CN109492500B - Ultrasonic biological recognition device, preparation method thereof and electronic equipment - Google Patents
Ultrasonic biological recognition device, preparation method thereof and electronic equipment Download PDFInfo
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- CN109492500B CN109492500B CN201710819521.3A CN201710819521A CN109492500B CN 109492500 B CN109492500 B CN 109492500B CN 201710819521 A CN201710819521 A CN 201710819521A CN 109492500 B CN109492500 B CN 109492500B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
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- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
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Abstract
The invention relates to an ultrasonic biological recognition device, a preparation method thereof and electronic equipment. The ultrasonic biological recognition device comprises an ultrasonic sensing component and a reflecting layer. The ultrasonic sensing component can emit ultrasonic waves and receive the reflected ultrasonic waves, and the ultrasonic sensor is provided with a detection area for detecting an object to be detected; the reflecting layer is laminated on the ultrasonic sensing assembly, the detection area is exposed, the reflecting layer is formed by black conductive polytetrafluoroethylene coating, and the conductive polytetrafluoroethylene coating contains 40-60% of polytetrafluoroethylene by mass percent. The ultrasonic biological recognition device is accurate in recognition.
Description
Technical Field
The invention relates to the technical field of ultrasonic identification, in particular to an ultrasonic biological identification device, a preparation method thereof and electronic equipment.
Background
Ultrasonic fingerprint identification technique can scan the fingerprint through the ultrasonic wave, compares with traditional fingerprint identification mode, and ultrasonic fingerprint identification can carry out more deep analysis to the fingerprint, even if the finger surface is stained with the dirt also does not hinder ultrasonic sampling, can also permeate the unique 3D characteristic of fingerprint under the skin surface even. Even if water, sweat, or the like is present on the hand, accurate recognition is still possible. However, the current ultrasonic biometric identification device has a problem that the identification function is not accurate enough.
Disclosure of Invention
Based on this, it is necessary to provide an ultrasonic biometric device with more accurate identification.
In addition, a preparation method of the ultrasonic biological recognition device and electronic equipment are also provided.
An ultrasonic biometric device comprising:
the ultrasonic sensing assembly can emit ultrasonic waves and receive the reflected ultrasonic waves, and is provided with a detection area for detecting an object to be detected; and
the reflecting layer is stacked on the ultrasonic sensing assembly, the detection area is exposed, the reflecting layer is formed by preparing black conductive polytetrafluoroethylene coating, and the black conductive polytetrafluoroethylene coating contains polytetrafluoroethylene with the mass percentage of 40% -60%.
The ultrasonic sensor can emit ultrasonic waves which are transmitted towards the direction of the screen and can also emit ultrasonic waves which are transmitted towards the direction far away from the screen, reflected waves which are formed after the ultrasonic waves which are transmitted towards the direction of the screen contact an object to be detected are received by the ultrasonic sensor to form an image, but the ultrasonic waves which are transmitted towards the direction far away from the screen are reflected if encountering foreign matters and the like, the formed reflected waves can also be received by the ultrasonic sensor to form an image, so that the accuracy of the identification of the ultrasonic biological identification device is influenced, the ultrasonic biological identification device is characterized in that a reflecting layer is laminated on the ultrasonic sensing component and exposes the detection area, black conductive polytetrafluoroethylene coating which forms the reflecting layer contains 40-60% of polytetrafluoroethylene by mass percentage, namely the main component of the formed reflecting layer is polytetrafluoroethylene, the polytetrafluoroethylene is close to the acoustic resistance of air, the reflecting layer has the acoustic resistance close to the air, the ultrasonic waves which are contacted with the reflecting layer and emitted by the ultrasonic sensing component can be reflected back, so that the partial or all of the ultrasonic waves can be reflected to the detection area, and the signal intensity of the ultrasonic identification device is improved; meanwhile, the reflecting layer is laminated on the ultrasonic sensing assembly, and the detection area is exposed, so that foreign matters can be prevented from being attached to the partial area of the ultrasonic sensing assembly, and the influence on the precision of the ultrasonic biological recognition device caused by the reflection of the ultrasonic waves transmitted to the partial area when encountering the foreign matters and the like can be avoided; and because the material that the preparation formed the reflection stratum is black electrically conductive polytetrafluoroethylene coating to make the reflection stratum not only can shelter from external light, can also shield external electromagnetic wave, in order to avoid external light and electromagnetic wave to the interference of ultrasonic wave biological identification device, further improved ultrasonic wave biological identification device's precision, consequently, above-mentioned ultrasonic wave biological identification device's recognition function is comparatively accurate.
In one embodiment, the conductive polytetrafluoroethylene coating further comprises a black conductive agent with a mass percentage of 6% -10%. The black conductive agent not only serves as a conductive agent but also serves as a coloring agent, and the reflective layer can be made black by using the black conductive agent in the content, so that the functions of shielding external light and shielding external electromagnetic waves of the reflective layer are realized.
In one embodiment, the black conductive agent is at least one selected from conductive carbon black, graphite and carbon powder. The conductive carbon black, the graphite and the carbon powder have good conductive performance and are black, so that the reflecting layer can be black by the black conductive agent in percentage by mass, and the effects of shielding external light and external electromagnetic waves of the reflecting layer are achieved.
In one embodiment, the polytetrafluoroethylene coating further contains metal powder, and the metal powder is selected from at least one of silver, iron and copper. The effect of shielding external electromagnetic waves of the reflecting layer can be improved by adding the metal powder.
In one embodiment, the reflective layer has a thickness of 20 to 50 microns. Adopt above-mentioned polytetrafluoroethylene coating to form the reflection stratum, the reflection stratum only needs 20 microns just can realize the reflection of ultrasonic wave to have better outside light effect of sheltering from and the effect of shielding outside electromagnetic wave, the thickness of control reflection stratum is below 50 microns, in order to avoid ultrasonic wave biological recognition device to have great thickness, ensures that ultrasonic wave biological recognition device has suitable volume.
In one embodiment, the ultrasonic sensing component includes a thin film transistor, and a piezoelectric layer, a conductive layer, and an acoustic matching layer stacked on the thin film transistor in sequence, where a side of the acoustic matching layer away from the conductive layer is the detection area, and the reflective layer is stacked on a side of the thin film transistor away from the piezoelectric layer. The ultrasonic sensing assembly with the structure can not only realize the emission of ultrasonic waves, but also realize the reception of the reflected ultrasonic waves, and convert the reflected ultrasonic waves into electric signals, thereby being beneficial to realizing the miniaturization of the ultrasonic biological recognition device.
In one embodiment, the conductive layer is two layers, and the two conductive layers are sequentially stacked on the piezoelectric layer, wherein the acoustic matching layer is stacked on the conductive layer far away from the piezoelectric layer. Because the conducting layer of the ultrasonic sensing assembly is usually prepared after silver paste is printed by screen printing, if only one layer of silver paste is printed by screen printing, the surface of the sintered silver layer is uneven, which is not beneficial to the smoothness of electric charges, and through preparing two layers of conducting layers, the conducting layer far away from the piezoelectric layer can have a smooth surface, which is beneficial to the conduction of electric charges.
In one embodiment, the width of each of the two conductive layers is smaller than the width of the piezoelectric layer, the width of the conductive layer far away from the piezoelectric layer is smaller than the width of the conductive layer close to the piezoelectric layer, and the width of the piezoelectric layer is smaller than the width of the thin film transistor, so as to form a step portion, wherein the circuit board is respectively bonded with the conductive layer close to the piezoelectric layer and the thin film transistor at the step portion. The bonding of the circuit board, the conducting layer and the thin film transistor can be facilitated by the arrangement of the step portion.
In one embodiment, the thickness of the acoustic matching layer is 20 micrometers to 100 micrometers, and the thickness of the piezoelectric layer is 8 micrometers to 10 micrometers. The acoustic matching layer with the thickness and the piezoelectric layer with the thickness can be well matched, so that the accuracy of the identification function of the ultrasonic biological identification device is improved.
In one embodiment, the ultrasonic sensor further comprises a circuit board, wherein the circuit board is a flexible circuit board containing an EMI shielding layer, and the circuit board is laminated on one side of the reflecting layer far away from the ultrasonic sensing assembly. The circuit board with the EMI shielding layer is laminated on the reflecting layer, so that the electromagnetic shielding function of the ultrasonic biological identification device can be further enhanced, and the identification function of the ultrasonic biological identification device is improved.
In one embodiment, the ultrasonic detection device further comprises a cover plate assembly, wherein the cover plate assembly is arranged on the detection area of the ultrasonic sensing assembly and covers the detection area. Set up the apron subassembly and can play the effect of protection ultrasonic sensing subassembly, be favorable to increasing ultrasonic sensing subassembly's life.
A preparation method of an ultrasonic sensing assembly comprises the following steps:
providing an ultrasonic sensing component, wherein the ultrasonic sensing component can emit ultrasonic waves and receive the reflected ultrasonic waves, and the ultrasonic sensing component is provided with a non-detection area and a detection area for detecting an object to be detected;
and forming a reflecting layer on a non-detection area of the ultrasonic sensing assembly by using black conductive polytetrafluoroethylene coating, wherein the conductive polytetrafluoroethylene coating contains 40-60% of polytetrafluoroethylene by mass.
According to the preparation method of the ultrasonic biological recognition device, the reflecting layer is formed in the non-detection area of the ultrasonic sensing assembly, the detection area is exposed, the polytetrafluoroethylene coating for preparing the reflecting layer contains polytetrafluoroethylene with the mass percentage of 40% -60%, namely the main component of the formed reflecting layer is polytetrafluoroethylene, and the polytetrafluoroethylene is close to the acoustic resistance of air, so that the reflecting layer has the acoustic resistance close to the air, ultrasonic waves emitted by the ultrasonic sensing assembly and contacted with the reflecting layer can be reflected, the ultrasonic waves emitted by the ultrasonic sensing assembly and contacted with the reflecting layer can be reflected back, and can be partially or completely reflected to the detection area, the signal intensity of the ultrasonic waves in the detection area is increased, and the accuracy of the ultrasonic biological recognition device is improved; meanwhile, the reflecting layer is laminated on the ultrasonic sensing assembly, and the detection area is exposed, so that foreign matters can be prevented from being attached to the partial area of the ultrasonic sensing assembly, and the influence on the precision of the ultrasonic biological recognition device caused by the reflection of the ultrasonic waves conducted to the partial area when encountering the foreign matters and the like can be avoided; and because the black conductive polytetrafluoroethylene coating is prepared as the material for forming the reflecting layer, the reflecting layer can not only shield external light, but also shield external electromagnetic waves, so that the interference of the external light and the electromagnetic waves on the ultrasonic biological recognition device is avoided, and the precision of the ultrasonic biological recognition device is further improved, therefore, the recognition function of the ultrasonic biological recognition device prepared by the preparation method is more accurate.
In one embodiment, the method for forming the reflective layer on the non-detection area of the ultrasonic sensing assembly by using the black conductive polytetrafluoroethylene coating is screen printing or spraying. By both methods, the conductive teflon coating can be formed on the non-detection area of the ultrasonic sensing assembly.
An electronic device comprises the ultrasonic biological identification device. Because the identification function of the ultrasonic biological identification device is accurate, the electronic equipment containing the ultrasonic biological identification device can also identify accurately.
Drawings
FIG. 1 is a cross-sectional view of an ultrasonic biometric device according to one embodiment;
FIG. 2 is a cross-sectional view of another embodiment of an ultrasonic biometric device;
FIG. 3 is a cross-sectional view of another embodiment of an ultrasonic biometric device;
FIG. 4 is a cross-sectional view of another embodiment of an ultrasonic biometric device;
fig. 5 is a flowchart of a method for manufacturing an ultrasonic biometric device according to an embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1, an electronic device, such as a mobile phone, a computer, etc., according to an embodiment includes an ultrasonic biometric device 100, and the ultrasonic biometric device 100 may be used for fingerprint recognition, for example. The ultrasonic biometric device 100 includes a cover plate assembly 110, an ultrasonic sensing assembly 120, a reflective layer 130, and a circuit board 140.
The cover plate assembly 110 may be embedded in or laminated with the housing of the electronic device. The cover plate assembly 110 includes a cover plate 112 and an ink layer 114.
The cover plate 112 is a transparent member. The cover plate 112 is selected from one of a transparent glass plate, a quartz plate, an alumina plate and a transparent organic plate, and the cover plate 112 made of these materials not only has suitable mechanical strength, but also can meet the requirements of Industrial Design (ID). And in particular, the cover plate 112 is embedded in the housing of the electronic device, alternatively, the cover is stacked on the housing of the electronic device.
The ink layer 114 is laminated on one surface of the cover plate 112. The ink layer 114 may be formed on the cover plate 112 by screen printing or the like. Specifically, the ink layer 114 is a black ink layer or a white ink layer. The ink layer 114 is made of epoxy resin ink, and the acoustic resistance of the ink layer differs greatly from that of air, so that ultrasonic waves cannot be reflected, that is, propagation of the ultrasonic waves is hardly affected.
By providing the cover plate 112 as a transparent member and providing the ink layer 114 on the cover plate 112, the cover plate assembly 110 can have a desired color, and the cover plate assembly 110 can block external light.
The ultrasonic sensing component 120 can emit ultrasonic waves and receive the reflected ultrasonic waves, and convert the received ultrasonic waves into electrical signals to identify the object to be detected. For example, the object to be detected may be a finger. The ultrasonic sensor assembly 120 has a detection area 121 for detecting an object to be detected. The cover plate assembly 110 is disposed on the sensing region 121 of the ultrasonic sensing assembly 120 and covers the sensing region 121. More specifically, the ink layer 114 of the cover member 110 is laminated on the detection area 121 of the ultrasonic sensor member 120.
The ultrasonic sensor module 120 includes a thin film transistor 122, and a piezoelectric layer 124, a conductive layer 126, and an acoustic matching layer 128, which are sequentially stacked on the thin film transistor 122.
The thin film transistor 122 is provided with a circuit capable of converting an electric signal into an image signal.
A piezoelectric layer 124 is laminated on the thin film transistor 122. Piezoelectric layer 124 is capable of transmitting ultrasonic waves and receiving the reflected ultrasonic waves, and converting the received ultrasonic waves into electrical signals.
Specifically, the material of piezoelectric layer 124 is a ferroelectric polymer; more specifically, the material of piezoelectric layer 124 is P (VDF-TrFE) (a copolymer of polyvinylidene fluoride and trifluoroethylene). Wherein, in P (VDF-TrFE), the molar ratio of polyvinylidene fluoride to trifluoroethylene is 60, 70, 30, 80 or 90. It is to be understood that the material of piezoelectric layer 124 is not limited to the above-mentioned materials, for example, the material of piezoelectric layer 124 may also be a homopolymer of polyvinylidene chloride (PVDC), a copolymer of polyvinylidene chloride, a homopolymer of polytetrafluoroethylene, a copolymer of polytetrafluoroethylene, polyvinylidene fluoride or diisopropylamine bromide (DTPAB), or the like.
A conductive layer 126 is laminated on the piezoelectric layer 124 on a side away from the thin film transistor 122. Specifically, the conductive layer 126 is two layers, and the two conductive layers 126 are sequentially laminated on the piezoelectric layer 124. The two conductive layers 126 are made of silver. The two conductive layers 126 can be obtained by screen printing silver paste and then sintering, the conductive layers 126 can be more uniform due to the arrangement of the two conductive layers 126, and the surface of the conductive layer 126 far away from the piezoelectric layer 124 is smoother, so that the conduction of charges is facilitated. It is understood that the conductive layer 126 may be one layer or more than two layers.
An acoustic matching layer 128 is laminated on the conductive layer 126. Wherein, the side of the acoustic matching layer 128 far away from the conductive layer 126 is the detection area 121. Specifically, the acoustic matching layers 128 are laminated on one of the conductive layers 126 remote from the piezoelectric layer 124; the side of the acoustic matching layer 128 remote from the conductive layer 126 is laminated to the ink layer 114. The acoustic matching layer 128 is used to match the acoustic impedance of the object to be detected (e.g., the ridge line of a finger). The acoustic matching layer 128 is a Die Attach Film (DAF).
Wherein, the thickness of the acoustic matching layer 128 is 20 micrometers to 100 micrometers, and the thickness of the piezoelectric layer 124 is 8 micrometers to 10 micrometers. The acoustic matching layer 128 with the thickness can be well matched with the piezoelectric layer 124 with the thickness, so as to enhance the signal of the ultrasonic wave and improve the identification accuracy of the ultrasonic biological identification device 100.
Further, the ultrasonic biometric device 100 further includes an adhesive layer 150, and the adhesive layer 150 is disposed between the ultrasonic sensing element 120 and the cover member 110 and fixedly bonds the ultrasonic sensing element 120 and the cover member 110. Specifically, the adhesive layer 150 is disposed between the acoustic matching layer 128 and the ink layer 114. The adhesive layer 150 is made of liquid adhesive, and the liquid adhesive is epoxy resin glue, such as NCA3285 with han height.
It will be appreciated that the adhesive layer 150 may be omitted and the acoustic matching layer 128 may be formed directly on the ink layer 114, for example, by coating, screen printing, spraying, etc., wherein a glue is required to bond the conductive layer 126 and the matching layer 128 together, wherein the glue may be NCA3285 glue having a height of han. The cover assembly 110 may also be omitted, in which case the acoustic matching layer 128 is laminated directly to the housing of the electronic device, i.e., the housing of the electronic device replaces the cover assembly 110.
The reflection layer 130 is stacked on the ultrasonic sensing unit 120 and exposes the sensing region 121, wherein the reflection layer 130 is made of black conductive teflon paint. The reflective layer 130 can reflect ultrasonic waves, shield external electromagnetic waves, and shield external light.
Wherein, the polytetrafluoroethylene coating comprises, by mass, 40-60% of polytetrafluoroethylene, 6-10% of black conductive agent, 10-30% of solvent and auxiliary agent.
Because the acoustic resistance of the polytetrafluoroethylene is close to air, and the reflecting layer 130 is prepared from the conductive polytetrafluoroethylene coating, the conductive polytetrafluoroethylene coating contains 40-60% of polytetrafluoroethylene by mass percent, namely, the main component of the formed reflecting layer 130 is polytetrafluoroethylene, so that the reflecting layer 130 also has the acoustic resistance close to air, the ultrasonic wave contacting with the reflecting layer 130 can be reflected, so that the ultrasonic wave emitted by the ultrasonic sensing component 120 and contacting with the reflecting layer 130 can be reflected back, and can be partially or totally reflected to the detection area 121, thereby increasing the signal intensity of the ultrasonic wave in the detection area 121 and improving the accuracy of the ultrasonic biological recognition device; meanwhile, since the reflecting layer 130 is laminated on the ultrasonic sensing component 120 and exposes the detection area 121, foreign matters can be prevented from being attached to other areas of the ultrasonic sensing component 120, and the influence on the accuracy of the ultrasonic biological recognition device caused by the reflection of the ultrasonic waves which are not transmitted to the detection area 121 when encountering the foreign matters and the like can be avoided; moreover, the reflective layer 130 is made of black conductive teflon coating, so that the reflective layer 130 is black, and the reflective layer 130 can shield external light and external electromagnetic waves, thereby avoiding interference of the external light and the electromagnetic waves on the ultrasonic biological recognition device 100, and further improving the accuracy of the ultrasonic biological recognition device 100.
The black conductive agent not only serves as a conductive agent, but also serves as a coloring agent, and the reflective layer can be black by using 6-10% by mass of the black conductive agent, so that the reflective layer 130 can shield external light and external electromagnetic waves. Specifically, the black conductive agent is at least one selected from conductive carbon black, graphite and carbon powder. The conductive carbon black, graphite and carbon powder are not only conductive, but also black, so as to realize the functions of shielding external light and external electromagnetic waves of the reflective layer 130.
Wherein the solvent is hydrocarbon, alcohol, ketone or ester solvent. For example, mineral spirits, kerosene, gasoline, benzene, toluene, xylene, or the like.
The auxiliary agents are defoaming agents, leveling agents, and the like required for forming the polytetrafluoroethylene coating, and some substances, such as inorganic fillers, for imparting various properties to the polytetrafluoroethylene coating, for improving the adhesion properties. Usually, the mass percentage of the defoaming agent and the mass percentage of the leveling agent are both 0.1 to 0.5 percent. The defoaming agent is selected from one of emulsified silicone oil, high-alcohol fatty acid ester compound, polyoxyethylene polyoxypropylene pentaerythritol ether, polyoxyethylene polyoxypropylene amine ether, polyoxypropylene glycerol ether, polyoxypropylene polyoxyethylene glycerol ether and polydimethylsiloxane. The flatting agent is selected from one of acrylic resin, urea resin and melamine formaldehyde resin. The inorganic filler may be, for example, chromium sesquioxide or tin bronze powder, or the like. It will be appreciated that the inorganic filler may also be omitted.
Further, the teflon coating may further include metal powder, and the content of the metal powder may be added according to the required conductivity of the reflective layer 130. The metal powder is at least one selected from silver, iron and copper. The function of shielding external electromagnetic waves of the reflective layer 130 is improved by adding metal powder. It is understood that the metal powder may be omitted if the black conductive agent is added in an amount sufficient to shield the reflective layer 130 from external electromagnetic waves.
Further, in order to make the reflective layer 130 have better adhesion performance, a wetting agent layer with a thickness of approximately 5 μm may be disposed between the reflective layer 130 and the thin film transistor 122, so as to increase the adhesion performance of the reflective layer 130 on the thin film transistor 122.
Specifically, in the illustrated embodiment, the reflective layer 130 is stacked on the side of the thin film transistor 122 of the ultrasonic sensing component 120 away from the piezoelectric layer 124, so that it can be avoided that impurities are attached to the side of the thin film transistor 122 of the ultrasonic sensing component 120 away from the piezoelectric layer 124 in the subsequent manufacturing process or in the use process, so as to affect the accuracy of the ultrasonic biometric apparatus 100.
It is understood that the reflective layer 130 is not limited to the above arrangement, for example, the reflective layer 130 may wrap the ultrasonic sensing component 120 to expose only the detection region 121 for reflecting the side ultrasonic waves.
Further, the thickness of the reflective layer 130 is 20 to 50 micrometers. Adopt above-mentioned polytetrafluoroethylene coating to form reflection stratum 130, reflection stratum 130's thickness only needs 20 microns just can realize the reflection of ultrasonic wave to have better outside light effect of sheltering from and the effect of shielding outside electromagnetic wave, the thickness of control reflection stratum 130 is below 50 microns, in order to avoid ultrasonic wave biological recognition device 100 to have great thickness, ensures that ultrasonic wave biological recognition device 100 has suitable volume. The thickness of the reflective layer 130 can be adjusted as needed to adjust the volume of the ultrasound biometric apparatus 100.
The circuit board 140 is a flexible circuit board. The circuit board 140 is used to electrically connect the ultrasonic sensing assembly 120 and the chip of the ultrasonic fingerprint recognition device 100. Specifically, the circuit board 140 includes an EMI shielding layer, and the circuit board 140 is stacked on the side of the reflective layer 130 away from the thin film transistor 122, so that the electromagnetic wave shielding function of the ultrasonic biometric apparatus 100 can be further enhanced, and the identification function of the ultrasonic biometric apparatus 100 can be more accurate.
More specifically, one end of the circuit board 140 is electrically connected to the ultrasonic sensor assembly 120, and the other end is bent multiple times to form a bent section 142, and the bent section 142 is stacked on the reflective layer 130. Specifically, in the illustrated embodiment, the end of the circuit board 140 away from the bending section 142 is electrically connected to the conductive layer 126 and the circuit on the thin film transistor 122.
Further, a pressure sensitive adhesive layer 160 is disposed between the bending section 142 of the circuit board 140 and the reflective layer 130 to fixedly bond the circuit board 140 and the reflective layer 130.
It is understood that the circuit board 140 may not be laminated with the reflective layer 130, and in this case, the pressure sensitive adhesive layer 160 may be omitted.
Further, the width of both conductive layers 126 is less than the width of piezoelectric layer 124, and the width of conductive layer 126 away from piezoelectric layer 124 is less than the width of conductive layer 126 near piezoelectric layer 124, the width of the piezoelectric layer 124 is smaller than that of the thin film transistor 122 to form a stepped portion 129, wherein the circuit board 140 is bonded (bonded) to the conductive layer 126 adjacent to the piezoelectric layer 124 and the circuit of the thin film transistor 122 at the stepped portion 129. Bonding of the circuit board 140 and the conductive layer 126 and the thin film transistor 122 can be facilitated by providing the step portion 129.
The ultrasonic biometric device 100 has at least the following advantages:
the ultrasonic wave sensor not only can emit ultrasonic waves which are transmitted towards the direction of the screen, but also can emit ultrasonic waves which are transmitted towards the direction far away from the screen, reflected waves formed after the ultrasonic waves transmitted towards the direction of the screen contact an object to be detected are received by the ultrasonic wave sensor to form an image, the formed reflected waves can also be received by the ultrasonic wave sensor to form an image if the ultrasonic waves transmitted towards the direction far away from the screen meet foreign matters and the like, so that the identification accuracy of the ultrasonic wave biological identification device is influenced, in the ultrasonic wave biological identification device 100, the reflection layer 130 is arranged on the ultrasonic wave sensing component 120, the detection area 121 is exposed, the black conductive polytetrafluoroethylene coating forming the reflection layer 130 contains 40-60% of polytetrafluoroethylene by mass, namely the main component of the formed reflection layer 130 is polytetrafluoroethylene, the acoustic resistance of the polytetrafluoroethylene is close to the acoustic resistance of air, the reflection layer 130 has the acoustic resistance close to the air, the ultrasonic wave which is in contact with the reflection layer 130 and can reflect the ultrasonic waves emitted by the ultrasonic wave sensing component 120 and are reflected back to the reflection layer 130, so that the intensity of the ultrasonic wave signal in the detection area 121 is increased, and the biological identification device 100 is improved.
Experiments prove that the difference between the acoustic resistance of the reflecting layer formed by the black conductive polytetrafluoroethylene coating containing 40-60 mass percent of polytetrafluoroethylene and the acoustic resistance of air is 1-2 MRayl, which is very close to that of air.
Meanwhile, since the reflection layer 130 is laminated on the ultrasonic sensing element 120 and exposes the detection region 121, it is possible to prevent foreign substances from adhering to the partial region of the ultrasonic sensing element 120 and prevent the ultrasonic waves transmitted to the partial region from reflecting when encountering foreign substances and the like to affect the accuracy of the ultrasonic biometric recognition apparatus 100.
And because the material forming the reflecting layer 130 is the black conductive polytetrafluoroethylene coating, the reflecting layer 130 can not only shield external light, but also shield external electromagnetic waves, so as to avoid the interference of the external light and the electromagnetic waves on the ultrasonic biological recognition device 100, and further improve the precision of the ultrasonic biological recognition device 100, therefore, the recognition function of the ultrasonic biological recognition device 100 is relatively precise.
In addition, since the ultrasonic biometric identification device 100 identifies more accurately, the electronic equipment using the ultrasonic biometric identification device 100 also has better identification performance.
As shown in fig. 2, an ultrasonic biometric device 200 according to another embodiment has substantially the same configuration as the ultrasonic biometric device 100, except that the circuit board 210 of the ultrasonic biometric device 200 according to the present embodiment is not laminated on the reflection layer 220.
Since the structure of the ultrasonic biometric device 200 according to the present embodiment is substantially the same as that of the ultrasonic biometric device 100, the ultrasonic biometric device 200 has similar effects to those of the ultrasonic biometric device 100.
As shown in fig. 3, an ultrasonic biometric device 300 according to another embodiment has substantially the same structure as the ultrasonic biometric device 100, except that the acoustic matching layer 312 of the ultrasonic sensor unit 310 of the ultrasonic biometric device 300 according to the embodiment is directly formed on the cover member 320 by a process such as coating or screen printing, and at this time, the acoustic matching layer 312 and the conductive layer 314 of the ultrasonic sensor unit 310 may be bonded together by the adhesive layer 330.
Since the structure of the ultrasonic biometric device 300 according to the present embodiment is substantially the same as the structure of the ultrasonic biometric device 100, the ultrasonic biometric device 300 also has similar effects to the ultrasonic biometric device 100.
As shown in fig. 4, an ultrasonic biometric device 400 according to another embodiment has substantially the same structure as the ultrasonic biometric device 100, except that a cover member is not provided on the side of the ultrasonic sensor unit 410 away from the reflection layer 420, and in this case, the acoustic matching layer 412 of the ultrasonic sensor unit 410 may be directly laminated on the housing of the electronic device.
Since the structure of the ultrasonic biometric device 400 according to the present embodiment is substantially the same as the structure of the ultrasonic biometric device 100, the ultrasonic biometric device 400 has similar effects to the ultrasonic biometric device 100.
As shown in fig. 5, a method for manufacturing an ultrasonic biometric apparatus according to an embodiment is a method for manufacturing the ultrasonic biometric apparatus. The preparation method of the ultrasonic biological recognition device comprises the following steps:
step S610: an ultrasonic sensing assembly is provided.
The ultrasonic sensing assembly can emit ultrasonic waves and receive reflected waves of the ultrasonic waves, and the ultrasonic sensing assembly is provided with a non-detection area and a detection area for detecting an object to be detected.
The ultrasonic sensing component comprises a thin film transistor, and a piezoelectric layer, a conductive layer and an acoustic matching layer which are sequentially stacked on the thin film transistor. One side of the acoustic matching layer, which is far away from the conductive layer, is a detection area; and the side of the thin film transistor, which is far away from the piezoelectric layer, and the side of the ultrasonic sensing assembly are non-detection areas.
Step S620: a black conductive teflon paint is used to form a reflective layer on the non-detection area of the ultrasonic sensing assembly.
In this embodiment in particular, a black conductive teflon paste is used to form a reflective layer on the side of the thin film transistor remote from the piezoelectric layer.
Wherein, the polytetrafluoroethylene coating comprises, by mass, 40-60% of polytetrafluoroethylene, 6-10% of black conductive agent, 10-30% of solvent and auxiliary agent.
The black conductive agent not only serves as a conductive agent, but also serves as a coloring agent, and the reflective layer can be black by using 6-10% by mass of the black conductive agent, so that the reflective layer 130 can shield external light and external electromagnetic waves. Specifically, the black conductive agent is at least one selected from conductive carbon black, graphite and carbon powder. The conductive carbon black, the graphite and the carbon powder can conduct electricity and are black so as to realize the functions of shielding external light and external electromagnetic waves of the reflecting layer.
Wherein the solvent is hydrocarbon, alcohol, ketone or ester solvent. For example, mineral spirits, kerosene, gasoline, benzene, toluene, xylene, or the like.
The auxiliary agents are defoaming agents, leveling agents and the like required for forming the polytetrafluoroethylene coating, and some substances such as inorganic fillers for imparting various properties to the polytetrafluoroethylene coating, for improving the adhesion property. Usually, the mass percentage of the defoaming agent and the mass percentage of the leveling agent are both 0.1 to 0.5 percent. The defoaming agent is selected from one of emulsified silicone oil, high alcohol fatty acid ester compound, polyoxyethylene polyoxypropylene pentaerythritol ether, polyoxyethylene polyoxypropylene amine ether, polyoxypropylene glycerol ether, polyoxypropylene polyoxyethylene glycerol ether and polydimethylsiloxane. The flatting agent is one of acrylic resin, urea-formaldehyde resin and melamine-formaldehyde resin. The inorganic filler may be, for example, chromium sesquioxide or tin bronze powder, or the like. It will be appreciated that the inorganic filler may also be omitted.
Specifically, the black conductive polytetrafluoroethylene coating can be obtained by stirring and mixing polytetrafluoroethylene, a black conductive agent, a solvent, and an additive.
Furthermore, metal powder is added in the step of stirring and mixing the polytetrafluoroethylene, the black conductive agent, the solvent and the additive, and the metal powder is selected from at least one of silver, iron and copper, so that the function of shielding external electromagnetic waves of the reflecting layer is improved. The content of the metal powder may be added according to the required conductive performance of the reflective layer 130. It is understood that the metal powder may be omitted if the black conductive agent is added in an amount sufficient to provide the reflective layer with an effect of shielding external electromagnetic waves.
Further, in order to make the reflective layer have better adhesion performance, the step of forming the reflective layer on the non-detection area of the ultrasonic sensing assembly by using the polytetrafluoroethylene coating specifically comprises the following steps: coating a substrate wetting agent on one side of the thin film transistor, which is far away from the piezoelectric layer, so as to form a wetting layer; then coating polytetrafluoroethylene paint on the wetting layer to form a reflecting layer. The adhesion property of the reflective layer on the thin film transistor can be increased. In particular, the thickness of the wetting layer is approximately 5 microns.
Specifically, the method of forming the reflective layer on the non-detection area of the ultrasonic sensing assembly using the teflon paint is screen printing or spraying.
The preparation method of the ultrasonic biological recognition device is simple to operate and easy for industrial production. The ultrasonic biological recognition device prepared by the preparation method of the ultrasonic biological recognition device has a relatively accurate recognition function.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (14)
1. An ultrasonic biometric device, comprising:
the ultrasonic sensing assembly can emit ultrasonic waves and receive the reflected ultrasonic waves, and is provided with a detection area for detecting an object to be detected; and
the reflecting layer is stacked on the ultrasonic sensing assembly, the detection area is exposed, the reflecting layer is formed by black conductive polytetrafluoroethylene coating, and the conductive polytetrafluoroethylene coating comprises polytetrafluoroethylene with the mass percentage of 40% -60% and a black conductive agent with the mass percentage of 6% -10%;
the ultrasonic sensing component comprises a thin film transistor, and a piezoelectric layer, a conductive layer and an acoustic matching layer which are sequentially stacked on the thin film transistor, wherein one side, far away from the conductive layer, of the acoustic matching layer is the detection area, and the reflecting layer is stacked on one side, far away from the piezoelectric layer, of the thin film transistor;
the conducting layers are two layers, and the two conducting layers are sequentially stacked on the piezoelectric layer.
2. The ultrasonic biological recognition device of claim 1, wherein the conductive polytetrafluoroethylene coating further comprises a solvent and an auxiliary agent in a mass percentage of 10% -30%, wherein the solvent is a hydrocarbon solvent, an alcohol solvent, a ketone solvent or a lipid solvent, and the auxiliary agent is a defoaming agent, a leveling agent or an inorganic filler.
3. The ultrasonic biometric apparatus according to claim 1, wherein the black conductive agent is at least one selected from conductive carbon black, carbon powder and graphite.
4. The ultrasonic biological recognition device of claim 1, wherein the conductive polytetrafluoroethylene coating further comprises a metal powder selected from at least one of silver, iron, and copper.
5. The ultrasonic biometric device according to claim 1, wherein the reflective layer has a thickness of 20 to 50 micrometers.
6. The ultrasonic biological recognition device according to claim 1, further comprising a circuit board, wherein the width of each of the two conductive layers is smaller than the width of the piezoelectric layer, the width of the conductive layer far from the piezoelectric layer is smaller than the width of the conductive layer near the piezoelectric layer, and the width of the piezoelectric layer is smaller than the width of the thin film transistor to form a stepped portion, wherein the circuit board is bonded to the conductive layer near the piezoelectric layer and the thin film transistor at the stepped portion, respectively.
7. The ultrasonic biometric device according to claim 1, wherein the acoustic matching layer has a thickness of 20 to 100 micrometers and the piezoelectric layer has a thickness of 8 to 10 micrometers.
8. The ultrasonic biometric identification device of claim 1, further comprising a circuit board, the circuit board being a flexible circuit board containing an EMI shielding layer, the circuit board being laminated to the side of the reflective layer distal from the ultrasonic sensing assembly.
9. The ultrasonic biometric identification device of claim 1, further comprising a cover assembly disposed over and covering the detection area of the ultrasonic sensing assembly.
10. The ultrasonic biological recognition device of claim 9, wherein the cover plate assembly comprises a cover plate and an ink layer, the cover plate is a transparent member, the ink layer is laminated on one surface of the cover plate, and the ink layer is a black ink layer or a white ink layer.
11. The ultrasonic biometric device according to claim 10, wherein the cover plate is one selected from a transparent glass plate, a quartz plate, an alumina plate, and a transparent organic plate; the ink layer is made of epoxy resin ink.
12. The preparation method of the ultrasonic biological recognition device is characterized by comprising the following steps of:
providing an ultrasonic sensing component, wherein the ultrasonic sensing component can emit ultrasonic waves and receive the reflected ultrasonic waves, and the ultrasonic sensing component is provided with a non-detection area and a detection area for detecting an object to be detected; the ultrasonic sensing assembly comprises a thin film transistor, and a piezoelectric layer, a conductive layer and an acoustic matching layer which are sequentially stacked on the thin film transistor, wherein one side, far away from the conductive layer, of the acoustic matching layer is a detection area, the conductive layer is two layers, and the two conductive layers are sequentially stacked on the piezoelectric layer;
forming a reflecting layer on a non-detection area of the ultrasonic sensing assembly by using a black conductive polytetrafluoroethylene coating, wherein the conductive polytetrafluoroethylene coating comprises polytetrafluoroethylene with the mass percentage of 40-60% and a black conductive agent with the mass percentage of 6-10%; the reflective layer is laminated on a side of the thin film transistor remote from the piezoelectric layer.
13. The method of manufacturing an ultrasonic biometric apparatus according to claim 12, wherein the method of forming the reflective layer on the non-detection region of the ultrasonic sensing member using the black conductive teflon paint is screen printing or spraying.
14. An electronic device comprising the ultrasonic biometric apparatus according to any one of claims 1 to 11.
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| WO2021081776A1 (en) * | 2019-10-29 | 2021-05-06 | 南昌欧菲生物识别技术有限公司 | Ultrasonic fingerprint module, manufacturing method therefor, and electronic device |
| WO2021081778A1 (en) * | 2019-10-29 | 2021-05-06 | 南昌欧菲生物识别技术有限公司 | Ultrasonic fingerprint module, manufacturing method therefor, and electronic device |
| WO2021081777A1 (en) * | 2019-10-29 | 2021-05-06 | 南昌欧菲生物识别技术有限公司 | Ultrasonic fingerprint module, fabrication method therefor and electronic device |
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