CN109595479A - Floodlight type semiconductor lighting wick structure and lamps and lanterns - Google Patents
Floodlight type semiconductor lighting wick structure and lamps and lanterns Download PDFInfo
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- CN109595479A CN109595479A CN201910116253.8A CN201910116253A CN109595479A CN 109595479 A CN109595479 A CN 109595479A CN 201910116253 A CN201910116253 A CN 201910116253A CN 109595479 A CN109595479 A CN 109595479A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 241001465382 Physalis alkekengi Species 0.000 title claims abstract description 38
- 238000004020 luminiscence type Methods 0.000 claims abstract description 86
- 239000000919 ceramic Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 29
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 238000009792 diffusion process Methods 0.000 claims description 6
- 230000005496 eutectics Effects 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 20
- 238000009826 distribution Methods 0.000 abstract description 6
- 238000013461 design Methods 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003760 hair shine Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 230000036544 posture Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V1/00—Shades for light sources, i.e. lampshades for table, floor, wall or ceiling lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention relates to a kind of floodlight type semiconductor lighting wick structure and lamps and lanterns, lamps and lanterns include floodlight type semiconductor lighting wick structure and lampshade, and floodlight type semiconductor lighting wick structure includes radiating piece, luminescence component, shading piece and light part out.By luminescence component, light part, radiating piece and shading piece are integrated into a mould group out, and structure is simple, which is fitted to each other, and realize the miniaturization of mould group.The heat of luminescence component is distributed by radiating piece, good radiate can ensure that the Miniaturization Design of luminescence component, shading piece shelters from luminescence component simultaneously, it avoids generating and dazzle the eyes, the light that luminescence component issues enters cavity and is projected by going out light part, reduces light-emitting surface, improves optical density, light light type is good out, and then facilitates more reasonable light distribution.The suitability of mould group application end is also improved simultaneously, makes application more extensive, during the manufacturing of lamps and lanterns, improves the degree of modularity of lamps and lanterns manufacture, and then can be improved the efficiency of lamps and lanterns production assembly.
Description
Technical field
The present invention relates to lighting technical fields, more particularly to a kind of floodlight type semiconductor lighting wick structure and lamps and lanterns.
Background technique
Lighting apparatus is all widely used in each field, and the current lighting apparatus degree of modularity is not high, portion
Part is more, and excessive component connection causes the heat dissipation performance of light source poor, causes larger difficulty to light type light distribution.And since illumination is set
Standby part dimension is larger, causes lighting apparatus to be difficult to reach micromation degree, and then influence the suitability of lighting apparatus.
Summary of the invention
Based on this, it is necessary in view of the above-mentioned problems, providing a kind of heat dissipation performance for effectively improving lighting apparatus and suitability
Floodlight type semiconductor lighting wick structure and lamps and lanterns.
A kind of floodlight type semiconductor lighting wick structure, comprising:
Radiating piece；
Luminescence component, the luminescence component are set on the radiating piece；
Light part out, the light part out has cavity, and one end of the light part out is the open end being connected to the cavity,
The open end is located on the luminescence component；And
Shading piece offers fixation hole on the shading piece, and the shading piece is connect with the radiating piece, it is described go out light part
It is pierced by the shading piece by the fixation hole, the luminescence component, light part, radiating piece and shading piece are integrated into a mould out
Group.
Above-mentioned floodlight type semiconductor lighting wick structure, by by luminescence component, go out light part, radiating piece and shading piece integrate
For an individual mould group, structure is simple, which is fitted to each other, and realizes the miniaturization of mould group, the heat of luminescence component
It is effectively distributed by radiating piece, good heat dissipation performance can ensure that the Miniaturization Design of luminescence component, while shading piece will
Luminescence component shelters from, and avoids generating and dazzle the eyes, and the light that luminescence component issues enters cavity and projected by going out light part, reduces and shines
Face, so that light utilization efficiency is improved, optical density is improved, and light light type is good out, and then facilitates more reasonable light distribution.It is above-mentioned general
Light type semiconductor lighting wick structure improves the suitability of mould group application end, makes application more extensive, in the manufacturing of lamps and lanterns
In the process, the degree of modularity of lamps and lanterns manufacture is improved, and then can be improved the efficiency of lamps and lanterns production assembly.Pass through floodlight type half
The lamps and lanterns that conductor illumination wick structure is formed enable to the brightness of specific illumination region or particular visual target much higher than other
Target and neighboring area.
The luminescence component welding or eutectic are on the radiating piece in one of the embodiments,.
The light part out is in the form of a column in one of the embodiments,；The inner wall of the cavity is equipped with diffusion structure.
The open end outer wall of the light part out is equipped with boss in one of the embodiments, and the shading piece is pressed on
On the boss；Or
It is provided with external screw thread on the outer wall of the open end of light part out, interior spiral shell is provided on the inner wall of the fixation hole
Line, the light part out are connect by the external screw thread with the screw-internal thread fit with the shading piece.
The luminescence component includes ceramic substrate and multiple LED light in one of the embodiments, and the LED light is fixed
On the ceramic substrate, the radiating piece is ceramic heat-dissipating part, and the ceramic substrate is connect with the ceramic heat-dissipating part.
The ceramic substrate is flat in one of the embodiments, is set on the ceramic heat-dissipating part；Or
The ceramic substrate is erected on the ceramic heat-dissipating part.
Extended cavity is offered on the radiating piece in one of the embodiments, the extended cavity is used to accommodate extension
Radiator structure.
The extended cavity is opened in the radiating piece towards on the end face of the shading piece in one of the embodiments,
The shading piece can cover the extended cavity.
Threading hole is offered on end face of the radiating piece far from the luminescence component in one of the embodiments, institute
It states threading hole and is through to the radiating piece towards the end face of the shading piece.
A kind of lamps and lanterns, comprising:
Floodlight type semiconductor lighting wick structure as described above；And
Lampshade, the lampshade have accommodating chamber, and the lampshade is connect with the shading piece, and the light part out is located at the appearance
It receives intracavitary.
Above-mentioned lamps and lanterns, by by luminescence component, go out light part, radiating piece and shading piece be integrated into an individual floodlight type partly
Conductor illuminates the mould group of wick structure, and structure is simple, which is fitted to each other, and realizes the miniaturization of mould group, luminescence component
Heat effectively distributed by radiating piece, good heat dissipation performance can ensure that the Miniaturization Design of luminescence component, hide simultaneously
Light part shelters from luminescence component, avoids generating and dazzle the eyes, and the light that luminescence component issues enters cavity and projected by going out light part, reduces
Light-emitting surface, so that light utilization efficiency is improved, optical density is improved, and light light type is good out, and then facilitates more reasonable light distribution.On
The suitability that floodlight type semiconductor lighting wick structure improves mould group application end is stated, makes application more extensive, in the production of lamps and lanterns
In manufacturing process, the degree of modularity of lamps and lanterns manufacture is improved, and then can be improved the efficiency of lamps and lanterns production assembly.Pass through floodlight
The lamps and lanterns that type semiconductor lighting wick structure is formed enable to specific illumination region or the brightness of particular visual target to be much higher than
Other targets and neighboring area.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the floodlight type semiconductor lighting wick structure in an embodiment；
Fig. 2 is the decomposition diagram of floodlight type semiconductor lighting wick structure shown in FIG. 1；
Fig. 3 is the cross-sectional view of radiating piece in Fig. 2；
Fig. 4 is the decomposition diagram of the floodlight type semiconductor lighting wick structure in another embodiment；
Fig. 5 is the structural schematic diagram of the shading piece in an embodiment；
Fig. 6 is the decomposition diagram of the connector in an embodiment.
Description of symbols:
10, floodlight type semiconductor lighting wick structure, 100, radiating piece, the 110, second connecting hole, 120, extended cavity, 130,
Radiating fin, 140, threading hole, 150, accommodating cavity, 160, fixing groove, 170, convex block, 200, luminescence component, 210, ceramic substrate,
220, LED light, 300, shading piece, 310, fixation hole, the 320, first connecting hole, 330, mounting groove, 340, card slot, 400, go out light
Part, 410, cavity, 420, open end, 430, boss, 500, connector, 510, mounting hole, 520, hook, the 530, first connection
Portion, the 531, first half slot, 532, chuck, the 533, first dowel, 540, second connecting portion, the 541, second half slot, 542,
Hook body, the 543, second dowel.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case where violating intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not offered as being unique embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Each technical characteristic of embodiment described above can carry out arbitrarily
Combination, for simplicity of description, it is not all possible to each technical characteristic in above-described embodiment combination be all described, so
And as long as there is no contradiction in the combination of these technical features, it all should be considered as described in this specification.
Fig. 1 and Fig. 2 is please referred to, the floodlight type semiconductor lighting wick structure 10 in an embodiment can effectively improve lamp
Have the degree of modularity of manufacture, improves the production assembly efficiency of lamps and lanterns.Specifically, floodlight type semiconductor lighting wick structure 10 wraps
Include radiating piece 100, luminescence component 200, shading piece 300 and light part 400 out.
Luminescence component 200 is set on radiating piece 100, and light part 400 has cavity 410 out, and one end of light part 400 is out
The open end 420 being connected with cavity 410, open end 420 are located on luminescence component 200, offer fixation on shading piece 300
Hole 310, shading piece 300 are connect with radiating piece 100, and light part 400 is pierced by shading piece 300 by fixation hole 310 out, radiating piece 100,
Luminescence component 200, shading piece 300 and light part 400 is integrated into a mould group out.
Above-mentioned floodlight type semiconductor lighting wick structure 10, by by radiating piece 100, luminescence component 200, shading piece 300
And light part 400 is integrated into an individual mould group out, structure is simple, which is fitted to each other, and realizes the miniaturization of mould group.
The heat of luminescence component 200 is effectively distributed by radiating piece 100, and good heat dissipation performance can ensure that luminescence component 200
Miniaturization Design, while shading piece 300 shelters from luminescence component 200, avoids generating and dazzle the eyes, the light that luminescence component 200 issues
It is projected into cavity 410 by going out light part 400, reduces light-emitting surface, so that light utilization efficiency is improved, optical density is improved,
Light light type is good out, and then facilitates more reasonable light distribution.Above-mentioned floodlight type semiconductor lighting wick structure 10 improves mould group application
The suitability at end makes application more extensive, during the manufacturing of lamps and lanterns, improves the degree of modularity of lamps and lanterns manufacture, into
And it can be improved the efficiency of lamps and lanterns production assembly.It is enabled to by the lamps and lanterns that floodlight type semiconductor lighting wick structure 10 is formed
The brightness of specific illumination region or particular visual target is much higher than other targets and neighboring area.
In one embodiment, it is provided with boss 430 on the outer wall of the open end 420 of light part 400 out, shading piece 300 is pressed on
On boss 430.By the way that boss 430 is arranged in the open end 420 of light part 400 out, shading piece 300 is installed on radiating piece 100 i.e.
It may make and the pressure of boss 430 is set on radiating piece 100, make to show that light part 400 and the installation of radiating piece 100 are more stable, out light
Part 400 and the connection of radiating piece 100 are more convenient.
Specifically, boss 430 is shaped in out on the outer wall of 400 open end 420 of light part.By the one of boss 430 at
Type is further simplified out the processing technology of light part 400 on the outer wall of light part 400 out, reduces out the cost of light part 400.
Further, light part 400 can be plastic parts out.Certainly, light part 400 can also be glass workpiece out, as long as can
Luminescence component 200 is covered, so that luminescence component 200 shines by going out light part 400.
In another embodiment, be provided with external screw thread on the outer wall of the open end 420 of light part 400 out, fixation hole 310 it is interior
Internal screw thread is provided on wall, light part 400 is connect by external screw thread with screw-internal thread fit with shading piece 300 out.Light part 400 passes through out
It is threadedly connected in the fixation hole 310 of shading piece 300, shading piece 300 is installed on radiating piece 100, can will be gone out light part 400 and be pacified
Loaded on radiating piece 100, the dismounting of light part 400 Yu shading piece 300 is facilitated out.
Certainly, in other embodiments, light part 400 can also be directly cemented in the fixation hole 310 of shading piece 300 out,
Or be directly connected on radiating piece 100, as long as enabling to luminescence component 200 to be located in cavity 410, by going out light part 400
It shines.
In one embodiment, light part 400 is column structure out, and the inner wall of cavity 410 is equipped with diffusion structure.By above-mentioned
The point light source of luminescence component 200 or area source can be become the luminous three-dimensional light source of cylinder by light part 400 out, complete to reach 360 °
All light-out effects efficiently solve the problems, such as the light emitting angle limitation of 200 light source of luminescence component.And it is advantageous by diffusion structure
Go out the light type of light by going out light part 400 in luminescence component 200, and then is conducive to light distribution.Specifically, diffusion structure can be coating
Layer structure on the inner wall of cavity 410, or other can be realized the structure of diffusion.
In one embodiment, the first connecting hole 320 is offered on shading piece 300, radiating piece 100 offer the second connecting hole
110, the connection corresponding with the first connecting hole 320 of the second connecting hole 110.By attachment screw be arranged in the first connecting hole 320 with
In second connecting hole 110, so that shading piece 300 is fixed on radiating piece 100.Facilitate shading piece 300 by above-mentioned connection type
Relative to the dismounting on radiating piece 100.
Certainly, in other embodiments, shading piece 300 can also be directly cemented on radiating piece 100, or pass through its other party
Formula is fixed on radiating piece 100, as long as enabling to show that light part 400 is installed on radiating piece 100 by shading piece 300.
In the present embodiment, shading piece 300 is plastic parts.Radiating piece is installed on by shading piece 300 due to going out light part 400
On 100, shading piece 300 uses plastic parts, and it is really up to the mark to avoid shading piece 300, and light part 400 or hair are broken out during installation
Optical assembly 200.
Certainly, in other embodiments, shading piece 300 can also be metalwork, as long as light part 400 is enabled to out to pass through
Shading piece 300 is installed on radiating piece 100.
Also referring to Fig. 3, optionally, extended cavity 120 is offered on radiating piece 100, extended cavity 120 is for accommodating extension
Radiator structure.It, can be by the heat of luminescence component 200 by radiating piece 100 since luminescence component 200 is main heater element
It distributes.Due to current material limitation or cost the considerations of, the heat dissipation performance of radiating piece 100 will receive certain limit
System facilitates by the way that extended cavity 120 is arranged and accommodates the better radiator structure of heat dissipation performance, further increase the heat dissipation of radiating piece 100
Performance.
Specifically, extended cavity 120 is opened in radiating piece 100 towards on the surface of shading piece 300, and shading piece 300 can cover
Lid extended cavity 120.Since shading piece 300 can cover extended cavity 120, when the radiator structure of extension is set to extended cavity
When in 120, extended cavity 120 is covered by shading piece 300, so that the radiator structure of extension is effectively fixed in extended cavity 120, is kept away
Exempt from the radiator structure for increasing the fixed extension of other shading pieces 300.
Further, the extended cavity 120 of radiating piece 100 is multiple, the setting of multiple intervals of extended cavity 120.And then it can be same
100 structure of radiating piece of the multiple extensions of Shi Rongna.
Certainly, in other embodiments, extended cavity 120 can not also be opened up on radiating piece 100, only by radiating piece
100 itself radiate to luminescence component 200.
In one embodiment, multiple spaced radiating fins 130 are formed on the outer wall of radiating piece 100.It is dissipated by being arranged
Hot wing 130 can further increase the heat dissipation performance of radiating piece 100, and then further transfer out the heat of luminescence component 200
It goes.Specifically, radiating fin 130 can be arranged along the circumferencial direction interval of radiating piece 100, it is of course also possible to along radiating piece 100
The setting of axis direction interval.
In one embodiment, radiating piece 100 offers threading hole 140, threading hole 140 on the end face far from luminescence component 200
Radiating piece 100 is through to towards the end face of shading piece 300.The company of luminescence component 200 Yu power supply can be facilitated by threading hole 140
It connects.Specifically, threading hole 140 is two, is opened in the opposite facing two sides of luminescence component 200 respectively, further facilitates luminous
The conducting wire of component 200 passes through threading hole 140 and connects power supply.Certainly, in other embodiments, threading hole 140 can also be one
Or it is multiple, as long as the conducting wire of luminescence component 200 can be facilitated to pass through threading hole 140.
In one embodiment, radiating piece 100 offers accommodating cavity 150, accommodating cavity 150 on the surface far from luminescence component 200
For accommodating the devices such as power supply.Wherein, threading hole 140 is connected with accommodating cavity 150, and luminescence component 200 is facilitated to be connected to power supply
On equal devices.
In one embodiment, fixing groove 160 is offered on radiating piece 100, luminescence component 200 is embedded in fixing groove 160.It is logical
Crossing setting fixing groove 160 can facilitate luminescence component 200 to be embedded on radiating piece 100, and then luminescence component 200 is facilitated to be connected to
On radiating piece 100.Specifically, fixing groove 160 is opened in radiating piece 100 towards the side of shading piece 300.When shading piece 300 is pacified
When loaded on radiating piece 100, fixing groove 160 is enabled to correspond to fixation hole 310, so that luminescence component 200 can have
Effect is located in light part 400.
In one embodiment, the welding of luminescence component 200 or eutectic are on radiating piece 100.Specifically, luminescence component 200 welds
Or eutectic is in fixing groove 160.By welding luminescence component 200 or eutectic is in radiating piece 100, luminescence component can be reduced
Thermal resistance between 200 and radiating piece 100, it is ensured that 200 heat of luminescence component is oriented to the unimpeded of radiating piece 100.
In one embodiment, 200 tin cream of luminescence component is welded on radiating piece 100.Certainly, in other embodiments, shine group
Part 200 can also be set to by other means on radiating piece 100, as long as the heat of luminescence component 200 is enabled effectively to pass
It is delivered on radiating piece 100.
Specifically, luminescence component 200 includes ceramic substrate 210 and multiple LED light 220, and multiple LED light 220 are fixed on pottery
Porcelain substrate 210, radiating piece 100 are ceramic heat-dissipating part, and ceramic substrate 210 is connect with ceramic heat-dissipating part.By ceramic substrate 210 with
The connection of ceramic heat-dissipating part can further improve the heat dissipation effect of LED light 220.
Further, LED light 220 is directly formed on ceramic substrate 210 by circuit manufacture procedure, to meet smaller shine
The production of the luminescence component 200 of face or approximate point light source.Luminous intensity can effectively be increased, improve light utilization efficiency, reduction is matched
Light difficulty.Ceramic substrate 210 has good heat dissipation effect simultaneously, and then can effectively be transferred to the heat of LED light 220 scattered
On warmware 100.
In traditional technique, SMT (Surface Mount Technology, surface mounting technology) technique forms luminous
Then luminescence component is connect by way of bonding or mechanical fasteners with radiating piece by component.Lead to the machine of heat dissipation Joint failure
Rate is big, and therefore, the light source power of single luminous point is limited, and then the quantity that will lead to single luminous point light source increases, shape ruler
Very little big, processing cost increases or luminous intensity is not high, and light utilization efficiency is low.And floodlight type semiconductor lighting wick structure 10 is logical
It crosses and welds luminescence component 200 or eutectic is in radiating piece 100 can effectively reduce thermal resistance, while LED light 220 is directly passed through into electricity
Road processing procedure is formed on ceramic substrate 210, further decreases the size of luminescence component 200, and then can effectively reduce floodlight type
The overall dimensions of semiconductor lighting wick structure 10, to meet the application of lamps and lanterns under more scenes.
In the present embodiment, luminescence component 200 is further located in the fixation hole 310 of shading piece 300.Pass through fixation hole
310 can play certain shaded effect to luminescence component 200, reduce the unfavorable factor of dazzle, and human eye is avoided to look at straight to luminous
Component 200 plays the effect of eyeshield.
Specifically, the ceramic substrate 210 of luminescence component 200 is flat is set on radiating piece 100.Further, luminescence component 200
Ceramic substrate 210 it is flat be set to fixing groove 160 in so that shading piece 300 can effectively block LED light 220, avoid dazzle
Generation, while effectively enhancing ceramic substrate 210 to radiating piece 100 conduct heat efficiency.
Further, the size of fixing groove 160 and the size on 210 surface of ceramic substrate match, ceramic basic to facilitate
Can effectively it be arranged in fixing groove 160.
Referring to Fig. 4, the light-focusing type semiconductor lighting wick structure 10 in another embodiment, luminescence component 200 includes pottery
Porcelain substrate 210 and multiple LED light 220, multiple LED light 220 are set on ceramic substrate 210.Wherein, ceramic substrate 210 is stood on
On radiating piece 100, so that luminescence component 200 is located in the cavity 410 of light part 400, more stand on to form 360 ° of complete cycles
Light-out effect.
Certainly, in other embodiments, luminescence component 200 can also be set on radiating piece 100 with other postures, can only
Enough so that luminescence component 200 is located in light part 400.
Further, the size of fixing groove 160 and the size of the cross section of ceramic substrate 210 match, to facilitate ceramics
Substrate 210 can be inserted in fixing groove 160.
In one embodiment, radiating piece 100 towards convex block 170 is formed on the surface of luminescence component 200, open by fixing groove 160
On convex block 170.The depth of fixing groove 160 can be effectively increased by the way that convex block 170 is arranged, so that ceramic substrate 210
It is more stably placed in fixing groove 160, while effectively increasing the contact area of ceramic substrate 210 Yu radiating piece 100, improve
Radiating efficiency.
Radiating piece 100 in another embodiment, convex block can also be formed in radiating piece 100 back on luminescence component 200
On surface.Fixing groove 160 is opened on the surface of radiating piece 100, is further opened on convex block, to increase fixing groove 160
Depth.
Certainly, in other embodiments, luminescence component 200 can also be set on radiating piece 100 with other postures, can only
Enough so that luminescence component 200 is located in light part 400.
Above-mentioned floodlight type semiconductor lighting wick structure 10 can be applied in lamps and lanterns, the lamps and lanterns in an embodiment, including
Floodlight type semiconductor lighting wick structure 10 and lampshade.Lampshade has accommodating chamber, and lampshade is connect with shading piece 300, out light part 400
In accommodating chamber.Lamps and lanterns are formed and then lampshade is set outside light part 400 out, wherein lampshade can be according to usage scenario
It is different and be arranged.
The mounting assembly of original lamps and lanterns is effectively optimized for two portions by above-mentioned floodlight type semiconductor lighting wick structure 10
Part, i.e. floodlight type semiconductor lighting wick structure 10 and lampshade effectively improve the mould of lamps and lanterns so that the simple for structure of lamps and lanterns is illustrated
Block degree, the manufacture so that lamps and lanterns are easily accomplished scale production.The production assembly efficiency and yields of lamps and lanterns are improved simultaneously.Together
When, 10 perfect heat-dissipating of floodlight type semiconductor lighting wick structure, suitability is strong, size is small, so that floodlight type semiconductor lighting
Wick structure 10 it is more adaptable, and then increase effectively the design space of lamps and lanterns.
In one embodiment, towards mounting groove 330 is offered on the surface of luminescence component 200, lampshade can be consolidated shading piece 300
Due in mounting groove 330, and then form lamps and lanterns.Specifically, lampshade can be directly adhered in mounting groove 330.Alternatively, mounting groove
There is internal screw thread in society on 330 inner wall, and external screw thread is provided on the outer wall of lampshade, and lampshade is threadably secured in shading piece 300
On.
Also referring to Fig. 5 and Fig. 6, in another embodiment, lamps and lanterns further include connector 500, are also opened on shading piece 300
Equipped with mounting groove 330, lampshade is installed in mounting groove 330 by connector 500.It is further facilitated by the way that connector 500 is arranged
Lampshade is fixed on shading piece 300.
Specifically, one end of lampshade is fixing end, is formed with mounting plate on the outer wall of fixing end, is formed on connector 500
There is mounting hole 510, fixing end is arranged in mounting hole 510, and mounting plate can be pressed and is set in mounting groove 330 by connector 500.Pass through
The mounting plate of lampshade, lampshade can be effectively fixed on shading piece 300 by connector 500, so that the company of lampshade and shading piece 300
It connects more convenient.
Further, the size of mounting hole 510 and the size of fixing end match, so that lampshade can more steadily be set
It is placed in mounting hole 510, avoids lampshade relative to 300 activity of shading piece.
Optionally, card slot 340 is offered on the inner wall of mounting groove 330, the side of connector 500 towards shading piece 300 is set
It is equipped with hook 520, hook 520 can be arranged in card slot 340.When the hook 520 of connector 500 is arranged in card slot 340,
The mounting plate pressure of lampshade is set in mounting groove 330 simultaneously, further facilitates the installation of lampshade Yu shading piece 300.
Optionally, connector 500 includes first connecting portion 530 and second connecting portion 540, first connecting portion 530 and second
Interconnecting piece 540 is semicircle shape structure.The first half slot 531 is offered in first connecting portion 530, is opened up in second connecting portion 540
There is the second half slot 541, first connecting portion 530 is oppositely arranged with second connecting portion 540, so that the first half slot 531 and second
Half slot 541 surrounds mounting hole 510 jointly.The fixation of lampshade can be facilitated by first connecting portion 530 and second connecting portion 540
End is arranged in mounting hole 510.
Specifically, it is formed with chuck 532 in first connecting portion 530, is formed in second connecting portion 540 and hooks body 542, hooks body
542, which can correspond to hook, is set in chuck 532, so that first connecting portion 530 opposite can be connect with second connecting portion 540.Into one
Step ground, the opposite both ends of first connecting portion 530 have been respectively formed on chuck 532, and the opposite both ends of second connecting portion 540 are respectively formed on
There is hook body 542 corresponding with chuck 532, hooks corresponding hook of body 542 and be set in chuck 532, so that first connecting portion 530 and second
Interconnecting piece 540 more steadily connects.
In one embodiment, first connecting portion 530 is towards being also formed with the first dowel 533 on the surface of shading piece 300.It is logical
The structural strength of first connecting portion 530 can not only be reinforced by crossing the first dowel 533, by can be effectively by the mounting plate of lampshade
Pressure is set in mounting groove 330.
In one embodiment, second connecting portion 540 is towards being also formed with the second dowel 543 on the surface of shading piece 300.It is logical
The structural strength of second connecting portion 540 can not only be reinforced by crossing the second dowel 543, by can be effectively by the mounting plate of lampshade
Further pressure is set in mounting groove 330.
The surface of first connecting portion 530 and second connecting portion 540 towards shading piece 300 has been respectively formed on hook 520, hook
520 is corresponding with the card slot 340 on shading piece 300.So that first connecting portion 530 and second connecting portion 540 can be with shadings
Part 300 effectively connects.
In one embodiment, the quantity of hook 520 is multiple, multiple intervals of hook 520 setting, the quantity and card of card slot 340
The quantity of hook 520 is corresponding, and each hook 520, which can correspond to, to be arranged in a card slot 340, and then can effectively improve connector
500 stability installed on shading piece 300.
In the present embodiment, spaced hook 520 there are three being formed in first connecting portion 530, second connecting portion 540
There are three spaced hooks 520 for upper formation, so that first connecting portion 530 can steadily be set with second connecting portion 540
It is placed in mounting groove 330.Certainly, in other embodiments, the quantity of the hook 520 in first connecting portion 530 can also be two
A, other numbers such as four, as long as first connecting portion 530 is enabled to steadily to be set on shading piece 300.Second
The quantity of hook 520 on interconnecting piece 540 can also be two, four lamp other numbers, as long as enabling to the second connection
Portion 540 is steadily set on shading piece 300.
In one embodiment, lamps and lanterns further include lamp holder, and lamp holder is set to radiating piece 100 back on one end of lampshade.Shine group
Part 200 can be electrically connected on lamp holder by radiating piece 100.It can be powered by lamp holder for luminescence component 200.Certainly,
In other embodiments, lamp holder can also omit, and luminescence component 200 can be directly connected to power supply.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but not
It can therefore be construed as limiting the scope of the patent.It should be pointed out that for those of ordinary skill in the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection model of the invention
It encloses.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of floodlight type semiconductor lighting wick structure characterized by comprising
Radiating piece；
Luminescence component, the luminescence component are set on the radiating piece；
Light part out, the light part out has cavity, and one end of the light part out is the open end being connected to the cavity, described
Open end is located on the luminescence component；And
Shading piece offers fixation hole on the shading piece, and the shading piece is connect with the radiating piece, it is described go out light part pass through
The fixation hole is pierced by the shading piece, and the luminescence component, light part, radiating piece and shading piece are integrated into a mould group out.
2. floodlight type semiconductor lighting wick structure according to claim 1, which is characterized in that the luminescence component welding
Or eutectic is on the radiating piece.
3. floodlight type semiconductor lighting wick structure according to claim 1, which is characterized in that the light part out is in column
Shape；The inner wall of the cavity is equipped with diffusion structure.
4. floodlight type semiconductor lighting wick structure according to claim 1-3, which is characterized in that the light out
The open end outer wall of part is equipped with boss, and the shading piece is pressed on the boss；Or
It is provided with external screw thread on the outer wall of the open end of light part out, internal screw thread, institute are provided on the inner wall of the fixation hole
It states out light part and is connect by the external screw thread with the screw-internal thread fit with the shading piece.
5. floodlight type semiconductor lighting wick structure according to claim 1-3, which is characterized in that described to shine
Component includes ceramic substrate and multiple LED light, and the LED light is fixed on the ceramic substrate, and the radiating piece is that ceramics dissipate
Warmware, the ceramic substrate are connect with the ceramic heat-dissipating part.
6. floodlight type semiconductor lighting wick structure according to claim 5, which is characterized in that the ceramic substrate is flat to be set
In on the ceramic heat-dissipating part；Or
The ceramic substrate is erected on the ceramic heat-dissipating part.
7. floodlight type semiconductor lighting wick structure according to claim 1-3, which is characterized in that the heat dissipation
Extended cavity is offered on part, the extended cavity is used to accommodate the radiator structure of extension.
8. floodlight type semiconductor lighting wick structure according to claim 7, which is characterized in that the extended cavity is opened in
For the radiating piece towards on the end face of the shading piece, the shading piece can cover the extended cavity.
9. floodlight type semiconductor lighting wick structure according to claim 1-3, which is characterized in that the heat dissipation
Part offers threading hole on the end face far from the luminescence component, the threading hole is through to the radiating piece towards the shading
The end face of part.
10. a kind of lamps and lanterns characterized by comprising
Such as the described in any item floodlight type semiconductor lighting wick structures of claim 1-9；And
Lampshade, the lampshade have accommodating chamber, and the lampshade is connect with the shading piece, and the light part out is located at the accommodating chamber
It is interior.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910116253.8A CN109595479A (en) | 2019-02-15 | 2019-02-15 | Floodlight type semiconductor lighting wick structure and lamps and lanterns |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910116253.8A CN109595479A (en) | 2019-02-15 | 2019-02-15 | Floodlight type semiconductor lighting wick structure and lamps and lanterns |
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| CN109595479A true CN109595479A (en) | 2019-04-09 |
Family
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| CN201910116253.8A Pending CN109595479A (en) | 2019-02-15 | 2019-02-15 | Floodlight type semiconductor lighting wick structure and lamps and lanterns |
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