CN109107627A - Semiconductors At Low Temperatures test case apparatus - Google Patents
Semiconductors At Low Temperatures test case apparatus Download PDFInfo
- Publication number
- CN109107627A CN109107627A CN201811126001.5A CN201811126001A CN109107627A CN 109107627 A CN109107627 A CN 109107627A CN 201811126001 A CN201811126001 A CN 201811126001A CN 109107627 A CN109107627 A CN 109107627A
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- heater element
- semiconductor refrigerating
- micro
- control unit
- semiconductors
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 238000012360 testing method Methods 0.000 title claims abstract description 20
- 238000001931 thermography Methods 0.000 claims abstract description 22
- 238000005057 refrigeration Methods 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims description 26
- 238000001816 cooling Methods 0.000 claims description 12
- 238000004146 energy storage Methods 0.000 claims description 9
- 206010037660 Pyrexia Diseases 0.000 claims description 8
- 239000003507 refrigerant Substances 0.000 claims description 6
- 241000883990 Flabellum Species 0.000 claims description 4
- 238000003491 array Methods 0.000 claims description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013528 artificial neural network Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000012407 engineering method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 210000004218 nerve net Anatomy 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L7/00—Heating or cooling apparatus; Heat insulating devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L1/00—Enclosures; Chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1894—Cooling means; Cryo cooling
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0212—Control thereof of electric power, current or voltage
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- Health & Medical Sciences (AREA)
- Clinical Laboratory Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Semiconductors At Low Temperatures provided by the invention test case apparatus, including infrared thermal imaging sensor, the input terminal of infrared thermal imaging sensor connection micro-control unit, the output end of micro-control unit is connected with one end of semiconductor refrigerating component, the other end of semiconductor refrigerating component is connected to heater element by being oriented to cold pipe, the cold pipe of guiding is equipped with the first spacing between one end and heater element of heater element, further includes the power supply unit to infrared thermal imaging sensor, micro-control unit and semiconductor refrigerating assembly power supply.It is taken pictures by infrared thermal imaging sensor to heater element, the photo for representing heater element different zones heat condition is transmitted to micro-control unit, the heat condition that micro-control unit is reacted according to photo, control semiconductor refrigerating component carries out refrigeration and generates cold wind, the cold wind of generation is transmitted to heater element by cold pipe is oriented to, cool down in such a way that Cryogenic air is blown over to heater element, to reduce the heat condition of heater element.
Description
Technical field
The invention belongs to semiconductor field, in particular to Semiconductors At Low Temperatures test case apparatus.
Background technique
Traditional low-temperature test chamber is made of the principle based on compressor refrigeration, mainly by refrigerant, compressor, condenser
Equal components are constituted, and have many advantages, such as that principle is simple, technology maturation, suitable for occasions such as household electrical appliances application, large-scale industrial applications, but
It is to be not suitable for since structure is complicated, component is heavy in the occasion having higher requirements to volume, weight etc..
Various high/low temperature cold-traps based on conductor refrigeration principle pass through biography generally using semiconductor devices as cold source
The PID controller of system controls refrigerator.This device is suitable for the refrigeration applications under laboratory environment, has temperature control essence
The advantages that degree is high, no electromagnetic interference, but since power consumption is larger, be unfavorable for working in outdoor environment, while cost is compared to biography
The cold low-temperature test chamber of controlling obviously increases.
Summary of the invention
In order to solve shortcoming and defect existing in the prior art, the present invention provides Semiconductors At Low Temperatures to test case apparatus,
For cooling down by the mode of semiconductor refrigerating to chamber.
In order to reach above-mentioned technical purpose, Semiconductors At Low Temperatures provided by the invention test case apparatus, and described device includes:
For obtaining the infrared thermal imaging sensor of the infrared image of heater element, the output end of infrared thermal imaging sensor
It is connected with the input terminal of micro-control unit, the output end of micro-control unit is connected with one end of semiconductor refrigerating component, semiconductor
The other end of cooling assembly is connected to heater element, the one end and hair of the cold pipe of guiding close to heater element by being oriented to cold pipe
It is equipped with the first spacing between thermal element, is equipped with motor being oriented in cold, flabellum is equipped on machine shaft；
It further include the power supply unit to infrared thermal imaging sensor, micro-control unit and semiconductor refrigerating assembly power supply.
Optionally, the semiconductor refrigerating component includes the refrigeration array being made of preset quantity semiconductor refrigerating element.
Optionally, between micro-control unit and semiconductor refrigerating component, it is additionally provided with system without deaerator unit.
Optionally, the system without deaerator unit includes the switch arrays being made of preset quantity noncontacting switch；
Wherein, each noncontacting switch controls the on-off in circuit locating for each semiconductor refrigerating element.
Optionally, noncontacting switch is p-type metal-oxide-semiconductor.
It optionally, further include semiconductor refrigerating method, which comprises
The infrared image that heater element is obtained based on infrared thermal imaging sensor, carries out infrared image to analyze determining fever
The heating region of element；
Determine refrigerant level for the area of heating region, in conjunction with heater element heating curve to energy-storage units to fever
The supply waveform of element carries out PWM adjusting.
Optionally, the area for heating region determines refrigerant level, in conjunction with heater element heating curve to storage
Energy unit carries out PWM adjusting to the supply waveform of heater element, comprising:
When the area of heating region is greater than preset threshold, show that heating region is excessive, if generation in infrared image at this time
Table is higher than half of the color region more than preset threshold of boundary temperature, then the confession most to cool down fastly at this time is determined from heating curve
Electric duty ratio；
Energy-storage units are enabled to be powered by obtained duty ratio to heater element.
Technical solution provided by the invention has the benefit that
By combining infrared thermal imaging sensor dynamic analysis by the heterogeneity phantom of cooling assembly, and using based on nerve net
The FUZZY ALGORITHMS FOR CONTROL of network is realized with digital signal processing chip and is controlled the contactless direct current of semiconductor chilling plate, dropped significantly
Low system power dissipation improves refrigeration effect, realizes and is existed in the field environment by small-power energy-storage system to power test instrument
The purpose that interior heater element is freezed rapidly.
Detailed description of the invention
It, below will be to attached drawing needed in embodiment description in order to illustrate more clearly of technical solution of the present invention
It is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, general for this field
For logical technical staff, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of Semiconductors At Low Temperatures test case apparatus provided by the invention；
Fig. 2 is the partial schematic diagram of Semiconductors At Low Temperatures test case apparatus provided by the invention.
Specific embodiment
To keep structure and advantage of the invention clearer, structure of the invention is made further below in conjunction with attached drawing
Description.
Embodiment one
Semiconductors At Low Temperatures provided by the invention test case apparatus, as shown in Figure 1, described device includes:
For obtaining the infrared thermal imaging sensor of the infrared image of heater element, the output end of infrared thermal imaging sensor
It is connected with the input terminal of micro-control unit, the output end of micro-control unit is connected with one end of semiconductor refrigerating component, semiconductor
The other end of cooling assembly is connected to heater element, the one end and hair of the cold pipe of guiding close to heater element by being oriented to cold pipe
It is equipped with the first spacing between thermal element, is equipped with motor being oriented in cold, flabellum is equipped on machine shaft；
It further include the power supply unit to infrared thermal imaging sensor, micro-control unit and semiconductor refrigerating assembly power supply.
In an implementation, infrared thermal imaging sensor takes pictures to heater element for each prefixed time interval, will generation
The photo of table heater element different zones heat condition is transmitted to micro-control unit, the fever that micro-control unit is reacted according to photo
Situation, control semiconductor refrigerating component carry out refrigeration and generate cold wind, and the cold wind of generation is transmitted to fever member by cold pipe is oriented to
Part cools down to heater element in such a way that Cryogenic air is blown over, to reduce the heat condition of heater element.
In order to enhance the refrigeration effect to heater element, spy, which will lead, is spaced first between the end of forced air cooled tube and heater element
Spacing, and end is not directly attached to heater element surface.Processing in this way is to enable leading flabellum in forced air cooled tube and rotating and blow
Cold wind out generates the sinuous flow of random direction after contact heating element surface, increases the contact of cold air and heater element surface
Area enhances the heat dissipation effect to heater element.
Optionally, the semiconductor refrigerating component includes the refrigeration array being made of preset quantity semiconductor refrigerating element.
In an implementation, in order to improve the refrigerating efficiency of semiconductor refrigerating component, single semiconductor refrigerating component is replaced
For the refrigeration array of multiple semiconductor refrigerating elements composition.It, can be only open-minded in this way if the heating area of heater element is smaller
Part semiconductor cooling module can also save the energy consumption of power supply unit while meeting cooling demand, in a disguised form extend system
Cool time.
Optionally, between micro-control unit and semiconductor refrigerating component, it is additionally provided with system without deaerator unit.
In an implementation, as shown in Fig. 2, in order to control semiconductor cooling assembly, in micro-control unit and semiconductor
The system without deaerator unit of on-off action has been equipped between cooling assembly.Specific system without deaerator unit includes by preset quantity
The switch arrays that noncontacting switch is constituted；Each noncontacting switch controls the on-off in circuit locating for each semiconductor refrigerating element.
It only draws system without deaerator unit and refrigeration array in Fig. 2, such as microcontroller, leads the components such as forced air cooled tube and be not drawn into.
Here why system without deaerator unit is used, contact is easy to produce when on off operating mode switches in order to prevent
Tip electrion phenomenon extends the service life of semiconductor refrigerating component.
In addition under the premise of semiconductor refrigerating component is using refrigeration array, system without deaerator unit also uses switch arrays
Building form, and each noncontacting switch is made to control the on-off in circuit locating for each semiconductor refrigerating element.
Can be enabled after being arranged in this way micro-control unit by noncontacting switch to the work of each semiconductor refrigerating element into
The accurate control of row, thus partly leading according to the degree of heat of heater element even heating region selection corresponding position or corresponding number
Body cooling module carries out refrigerating operation, and energy consumption is equally reduced while meeting refrigeration demand.
Optionally, noncontacting switch is p-type metal-oxide-semiconductor.
It optionally, further include semiconductor refrigerating method, which comprises
The infrared image that heater element is obtained based on infrared thermal imaging sensor, carries out infrared image to analyze determining fever
The heating region of element；
Determine refrigerant level for the area of heating region, in conjunction with heater element heating curve to energy-storage units to fever
The supply waveform of element carries out PWM adjusting.
In an implementation, the heating region that heater element is determined based on infrared image is preset when the area of heating region is greater than
When threshold value, show that heating region is excessive, if representing the color region for being higher than boundary temperature in infrared image at this time more than default
The half of threshold value then determines the power supply duty ratio most to cool down fastly at this time from heating curve；Enable energy-storage units by obtained duty
Heater element is compared to be powered.
Dynamic detection analysis is carried out to Temperature Distribution by neural network algorithm, and passes through the fuzzy-adaptation PID control of engineering
Method carries out BUCK-BOOST control to DC energy storage system, the array formed using N number of noncontacting switch, to semiconductor refrigerating
Device carries out DC control, and carries out directive property cooling to by refrigeration device by being oriented to cold pipe.Simultaneously according to by refrigeration device
Heterogeneity phantom be fitted dynamic temperature lowering curve, further control noncontacting switch array work under optimum working efficiency state,
System power dissipation is reduced, reduces the quantity of semiconductor refrigerating element, to reduce system cost.
Semiconductors At Low Temperatures provided by the invention test case apparatus, including infrared thermal imaging sensor, infrared thermal imaging sensing
The input terminal of the output end connection micro-control unit of device, the output end of micro-control unit are connected with the one of semiconductor refrigerating component
End, the other end of semiconductor refrigerating component are connected to heater element by being oriented to cold pipe, and the cold pipe of guiding is close to heater element
One end and heater element between be equipped with the first spacing, further include leading to infrared thermal imaging sensor, micro-control unit and partly
The power supply unit of the cold assembly power supply of system.It is taken pictures by infrared thermal imaging sensor to heater element, fever member will be represented
The photo of part different zones heat condition is transmitted to micro-control unit, the heat condition that micro-control unit is reacted according to photo, control
Semiconductor refrigerating component processed carries out refrigeration and generates cold wind, the cold wind of generation is transmitted to heater element by cold pipe is oriented to, with low
The mode that warm air is blown over cools down to heater element, to reduce the heat condition of heater element.
Each serial number in above-described embodiment is for illustration only, the assembling for not representing each component or the elder generation in use process
Sequence afterwards.
The above description is only an embodiment of the present invention, is not intended to limit the invention, all in the spirit and principles in the present invention
Within, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
Claims (7)
1. Semiconductors At Low Temperatures test case apparatus, which is characterized in that described device includes:
For obtaining the infrared thermal imaging sensor of the infrared image of heater element, the output end connection of infrared thermal imaging sensor
There is the input terminal of micro-control unit, the output end of micro-control unit is connected with one end of semiconductor refrigerating component, semiconductor refrigerating
The other end of component is connected to heater element, the one end and fever member of the cold pipe of guiding close to heater element by being oriented to cold pipe
It is equipped with the first spacing between part, is equipped with motor being oriented in cold, flabellum is equipped on machine shaft；
It further include the power supply unit to infrared thermal imaging sensor, micro-control unit and semiconductor refrigerating assembly power supply.
2. Semiconductors At Low Temperatures according to claim 1 test case apparatus, which is characterized in that the semiconductor refrigerating component packet
Include the refrigeration array being made of preset quantity semiconductor refrigerating element.
3. Semiconductors At Low Temperatures according to claim 2 test case apparatus, which is characterized in that in micro-control unit and semiconductor
Between cooling assembly, it is additionally provided with system without deaerator unit.
4. Semiconductors At Low Temperatures according to claim 3 test case apparatus, which is characterized in that the system without deaerator unit packet
Include the switch arrays being made of preset quantity noncontacting switch；
Wherein, each noncontacting switch controls the on-off in circuit locating for each semiconductor refrigerating element.
5. Semiconductors At Low Temperatures according to claim 4 test case apparatus, which is characterized in that noncontacting switch is p-type MOS
Pipe.
6. Semiconductors At Low Temperatures according to any one of claims 1 to 5 test case apparatus, which is characterized in that further include partly leading
System cooling method, which comprises
The infrared image that heater element is obtained based on infrared thermal imaging sensor, carries out infrared image to analyze determining heater element
Heating region；
Determine refrigerant level for the area of heating region, in conjunction with heater element heating curve to energy-storage units to heater element
Supply waveform carry out PWM adjusting.
7. Semiconductors At Low Temperatures according to claim 6 test case apparatus, which is characterized in that the face for heating region
Product determines refrigerant level, carries out PWM tune to the supply waveform of heater element to energy-storage units in conjunction with the heating curve of heater element
Section, comprising:
When the area of heating region is greater than preset threshold, show that heating region is excessive, if representing height in infrared image at this time
In the half that the color region of boundary temperature is more than preset threshold, then determine that the power supply most to cool down fastly at this time is accounted for from heating curve
Empty ratio；
Energy-storage units are enabled to be powered by obtained duty ratio to heater element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811126001.5A CN109107627A (en) | 2018-09-26 | 2018-09-26 | Semiconductors At Low Temperatures test case apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811126001.5A CN109107627A (en) | 2018-09-26 | 2018-09-26 | Semiconductors At Low Temperatures test case apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN109107627A true CN109107627A (en) | 2019-01-01 |
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| CN201811126001.5A Pending CN109107627A (en) | 2018-09-26 | 2018-09-26 | Semiconductors At Low Temperatures test case apparatus |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113277761A (en) * | 2021-06-23 | 2021-08-20 | 湖南师范大学 | Cement formula limestone proportion adjusting method based on model prediction framework |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106092904A (en) * | 2016-08-26 | 2016-11-09 | 常州市武进区半导体照明应用技术研究院 | A kind of material photo-thermal conversion efficiency test platform and method of testing thereof |
| CN107289545A (en) * | 2017-07-14 | 2017-10-24 | 珠海格力电器股份有限公司 | Radiator, air-conditioner outdoor unit and air conditioner |
| CN209451874U (en) * | 2018-09-26 | 2019-10-01 | 国网浙江省电力有限公司宁波供电公司 | Semiconductors At Low Temperatures test case apparatus |
-
2018
- 2018-09-26 CN CN201811126001.5A patent/CN109107627A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106092904A (en) * | 2016-08-26 | 2016-11-09 | 常州市武进区半导体照明应用技术研究院 | A kind of material photo-thermal conversion efficiency test platform and method of testing thereof |
| CN107289545A (en) * | 2017-07-14 | 2017-10-24 | 珠海格力电器股份有限公司 | Radiator, air-conditioner outdoor unit and air conditioner |
| CN209451874U (en) * | 2018-09-26 | 2019-10-01 | 国网浙江省电力有限公司宁波供电公司 | Semiconductors At Low Temperatures test case apparatus |
Non-Patent Citations (5)
| Title |
|---|
| 张红军等: ""半导体制冷型黑体的高精度温控器"", 《仪表技术》, pages 41 - 42 * |
| 王怀光;范红波;任国全;马超;: "基于增量式PID控制的半导体制冷温控系统", 现代制造工程, no. 11, pages 110 - 113 * |
| 王莹等: ""新型双向水温自动控制系统"", 《电子科技》, pages 27 * |
| 田莎等: ""固态继电器在固体蓝光激光器温度控制系统中的应用"", 《应用科技》, pages 47 * |
| 胡红光: "《电力红外诊断技术作业与管理》", 中国电力出版社, pages: 10 - 11 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113277761A (en) * | 2021-06-23 | 2021-08-20 | 湖南师范大学 | Cement formula limestone proportion adjusting method based on model prediction framework |
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