CN109195314A - A kind of pcb board and a kind of electronic equipment - Google Patents
A kind of pcb board and a kind of electronic equipment Download PDFInfo
- Publication number
- CN109195314A CN109195314A CN201811135613.0A CN201811135613A CN109195314A CN 109195314 A CN109195314 A CN 109195314A CN 201811135613 A CN201811135613 A CN 201811135613A CN 109195314 A CN109195314 A CN 109195314A
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- glass fiber
- signal wire
- pcb board
- chip
- substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of pcb boards, and wherein substrate includes the glass cloth worked out by the first glass fiber and the second glass fiber, are filled with resin in the gap location of glass cloth.And any linear subsignal line in the signal wire of high speed signal is used for transmission positioned at substrate surface and is contacted with above-mentioned first glass fiber, the second glass fiber and gap, it is only in contact with the first glass fiber or the second glass fiber so as to avoid a part in above-mentioned signal wire, and another part signal wire can be in contact with the resin of a large amount of filling to glass cloth gap locations, and the D for the substrate for causing signal wire to contactkAnd DfNon-uniform problem improves the quality of signal in high-speed link so that the physical parameter of the substrate contacted with signal wire is more stable, and then improves the S parameter of pcb board.The present invention also provides a kind of electronic equipment, since the electronic equipment is provided with pcb board provided by aforementioned present invention, so that the electronic equipment equally has above-mentioned beneficial effect.
Description
Technical field
The present invention relates to technical field of integrated circuits, more particularly to a kind of pcb board and a kind of electronic equipment.
Background technique
As the continuous progress of science and technology, the structure and manufacture craft of PCB (printed circuit board) have been achieved in recent years
Greatly development.
Setting high-speed link is usually required at this stage, in pcb board, that is, is used for transmission the link of high speed signal.And it is usual
In the case of the loss of high-speed link have direct influence for the quality of signal transmitted in high-speed link.
In the prior art, usually select the glass cloth worked out by glass fiber as high-speed link to be arranged
Substrate, and be normally filled with resin in the position of glass cloth intermediate gap and solidified.But in the prior art, exist for setting
For the high-speed link for the substrate surface being made of glass cloth, the D of substrate in the prior artk(dielectric constant) and Df(medium
Loss) it is usually very unstable, and high-speed link is for the D of substratekAnd DfIt is more demanding, if the D of substratekAnd DfIt is unstable
If be unfavorable for control to high-speed link, the S parameter so as to cause pcb board in the prior art is lower, and signal quality is poor.
So those skilled in the art's urgent problem when how to improve the S parameter of pcb board.
Summary of the invention
The object of the present invention is to provide a kind of pcb boards, and S parameter is higher, and signal quality is higher；Another object of the present invention
It is to provide a kind of electronic equipment, the quality of the high speed signal transmitted in the electronic equipment is higher.
In order to solve the above technical problems, the present invention provides a kind of pcb board, comprising:
Substrate；Wherein, the substrate includes the glass cloth being compiled by the first glass fiber and the second glass fiber, and filling
To the resin of the glass cloth intermediate gap；
Positioned at the transmitting chip of the substrate surface；Wherein, the transmitting chip is for sending high speed signal；
Positioned at the reception chip of the substrate surface；Wherein, the reception chip is for receiving the high speed signal；
Positioned at the signal wire of the substrate；Wherein, the transmitting chip and the reception chip pass through the signal wire electricity
Connection；The signal wire is used for transmission the high speed signal；First glass fiber, second glass fiber and the gap are equal
It is in contact with linear subsignal line any in the signal wire.
Optionally, first glass fiber is mutually perpendicular to second glass fiber.
Optionally, the signal wire is arranged along first direction, the angle between first glass fiber and the signal wire
Value range be 10 ° to 20 °, including endpoint value.
Optionally, the pcb board further include:
Positioned at the inductance chip of the substrate surface；Wherein, the high speed signal passes through the inductance chip.
Optionally, the pcb board further include:
Positioned at the ESD chip of the substrate surface；Wherein, the high speed signal passes through the ESD chip.
The present invention also provides a kind of electronic equipment, including pcb board as described in any one of the above embodiments.
A kind of pcb board provided by the present invention, wherein substrate include by the first glass fiber and the second glass fiber establishment and
At glass cloth, glass cloth gap location be filled with resin.And it is located at the signal wire that substrate surface is used for transmission high speed signal
In any linear subsignal line contacted with above-mentioned first glass fiber, the second glass fiber and gap, so as to avoid upper
A part is stated in signal wire to be only in contact with the first glass fiber or the second glass fiber, and another part signal wire can with largely fill out
The resin for being charged to glass cloth gap location is in contact, and the D for the substrate for causing signal wire to contactkAnd DfNon-uniform problem, so that with
The physical parameter of the substrate of signal wire contact is more stable, and then improves the S parameter of pcb board, improves signal in high-speed link
Quality.
The present invention also provides a kind of electronic equipment, since the electronic equipment is provided with PCB provided by aforementioned present invention
Plate is no longer repeated herein so that the electronic equipment equally has above-mentioned beneficial effect.
Detailed description of the invention
It, below will be to embodiment or existing for the clearer technical solution for illustrating the embodiment of the present invention or the prior art
Attached drawing needed in technical description is briefly described, it should be apparent that, the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of pcb board in the prior art；
Fig. 2 is a kind of overlooking structure diagram of pcb board provided by the embodiment of the present invention；
Fig. 3 is a kind of positive structure diagram of pcb board provided by the embodiment of the present invention；
Fig. 4 is a kind of structural schematic diagram of specific pcb board provided by the embodiment of the present invention；
Fig. 5 is the S parameter distribution map of substrate in Fig. 1；
Fig. 6 is the S parameter distribution map of substrate in Fig. 4；
Fig. 7 is the structural schematic diagram of the specific pcb board of another kind provided by the embodiment of the present invention.
In figure: 1. substrates, 11. first glass fiber, 12. second glass fiber, 13. gaps, 2. transmitting chips, 3. receive core
Piece, 4. signal wires, 5. inductance chips, 6.ESD chip.
Specific embodiment
Core of the invention is to provide a kind of pcb board.Referring to Fig. 1, in the prior art, can't be concerned about by glass cloth structure
At substrate 1 in, glass fiber and the positional relationship that the 1 surface signal line 4 of substrate is set, so as to cause in the prior art,
In signal wire 4 a part be only in contact with a certain glass fiber for being compiled into glass cloth, and another part signal wire can with it is big
The D for the substrate 1 that amount filling to the resin at glass cloth gap 13 is in contact, and signal wire 4 is caused to contactkAnd DfUnevenly, thus
Lead to the bad control of high-speed link in the prior art, the S parameter of pcb board is lower, accordingly in the high speed letter of pcb board surface transmission
Number it is second-rate.
And a kind of pcb board provided by the present invention, wherein substrate includes being worked out by the first glass fiber and the second glass fiber
Made of glass cloth, glass cloth gap location be filled with resin.And it is located at the signal that substrate surface is used for transmission high speed signal
Any linear subsignal line is contacted with above-mentioned first glass fiber, the second glass fiber and gap in line, so as to avoid
In above-mentioned signal wire a part be only in contact with the first glass fiber or the second glass fiber, and another part signal wire can with it is a large amount of
The D for the substrate filled to the resin of glass cloth gap location and be in contact, and signal wire is caused to contactkAnd DfNon-uniform problem, so that
The physical parameter of the substrate contacted with signal wire is more stable, and then improves the S parameter of pcb board, improves signal in high-speed link
Quality.
In order to enable those skilled in the art to better understand the solution of the present invention, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.Obviously, described embodiments are only a part of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
Fig. 2 and Fig. 3 is please referred to, Fig. 2 is a kind of overlooking structure diagram of pcb board provided by the embodiment of the present invention；
Fig. 3 is a kind of positive structure diagram of pcb board provided by the embodiment of the present invention.
Referring to fig. 2 and Fig. 3, in embodiments of the present invention, the pcb board includes substrate 1；Wherein, the substrate 1 includes
The glass cloth being compiled by the first glass fiber 11 and the second glass fiber 12, and fill to the tree of the glass cloth intermediate gap 13
Rouge；Transmitting chip 2 positioned at 1 surface of substrate；Wherein, the transmitting chip 2 is for sending high speed signal；Positioned at the base
The reception chip 3 on 1 surface of plate；Wherein, the reception chip 3 is for receiving the high speed signal；Positioned at the signal of the substrate 1
Line 4；Wherein, the transmitting chip 2 is electrically connected with the reception chip 3 by the signal wire 4；The signal wire 4 is for passing
The defeated high speed signal；First glass fiber 11, second glass fiber 12 and the gap 13 are and in the signal wire 4
Any linear subsignal line is in contact.
Aforesaid substrate 1 is the substrate of pcb board, due to needing that high-speed chain is arranged on 1 surface of substrate in embodiments of the present invention
Road, corresponding aforesaid substrate 1 are usually made of the glass cloth that the first glass fiber 11 and the second glass fiber 12 are compiled into, while by
In the usually webbed establishment structure of glass cloth, in compilation process, in adjacent first glass fiber 11 and the second glass fiber 12
Between would generally there are gaps 13, and at the gap 13 usually solidification have resin.
It should be noted that glass cloth is mainly worked out by glass fiber, and glass fiber is also commonly known as glass fibers
Yarn is tieed up, which is ageing-resistant, the corrosion-resistant, high temperature resistant of one kind and has fire-retardant material.Since glass cloth needs to divide
Glass fiber not along two direction intersected settings, which intersects, works out, the corresponding above-mentioned direction intersected respectively along two
The glass fiber of setting is referred to as the first glass fiber 11 and the second glass fiber 12 in embodiments of the present invention.Also need to illustrate
Be usually require to use a plurality of first glass fiber 11 and a plurality of second glass fiber 12 is worked out in one piece of glass cloth, and
Above-mentioned first glass fiber 11 usually requires to be mutually perpendicular to the second glass fiber 12, to save the glass required when working out glass cloth
The amount of silk.
The glass cloth of different size can be selected as the substrate 1 for high-speed link to be arranged in embodiments of the present invention,
Such as the usually heavy 203.4g/m of the cloth base unit area of glass cloth 76282, warp and weft code name is 968 1X0 (warp), 968 1X0
(weft)；The usually heavy 46.8g/m of 1080 cloth base unit area of glass cloth2, warp and weft code name is 511 1X0 (warp), 511 1X0
(weft)；The usually heavy 102g/m of 2166 cloth base unit area of glass cloth2, warp and weft code name is 722 1X0 (warp), 722 1X0
(weft).Certainly, the glass cloth of other specifications can also be selected as substrate 1 in the present invention, in relation to glass in the embodiment of the present invention
The concrete specification of glass cloth can refer to the prior art, no longer be repeated herein.
The concrete component for the resin filled at above-mentioned glass cloth gap 13 does not do specific limit in embodiments of the present invention
It is fixed, it is depending on the circumstances.But under normal conditions above-mentioned first glass fiber 11 and the second glass fiber 12 be filled in gap
The physical parameter of resin at 13, such as DkAnd DfThere can be apparent difference.
Above-mentioned transmitting chip 2 and reception chip 3 are arranged at the surface of substrate 1, and above-mentioned signal wire 4 is responsible for emit
Chip 2 and reception chip 3 are electrically connected.Above-mentioned transmitting chip 2 can send out high speed signal, and the high speed signal can pass through signal
Line 4, which is transmitted to, receives chip 3, receives the high speed signal to receive chip 3.So-called high speed signal transmits the letter of the signal
Number 4 length of line is greater than 1/6th of the signal effective wavelength, i.e. 4 length of signal wire is greater than the 1/6 of signal effective wavelength for height
Fast signal, on the contrary it is low speed signal that 4 length of signal wire, which is less than the 1/6 of signal effective wavelength,.It related above-mentioned transmitting chip 2 and connects
The specific structure for receiving chip 3 can refer to the prior art, no longer be repeated herein.It should be noted that user can pass through
Above-mentioned reception chip 3 detects the 3 received high speed signal of institute of reception chip.
One end of above-mentioned signal wire 4 is electrically connected with transmitting chip 2, and the other end of signal wire 4 is electrically connected with chip 3 is received
It connects, so that the high speed signal issued by transmitting chip 2 can be propagated to along signal wire 4 receives chip 3.I.e. above-mentioned transmitting
Chip 2, signal wire 4 and reception chip 3 may be constructed a high-speed link.It should be noted that can be set in substrate 1
Multiple transmitting chips 2 and multiple reception chips 3 can be set on 1 surface of substrate in multiple high-speed links, while at one group pair
Between the transmitting chip 2 answered and reception chip 3, a plurality of signal wire 4 can also be set.Specific structure in relation to above-mentioned high-speed link
Can according to the actual situation depending on, be not specifically limited herein.
It should be noted that above-mentioned signal wire 4 can not only be only arranged at the surface of substrate 1, can also be existed by setting
Via hole in substrate 1 extends to the inside of substrate 1, but the both ends of signal wire 4 need respectively with transmitting chip 2 and receive core
Piece 3 is electrically connected, while above-mentioned signal wire 4 can be distributed in different planes by via hole, but the plane of signal wire 4 is distributed with
It is generally parallel to each other, and is parallel to each other with above-mentioned first glass fiber 11 and 12 place plane of the second glass fiber.It is related above-mentioned
The specific material of signal wire 4 can refer to the prior art, no longer be repeated herein.
In embodiments of the present invention, first glass fiber 11, second glass fiber 12 and the gap 13 be and institute
Any linear subsignal line in signal wire 4 is stated to be in contact.
Above-mentioned signal wire 4 generally includes multistage subsignal line, and adjacent subsignal line head and the tail contact is to constitute one whole letter
Number line 4；Wherein every cross-talk signal wire is linear, and the direction of adjacent subsignal line can be the same or different, i.e., above-mentioned
Usually linear or broken line the structure of signal wire 4, and the both ends of signal wire 4 have been electrically connected above-mentioned transmitting chip 2 and have connect
Receive chip 3.
And in embodiments of the present invention, above-mentioned subsignal line with the first glass fiber 11, the second glass fiber 12 and gap
13 are in contact.It should be noted that be not above-mentioned each the first glass fiber 11 or the second glass fiber 12 and each
Gap 13 is in contact with above-mentioned subsignal line, but above-mentioned each cross-talk signal wire with preset first glass fiber 11, second
Glass fiber 12 and gap 13 are in contact, thus the physical parameter in the region that guarantees to be in contact between every cross-talk signal wire and substrate 1,
Such as DkWith DfIt is uniform, stablize, to improve the quality of the high speed signal transmitted in signal wire 4.
Specifically, since pcb board is usually in rectangle, and every cross-talk signal wire leads in the provisioning process in above-mentioned signal wire 4
Often each parallel to the long side of pcb board or it is parallel to the broadside of pcb board.For the ease of the setting of signal wire 4, simplify pcb board
Design difficulty, in embodiments of the present invention, usually by constitute substrate 1 glass cloth rotate certain angle in the horizontal direction
Degree, so that above-mentioned first glass fiber 11 intersects with the long side of above-mentioned pcb board and broadside, and above-mentioned second glass fiber 12
Equally intersect with the long side of above-mentioned pcb board and broadside, to realize under the premise of not changing the distribution of above-mentioned signal wire 4, makes
The subsignal line that signal wire 4 must be constituted is in contact with preset first glass fiber 11, the second glass fiber 12 and gap 13.
A kind of pcb board provided by the embodiment of the present invention, wherein substrate 1 includes by the first glass fiber 11 and the second glass
The glass cloth that silk 12 is worked out goes out to be filled with resin in the gap of glass cloth 13.And it is located at 1 surface of substrate and is used for transmission high speed
Any linear subsignal line and above-mentioned first glass fiber 11, the second glass fiber 12 and gap 13 in the signal wire 4 of signal
It contacts, is only in contact with the first glass fiber 11 or the second glass fiber 12 so as to avoid a part in above-mentioned signal wire 4, and
The base that another part signal wire 4 can be in contact to the resin at glass cloth gap 13 with a large amount of fillings, and signal wire 4 is caused to contact
The D of plate 1kAnd DfNon-uniform problem so that the physical parameter of the substrate 1 contacted with signal wire 4 is more stable, and then improves PCB
The S parameter of plate improves the quality of signal in high-speed link.
Specific structure in relation to substrate 1 in above-mentioned pcb board will be described in detail in following inventive embodiments.
Referring to FIG. 4, Fig. 5 and Fig. 6, Fig. 4 show for a kind of structure of specific pcb board provided by the embodiment of the present invention
It is intended to；Fig. 5 is the S parameter distribution map of substrate in Fig. 1；Fig. 6 is the S parameter distribution map of substrate in Fig. 4.
It is different from foregoing invention embodiment, the embodiment of the present invention is on the basis of foregoing invention embodiment, further
The structure of substrate 1 in pcb board is specifically limited.Remaining content is described in detail in foregoing invention embodiment,
It is no longer repeated herein.
Referring to fig. 4, in embodiments of the present invention, the signal wire 4 is arranged along first direction, first glass fiber 11 with
The value range of angle between the signal wire 4 is 10 ° to 20 °, including endpoint value, i.e. signal wire in embodiments of the present invention
4 be in straight line, and the degree of the angle between the signal wire 4 and the first glass fiber 11 is between 10 ° to 20 °.
Under normal conditions, in embodiments of the present invention, the pcb board is in rectangle, and above-mentioned first glass fiber 11 and pcb board
Long side be parallel to each other, while in embodiments of the present invention, the first glass fiber 11 is mutually perpendicular to the second glass fiber 12.Above-mentioned letter
The value range of every cross-talk signal wire angle between the long side of pcb board in the provisioning process is 10 ° to 20 ° in number line 4,
Including endpoint value；The value range of the angle between the second glass fiber 12 and signal wire 4 is 70 ° to 80 ° at this time, including endpoint
Value.
Due to the limitation of pcb board space surface in the actual process, while in order to avoid the waste of substrate 1, usually can not
The setting in 1 surface setting signal line 4 of substrate signal wire 4 being too greatly inclined.It under normal conditions, only can be by signal wire
4 in the horizontal direction rotate 10 ° to 20 ° so that constitute signal wire 4 subsignal line with preset first glass fiber 11, second
Glass fiber 12 and gap 13 are in contact.It should be noted that after signal wire 4 is rotated 10 ° to 20 ° in the horizontal direction,
Layout again can be carried out to pcb board in Design PCB plate, to reduce the waste to pcb board space surface as far as possible.
The S parameter distribution map of the glass cloth of two kinds of different angles is provided below, wherein Fig. 5 is S in the prior art ginseng
Number distribution map, is parallel to each other with signal wire 4 due to the first glass fiber 11 in Fig. 5, is also referred to as in embodiments of the present invention at this time
Zero degree cabling；And Fig. 6 is the S parameter distribution map of Fig. 4, the long side of the first glass fiber 11 and pcb board and signal wire 4 in Fig. 6
Between angle be 10 °, at this time in embodiments of the present invention be also referred to as ten degree of cablings.
It is available by comparing referring to Fig. 5 and Fig. 6, in the case where zero degree cabling and ten degree of cablings, difference can be generated
S parameter, so as to compare the S parameter amplitude in the case where signal wire 4 is in different angles.As a complete unit, ten under each frequency point
The amplitude of degree cabling S parameter is above parameter value under zero degree cabling, and zero degree cabling S parameter amplitude is about under 10G frequency point
0.027db, and S parameter amplitude is about 0.023db under ten degree of cablings.Simultaneously because the limitation of pcb board size, ten degree of cablings are not
The cabling space in excessive pcb board can be occupied.
A kind of pcb board provided by the embodiment of the present invention, wherein signal wire 4 is in a straight line, and signal wire 4 and the first glass
Angle value between silk 11 is between 10 ° to 20 °.The angle that signal wire 4 rotates in the horizontal direction is limited to 10 ° to 20 °
Between can be while effectively improving S parameter, as few as possible space for occupying cabling in pcb board.
Specific structure in relation to pcb board provided by the present invention will be described in detail in following inventive embodiments.
Referring to FIG. 7, Fig. 7 is the structural schematic diagram of the specific pcb board of another kind provided by the embodiment of the present invention.
It is different from foregoing invention embodiment, the embodiment of the present invention is on the basis of foregoing invention embodiment, further
The structure of pcb board is specifically limited.Remaining content is described in detail in foregoing invention embodiment, herein no longer
It is repeated.
Referring to Fig. 7, in embodiments of the present invention, the pcb board can also include the inductance core positioned at 1 surface of substrate
Piece 5；Wherein, the high speed signal passes through the inductance chip 5.The pcb board can also include being located at 1 surface of substrate
ESD chip 6；Wherein, the high speed signal passes through the ESD chip 6.
Above-mentioned inductance chip 5 is choke chip, and above-mentioned high speed signal can pass through the inductance chip 5, which can
To reduce the electromagnetic radiation in high-speed link；And above-mentioned ESD chip 6 is a kind of electrostatic protection chip, above-mentioned high speed signal
The ESD chip 6 can equally be passed through, which can eliminate the electrostatic interaction in high-speed link.
Specifically, in embodiments of the present invention, the signal wire 4 is generally divided into the first subsignal line, the second subsignal line
And third subsignal line, wherein one end of the first subsignal line is electrically connected with transmitting chip 2,5 electricity of the other end and inductance chip
Connection；One end of second subsignal line is electrically connected with inductance chip 5, and the other end is electrically connected with ESD chip 6；Third subsignal line
One end be electrically connected with ESD chip 6, the other end with receive chip 3 be electrically connected.Inductance chip 5 and ESD chip 6 are added
Into signal wire 4, to reduce the electromagnetic radiation in high-speed link and eliminate electrostatic interaction.
A kind of pcb board provided by the embodiment of the present invention can reduce the electricity in high-speed link by the way that inductance chip 5 is arranged
Magnetic radiation effect；The electrostatic interaction in high-speed link can be eliminated by the way that ESD chip 6 is arranged.
The present invention also provides a kind of electronic equipment, including the pcb board as provided by any of the above-described inventive embodiments.Due to
The quality of the high speed signal transmitted in the pcb board is higher, so that the height transmitted in electronic equipment provided by the embodiment of the present invention
The quality of fast signal is higher.Particular content and specific structure in relation to remaining part in electronic equipment are referred to existing skill
Art is no longer repeated herein.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, same or similar part may refer to each other between each embodiment.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that
A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
A kind of pcb board provided by the present invention and a kind of electronic equipment are described in detail above.It is used herein
A specific example illustrates the principle and implementation of the invention, and the above embodiments are only used to help understand
Method and its core concept of the invention.It should be pointed out that for those skilled in the art, not departing from this
, can be with several improvements and modifications are made to the present invention under the premise of inventive principle, these improvement and modification also fall into the present invention
In scope of protection of the claims.
Claims (6)
1. a kind of pcb board characterized by comprising
Substrate；Wherein, the substrate includes the glass cloth being compiled by the first glass fiber and the second glass fiber, and is filled to institute
State the resin of glass cloth intermediate gap；
Positioned at the transmitting chip of the substrate surface；Wherein, the transmitting chip is for sending high speed signal；
Positioned at the reception chip of the substrate surface；Wherein, the reception chip is for receiving the high speed signal；
Positioned at the signal wire of the substrate；Wherein, the transmitting chip is electrically connected with the reception chip by the signal wire；
The signal wire is used for transmission the high speed signal；First glass fiber, second glass fiber and the gap are and institute
Any linear subsignal line in signal wire is stated to be in contact.
2. pcb board according to claim 1, which is characterized in that first glass fiber and second glass fiber are mutual
Vertically.
3. pcb board according to claim 2, which is characterized in that the signal wire is arranged along first direction, first glass
The value range of angle between glass silk and the signal wire is 10 ° to 20 °, including endpoint value.
4. pcb board according to claim 1, which is characterized in that the pcb board further include:
Positioned at the inductance chip of the substrate surface；Wherein, the high speed signal passes through the inductance chip.
5. pcb board according to claim 1, which is characterized in that the pcb board further include:
Positioned at the ESD chip of the substrate surface；Wherein, the high speed signal passes through the ESD chip.
6. a kind of electronic equipment, which is characterized in that including the pcb board as described in any one of claim 1 to 5 claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811135613.0A CN109195314A (en) | 2018-09-27 | 2018-09-27 | A kind of pcb board and a kind of electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811135613.0A CN109195314A (en) | 2018-09-27 | 2018-09-27 | A kind of pcb board and a kind of electronic equipment |
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| CN109195314A true CN109195314A (en) | 2019-01-11 |
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