Summary of the invention
To solve the above-mentioned problems, the present invention provides manufacturing method, the flexibility of a kind of cover board for flexible screen and cover board
Display module and electronic equipment can effectively improve the anti-fragmentation performance of Flexible Displays mould group.
On the one hand, the present invention provides a kind of cover board for flexible screen, comprising: substrate;First coating, the first coating cover
Lid is on the first surface of the substrate;First adhesive layer, the first coating are bonded to substrate by the first adhesive layer, the first adhesive layer
At least one first protrusion is provided on first face, to form hollow structure between substrate and the first coating.
A specific embodiment according to the present invention, the first face of the first adhesive layer are the side towards substrate.
The cross-sectional shape of a specific embodiment according to the present invention, first protrusion is circle, triangle, rectangle
Or diamond shape.
A specific embodiment according to the present invention, first protrusion is in cylindrical shape, and has 10 microns to 100
The diameter of micron.
A specific embodiment according to the present invention, the height of first protrusion are the 1/5 of the thickness of the first adhesive layer
To 1/3.
A specific embodiment according to the present invention, first protrusion are evenly distributed on the first face of the first adhesive layer
On.
A specific embodiment according to the present invention, the cover board further include the second coating and the second adhesive layer, and second covers
Layer is covered on the second surface opposite with first surface of substrate, and the second coating is bonded to substrate by the second adhesive layer, and second
At least one second protrusion is provided on first face of adhesive layer, to form hollow structure between substrate and the second coating.
A specific embodiment according to the present invention, ultra-thin glass of the substrate by thickness less than or equal to 300 microns are made,
First coating and the second coating are made of polyimides PI, and the first adhesive layer and the second adhesive layer are by transparent optical cement OCA
It is made.
On the other hand, the present invention provides a kind of Flexible Displays mould group, including above-mentioned cover board and flexible screen.
On the other hand, the present invention provides a kind of electronic equipment, including Flexible Displays mould group, and Flexible Displays mould group includes upper
State cover board.
On the other hand, the present invention provides a kind of method for manufacturing the cover board for flexible screen, comprising: is produced in one side
The first adhesive layer at least one the first protrusion;By the first cladding layer the first adhesive layer one side;By the of substrate
One surface is fitted in the another side of the first adhesive layer, to form hollow structure between substrate and the first coating.
A specific embodiment according to the present invention is produced on the first bonding in one side at least one the first protrusion
Layer, comprising: production is used to form the mold of the first adhesive layer at least one the first protrusion;It is viscous using Mold Making first
Connect layer.
A specific embodiment according to the present invention is produced on the first bonding in one side at least one the first protrusion
Layer, comprising: first adhesive layer of the production on the first face at least one the first protrusion;Wherein, the first cladding layer is existed
The one side of first adhesive layer, comprising: by the first cladding layer in second face opposite with the first face of the first adhesive layer;Wherein,
Substrate is fitted in the another side of the first adhesive layer, comprising: substrate is fitted in the first face of the first adhesive layer.
A specific embodiment according to the present invention, the method also includes: it attaches on the first face of the first adhesive layer
Protective film;Before the first face that substrate is conformed to the first adhesive layer, protective film of tearing.
A specific embodiment according to the present invention, the method also includes: be produced in one side have at least one the
Second adhesive layer of two protrusions;By the second cladding layer the second adhesive layer one side;By the opposite with first surface of substrate
Second surface is fitted in the another side of the second adhesive layer, to form hollow structure between substrate and the second coating.
Cover board according to an embodiment of the present invention and its manufacturing method provide the adhesive layer with bulge-structure, for being bonded
Substrate and coating, to form composite decking structure.Such composite decking passes through between bulge-structure and bulge-structure
Hollow structure can disperse stress when substrate is impacted, and the probability of substrate fragmentation be reduced, to effectively increase flexible screen
Anti-fragmentation performance, while buffer function can be provided to substrate, improve the anti-shear performance of cover board, improves bending reliability.
Specific embodiment
In order to make those skilled in the art that idea of the invention and thought be more clearly understood, below in conjunction with specific implementation
Example the present invention is described in detail.It should be understood that the one of embodiments set forth herein all embodiments that all only the present invention may have
Part.Those skilled in the art have the ability to make a part or whole part of following embodiments after reading the description of the present application
It improves, be transformed or replace out, these are improved, transformation or replacement are also included in the scope of protection of present invention.
Various embodiments of the present invention provide a kind of cover board for flexible screen and its manufacturing method, using the flexibility of the cover board
Display module and electronic equipment with the Flexible Displays mould group for using the cover board.In various embodiments of the present invention, electronics is set
It is standby to can be mobile phone, computer, tablet computer, E-book reader, DTV etc..In various embodiments of the present invention, flexible screen
It can refer to the deformable flexible electronic display being fabricated from a flexible material, such as AMOLED.The type of flexible screen can be with
The flexible screen of flexible screen, foldable (foldable) including bent (bendable) and the flexibility of rollable (rollable)
Screen.The also known as fixed Curved screen of bent flexible screen, this display screen form curve form by fixed angle bending.It can roll over
Folded flexible screen can be folding along one or more broken line, and countless a variety of variations can occur for use state.Rollable
Flexible screen can bend in any position on the surface of entire display screen, be the variation highest flexible screen of freedom degree.?
In various embodiments of the present invention, flexible screen and cover board form Flexible Displays mould group, and cover board is the outermost protection of Flexible Displays mould group
Property structure.Flexible Displays mould group, which can be, to be referred to be directly connected to other components (such as mainboard) of electronic equipment, and is not had to
Add the structure of other electronic components.In Flexible Displays mould group, polaroid, touch-control are usually also provided with below cover board
Panel, flexible screen, support membrane etc..
Figure 1A shows the structural schematic diagram of cover board 100 according to an embodiment of the invention.Figure 1B shows Figure 1A embodiment
The plan view of first adhesive layer 130 of cover board 100.
In the present embodiment, cover board 100 includes: substrate 110;First coating 120, the first coating 120 are covered on substrate 110
First surface 111 on;First adhesive layer 130, the first coating 120 are bonded to substrate 110 by the first adhesive layer 130, and first
At least one first protrusion 131 is provided on first face of adhesive layer 130, to be formed between substrate 110 and the first coating 120
Hollow structure 132.
It is combined according to the cover board of the present embodiment by substrate and the first coating, enables cover board integration base and coating
Mechanical performance, thus have more comprehensive applicability.By being provided with the of the first protrusion between substrate and the first coating
The connection of one adhesive layer being capable of answering of being born when being impacted of cushion cover so that form hollow structure between the first protrusion
Power, reduces the probability of substrate fragmentation, and can improve the anti-shear performance of cover board, improves bending reliability.
In the present embodiment, substrate 110, which can refer to, undertakes 100 main loads of cover board, plays support as 100 main body of cover board
The structure of effect.The material of substrate 110 can be ultra-thin glass, PI (polyimide), PET (polyethylene terephthalate),
PMMA (polymethyl methacrylate), PU (polyurethane) etc..In the present embodiment, ultra-thin glass can be dinger thickness degree and be less than or wait
In 300 microns of glass.In one embodiment of this invention, ultra-thin glass can be the glass that dinger thickness degree is less than or equal to 50 microns
Glass.In one embodiment of this invention, substrate 110 is made of ultra-thin glass.Material of the ultra-thin glass as substrate 110, has
Preferable thermal stability and chemically, good flexible, visible light permeability, steam and oxygen barrier property, higher
Surface flatness and surface hardness, higher scratch resistance, and insulate.According to an embodiment of the invention, surface is had convex
The adhesive layer for playing structure is bonded with the upper surface of ultra-thin glass and/or lower surface, and the surface hardness of composite decking can be enhanced, and
Allow cover board to buffer stress suffered by ultra-thin glass when being impacted, reduces glass fragmentation faced probability.
In the present embodiment, the first coating 120 can refer to the stratiform knot being covered on the first surface 111 of substrate 110
Structure.First coating 120 can be planar structure, can be by materials systems such as PI, PMMA or PDMS (dimethyl silicone polymer)
At.The first coating 120, which is arranged, can be improved the crash resistance of cover board 100, and can be improved the smoothness of cover board 100, intensity, prevents
The performances such as scrape, be grease proofing.In one embodiment of this invention, the first coating 120 is made of PI material.PI has good thermostabilization
Property, preferable mechanical property and chemical property.
In the present embodiment, the first surface 111 of substrate 110 can be the upper surface (as shown in Figure 1A) of substrate, can also
To be the lower surface (not shown) of substrate.First coating 120 covers the first surface 111 of substrate 110, can refer to the first coating
120 are completely covered substrate 110 on the entire area of substrate 110, may also mean that the first coating 120 covers substrate 110
Most areas.
In the present embodiment, the first adhesive layer 130 is the middle layer for connecting coating and substrate, plays bonding effect.
In the present embodiment, the first coating 120 is bonded to substrate 110 by the first adhesive layer 130, can refer to the first adhesive layer 130
It is folded between the first coating 120 and substrate 110, the two is bonded together by the viscous force of itself.In the present embodiment,
The material of one adhesive layer 130 can be transparent optical cement OCA (optical clear adhesive), solid transparent optical glue
SCA (solid optically clear adhesive), pressure sensitive adhesive PSA (pressure sensitive adhesive) or
Optical clear resin OCR (optical clear resin).According to the present embodiment, coating and substrate are bonded by adhesive layer, had
Conducive to the structural intergrity for improving cover board entirety, the defects of dividing, being staggered is avoided.An embodiment according to the present invention, the
One adhesive layer 130 is made of OCA glue.OCA glue have high clarity, high light transmittance (full light transmittance > 99%), high adhesion,
The performances such as high durable, water resistance, high temperature resistant, uvioresistant have controlled thickness, uniform spacing are capable of providing, when long
Between using yellow (xanthochromia), removing and rotten will not be led to the problem of.
In the present embodiment, the first protrusion 131 of the first adhesive layer 130 can refer to the table for extending beyond the first adhesive layer
Face height forms the object of standing shape structure.In the present embodiment, the first protrusion 131 can only have one, for example, along song
The strip bulge that line extends and is distributed in the whole surface of the first adhesive layer 130, it is possible to have it is multiple, for example, dispersedly
The multiple columnar projections being arranged in the whole surface of the first adhesive layer 130, the embodiment of the present invention are not limited to this, for example,
First protrusion 131 is also possible to fenestral fabric.In the present embodiment, hollow structure 132 can refer to because of the first protrusion 131
Presence, and the gap formed between the first adhesive layer 130 and substrate 110 or the first coating 120.Hollow structure can be company
At a piece of (as shown in Figure 1B), it is also possible to discrete (as shown in Figure 2).In the present embodiment, hollow structure 132 is in plane
On distribution situation can depend on the first protrusion 131 plane distribution.
In the present embodiment, the first face for being provided with the first adhesive layer 130 of the first protrusion 131 can be the first adhesive layer
Upper surface (not shown), be also possible to the lower surface (as shown in Figure 1A) of the first adhesive layer.
An embodiment according to the present invention, the first face of the first adhesive layer 130 are the side towards substrate 110.In this way
One, the first protrusion 131 directly contact substrate 110, the hollow structure between the first protrusion 131 also directly reclines substrate 110, from
And it can more fully disperse the stress that substrate 110 is born in collision or bending.According to another embodiment of the present invention,
First face of one adhesive layer is the side away from substrate.The first protrusion directly contacts the first coating at this time, can also play slow
The effect of punching and dispersive stress, to improve the anti-fragmentation performance of cover board.
An embodiment according to the present invention, the cross section of the first protrusion 131 can have various shape, including circle, three
Angular, rectangle or diamond shape etc..The longitudinal section of first protrusion 131 can be trapezoidal or rectangle etc..For example, when the first protrusion 131
Cross section is circle, and when the longitudinal section of the first protrusion 131 is trapezoidal, the first protrusion is truncated cone-shaped, transversal when the first protrusion 131
Face is circle, and when the longitudinal section of the first protrusion 131 is rectangle, the first protrusion is cylinder.
Referring to Figure 1B, an embodiment according to the present invention, first protrusion 131 is in cylindrical shape, and micro- with 10
The diameter of rice to 100 microns.The first cylindrical protrusion 131 can effectively increase the first adhesive layer 130 it is raised that
Bond area on one side, to improve the fastness of bonding.Cylindrical protrusions of the diameter between 10 microns and 100 microns can
Enough guarantee that bond area is sufficiently large, and can guarantee that the gap between protrusion is enough, to provide effective buffer function.
An embodiment according to the present invention, the height of first protrusion 131 are the 1/5 of the thickness of the first adhesive layer 130
To 1/3.In the present embodiment, the first adhesive layer 130 with a thickness of the distance between substrate 110 and the first coating 120, Ye Ji
The bottom surface of one adhesive layer 130 is to the maximum gauge between raised top surface.When the height of protrusion is the 1/5 to 1/3 of thickness of adhibited layer
When, effective buffer function can either be provided to cover board 100, and can guarantee that protrusion has certain enabling capabilities simultaneously, in order to avoid
Since the structural strength of raised adhesive layer not enough causes coating or substrate to collapse or out-of-flatness.
An embodiment according to the present invention, first protrusion 131 are evenly distributed on the first face of the first adhesive layer 130
On.In the present embodiment, being uniformly distributed can refer to that the number of the first protrusion in unit area is equal or roughly equal,
It can refer to that the sum of area of plane shared by the first protrusion in unit area is equal or roughly equal.Protrusion is evenly distributed on viscous
Connect on layer, be conducive to keep adhesive effect and buffering effect homogeneity, avoid because structure it is uneven caused by stress concentrate
Or uneven surface.
Fig. 2 shows the plan views of the first adhesive layer 230 of cover board according to an embodiment of the invention.First adhesive layer 230
It can be an example of the first adhesive layer 130 of Figure 1A embodiment.In the present embodiment, the first adhesive layer 230 is provided with net
First protrusion 231 of trellis.Discrete, rectangle hollow structure 232 is formed between the first protrusion 231 at this time.Latticed
One protrusion is formed by discrete hollow structure similar to closed air bag, can individually absorb impact and absorb stress, thus
More significant buffer function is provided.
Fig. 3 shows the structural schematic diagram of cover board 300 according to an embodiment of the invention.According to the cover board 300 of the present embodiment
It can be an example of the cover board 100 of Figure 1A embodiment.
In the present embodiment, other than substrate 310, the first coating 320 and the first adhesive layer 330, cover board 300 further includes
Second coating 340 and the second adhesive layer 350, the second coating 340 are covered on second opposite with first surface 311 of substrate 310
On surface 312, the second coating 340 is bonded to substrate 310 by the second adhesive layer 330, is arranged on the first face of the second adhesive layer 350
There is at least one second protrusion 351, to form hollow structure between substrate 310 and the second coating 340.
In the present embodiment, the second coating 340 from the first coating 320 other than position is different, other aspects, including knot
Structure and material, it is essentially identical.Second adhesive layer 350 from the first adhesive layer 330 other than position and orientation are different, other aspects
It is essentially identical.Second protrusion 351 and the first protrusion 331 have basically same structure.In the present embodiment, with first surface
311 opposite second surfaces 312 can be the upper surface (not shown) of substrate 310, be also possible to the lower surface of substrate 310 (such as
Shown in Fig. 3).There is upper layer and lower layer coating according to the cover board 300 of the present embodiment, more comprehensive guarantor can be provided for substrate 310
Shield and support, and can more fully disperse the generated stress when being subjected to impact of substrate 310, there are more protrusions and sky
Gap is that substrate 210 provides buffer function.
It should be understood that the second adhesive layer 350 can also be different in structure with the first adhesive layer 330, for example, when the first bonding
When protrusion on layer 330 is the protrusion of dispersion, the protrusion on the second adhesive layer 350 can be latticed protrusion.According to the present invention
Embodiment can according to the different mechanical properties of two adhesive layer present positions be two adhesive layers different shape knots is set
Structure, so that the whole mechanical property of cover board is optimal.For example, when flexible screen curves inwardly frequent occurrence, table on substrate
Extrusion stress is often born in face, and tensile stress is often born in lower surface.At this point it is possible to will be arranged in the adhesive layer of upper surface convex
It plays that smaller, hollow structure is bigger, to be more suitable for through being squeezed, it is bigger, hollow protrusion will to be arranged in the adhesive layer of lower surface
Structure is smaller, to be more suitable for through Tensile.
Fig. 4 shows the structural schematic diagram of Flexible Displays mould group 400 according to an embodiment of the invention.
The 400 backpack cover plate 410 of Flexible Displays mould group and flexible screen 420 of Fig. 4.Flexible screen 420 is arranged below cover board 410.
For example, Flexible Displays mould group 400 can also include polaroid, touch panel, support other than cover board 410 and flexible screen 420
The modular structures such as film, foam.Certainly, the Flexible Displays mould group of embodiment according to the present invention is not limited to above-mentioned modular structure.
It is convex by being provided with first between the substrate of cover board and the first coating according to the Flexible Displays mould group of the present embodiment
The the first adhesive layer connection risen so that form hollow structure between the first protrusion, can cushion cover held when being impacted
The stress received, reduces the probability of substrate fragmentation, and can improve the anti-shear performance of cover board, improves bending reliability, thus
Improve Flexible Displays mould group cracking resistance and service life.
The embodiments of the present invention also provide a kind of electronic equipment, the flexible screens of the embodiment including Fig. 4.
The method that Fig. 5 shows cover board of the manufacture according to an embodiment of the invention for flexible screen.The method of Fig. 4 can be used
In the cover board for preparing above-described embodiment description, detailed description is suitably omitted herein.This method includes following content:
510, it is produced on the first adhesive layer at least one the first protrusion in one side;
520, by the first cladding layer the first adhesive layer one side;
530, the first surface of substrate is fitted in the another side of the first adhesive layer, with the shape between substrate and the first coating
At hollow structure.
In the present embodiment, the first adhesive layer and protrusion thereon are made, can be realized, can also be passed through by mold
It is machined into protrusion on the surface of preformed planar adhesive layer and realizes.In the present embodiment, the first adhesive layer
One side and another side can refer to the opposite sides of the first adhesive layer.In relation to substrate, the first coating, first in the present embodiment
The details of adhesive layer and the first protrusion, sees above description.According to the cover plate making method of the present embodiment, it can produce and be used for
The bulge-structure of dispersive stress and offer buffering, for improving the intensity and drop resistant performance of substrate.
An embodiment according to the present invention, 510 include:
Production is used to form the mold of the first adhesive layer with first protrusion;
Use the first adhesive layer of Mold Making.
In the present embodiment, mold can be refer to by be molded or squeeze etc. modes by the first adhesive layer be molded into come
Shaping jig.Mold can be made of metal or other heat-resisting materials are made.The mode of production mold can be casting
It makes, is also possible to be machined.It can be the first adhesive layer finally used by the first adhesive layer that Mold Making comes out,
It can be the semi-finished product of the first adhesive layer, it is also necessary to which processing could final molding otherwise.According to the lid of the present embodiment
Board fabrication method manufactures the first adhesive layer by mold, can efficiently fast implement the manufacture of the first adhesive layer, while guaranteeing the
The shape of one adhesive layer and the stability of structure.
An embodiment according to the present invention, 510 include: first bonding of the production on the first face with first protrusion
Layer.520 include: by the first cladding layer in second face opposite with the first face of the first adhesive layer.530 include: to paste substrate
It closes in the first face of the first adhesive layer.In the present embodiment, the first raised substrate that directly reclines enables the first protrusion more straight
Ground connection provides the function of dispersive stress and buffering for substrate.
An embodiment according to the present invention, cover plate making method further include:
Protective film is attached on the first face of the first adhesive layer;
Before the first face that substrate is conformed to the first adhesive layer, protective film of tearing.
In the present embodiment, protective film is attached on the first face of adhesive layer, is conducive to keep the viscosity in the first face will not
It detracts or even disappears in the storage and transportational process of adhesive layer.Since the first face of adhesive layer is equipped with the first protrusion,
The attaching performance of protective film should be able to guarantee that bulge-structure will not be destroyed when tearing protective film.For example, using the first face as
Weight layer upper surface, will be on the first face for being attached to adhesive layer on one side of protective film relatively easily torn.In another reality of the invention
It applies in example, can also also attach protective film on the second face of adhesive layer.At this point it is possible to be used using the second face as light layer upper surface
Protective film be relatively difficult to tear be attached on the second face of adhesive layer on one side.
An embodiment according to the present invention, cover plate making method further include:
It is produced on the second adhesive layer at least one the second protrusion in one side;
By the second cladding layer the second adhesive layer one side;
The second surface opposite with first surface of substrate is fitted in the another side of the second adhesive layer, in substrate and
Hollow structure is formed between two coating.
Coating is pasted on two surfaces of substrate according to the manufacturing method of the present embodiment, and two coating are logical
Cross the adhesive layer bonding for being provided with protrusion.So, more comprehensive protection can be provided to substrate, it can be more fully
Stress when dispersion substrate is subjected to impact, additionally it is possible to provide significantly more efficient buffer function to substrate.
Combine specific embodiment that idea of the invention, principle and thought is described in detail above.Those skilled in the art
It should be understood that the more than these types of form given above of embodiments of the present invention, those skilled in the art are reading the application text
After part, any possible improvement, replacement can be made to the step in above embodiment, method, apparatus, component and is equal
Form, these are improved, replacements and equivalents should be regarded as falling within the scope of the invention.Protection scope of the present invention is only with power
Subject to sharp claim.