T _ row, and the frame rate is Fps ═ 1/T _ total. If the number of rows of the pixel array is N, the time for reading a frame of signal in the conventional common structure is T _ total ═ T _ exp + T _ fot + N × T _ row, but in the present invention, all the analog-to-digital converted digital electrical signals are stored in the memory array, and each memory, pixel unit, and analog-to-digital conversion unit have a one-to-one correspondence relationship, and each sub-unit operates synchronously, and these digital electrical signals are all output to the memory array in parallel at the same time, and as can be seen by comparison, the total time for reading a frame of signal is T _ total ═ T _ exp + T _ fot + T _ row. Compared with the prior art, the invention greatly shortens the total time of one frame.
Because only 0 or 1 voltage state needs to be stored in the invention, no matter the resistance change type memory cell is a single-value memory cell or a multi-value memory cell, each bit of the digital electric signal output by the analog-to-digital conversion unit is connected with one resistance change type memory cell. The number of memory cells in each memory is determined by the number of bits of the analog-to-digital conversion unit. Therefore, the converted digital electric signals can be written into the resistance change type memory cells in a parallel mode, and the total writing time is short. It is noted that the memory cells and logic circuits in each memory may or may not be in a one-to-one correspondence. For example, in some embodiments, the same logic may control all memory cells in a memory to store bits of a digital electrical signal in parallel. Referring to fig. 7 and 8, the resistance change type memory cell is single-valued, the analog-to-digital conversion unit has 10 bits (10 bits), and the pixel signal output by the analog-to-digital conversion unit is D [11:1], where D [10:1] is the digital electrical signal converted by the analog-to-digital conversion unit, and the most significant bit D [11] is a sign bit. The memory comprises 11 resistive random access memory cells which are marked as S1-S11. The logic circuit controls writing D [11:1] into S1-S11. When the pixel signal needs to be read out, the logic circuit is set to a read timing, thereby reading out the pixel data of each memory.
In summary, the 3D stacked image sensor of the present invention forms a memory array on the back surface of the upper chip, and the digital electrical signal after analog-to-digital conversion can be directly stored in the memory array, so that the exposure of the subsequent frame image is not affected. Furthermore, because the memory array is epitaxially grown on the back surface of the upper chip through a back-illuminated process, a memory chip does not need to be separately arranged, and the manufacturing process is simpler. Furthermore, the pixel units, the analog-to-digital conversion units and the memories are in one-to-one correspondence, so that one frame of image data can be transmitted at the same time, and the frame rate of the image sensor is greatly improved.
Although the present invention has been described with reference to preferred embodiments, it is to be understood that the foregoing is illustrative and not restrictive, and that various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. A3D stacked image sensor includes a pixel array, an analog-to-digital conversion unit array, and a memory array,
the image sensor consists of an upper layer chip and a lower layer chip which are stacked up and down;
the pixel array comprises a plurality of pixel units, is used for converting optical signals into analog electric signals and is positioned on the upper layer chip;
the analog-to-digital conversion unit array comprises a plurality of analog-to-digital conversion units, is used for converting the analog electric signals into digital electric signals and is positioned on the lower chip;
the memory array comprises a memory cell array and a logic circuit array, wherein the memory cell array comprises a plurality of memory cells for storing the digital electric signals, and the logic circuit array comprises a plurality of logic circuits for controlling reading and writing of the plurality of memory cells; wherein the memory cell array is located on the upper chip and below the pixel array, and the logic circuit array of the memory array is located on the upper chip or the lower chip;
the storage unit is a resistance change type storage unit, and the storage unit array is epitaxially grown below the pixel array through a back-illuminated process.
2. The image sensor of claim 1, wherein each pixel unit corresponds to an analog-to-digital conversion unit and a memory, and each memory comprises at least one storage unit and at least one logic circuit.
3. The image sensor of claim 1, wherein the logic circuit array of the memory array is located on the upper chip, and the logic circuit array is connected with the analog-to-digital conversion unit array by hybrid bonding.
4. The image sensor of claim 1, wherein the logic circuit array of the memory array is located on the lower chip, and the logic circuit array is connected to the memory cell array by hybrid bonding.
5. The image sensor of claim 1, wherein the array of pixels is connected to the array of analog-to-digital conversion units by hybrid bonding.
6. The image sensor of claim 1, further comprising a first driving circuit in the lower chip for driving the logic circuits of the memory array to be turned on simultaneously so that the digital electrical signals converted by the analog-to-digital conversion unit array are output to the memory unit array in parallel.
7. The image sensor of claim 6, wherein the lower chip further comprises:
the second driving circuit is used for driving each pixel unit and converting received optical signals into analog electric signals; and
and the third driving circuit is used for driving each analog-to-digital conversion unit and simultaneously converting each analog electric signal into a digital electric signal.
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| US8890047B2 (en) * | 2011-09-21 | 2014-11-18 | Aptina Imaging Corporation | Stacked-chip imaging systems |
| WO2015157341A1 (en) * | 2014-04-07 | 2015-10-15 | Samsung Electronics Co., Ltd. | High resolution, high frame rate, low power image sensor |
| CN105355621B (en) * | 2015-11-26 | 2018-05-29 | 上海集成电路研发中心有限公司 | A kind of stack imaging sensor |
| US9749569B2 (en) * | 2015-12-22 | 2017-08-29 | Omnivision Technologies, Inc. | High speed rolling image sensor with ADM architecture and method of implementing thereof |
| CN109155324B (en) * | 2016-03-15 | 2024-01-05 | 达特茅斯学院 | Stacked backside illuminated metrology image sensor with clustered parallel readout |
| CN106098714B (en) * | 2016-06-07 | 2019-06-07 | 上海集成电路研发中心有限公司 | Back-illuminated type overall situation exposing pixels cellular construction and manufacturing method |
| FR3057395A1 (en) * | 2016-10-07 | 2018-04-13 | Stmicroelectronics (Crolles 2) Sas | IMAGE SENSOR WITH BACKLIGHT LIGHT |
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