CN109447207A - Identification card and its manufacturing method with ceramic matrix - Google Patents
Identification card and its manufacturing method with ceramic matrix Download PDFInfo
- Publication number
- CN109447207A CN109447207A CN201811513388.XA CN201811513388A CN109447207A CN 109447207 A CN109447207 A CN 109447207A CN 201811513388 A CN201811513388 A CN 201811513388A CN 109447207 A CN109447207 A CN 109447207A
- Authority
- CN
- China
- Prior art keywords
- ceramic matrix
- resin material
- material layer
- identification card
- recess portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
Abstract
The invention discloses a kind of identification cards.The identification card includes ceramic matrix, and the ceramic matrix has the first surface and second surface towards opposite direction.The first surface of the ceramic matrix has at least one first recess portion, and the identification card further include: the first resin material layer being filled in first recess portion；With at least one of first information storage medium, the first security feature and the first decorative characteristics in conjunction with first resin material layer.
Description
Technical field
This invention relates generally to identification card fields, and particularly a kind of identification card with ceramic matrix and its
Manufacturing method.
Background technique
Identification card is the medium of individual and storage individual information for identification.Various identification cards are (for example, employee's card, identity
Card, financial transaction card, member card etc.) it has been widely applied in people's lives.
Current identification card mostly uses one or more layers of macromolecule polymer material manufacture card body or card body, then exists
Desired graph text information is formed by printing on the layer of card body or card body, then addition (insertion is pasted) the various information on card body
Storage medium and security protection element and be made.
However, high molecular material intensity is smaller, high temperature resistant and chemical resistance are poor.On the market in identification card material therefor,
PVC (polyvinyl chloride) accounts for 90% or more, this kind of card is easily-deformable, and frangibility causes card body to fail.In addition, high molecular material
Surface picture and text on card body are realized by printing, will lead to colour fading under the influence of the conditions such as extraneous illumination, temperature.
In addition, as identification card (for example, various credits card) gradually gos deep into people's lives and user for individual character product
The pursuit of matter, various special materials and individualized feature start to be gradually applied in identification card.For example, having already appeared at present
With wooden materials feature, the financial transaction card of silk material feature and metal material feature, business card etc..
Ceramic material refers to natural or synthetic compound by one kind inorganic material made of forming and high temperature sintering.It
Have many advantages, such as high-melting-point, high rigidity, high-wearing feature, resistance to oxidation.Although at present it has been suggested that ceramic material is applied to know
Not card field, but still have the following problems:
One, ceramic material multiform becomes a layer or a part for card body, in conjunction with card matrix material, therefore works as card matrix material
When stress deformation, the separation of ceramic material layer Yu card matrix material layer is easily led to；
Two, chip, magnetic stripe, anti-fake label etc. are adhered directly on ceramic material, and associativity is poor.
Summary of the invention
The purpose of the present invention is to provide a kind of identification cards with ceramic matrix, to solve above-mentioned skill in the prior art
At least one of art problem.
According to an aspect of the invention, there is provided a kind of identification card with ceramic matrix.
According to an exemplary embodiment, identification card may include ceramic matrix, and the ceramic matrix has towards opposite
The first surface and second surface in direction.The first surface of the ceramic matrix has at least one first recess portion；And it is described
Identification card further include: the first resin material layer being filled in first recess portion；With in conjunction with first resin material layer
At least one of first information storage medium, the first security feature and the first decorative characteristics.
According to another exemplary embodiment, the ceramic matrix may include metal oxide, metal carbides, metal diboride
At least one of object, metal nitride and metal silicide.
According to a further exemplary embodiment, first resin material layer may include in PET, PVC, ABS, PP and PE extremely
Few one kind, the first information storage medium may include in contact IC chip, noncontact IC chip, magnetic stripe and signature strip
It is at least one.
According to a further exemplary embodiment, the second surface of the ceramic matrix can have at least one second recessed
Portion, and the identification card further include: the second resin material layer being filled in second recess portion；With with second resin
At least one of the second information storage medium, the second security feature and the second decorative characteristics that material layer combines.
According to a further exemplary embodiment, second resin material layer may include in PET, PVC, ABS, PP and PE extremely
Few one kind, and second information storage medium may include contact IC chip, noncontact IC chip, magnetic stripe and signature strip
At least one of.
According to another aspect of the present invention, a kind of manufacturing method of identification card with ceramic matrix is provided.
According to an exemplary embodiment, the method with the identification card of ceramic matrix is manufactured can include: production ceramics
Matrix, the ceramic matrix have the first surface and second surface towards opposite direction, and the first of the ceramic matrix
Surface has at least one first recess portion；The first resin material layer is formed in first recess portion；It is stored with by the first information
At least one of medium, the first security feature and first decorative characteristics are in conjunction with first resin material layer.
According to another exemplary embodiment, the ceramic matrix may include metal oxide, metal carbides, metal diboride
At least one of object, metal nitride and metal silicide.
According to a further exemplary embodiment, first resin material layer may include in PET, PVC, ABS, PP and PE extremely
Few one kind, and the first information storage medium may include contact IC chip, noncontact IC chip, magnetic stripe and signature strip
At least one of.
According to a further exemplary embodiment, the second surface of the ceramic matrix can have at least one second recessed
Portion, and the method also includes: in second recess portion form the second resin material layer；It is situated between with the second information is stored
At least one of matter, the second security feature and second decorative characteristics are in conjunction with second resin material layer.
According to a further exemplary embodiment, second resin material layer may include in PET, PVC, ABS, PP and PE extremely
Few one kind, and second information storage medium includes in contact IC chip, noncontact IC chip, magnetic stripe and signature strip
At least one.
Detailed description of the invention
By below with reference to attached drawing detailed description made for the present invention, other objects and advantages of the present invention will it is aobvious and
It is clear to, in which:
Fig. 1 is the diagrammatic cross-section of the identification card with ceramic matrix of an exemplary embodiment according to the present invention；
With
Fig. 2 is the stream for the method that the manufacture of an exemplary embodiment according to the present invention has the identification card of ceramic matrix
Cheng Tu.
Specific embodiment
In order to be easier to understand the objectives, technical solutions, and advantages of the present invention, below with reference to attached drawing and illustratively
Embodiment is further described in detail technical solution of the present invention.It should be noted that the present invention is not limited only to hereafter mention
The construction or details illustrated out or in the accompanying drawings.The present invention can also have other embodiments or otherwise realize.
It should be appreciated that word "include", "comprise" used in this specification, " having " are not excluded for other elements or step
Suddenly, directionality term, such as "left", "right", "upper", "lower" used herein etc. are only used for indicating individual features in attached drawing
In orientation or orientation in order to illustrate and understand, and be not to be construed as the restriction to structure of the invention.In addition, the application
Technical characteristic prefix " first ", " second " used in file, " third " and " the 4th " etc. are only used for distinguishing different similar
Technical characteristic is not intended to do each technical characteristic additional restriction.
It should be noted that only to show that each stacking is set suitable for " being cascading " used herein or similar statement
Sequence, it is not intended to limit and be abutted directly against between each layer, unless expressly stated otherwise, or record, further include going back volume between, the layers
It is externally provided with the situation of other layers.Dimension scale in the description of the present application attached drawing not true dimension scale of representative products,
And merely to the positional relationship or connection relationship between each component is schematically presented.In order to facilitate understanding, the size of component
Zooming in or out for different proportion may have been made.
In the following description, the similar component (layer) of the card body in each embodiment has similar appended drawing reference, also, such as
Without special instruction, the description as described in each component is equally applicable to other embodiments in first embodiment, and is therefore describing other
It is omitted when embodiment.
Fig. 1 is the diagrammatic cross-section of the identification card with ceramic matrix of an exemplary embodiment according to the present invention.
As shown in Figure 1, identification card 100 includes ceramic matrix 110, the ceramic matrix 110 has the first surface towards opposite direction
111 (for example, fronts of identification card) and second surface 112 (for example, back side of identification card).The first surface of ceramic matrix 110
At least one first recess portion 120 is formed on 111, identification card 100 further includes being filled in the first resin material in the first recess portion 120
Layer 121 and the first information storage medium in conjunction with first resin material layer, the first security feature and the first decorative characteristics
In at least one feature 122.
In the exemplary embodiment, ceramic matrix 110 is made of ceramic materials.Ceramic material may include metal oxidation
At least one of object, metal carbides, metal boride, metal nitride and metal silicide or mixture.Ceramic matrix
110 can be then injected into mold appropriate and cast by melting ceramic raw material at high temperature.The table of ceramic matrix 110
The first recess portion 120 on face can be formed while manufacturing ceramic matrix 110 by using casting mould appropriate.In addition,
First recess portion can also obtain after forming ceramic matrix, then through mach mode.
In the exemplary embodiment, the first resin material layer 121 can be by least one in various common resin materials
It kind is formed, for example, PET (polyethylene terephthalate), PVC (polyvinyl chloride), (acrylonitrile-butadiene-styrene (ABS) is total by ABS
Polymers), PP (polypropylene), PE (polyethylene) etc..According to an exemplary embodiment, can be made in ceramic matrix 110
Cheng Hou, by resin material to be then cooled and shaped to form the in the first recess portion 120 of molten condition injection ceramic matrix 110
One resin material layer 121.Illustrative 121 method for forming the first resin material layer includes 3D printing.First resin material
The height of layer 121 can be substantially flush with the opening of recess portion 120, or slightly below the first recess portion 120 opening (for example, low 0.1~
0.2mm), in order to after embedding information storage medium, security feature or other elements, so that the height of embedded components and the
The opening of one recess portion 120 is substantially flush.
In the exemplary embodiment, first information storage medium may include contact information storage medium or contactless
Information storage media, for example, at least one of contact IC chip, noncontact IC chip, magnetic stripe and signature strip.First peace
Full feature may include one of the various security features usually used on bank card, for example, laser anti-counterfeiting labeling, RFID (radio frequency
Identification) anti-counterfeiting chip, micro text etc..First decorative characteristics may include that can provide the material played role in decoration on card body surface
Or feature, for example, the metal foil of thermoprinted-image, special color, coating etc..
Further, as shown in Fig. 2, the second surface 112 of the ceramic matrix 110 of identification card 100 be equipped with it is first recessed
At least one similar second recess portion 130 of portion 120, and identification card 100 further includes being filled in second in second recess portion 130
Resin material layer 131 and the second information storage medium 132 in conjunction with second resin material layer.
Second resin material layer 131 can be formed by the material identical or different with the first resin material layer 121.Exemplary
Embodiment in, the first resin material layer 121 and the second resin material layer 131 are by PVC material and shape with identical technique
At.Similarly, the height of the second resin material layer 131 can be substantially flush with the opening of the second recess portion 130, or slightly below second
The opening (for example, low 0.1~0.2mm) of recess portion 130, in order to after embedding information storage medium or other elements, so that
The height of embedded components and the opening of the second recess portion 130 are substantially flush.
In the exemplary embodiment, the second information storage medium, the second security feature and the second decorative characteristics are respectively
The feature similar with first information storage medium, the first security feature and the first decorative characteristics, can be identical or different.
It should be noted that when as viewed from the front or back from identification card, the first recess portion on ceramic matrix surface or
Second recess portion can have an identical or different surface shape, and the first recess portion or the second recess portion can respectively have it is a variety of different
Shape, for example, rectangle, circle, ellipse etc..
It is formed on the surface of ceramic matrix or the first/the in addition, identification card can also have by similar approach such as printings
Ink layer on two resin material layers, for providing other relevant informations of personalized pattern, identification card (for example, card sending mechanism
Information, card number) etc..
According to another aspect of the present invention, the method for manufacturing this identification card with ceramic matrix is additionally provided.Fig. 2 shows
Go out according to an embodiment of the invention for manufacturing the schematic flow chart of this identification card.
As shown, it may include following steps that manufacture, which has the method for the identification card of ceramic matrix,.
In step 201, first make ceramic matrix so that the first surface of ceramic matrix have the first recess portion and/or
Second surface has the second recess portion.
Ceramic matrix is made of ceramic materials.Available ceramic material may include metal oxide, metal carbides, metal
Or mixtures thereof one of boride, metal nitride and metal silicide.Ceramic matrix can by by ceramic raw material in height
The lower melting of temperature, is then injected into mold appropriate and casts.Recess portion on the surface of ceramic matrix can be by using appropriate
Casting mould and formed while manufacturing ceramic matrix.As needed, it can only be formed on a surface of ceramic matrix
The recess portion of right quantity and shape, can also be with two of the ceramic matrix opposite quantity appropriate of formation simultaneously on the surface and shape
Recess portion.
In step 202, the first resin material layer is formed in the first recess portion.First resin material layer can be by various common
At least one of resin material formed, for example, PET, PVC, ABS, PP, PE etc..Can after ceramic matrix completes,
By resin material to be then cooled and shaped to form the first resin material in the first recess portion of molten condition injection ceramic matrix
Layer.In addition, the height of the first resin material layer can be substantially flush with the opening of the first recess portion, or slightly below the first recess portion is opened
Mouthful (for example, low 0.1~0.2mm), in order to after the elements such as embedding information storage medium, security feature, so that insertion member
The height of part and the opening of the first recess portion are substantially flush.
In step 203, by least one of first information storage medium, the first security feature and first decorative characteristics
In conjunction with first resin material layer.
First information storage medium is (for example, in contact IC chip, noncontact IC chip, magnetic stripe and signature strip extremely
Few one kind), the first security feature (for example, laser anti-counterfeiting labeling, RFID (radio frequency identification) anti-counterfeiting chip etc.) and the first decoration
Feature (for example, the metal foil of thermoprinted-image, special color, coating etc.) can be by same or similar with traditional manufacturing card
Method is integrated to the first resin material layer.In this way, information storage feature, Special safety in the prior art be can be avoided
Sign, decorative characteristics cannot well in conjunction with ceramic material the technical issues of.
As needed, if being respectively formed on recess portion on two opposite surfaces of ceramic matrix, manufacture has pottery
The method of the identification card of porcelain basal body may also include that
In step 204, the second resin material layer is formed in the second recess portion；With
In step 205, by least one of the second information storage medium, the second security feature and second decorative characteristics
In conjunction with second resin material layer.
It is identical to realize that the technique or means of step 204 and step 205 can be distinguished with step 202 and step 203, herein no longer
It repeats.
In addition, after step 203 or step 205, the method may also include according to the specific structure of various identification cards
In the step of forming ink layer on the surface of ceramic matrix or on first/second resin material layer, for providing personalized figure
Case, other relevant informations (for example, card sending mechanism information, card number) of identification card etc..
So far, it is described in detail by way of example and thinks the preferred embodiment of the present invention, but this field
Technical staff will be appreciated that without departing substantially from the spirit of object of the present invention, it can be carried out further modification and
Variation, and all such modifications and variations should all be fallen within the scope of protection of the present invention.Therefore, protection scope of the present invention
It should be based on the protection scope of the described claims.
Claims (10)
1. a kind of identification card, including ceramic matrix, the ceramic matrix has the first surface and the second table towards opposite direction
Face, which is characterized in that the first surface of the ceramic matrix has at least one first recess portion；And the identification card also wraps
It includes:
The first resin material layer being filled in first recess portion；With
In first information storage medium, the first security feature and the first decorative characteristics in conjunction with first resin material layer
It is at least one.
2. identification card according to claim 1, which is characterized in that the ceramic matrix includes metal oxide, metal carbon
At least one of compound, metal boride, metal nitride and metal silicide.
3. identification card according to claim 1, it is characterised in that:
First resin material layer includes at least one of PET, PVC, ABS, PP and PE；And
The first information storage medium include in contact IC chip, noncontact IC chip, magnetic stripe and signature strip at least
It is a kind of.
4. identification card according to any one of claim 1 to 3, which is characterized in that described the second of the ceramic matrix
Surface has at least one second recess portion, and the identification card further include:
The second resin material layer being filled in second recess portion；With
In the second information storage medium, the second security feature and the second decorative characteristics in conjunction with second resin material layer
It is at least one.
5. identification card according to claim 4, it is characterised in that:
Second resin material layer includes at least one of PET, PVC, ABS, PP and PE；And
Second information storage medium include in contact IC chip, noncontact IC chip, magnetic stripe and signature strip at least
It is a kind of.
6. a kind of method that manufacture has the identification card of ceramic matrix, comprising:
Ceramic matrix is made, the ceramic matrix has the first surface and second surface towards opposite direction, and the pottery
The first surface of porcelain basal body has at least one first recess portion；
The first resin material layer is formed in first recess portion；With
By at least one of first information storage medium, the first security feature and first decorative characteristics and first resinous wood
The bed of material combines.
7. according to the method described in claim 6, it is characterized in that, the ceramic matrix includes metal oxide, metallic carbide
At least one of object, metal boride, metal nitride and metal silicide.
8. identification card according to claim 6, it is characterised in that:
First resin material layer includes at least one of PET, PVC, ABS, PP and PE；And
The first information storage medium include in contact IC chip, noncontact IC chip, magnetic stripe and signature strip at least
It is a kind of.
9. the method according to any one of claim 6 to 8, which is characterized in that second table of the ceramic matrix
Face have at least one second recess portion, and the method also includes:
The second resin material layer is formed in second recess portion；With
By at least one of the second information storage medium, the second security feature and second decorative characteristics and second resinous wood
The bed of material combines.
10. according to the method described in claim 9, it is characterized by:
Second resin material layer includes at least one of PET, PVC, ABS, PP and PE；And
Second information storage medium include in contact IC chip, noncontact IC chip, magnetic stripe and signature strip at least
It is a kind of.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811513388.XA CN109447207A (en) | 2018-12-11 | 2018-12-11 | Identification card and its manufacturing method with ceramic matrix |
| EP19897272.1A EP3895070A4 (en) | 2018-12-11 | 2019-12-09 | Identification card with glass substrate, identification card with ceramic substrate and manufacturing methods thereof |
| US17/312,216 US11657249B2 (en) | 2018-12-11 | 2019-12-09 | Identification card with a glass substrate, identification card with a ceramic substrate and manufacturing methods thereof |
| PCT/CN2019/124058 WO2020119643A1 (en) | 2018-12-11 | 2019-12-09 | Identification card with glass substrate, identification card with ceramic substrate and manufacturing methods thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811513388.XA CN109447207A (en) | 2018-12-11 | 2018-12-11 | Identification card and its manufacturing method with ceramic matrix |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109447207A true CN109447207A (en) | 2019-03-08 |
Family
ID=65557477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811513388.XA Pending CN109447207A (en) | 2018-12-11 | 2018-12-11 | Identification card and its manufacturing method with ceramic matrix |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109447207A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020119643A1 (en) * | 2018-12-11 | 2020-06-18 | Giesecke+Devrient Mobile Security Gmbh | Identification card with glass substrate, identification card with ceramic substrate and manufacturing methods thereof |
| CN111816618A (en) * | 2020-09-03 | 2020-10-23 | 捷德(中国)科技有限公司 | Identification card and preparation method thereof |
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| US20160232438A1 (en) * | 2015-02-06 | 2016-08-11 | American Express Travel Related Services Company, Inc. | Ceramic-containing transaction cards |
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| CN209182856U (en) * | 2018-12-11 | 2019-07-30 | 捷德（中国）信息科技有限公司 | Identification card with ceramic matrix |
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| CN2521676Y (en) * | 2002-04-22 | 2002-11-20 | 唐智良 | Integral anti-disassembling passive micro-wave electronic identification card |
| CN201249579Y (en) * | 2008-08-29 | 2009-06-03 | 余亚洲 | Ceramic telephone card |
| CN104557099A (en) * | 2013-10-25 | 2015-04-29 | 深圳光启创新技术有限公司 | Method for laminating conductive geometric structure to ceramic substrate as well as module and metamaterial obtained by adopting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020119643A1 (en) * | 2018-12-11 | 2020-06-18 | Giesecke+Devrient Mobile Security Gmbh | Identification card with glass substrate, identification card with ceramic substrate and manufacturing methods thereof |
| US11657249B2 (en) | 2018-12-11 | 2023-05-23 | Giesecke+Devrient Mobile Security Gmbh | Identification card with a glass substrate, identification card with a ceramic substrate and manufacturing methods thereof |
| CN111816618A (en) * | 2020-09-03 | 2020-10-23 | 捷德(中国)科技有限公司 | Identification card and preparation method thereof |
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| WO2022048530A1 (en) * | 2020-09-03 | 2022-03-10 | Giesecke+Devrient Mobile Security Gmbh | Identification card and manufacturing method of identification card |
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