CN109378287A - Semiconductor encapsulation device - Google Patents
Semiconductor encapsulation device Download PDFInfo
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- CN109378287A CN109378287A CN201811360079.3A CN201811360079A CN109378287A CN 109378287 A CN109378287 A CN 109378287A CN 201811360079 A CN201811360079 A CN 201811360079A CN 109378287 A CN109378287 A CN 109378287A
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- module
- encapsulation device
- semiconductor encapsulation
- wafer
- shell
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of semiconductor encapsulation device comprising multiple Process modules, preprocessing module and delivery module；For carrying out making technology production, the preprocessing module is located at outside the Process module Process module comprising several heating units and several cooling units；The delivery module is for transmitting wafer between multiple Process modules and the preprocessing module.The structure setting that semiconductor encapsulation device of the invention passes through optimization, the transmission of wafer fully achieves automation, residence time of the wafer in Process module can greatly be shortened, the rate flow of Process module and the output capacity of entire semiconductor encapsulation device can be significantly improved, reduce the equipment input cost of semiconductor packages factory, semiconductor encapsulation device of the invention simultaneously can greatly reduce the space occupied, be conducive to the layout optimization in factory, the automatization level for being conducive to improve producing line helps to reduce production cost and avoids the generation of production accident.
Description
Technical field
The invention belongs to semiconductor chip packaging fields, more particularly to a kind of semiconductor encapsulation device.
Background technique
Bonding wire (wire bonding) is one of the critical process during semiconductor chip packaging, it is to make chip and envelope
It fills substrate or lead frame etc. and completes circuit connection, so that chip realizes the function of electronic signal transmission.In wire bonding process, interface
Temperature is extremely important.Especially in wafer-level packaging technique (Wafer level package, abbreviation WLP), wafer and bonding wire
Between temperature it is very big to bonding wire qualitative effects, thus wafer is heated before bonding wire craft to improve interface temperature and be
One only stage which must be passed by, and be all that wafer is placed into manually by bonding equipment by operator in existing wafer-level packaging technique
Interior, wafer is heated to start to carry out wire-bonding operations after predetermined temperature by the heating device of the manually opened bonding equipment of operator,
Wafer is finally removed into bonding equipment by operator again, i.e., existing bonding equipment itself carries heating device, and wafer adds
Thermal process is completed in bonding equipment, continues to carry out bonding wire craft in same bonding equipment later.This mode exists many
Problem.For example, not only production efficiency is low, be easy to cause since the movement of wafer is all the handwork for relying on operator
Wafer contamination and damage, and be easy to cause personal injury to operator；On the other hand, since heating process is slower,
Time needed for wafer is heated to predetermined temperature is longer, so that the output capacity of bonding equipment is low, equipment input cost increases, sets
Standby occupied space is more, in addition, excessive bonding equipment causes, space is crowded in semiconductor packages factory, automatization level is low, pole
Easily cause production accident, and expands production space and bring new the problems such as the production cost increases.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of semiconductor encapsulation devices, use
Cause production efficiency low in solving dependence manual work in the prior art, easily causes personal injury, wafer contamination and damage, and
Because wafer heating time is too long, equipment output capacity is caused to decline, equipment input cost increases, and leads to space in semiconductor factory
The problems such as crowded bring production cost rises and production accident hidden danger increases.
To achieve the above object and other related purposes, the present invention provide a kind of semiconductor encapsulation device comprising multiple
Process module, preprocessing module and delivery module；The Process module is for carrying out making technology production, the preprocessing module
Except the Process module comprising several heating units and several cooling units；The delivery module is used for
Wafer is transmitted between multiple Process modules and the preprocessing module.
Optionally, the Process module includes bonding wire chamber.
Optionally, the quantity of the Process module is more than or equal to 4.
Optionally, several described heating units are intervally arranged up and down；Several described cooling units are intervally arranged up and down,
Several described cooling units are located at below several described heating units, and have spacing with the heating unit.
Optionally, the semiconductor encapsulation device further includes thermal insulation layer, and the thermal insulation layer is located at the heating unit and institute
It states between cooling unit.
Optionally, the heating unit includes heater.
More optionally, the heating unit further includes temperature controller, and the temperature controller is connected with the heater.
Optionally, the semiconductor encapsulation device further includes wafer load module.
In an optinal plan, the semiconductor encapsulation device further includes shell, multiple Process modules, the pre- place
Reason module, the delivery module and the wafer load module are respectively positioned in the shell.
Optionally, the semiconductor encapsulation device further includes filter, and the filter is located on the shell.
In another optinal plan, the semiconductor encapsulation device further includes shell, and the delivery module is located at the shell
In vivo, multiple Process modules and the preprocessing module are located at outside the shell and are connected with the shell.
As described above, semiconductor encapsulation device of the invention, by the structure setting of optimization, the transmission of wafer is fully achieved
Automation, can greatly shorten residence time of the wafer in Process module, significantly improve the rate flow of Process module and entire
The output capacity of semiconductor encapsulation device reduces the equipment input cost of semiconductor packages factory, while the semiconductor after structure optimization
Packaging system can greatly reduce occupied space, be conducive to the layout optimization in factory, be conducive to the automatization level for improving producing line,
Help to reduce production cost and avoids the generation of production accident.
Detailed description of the invention
Fig. 1 is shown as the structural schematic diagram of the semiconductor encapsulation device of the embodiment of the present invention one.
Fig. 2 is shown as the exemplary configuration schematic diagram of the preprocessing module in semiconductor encapsulation device of the invention.
Fig. 3 is shown as the overlooking structure diagram of the semiconductor encapsulation device of the embodiment of the present invention two.
Reference numerals explanation
1 Process module
2 preprocessing modules
21 heating units
211 temperature controllers
212 heaters
22 cooling units
221 cooling lines
23 thermal insulation layers
3 delivery modules
4 shells
5 wafer load modules
51 wafer cassettes
6 filters
7 central controllers
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Disclosed content understands further advantage and effect of the invention easily.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.
It please refers to Fig.1 to Fig.3.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of invention, though only show in diagram with related component in the present invention rather than package count when according to actual implementation
Mesh, shape and size are drawn, when actual implementation form, quantity and the ratio of each component can arbitrarily change for one kind, and its
Assembly layout form may also be increasingly complex.And to keep diagram succinct as far as possible, to the identical knot in same diagram in this specification
Structure not repeating label as far as possible.
Embodiment one
As shown in Figures 1 and 2, the present invention provides a kind of semiconductor encapsulation device comprising multiple Process modules 1, pre- place
Manage module 2 and delivery module 3；The Process module 1 is for carrying out making technology production；The preprocessing module 2 is located at described
Except Process module 1, the preprocessing module 2 includes several heating units 21 and several cooling units 22；The transmission
Module 3 is for transmitting wafer between multiple Process modules 1 and the preprocessing module 2.Semiconductor packages of the invention
Device passes through the structure setting of optimization, and the transmission of wafer fully achieves automation, can greatly shorten wafer in Process module 1
Residence time, the rate flow of Process module 1 and the output capacity of entire semiconductor encapsulation device can be significantly improved, reduction is partly led
Body encapsulates the equipment input cost of factory, while semiconductor encapsulation device of the invention can greatly reduce the space occupied, favorably
In the layout optimization in factory, be conducive to the automatization level for improving producing line, help to reduce production cost and avoid production accident
Generation.
It should be strongly noted that the preprocessing module 2 in the present invention is not just defined in institute in the present embodiment
Pretreatment before stating the making technology production carried out in Process module 1, for example preheat, while also including after making technology produces
Post-processing, such as it is cooling because before the post-processing after the production of previous making technology can regard lower one of making technology as
Pretreatment.
As an example, the Process module 1 includes bonding wire chamber, the bonding wire chamber be used for chip and package substrate or
Lead frame etc. completes circuit connection, so that chip realizes the function of electronic signal transmission.In wire bonding process chip and bonding wire it
Between interface temperature it is extremely important.In existing wafer-level packaging technique, the wafer of chip has been made by operator
It is sent in bonding equipment, starts bonding wire operation after preset temperature is first heated in bonding equipment, since heating process compares
It is long, cause the production efficiency of bonding equipment low so that the quantity increase in demand to bonding equipment, thus cause equipment investment at
Space is crowded in this increase, factory, automatization level is low, easily initiation production accident, and expand production space bring it is new
The problems such as the production cost increases, and the invention proposes structural improvements effectively to solve foregoing problems.Certainly, other are related to crystalline substance
Circle preheating packaging technology can also use equipment of the invention, such as welding (die bonding) technique, i.e., the described processing procedure
Module 1 can also be other semiconductor packages chambers for such as welding chamber etc, not do stringent limitation in the present embodiment.It is described
The structure of Process module 1 also can according to need setting, such as a settable microscope carrier in chamber, for carrying wafer, the load
The size of platform is matched with the wafer size that need to be carried.
The quantity of the Process module 1 can be 2 or more according to the layout and production capacity configuration in encapsulation factory.
In the present embodiment, as an example, the quantity of the Process module 1 is no less than 4, i.e., the quantity of the described Process module 1 can be 4
A, 5 or more, in the case where the quantity of the Process module 1 is more, advantages of the present invention will be protruded all the more.It is multiple
The arrangement of the Process module 1 equally can be depending on the needs of the layout in factory, for example are single laid out in parallel or double
Row's arrangement, can also be distributed in a ring, not do stringent limitation in the present embodiment, but need to ensure multiple Process modules 1
Within the scope of the transmission of the delivery module 3, in order to which the delivery module 3 is in the Process module 1 and the pretreatment mould
The transmission that wafer is carried out between block 2 is advisable.Preferably by multiple Process modules 1 and the preprocessing module 2 in the present embodiment
It is distributed around the delivery module 3, in order to the transmission of wafer, improves production efficiency.
Several heating units 21 and several arrangements of cooling unit 22 in the preprocessing module 2 can
With flexible setting as needed, for example, multiple heating units 21 and multiple cooling units 22 can with laid out in parallel, or
Heating unit 21 and the cooling unit 22 described in person can be arranged with transpostion interval or the heating unit 21 and the cooling
Unit 22 can share the same space, and need to carry out wafer heating or cooling operations according to technique production.It is preferred that
The space of the heating unit 21 and the cooling unit 22 is respectively independently arranged, to avoid frequent heating/state of cooling
Switching causes damage to the preprocessing module 2 and heating/extension cooling time and power consumption is thus led to problems such as to increase.Institute
Stating heating unit 21 can be consistent or inconsistent with the quantity of the cooling unit 22, but in the present embodiment, as an example,
The quantity of the cooling unit 22 is not more than the quantity of the heating unit 21.The quantity of the heating unit 21 can with it is described
The quantity of Process module 1 is consistent or less than the quantity of the Process module 1, for example, be 1,2,3 or more, specifically
It is unlimited.I.e. in the present embodiment, the quantity of the heating unit 21 is preferably no more than the quantity of the Process module 1, in order to avoid cause
Unnecessary space waste.In the present embodiment, as shown in Fig. 2, as an example, several described heating units 21 are between the upper and lower every row
Cloth；Several described about 22 cooling units are intervally arranged, and it is single that several described cooling units 22 are located at several described heating
21 lower section of member, and there is spacing with the heating unit 21, it can be set in the heating unit 21 and the cooling unit 22
Microscope carrier is for carrying wafer.And it should be noted that " being intervally arranged " described herein refers between two adjacent units
Spatially there is specific essence to separate, i.e. each unit, including each heating unit 21 and each cooling unit 22
By actual physical isolation to be used to accommodate wafer with certain space.The heating unit of several in the present embodiment
21 concentrated settings, several described 22 concentrated settings of cooling unit, to reduce the heating unit 21 and the cooling list to the greatest extent
Interfering with each other between member 22.It is mutual dry between the heating unit 21 and the cooling unit 22 to be further reduced
It disturbs, can be set thermal insulation layer 23 in face/layer that the heating unit 21 and the cooling unit 22 are in contact, and can be with
Thermal insulation layer 23 is set in each described heating unit 21 and separation layer is set in each described cooling unit 22
To keep the temperature inside each unit stable and reduce the heat interference between adjacent cells, to further decrease power consumption.As
Example, the heating unit 21 are internally provided with heater 212 to heat to its inner space, and the heater 212 can
To be resistance heater, need to be connected to power supply in heating process.The installation site and structure of the heater 212 can bases
It 21 inner space of heating unit and/or specifically needs to be arranged, for example can be set in the inner top of place heating unit 21
And/or interior bottom, and each corresponding described heating unit 21 is provided with a temperature controller 211, and the temperature controller 211 is one by one
It is correspondingly arranged in the heating unit 21 and is connected with the heater 212, to the temperature in the heating unit 21
It is controlled, specific temperature is depending on process requirement.And inductor can be set in the heating unit 21 and (do not schemed
Show) and inductor is connected with the temperature controller 211, to detect in the heating unit 21 when that has wafer institute in inductor
It states temperature controller 211 and controls the heater 212 and begin to warm up.The specific structure of the heater 212 and to the heating unit
21 specific heating method can also have other selections, not do stringent limitation in the present embodiment.And the cooling unit 22 is cold
But can be cooled down by the cooling line 221 to set within it, the cooling line 221 can be gas cooling pipeline or
Liquid cooling line, by being passed through cooling gas or cooling liquid not do specifically to cooling down in the cooling unit 22
Limitation.
As an example, the preprocessing module 2 further includes cleaning unit (not shown) in the present embodiment, for wafer
It is cleaned, the cleaning unit can be set side by side with the cooling unit 22 and the heating unit 21 or be stacked up and down.
Cleaning is carried out to wafer and helps to improve wafer cleanliness, is avoided on the chip that granule foreign is mixed on wafer in wire bonding process
It causes device performance to reduce even to fail.Certainly, in other examples, the cleaning unit can also be with the cooling unit 22
One, i.e., the described cooling unit 22 can be also used for cleaning wafer, such as by leading to directly into the cleaning unit
Enter cooling gas wafer is cooled down and be cleaned simultaneously, specifically with no restrictions.
As an example, the delivery module 3 can be such as mechanical transmission arm (transfer robot), according to wafer
The specification that matches of size selection.And the quantity of the delivery module 3 can be 1 or more, i.e., in the processing procedure mould
In the more situation of block 1, multiple delivery modules 3 can be set to improve transmission efficiency.
The technique circulation process of wafer can be to be carried out in a manner of one chip, i.e., the wafer that need to carry out process is a piece of
Piece is sent in the preprocessing module 2 from other process sections carries out heating or other pretreatments, completes heating or other pre- places
The wafer of reason is sent to progress making technology production in the Process module 1 by the delivery module 3.In the present embodiment, as
Example, the semiconductor encapsulation device further include wafer load module 5, and the wafer load module 5 is equipped with multi-disc for placing
The wafer cassette 51 of wafer, such as FOUP (front opening unified pod, front opening wafer cassette), it is brilliant equipped with multi-disc
Round wafer cassette 51 passes to the semiconductor encapsulation device of the present embodiment from a upper process section, and wafer is first passed by the delivery module 3
It send into the preprocessing module 2 and is preheated and (can also first be cleaned when necessary), complete the wafer of predetermined heat again
It is sent in the Process module 1 via the delivery module 3 and completes making technology, will completed by the delivery module 3 later
The wafer of making technology production, which is sent back in the preprocessing module 2, to carry out cooling or directly sends wafer cassette 51 or cleaned back to
Send wafer cassette 51 back to again afterwards, until all wafers all completes technique produce after, all wafers will together with wafer cassette 51 by
It is sent to next process section, advantageously reduces the transmission workload of wafer, is conducive to the optimization and production efficiency of production procedure
Raising.
The Process module 1, preprocessing module 2 and delivery module 3 can uniformly be connected to a central controller 7, such as
One computer is controlled the operation of modules, according to technique manufacturing parameter (recipe) by the central controller 7 further to mention
The automatization level of the high semiconductor encapsulation device, improves production efficiency.
In order to further increase the cleannes in whole process, pollution of the wafer in transmit process, this reality are reduced to the greatest extent
It applies in example, as an example, the semiconductor encapsulation device further includes shell 4, multiple Process modules 1, the pretreatment mould
Block 2, the delivery module 3 and the wafer load module 5 are respectively positioned in the shell 4, and the concrete shape of the shell 4 can be with
Depending on being laid out in factory, preferred rectangle, and size is advisable with all modules that can accommodate entire semiconductor encapsulation device, it can
In side designer's access way of the shell 4.It, can also be on the shell 4 and to further increase cleanliness
Filter 6 is set, and the filter 6 can be connected to the central purge system in semiconductor packages factory, to from factory service end
Purification gas further progress purification, purified air is delivered in the shell 4 through the filter 6 again, in institute
The bonding wire process volume for forming a ultra-clean in shell 4 is stated, particle of the wafer in transmit process can be greatly reduced in this way
Pollution, facilitates the raising of production yield.
Processing procedure is packaged using the semiconductor packaging device of the present embodiment, for example carries out the process example of bonding wire processing procedure such as
Under: wafer to be packaged is uniformly loaded in wafer cassette 51 and is transmitted in the wafer load module 5, the delivery module
3 take out wafer from the wafer cassette 51 of the wafer load module 5 and are sent to the preprocessing module 2 and are preheated, and add
After heat to predetermined temperature, the delivery module 3 will complete preheating wafer again and take out and be sent to from the preprocessing module 2
The Process module 1 carries out making technology production, and the wafer after completing making technology production is sent back through the delivery module 3 again
In the wafer cassette 51 of the wafer load module 5, or it is sent to after the preprocessing module 2 carries out cooling/cleaning and sends institute back to again
It states in the wafer cassette 51 of wafer load module 5.Certainly, which is merely exemplary, and specifically can according to need and adjusts
It is whole, in the present embodiment with no restrictions.Operation is packaged using semiconductor packaging device of the invention, the transmission of wafer is completely real
It now automates, and the process flows such as heating is transferred to the space other than Process module 1 and are carried out, it is possible thereby to greatly shorten wafer
Residence time in Process module 1 significantly improves the rate flow of Process module 1 and the output of entire semiconductor encapsulation device
Rate reduces the equipment input cost of semiconductor packages factory, while semiconductor encapsulation device of the invention is because improving Process module
Running rate and the usage amount for reducing Process module, thus can greatly reduce the space occupied, be conducive to the layout optimization in factory,
The automatization level for being conducive to improve producing line helps to reduce production cost and avoids the generation of production accident.Of the invention half
Conductor packaging system is particularly suitable for large-sized wafer-level packaging, such as 8 cun, 12 cun and the 18 cun of following wafer-level packagings,
Production efficiency can be significantly improved, production cost is reduced.
Embodiment two
As shown in figure 3, the present invention also provides the semiconductor encapsulation devices of another structure.The semiconductor packages of the present embodiment
Device and the main difference of embodiment one are, in embodiment one, multiple Process modules 1, the preprocessing module 2,
The delivery module 3 and the wafer load module 5 are respectively positioned in the shell 4, and in the present embodiment, the semiconductor packages
Device equally includes shell 4, but only the delivery module 3 is located in the shell 4 in the present embodiment, and other multiple described systems
Journey module 1 and the preprocessing module 2 are respectively positioned on outside the shell 4 and are connected with the shell 4, i.e., the described Process module 1
With the preprocessing module 2 with 4 single-contact of shell, which is usually the face where the access way of wafer,
And wafer load module 5 equally can be set in the semiconductor encapsulation device of the present embodiment, the wafer load module 5 is located at described
Shell 4 is outer and is connected with the shell 4.In addition to this, the modules of the present embodiment it is specific setting all with embodiment one
It is identical, the description of embodiment one is specifically please referred to, is repeated no more for purposes of brevity.
In conclusion the present invention provides a kind of semiconductor encapsulation device comprising multiple Process modules, preprocessing module and
Delivery module；For carrying out making technology production, the preprocessing module is located at except the Process module Process module,
It includes several heating units and several cooling units；The delivery module is used in multiple Process modules and described
Wafer is transmitted between preprocessing module.Semiconductor encapsulation device of the invention passes through the structure setting of optimization, and the transmission of wafer is complete
It is complete to realize automation, it can greatly shorten residence time of the wafer in Process module, the stream of Process module can be significantly improved
The output capacity of rate of rotation and entire semiconductor encapsulation device reduces the equipment input cost of semiconductor packages factory, while of the invention
Semiconductor encapsulation device can greatly reduce the space occupied, be conducive to the layout optimization in factory, be conducive to raising producing line oneself
Dynamicization is horizontal, helps to reduce production cost and avoids the generation of production accident.So the present invention effectively overcomes the prior art
In various shortcoming and have high industrial utilization value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (11)
1. a kind of semiconductor encapsulation device characterized by comprising
Multiple Process modules；
Preprocessing module is located at except the Process module, and the preprocessing module includes several heating units and several
Cooling unit；And
Delivery module, for transmitting wafer between multiple Process modules and the preprocessing module.
2. semiconductor encapsulation device according to claim 1, it is characterised in that: the Process module includes bonding wire chamber.
3. semiconductor encapsulation device according to claim 1, it is characterised in that: the quantity of the Process module is more than or equal to
4.
4. semiconductor encapsulation device according to claim 1, it is characterised in that: several described heating units between the upper and lower every
Arrangement；Several described cooling units are intervally arranged up and down, several described cooling units are located at several heating units
Lower section, and there is spacing with the heating unit.
5. semiconductor encapsulation device according to claim 4, it is characterised in that: the semiconductor encapsulation device further include every
Thermosphere, the thermal insulation layer is between the heating unit and the cooling unit.
6. semiconductor encapsulation device according to claim 1, it is characterised in that: the heating unit includes heater.
7. semiconductor encapsulation device according to claim 6, which is characterized in that the heating unit further includes temperature controller,
The temperature controller is connected with the heater.
8. semiconductor encapsulation device according to any one of claims 1 to 7, it is characterised in that: the semiconductor packages dress
Setting further includes wafer load module.
9. semiconductor encapsulation device according to claim 8, it is characterised in that: the semiconductor encapsulation device further includes shell
Body, multiple Process modules, the preprocessing module, the delivery module and the wafer load module are respectively positioned on the shell
In vivo.
10. semiconductor encapsulation device according to claim 9, it is characterised in that: the semiconductor encapsulation device further includes
Filter, the filter are located on the shell.
11. semiconductor encapsulation device according to claim 1, it is characterised in that: the semiconductor encapsulation device further includes
Shell, the delivery module are located in the shell, and multiple Process modules and the preprocessing module are located at the shell
It is connected outside and with the shell.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811360079.3A CN109378287A (en) | 2018-11-15 | 2018-11-15 | Semiconductor encapsulation device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811360079.3A CN109378287A (en) | 2018-11-15 | 2018-11-15 | Semiconductor encapsulation device |
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| CN109378287A true CN109378287A (en) | 2019-02-22 |
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Cited By (1)
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|---|---|---|---|---|
| CN110164800A (en) * | 2019-06-05 | 2019-08-23 | 京东方科技集团股份有限公司 | A kind of sealed in unit and display device |
| CN110164800B (en) * | 2019-06-05 | 2021-09-17 | 京东方科技集团股份有限公司 | Packaging equipment and display device |
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