CN109455665A - A kind of meso-scale structural mechanics assembled formation method of non-lithographic - Google Patents
A kind of meso-scale structural mechanics assembled formation method of non-lithographic Download PDFInfo
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- CN109455665A CN109455665A CN201811232182.XA CN201811232182A CN109455665A CN 109455665 A CN109455665 A CN 109455665A CN 201811232182 A CN201811232182 A CN 201811232182A CN 109455665 A CN109455665 A CN 109455665A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/005—Bulk micromachining
- B81C1/00515—Bulk micromachining techniques not provided for in B81C1/00507
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam
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Abstract
Present disclose provides a kind of meso-scale structural mechanics assembled formation methods of non-lithographic, for obtaining the three-dimensional target configuration of meso-scale, comprising the following steps: design procedure: design two-dimentional precursor construction corresponding with target configuration and the pre-stretching dependent variable for the assembly platform by two-dimentional precursor construction mechanics assembled formation for target configuration；Manufacturing step: using femtosecond laser cutting two-dimensional surface material to form two-dimentional precursor construction；Mechanics assembled formation step: two-dimentional precursor construction is fixed on the assembly platform with pre-stretching dependent variable, release assembly platform makes two-dimentional precursor construction at least partly bending deformation, to form target configuration.The preparation method machining accuracy is high and is suitable for various types of high performance materials；Can efficiently, economically fabricate meso-scale structure, it is less to use chemical reagent, it is environmentally friendly；Semiconductor fabrication process can be compatible with.
Description
Technical field
This disclosure relates to which the meso-scale structural mechanics of technical field of micro and nano fabrication more particularly to a kind of non-lithographic is assembled into
Type method.
Background technique
The complex three-dimensional structure of meso-scale (between both macro and micro, it is considered that between nanometer and millimeter), extensively
It is present in the biosystems such as cytoskeleton, neural network, vascular network, and assumes responsibility for most basic life body function.It is another
Aspect, the micro structural component of meso-scale is in biomedical devices, MEMS, Meta Materials, energy storage device, photoelectric sensor
It has a wide range of applications in part etc..Therefore, the manufacture of the three-dimensional structure of meso-scale is always focus and the forward position of Technological research.
Nearly ten years, the three-dimensional structure of meso-scale is difficult to be obtained with traditional machining process, molding and manufacture
It has been a hot spot of research.Currently, the main manufacture methods of meso-scale three-dimensional structure have: general lithographic definition machine-shaping
Technique is bent packaging technology, the coining based on template and growth work by self-assembled molding technique, the residual stress of liquid medium
Skill, the increasing material manufacturing technique based on laser writing technology, increasing material manufacturing technique based on 3D printing technique etc..
The manufacturing method of existing meso-scale three-dimensional structure has the disadvantages that
First, the applicability of these techniques is not strong, by material, product configuration etc. limit, such as laser direct-writing technique by
It is limited to light-sensitive material, 3D printing technique is limited to high molecular material, metal powders melt, and it is limited that residual stress is bent packaging technology
In molding structure etc.；
Second, the efficiency of these techniques is lower；
Third, these techniques are needed in implementation process using a large amount of chemical reagent, and mostly have toxicity, it is difficult to be done
To environmental-friendly；
4th, these techniques are difficult with compatible with semiconductor fabrication process.
Summary of the invention
A kind of meso-scale structural mechanics assembled formation method for being designed to provide non-lithographic of the disclosure, this method is not
It is limited by rapidoprint, environmental protection, efficiently, and semiconductor fabrication process can be compatible with.
To achieve the above object, the disclosure provides a kind of meso-scale structural mechanics assembled formation method of non-lithographic,
For obtaining the three-dimensional target configuration of meso-scale, by two-dimentional precursor construction in the assembly platform with pre-stretching dependent variable
Upper by mechanics assembled formation is the target configuration, the forming method the following steps are included:
Design procedure: it designs two-dimentional precursor construction corresponding with the target configuration and is used for the two-dimentional forerunner
Body structural mechanics assembled formation is the pre-stretching dependent variable of the assembly platform of the target configuration；
Manufacturing step: two-dimensional surface material is cut using femtosecond laser to form the two-dimentional precursor construction；
Mechanics assembled formation step: the two-dimentional precursor construction is fixed on described in the pre-stretching dependent variable
Assembly platform, discharging the assembly platform makes the two-dimentional precursor construction bending deformation, to form the target configuration.
Preferably, the design procedure includes bending deformation region and the key for the one for designing the two-dimentional precursor construction
Region is closed, the bending deformation region is used for bending deformation, and the bond area is for being fixed on the assembly platform.
Preferably, the design procedure is further comprising the steps of:
It is obtained after buckling induces using large deformation theory of mechanics and FEM calculation the prediction two-dimentional precursor construction
3-d modelling, i.e., induction configuration；
Compare the induction configuration and the target configuration；
According to two dimension precursor construction described in comparing result iterated revision and/or the pre-stretching dependent variable.
Preferably, in the design procedure, when designing the two-dimentional precursor construction, laser cutting width is added
Compensation rate k × n；
Wherein:
K is scale factor, and value range is 0.2 to 1；
N is laser cutting width.
Preferably, in the manufacturing step, femtosecond laser cutting technique is adjusted to following parameter: laser beam energy
Strength range are as follows: 1 μ J to 5 μ J；
Scanning linear velocity when laser cutting are as follows: 1mm/s to 40mm/s；
Protective gas pressure are as follows: 0.1bar to 0.2bar.
Preferably, the parameter of the femtosecond laser cutting technique is adjusted according to the type of the two-dimensional surface material.
Preferably, in the manufacturing step, high-molecular organic material is spun on the hard substrate of carrying or is incited somebody to action
Finished films are attached at the hard substrate of carrying, and the two dimension for being then formed in the hard substrate using femtosecond laser cutting is flat
Plane materiel material and obtain the two-dimentional precursor construction.
Preferably, the two-dimensional surface material is formed as the composite membrane of polyimides and gold.
Preferably, the assembly platform is loaded along the mutually perpendicular x-axis direction of the assembly platform and y-axis direction double
Axis pulling force to obtaining the pre-stretching dependent variable,
The two-dimentional precursor construction that cutting is obtained is transferred to the assembly platform.
Preferably, two-dimentional precursor construction cutting obtained is transferred to the assembling by water-soluble adhesive tape and puts down
Platform.
The mechanics assembled formation method for the meso-scale structure that the disclosure provides cuts two-dimentional presoma using femtosecond laser
Structure is had the advantages that by mechanics assembled formation objective configuration
First, machining accuracy is high, and the performance of material is not influenced by processing, and is suitable for various types of high-performance materials
Material.Limitation of the material to processing in manufacture meso-scale structure is overcome, and preferable processing quality can be obtained；
Second, can efficiently, economically fabricate meso-scale structure, realize that high-volume manufactures, and less use chemistry
Reagent has the advantages that environmental-friendly；
Third can be compatible with semiconductor fabrication process, can be adjusted, be can be realized and semiconductor system by simple equipment
Make process compatible with dock；
4th, the forming method biomedical devices, integrated circuit, in terms of have it is good, important
Application prospect.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and together with specification for explaining the principles of this disclosure.
Fig. 1 is a kind of flow chart of the meso-scale structural mechanics assembled formation method for non-lithographic that the disclosure provides；
Fig. 2 is a kind of signal of the meso-scale structural mechanics assembled formation method process for non-lithographic that the disclosure provides
Figure；
Fig. 3 is that ten of the meso-scale structural mechanics assembled formation method for a kind of non-lithographic that the disclosure provides are specific real
The schematic diagram of the two-dimentional precursor construction and induction configuration in example is applied, it is 1 to 10 which numbers respectively, wherein left
Side is the two-dimentional precursor construction of design, represents bond area using shade filling, right side is corresponding finite element prediction
Induce configuration；
Fig. 4 a is that a kind of meso-scale structural mechanics assembled formation method of the non-lithographic provided according to the disclosure designs
One embodiment of two-dimentional precursor construction, shows the size of two-dimentional precursor construction, and dimensional units mm corresponds to Fig. 3
In No. 1 embodiment；
Fig. 4 b is that a kind of meso-scale structural mechanics assembled formation method of the non-lithographic provided according to the disclosure designs
Another embodiment of two-dimentional precursor construction, shows the size of two-dimentional precursor construction, and dimensional units mm corresponds to figure
No. 2 embodiments in 3；
Fig. 4 c is that a kind of meso-scale structural mechanics assembled formation method of the non-lithographic provided according to the disclosure designs
The further embodiment of two-dimentional precursor construction, shows the size of two-dimentional precursor construction, and dimensional units mm corresponds to figure
No. 5 embodiments in 3；
Fig. 5 a is No. 1 embodiment in Fig. 3, i.e. the implementation of the corresponding two-dimensional surface material of two dimension precursor construction in Fig. 4 a
The pictorial diagram of example, shows the material object of the two-dimensional surface material through femtosecond laser cutting processing；
Fig. 5 b is No. 5 embodiments in Fig. 3, i.e. the implementation of the corresponding two-dimensional surface material of two dimension precursor construction in Fig. 4 c
The pictorial diagram of example, shows the material object of the two-dimensional surface material through femtosecond laser cutting processing；
Fig. 5 c is No. 1 embodiment and No. 5 embodiments in Fig. 3, i.e. in Fig. 4 a and Fig. 4 c before the corresponding two dimension of X-Y scheme
The pictorial diagram for driving the embodiment of body structure, shows the material object of the two-dimentional precursor construction through femtosecond laser cutting processing；
Fig. 6 a is No. 1 embodiment in Fig. 3, i.e. the embodiment of two-dimentional precursor construction in Fig. 5 a is cut through femtosecond laser
The partial, detailed view of laser confocal microscope after processing, it is shown that the cutting width of femtosecond laser processing, and after processing
Plane quality after the actual linewidth of obtained forerunner's volume graphic, and laser processing；
Fig. 6 b is No. 5 embodiments in Fig. 3, i.e. the embodiment of two-dimentional precursor construction in Fig. 5 b is cut through femtosecond laser
The partial, detailed view of laser confocal microscope after processing, it is shown that the cutting width of femtosecond laser processing, and after processing
Plane quality after the actual linewidth of obtained forerunner's volume graphic, and laser processing；
Fig. 7 is No. 5 embodiments in Fig. 3, i.e. after the embodiment mechanics assembling of two-dimentional precursor construction in Fig. 5 b at
The microscope photo of the meso-scale structure of type.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all implementations consistent with this disclosure.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects be described in detail in claims, the disclosure.
The disclosure provides a kind of meso-scale structural mechanics assembled formation method of non-lithographic, and the forming method is by by two
Precursor construction (the two-dimentional precursor construction manufactured according to X-Y scheme) installation is tieed up to the assembling with pre-stretching dependent variable
Platform simultaneously, and then make two-dimentional precursor construction mechanics assembling (i.e. mechanics buckling three-dimensional assembles) be shaped to objective configuration (under
Text is referred to as target configuration).Fig. 1 and Fig. 2 is respectively flow chart and the process signal of a specific embodiment of the forming method
Figure.
As depicted in figs. 1 and 2, which can generally comprise design procedure, manufacturing step and mechanics assembled formation
Step.
In design procedure:
Target configuration has corresponding X-Y scheme, according to the two-dimensional structure of X-Y scheme manufacture (i.e. before two dimension
Drive body structure) above-mentioned target configuration can be formed through bending deformation；The two dimension precursor construction is designed (for example, two-dimentional forerunner
The shapes and sizes of body structure), also the pre-stretching dependent variable of design and assembly platform is (for example, the loading direction of prestretching force and pre-
The size of elongation strain amount), the bending deformation region and installation region of two-dimentional precursor construction and assembly platform can also be designed
(for example, the position of installation region and quantity in two-dimentional precursor construction).
Can also include amendment step in design procedure:
The bending deformation of two-dimentional precursor construction is analyzed using three-dimensional large deformation theory of mechanics, determines two dimension forerunner
The material relevant parameter of body structure, above-mentioned material relevant parameter is inputted, and uses finite element analysis computation, predicts the X-Y scheme
The three-dimensional structure (i.e. induction configuration) that shape can be obtained actually after bending deformation；
Induction configuration is compared with target configuration, according to the above-mentioned two dimension precursor construction of comparing result iterated revision,
The pre-stretching dependent variable of the installation region and assembly platform of two-dimentional precursor construction and assembly platform.
Fig. 3 provides ten specific embodiments of two-dimentional precursor construction.Fig. 4 a to Fig. 4 c shows two-dimentional presoma in Fig. 3
The X-Y scheme of three specific embodiments of structure, shows bending deformation region 20 and bond area 10.
, can be to the progress finite element analysis of two-dimentional precursor construction in amendment step, the 3-d modelling induced, i.e.,
Configuration is induced, induction configuration and target configuration are compared, judges to induce configuration whether consistent with target configuration:
If consistent, into subsequent manufacturing step；
If inconsistent, the installation region of two-dimentional precursor construction and/or two-dimentional precursor construction and assembly platform is modified
And/or the pre-stretching dependent variable of assembly platform.
It should be appreciated that the parameter of modification can be two-dimentional precursor construction, the peace of two-dimentional precursor construction and assembly platform
Fill region, assembly platform any one of pre-stretching dependent variable three, both appoint or all.
In design procedure, it is also contemplated that the influence of femtosecond laser cutting width, i.e., determine laser cutting width n it
Afterwards, compensation rate k × n of laser cutting width the design of two-dimentional precursor construction is added, wherein k is scale factor, value model
Enclose is 0.2 to 1.
Meet the X-Y scheme that manufacture requires in this way, being conducive to design, to more accurately form two-dimentional presoma knot
Structure.
In manufacturing step:
Two-dimentional precursor construction is manufactured according to the X-Y scheme determined in design procedure, is cut particular by femtosecond laser
Technique cuts two-dimensional surface material and forms two-dimentional precursor construction.In manufacturing step, be cut into two-dimentional precursor construction it
Before, the parameter of femtosecond laser cutting technique can be adjusted, for example, femtosecond laser beam energy intensity range is adjusted to
The cutting scanning linear velocity of femtosecond laser is adjusted to 1mm/s to 40mm/s, by the protective gas in cutting process by 1 μ J to 5 μ J
Pressure is adjusted to 0.1bar to 0.2bar.
It can obtain following using the femtosecond laser cutting technique with above-mentioned parameter the utility model has the advantages that can obtain lesser
It is cut by laser width, and then improves the resolution ratio of two-dimentional precursor construction, that is, obtains lesser minimum feature, to obtain preferable
Two-dimentional precursor construction plane quality.
The disclosure cuts to form two-dimentional precursor construction using femtosecond laser, the laser arteries and veins excited with femtosecond pulse duration
Rush that the duration is extremely short, instantaneous focal power is high, so that femtosecond laser cutting technique has the advantage that 1) femtosecond laser is empty
Between high resolution, machining accuracy reach sub-micron, be only more than mostly light since Gaussian Profile is presented in femtosecond laser light intensity space
Son absorbs the irradiation area of threshold value, specific processing behavior just occurs, and the machining accuracy for obtaining femtosecond laser is less than focal beam spot
Size；2) femtosecond laser is not selective and restricted to rapidoprint, can carry out retrofit and processing to any material；
3) femtosecond laser worked structure does not have melting area, avoids the generation of micro-crack, realizes " cold " processing on relative meaning, from
And avoid the numerous negative effects of fuel factor bring in processing.
A kind of meso-scale structural mechanics assembled formation method for non-lithographic that the disclosure provides is cut using femtosecond laser
Two-dimentional precursor construction, and the target configuration of mechanics assembled formation three-dimensional is combined, it has the advantages that
First, machining accuracy is high, material property is not influenced by processing, and is suitable for various types of high performance materials,
Limitation of the material to processing in manufacture meso-scale structure is overcome, and preferable processing quality can be obtained；
Second, can efficiently, economically fabricate meso-scale structure, and it is less use chemical reagent, realize environment friend
It is good；
Third can be compatible with semiconductor fabrication process, can be adjusted, be can be realized and semiconductor system by simple equipment
Make process compatible with dock；
4th, the forming method biomedical devices, integrated circuit, in terms of have it is good, important
Application prospect.
The parameter that above-mentioned femtosecond laser cutting technique can be adjusted according to the material of meso-scale structure, thus each material
Material all has the parameter of its corresponding femtosecond laser cutting technique.In this way, femtosecond laser cutting technique can be suitable for each
The cutting processing of the two-dimentional precursor construction of kind material, overcomes the limitation of material.
In manufacturing step, high-molecular organic material is spun on the hard substrate of carrying (for example, sheet glass or silicon
Piece)；It is either heavy with the smooth hard substrate (for example, sheet glass perhaps silicon wafer) for being attached at carrying of film or by chemistry
Product growth technique forms two-dimensional surface material in hard substrate；Later, using the two dimension in femtosecond laser cutting hard substrate
Planar materials are to obtain two-dimentional precursor construction.
In the embodiment that two-dimensional surface material is formed as plane membrane structure, in design procedure, when progress finite element
Material parameter when analytical calculation, in addition to needing to be added two-dimentional precursor construction, it is also necessary to the thickness of two-dimentional precursor construction be added
Spend parameter.
Above-mentioned plane membrane structure can overlap to form for monofilm (such as thin layer of gold, silver perhaps copper) or multilayer film, than
Such as, be formed as the composite membrane of polyimides and metal (such as gold, silver or copper) thin layer.In semiconductor processing, belonging to thin layer can be with
As the material for the functional layer for forming component, polyimides can be used as the protective layer material of functional layer, and playing prevents first device
The effect of part short circuit, such plane membrane structure are more suitable for semiconductor technology.
In manufacturing step, in addition to being cut according to the type of material, material to the absorptivity adjustment femtosecond laser of laser energy
The parameter of technique is cut, the parameter of femtosecond laser cutting technique can also be adjusted according to the thickness of plane membrane structure.
The forming method can adjust the technological parameter of laser according to material, take full advantage of femtosecond laser to two dimension
Under the premise of the advantages of high manufacturing accuracy of planar materials, additionally it is possible to overcome the limitation of material.
In mechanics assembled formation step, the installation region of two-dimentional precursor construction can be by the method for bonding, reliably
Ground is connected to assembly platform.The mode of bonding is determined according to the property of selected materials, i.e., (is pacified by improving bond area 10
Fill region) Surface binding energy, stable joint surface is formed, to achieve the purpose that bonding, it is ensured that two-dimentional precursor construction with
Assembly platform assembling securely engagement.
The dependent variable of assembly platform can be obtained by way of loading twin shaft pulling force, i.e., along the orthogonal of assembly platform
X-axis direction and y-axis direction distinguish loading tensile Fx and Fy.Assembly platform stretch by stretching-machine and obtains above-mentioned answer
When variable, the uniform region of all directions dependent variable is formed for assembling two-dimentional presoma knot in the middle section of assembly platform
Structure.Biaxial stretch-formed easy implementation simultaneously can obtain the uniform region of above-mentioned dependent variable met the requirements on assembly platform.
After being cut into two-dimentional precursor construction according to designed X-Y scheme, by transfer technique by two-dimentional forerunner
Body Structure transfer is to assembly platform.In transfer process, it can be transferred by water-soluble adhesive tape as seal.It is, of course, also possible to
Using other seals, such as dimethyl silicone polymer (PDMS) seal.
A specific embodiment of the disclosure is provided below.
First according to the two-dimentional precursor construction of target configuration design object configuration, and design the two dimension precursor construction
The distributing position for the bond area 10 being bonded with assembly platform and the pre-stretching dependent variable of assembly platform.With No. 1 configuration in Fig. 3
For target, the pre-stretching dependent variable of the x-axis obtained by theoretical calculation and y-axis is 30%, the processing ruler of two-dimentional precursor construction
Very little and bond area 10, bending deformation region 20 are as shown in fig. 4 a.
Bending deformation analysis is carried out by three-dimensional large deformation theory of mechanics for two-dimentional precursor construction.Group is determined with this
The material parameter of assembling structure, plane membrane structure thickness parameter (such as according to analysis result, choosing planar film is 5 μm of thickness
Polyimides and 160nm gold it is compound), above-mentioned material relevant parameter is input to finite element analysis computation, buckling is obtained and lures
Three-dimensional structure after leading, i.e. induction configuration.Obtained induction configuration is compared with target configuration, with the design of this iterated revision
10 position of two-dimentional precursor construction and bond area.
High-molecular organic material, can be spun on carrying silicon by the two-dimensional surface membrane material for making two-dimentional precursor construction
Piece, or the method that can be grown by chemical deposition, or bearing basement is attached at by commercial film is smooth.
The machined parameters of femtosecond laser are adjusted, and two-dimentional precursor construction is gone out using femtosecond laser cutting processing.Herein, will
The machined parameters of two-dimentional precursor construction are adjusted to as follows:
Laser beam energy intensity is 2 μ J；
Laser cutting scanning linear velocity is 10mm/s；
Protective gas pressure is 0.1bar.
Under this parameter, it is cut by laser n=104 μm of width, on the basis of former design size, laser cutting width is added
52 μm of compensation rate (k × n=0.5 × 104 μm) of n.
Assembly platform (substrate) is prepared using silicon rubber, loads twin shaft pulling force F along x-axis and y-axis directionxAnd FyIt is obtained with this
Above-mentioned pre-stretching dependent variable.
The two-dimentional precursor construction processed is transferred to assembly platform (silicone rubber substrate) by water-soluble adhesive tape.Together
When, two-dimentional precursor construction is bonded with assembly platform by the bond area 10 of design, two-dimentional precursor construction passes through bonding
Region 10 and be fixed to assembly platform, the fixed form of a bonding tool fixed as two-dimentional precursor construction and assembly platform
Body embodiment.
Assembly platform is discharged, the bending deformation region 20 for being bonded to the two-dimentional precursor construction of assembly platform occurs buckling and becomes
Shape obtains three-dimensional target configuration with this.
It should be appreciated that this disclosure relates to each step under the premise of without obvious tandem, can be interchanged sequence.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the disclosure
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by appended
Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And it can carry out various modifications and change in the case where without departing from the scope.The scope of the present disclosure is only by the attached claims
To limit.
Claims (10)
1. a kind of meso-scale structural mechanics assembled formation method of non-lithographic, for obtaining the three-dimensional target structure of meso-scale
Type, which is characterized in that two-dimentional precursor construction is passed through into mechanics assembled formation on the assembly platform with pre-stretching dependent variable
For the target configuration, the forming method the following steps are included:
Design procedure: it designs two-dimentional precursor construction corresponding with the target configuration and is used for the two-dimentional presoma knot
Structure mechanics assembled formation is the pre-stretching dependent variable of the assembly platform of the target configuration；
Manufacturing step: two-dimensional surface material is cut using femtosecond laser to form the two-dimentional precursor construction；
Mechanics assembled formation step: the two-dimentional precursor construction is fixed on the assembling with the pre-stretching dependent variable
Platform, discharging the assembly platform makes the two-dimentional precursor construction bending deformation, to form the target configuration.
2. the meso-scale structural mechanics assembled formation method of non-lithographic according to claim 1, which is characterized in that described
Design procedure includes the bending deformation region and bond area for designing the one of the two-dimentional precursor construction, the bending deformation
Region is used for bending deformation, and the bond area is for being fixed on the assembly platform.
3. the meso-scale structural mechanics assembled formation method of non-lithographic according to claim 2, which is characterized in that described
Design procedure is further comprising the steps of:
The three-dimensional that the two-dimentional precursor construction is induced through buckling is predicted using large deformation theory of mechanics and FEM calculation
Configuration, i.e. induction configuration；
Compare the induction configuration and the target configuration；
According to two dimension precursor construction described in comparing result iterated revision and/or the pre-stretching dependent variable.
4. the meso-scale structural mechanics assembled formation method of non-lithographic according to claim 2, which is characterized in that in institute
It states in design procedure, when designing the two-dimentional precursor construction, compensation rate k × n of laser cutting width is added；
Wherein:
K is scale factor, and value range is 0.2 to 1；
N is laser cutting width.
5. the meso-scale structural mechanics assembled formation method of non-lithographic according to any one of claim 1 to 4, special
Sign is, in the manufacturing step, femtosecond laser cutting technique is adjusted to following parameter: laser beam energy strength range
Are as follows: 1 μ J to 5 μ J；
Laser cutting scanning linear velocity are as follows: 1mm/s to 40mm/s；
Protective gas pressure are as follows: 0.1bar to 0.2bar.
6. the meso-scale structural mechanics assembled formation method of non-lithographic according to claim 5, which is characterized in that according to
The type of the two-dimensional surface material adjusts the parameter of the femtosecond laser cutting technique.
7. the meso-scale structural mechanics assembled formation method of non-lithographic according to any one of claim 1 to 4, special
Sign is, in the manufacturing step, high-molecular organic material is spun on the hard substrate of carrying or by finished films
Be attached at the hard substrate of carrying, then using femtosecond laser cutting be formed in the hard substrate two-dimensional surface material and
Obtain the two-dimentional precursor construction.
8. the meso-scale structural mechanics assembled formation method of non-lithographic according to claim 7, which is characterized in that described
Two-dimensional surface material is formed as the composite membrane of polyimides and gold.
9. the meso-scale structural mechanics assembled formation method of non-lithographic according to any one of claim 1 to 4, special
Sign is, along the assembly platform mutually perpendicular x-axis direction and y-axis direction to the assembly platform load twin shaft pulling force from
And the pre-stretching dependent variable is obtained, the two-dimentional precursor construction that laser cutting is obtained is transferred to the assembly platform.
10. the meso-scale structural mechanics assembled formation method of non-lithographic according to claim 9, which is characterized in that will
It cuts the obtained two-dimentional precursor construction and the assembly platform is transferred to by water-soluble adhesive tape.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111428402A (en) * | 2020-03-18 | 2020-07-17 | 清华大学 | Reverse design method and device for mechanically guiding and assembling strip-shaped three-dimensional structure |
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| CN111428402A (en) * | 2020-03-18 | 2020-07-17 | 清华大学 | Reverse design method and device for mechanically guiding and assembling strip-shaped three-dimensional structure |
| CN111428402B (en) * | 2020-03-18 | 2022-04-29 | 清华大学 | Reverse design method and device for mechanically guiding and assembling strip-shaped three-dimensional structure |
| CN113727530A (en) * | 2021-08-31 | 2021-11-30 | 清华大学 | Preparation process of electronic device based on shape memory polymer |
| CN114178704A (en) * | 2021-11-03 | 2022-03-15 | 香港城市大学深圳福田研究院 | Method for producing high-temperature structural material and precursor |
| WO2023077548A1 (en) * | 2021-11-03 | 2023-05-11 | 香港城市大学深圳福田研究院 | Method for manufacturing high-temperature structural material, and precursor |
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