CN109521862A - A kind of heated at constant temperature calculating control system, device and method - Google Patents

A kind of heated at constant temperature calculating control system, device and method Download PDF

Info

Publication number
CN109521862A
CN109521862A CN201811416907.0A CN201811416907A CN109521862A CN 109521862 A CN109521862 A CN 109521862A CN 201811416907 A CN201811416907 A CN 201811416907A CN 109521862 A CN109521862 A CN 109521862A
Authority
CN
China
Prior art keywords
temperature
heat
heated
control module
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811416907.0A
Other languages
Chinese (zh)
Inventor
王李琰
邵威烈
周才廷
靳子蔚
田保强
靳菲菲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201811416907.0A priority Critical patent/CN109521862A/en
Publication of CN109521862A publication Critical patent/CN109521862A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Control Of Temperature (AREA)

Abstract

The present invention relates to a kind of heated at constant temperature calculating control systems, device and method, including control terminal and the multiple terminal devices for communicating connection;Terminal device includes heat-conducting medium, computing chip, chip control module, temperature sensing module;Control terminal includes distributed type assemblies control module;Distributed type assemblies control module receives the set temperature demand of party in request's calculating task and each terminal device, the temperature data of computing chip status information and heat-conducting medium is obtained from each terminal device, and carry out task schedule and distribution, so that the operation of heat-conducting medium calculation in absorption chip distributes temperature after heat and reaches set temperature and constant, calculated result is received from each terminal device when operation or after operation, and is summarized and returned to party in request;The present invention has the characteristics that energy-saving and environmental protection, resource high-efficiency fusion utilize, and can utilize the energy source secondary generated in the computing chip course of work on the basis of meeting growing calculating task demand, meet the scene of all kinds of heated at constant temperature.

Description

A kind of heated at constant temperature calculating control system, device and method
Technical field
The present invention relates to thermostatic control and computing technique fields, calculate and control more specifically to a kind of heated at constant temperature System, device and method.
Background technique
In the information age, especially upcoming artificial intelligence epoch, more and more calculating tasks are needed by a large amount of High performance computing chip is completed, and this is also along with the generation of a large amount of waste heats, how to have this partial heat energy The secondary use of effect, while high performance chips complete calculating task, the problem of accomplishing energy conservation and environmental protection, be great meaning.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, providing a kind of heated at constant temperature meter Calculate control system;
Additionally provide a kind of heated at constant temperature calculation control device and a kind of heated at constant temperature calculation control method.
The technical solution adopted by the present invention to solve the technical problems is:
Construct a kind of heated at constant temperature calculating control system, wherein including control terminal and the multiple terminals for communicating connection Equipment;
The terminal device includes heat-conducting medium, computing chip, chip control module, temperature sensing module;
The heat-conducting medium, heat derives when for the computing chip to work are exterior object heat supply;
The chip control module monitors the computing chip state and by shape for controlling computing chip operation State information and calculated result are sent to the control terminal;
The temperature sensing module for perceiving the heat-conducting medium temperature data, and sends it to the control terminal;
The control terminal includes distributed type assemblies control module;
The distributed type assemblies control module is received from each terminal device for receiving party in request's calculating task The calculated result, and summarize and return to the party in request;It is also used to obtain the status information from each terminal device And the temperature data, and task schedule and distribution are carried out with the temperature data according to the state information, to guarantee It is constant to state heat-conducting medium temperature.
Heated at constant temperature calculating control system of the present invention, wherein the terminal device further includes assisted heating device And heating control module;
The assisted heating device is the exterior object when being unable to satisfy constant temperature demand for the heat-conducting medium heat supply It is heated to required steady temperature and keeps the temperature;
The heating control module, for controlling the assisted heating device operation.
Heated at constant temperature calculating control system of the present invention, wherein the distributed type assemblies control module is also used to When the computing chip distributes conduction to heat-conducting medium heat when running is unable to satisfy the exterior object constant temperature demand, It sends a command to the heating control module and starts the assisted heating device.
Heated at constant temperature calculating control system of the present invention, wherein the control terminal further includes configuration management module;
The configuration management module, for the configuration ginseng to the distributed type assemblies control module and the terminal device Number is managed, and adjusts task distribution mechanisms, temperature control strategy and chip controls strategy.
Heated at constant temperature calculating control system of the present invention, wherein the temperature sensing module is also used to detect described The real time temperature data of computing chip simultaneously send it to the control terminal.
A kind of heated at constant temperature calculation control device, including above-mentioned heated at constant temperature calculating control system, wherein the terminal Equipment further includes container, is provided with thermal insulation layer in the container, the thermal insulation layer separate space in the container be installing zone and Heating zone;The computing chip is provided in the installing zone;What the heat-conducting medium distributed when running the computing chip Heat is conducted to the heating zone;The temperature sensing module includes the first temperature inductor being arranged in the heating zone, First temperature inductor detects the temperature for the part that the heat-conducting medium is located in the heating zone;The chip controls mould Block is set on the container.
Heated at constant temperature calculation control device of the present invention, wherein the temperature sensing module further includes being set to institute It states in installing zone, detects the second temperature inductor of the computing chip temperature.
Heated at constant temperature calculation control device of the present invention, wherein be provided on the container assisted heating device and Heating control module;The assisted heating device is set in the heating zone.
A kind of heated at constant temperature calculation control method, according to above-mentioned heated at constant temperature calculating control system, its implementation is such as Under:
Step 1: the distributed type assemblies control module receives setting for party in request's calculating task and each terminal device Determine temperature requirements;
Step 2: the distributed type assemblies control module obtains the computing chip state letter from each terminal device The temperature data of breath and the heat-conducting medium, and according to the computing chip status information and the temperature of the heat-conducting medium Data carry out task schedule and distribution, so that the heat-conducting medium absorbs temperature after the computing chip operation distributes heat and reaches The set temperature is simultaneously constant;
Step 3: the distributed type assemblies control module receives calculated result from each terminal device, and summarizes and return Back to the party in request.
Heated at constant temperature calculation control method of the present invention, wherein in the second step, the distributed type assemblies control Module regulates and controls computing chip operation, is unable to satisfy temperature after the operation of heat-conducting medium calculation in absorption chip distributes heat and reaches setting temperature When spending, the distributed type assemblies control module sends a command to the heating control module, and the heating control module controls institute Assisted heating device is stated to be actuated for being heated to the set temperature and keep the temperature.
The beneficial effects of the present invention are: distributed type assemblies control module receives party in request's calculating task and each terminal is set Standby set temperature demand obtains the temperature data of computing chip status information and heat-conducting medium from each terminal device, and Task schedule and distribution are carried out according to the temperature data of computing chip status information and heat-conducting medium, so that heat-conducting medium absorbs Computing chip operation distributes temperature after heat and reaches set temperature and constant, receives from each terminal device when operation or after operation Calculated result, and summarize and return to party in request;The present invention has the characteristics that energy-saving and environmental protection, resource high-efficiency fusion utilize, Neng Gou On the basis of meeting growing calculating task demand, the energy source secondary generated in the computing chip course of work is utilized, it is full The scene of all kinds of heated at constant temperature of foot;System of the invention is in combination with different types of computing chip, i.e., for calculating different type The chip of calculating task can be in a plurality of types of thermostatic device for heating according to the quantity for being embedded in chip in single terminal equipment It uses.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, below in conjunction with attached drawing and reality Applying example, the invention will be further described, and the accompanying drawings in the following description is only section Example of the invention, for this field For those of ordinary skill, without creative efforts, it can also be obtained according to these attached drawings other accompanying drawings:
Fig. 1 is the heated at constant temperature calculating control system functional block diagram of present pre-ferred embodiments;
Fig. 2 is the heated at constant temperature calculation control device structural schematic diagram of present pre-ferred embodiments;
Fig. 3 is the heated at constant temperature calculation control method logical flow chart of present pre-ferred embodiments.
Specific embodiment
In order to keep the purposes, technical schemes and advantages of the embodiment of the present invention clearer, implement below in conjunction with the present invention Technical solution in example carries out clear, complete description, it is clear that and described embodiment is section Example of the invention, and It is not all of embodiment.Based on the embodiment of the present invention, those of ordinary skill in the art are not before making the creative labor Every other embodiment obtained is put, protection scope of the present invention is belonged to.
The heated at constant temperature calculating control systems of present pre-ferred embodiments is as shown in Figure 1, including control terminal 1 and communicating The multiple terminal devices 2 of connection;
Terminal device 2 includes heat-conducting medium 20, computing chip 21, chip control module 22, temperature sensing module 23;
Heat-conducting medium 20, heat derives when for computing chip 21 to work are exterior object heat supply;
Chip control module 22 is run for controlling computing chip 21, monitors 21 state of computing chip and by status information And calculated result is sent to control terminal 1;
Temperature sensing module 23 for perceiving 20 temperature data of heat-conducting medium, and sends it to control terminal 1;
Control terminal 1 includes distributed type assemblies control module 10;
Distributed type assemblies control module 10 receives from each terminal device 2 for receiving party in request's calculating task and calculates knot Fruit, and summarize and return to party in request;It is also used to obtain status information and temperature data from each terminal device 2, and according to shape State information and temperature data carry out task schedule and distribution, to guarantee that heat-conducting medium temperature is constant;
Distributed type assemblies control module receives the set temperature demand of party in request's calculating task and each terminal device, from each Obtain the temperature data of computing chip status information and heat-conducting medium in terminal device, and according to computing chip status information with And the temperature data of heat-conducting medium carries out task schedule and distribution, so that after the operation of heat-conducting medium calculation in absorption chip distributes heat Temperature reaches set temperature and constant, calculated result is received from each terminal device when operation or after operation, and summarize and return to Party in request;The present invention has the characteristics that energy-saving and environmental protection, resource high-efficiency fusion utilize, and can appoint meeting growing calculating On the basis of business demand, the energy source secondary generated in the computing chip course of work is utilized, the scene of all kinds of heated at constant temperature is met; System of the invention is in combination with different types of computing chip, i.e., for calculating the chip of different type calculating task, according to list It is embedded in the quantity of chip in a terminal device, can be used in a plurality of types of thermostatic device for heating.
As shown in Figure 1, terminal device 2 further includes assisted heating device 24 and heating control module 25;
Assisted heating device 24 is heated to institute when being unable to satisfy constant temperature demand for 20 heat supply of heat-conducting medium for exterior object It needs steady temperature and keeps the temperature;
Heating control module 25 is run for controlling assisted heating device 24;
It is limited by 21 quantity of computing chip carried on terminal device 2, is deposited by the heat that 21 operation of computing chip generates It then is unable to reach requirement by 21 heat of computing chip merely, is needed at this time auxiliary when demand temperature is higher than the value in peak Heating device 24 is helped to heat exterior object, to ensure that whole system has higher heat to be applicable in adjustable range.
As shown in Figure 1, distributed type assemblies control module 10, is also used to distribute when computing chip 21 is run and conduct to thermally conductive When the heat of medium 20 is unable to satisfy exterior object constant temperature demand, the starting auxiliary heating dress of heating control module 25 is sent a command to Set 24;Control is managed convenient for concentrating.
As shown in Figure 1, control terminal 1 further includes configuration management module 11;
Configuration management module 11 is carried out for the configuration parameter to distributed type assemblies control module 10 and terminal device 2 Management adjusts task distribution mechanisms, temperature control strategy and chip controls strategy, in configuration management module to terminal device correlation Configuration parameter modify after, system will issue configuration by the network communication with terminal device and be updated, and facilitate system The adjusting of parameter is modified.
As shown in Figure 1, temperature sensing module 23, is also used to detect the real time temperature data of computing chip 21 and is sent to To control terminal 1;Convenient for grasping 21 real time temperature of computing chip, avoid because of heat eliminating medium presence heat dissipation failure and the excessively high damage of temperature It is bad.
A kind of heated at constant temperature calculation control device, as shown in Fig. 2, including above-mentioned heated at constant temperature calculating control system, eventually End equipment 2 further includes container 26, and thermal insulation layer 260 is provided in container 26, and space is installing zone in 260 partitioned bottle of thermal insulation layer 261 and heating zone 262;Computing chip 21 is provided in installing zone 261;What heat-conducting medium 20 distributed when running computing chip 21 Heat is conducted to heating zone 262;Temperature sensing module includes the first temperature inductor 230 being arranged in heating zone 262, and first Temperature inductor 230 detects the temperature that heat-conducting medium 20 is located at the part in heating zone 262;Chip control module 22 is set to appearance On device 26;
The present apparatus is a kind of better embodiment of terminal device, can also have other implementation structures, belong to this Shen Protection scope please;
It is placed an object into heating zone 262 when being heated to object by the present apparatus, computing chip 21 is arranged in installing zone Interior 261, the operation of computing chip 21 will not be interfered when realizing the conduction of heat by heat-conducting medium 20, and heating, It is easily controllable.
As shown in Fig. 2, temperature sensing module further includes being set in installing zone 261, the of detection 21 temperature of computing chip Two temperature inductors 231;Convenient for detecting the real time temperature of computing chip 21.
As shown in Fig. 2, being provided with assisted heating device 24 and heating control module 25 on container 26;Assisted heating device 24 It is set in heating zone 262;Computing chip heat be unable to reach require temperature when, starting assisted heating device 24 is carried out to adding Object carries out heated constant temperature in hot-zone 262, and the constant temperature range of safeguards system is sufficiently large, meanwhile, the heat of assisted heating device 24 It is obstructed by thermal insulation layer 260, it is small to 21 influence on system operation of computing chip.
A kind of heated at constant temperature calculation control method, as shown in figure 3, according to above-mentioned heated at constant temperature calculating control system, Implementation method is as follows:
S01: distributed type assemblies control module receives the set temperature demand of party in request's calculating task and each terminal device;
S02: distributed type assemblies control module obtains computing chip status information and heat-conducting medium from each terminal device Temperature data, and task schedule and distribution are carried out according to the temperature data of computing chip status information and heat-conducting medium, made The operation of heat-conducting medium calculation in absorption chip distributes temperature after heat and reaches set temperature and constant;
S03: distributed type assemblies control module receives calculated result from each terminal device, and summarizes and return to party in request;
Have the characteristics that energy-saving and environmental protection, resource high-efficiency fusion utilize, growing calculating task demand can met On the basis of, the energy source secondary generated in the computing chip course of work is utilized, the scene of all kinds of heated at constant temperature is met;The present invention System in combination with different types of computing chip, i.e., for calculating the chip of different type calculating task, according to single terminal It is embedded in the quantity of chip in equipment, can be used in a plurality of types of thermostatic device for heating.
Preferably, in second step, distributed type assemblies control module regulates and controls computing chip operation, is unable to satisfy heat-conducting medium suction When receiving computing chip operation and distributing temperature after heat and reach set temperature, distributed type assemblies control module sends a command to heating control Molding block, heating control module control assisted heating device are actuated for being heated to set temperature and keep the temperature;To ensure Whole system has higher heat to be applicable in adjustable range.
It should be understood that for those of ordinary skills, it can be modified or changed according to the above description, And all these modifications and variations should all belong to the protection domain of appended claims of the present invention.

Claims (10)

1. a kind of heated at constant temperature calculating control system, which is characterized in that including control terminal and the multiple terminals for communicating connection Equipment;
The terminal device includes heat-conducting medium, computing chip, chip control module, temperature sensing module;
The heat-conducting medium, heat derives when for the computing chip to work are exterior object heat supply;
The chip control module monitors the computing chip state and believes state for controlling the computing chip operation Breath and calculated result are sent to the control terminal;
The temperature sensing module for perceiving the heat-conducting medium temperature data, and sends it to the control terminal;
The control terminal includes distributed type assemblies control module;
The distributed type assemblies control module, for receiving party in request's calculating task, from each terminal device described in reception Calculated result, and summarize and return to the party in request;Be also used to obtain from each terminal device the status information and The temperature data, and task schedule and distribution are carried out with the temperature data according to the state information, to be led described in guarantee Heat medium temperature is constant.
2. heated at constant temperature calculating control system according to claim 1, which is characterized in that the terminal device further includes auxiliary Help heating device and heating control module;
The assisted heating device heats when being unable to satisfy constant temperature demand for the heat-conducting medium heat supply for the exterior object To required steady temperature and keep the temperature;
The heating control module, for controlling the assisted heating device operation.
3. heated at constant temperature calculating control system according to claim 2, which is characterized in that the distributed type assemblies control mould Block, is also used to distribute conduction when the computing chip is run and is unable to satisfy the exterior object to the heat of the heat-conducting medium When constant temperature demand, sends a command to the heating control module and start the assisted heating device.
4. heated at constant temperature calculating control system according to claim 1, which is characterized in that the control terminal further includes configuration Management module;
The configuration management module, for the configuration parameter to the distributed type assemblies control module and the terminal device into Row management, adjusts task distribution mechanisms, temperature control strategy and chip controls strategy.
5. heated at constant temperature calculating control system according to claim 1, which is characterized in that the temperature sensing module, also For detecting the real time temperature data of the computing chip and sending it to the control terminal.
6. a kind of heated at constant temperature calculation control device, including any heated at constant temperature calculating control system of claim 1-5, It is characterized in that, the terminal device further includes container, thermal insulation layer is provided in the container, the thermal insulation layer separates the appearance Space is installing zone and heating zone in device;The computing chip is provided in the installing zone;The heat-conducting medium is by the meter The heat distributed when chip operation is calculated to conduct to the heating zone;The temperature sensing module includes being arranged in the heating zone The first temperature inductor, first temperature inductor detects the temperature for the part that the heat-conducting medium is located in the heating zone Degree;The chip control module is set on the container.
7. heated at constant temperature calculation control device according to claim 6, which is characterized in that the temperature sensing module is also wrapped It includes and is set in the installing zone, detect the second temperature inductor of the computing chip temperature.
8. heated at constant temperature calculation control device according to claim 6, which is characterized in that be provided with auxiliary on the container Heating device and heating control module;The assisted heating device is set in the heating zone.
9. a kind of heated at constant temperature calculation control method, heated at constant temperature calculating control system described in -5, special according to claim 1 Sign is that implementation method is as follows:
Step 1: the distributed type assemblies control module receives the setting temperature of party in request's calculating task and each terminal device Degree demand;
Step 2: the distributed type assemblies control module obtained from each terminal device the computing chip status information with And the temperature data of the heat-conducting medium, and according to the computing chip status information and the temperature data of the heat-conducting medium Task schedule and distribution are carried out, so that the heat-conducting medium absorbs temperature after the computing chip operation distributes heat and reaches described Set temperature is simultaneously constant;
Step 3: the distributed type assemblies control module receives calculated result from each terminal device, and summarizes and return to The party in request.
10. heated at constant temperature calculation control method according to claim 9, which is characterized in that in the second step, described point Cloth clustered control module regulates and controls computing chip operation, is unable to satisfy the operation of heat-conducting medium calculation in absorption chip and distributes temperature after heat When degree reaches set temperature, the distributed type assemblies control module sends a command to the heating control module, the heating control Molding block controls the assisted heating device and is actuated for being heated to the set temperature and keeps the temperature.
CN201811416907.0A 2018-11-26 2018-11-26 A kind of heated at constant temperature calculating control system, device and method Pending CN109521862A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811416907.0A CN109521862A (en) 2018-11-26 2018-11-26 A kind of heated at constant temperature calculating control system, device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811416907.0A CN109521862A (en) 2018-11-26 2018-11-26 A kind of heated at constant temperature calculating control system, device and method

Publications (1)

Publication Number Publication Date
CN109521862A true CN109521862A (en) 2019-03-26

Family

ID=65793679

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811416907.0A Pending CN109521862A (en) 2018-11-26 2018-11-26 A kind of heated at constant temperature calculating control system, device and method

Country Status (1)

Country Link
CN (1) CN109521862A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6415619B1 (en) * 2001-03-09 2002-07-09 Hewlett-Packard Company Multi-load refrigeration system with multiple parallel evaporators
CN102855157A (en) * 2012-07-19 2013-01-02 浪潮电子信息产业股份有限公司 Method for comprehensively scheduling load of servers
CN103997979A (en) * 2011-12-12 2014-08-20 奥林巴斯医疗株式会社 Treatment system and method for controlling treatment system
CN104654449A (en) * 2014-12-17 2015-05-27 东北大学 Distributed electric heat energy storage heating control system and method
CN206235982U (en) * 2016-07-29 2017-06-09 兰州文理学院 A kind of automated computer constant temperature mechanism
CN108758786A (en) * 2018-06-12 2018-11-06 东北大学 A kind of waste heat powering device of distribution cloud computing system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6415619B1 (en) * 2001-03-09 2002-07-09 Hewlett-Packard Company Multi-load refrigeration system with multiple parallel evaporators
CN103997979A (en) * 2011-12-12 2014-08-20 奥林巴斯医疗株式会社 Treatment system and method for controlling treatment system
CN102855157A (en) * 2012-07-19 2013-01-02 浪潮电子信息产业股份有限公司 Method for comprehensively scheduling load of servers
CN104654449A (en) * 2014-12-17 2015-05-27 东北大学 Distributed electric heat energy storage heating control system and method
CN206235982U (en) * 2016-07-29 2017-06-09 兰州文理学院 A kind of automated computer constant temperature mechanism
CN108758786A (en) * 2018-06-12 2018-11-06 东北大学 A kind of waste heat powering device of distribution cloud computing system

Similar Documents

Publication Publication Date Title
US20180159691A1 (en) Intelligent sensor and controller framework for the power grid
CN103150003B (en) The power-saving control method of information handling system, this information handling system and device
CN106440235A (en) Air conditioner and air supply control method and device thereof
CN106293934B (en) A kind of cluster system management optimization method and platform
CN104901858A (en) System communication method based on CAN bus
CN105183561A (en) Resource distribution method and resource distribution system
CN109026809A (en) A kind of fan control system, method and CPLD
CN106152249A (en) The control method of electric heating equipment, device and system
CN109521862A (en) A kind of heated at constant temperature calculating control system, device and method
CN202941017U (en) Intelligent illumination system
CN103995574A (en) Method for achieving fan intelligent heat dissipation in private cloud system
CN105299905A (en) Air source water heater and control method and device of air source water heater
CN105116987A (en) Universal power supply and performance management system of cloud computing center
CN106026178B (en) A kind of more distributed generation resources self-discipline electricity-generating control methods in region and device
CN107450632A (en) Unit control system and method
CN204534793U (en) A kind of energy-saving carbon fiber electricity ground heating system
CN105636892B (en) Elevator control system
CN103163911A (en) Temperature controlling system and method of electrical heating system
CN110058968A (en) Control method, system and the relevant device of decentralization storage
CN105226819A (en) A kind of distributed power source monitoring management system based on IEC61850
CN108758786A (en) A kind of waste heat powering device of distribution cloud computing system
CN106685684B (en) The system-level management method of container in cloud computing
CN107449023B (en) Send out thermal module and its intelligent electricity floor heating
CN208739147U (en) A kind of image aggregation gateway based on LoRa
CN107343038A (en) A kind of remote real-time monitoring device and method based on IPMI

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20190326