CN109299488B - Method for judging bonding condition of epoxy resin layer in epoxy sleeve repairing pipeline - Google Patents
Method for judging bonding condition of epoxy resin layer in epoxy sleeve repairing pipeline Download PDFInfo
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Abstract
The invention discloses a method for judging the bonding condition of an epoxy resin layer in an epoxy sleeve repairing pipeline, and belongs to the field of oil and gas pipeline repairing. The method comprises the following steps: establishing an epoxy sleeve repairing pipeline model of a simulation pipeline, a simulation epoxy resin layer and a simulation steel sleeve which are sequentially sleeved from inside to outside; taking different simulated pressure values as the operating pressure in the simulated pipeline, acquiring corresponding simulated stress values, and establishing a linear fitting relation between the simulated pressure values and the corresponding simulated stress values; acquiring a simulated stress value of the target epoxy resin according to the linear fitting relation and the actual operating pressure of the target pipeline; acquiring an actual bonding force value of a target epoxy resin layer; comparing the actual bonding force value with the simulated stress value of the target epoxy resin: the actual bonding force value is larger than the simulated stress value of the target epoxy resin, and the target epoxy resin layer and the target pipeline or the target steel sleeve are in a bonding state; otherwise, the separation is carried out. The method can accurately and quickly judge the bonding condition of the epoxy resin layer in the epoxy sleeve repairing pipeline.
Description
Technical Field
The invention relates to the field of oil and gas pipeline repair, in particular to a method for judging the bonding condition of an epoxy resin layer in an epoxy sleeve repaired pipeline.
Background
Petroleum and natural gas are generally conveyed through pipelines, and with the prolonging of the service life of the pipelines, the pipelines are easy to have the defects of corrosion, cracks, deformation, scratches, welding line cracking and the like due to the external environment, the pressure of conveying media, chemical factors and the like, so that the pipelines cannot be normally used. For the above defects of the pipeline, the pipeline can be repaired by a method of sleeving the two halves of the equal steel sleeve on the defect of the pipeline and pouring epoxy resin between the steel sleeve and the pipeline, and the method is called epoxy sleeve repairing the pipeline. However, when media with different pressures are conveyed in the pipeline, the epoxy resin layer and the steel sleeve sleeved at the pipeline defect part expand or contract. Because pipeline, epoxy layer, the telescopic expansion coefficient of steel are different, the epoxy layer will receive the stress effect, makes the bonding state between epoxy layer and pipeline or the steel sleeve change, and even the mutual separation, this seriously influences the effect that the pipeline was restoreed to the epoxy sleeve. Based on the above, it is necessary to provide a method for determining the adhesion condition of an epoxy resin layer in an epoxy sleeve repaired pipe.
The prior art provides a method for judging the bonding condition of an epoxy resin layer in an epoxy sleeve repaired pipeline, which comprises the following steps: when the pipeline running pressure after the epoxy sleeve is repaired is different, whether the epoxy resin layer is suitable for the epoxy sleeve repair with the running pressure pipeline or not is judged by checking the bonding condition between the epoxy resin layer and the pipeline or the steel sleeve. Through repeating above-mentioned step many times, when obtaining in the pipeline for different operating pressure, the epoxy resin layer of different materials and the pipeline or the bonding condition between the steel sleeve come to receive the pipeline operating pressure's that obtains the epoxy resin layer of different materials and be suitable for scope. When the pipeline is repaired, the epoxy resin layer matched with the pipeline is selected according to the operating pressure in the pipeline, so that the epoxy resin layer is not separated from the pipeline or the steel sleeve under the operating pressure of the pipeline.
The inventor finds that the prior art has at least the following problems:
the method provided by the prior art is complicated, and when the operating pressure in the pipeline is different, the bonding condition between the epoxy resin layer made of different materials and the pipeline and the steel sleeve needs to be checked every time.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is to provide a method which is simple and can easily judge the bonding condition of epoxy resin layers made of different materials in an epoxy sleeve repairing pipeline. The specific technical scheme is as follows:
the embodiment of the invention provides a method for judging the bonding condition of an epoxy resin layer in an epoxy sleeve repairing pipeline, which comprises the following steps:
establishing an epoxy sleeve repairing pipeline model, wherein the epoxy sleeve repairing pipeline model comprises the following steps: the simulation pipeline, the simulation epoxy resin layer and the simulation steel sleeve are sleeved from inside to outside in sequence;
taking different simulated pressure values as the operating pressure in the simulated pipeline, and acquiring simulated stress values corresponding to the simulated epoxy resin layer under different simulated pressure values;
establishing a linear fitting relation between the simulated pressure value and the simulated stress value;
acquiring a simulated stress value of the target epoxy resin layer according to the linear fitting relation and the actual operating pressure in the target pipeline;
acquiring an actual bonding force value of the target epoxy resin layer;
comparing the actual bonding force value of the target epoxy resin layer with the simulated stress value of the target epoxy resin layer:
when the actual bonding force value is larger than the simulated stress value of the target epoxy resin layer, the target epoxy resin layer and the target pipeline or the target steel sleeve are in a bonding state;
and on the contrary, the target epoxy resin layer is separated from the target pipeline or the target steel sleeve.
Specifically, the simulated pressure value is preferably in the range of 1MPa to 5 MPa.
Specifically, preferably, the linear fitting relationship is a linear fitting graph.
Specifically, preferably, the simulated stress includes: simulated central stress and simulated edge stress.
Specifically, preferably, the simulated central stress and the simulated edge stress each include: simulating hoop stress, simulating axial stress and simulating radial stress.
Specifically, preferably, the method further comprises: determining the simulated hoop stress, the simulated axial stress or the simulated radial stress as a sensitive factor;
comparing the actual bonding force value with a force value corresponding to the sensitive factor:
when the actual bonding force value is larger than the force value corresponding to the sensitive factor, the target epoxy resin layer and the target pipeline or the target steel sleeve are in a bonding state;
and on the contrary, the target epoxy resin layer is separated from the target pipeline or the target steel sleeve.
Specifically, preferably, the actual adhesion value is obtained by:
testing physical parameters of the target epoxy layer, comprising: material, modulus of elasticity, poisson's ratio, and coefficient of expansion;
acquiring epoxy resin layer samples with physical parameters one-to-one identical to those of the target epoxy resin layer;
and testing the bonding force value of the epoxy resin layer sample by using a bonding force tester to serve as an actual bonding force value.
Specifically, preferably, the actual adhesion value is obtained by:
intercepting a piece of epoxy resin layer sample from the target epoxy resin layer;
and testing the bonding force value of the epoxy resin layer sample by using a bonding force tester to serve as the actual bonding force value.
Specifically, preferably, the actual adhesion value includes: the actual bond value at the middle and the actual bond value at the edge.
The technical scheme provided by the embodiment of the invention has the following beneficial effects:
according to the method for judging the bonding condition of the epoxy resin layer in the epoxy sleeve repairing pipeline provided by the embodiment of the invention, the linear fitting relation between the simulated pressure value and the simulated stress value is obtained by establishing the epoxy sleeve repairing pipeline model, the simulated stress value of the target epoxy resin layer is obtained through the linear fitting relation and the actual operation pressure in the target pipeline, and the simulated stress value is compared with the actual bonding force value of the target epoxy resin layer, so that the bonding condition of the target epoxy resin layer is judged. The method is simple, and can judge whether the target epoxy resin layers made of different materials are suitable for repairing the target pipelines made of different materials and having different operating pressures, so that the target pipelines can be repaired by selecting the appropriate epoxy resin materials.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a plot of a linear fit of simulated central stress to simulated pressure provided in example 1 of the present invention;
FIG. 2 is a linear fit graph of simulated edge stress and simulated pressure provided in example 1 of the present invention.
Detailed Description
Unless defined otherwise, all technical terms used in the examples of the present invention have the same meaning as commonly understood by one of ordinary skill in the art. In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The embodiment of the invention provides a method for judging the bonding condition of an epoxy resin layer in an epoxy sleeve repairing pipeline, which comprises the following steps:
establishing an epoxy sleeve repairing pipeline model, wherein the epoxy sleeve repairing pipeline model comprises the following steps: the pipeline repairing model comprises a simulation pipeline, a simulation epoxy resin layer and an epoxy sleeve repairing pipeline model for simulating a steel sleeve which are sequentially sleeved from inside to outside; taking different simulated pressure values as the operating pressure in the simulated pipeline, and acquiring simulated stress values corresponding to the simulated epoxy resin layer under different simulated pressure values; establishing a linear fitting relation between the simulated pressure value and the simulated stress value; acquiring a simulated stress value of the target epoxy resin layer according to the linear fitting relation and the actual operating pressure in the target pipeline; acquiring an actual bonding force value of a target epoxy resin layer; comparing the actual bonding force value of the target epoxy resin layer with the simulated stress value of the target epoxy resin layer: when the actual bonding force value is larger than the simulated stress value of the target epoxy resin layer, the target epoxy resin layer and the target pipeline or the target steel sleeve are in a bonding state; and on the contrary, the target epoxy resin layer is separated from the target pipeline or the target steel sleeve.
It should be noted that the actual adhesion value is the amount of force applied when the target epoxy layer is separated from the target pipe or the target steel sleeve. "separate" means a partial or complete separation between the target epoxy layer and the target pipe or target steel sleeve.
According to the method for judging the bonding condition of the epoxy resin layer in the epoxy sleeve repairing pipeline provided by the embodiment of the invention, the linear fitting relation between the simulated pressure value and the simulated stress value is obtained by establishing the epoxy sleeve repairing pipeline model, the simulated stress value of the target epoxy resin layer is obtained through the linear fitting relation and the actual operation pressure in the target pipeline, and the simulated stress value is compared with the actual bonding force value of the target epoxy resin layer, so that the bonding condition of the target epoxy resin layer is judged. The method is simple, and can judge whether the target epoxy resin layers made of different materials are suitable for repairing the target pipelines made of different materials and having different operating pressures, so that the target pipelines can be repaired by selecting the appropriate epoxy resin materials.
The method provided by the embodiment of the invention is specifically described as follows:
firstly, establishing an epoxy sleeve repair pipeline model in finite element simulation software FLUENT, wherein the epoxy sleeve repair pipeline model comprises the following steps: the simulation pipeline, the simulation epoxy resin layer, the simulation steel sleeve of suit in order from inside to outside. FLUENT software is a common modeling software and will not be described in detail herein.
Specifically, the simulated pipeline, the simulated epoxy resin layer and the simulated steel sleeve in the epoxy sleeve repair pipeline model correspond to physical parameters such as a target pipeline, a target epoxy resin layer and a target steel sleeve in a one-to-one manner, such as material, elastic modulus, Poisson's ratio and thermal expansion coefficient, so that the actual epoxy sleeve repair pipeline is simulated at high precision. A plurality of corresponding models can be established for epoxy, pipe or steel sleeves of different materials.
Then obtaining different simulated stress values of the simulated epoxy resin layer by the following method:
and carrying out grid division on the model, and applying different simulated pressure values for constraint so as to obtain corresponding different simulated stress values.
Before the epoxy sleeve is repaired, the pressure in the pipeline is usually reduced to 2MPa, and after the repair is finished, the pressure is increased to the operating pressure (generally 5MPa) of the pipeline. When replacing steel sleeves, the operating pressure in the pipeline is usually reduced from 5MPa to 0 MPa. The simulated pressure value is in the range of 1MPa to 5MPa, and may be, for example, 1MPa, 1.5MPa, 2MPa, 2.5MPa, 3MPa, 3.5MPa, 4MPa, 4.5MPa, 5MPa, or the like, to accurately simulate the operating pressure within the target pipeline.
For example, the simulated pressure values of 1MPa, 2MPa, 3MPa, 4MPa, 5MPa, etc. are applied to the simulated pipeline for constraint, and corresponding different simulated stress values are obtained respectively.
And then, the simulated pressure values correspond to the simulated stress values one by one, and a linear fitting relation between the simulated pressure values and the simulated stress values is established. In order to facilitate the visual observation of the relationship between the simulated pressure value and the simulated stress value, the linear fitting relationship is a linear fitting graph.
In an actual epoxy sleeve rehabilitating pipeline, the magnitude of the middle stress and the edge stress of the target epoxy layer are different. To facilitate high precision simulation, simulating the simulated stress of the epoxy layer includes: simulated central stress and simulated edge stress.
Specifically, simulating both the mid-section stress and the simulated edge stress includes: the method comprises the following steps of simulating hoop stress, axial stress and radial stress so as to compare the actual bonding force with the obtained actual bonding force in different directions, and then accurately judging the bonding condition of the epoxy resin layer.
In order to facilitate rapid determination of the bonding state of the epoxy resin layer, the method provided by the embodiment of the invention further comprises: determining simulated hoop stress, or simulated axial stress, or simulated radial stress as a sensitive factor; and comparing the actual bonding force value with a force value corresponding to the sensitive factor: when the actual bonding force value is larger than the force value corresponding to the sensitive factor, the target epoxy resin layer and the target pipeline or the target steel sleeve are in a bonding state; and on the contrary, the target epoxy resin layer is separated from the target pipeline or the target steel sleeve.
The sensitive factor is the factor which has the largest influence on the actual bonding force value, and can also be understood as the factor which is easiest to reach the actual bonding force value, namely the factor with the largest value among the simulated hoop stress, the simulated axial stress and the simulated radial stress is the sensitive factor. The force value corresponding to the sensitive factors is compared with the actual bonding force value, so that the comparison factors are reduced, and the bonding state of the epoxy resin layer is rapidly judged.
Specifically, the actual adhesion value can be obtained by various methods, and on the premise of easy obtainment, the following two specific examples are given:
as a first example: the method for acquiring the actual bonding force value comprises the following steps: testing physical parameters of a target epoxy layer, comprising: material, modulus of elasticity, poisson's ratio, and coefficient of expansion; acquiring epoxy resin layer samples with physical parameters one-to-one identical to those of a target epoxy resin layer; and testing the bonding force value of the epoxy resin layer sample by using a bonding force tester as an actual bonding force value.
The epoxy resin layer sample is an epoxy resin layer prepared by adopting the same method of physical parameters and preparation method as the target epoxy resin layer.
As a second example: the method for acquiring the actual bonding force value comprises the following steps: intercepting a block from a target epoxy resin layer as an epoxy resin layer sample; and testing the bonding force value of the epoxy resin layer sample by using a bonding force tester as an actual bonding force value.
The two methods for obtaining the actual bonding force value are simple, and the bonding condition of the epoxy resin layer in the epoxy sleeve repairing pipeline can be judged conveniently by using the method provided by the embodiment of the invention. The second example preferably provides a method that can accurately acquire the actual adhesion value of the target epoxy resin layer.
The adhesion tester may be a coating adhesion tester available from ELCOMETER106, uk, heigh. When testing actual adhesion value, bond cylinder test end and the epoxy layer sample of adhesion force tester, then pull cylinder test end until with the separation of epoxy layer sample, when recording both separations, to the pulling force that cylinder test end was applyed, actual adhesion value promptly.
The specific time for obtaining the actual adhesion value is not limited, and may be before modeling or after modeling.
Specifically, the actual adhesion values include: the actual bond value at the middle and the actual bond value at the edge.
The method is characterized in that the middle actual adhesion value or the edge actual adhesion value of the epoxy resin layer sample is tested and is compared with the simulated middle stress and the simulated edge stress respectively, so that whether the epoxy resin layer actually used is qualified or not is accurately judged.
Further, when the adhesion tester is used for testing the adhesion value, the cylinder testing end can also be stretched along the hoop direction, the axial direction and the radial direction of the epoxy resin layer test sample so as to obtain the hoop actual adhesion value, the axial actual adhesion value and the radial actual adhesion value, and the hoop actual adhesion value, the axial actual adhesion value and the radial actual adhesion value are respectively compared with the simulated hoop stress value, the simulated axial stress value and the simulated radial stress value of the target epoxy resin layer so as to judge the adhesion condition of the epoxy resin layer.
When the actual adhesion value is greater than the simulated stress value of the target epoxy resin layer, the target epoxy resin layer is still adhered to the target pipeline or the target steel sleeve when bearing the simulated stress value, and the target epoxy resin layer is not separated from the target pipeline or the target steel sleeve, so that the target epoxy resin layer is suitable for repairing the pipeline with the actual operation pressure, and the target epoxy resin layer can be considered to be qualified. On the contrary, when the target epoxy resin layer bears the simulated stress value, the actual bonding force value is smaller than the simulated stress value, which indicates that the target epoxy resin layer is separated from the target pipeline or the target steel sleeve, so the target epoxy resin layer is not suitable for pipeline repair with the actual operating pressure, and the target epoxy resin layer is considered to be unqualified and needs to select the epoxy resin material with good bonding effect.
In actual operation of a target pipeline repaired by the epoxy sleeve, expansion or contraction of the target pipeline, the target epoxy resin layer and the target steel sleeve can be influenced by changes of operation pressure, and due to the fact that expansion coefficients of the target pipeline, the target epoxy resin layer and the target steel sleeve are different, a tensile stress effect can be generated between the target epoxy resin layer and the target pipeline or between the target steel sleeve and the target epoxy resin layer, and therefore simulated radial stress is generally a sensitive factor. And judging whether the target epoxy resin layer is qualified or not by comparing the simulated radial stress value with the radial actual bonding force value. And the edge simulated radial stress value and the edge radial actual bonding force value, and the middle simulated radial stress value and the middle radial actual bonding force value can be compared.
When the target epoxy resin layer is not suitable for repairing the target pipeline with the actual operating pressure, the pipeline model can be repaired by establishing the epoxy sleeve with the simulated epoxy resin layer made of other materials, and the steps are repeated to obtain the target epoxy resin layer suitable for repairing the target pipeline.
The present invention will be further described below by way of specific examples.
Example 1
The embodiment provides a method for judging the bonding condition of an epoxy resin layer in an epoxy sleeve repairing pipeline, which comprises the following steps: first, by inputting the relevant parameters of the pipeline in the finite element simulation software FLUENT: x70 tubular steel, elastic modulus 2e11GPa, Poisson's ratio of 0.35, coefficient of thermal expansion of 12e-6(ii) a Relevant parameters of the epoxy layer: modulus of elasticity 2.3e9GPa, Poisson's ratio of 0.35, coefficient of thermal expansion of 67.1e-6(ii) a Relevant parameters of the steel sleeve: x70 tubular steel, elastic modulus 2e11GPa, Poisson's ratio of 0.3 and thermal expansion coefficient of 12e-6And establishing an epoxy sleeve repairing pipeline model which is sequentially sleeved with a simulation pipeline, a simulation epoxy resin layer and a simulation steel sleeve from inside to outside.
Then, carrying out grid division on the epoxy sleeve repairing pipeline model, applying 1MPa, 2MPa, 3MPa, 4MPa and 5MPa simulation pressure values in the simulation pipeline for constraint, respectively obtaining simulation middle stress and simulation edge stress corresponding to the simulation epoxy resin layer, and simulating the middle stress and the simulation edge stress, wherein the simulation middle stress and the simulation edge stress respectively comprise: the simulation hoop stress, the simulation axial stress and the simulation radial stress are shown in the table 1.
TABLE 1
And then, establishing a linear fitting graph of the simulated pressure value and the simulated stress value according to the data of the table 1, wherein the abscissa is the simulated pressure and the ordinate is the simulated middle stress and the simulated edge stress respectively as shown in the attached figures 1 and 2. As can be seen from fig. 1 and 2, the simulated radial stress value is greater than the simulated middle stress value and the simulated edge stress value, so the simulated radial stress value is a sensitive factor, and the bonding condition of the target epoxy resin layer is determined by comparing the radial actual bonding force value with the simulated radial stress value of the target epoxy resin layer at a later stage.
Taking the operating pressures in the pipelines as 2MPa, 3MPa and 5MPA as examples, respectively substituting 2MPa, 3MPa and 5MPA into the attached drawings 1 and 2 to obtain the simulated central radial stress value and the simulated edge radial stress value corresponding to the target epoxy resin layer as 1.2MPa, 2.7MPa, 1.9MPa, 4.0MPa, 3.1MPa and 6.7MPa respectively.
A target epoxy resin layer in an epoxy sleeve repairing pipeline is intercepted and used as an epoxy resin layer sample, and the actual bonding force value of the middle part and the actual bonding force value of the edge of the epoxy resin layer sample are respectively 2.8MPa and 4.5MPa through a coating adhesion force tester provided by the British easy high ElCOMETER106 company.
Because 1.2MPa is less than 2.8MPa and 2.7MPa is less than 4.5MPa, the target epoxy resin layer is in a bonding state with the target pipeline or the target steel sleeve, and the target epoxy resin layer is suitable for the target pipeline with the internal operating pressure of 2 MPa.
Because 1.9MPa is less than 2.8MPa and 4.0MPa is less than 4.5MPa, the target epoxy resin layer is in a bonding state with the target pipeline or the target steel sleeve, and the target epoxy resin layer is suitable for the target pipeline with the internal operating pressure of 3 MPa.
Since 3.1MPa > 2.8MPa and 6.7MPa > 4.5MPa, the target epoxy layer is separated from the target pipe or the target steel sleeve, which is not suitable for the target pipe having an internal operating pressure of 5 MPa.
When the epoxy layer is not suitable for the target pipe, epoxy material of other material can be selected and modeled again, and the above process is repeated.
Application examples
This application example evaluates the accuracy of the method provided in example 1. The specific evaluation process comprises the following steps: after the method provided by embodiment 1 is used to judge the bonding condition of the epoxy resin layer in the epoxy sleeve repaired pipeline, the operating pressure of the target pipeline is set as the actual operating pressure, and then the bonding condition of the corresponding target epoxy resin layer and the pipeline or the steel sleeve is checked. And when the actual operating pressure of the target pipeline is respectively 2MPa, 3MPa and 5MPa in the specific evaluation process, acquiring the simulated middle stress value, the simulated edge stress value, the middle actual bonding force value and the edge actual bonding force value of the target epoxy resin layer, judging the bonding condition of the target epoxy resin layer, and comparing the bonding condition with the actual bonding condition. The three groups of data are numbered as No. 1, No. 2 and No. 3 in sequence, and specific parameters are shown in Table 2.
TABLE 2
Wherein, unqualified means that the epoxy resin layer is separated from the pipeline or the steel sleeve, and qualified means that the epoxy resin layer is bonded with the pipeline or the steel sleeve. As can be seen from table 2, the judgment method provided in example 1 is consistent with the actual adhesion of the target epoxy resin layer. Therefore, the method provided by the embodiment of the invention can be accurately applied to judging the bonding condition of the epoxy resin layer in the epoxy sleeve repairing pipeline, and meets the field use requirement.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (8)
1. A method for determining the adhesion of an epoxy layer in an epoxy sleeve repaired pipe, the method comprising:
establishing an epoxy sleeve repairing pipeline model, wherein the epoxy sleeve repairing pipeline model comprises the following steps: the simulation pipeline, the simulation epoxy resin layer and the simulation steel sleeve are sleeved from inside to outside in sequence;
taking different simulated pressure values as the operating pressure in the simulated pipeline, and acquiring simulated stress values corresponding to the simulated epoxy resin layer under different simulated pressure values; the range of the simulated pressure value is 1MPa-5 MPa;
establishing a linear fitting relation between the simulated pressure value and the simulated stress value;
acquiring a simulated stress value of the target epoxy resin layer according to the linear fitting relation and the actual operating pressure in the target pipeline;
acquiring an actual bonding force value of the target epoxy resin layer;
comparing the actual bonding force value of the target epoxy resin layer with the simulated stress value of the target epoxy resin layer:
when the actual bonding force value is larger than the simulated stress value of the target epoxy resin layer, the target epoxy resin layer and the target pipeline or the target steel sleeve are in a bonding state;
and on the contrary, the target epoxy resin layer is separated from the target pipeline or the target steel sleeve.
2. The method of claim 1, wherein the linear fit relationship is a linear fit graph.
3. The method of claim 1, the simulating stress comprising: simulated central stress and simulated edge stress.
4. The method of claim 3, wherein simulating the central stress and the simulated edge stress each comprises: simulating hoop stress, simulating axial stress and simulating radial stress.
5. The method of claim 4, further comprising: determining the simulated hoop stress, the simulated axial stress or the simulated radial stress as a sensitive factor;
comparing the actual bonding force value with a force value corresponding to the sensitive factor:
when the actual bonding force value is larger than the force value corresponding to the sensitive factor, the target epoxy resin layer and the target pipeline or the target steel sleeve are in a bonding state;
and on the contrary, the target epoxy resin layer is separated from the target pipeline or the target steel sleeve.
6. The method of claim 1, wherein the actual adhesion value is obtained by:
testing physical parameters of the target epoxy layer, comprising: material, modulus of elasticity, poisson's ratio, and coefficient of expansion;
acquiring epoxy resin layer samples with physical parameters one-to-one identical to those of the target epoxy resin layer;
and testing the bonding force value of the epoxy resin layer sample by using a bonding force tester to serve as the actual bonding force value.
7. The method of claim 1, wherein the actual adhesion value is obtained by:
intercepting a piece of epoxy resin layer sample from the target epoxy resin layer;
and testing the bonding force value of the epoxy resin layer sample by using a bonding force tester to serve as the actual bonding force value.
8. The method of claim 1, wherein the actual adhesion value comprises: the actual bond value at the middle and the actual bond value at the edge.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101688104A (en) * | 2007-07-03 | 2010-03-31 | 日立化成工业株式会社 | Adhesive composition, bonded member made with adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing these |
| CN104987666A (en) * | 2015-06-30 | 2015-10-21 | 苏州洋杰电子有限公司 | Epoxy resin-polymaleimide composite semiconductor packaging material and preparation method thereof |
| KR20160145977A (en) * | 2015-06-11 | 2016-12-21 | 신진유지건설 주식회사 | Tube for pipe repairing and strengthen insert shape-memory alloy |
| CN106549283A (en) * | 2016-10-28 | 2017-03-29 | 湖南大学 | A kind of friction film has resin type electrical carbon material of self-regeneration function and preparation method thereof |
-
2017
- 2017-07-25 CN CN201710613290.0A patent/CN109299488B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101688104A (en) * | 2007-07-03 | 2010-03-31 | 日立化成工业株式会社 | Adhesive composition, bonded member made with adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing these |
| KR20160145977A (en) * | 2015-06-11 | 2016-12-21 | 신진유지건설 주식회사 | Tube for pipe repairing and strengthen insert shape-memory alloy |
| CN104987666A (en) * | 2015-06-30 | 2015-10-21 | 苏州洋杰电子有限公司 | Epoxy resin-polymaleimide composite semiconductor packaging material and preparation method thereof |
| CN106549283A (en) * | 2016-10-28 | 2017-03-29 | 湖南大学 | A kind of friction film has resin type electrical carbon material of self-regeneration function and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 《油气长输管道管体缺陷及修复技术概述》;李荣光，杜娟，赵国星，张巍，刘军，安迪，张轩;《石油工程建设》;20160229;全文 * |
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