CN109553726A - A kind of light-cured resin, preparation method and photocuring part aftertreatment technology - Google Patents
A kind of light-cured resin, preparation method and photocuring part aftertreatment technology Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
- C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/01—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
- C08F283/065—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to unsaturated polyethers, polyoxymethylenes or polyacetals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
- C08F283/105—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule on to unsaturated polymers containing more than one epoxy radical per molecule
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Abstract
The present invention relates to a kind of 3D printing light-cured resin, the A material and B material that the mass ratio including independently saving before using is 2: 3-3: 2；A material includes the component of following parts by weight: 10-80 parts of acrylate, 1-10 parts of initiator As, 0.1-1 parts of defoaming agents, 0.1-1 parts of levelling agents, 10-70 portions of reactive diluents；B material includes the component of following parts by weight: 10-70 parts of thermosetting resins, 1-10 parts of initiator Bs, 0.1-1 parts of defoaming agents, 0.1-1 parts of levelling agents, 10-70 portions of reactive diluents；Initiator A is thermal initiator, and initiator B includes radical initiator.Resin of the invention carries out the processing of UV photocuring to photocuring part and heat cure is handled, so that photocuring part shows excellent mechanical property, and the surface effect of photocuring part is good, good stability of the dimension after stereolithography apparatus obtains photocuring part.
Description
Technical field
The present invention relates to a kind of light-cured resin, preparation method and Stereolithography techniques, belong to light-cured resin technology
Field.
Background technique
Stereolithography, which refers to, focuses on photo-curing material surface with the laser of specific wavelength and intensity, be allowed to by point to
Line completes the drawing performance of a level by line to face consecutive solidification, and then lifting platform is in the mobile synusia of vertical direction
Highly, another level of resolidification is layering constitutes a 3D solid in this way.In recent years, it is fast to have benefited from Stereo Lithography
Speed is molded over the extensive application in manufacturing industry, and market is consequently increased photosensitive resin quantity, type and quality.
Currently, the resin that can be applied to stereolithography apparatus is far from satisfying demand, mainly from American-European countries into
Mouthful, it is not only expensive, but also 3D printing light-cured resin in 3D printing using single photocuring mode, light after molding
Solidification part poor mechanical property (show brittleness is big, tensile strength is low, poor impact resistance), surface effect is poor, size is unstable etc.
Deficiency restricts always the development in photocuring 3D printing market, and since trade war influences, there is an urgent need to domestic enterprises to beat
Broken external monopolization, exploitation being capable of rapid curing and the 3D printing light-cured resins of excellent in mechanical performance in a short time.
Summary of the invention
The technical problem to be solved by the present invention is for solve poor mechanical property after the molding of existing 3D printing light-cured resin,
The technical problem that surface effect is poor, size is unstable provides a kind of light-cured resin, preparation method and Stereolithography technique.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of 3D printing light-cured resin, including the A material and B material independently saved before using, the A material and B object
The mass ratio of material is 2: 3-3: 2；The A material includes the component of following parts by weight: 10-80 parts of acrylate, 1-10 parts of initiations
Agent A, 0.1-1 part defoaming agent, 0.1-1 parts of levelling agents, 10-70 portions of reactive diluents；The B material includes the group of following parts by weight
Point: 10-70 parts of thermosetting resins, 1-10 parts of initiator Bs, 0.1-1 parts of defoaming agents, 0.1-1 parts of levelling agents, 10-70 parts of activity are dilute
Release agent；The initiator A is thermal initiator, and the initiator B includes radical initiator；The reactive diluent is with third
One or more of the monomer of enoate group, the monomer with vinyl, compound with maleimide base group.
Preferably, the acrylate be polyester acrylate, epoxy acrylate, aromatic urethane acrylate,
One or more of pure acrylate, methacrylate, polyether acrylate.
Preferably, the rotary viscosity of the acrylate is 500-8000mPa.s, and preferred rotary viscosity is 1000-
5000mPa.s。
Preferably, the thermosetting resin be cycloaliphatic epoxy resin, it is bisphenol A epoxide resin, bisphenol F epoxy resin, double
Phenol E epoxy resin polyurethane, phenolic resin, Lauxite, melamine resin, furane resins, organic siliconresin, poly- fourth
One or more of diene resin.
Preferably, the thermal initiator is dibenzoyl peroxide, cumyl peroxide, dicetyl peroxydicarbonate diisopropyl
Ester, azodiisobutyronitrile, persulfate, amines catalyst, anhydride catalyst, base metal catalysts, in organotin catalysts
One or more.
Preferably, the radical initiator is benzophenone, dimethoxybenzoin, chlorinated diphenyl ketone, 4- benzoyl
One or more of -4 ' of base-dimethyl diphenyl sulfide, 1- hydroxy-cyclohexyl ketone, 2,4- diethyl thioxanthone.
Preferably, the initiator B further includes cationic initiator, and the cationic initiator is diazonium salt, diaryl
One of salt compounded of iodine, triaryl sulfonium salts, alkyl sulfosalt, iron arene salt, sulfonyloxy ketone, triaryl silicon oxygen ether are several
Kind.
Preferably, the reactive diluent is 2- (1,2- hexamethylene -1,2- dihydroxy acid imide) ethyl propylene acid esters, ring
Trimethylolpropane dimethoxym ethane acrylate, 2- phenoxyethyl acrylate, iso-bornyl acrylate, methacrylic acid ring
One or more of ester, dipropylene glycol diacrylate, 1,9- nonanediol diacrylate.
Preferably, the defoaming agent is polyoxyethylene polyoxypropylene pentaerythrite ether, polyoxyethylene polyoxy propyl alcohol amidogen ether, gathers
One or more of oxypropylene glycerin ether, polyoxyethylene polyoxypropylene glycerin ether, dimethyl silicone polymer.
Preferably, the levelling agent is acrylic compounds levelling agent, silicone levelling agent and fluorocarbons class levelling agent
One or more of.
The present invention also provides a kind of preparation methods of above-mentioned light-cured resin, include the following steps:
Each component in A material is stirred mixing according to quality proportioning, while being heated, temperature of charge is kept to exist
10-100 DEG C of time is 15-150min, obtains A material；
Each component in B material is stirred mixing according to quality proportioning, while being heated, temperature of charge is kept to exist
10-100 DEG C of time is 15-150min, obtains B material.
The A material and B material that light-cured resin of the present invention is related to cannot be mixed before use, need to separate storage,
It is mixed when use by 2: 3-3: 2 mass ratio.
Above-mentioned light-cured resin further includes after carrying out to photocuring part after stereolithography apparatus obtains photocuring part
The technique of reason, the aftertreatment technology include the following steps:
The processing of UV photocuring: under the conditions of UV light intensity is 10-300mw, Uniform Irradiation 50-500s；
Heat cure processing: 1-20h is heat-treated under the conditions of starvation, temperature is controlled at 20-200 DEG C, preferred to use
The mode being gradually warmed up is heat-treated, and temperature is controlled at 60-180 DEG C, preferably a length of 2-12h when heating.
The beneficial effects of the present invention are:
3D printing light-cured resin of the invention includes pressing 2 when in use using the preceding A material and B material independently saved:
3-3: 2 mass ratio mixing, after stereolithography apparatus obtains photocuring part, to photocuring part carry out UV photocuring processing and
Heat cure processing, so that photocuring part shows excellent mechanical property and (shows good toughness, tensile strength height, impact resistance
By force), and the surface effect of photocuring part is good, good stability of the dimension, suitable for the production requirement of Stereo Lithography Apparatus Rapid Prototyping, just
In large-scale industrial production application, there is splendid market effect and economic value.
Specific embodiment
The present invention is described in further detail now.
Embodiment 1
The present embodiment provides a kind of 3D printing light-cured resins, including the A material and B material independently saved before using, institute
State the component that A material includes following parts by weight: 45 parts of aromatic urethane acrylates (rotary viscosity 3000mPa.s), 1 part
Cumyl peroxide, 0.5 part of polyoxyethylene polyoxypropylene glycerin ether, 0.1 part of acrylic compounds levelling agent, 30 parts of methacrylic acids
Cyclohexyl ester；The B material includes the component of following parts by weight: 70 parts of cycloaliphatic epoxy resins, 1 part of dimethoxybenzoin, and 0.5 part
Polyoxyethylene polyoxypropylene glycerin ether, 0.3 part of acrylic compounds levelling agent, 30 parts of methacrylic acid cyclohexyl esters.
The preparation method of the light-cured resin, includes the following steps:
Each component in A material is stirred mixing according to quality proportioning with the mixing speed of 500r/min, while into
Row heating, holding temperature of charge are 30min in 60 DEG C of time, obtain A material；
Each component in B material is stirred mixing according to quality proportioning with the mixing speed of 500r/min, while into
Row heating, holding temperature of charge are 30min in 60 DEG C of time, obtain B material.
After mixing by above-mentioned A material and B material 1:1 in mass ratio, static de-soak, then through SLA photocuring form2
(cured layer is with a thickness of 0.1mm, ultraviolet wavelength 400nm, laser power 750mW, laser scanning speed for the printing of 3d printer
Photocuring part 7500mm/s) is obtained, then by the post-treated technique of photocuring part, test sample, the aftertreatment technology packet is made
Include following steps:
The processing of UV photocuring: under the conditions of UV light intensity is 100mw, Uniform Irradiation 180s；
Heat cure processing: being heat-treated 10h under the conditions of starvation by the way of being gradually warmed up, and temperature is controlled in 20-
120℃。
Test sample is tested for the property using the test method of ASTM, specific performance such as table 1.
The performance test data table of 1 embodiment of table, 1 test sample
Embodiment 2
The present embodiment provides a kind of 3D printing light-cured resins, including the A material and B material independently saved before using, institute
State the component that A material includes following parts by weight: 60 parts of pure acrylates (rotary viscosity 2000mPa.s), 2 parts of zinc oxide, 0.6
Part polyoxyethylene polyoxypropylene pentaerythrite ether, 1 part of silicone levelling agent, 40 parts of 2- (1,2- hexamethylene -1,2- dihydroxy acyls
Imines) ethyl propylene acid esters；The B material includes the component of following parts by weight: 70 parts of phenolic resin, 2.3 parts of 1- hydroxy cyclohexylphenyls
Base ketone, 0.55 part of polyoxyethylene polyoxypropylene pentaerythrite ether, 0.35 part of silicone levelling agent, 40 parts of 2- (1,2- hexamethylenes
Alkane -1,2- dihydroxy acid imide) ethyl propylene acid esters.
The preparation method of the light-cured resin, includes the following steps:
Each component in A material is stirred mixing according to quality proportioning with the mixing speed of 500r/min, while into
Row heating, holding temperature of charge are 150min in 10 DEG C of time, obtain A material；
Each component in B material is stirred mixing according to quality proportioning with the mixing speed of 500r/min, while into
Row heating, holding temperature of charge are 150min in 10 DEG C of time, obtain B material.
After mixing by above-mentioned A material and B material 2:3 in mass ratio, static de-soak, then through SLA photocuring form2
(cured layer is with a thickness of 0.1mm, ultraviolet wavelength 400nm, laser power 750mW, laser scanning speed for the printing of 3d printer
Photocuring part 7500mm/s) is obtained, then by the post-treated technique of photocuring part, test sample, the aftertreatment technology packet is made
Include following steps:
The processing of UV photocuring: under the conditions of UV light intensity is 120mw, Uniform Irradiation 150s；
Heat cure processing: being heat-treated 8h under the conditions of starvation by the way of being gradually warmed up, and temperature is controlled in 50-
150℃。
Test sample is tested for the property using the test method of ASTM, specific performance such as table 2.
The performance test data table of 2 embodiment of table, 2 test sample
Embodiment 3
The present embodiment provides a kind of 3D printing light-cured resins, including the A material and B material independently saved before using, institute
State the component that A material includes following parts by weight: 80 parts of polyester acrylates (rotary viscosity 1000mPa.s), 1.5 parts of persulfuric acid
Ammonium, 0.6 part of polyoxyethylene polyoxy propyl alcohol amidogen ether, 0.35 part of fluorocarbons class levelling agent, 44 parts of ring trimethylolpropane first contractings
Aldehyde acrylate；The B material includes the component of following parts by weight: 50 parts of melamine resins, 2.8 parts of 2,4- diethyl
Thioxanthone, 0.45 part of polyoxyethylene polyoxy propyl alcohol amidogen ether, 0.46 part of fluorocarbons class levelling agent, 50 parts of ring trihydroxy methyls third
Alkane dimethoxym ethane acrylate.
The preparation method of the light-cured resin, includes the following steps:
Each component in A material is stirred mixing according to quality proportioning with the mixing speed of 500r/min, while into
Row heating, holding temperature of charge are 100min in 70 DEG C of time, obtain A material；
Each component in B material is stirred mixing according to quality proportioning with the mixing speed of 500r/min, while into
Row heating, holding temperature of charge are 100min in 70 DEG C of time, obtain B material.
After mixing by above-mentioned A material and B material 3:2 in mass ratio, static de-soak, then through SLA photocuring form2
(cured layer is with a thickness of 0.1mm, ultraviolet wavelength 400nm, laser power 750mW, laser scanning speed for the printing of 3d printer
Photocuring part 7500mm/s) is obtained, then by the post-treated technique of photocuring part, test sample, the aftertreatment technology packet is made
Include following steps:
The processing of UV photocuring: under the conditions of UV light intensity is 130mw, Uniform Irradiation 120s；
Heat cure processing: being heat-treated 2h under the conditions of starvation by the way of being gradually warmed up, and temperature is controlled in 60-
180℃。
Test sample is tested for the property using the test method of ASTM, specific performance such as table 3.
The performance test data table of 3 embodiment of table, 3 test sample
Embodiment 4
The present embodiment provides a kind of 3D printing light-cured resins, including the A material and B material independently saved before using, institute
The component that A material includes following parts by weight: 35 parts of epoxy acrylates (rotary viscosity 5000mPa.s) is stated, 1.5 parts of octanoic acids are sub-
Tin, 0.4 part of polyoxyethylene polyoxypropylene glycerin ether, 0.36 part of fluorocarbons class levelling agent, 20 parts of dipropylene glycol diacrylates
Ester；The B material includes the component of following parts by weight: 56 parts of bisphenol A epoxide resins, 1.5 parts of dimethoxybenzoins, and 0.3 part poly-
Oxypropylene polyoxyethylene glycerol ether, 0.25 part of fluorocarbons class levelling agent, 25 parts of 1,9- nonanediol diacrylates.
The preparation method of the light-cured resin, includes the following steps:
Each component in A material is stirred mixing according to quality proportioning with the mixing speed of 500r/min, while into
Row heating, holding temperature of charge are 40min in 90 DEG C of time, obtain A material；
Each component in B material is stirred mixing according to quality proportioning with the mixing speed of 500r/min, while into
Row heating, holding temperature of charge are 40min in 90 DEG C of time, obtain B material.
After mixing by above-mentioned A material and B material 1:1 in mass ratio, static de-soak, then through SLA photocuring form2
(cured layer is with a thickness of 0.1mm, ultraviolet wavelength 400nm, laser power 750mW, laser scanning speed for the printing of 3d printer
Photocuring part 7500mm/s) is obtained, then by the post-treated technique of photocuring part, test sample, the aftertreatment technology packet is made
Include following steps:
The processing of UV photocuring: under the conditions of UV light intensity is 80mw, Uniform Irradiation 150s；
Heat cure processing: being heat-treated 12h under the conditions of starvation by the way of being gradually warmed up, and temperature is controlled in 60-
200℃。
Test sample is tested for the property using the test method of ASTM, specific performance such as table 4.
The performance test data table of 4 embodiment of table, 4 test sample
Embodiment 5
The present embodiment provides a kind of 3D printing light-cured resins, including the A material and B material independently saved before using, institute
The component that A material includes following parts by weight: 10 parts of methacrylates (rotary viscosity 500mPa.s) is stated, 1 part of azo two is different
Butyronitrile, 0.1 part of polypropylene glycerol aether, 0.1 part of acrylic compounds levelling agent, 10 parts of iso-bornyl acrylates；The B material packet
Include the component of following parts by weight: 10 parts of furane resins, 2 parts of -4 ' of 4- benzoyl-dimethyl diphenyl sulfides, 3 parts of Diaryl iodoniums
Salt, 0.1 part of polypropylene glycerol aether, 0.1 part of acrylic compounds levelling agent, 10 parts of iso-bornyl acrylates.
The preparation method of the light-cured resin, includes the following steps:
Each component in A material is stirred mixing according to quality proportioning with the mixing speed of 500r/min, while into
Row heating, holding temperature of charge are 30min in 80 DEG C of time, obtain A material；
Each component in B material is stirred mixing according to quality proportioning with the mixing speed of 500r/min, while into
Row heating, holding temperature of charge are 30min in 80 DEG C of time, obtain B material.
After mixing by above-mentioned A material and B material 1:1 in mass ratio, static de-soak, then through SLA photocuring form2
(cured layer is with a thickness of 0.1mm, ultraviolet wavelength 400nm, laser power 750mW, laser scanning speed for the printing of 3d printer
Photocuring part 7500mm/s) is obtained, then by the post-treated technique of photocuring part, test sample, the aftertreatment technology packet is made
Include following steps:
The processing of UV photocuring: under the conditions of UV light intensity is 10mw, Uniform Irradiation 500s；
Heat cure processing: being heat-treated 1h under the conditions of starvation by the way of being gradually warmed up, and temperature is controlled in 100-
200℃。
Test sample is tested for the property using the test method of ASTM, specific performance such as table 5.
The performance test data table of 5 embodiment of table, 5 test sample
Embodiment 6
The present embodiment provides a kind of 3D printing light-cured resins, including the A material and B material independently saved before using, institute
State the component that A material includes following parts by weight: 80 parts of polyether acrylates (rotary viscosity 8000mPa.s), 10 parts of N, N- bis-
Methyl cyclohexylamine, 1 part of dimethyl silicone polymer, 1 part of silicone levelling agent, 70 parts of 2- phenoxyethyl acrylates；The B
Material includes the component of following parts by weight: 70 parts of polybutadienes, 5 parts of benzophenone, 5 parts of diazonium salts, 1 part of poly dimethyl silicon
Oxygen alkane, 1 part of silicone levelling agent, 70 parts of 2- phenoxyethyl acrylates.
The preparation method of the light-cured resin, includes the following steps:
Each component in A material is stirred mixing according to quality proportioning with the mixing speed of 500r/min, while into
Row heating, holding temperature of charge are 15min in 100 DEG C of time, obtain A material；
Each component in B material is stirred mixing according to quality proportioning with the mixing speed of 500r/min, while into
Row heating, holding temperature of charge are 15min in 100 DEG C of time, obtain B material.
After mixing by above-mentioned A material and B material 1:1 in mass ratio, static de-soak, then through SLA photocuring form2
(cured layer is with a thickness of 0.1mm, ultraviolet wavelength 400nm, laser power 750mW, laser scanning speed for the printing of 3d printer
Photocuring part 7500mm/s) is obtained, then by the post-treated technique of photocuring part, test sample, the aftertreatment technology packet is made
Include following steps:
The processing of UV photocuring: under the conditions of UV light intensity is 300mw, Uniform Irradiation 50s；
Heat cure processing: being heat-treated 20h under the conditions of starvation by the way of being gradually warmed up, and temperature is controlled in 20-
100℃。
Test sample is tested for the property using the test method of ASTM, specific performance such as table 6.
The performance test data table of 6 embodiment of table, 6 test sample
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (10)
1. a kind of 3D printing light-cured resin, which is characterized in that including the A material and B material independently saved before using, the A
The mass ratio of material and B material is 2: 3-3: 2；The A material includes the component of following parts by weight: 10-80 parts of acrylate, 1-
10 parts of initiator As, 0.1-1 parts of defoaming agents, 0.1-1 parts of levelling agents, 10-70 portions of reactive diluents；The B material includes following weight
Measure the component of part: 10-70 parts of thermosetting resins, 1-10 parts of initiator Bs, 0.1-1 parts of defoaming agents, 0.1-1 parts of levelling agents, 10-70
Part reactive diluent；The initiator A is thermal initiator, and the initiator B includes radical initiator；The reactive diluent
For one of the monomer with acrylate group, the monomer with vinyl, the compound with maleimide base group
Or it is several.
2. 3D printing light-cured resin according to claim 1, which is characterized in that the acrylate is polyester acrylic
Ester, epoxy acrylate, aromatic urethane acrylate, pure acrylate, methacrylate, in polyether acrylate
One or more, the rotary viscosity of the acrylate are 500-8000mPa.s.
3. 3D printing light-cured resin according to claim 1 or 2, which is characterized in that the thermosetting resin is alicyclic ring
Race's epoxy resin, bisphenol A epoxide resin, bisphenol F epoxy resin, bis-phenol E epoxy resin polyurethane, phenolic resin, Lauxite,
One or more of melamine resin, furane resins, organic siliconresin, polybutadiene.
4. 3D printing light-cured resin according to claim 1-3, which is characterized in that the thermal initiator was
Oxidation dibenzoyl, cumyl peroxide, di-isopropyl peroxydicarbonate, azodiisobutyronitrile, persulfate, amine are urged
One or more of agent, anhydride catalyst, base metal catalysts, organotin catalysts.
5. 3D printing light-cured resin according to claim 1-4, which is characterized in that the radical initiator
For benzophenone, dimethoxybenzoin, chlorinated diphenyl ketone, -4 ' of 4- benzoyl-dimethyl diphenyl sulfide, 1- hydroxy cyclohexylphenyl
One or more of base ketone, 2,4- diethyl thioxanthone.
6. 3D printing light-cured resin according to claim 1-5, which is characterized in that the initiator B also wraps
Include cationic initiator, the cationic initiator be diazonium salt, diaryl iodonium salt, triaryl sulfonium salts, alkyl sulfosalt,
One or more of iron arene salt, sulfonyloxy ketone, triaryl silicon oxygen ether.
7. 3D printing light-cured resin according to claim 1-6, which is characterized in that the reactive diluent is
2- (1,2- hexamethylene -1,2- dihydroxy acid imide) ethyl propylene acid esters, ring trimethylolpropane dimethoxym ethane acrylate, 2- benzene
Oxygroup ethyl propylene acid esters, iso-bornyl acrylate, methacrylic acid cyclohexyl ester, dipropylene glycol diacrylate, 1,9- nonyl
One or more of omega-diol diacrylate.
8. 3D printing light-cured resin according to claim 1-7, which is characterized in that the defoaming agent is polyoxy
Ethylene polyoxypropylene pentaerythrite ether, polyoxyethylene polyoxy propyl alcohol amidogen ether, polypropylene glycerol aether, polyoxyethylene polyoxypropylene are sweet
One or more of oily ether, dimethyl silicone polymer, the levelling agent be acrylic compounds levelling agent, silicone levelling agent and
One or more of fluorocarbons class levelling agent.
9. a kind of preparation method of the described in any item 3D printing light-cured resins of claim 1-8, which is characterized in that including such as
Lower step:
Each component in A material is stirred mixing according to quality proportioning, while being heated, keeps temperature of charge in 10-
100 DEG C of time is 15-150min, obtains A material；
Each component in B material is stirred mixing according to quality proportioning, while being heated, keeps temperature of charge in 10-
100 DEG C of time is 15-150min, obtains B material.
10. a kind of light that the described in any item 3D printing light-cured resins of claim 1-8 are obtained through stereolithography apparatus is solid
Change the aftertreatment technology of part, the aftertreatment technology includes the following steps:
The processing of UV photocuring: under the conditions of UV light intensity is 10-300mw, Uniform Irradiation 50-500s；
Heat cure processing: being heat-treated 1-20h under the conditions of starvation, and temperature is controlled at 20-200 DEG C；It is preferred to use gradually
The mode of heating is heat-treated, and temperature is controlled at 60-180 DEG C, preferably a length of 2-12h when heating.
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| CN201811223509.7A CN109553726A (en) | 2018-10-19 | 2018-10-19 | A kind of light-cured resin, preparation method and photocuring part aftertreatment technology |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110065230A (en) * | 2019-04-12 | 2019-07-30 | 珠海赛纳打印科技股份有限公司 | Three-dimension object forming method and molding machine |
| CN111070672A (en) * | 2019-11-18 | 2020-04-28 | 深圳光韵达光电科技股份有限公司 | 3D printing method and device based on thermocuring mechanism |
| CN111748312A (en) * | 2020-06-22 | 2020-10-09 | 江苏泰特尔新材料科技有限公司 | Cationic free radical dual-curing adhesive and preparation method thereof |
| CN114479425A (en) * | 2022-02-15 | 2022-05-13 | 邢台春蕾新能源开发有限公司 | Photosensitive resin for 3D printing |
| CN116156772A (en) * | 2022-12-28 | 2023-05-23 | 南通威斯派尔半导体技术有限公司 | AMB copper-clad ceramic circuit board and preparation method thereof |
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| CN107513247A (en) * | 2017-09-20 | 2017-12-26 | 杭州乐新材料科技有限公司 | A kind of resistant, toughened light curing resin composition and preparation method thereof |
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| CN107513247A (en) * | 2017-09-20 | 2017-12-26 | 杭州乐新材料科技有限公司 | A kind of resistant, toughened light curing resin composition and preparation method thereof |
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| CN110065230A (en) * | 2019-04-12 | 2019-07-30 | 珠海赛纳打印科技股份有限公司 | Three-dimension object forming method and molding machine |
| CN110065230B (en) * | 2019-04-12 | 2021-04-06 | 珠海赛纳三维科技有限公司 | Three-dimensional object forming method and forming device |
| JP2022507276A (en) * | 2019-04-12 | 2022-01-18 | チューハイ セイルナー スリーディー テクノロジー カンパニー リミテッド | 3D object molding method and molding equipment |
| US11559942B2 (en) | 2019-04-12 | 2023-01-24 | Zhuhai Sailner 3D Technology Co., Ltd. | Three-dimensional object molding method and molding device |
| JP7232329B2 (en) | 2019-04-12 | 2023-03-02 | チューハイ セイルナー スリーディー テクノロジー カンパニー リミテッド | Three-dimensional object molding method and molding apparatus |
| CN111070672A (en) * | 2019-11-18 | 2020-04-28 | 深圳光韵达光电科技股份有限公司 | 3D printing method and device based on thermocuring mechanism |
| CN111748312A (en) * | 2020-06-22 | 2020-10-09 | 江苏泰特尔新材料科技有限公司 | Cationic free radical dual-curing adhesive and preparation method thereof |
| CN111748312B (en) * | 2020-06-22 | 2022-04-29 | 江苏泰特尔新材料科技股份有限公司 | Cationic free radical dual-curing adhesive and preparation method thereof |
| CN114479425A (en) * | 2022-02-15 | 2022-05-13 | 邢台春蕾新能源开发有限公司 | Photosensitive resin for 3D printing |
| CN116156772A (en) * | 2022-12-28 | 2023-05-23 | 南通威斯派尔半导体技术有限公司 | AMB copper-clad ceramic circuit board and preparation method thereof |
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