CN109074190B

CN109074190B - Display module and glass with undercut plastic frame

Info

Publication number: CN109074190B
Application number: CN201780020811.XA
Authority: CN
Inventors: D·G·福尼尔; J·R·科洛格达尔; D·W·贾维斯; E·S·霍; L·E·胡顿; S·V·蒂鲁普库芝; G·R·奥沃科; M·恩戈; D·A·帕库拉; R·F·迈耶
Original assignee: Apple Inc
Current assignee: Apple Inc
Priority date: 2016-09-22
Filing date: 2017-09-20
Publication date: 2022-05-24
Anticipated expiration: 2037-09-20
Also published as: CN114967975A; JP6775596B2; KR102174119B1; JP2019516123A; KR20200128172A; CN207340290U; JP6906666B2; KR102289734B1; JP2020191124A; KR20180113219A; CN109074190A; WO2018057652A1

Abstract

The invention discloses an electronic device with a display assembly. Several layers may be combined to form a display assembly. For example, a display assembly may include a touch sensitive layer (or touch detection layer), a display layer that presents visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or bend that allows a portion of the display layer to bend around the force-sensitive layer. Additionally, connectors (providing electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include connectors on a first edge region, and the force-sensitive layer may include connectors on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on the vertical edge regions, the display assembly may reduce its footprint.

Description

Display module and glass with undercut plastic frame

Technical Field

The following description relates to electronic devices. In particular, the following relates to an electronic device comprising a display assembly having several active layers. The display assembly is designed to bend or flex around the force-sensitive layer. In addition, to increase the amount of available space in the electronic device, the electrical and mechanical connections of the active layer are positioned in different locations.

Background

The electronic device may include a display assembly. When the display assembly includes multiple layers, the volume occupied by the display assembly increases, which can cause engineering design changes to accommodate the increased volume. Furthermore, each of the layers requires electrical and mechanical connections. Additional design challenges can result when electrical and mechanical connections are stacked on top of or adjacent to each other.

Disclosure of Invention

In one aspect, a display assembly for an electronic device is described. The display assembly may include a touch sensitive layer capable of detecting touch inputs capable of controlling the electronic device. The display assembly may also include a force-sensitive layer capable of detecting the magnitude of a force applied to the touch-sensitive layer. The display assembly may also include a display layer capable of presenting visual information. The display layer may be positioned at least partially between the touch-sensitive layer and the force-sensitive layer. In some embodiments, the display layer is at least partially folded around the force-sensitive layer.

In another aspect, an electronic device is described. The electronic device may include a protective layer formed of a transparent material. The electronic device may also include a display assembly covered by the protective layer. The display assembly may include a force sensitive layer capable of detecting the amount of force applied to the protective layer. The display assembly may also include a display layer positioned between the touch-sensitive layer and the force-sensitive layer. In some embodiments, the display is curved at least partially around the force-sensitive layer defining the bend. The electronic device may also include a frame carrying the protective layer. The frame may include a recess at least partially receiving the display at the bend.

In another aspect, a method for forming a display assembly for an electronic device is described. The method may include positioning a display layer between a touch-sensitive layer and a force-sensitive layer. The touch sensitive layer may be configured to detect a touch input that controls the electronic device. The force-sensitive layer may be configured to detect an amount of force applied to the touch-sensitive layer. The method may further include bending the display layer such that the display layer is at least partially bent around the force-sensitive layer.

Other systems, methods, features and advantages of the embodiments will be, or will become, apparent to one with skill in the art upon examination of the following figures and detailed description. It is intended that all such additional systems, methods, features and advantages be included within this description and this summary, be within the scope of the embodiments, and be protected by the following claims.

Drawings

The present disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements, and in which:

fig. 1 illustrates an isometric front view of an embodiment of an electronic device, according to some described embodiments;

FIG. 2 illustrates an isometric rear view of the electronic device shown in FIG. 1, further illustrating additional features of the electronic device;

FIG. 3 illustrates a partially exploded view of the electronic device shown in FIG. 1, showing various components of the electronic device;

FIG. 4 illustrates a partially exploded view of the electronic device shown in FIG. 1, further illustrating additional components of the electronic device;

FIG. 5 shows a cross-sectional view of the electronic device shown in FIG. 1 taken along line A-A in FIG. 1;

fig. 6 shows a cross-sectional view of an alternative embodiment of an electronic device according to some of the embodiments;

FIG. 7 illustrates a cross-sectional view of the electronic device shown in FIG. 1 taken along line B-B in FIG. 1;

fig. 8 shows a cross-sectional view of an alternative embodiment of an electronic device according to some of the embodiments;

fig. 9 shows a plan view of an embodiment of a frame according to some of the embodiments;

FIG. 10 shows a cross-sectional view taken along line A-A of the frame shown in FIG. 9;

fig. 11 shows a cross-sectional view of an alternative embodiment of a frame according to some of the described embodiments, showing a surface of the frame having protruding features;

FIG. 12 illustrates a cross-sectional view of an embodiment of an electronic device showing the electronic device having a frame and a support member partially embedded in the frame and extending substantially into the frame;

fig. 13 illustrates a cross-sectional view of an embodiment of an electronic device showing the electronic device having a protective cover and a side wall member extended to provide additional support for the protective cover, in accordance with some described embodiments;

figure 14 illustrates a cross-sectional view of an embodiment of an electronic device showing the electronic device having various structural reinforcements, according to some described embodiments;

fig. 15 illustrates a plan view of an embodiment of an electronic device showing a board positioned in a housing of the electronic device, in accordance with some described embodiments;

FIG. 16 illustrates a partial side view of the electronic device shown in FIG. 15 further showing the first extension of the plate secured with the display assembly;

fig. 17 illustrates a cross-sectional view of an embodiment of an electronic device showing the electronic device having a housing and a support structure integrally formed with the housing, in accordance with some described embodiments;

fig. 18 shows a plan view of an embodiment of a protective cover according to some of the embodiments;

FIG. 19 shows a cross-sectional view taken along line B-B of the protective covering shown in FIG. 18, further illustrating a notch formed in the protective covering;

fig. 20 illustrates a cross-sectional view of an embodiment of an electronic device showing a protective cover (as shown in fig. 18 and 19) secured with a housing, in accordance with some described embodiments;

fig. 21 illustrates a cross-sectional view of an embodiment of an electronic device showing a protective cover extending over a frame and positioned adjacent to a side wall member, in accordance with some such embodiments;

fig. 22 shows an exploded view of a battery according to some of the described embodiments;

FIG. 23 shows a plan view of the first electrode shown in FIG. 22;

fig. 24 shows a plan view of an alternative embodiment of an electrode suitable for use in a battery assembly, according to some of the embodiments;

fig. 25 shows a plan view of an alternative embodiment of an electrode suitable for use in a battery assembly, according to some of the described embodiments;

fig. 26 shows a plan view of an alternative embodiment of an electrode suitable for use in a battery assembly, according to some of the embodiments;

fig. 27 illustrates an embodiment of a battery located in an electronic device, wherein the battery has a shape that accommodates internal components of the electronic device, in accordance with some described embodiments;

fig. 28 illustrates an alternative embodiment of a battery assembly located in an electronic device, wherein the battery assembly has a shape that accommodates a plurality of internal components of the electronic device, in accordance with some described embodiments;

fig. 29 shows an alternative embodiment of a battery assembly located in an electronic device, wherein the battery assembly has an opening to accommodate internal components of the electronic device, in accordance with some of the described embodiments;

fig. 30 shows an alternative embodiment of a battery assembly located in an electronic device, where the battery assembly is located in a housing (of the electronic device) over a first internal component of the electronic device, in accordance with some described embodiments;

FIG. 31 shows a cross-sectional view of the electronic device shown in FIG. 30 taken along line C-C in FIG. 30;

fig. 32 illustrates an exploded view of the circuit board assembly shown in fig. 4, in accordance with some described embodiments;

FIG. 33 illustrates a cross-sectional view of the circuit board assembly shown in FIG. 32 showing various internal components of the circuit board assembly;

fig. 34 illustrates an alternative embodiment of a circuit board assembly showing the circuit board assembly modified for access protection;

fig. 35 illustrates an alternative embodiment of a circuit board assembly showing the circuit board assembly having a flexible circuit electrically coupled to a circuit board of the circuit board assembly, in accordance with some described embodiments;

FIG. 36 illustrates a cross-sectional view of the circuit board assembly shown in FIG. 35 showing the flexible circuit extending between the circuit boards;

fig. 37 shows a cross-sectional view of an alternative embodiment of a circuit board assembly showing internal components of the circuit board assembly having corresponding geometries, in accordance with some of the described embodiments;

fig. 38 shows a cross-sectional view of an alternative embodiment of a circuit board assembly showing the circuit board assembly having several solder mask layers for supporting a circuit board, in accordance with some described embodiments;

fig. 39 illustrates an isometric view of an embodiment of an audio module according to some of the described embodiments;

FIG. 40 illustrates a cross-sectional view of the audio module shown in FIG. 39 taken along line D-D in FIG. 39, showing several internal features;

FIG. 41 illustrates a cross-sectional view of the electronic device showing the audio module positioned in the electronic device;

FIG. 42 illustrates an exploded view of a heat distribution assembly according to some described embodiments;

FIG. 43 illustrates a partial cross-sectional view of the electronic device shown in FIG. 1 showing the thermal distribution assembly positioned in the electronic device;

FIG. 44 illustrates a side view of an alternative embodiment of a heat distribution assembly according to some described embodiments;

FIG. 45 illustrates an isometric view of an alternative embodiment of a heat dispensing assembly, showing the heat dispensing assembly modified to receive a component, in accordance with some of the described embodiments;

figure 46 shows an isometric view of an alternative embodiment of a thermal distribution assembly according to some of the embodiments;

FIG. 47 illustrates a flow diagram showing a method for forming a display assembly of an electronic device, in accordance with some described embodiments;

FIG. 48 illustrates a flow chart showing a method for forming a battery assembly for an electronic device, in accordance with some described embodiments;

figure 49 illustrates a flow diagram showing a method for forming a circuit board assembly, according to some described embodiments;

fig. 50 illustrates a flow chart showing a method for assembling an electronic device including a housing defining an internal cavity, in accordance with some described embodiments; and is

Fig. 51 illustrates a flow diagram showing a method for making a heat distribution assembly for removing heat from a heat generating component in an electronic device having a housing sidewall, in accordance with some described embodiments.

Those skilled in the art will know and appreciate that, according to common practice, the various features of the drawings discussed below are not necessarily drawn to scale and that the dimensions of the various features and elements of the drawings may be exaggerated or minimized to more clearly illustrate the embodiments of the present invention described herein.

Detailed Description

Reference will now be made in detail to the exemplary embodiments illustrated in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to one preferred embodiment. On the contrary, it is intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the embodiments as defined by the appended claims.

In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific embodiments in accordance with the embodiments. Although these embodiments are described in sufficient detail to enable those skilled in the art to practice the embodiments, it is to be understood that these examples are not limiting, such that other embodiments may be utilized and that changes may be made without departing from the spirit and scope of the embodiments.

The following disclosure relates to an electronic device. The electronic device may include several enhancements over conventional devices. For example, the electronic device may include a housing defining an internal cavity of the electronic device. The electronic device may also include a display that extends into the housing in at least some locations, thereby increasing the size of the display. The display may be part of a display assembly that also includes a touch-sensitive layer and a force-sensitive layer. To accommodate the increased display size, the electronic device may include a bezel (or frame) that surrounds the display, where the frame has a reduced size. However, the reduced size of the bezel may expose electrical and mechanical connections between the display assembly components and the flexible circuit (in the electronic device) without specific modification. In this regard, some components of the display assembly may be electrically and mechanically coupled to their respective circuits (including the flexible circuit) at different locations throughout the electronic device in order to hide the electrical and mechanical connections. For example, the touch-sensitive layer and the display may be electrically and mechanically coupled to their respective circuits at one location within the electronic device, while the force-sensitive layer is electrically and mechanically coupled to the circuits at a different location that is remote from the electrical and mechanical connections between the touch-sensitive layer, the display, and their respective flexible circuits. In addition, by routing the electrical and mechanical connections at different locations, the volume occupied by the display assembly (and its components) may be reduced, and additional space in the internal cavity of the electronic device may be made available to another or more different components in the electronic device.

The electronic device may also include a circuit board assembly designed to occupy less space in the electronic device. For example, the circuit board assembly may be divided into stacking a first circuit board over a second circuit board. The stacked configuration of multiple circuit boards (stacked one above the other) may reduce the footprint of the circuit board assembly in two dimensions. Additionally, the aforementioned circuit boards may include operative components (e.g., integrated circuits or processor circuits) positioned on multiple opposing surfaces. Additionally, the circuit board assembly may include an interposer or interconnect designed to transmit signals between the first circuit board and the second circuit board such that the first circuit board and the second circuit board (and their respective operational components) communicate with each other.

In some cases, the stacked circuit board assemblies may include an operative component (located on one of the circuit boards) including a recess and an additional operative component (located on the other circuit board) including a protrusion (or protruding feature) partially positioned in the recess. In this way, the circuit boards may be positioned closer together based on the recess receiving a portion of the additional operating component, thereby further reducing the footprint of the stacked circuit board assembly. Additionally, in some cases, the operational components may be electrically coupled to one another. For example, the recess may include a connector and the protrusion may include a connector electrically coupled to the connector of the recess. The circuit boards may also be in electrical communication with each other due to the electrical connection between the operational components. This may reduce the need for a separate and dedicated electrical connector for electrically coupling circuit boards.

The electronic device may also include a battery assembly or an internal power source. Due in part to modifications to the display assembly and the circuit board assembly to create additional space in the housing, the battery assembly may be increased in size and occupy at least a portion of the additional space, thereby increasing the charge capacity of the battery assembly. In addition, the battery assembly may include shapes other than the conventional linear shape. For example, the battery assembly may include an L-shaped configuration formed by die cutting a number of electrodes in the L-shaped configuration to form the battery assembly, the L-shaped configuration of the number of electrodes being similar to the L-shaped configuration of the battery assembly. In addition, additional components such as antennas and circuitry may be relocated within the electronic device in order to increase the size of the battery assembly. Further, the battery assembly may include modifications, such as channels designed to accommodate flexible circuits routed across the battery assembly and specifically across the channels.

Additionally, in some cases, the housing may include a metal band coupled with a transparent protective layer (such as cover glass) that covers the display assembly. The metal strip may comprise a metal, such as aluminum, or a metal alloy comprising aluminum. The housing may further include an additional protective layer coupled to the metal strap. The additional protective layer may comprise a non-metallic material such as glass, sapphire, plastic, and the like. The additional protective layer may substantially define a rear or bottom wall of the electronic device. Thus, the ability of the housing to distribute and dissipate heat from the electronic device may be limited because the amount of metal used for the housing is limited to the metal strip, and glass has a significantly lower thermal conductivity than the metal forming the metal strip.

When one or more components (such as an integrated circuit) in an electronic device generate heat, the heat of the internal cavity may need to be removed to avoid damage to the one or more components in the electronic device. In this regard, the electronic device may include a heat distribution assembly disposed against or proximate to the additional protective layer. The heat distribution assembly is designed to dissipate (or redistribute) thermal energy generated from one or more heat-generating components to the metal strip, thereby allowing thermal energy to be dissipated from the electronic device. The heat distribution assembly may include several metal layers, wherein one metal layer may have a relatively high thermal conductivity (compared to the remaining layers). Accordingly, the electronic device may include a housing having a bottom wall made of glass, which may improve the overall aesthetics of the electronic device, while also enabling heat removal from the electronic device before temperatures within the electronic device rise and cause damage to any internal components of the electronic device. In addition, the relatively low thermal conductivity layer may prevent heat from being transferred to the bottom glass wall, thereby preventing or limiting thermal energy from reaching a user of the electronic device when the user is holding the electronic device.

Additionally, when a user interacts with the display component, the force-sensitive layer can determine a magnitude of a force exerted on the display in order to generate a command in accordance with the determined magnitude of the force. However, a force applied to the display assembly (through a protective layer covering the display assembly) may bend the display assembly and the protective layer, thereby reducing the internal cavity and increasing the internal air pressure. The increased internal air pressure may affect other components, such as audio modules designed to generate acoustic energy. To isolate the audio module from increased air pressure, the audio module may include a housing or casing that encloses the components of the audio module, including the back cavity of the audio module, and provides a shield that isolates air in the interior cavity of the electronic device, and thus isolates the back cavity of the audio module from pressure variations in the electronic device. In this way, the audio module is not affected by pressure variations in the electronic device and generates acoustic energy without being disturbed by pressure variations.

These and other embodiments are discussed below with reference to fig. 1-51. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these figures is for explanatory purposes only and should not be construed as limiting.

Fig. 1 illustrates an isometric front view of an embodiment of an electronic device 100, according to some described embodiments. In some embodiments, the electronic device 100 is a tablet device. In other embodiments, electronic device 100 is a wearable electronic device that includes one or more straps (not shown) designed to wrap around an appendage (e.g., a wrist) of a user to secure electronic device 100 with the user. In the embodiment shown in fig. 1, the electronic device 100 is a mobile communication device such as a smartphone. Thus, by way of non-limiting example, the electronic device 100 may implement wireless communications in the form of cellular network communications, bluetooth communications (2.4GHz), and/or Wireless Local Area Network (WLAN) communications (2.4GHz to 5 GHz). As shown, the electronic device 100 may include a display component 102 that includes a display layer designed to present visual information in the form of textual information, still images, and/or video information. Although not shown in the figures, the display assembly 102 may also include a touch sensitive layer designed to detect touch inputs in the display assembly 102, for example, to control information presented on the display assembly 102. Additionally, the display assembly 102 may also include a force sensitive layer designed to detect the magnitude of a force applied to the display assembly 102. The determined magnitude of the force may correspond to a particular input or command to a processor circuit (not shown) for controlling the display assembly 102. For example, different magnitudes of force detected may correspond to different or unique commands.

To protect the display assembly 102, the electronic device 100 may include a first protective layer 104 covering the display assembly 102. A second protective layer (not shown) of the electronic device 100 will be shown and discussed below. By way of non-limiting example, the first protective layer 104 may comprise one or more transparent materials, including glass, sapphire, or plastic. As shown, the first protective layer 104 may include openings to facilitate user interaction with the electronic device 100. For example, the first protective layer 104 may include a first opening 106 and a second opening 108. The electronic device 100 may include an image capture device (not shown) that captures one or more images through the first opening 106. The electronic device 100 may also include an audio module (not shown) that generates acoustic energy in the form of audible sound that exits the electronic device 100 via the second opening 108.

Additionally, the electronic device 100 may include a band 110 that defines an outer perimeter of the electronic device 100. Generally, the band 110 includes a shape similar to a four-sided ring. However, other shapes are possible. Additionally, the band 110 may define a plurality of sidewalls and an opening to at least partially receive and secure together the first protective layer 104 and the second protective layer (not shown). In some embodiments, the band 110 comprises a metal, such as aluminum or an alloy comprising aluminum. In this regard, the strap 110 may provide a rigid support structure for the electronic device 100. Additionally, when the band 110 is formed of metal, the band 110 may include several sidewalls, some of which are used to support wireless communications. For example, the band 110 may include a first side wall member 112 forming a U-shaped design, and a second side wall member 114 also forming a U-shaped design. The first and second

side wall members

112, 114 may each function in conjunction with radio circuitry (not shown) in the electronic device 100, such that the first and second

side wall members

112, 114 each form at least a portion of an antenna of their respective radio circuitry. For example, the first sidewall component 112 may function in conjunction with WLAN radio circuitry and the second sidewall component 114 may function in conjunction with cellular network radio circuitry.

Additionally, band 110 may further include third and

fourth sidewall members

116, 118, where third and

fourth sidewall members

116, 118 are separated from first and

second sidewall members

112, 114 by a dividing region or opening. For example, band 110 may include a first split area 122 and a second split area 124 that combine to separate third side wall member 116 from first side wall member 112 and second side wall member 114. Additionally, band 110 may include third and fourth cut-out

regions

126, 128 that combine to separate fourth sidewall member 118 from first and

second sidewall members

112, 114. The aforementioned segmented regions may be filled with a non-metallic material, such as molded plastic (or other non-conductive material), to provide flush, coplanar surfaces for the portions of the band 110. With first and second

side wall members

112, 114 electrically isolated from third and fourth

side wall members

116, 118, first and second

side wall members

112, 114 may function as part of an antenna, while third and fourth

side wall members

116, 118 may function as electrical grounds for one or more internal components (not shown) electrically coupled to third and fourth

side wall members

116, 118, respectively. Additionally, each of first, second, third, and

fourth sidewall members

112, 114, 116, and 118 may provide protective structural components for at least some internal components, as well as heat dissipation and heat removal functions for some heat-generating components (not shown) of electronic device 100, provided that the heat-generating components are thermally coupled with at least one of the foregoing components. Additionally, first, second, third, and

fourth sidewall members

112, 114, 116, 118 may each represent at least a portion of a first, second, third, and fourth sidewall, respectively.

Electronic device 100 may also include one or more input devices. For example, the electronic device 100 includes a first button 130 designed to generate an input when pressed. The input may generate an electrical signal that is sent to a processor circuit (not shown) in the electronic device 100 in order to alter the visual information presented on the display assembly 102. As shown, first button 130 is positioned along third side wall member 116. However, other locations are possible. Additionally, although not shown in the figures, electronic device 100 may include switches designed to provide additional user input functionality.

Additionally, electronic device 100 may also include a data port 132 designed to receive and electrically couple with a cable assembly (not shown). Data port 132 may receive data/communications from a cable assembly and power to charge a battery assembly (not shown) located in electronic device 100. Additionally, the electronic device 100 may include additional openings designed for various user interactions. For example, the electronic device 100 may include an audio module (not shown) located near the opening 134 or through-hole formed in the second side wall member 114. The opening 134 allows acoustic energy generated from the audio module to exit the electronic device 100. In addition, the electronic device 100 may further include a microphone (not shown) located near the opening 136 or through-hole formed in the second side wall member 114. The microphone may be positioned to receive acoustic energy through the opening 136.

Fig. 2 illustrates an isometric rear view of the electronic device 100 shown in fig. 1, further illustrating additional features of the electronic device 100. As shown, the electronic device 100 may include a second protective layer 144 secured with the band 110. The second protective layer 144 may be combined with the band 110 to define a housing that includes an internal cavity or cavity that receives several internal components, such as, by way of non-limiting example, a circuit board, an integrated circuit, and a battery assembly. In this regard, the tape 110 may include a first edge region that receives the first protective layer 104 (shown in fig. 1) and a second edge region that receives the second protective layer 144, where the first edge region and the second edge region are located at opposite or opposing locations of the tape 110. In addition, the second protective layer 144 may be referred to as a bottom wall or a rear wall.

In general, the second protective layer 144 may comprise one or more materials that provide an aesthetic finish, such as glass, sapphire, or plastic. Additionally, in some cases, the material composition of the second protective layer 144 may allow radio frequency ("RF") communications generated from internal radio circuitry (not shown) of the electronic device 100 to penetrate the second protective layer 144. In this manner, the electronic device 100 may wirelessly communicate with other devices (not shown) via RF communications that are substantially uninhibited by the second protective layer 144.

Additionally, the second protective layer 144 may include openings that facilitate user interaction with the electronic device 100. For example, the second protective layer 144 may include a first opening 146 and a second opening 148. The electronic device 100 may include an image capture device (not shown) that captures one or more images through the first opening 146. The electronic device 100 may also include a flash module (not shown) aligned with the second opening 148, wherein the flash module generates light energy through the second opening 148 during an image capture event from the image capture device to enhance the image quality of one or more images acquired by the image capture device. Additionally, in addition to the first button 130 (shown in FIG. 1), the electronic device 100 may also include a second button 150 that is designed to generate an input when pressed in a similar manner as the first button 130. As shown, the second button 150 is positioned along the fourth side wall member 118. However, other locations are possible.

FIG. 3 illustrates a partially exploded view of the electronic device 100 shown in FIG. 1, showing various components of the electronic device 100. Several features of the electronic device 100 are not shown for the sake of brevity. As shown, the first protective layer 104 may cover the display assembly 102. In addition, the first protective layer 104 may be adhesively secured to the display assembly 102 by an adhesive layer (not shown).

As shown, the display assembly 102 may include a touch sensitive layer 202 designed to receive touch inputs, a display layer 204 designed to present visual information, and a force sensitive layer 206 designed to detect the magnitude of a force applied to or acting on the display layer 204 by applying a force to at least one of the first protective layer 104, the touch sensitive layer 202, and the display layer 204. Additionally, although not shown in the figures, the display assembly 102 may include an adhesive layer for adhesively securing the touch-sensitive layer 202 and the display layer 204 together and adhesively securing the display layer 204 and the force-sensitive layer 206 together.

The touch sensitive layer 202 is designed to receive touch input when, for example, a user (not shown) presses on the first protective layer 104. The touch sensitive layer 202 may comprise capacitive touch sensitive technology. For example, the touch sensitive layer 202 may include a layer of capacitive material that holds a charge. The layer of capacitive material is designed to form a portion of a plurality of capacitive parallel plates in locations corresponding to the display layer 204. In this regard, when a user touches the first protective layer 104, the user forms one or more capacitors. Further, the user causes a voltage drop across one or more capacitors, which in turn causes the charge of the capacitive material to change at one or more particular contact points corresponding to the location of the user touch input. The capacitance change and/or voltage drop may be measured by electronic device 100 to determine the location of the touch input. In addition, the touch sensitive layer 202 may include an edge region 226 that includes a connector (shown later).

In some embodiments, the display layer 204 includes a liquid crystal display ("LCD") that relies on a backlight to present visual information. In the embodiment shown in fig. 3, the display layer 204 comprises an organic light emitting diode ("OLED") display designed to illuminate individual pixels as desired. When the display layer 204 includes OLED technology, the display layer 204 may have a reduced form factor compared to an LCD display. In this regard, the display assembly 102 may have a smaller footprint, thereby providing more space for other components, such as a battery assembly (shown later). Further, when the display layer 204 includes OLED technology, the display layer 204 may bend or bend without causing damage to the display layer 204. For example, as shown in FIG. 3, the display layer 204 includes a bend 208. The bend 208 may comprise a 180 degree bend or an approximately 180 degree bend. The bend 208 allows the display layer 204 to bend or flex around at least a portion of the force-sensitive layer 206, as shown in FIG. 3. Additionally, the display layer 204 may include an edge region 210 having connectors (not shown) for electrically and mechanically coupling the display layer 204 with a flexible circuit (not shown) that is electrically coupled to a circuit board assembly (not shown), wherein the flexible circuit communicates the display layer 204 with the circuit board assembly. Additionally, in some embodiments, the display layer 204 may include an active matrix organic light emitting diode ("AMOLED") display. Additionally, as shown in FIG. 3, the edge region 226 of the touch sensitive layer 202 is parallel, or at least substantially parallel, with respect to the edge region 210 of the display layer 204, even when the display layer 204 includes the bend 208.

The force-sensitive layer 206 may operate by determining the magnitude of a force or pressure applied to the first protective layer 104, the touch-sensitive layer 202, and/or the display layer 204. In this regard, the force-sensitive layer 206 may distinguish between different magnitudes of force applied to the electronic device 100. Different amounts of force may correspond to different user inputs. The force-sensitive layer 206 can include a plurality of parallel capacitor plate arrangements, where one plate in each capacitor plate arrangement has an electrical charge. When a force is applied to the first protective layer 104, the first protective layer 104 causes the distance between the one or more pairs of parallel plate capacitors to decrease, thereby causing a change in capacitance between the one or more pairs of parallel plate capacitors. The amount of change in the capacitance corresponds to the magnitude of the force acting on the first protective layer 104. Additionally, as shown in the enlarged view, the force-sensitive layer 206 can include a connector 218 located on an edge region 220 of the force-sensitive layer 206, wherein the edge region 220 is perpendicular, or at least substantially perpendicular, relative to the edge region 210 of the display layer 204 and an edge region 226 of the touch-sensitive layer 202. Thus, the connectors 218 may be positioned vertically, or at least substantially vertically, with respect to connectors (shown later) of the display layer 204.

Additionally, to support first protective layer 104 and facilitate assembly of first protective layer 104 with tape 110 (as shown in fig. 1), electronic device 100 may include a frame 154 that receives first protective layer 104 and is secured together with the first protective layer by adhesive layer 166. Thus, the frame 154 may have a size and shape that conforms to the first protective layer 104. The frame 154 may be positioned at least partially between the first protective layer 104 and the band 110. The frame 154 may be formed from a polymer material, such as plastic, and may also include a metal ring (not shown) partially embedded in the polymer material during the insert molding operation. In this regard, the frame 154 may structurally support the first protective layer 104, as well as one or more components of the display assembly 102. This will be shown below.

FIG. 4 illustrates a partially exploded view of the electronic device 100 shown in FIG. 1, further illustrating additional components of the electronic device 100. Several features of the electronic device 100 are not shown for the sake of brevity. As shown, the band 110 and the second protective layer 144 may be combined to provide an interior cavity 152 for several interior components. For example, electronic device 100 may include a battery assembly 160 designed to distribute electrical current to the operating components of electronic device 100. The battery assembly 160 may include a rechargeable battery designed to receive current during recharging. For example, the electronic device 100 may include an inductive receiver coil 162 (formed of a metal such as steel) electrically coupled to the battery assembly 160. When placed in proximity to an alternating magnetic field from a device (not shown) located external to the electronic device, the inductive receiver coil 162 may receive an induced current from the alternating magnetic field. The induced current from the inductive receiver coil 162 passes through a transformer, thereby converting the alternating current to direct current that is then used to charge (or recharge) the battery assembly 160. In addition, the second protective layer 144 provides little or no impedance to external magnetic fields so that the alternating magnetic field reaches the induction receiver coil 162.

Additionally, the battery assembly 160 may also include channels 164 having a reduced dimension (e.g., in the z-dimension of a cartesian coordinate), thereby allowing components such as flexible circuits (not shown) to extend along the battery assembly 160 and pass over the battery assembly 160 along the channels 164. Due in part to the increased space provided by channel 164, other internal components, such as an antenna element (not shown), may be repositioned within internal cavity 152 of electronic device 100, thereby creating additional space for battery assembly 160. In this way, the volume (size) of battery assembly 160 may be increased, and the increased volume allows battery assembly 160 to increase electrical storage capacity such that electronic device 100 provides longer usage time of electronic device 100 between charging events of battery assembly 160.

Electronic device 100 may also include a circuit board assembly 170 having a plurality of operational components. As shown, circuit board assembly 170 may include a first circuit board 172 and a second circuit board 174, where first circuit board 172 is stacked above second circuit board 174. In this way, circuit board assembly 170 may save space in the x-dimension and the y-dimension within interior cavity 152. Additionally, first circuit board 172 and second circuit board 174 may include multiple surfaces, wherein each surface of the multiple surfaces is designed to carry one or more components (e.g., processor circuits). Various features of the circuit board assembly 170 will be discussed below.

The electronic device 100 may also include a first audio module 182 and a second audio module 184 designed to produce acoustic energy in the form of audible sound. Each of the audio modules may include an opening for emitting acoustic energy. However, each audio module is designed to include an acoustic cavity (defined by its respective audio module) that is isolated from the internal cavity 152 of the electronic device 100. As such, when the internal cavity 152 is altered by, for example, pressing and bending the first protective layer 104 (as shown in fig. 3) to provide touch and/or force inputs to the electronic device 100, the audio module is not (acoustically) affected by the alteration of the internal cavity 152 and the associated increased air pressure within the internal cavity 152. As will be discussed further below.

The electronic device 100 may also include a thermal distribution assembly 190. Although not shown in the figures, the heat distribution assembly 190 may include several layers of material. In some embodiments, the layers of material are different. For example, some layers are formed of a first type of material, while other layers are formed of a second type of material different from the first type of material. The first type of material may comprise a material having a relatively high thermal conductivity. For example, the first type of material may include copper known to have a thermal conductivity of about 400W/m × K (watts/meter/kelvin). Alternatively, the first type may comprise graphite known to have a thermal conductivity of about 170W/m K. Thus, the first type of material is well suited to receiving thermal energy and transferring or distributing thermal energy from one location to another location in the electronic device 100, thereby facilitating the removal of thermal energy from the electronic device 100. The second type of material may comprise a more robust material, such as stainless steel. In this regard, the second type of material may have a relatively low thermal conductivity. However, the second type of material may 1) provide a protective cover for the first type of material, 2) provide structural support for the electronic device 100, and/or 3) provide a workable surface for securing components (not shown) with the thermal distribution assembly 190 through, for example, a welding operation. The various layers of the heat distribution assembly 190 will be discussed further below.

The heat distribution assembly 190 is designed to redirect or redistribute heat generated in the electronic device 100. For example, the circuit board assembly 170 may include operating components known for converting electrical energy (provided by the battery assembly 160) to thermal energy during operation, such as integrated circuits. By way of non-limiting example, the thermal distribution assembly 190 may be thermally coupled to the circuit board assembly 170 by contact between the thermal distribution assembly 190 and the circuit board assembly 170. Additionally, heat distribution assembly 190 may be thermally coupled to tape 110 such that thermal energy received by heat distribution assembly 190 from circuit board assembly 170 may be at least partially transferred to tape 110. Thus, at least a portion of the thermal conductivity lost by the use of the second protective layer 144 (non-metallic) is recovered through the use of the heat distribution assembly 190. Additionally, the heat distribution assembly 190 may have a size and shape that conforms to the second protective layer 144 such that the heat distribution assembly 190 covers, or at least substantially covers, the surface of the second protective layer 144. For example, the x-dimension and y-dimension of the thermal distribution assembly 190 may be the same or substantially similar to the x-dimension and y-dimension, respectively, of the second protective layer 144.

Although not shown in the figures, the electronic device 100 may include additional components, such as a haptic engine and an internal antenna, as non-limiting examples. Additionally, although not shown in the figures, electronic device 100 may include several flexible circuits that place electronic components (e.g., display assembly 102, circuit board assembly 170) in electrical communication with each other and with battery assembly 160.

Fig. 5 shows a cross-sectional view of the electronic device 100 shown in fig. 1, taken along line a-a in fig. 1. As shown, the display assembly 102 layers, i.e., the touch sensitive layer 202, the display layer 204, and the force sensitive layer 206 are assembled. Although not shown in the figures, the display assembly 102 may include an adhesive layer for adhesively securing the touch-sensitive layer 202 and the display layer 204 together and the display layer 204 and the force-sensitive layer 206 together.

The touch sensitive layer 202 is designed to receive touch input when, for example, a user (not shown) presses on the first protective layer 104. Touch input may be relayed from the touch sensitive layer 202 to the circuit board assembly 170 (shown in fig. 4) through a first flex circuit 212 that is electrically and mechanically coupled to the touch sensitive layer 202 through connectors 222 of the touch sensitive layer 202. The connector 222 may be positioned on an edge region 226 (shown in fig. 3) of the touch sensitive layer 202. As shown, the first flexible circuit 212 may be bent or flexed around the display layer 204 and the force-sensitive layer 206 to electrically and mechanically couple with the touch-sensitive layer 202.

The frame 154 may include design considerations to accommodate the display assembly 102. For example, the frame 154 may include a recess 156 or undercut area designed to at least partially receive the first flexible circuit 212 and/or the display layer 204. As shown in fig. 5, the notch 156 is sized and shaped to receive the display layer 204 and the bend/flex region of the first flexible circuit 212. Although the notch 156 has a curvature that generally corresponds to the first flexible circuit 212 and the display layer 204, other shapes are possible for the notch 156, including straight edges. Additionally, the notch 156 may be formed during a molding operation of the frame 154. Alternatively, the notch 156 may be formed after the molding operation by, for example, a cutting operation.

In addition, the frame 154 is adhesively secured to the first protective layer 104 and the second sidewall member 114 (the second sidewall member of the band 110, as shown in FIG. 1) by an adhesive layer (not shown). The frame 154 may include a support member 158 partially embedded in the frame 154. In some embodiments, the support member 158 comprises a ring formed of a metallic material that extends continuously around the display assembly 102 in accordance with the frame 154. However, the support member 158 may also be discontinuous and thus may be selectively embedded in the frame 154. As shown, the support members 158 may extend along the frame 154 to support the display assembly 102 and the first protective layer 104. Additionally, the first flexible circuit 212 may be adhesively secured to the support member 158 by an adhesive layer (not labeled).

Fig. 5 also shows some components of the display assembly 102 that are coupled to the flexible circuit at one location, while other components are not. For example, the touch sensitive layer 202 is electrically and mechanically coupled to the first flexible circuit 212 via a connector 222, and the display layer 204 is electrically and mechanically coupled to the second flexible circuit 214 via a connector 224, wherein the connector 222 and the connector 224 are positioned adjacent to the second side wall member 114 (defined by the U-shaped configuration, as shown in fig. 1). The connectors 218 (shown in FIG. 3) of the force-sensitive layer 206 are positioned along different edge regions of the force-sensitive layer 206 (see FIG. 3). Further, the

connectors

222 and 224 are electrically and mechanically coupled to the first and second

flexible circuits

212 and 214, respectively, adjacent the recess 156 in the frame 154, while the force-sensitive layer 206 is not. Further, the connector 222 may be positioned parallel, or at least substantially parallel, with respect to the connector 224. The force-sensitive layer 206 can be electrically and mechanically coupled to a flexible circuit (not shown) at another, separate location (e.g., a connector 218 on an edge region 220, as shown in FIG. 3). As will be shown and described hereinafter.

Fig. 6 illustrates a cross-sectional view of an alternative embodiment of an electronic device 250, according to some described embodiments. Electronic device 250 may include any one or more features or one or more components previously described for the electronic device. For example, the electronic device 250 may include a display component 252 that includes a touch-sensitive layer 262, a display layer 264, and a force-sensitive layer 266. However, as shown in FIG. 6, the display layer 264 may include a substantially flat configuration throughout the display layer 264, with the flexible circuit 274 being bent around the force-sensitive layer 266 to electrically and mechanically couple with the display layer 264.

Fig. 7 illustrates a sectional view of the electronic apparatus 100 shown in fig. 1 taken along line B-B in fig. 1. As shown, the connector 218 (also shown in FIG. 3) of the force-sensitive layer 206 electrically and mechanically couples the force-sensitive layer 206 to a third flexible circuit 216, which third flexible circuit 216 is electrically coupled to the circuit board assembly 170 (shown in FIG. 4) to communicate the force-sensitive layer 206 with the circuit board assembly 170. Additionally, the third flexible circuit 216 may be adhesively secured to the support member 158 by an adhesive layer (not shown).

As shown in fig. 7, only the force-sensitive layer 206 includes electrical and mechanical connections to the flex circuit. In other words, the connector 218 that provides the electrical and mechanical connection between the force-sensitive layer 206 and the third flexible circuit 216 is located at a different location of the electronic device 100 than the connector 222 of the touch-sensitive layer 202 (shown in FIG. 5) and the connector 224 of the display layer 204 (shown in FIG. 5). Additionally, based on the location of the respective edge regions, the connectors 218 of the force-sensitive layer 206 are positioned perpendicular, or at least substantially perpendicular, relative to the connectors 222 of the touch-sensitive layer 202 and the connectors 224 of the display layer 204.

Additionally, connector 218 is adjacent third side wall member 116 (also shown in fig. 1), which third side wall member 116 is defined in part by a side wall that is perpendicular or substantially perpendicular to a portion of second side wall member 114 (shown in fig. 1 and 5). Accordingly, the frame 154 may not require the recess 156 (shown in fig. 5) to accommodate the display layer 204 and the first flexible circuit 212 (shown in fig. 5). Thus, the frame 154 may comprise an asymmetric frame. Further, the additional material of the frame 154 may allow for additional structural rigidity to support the display assembly 102 and the first protective layer 104.

Fig. 8 illustrates a cross-sectional view of an alternative embodiment of an electronic device 300, according to some described embodiments. Electronic device 300 may include any one or more features or one or more components previously described for the electronic device. For example, the electronic device 300 may include a first protective layer 304 secured with the display assembly 302, and a frame 354 carrying the first protective layer 304. However, the first protective layer 304 may include an extension 306 that extends at least partially radially outward from the first protective layer 304 in a circumferential manner. To accommodate extension 306, frame 354 may include notch 366 for receiving extension 306. The extensions 306 provide additional structural contour to the first protective layer 304 and may also provide additional surface area to adhesively bond the first protective layer 304 to the frame 354. For example, as shown in fig. 8, the first protective layer 304 is adhesively secured to the frame 354 by an adhesive layer 362 that extends across an area defined in part by the interface between the frame 354 and the first protective layer 304 (including the extension 306). In addition, the distance or gap between the frame 354 and the first protective layer 304 (including the extension 306) may allow the adhesive layer 362 to extend through the interface region by capillary force. Thus, the frame 354 is adhesively secured with the first protective layer 304 by multiple (vertical) surfaces to form a strong bond that resists or counteracts forces applied to the electronic device 300 in multiple directions.

Fig. 9 illustrates a plan view of an embodiment of a frame 454 according to some such embodiments. As shown, the frame 454 may include a support member 458, which may comprise a metal ring molded into the frame 454. The frame 454 may be implemented into one or more of the electronic devices described herein and may include any of the features previously described for the frame. To improve adhesion between an adhesive (not shown) and surface 462 of frame 454, surface 462 may include certain modifications. For example, as shown in the enlarged view, surface 462 may include a textured area 464 designed to increase the surface tension or surface energy of surface 462. The textured area 464 can enhance bonding between the frame 454 and a transparent cover (e.g., the first protective layer 104 shown in fig. 5) by an adhesive (e.g., the adhesive layer 166 shown in fig. 5).

Fig. 10 shows a cross-sectional view taken along line a-a of the frame 454 shown in fig. 9. As shown, textured area 464 may include a plurality of dimples or indentations formed into frame 454 along surface 462. Textured region 464 provides additional surface area to the aforementioned adhesive. Textured area 464 can be formed using several different processes. For example, a molding tool (not shown) used to mold the frame 454 may include a protruding feature having a shape corresponding to the shape of the textured region 464. Alternatively, the frame 454 can be formed with a molding tool that does not include protruding features, and after the molding operation that forms the frame 454, the surface 462 can be etched, e.g., by a laser, to form the textured area 464. Additionally, while the textured area 464 defines a number of dimples or indentations formed into the frame 454, a number of shapes other than dimples or indentations are also possible. For example, the textured area 464 may include a number of linear and/or non-linear indentations.

Fig. 11 illustrates a cross-sectional view of an alternative embodiment of the frame 554, showing the surface 562 of the frame 554 having protruding features 564, according to some described embodiments. The frame 554 may include any of the features previously described for the frame. In this regard, the surface 562 may be used to receive a transparent cover (e.g., the first protective layer 104 shown in fig. 5) via an adhesive (e.g., the adhesive layer 166 shown in fig. 5). As shown, the protruding features 564 may extend from the surface 562. The frame 554, and in particular the protruding features 564, may be formed by a molding tool (not shown) that includes inserts designed to extract a portion of the molding material (used to form the frame 554) such that the protruding features 564 extend from the surface 562. The protruding features 564 provide additional surface area for the adhesive described previously.

Fig. 12 illustrates a cross-sectional view of an embodiment of the electronic device 700, showing the electronic device 700 having a frame 754 and a support element 758 partially embedded in the frame 754 and extending substantially into the frame 754. Electronic device 700 may include any of the features described herein for the electronic device. Additionally, similar to the previous embodiments, the support element 758 may include a ring formed from a metallic material that surrounds the display assembly 702 of the electronic device 700 and extends according to the frame 754. As shown, the support element 758 may extend beyond the display assembly 702 in the z-dimension, and also beyond the protective cover 704 (similar to the first protective layer 104 shown in fig. 1).

To further extend the support element 758 in the z-dimension, the frame 754 may be widened in the y-dimension. Additionally, the size of the sidewall member 714 (similar to the second sidewall member 114 shown in fig. 1) of the electronic device 700 may be reduced in the y-dimension to offset the increased size of the frame 754. Additionally, one or more of the materials used to form the frame 754 may be altered to accommodate the support element 758. For example, the frame 754 may include a nylon material mixed with a glass filler material that enhances the overall strength and rigidity of the frame 754. However, in some embodiments, the frame 754 is formed from ceramic. In this regard, sidewall component 714, as well as any remaining sidewall components, may also be formed of ceramic.

Other factors should be considered when the supporting element 758 extends in the manner described. For example, in some cases, side wall members 714 form part of an antenna assembly (not shown) that includes antenna components designed to provide wireless communication for electronic device 700. When formed of metal, the support element 758 may cause some interference with the antenna components. This may include forming a parallel plate capacitor between the antenna assembly (including side wall members 714) and support element 758. Accordingly, the size, shape, material, and location of the supporting element 758 should be considered to prevent undesirable interference. It should be noted that additional techniques may be used to optimize the size of the support elements 758 and proximity to the side wall members 714. This may include, for example, reducing the z-dimension of the supporting element 758, and/or providing openings or discontinuities in the supporting element 758.

The electronic device 700 may include a surface 762 that receives and adhesively combines with the protective cover 704. Surface 762 may include a dimension 766 to provide a substantially flat surface. However, in some embodiments, the surface 762 is modified to enhance bonding with the protective cover 704. In addition, the frame 754 can include a notch 756 or undercut formed into the frame 754 that allows the frame 754 to receive the display assembly 702, which includes the flexible circuits and flexible layers of the display assembly 702. The size of the notch 756 can be adjusted (e.g., increased) based on the increased size of the frame 754. However, by increasing the size of the notches 756 (in the y-dimension), additional material of the frame 754 may be removed at a location below the surface 762. It should be noted that additional techniques may be used to optimize the size of the notches 756 using the size 766 of the surface 762.

Additionally, to secure the frame 754 and the side wall members 714 together, the electronic device 700 may include an adhesive 768 that bonds the frame 754 to the side wall members 714. As shown, the amount of adhesive 768 used generally allows the side wall members 714, frame 754, and protective cover 704 to form a generally continuous and flat configuration, as shown by the edges of the foregoing parts aligned with one another. However, to provide additional protection to protective cover 704 by side wall members 714, the amount of adhesive 768 used may be reduced, thereby making protective cover 704 lower in the z-dimension relative to side wall members 714. In this way, the side wall member 714 may additionally cover a portion of the protective cover 704 and provide additional protection to the protective cover 704 from forces having a force component in the y-dimension. It should be noted that additional techniques may be used to optimize the amount of adhesive 768 used and to adjust the dimensions of the frame 754, the side wall members 714 and the protective cover 704 so as to maintain a generally continuous and flat configuration.

Fig. 13 illustrates a cross-sectional view of an embodiment of an electronic device 800, showing the electronic device 800 having a protective cover 804 and a side wall member 814 extended to provide additional support for the protective cover 804, according to some described embodiments. The electronic device 800 may include any of the features described herein for the electronic device. In contrast to the previous embodiments, the sidewall component 814 includes an outer perimeter 824 that is convex or raised in the z-dimension. Thus, the material forming the sidewall members 814 increases (in the y-dimension) and provides additional support for the protective cover 804. Additionally, the side wall member 814 can include an edge 826 that is parallel, or at least substantially parallel, with respect to the surface 806 of the protective cover 804. Thus, the side wall members 814 may also provide additional support to the protective cover 804 and the frame 854 between the protective cover 804 and the side wall members 814.

Fig. 14 illustrates a cross-sectional view of an embodiment of an electronic device 900 showing the electronic device 900 having various structural enhancements, according to some described embodiments. Electronic device 900 may include any features described herein for an electronic device. Similar to previous embodiments, electronic device 900 may include a display assembly 902 including a touch-sensitive layer 912 designed to receive touch inputs, a display layer 914 designed to present visual information, and a force-sensitive layer 916 designed to detect an amount of force applied to or acting on the display layer 914 by applying the force to at least one of the touch-sensitive layer 912, the display layer 204, and a protective cover 904 covering the display assembly 902. The display assembly 902 may also include a plate 918 secured to the force-sensitive layer 916. As shown, the plate 918 is located below the force sensitive layer 916. However, in some embodiments (not shown), the plate 918 is positioned between the display layer 914 and the force-sensitive layer 916.

The plate 918 may comprise a rigid material, such as metal or plastic. The plate 918 may provide structural support and stiffness to the display assembly 902. Thus, when the electronic device 900 is dropped, the plate 918 may protect the display assembly 902 from impact by another component (not shown) in the electronic device 900. In addition, the plate 918 may prevent the layers of the display assembly 902 from bending, which in turn may prevent the layers from overcoming the adhesion and peeling away from each other.

In some embodiments, an electronic device includes a flexible circuit coupled to a touch input layer. To limit movement of the flexible circuit, an adhesive is applied to the support member (embedded in the frame) to adhere the flexible circuit and the support member together. However, adhesives are known to shrink when cured. The shrinking effect of the adhesive provides a pulling force to the flexible circuit, which in turn causes other components to experience an undesirable pulling force, which may alter the position of or even damage some components.

Generally, the amount of shrinkage of the adhesive (from uncured to cured state) depends on the amount of adhesive used. To reduce the pulling force due to shrinkage, the electronics can be modified to limit the amount of adhesive needed. For example, fig. 14 shows an electronic device 900 having a plate 928, the plate 928 being positioned between a flexible circuit 922 (similar to the first flexible circuit 212 shown in fig. 5) and a support element 958 embedded in a frame 954. The plate 928 may be positioned between the support element 958 and an adhesive 930 disposed on the support element 958. Plate 928 may comprise a metal plate used as a spacer that may be secured to flex circuit 922. The plate 928 may occupy space between the flexible circuit 922 and the support element 958 that would otherwise be occupied by the adhesive 930. In this way, the amount of adhesive 930 used can be reduced, and thus the shrinking effect of the adhesive 930 can also be reduced. In addition, the plate 928 is designed and positioned to absorb some forces that would otherwise affect the display assembly 902. Thus, when the display component 902 is on and visual information is being presented, the plate 928 may limit or prevent visual problems, such as display artifacts.

Similar to the previous embodiments, the display layer 914 extends beyond the force-sensitive layer 916 and includes a bend. However, as shown in fig. 14, the display layer 914 may include a first material 932 covering a surface of the display layer 914. First material 932 may include a potting material that protects display layer 914 and, in particular, the bend region of display layer 914 from external forces. To provide the first material, needles (not shown) may be inserted into locations within the bend region of the display layer 914. The needle may disperse the material when pulled from the electronic device 900.

Display layer 914 may also include a second material 934 covering the surface of display layer 914, the second material including a number of metal traces (not labeled). Second material 934 is designed to provide a compressive force to the metal traces and prevent a tensile force from acting on the metal traces, thereby preventing damage to the metal traces. Additionally, second material 934 may provide stiffness and structural support for display layer 914.

Fig. 15 illustrates a plan view of an embodiment of an electronic device 1000, showing a board 1018 positioned in a housing 1010 of the electronic device 1000, in accordance with some such embodiments. For illustrative purposes, several features including the transparent cover and the display assembly are removed. Electronic device 1000, housing 1010, and board 1018 may include any features described herein for the electronic device, housing, and board, respectively. The board 1018 is designed for use with a display assembly (now shown). In this regard, plate 1018 may include any of the features previously described for plate 918 (shown in fig. 14).

The plate 1018 may include a recess 1020 designed to receive a portion of a display assembly. For example, the notch 1020 may receive a bend region of a display assembly (similar to the display assembly 102 shown in fig. 5) and/or a flexible circuit associated with the display assembly (such as the first flexible circuit 212 shown in fig. 5). In other words, the curved region associated with the display assembly may curve around the board 1018 along the flat edge 1022 of the board 1018 and avoid contacting the housing 1010. Accordingly, the notch 1020 may be referred to as a cut-out region of the plate 1018.

Further, plate 1018 may include extensions, such as first extension 1024 and second extension 1026. As shown, first and

second extensions

1024, 1026 extend beyond the flat edge 1028 of plate 1018. The display assembly (not shown) may include a bending region and a flexible circuit that are bent around the flat edge 1028 and may be positioned between the first and

second extensions

1024, 1026 in the manner previously described. First extension 1024 and second extension 1026 extend plate 1018 in the y-dimension. In this way, an external force having a force component in the y-dimension applied to the electronic device 1000 may displace the board 1018 (and the display components carried by the board 1018) in the y-dimension relative to the housing 1010. However, the first extension 1024 and the second extension 1026 are designed to engage the side wall member 1014 of the housing 1010 (similar to the second side wall member 114 shown in fig. 1) before the flex area of the display assembly and/or the flexible circuit engage the housing 1010. Accordingly, the display assembly may be prevented from being damaged and/or the electrical connection may be prevented from being disconnected.

FIG. 16 illustrates a partial side view of the electronic device 1000 illustrated in FIG. 15, further showing a first extension 1024 of the plate 1018 secured with the display assembly 1002. As shown, the display assembly 1002 may be bent around the plate 1018. In addition, the plate 1018 may extend laterally beyond the display assembly 1002 in the y-dimension and the frame 1054 that secures the protective cover 1004 over the display assembly 1002. Accordingly, first extension 1024 and second extension 1026 (shown in fig. 15) may combine to provide a cushion for display assembly 1002 against forces applied to display assembly 1002 that cause the display assembly to move toward sidewall member 1014 of housing 1010 (labeled in fig. 15). The frame 1054, protective cover 1004, and display assembly 1002 can include any of the features previously described for the frame, protective cover, and display assembly, respectively.

Fig. 17 illustrates a cross-sectional view of an embodiment of an electronic device 1100, showing the electronic device 1100 having a housing 1110 and a support structure 1120 integrally formed with the housing 1110, in accordance with some such embodiments. For simplicity, some features and components of the electronic device 1100 are not shown. However, electronic device 1100 and housing 1110 may include any of the features described herein for the electronic device and housing, respectively. Unlike previous embodiments where the electronic device has a frame secured to the housing, the support structure 1120 can be part of the housing 1110. In some embodiments, the shell 1110 is formed from a metal, such as aluminum or an alloy including aluminum. In the embodiment shown in fig. 17, the housing 1110 is formed of ceramic. The ceramic material may provide a robust housing while also minimizing the effects of RF interference on the antenna assembly (not shown) of the electronic device 1100.

The support structure 1120 can receive and support a protective cover 1104 (similar to the first protective layer 104 shown in fig. 1). Additionally, support structure 1120 may include notches 1156 that are designed to receive bent regions of display assembly 1102 and/or bent regions of flexible circuit 1112 used with display assembly 1102. The notch 1156 may extend circumferentially around the display assembly 1102. Accordingly, the notch 1156 may be integrated into the housing 1110. This may reduce associated costs and reduce manufacturing time associated with the use of the frame.

Fig. 18 illustrates a plan view of an embodiment of a protective cover 1204, according to some described embodiments. The protective cover 1204 may include any of the features described herein for the protective cover and/or the protective layer. Accordingly, the protective cover 1204 may comprise a transparent material, such as glass, sapphire, plastic, and the like. In this regard, the protective cover 1204 is designed to cover a display assembly (not shown). The protective cover 1204 may include a base portion and a recess (shown below) partially defined by a dashed line 1206.

Fig. 19 illustrates a cross-sectional view taken along line B-B of the protective cover 1204 shown in fig. 18, further illustrating a notch 1208 formed in the protective cover 1204. The notch 1208 may define a cavity that extends partially into the material forming the protective cover 1204. In this way, the recess may receive, or at least partially receive, the display assembly. This will be further illustrated below. Additionally, the protective cover 1204 can include a base portion 1212 extending around the notch 1208.

Fig. 20 illustrates a cross-sectional view of an embodiment of an electronic device 1200 showing a protective cover 1204 (shown in fig. 18 and 19) secured with a housing 1210, according to some described embodiments. For simplicity, some features and components of the electronic device 1200 are not shown. However, electronic device 1200 may include any features described herein for the electronic device. As shown, the electronic device 1200 may include a display assembly 1202 secured to a protective cover 1204 and positioned in a recess 1208. The display assembly 1202 may fit partially into the recess 1208 or may fit fully into the recess 1208, depending on the desired configuration. By fitting the display assembly 1202 into the notch 1208 of the protective cover 1204, the protective cover 1204 can enhance the protection provided to the display assembly 1202 by covering multiple dimensions of the display assembly 1202. Thus, an impact force applied to the electronic device 1200 may be absorbed, or at least partially absorbed, by the protective cover 1204 before the display assembly 1202 is subjected to any impact. Additionally, by modifying the protective cover 1204, design modifications to other components may be limited, thereby reducing manufacturing and engineering design costs. In addition, the frame 1254 may not require a notch (such as notch 156 shown in fig. 5), and thus may provide additional support to the protective cover 1204.

Fig. 21 illustrates a cross-sectional view of an embodiment of an electronic device 1300 showing a protective cover 1304 extending over a frame 1354 and positioned adjacent to a side wall member 1314, according to some described embodiments. The electronic device 1300, the side wall member 1314, and the frame 1354 can include any of the features described herein for the electronic device, the side wall member, and the frame, respectively. As shown, the frame 1354 may be modified and reduced in size to allow the protective cover 1304 to extend over the frame 1354 and interface with the side wall members 1314. This allows the protective cover 1204, and in particular the crimped portion 1306 of the protective cover 1304, to receive direct protection from the side wall member 1314, as opposed to the frame 1354 extending between the side wall member 1314 and the protective cover 1304 (as shown in other embodiments). Additionally, the protective cover 1304 can define an extended protective cover having a relatively large length in the y-dimension. This may allow modification of the display assembly 1302 of the electronic device 1300 to increase in size in the y-dimension as well. Alternatively or in combination, the extended length of the protective cover 1304 and the display assembly 1302 may facilitate achieving an appearance-symmetric display assembly, which may also allow for modification of a display frame (not shown) that partially covers the appearance-symmetric display assembly. By providing a symmetric display assembly, the overall appearance of the electronic device 1300 may be enhanced.

Fig. 22 illustrates an exploded view of a battery assembly 160 according to some described embodiments. As shown, the battery assembly 160 may include a first cover element 1402 and a second cover element 1404, wherein the first cover element 1402 and the second cover element 1404 are sealed together to form an enclosure that shields the internal components of the battery assembly 160. The housing formed by the first cover element 1402 and the second cover element 1404 may define a cavity for receiving and enclosing the internal components. For example, battery assembly 160 can also include a first electrode 1406 and a second electrode 1408 that is separate from first electrode 1406 (such that each of first electrode 1406 and second electrode 1408 comprise a unitary electrode), wherein separator 1410 provides some physical isolation between first electrode 1406 and second electrode 1408 while also allowing charge to flow between first electrode 1406 and second electrode 1408. As is generally known in the battery art, one of the first electrode 1406 and the second electrode 1408 comprises an anode, while the remaining electrodes (of the first electrode 1406 and the second electrode 1408) comprise cathodes. In addition, as is generally known, electrodes may be used to convert chemical energy into electrical power for use by electronic devices, such as the electronic device 100 shown in fig. 1. Additionally, battery assembly 160, as well as the battery assemblies described herein, may include a rechargeable battery assembly designed for reuse after battery assembly 160 receives electrical energy from an external source. The battery assembly 160 may also include a circuit board 1412 including one or more circuits designed to monitor the current flowing into and out of the battery assembly 160. Additionally, circuit board 1412 and components of circuit board 1412 may be in electrical communication with circuit board assembly 170 (shown in fig. 4).

Additionally, the first cover element 1402 can form a channel 164 that provides additional space in the z-dimension for a component (not shown), such as a flexible circuit. In other words, the size (such as height) of the battery assembly 160 is reduced in locations corresponding to the channels 164 while still providing sufficient space for the circuit board 1412 to be positioned below the channels 164. In this way, components may be positioned across channel 164, allowing other components in electronic device 100 (shown in fig. 1) to be rearranged to create additional space for battery assembly 160. Accordingly, the battery assembly 160 may include a large size corresponding to a large charge capacity. While the first cover element 1402 and the second cover element 1404 may provide a shield that includes an electrical shield, the foregoing cover elements may allow for some electrical connection. For example, the first cover element 1402 can include an opening 1414 proximate the circuit board 1412. Additionally, although not shown in the figures, the first cover element 1402 and/or the second cover element 1404 may include additional openings to allow one or more additional components to be electrically coupled with the battery assembly 160. Although conventional battery electrodes include a substantially rectilinear shape, battery assembly 160, as well as the electrodes in the battery assemblies described herein, may include different shapes. For example, as shown in fig. 22, first electrode 1406 and second electrode 1408 comprise an "L-shaped configuration" in which at least one surface comprises six different sides. As will be discussed further below.

Fig. 23 is a plan view of the first electrode 1406 shown in fig. 22. As shown, the first electrode 1406 includes an L-shaped configuration. In this regard, the first electrode 1406 may include a first portion 1420 or first rectangular portion, and a second portion 1422 or second rectangular portion extending from the first portion 1420. The dashed line represents the interface area between the first portion 1420 and the second portion 1422. In some embodiments (not shown), the first portion 1420 is the same or substantially similar in size to the second portion 1422. However, in the embodiment shown in fig. 23, the first portion 1420 is larger in size than the second portion 1422.

The first electrode 1406 can also be characterized as including a first wall 1434 having a first dimension 1444 and a second wall 1436 having a second dimension 1446. As shown, the first wall 1434 is parallel, or at least substantially parallel, with respect to the second wall 1436, and the second dimension 1446 is smaller than the first dimension 1444. Additionally, the first electrode 1406 may include a third wall 1438 having a third dimension 1448 (separating the first wall 1434 from the second wall 1436), and a fourth wall 1440 having a fourth dimension 1450. As shown, the third wall 1438 is parallel, or at least substantially parallel, with respect to the fourth wall 1440, and the fourth dimension 1450 is less than the third dimension 1448. Additionally, the first electrode 1406 can include a fifth wall 1442 that is parallel, or at least substantially parallel, with respect to the third wall 1438. The fifth wall 1442 may include a fifth dimension 1452 that is less than the third dimension 1448. As shown in fig. 23, fourth dimension 1450 and fifth dimension 1452 may combine to equal third dimension 1448. Additionally, the third wall 1438 is perpendicular, or at least substantially perpendicular, with respect to the first and

second walls

1434, 1436. In some embodiments (not shown), the first dimension 1444 is the same as the second dimension 1446. Additionally, in some embodiments (not shown), first dimension 1444 is smaller than second dimension 1446. Additionally, it should be noted that second electrode 1408 (shown in fig. 22), as well as any one or more additional electrodes and one or more separators included in cell assembly 160 (shown in fig. 22), may include a size and shape that is the same as or substantially similar to the size and shape of first electrode 1406.

Fig. 24 illustrates a plan view of an alternative embodiment of an electrode 1506 suitable for use in a battery assembly in accordance with some described embodiments. As shown, the electrodes 1506 may include a "C-shaped configuration. In this regard, the electrode 1506 may include a first portion 1520 or a first rectangular portion. The electrode 1506 may also include a second portion 1522 or a second rectangular portion, and a third portion 1524 or a third rectangular portion, both of which extend perpendicularly or substantially perpendicularly with respect to the first portion 1520. Dashed lines indicate the interface regions between the first portion 1520 and the second portion 1522 and between the first portion 1520 and the third portion 1524. In some embodiments (not shown), the first portion 1520 is the same or substantially similar in size as the second portion 1522 and the third portion 1524. However, in the embodiment shown in fig. 24, the size of the first portion 1520 is larger than the size of the second portion 1522 and also larger than the size of the third portion 1524. Additionally, as shown in fig. 24, the dimensions of the second portion 1522 are the same as or substantially similar to the dimensions of the third portion 1524. However, in some implementations (not shown), the size of the second portion 1522 may be different than the size of the third portion 1524. For example, the size of the second portion 1522 may be larger or smaller than the size of the third portion 1524.

Electrode 1506 may also be characterized as including a first wall 1534 having a first dimension 1544 and a second wall 1536 having a second dimension 1546. As shown, first wall 1534 is parallel or at least substantially parallel with respect to second wall 1536, and second dimension 1546 includes a length that is the same as or at least substantially similar to the length of first dimension 1544. Additionally, electrode 1506 may include a third wall 1538 having a third dimension 1548 (separating first wall 1534 from second wall 1536), a fourth wall 1540 having a fourth dimension 1550, and a fifth wall 1542 having a fifth dimension 1552. As shown, third wall 1538 is parallel or at least substantially parallel with respect to fourth wall 1540 and fifth wall 1542. Additionally, each of fourth dimension 1550 and fifth dimension 1552 is smaller than third dimension 1548. In addition, the third wall 1538 is perpendicular, or at least substantially perpendicular, relative to the first wall 1534 and the second wall 1536. As shown in fig. 24, first dimension 1544 is the same as second dimension 1546. However, first dimension 1544 may be different than second dimension 1546, such as smaller or larger than the second dimension. Additionally, electrode 1506 may include a sixth wall 1562 that is parallel, or at least substantially parallel, with respect to third wall 1538. Sixth wall 1562 may include a sixth dimension 1572 that is less than third dimension 1548. As shown in fig. 24, fourth dimension 1550, fifth dimension 1552, and sixth dimension 1572 may combine to equal third dimension 1548. Additionally, it should be noted that any one or more additional electrodes and one or more separators included in a battery assembly (not shown) can include a size and shape that is the same as or substantially similar to the size and shape of electrode 1506.

Fig. 25 shows a plan view of an alternative embodiment of an electrode 1606 suitable for use in a battery assembly, according to some of the described embodiments. As shown, the electrode 1606 may include an "I-shaped configuration. In this regard, the electrode 1606 may include a first portion 1620 or first rectangular portion, a second portion 1622 or second rectangular portion, and a third portion 1624 or third rectangular portion. Dashed lines indicate the interface areas between first portion 1620 and second portion 1622 and between first portion 1620 and third portion 1624. As shown, both the second portion 1622 and the third portion 1624 extend perpendicular or substantially perpendicular to the first portion 1620. Similar to a shape similar to the letter "I," the first portion 1620 may be centered or substantially centered relative to the second and

third portions

1622, 1624. As shown, the first portion 1620 is the same or substantially similar in size to the second and

third portions

1622, 1624. However, in some embodiments (not shown), the size of the first portion 1620 is different than the size of the second portion 1622 and also different than the size of the third portion 1624. In addition, as shown in fig. 25, the second portion 1622 has the same or substantially similar dimensions as the third portion 1624. However, in some embodiments (not shown), the second portion 1622 may have a different size than the third portion 1624. For example, the second portion 1622 may be sized larger or smaller than the third portion 1624. Additionally, in some embodiments, third portion 1624 is removed from electrode 1606 such that electrode 1606 comprises a "T-shaped configuration.

The electrode 1606 can also be characterized as including a first wall 1634 having a first dimension 1644 and a second wall 1636 having a second dimension 1646. As shown, the first wall 1634 is parallel or at least substantially parallel with respect to the second wall 1636, and the second dimension 1646 comprises a length that is the same as, or at least substantially similar to, the length of the first dimension 1644. In addition, the electrode 1606 can include a third wall 1638 having a third dimension 1648. The third wall 1638 may be perpendicular, or at least substantially perpendicular, relative to the first and

second walls

1634, 1636, and the third dimension 1648 comprises a length that is the same, or at least substantially similar, to the length of the first and

second dimensions

1644, 1646.

The electrode 1606 can also be characterized as having a first portion 1620 that is aligned with and symmetrically disposed about a first longitudinal axis 1652 that extends through the first portion 1620. The term "longitudinal" as used throughout the detailed description and in the claims refers to a direction extending along a major axis of a component, where the "major" dimension corresponds to the largest (longest) dimension of a portion of an electrode. Electrode 1606 may also include second portion 1622 and third portion 1624 that are aligned with and symmetrically disposed about second longitudinal axis 1654 and third longitudinal axis 1656, respectively. Second longitudinal axis 1654 may be aligned parallel with respect to third longitudinal axis 1656. Additionally, first longitudinal axis 1652 may be perpendicular relative to second longitudinal axis 1654 and third longitudinal axis 1656. Additionally, it should be noted that any one or more additional electrodes and one or more separators included in the battery assembly (not shown) can include a size and shape that is the same as or substantially similar to the size and shape of the electrode 1606.

Fig. 26 illustrates a plan view of an alternative embodiment of an electrode 1706 suitable for use in a battery assembly, according to some described embodiments. As shown, the electrode 1706 can include an "L-shaped configuration" that is similar to the L-shaped configuration of the first electrode 1406 (shown in fig. 23). In this regard, the electrode 1706 may include a first portion 1720 or a first rectangular portion, and a second portion 1722 or a second rectangular portion extending in a perpendicular manner from the first portion 1720. The dashed line represents the interface region between first portion 1720 and second portion 1722. In some embodiments (not shown), first portion 1720 is the same size or substantially similar to second portion 1722. However, in the embodiment shown in FIG. 26, the size of first portion 1720 is larger than the size of second portion 1722. Additionally, the electrode 1706 may also include openings 1730 that define voids or spaces in the electrode 1706. The opening 1730 may allow a battery assembly (not shown) including the electrode 1706 and other electrodes having a similar size and shape as the electrode 1706 to position a component (not shown) at a location corresponding to the opening 1730. In this way, the battery assembly can receive the component through opening 1730 when the openings of the electrodes and the openings of the separator are aligned with each other to form a continuous through-hole through the electrode layer and the separator layer of the battery assembly. As will be discussed further below. Additionally, although the openings 1730 are shown as being located in the electrode 1706, other embodiments, such as the embodiments of the electrode shown in fig. 23-25, may also include openings.

The various embodiments of the electrodes shown and described in fig. 23-26 may be formed by cutting operations, including die cutting. The die cutting operation may include subjecting the electrode sheet to a cutting operation using a die having a predetermined size and shape. The mold may include a size and shape corresponding to the size and shape of the electrodes shown in fig. 23-26. It should be noted that the separator can be die cut in a similar manner. Accordingly, the shape of the electrodes described herein may include shapes other than rectangular shapes. In this regard, the battery assembly may include various sizes and shapes depending on the size and shape of the electrodes and separators so that the battery assembly may be of various sizes and shapes in order to increase the size of the battery assembly and/or to accommodate other internal components in the electronic device.

Fig. 27-29 illustrate various embodiments of battery assemblies suitable for use with the electronic devices described herein. For illustrative purposes, some components of the electronic devices shown in fig. 27-29 have been removed. The die cutting operation (described above) used to form the electrodes for use in the battery assemblies described herein may be cut into various sizes and shapes. In this regard, the battery assembly may be of various sizes and shapes. In addition, the electronic device and battery assembly shown in fig. 27-29 may include any one or more of the components and one or more features previously described for the electronic device. In addition, while a specific number of embodiments of the battery assembly are shown, several other configurations are possible.

Fig. 27 illustrates an embodiment of a battery assembly 1860 disposed in an electronic device 1800, in accordance with some such embodiments, where the battery assembly 1860 has a shape that accommodates an internal component 1870 of the electronic device 1800. As shown, the battery assembly 1860 may include a C-shaped configuration to accommodate an internal component 1870 that may include a circuit board assembly (previously described). The term "accommodate" may refer to modifying the size and shape of a component (such as the battery assembly 1860) in order to avoid or reduce modification of the size, shape, and/or position of another component (such as the internal component 1870) in the electronic device 1800. For example, the battery assembly shown and described herein may accommodate another component or components by providing space that would otherwise be occupied by a conventional linear battery. In addition, any one or more electrodes and one or more separators of battery assembly 1860 also include a C-shaped configuration having a shape similar to that of electrode 1506 (shown in fig. 24). Accordingly, battery assembly 1860 may include an enclosure defined by one or more cover elements that includes a C-shaped configuration.

Fig. 28 illustrates an alternative embodiment of a battery assembly 1960 located in an electronic device 1900 according to some described embodiments, the battery assembly 1960 having a shape that accommodates multiple internal components of the electronic device 1900. As shown, the battery assembly 1960 may include an "I-shaped" configuration to accommodate the first and second

internal components

1970, 1972. Each of the first internal components 1970 and the second internal components 1972 may represent a component, such as a circuit board, an audio module, a flex circuit, or the like. Fig. 28 also shows that the first internal component 1970 and the second internal component 1972 are positioned in different spaces between the extensions of the battery assembly 1960. Additionally, any one or more electrodes and one or more separators of battery assembly 1960 further comprise an I-shaped configuration having a shape similar to that of electrode 1606 (shown in fig. 25). Accordingly, the battery assembly 1960 may include an enclosure defined by one or more cover elements that includes an I-shaped configuration.

Fig. 29 illustrates an alternative embodiment of a battery assembly 2060 located in the electronic device 2000 in accordance with some described embodiments, wherein the battery assembly 2060 has an opening 2062 that receives an interior component 2072 of the electronic device 2000. As shown, the opening 2062 may comprise a size and shape such that the perimeter of the opening 2062 may be used to position the inner member 2072. While the openings 2062 include generally circular openings, the openings 2062 may take on other shapes, including three-sided shapes and four-sided shapes, as non-limiting examples. Additionally, as shown in fig. 29, the battery assembly 2060 may include an L-shaped configuration (although other aforementioned shapes are possible) to receive the interior member 2070 (which may include a circuit board assembly), and may also include an opening 2062. The L-shaped configuration of the battery assembly 2060 allows the inner member 2070 to be positioned at least partially between edges of the battery assembly 2060, such as the first edge 2064 and the second edge 2066. Additionally, a battery assembly including an L-shaped configuration and an opening (similar to opening 2062) may include electrodes and separators that are aligned with each other and have a shape similar to the shape of electrode 1706 (shown in fig. 26). In other words, any one or more electrodes and one or more separators of battery assembly 2060 further comprise an L-shaped configuration having openings similar to the openings of electrode 1706 (shown in fig. 26). Accordingly, the battery assembly 2060 may comprise a housing defined by one or more cover elements that comprises an L-shaped configuration and an opening.

In addition to having various sizes and shapes (in addition to the conventional rectilinear shape), the battery assemblies described herein may include additional features. Fig. 30 illustrates an alternative embodiment of a battery assembly 2160 located in the electronic device 2100, in accordance with some described embodiments, wherein the battery assembly 2160 is positioned in the housing 2102 (of the electronic device 2100) above the first internal component 2172 (shown in phantom) of the electronic device 2100. Due in part to the additional space provided by display layer 204 (shown in fig. 5), battery assembly 2160 may cover or overlie some components, such as first internal component 2172. Additionally, to accommodate circuit board assembly 2170 within housing 2102, battery assembly 2160 may include an L-shaped configuration. In this manner, battery assembly 2160 provides a location to accommodate a portion of circuit board assembly 2170 (including also L-shaped configurations, as shown herein), whereas otherwise straight batteries may not accommodate circuit board assembly 2170. As shown in fig. 30, circuit board assembly 2170 can "mate" with battery assembly 2160, which can be similar to puzzle pieces. Additionally, battery assembly 2160 may also include a passage 2162 defining a reduced size battery assembly 2160. As such, electronic device 2100 may include a flexible circuit 2164 that passes over battery assembly 2160 along passage 2162 and is electrically coupled with circuit board assembly 2170 and a second internal component 2174, which may include an operational component (such as an audio module, as a non-limiting example), to place second internal component 2174 in electrical communication with circuit board assembly 2170. While the flexible circuit 2164 is described as being electrically coupled to the second internal component 2174, the flexible circuit 2164 may also be electrically coupled with a third internal component (not shown), such as an antenna. In either case, passageways 2162 formed in battery assembly 2160 allow for rearrangement of various internal components. Additionally, battery assembly 2160 may include an increased size corresponding to an increased electrical storage capacity because battery assembly 2160 may be positioned above first internal component 2172.

Fig. 31 illustrates a cross-sectional view of the electronic device 2100 illustrated in fig. 30 taken along line C-C in fig. 30. Due in part to the die cutting operation of the electrodes and separator (described above), battery assembly 2160 may pass over first inner member 2172. Further, as shown in fig. 31, a portion of battery assembly 2160 may be placed flat on housing 2102 while another portion of battery assembly 2160 covers first interior member 2172. In other words, battery assembly 2160 may be elevated above first inner member 2172 and also at least partially conform to the size and shape of first inner member 2172. Further, the electrode may also pass over the first inner member 2172. For example, cell assembly 2160 includes a first electrode 2182 and a second electrode 2184, with a separator 2186 positioned between the first electrode 2182 and the second electrode 2184. As shown in fig. 31, a first electrode 2182, a second electrode 2184, and a separator 2186 may pass over the first inner member 2172. In addition, the die cutting operation may form first and

second electrodes

2182, 2184 such that the electrodes terminate prior to entering a location in cell assembly 2160 corresponding to passage 2162, thereby allowing passage 2162 to reduce the size of cell assembly 2160 to receive flexible circuit 2164. Although not shown in the figures, the passages 2162 may include a size and shape to receive two or more flexible circuits to electrically couple additional internal components (not shown) with the circuit board assembly 2170 (shown in fig. 30). Thus, flex circuit 2164 (or additional flex circuits) need not be positioned around the perimeter of battery assembly 2160.

Fig. 32 illustrates an exploded view of the circuit board assembly 170 shown in fig. 4, according to some described embodiments. As shown, the circuit board assembly 170 may include a first circuit board 172 and a second circuit board 174. In some implementations, each of the first circuit board 172 and the second circuit board 174 includes a printed circuit board. Additionally, the first circuit board 172 can be secured with and positioned above the second circuit board 174 in a stacked configuration. As shown in fig. 32, the first circuit board 172 includes a size and shape that is the same as or at least partially similar to the size and shape of the second circuit board 174. However, in some embodiments (not shown), the first circuit board 172 includes at least some differences in terms of size and/or shape as compared to the second circuit board 174. While the stacked configuration of circuit board assembly 170 increases the footprint of circuit board assembly 170 in the z-dimension in electronic device 100 (shown in fig. 1), the stacked configuration decreases the footprint of circuit board assembly 170 in the x-dimension and the y-dimension. The additional space provided by stacking the aforementioned circuit boards may provide additional space for other components in electronic device 100, such as battery assembly 160 (shown in fig. 4). In addition, the additional space provided by reducing the size of display assembly 102 (shown in FIG. 5) provides space for circuit board assembly 170. In other words, the additional space in the z-dimension enabled in part by the reduced size of display assembly 102 allows for a stacked configuration of circuit board assembly 170. Although not shown in the figures, circuit board assembly 170 may include three or more circuit boards in a stacked configuration and in electrical communication with each other.

First circuit board 172 and/or second circuit board 174 may include several operational components. An "operational component" may refer to a component, such as an integrated circuit or a processor circuit, that performs one or more operations, such as executing instructions from a software application stored on a memory circuit. The operating components may also be referred to as transistors. Operating components located on either of first circuit board 172 and/or second circuit board 174 may convert electrical energy to thermal energy during operation. However, the heat distribution assembly (not shown) is designed to remove thermal energy from the circuit board assembly 170. As will be discussed below. As shown in fig. 32, the circuit board may include operating components on multiple surfaces. For example, the first circuit board 172 may include a first mounting surface 2202 and a second mounting surface 2204 opposite the first mounting surface 2202, where the first mounting surface 2202 has a first operational component 2212 and the second mounting surface 2204 has a second operational component 2214 (shown in phantom). As shown in fig. 32, the first mounting surface 2202 and the second mounting surface 2204 may include additional operational components. Additionally, it should be noted that the operational components on the first circuit board 172 may be in electrical communication with each other. The communication device may include, for example, at least one through hole (not shown) extending through the first circuit board 172.

The second circuit board 174 may include a first mounting surface 2206 that includes a number of operational components, such as operational component 2216. The second circuit board 174 also includes a second mounting surface 2208 opposite the first mounting surface 2206. In some embodiments, the second mounting surface 2208 includes one or more operational components in electrical communication with the operational components located on the first mounting surface 2206. Additionally, it should be noted that second circuit board 174 is overlaid (or covered) by first circuit board 172 in a stacked configuration when circuit board assembly 170 is assembled. It should be noted, however, that the first circuit board 172 is still separated from the second circuit 174 by at least some gap or space. Additionally, when circuit board assembly 170 is assembled, first mounting surface 2206 of second circuit board 174 faces second mounting surface 2204 of first circuit board 172, and vice versa.

The first circuit board 172 may be mechanically connected to the second circuit board 174 by several standoff studs connected to rivets. For example, as shown in fig. 32, the second circuit board 174 includes a first standoff 2222 that is designed to couple with a first rivet 2224 located on the first circuit board 172. Each of the remaining standoffs (not labeled) shown in fig. 19 can be connected to a rivet (not labeled) shown in fig. 32. The standoffs are designed not only to provide a mechanical connection, but also to maintain a desired distance between the first and

second circuit boards

172, 174 such that components on the second mounting surface 2204 of the first circuit board 172 do not (physically) interfere with components on the first mounting surface 2206 of the second circuit board 174, and vice versa. Additionally, the positioning of the standoffs and rivets may be reversed such that the first circuit board 172 includes standoffs and the second circuit board 174 includes rivets.

To electrically couple first circuit board 172 with second circuit board 174, a number of interposers may be used to route electrical signals between first circuit board 172 and second circuit board 174. For example, as shown in fig. 32, second circuit board 174 may include a number of interposers, such as interposer 2232 that is electrically coupled to second circuit board 174 by, for example, a soldering operation. Several additional interpolators (not labeled) are shown. Additionally, although not shown, the second circuit board 174 may include several metal traces that electrically couple the interposer to one or more operational components on the second circuit board 174. Additionally, each of the interposers may be electrically coupled with one or more metal traces (not shown) on second mounting surface 2204 of first circuit board 172 when first circuit board 172 is electrically coupled to second circuit board 174.

Circuit board assembly 170 may include several shielding elements that shield components of circuit board assembly 170 from electromagnetic interference ("EMI"). For example, circuit board assembly 170 may include a first shielding element 2242 covering components positioned on first mounting surface 2202 of first circuit board 172. The first shielding element 2242 may comprise a metal-based material designed to provide an EMI shielding enclosure for components on the first mounting surface 2202. The circuit board assembly 170 may also include a second shielding element 2244 designed to provide an EMI shield for components located on the second mounting surface 2204 of the first circuit board 172 and on the first mounting surface 2206 of the second circuit board 174. The second shield element 2244 may comprise a metal, such as copper or brass. The second shield member 2244 may be secured with (and between) the first and

second circuit boards

172, 174 by a number of solder joints disposed on each circuit board. For example, fig. 32 shows second circuit board 174 with first solder points 2250 positioned around an outer perimeter of second circuit board 174. Several additional pads are shown, but not labeled, in addition to first pad 2250. The first circuit board 172 may also include solder joints (not shown) located at positions corresponding to solder joints on the second circuit board 174. In some embodiments, the second shield element 2244 comprises a number of discrete structural elements. In the embodiment shown in fig. 32, second shield element 2244 may comprise a single continuous structural member designed to extend along the outer perimeter of circuit board assembly 170. Alternatively, the second shielding element 2244 may comprise several shielding element parts which are combined with each other to form the second shielding element 2244.

Circuit board assembly 170 may also include a third shield element 2246 positioned on second mounting surface 2208 of second circuit board 174. Third shield element 2246 is designed to combine with first shield element 2242 and second shield element 2244 to provide an EMI shield for circuit board assembly 170. Additionally, the second mounting surface 2208 of the second circuit board 174 may include metal traces (extending through the second mounting surface 2208). In this regard, in addition to forming an EMI shield, the third shield element 2246 may also define at least a portion of an electrical ground path for the circuit board assembly 170 because the third shield element 2246 is electrically connected to the second mounting surface 2208 by metal traces. Additionally, the aforementioned shielding elements may shield components of electronic device 100 (shown in fig. 1) that are external to circuit board assembly 170 from EMI generated by one or more components of circuit board assembly 170 when the one or more components of circuit board assembly 170 generate EMI during operation.

Fig. 33 illustrates a cross-sectional view of circuit board assembly 170 shown in fig. 32, showing various internal components of circuit board assembly 170. As shown, the first circuit board 172 may be separated from the second circuit board 174 by standoffs 2226. Additionally, to mechanically couple the first circuit board 172 to the second circuit board 174, the standoffs 2226 may be mechanically coupled to the rivets 2228, wherein the standoffs 2226 and rivets 2228 are electrically isolated from the components of the first and

second circuit boards

172, 174.

The first circuit board 172 may include a through hole 2218 formed of metal to provide an electrical connection between the first and

second operating members

2212 and 2214. Additionally, first circuit board 172 may be in electrical communication with second circuit board 174 through interposer 2234. Interposer 2234 may be electrically and mechanically coupled to first pads 2262 on first circuit board 172, as shown, and may also be electrically and mechanically coupled to second pads 2264 on second circuit board 174. In addition to interposer 2234, a number of additional interposers (not shown) may be used to carry signals between circuit boards. The first circuit board 172 may include first metal traces 2272 electrically connected with the second operating member 2214 and the through hole 2218, and the second circuit board 174 may include second metal traces 2274 electrically connected with the third operating member 2220 located on the second circuit board 174. In this manner, third operative member 2220 may be in electrical communication with second operative member 2214 through interposer 2234 and metal traces. Third operational component 2220 may be in electrical communication with first operational component 2212 through vias 2218, interposers 2234, and metal traces. Circuit board assembly 170 may use a number of additional metal traces, vias, and solder joints to provide additional electrical communication paths.

Fig. 34 illustrates an alternative embodiment of a circuit board assembly 2370 that illustrates the circuit board assembly 2370 modified for access protection. Circuit board assembly 2370 may include any of the components and features previously described for the circuit board assembly, such as first circuit board 2372 and second circuit board 2374. However, as shown in fig. 34, the circuit board assembly 2370 may include potting material 2390 embedded in the circuit board assembly 2370 between the first circuit board 2372 and the second circuit board 2374. Potting material 2390 may include a resin that is cured to form a liquid-resistant shield for various operative components of circuit board assembly 2370, such as operative components 2314. In this regard, the potting material 2390 may prevent damage to the circuit board assembly 2370 and, in particular, components of the circuit board assembly 2370 due to liquid ingress. Additionally, the potting material 2390 may extend to the first and

second shielding elements

2342, 2344 of the circuit board assembly 2370 in order to protect components, such as the standoffs 2326, from corrosion. Potting material 2390 may be used with the circuit components described herein.

Fig. 35 illustrates an alternative embodiment of circuit board assembly 2470, showing circuit board assembly 2470 having flexible circuit 2402 electrically coupled to a circuit board of the circuit board assembly, according to some described embodiments. The circuit board assembly 2470 may include any of the components and/or features previously described for the circuit board assembly. For example, as shown, the circuit board assembly 2470 may include a first circuit board 2472 and a second circuit board 2474. The circuit board assembly 2470 may also include a first shielding element 2442 disposed over the first circuit board 2472 and at least some of the components. The circuit board assembly 2470 may also include a second shielding element 2444 covering a gap between the first circuit board 2472 and the second circuit board 2474. The circuit board assembly 2470 may also include a third shielding element 2446 disposed over the second circuit board 2474. However, circuit board assembly 2470 in fig. 35 does not use an interposer to enable electrical communication between first circuit board 2472 and second circuit board 2474 (and their respective components), but rather uses flex circuit 2402 to carry electrical signals between operational components located on first circuit board 2472 and/or second circuit board 2474.

The flexible circuit 2402 may be electrically and mechanically coupled to a first circuit board 2472 and form a loop for electrically and mechanically coupling to a second circuit board 2474. The electrical and mechanical coupling may be performed using a thermocompression bonding operation. A thermode (not shown) may be used as a "hot tip" that is heated to provide thermal energy to the flex circuit 2402 and to the solder elements (not shown) on the first and

second circuit boards

2472, 2474 to form an electromechanical connection of the flex circuit 2402 to the first and

second circuit boards

2472, 2474. It should be noted that a plurality of thermocompression bonding operations may be used to couple the flexible circuit 2402 with the first and

second circuit boards

2472, 2474.

Fig. 36 illustrates a cross-sectional view of the circuit board assembly 2470 shown in fig. 35 taken along line D-D, showing the flexible circuit board 2402 extending between the circuit boards. As shown, the flexible circuit 2402 is electrically and mechanically coupled to first and

second pads

2412, 2414 positioned on first and

second circuit boards

2472, 2474, respectively. Additionally, a first solder joint 2412 may be electrically coupled with a first metal trace 2422 on the first circuit board 2472, and a second solder joint 2414 may be electrically coupled with a second metal trace 2424 on the second circuit board 2474. Thus, the flexible circuit 2402 may be electrically coupled to a number of operational components (not shown), some of which are electrically coupled to the first metal traces 2422 and located on the first circuit board 2472, and some of which are electrically coupled to the second metal traces 2424 and located on the second circuit board 2474.

Fig. 37 illustrates a cross-sectional view of an alternative embodiment of a circuit board assembly 2570 showing internal components of the circuit board assembly 2570 having corresponding geometries, according to some described embodiments. Circuit board assembly 2570 may include any of the components and/or features previously described for the circuit board assembly. For example, the circuit board assembly 2570 may include a first circuit board 2572 and a second circuit board 2574, wherein the first circuit board 2572 is in electrical communication with the second circuit board 2574 through the interposer 2520. Additional interposers (not shown) may electrically couple first circuit board 2572 (and components thereon) with second circuit board 2574 (and components thereon). First circuit board 2572 may include a first mounting surface 2502 having a first operational component 2512 and a second mounting surface 2504 (opposite first mounting surface 2502) having a second operational component 2514 electrically coupled to metal traces (not labeled). In addition, the second circuit board 2574 can include a third operational component 2516 electrically coupled to metal traces (not labeled), wherein the third operational component 2516 and the metal traces are located on the first mounting surface 2506 of the second circuit board 2574.

As shown in fig. 37, the second operating member 2514 and the third operating member 2516 may be in a nested configuration. For example, the third operating member 2516 may include a protrusion 2518 that extends at least partially into a recess 2522 of the second operating member 2514. The corresponding geometry between the second operating member 2514 and the third operating member 2516 may allow for a reduced size (or reduced height) of the circuit board assembly 2570, thereby reducing the overall space occupied by the circuit board assembly 2570 in an electronic device (not shown). In other words, because the components of the first and

second circuit boards

2572 and 2574 form corresponding or nested configurations in a similar manner as the nested configurations of the second and third

operational components

2514 and 2516, the spacing or gap between the first and

second circuit boards

2572 and 2574 may be reduced as compared to previous embodiments.

Additionally, in some cases, components on different circuit boards may be electrically and mechanically coupled to each other in a direct manner. For example, fig. 37 also shows that the first circuit board 2572 has a fourth operating member 2534 on the second mounting surface 2504 and a fifth operating member 2536 on the first mounting surface 2506 of the second circuit board 2574. The fourth operating member 2534 may include a recess 2542 and a connector 2544 positioned in the recess 2542. In addition, the fifth operating member 2536 may include a projection 2538 extending into the recess 2542. Projection 2538 may include a connector 2554 that is electrically and mechanically coupled to connector 2544. Thus, the fourth manipulating member 2534 and the fifth manipulating member 2536 are electrically and mechanically coupled.

In addition, when the circuit board assembly 2570 includes operating members such as the fourth operating member 2534 and the fifth operating member 2536, the first circuit board 2572 may be electrically coupled to the second circuit board 2574 through the fourth operating member 2534 and the fifth operating member 2536. Thus, the circuit board assembly 2570 may not require an interposer (such as interposer 2520) to provide electrical communication between the first and

second circuit boards

2572 and 2574. In addition, as shown in fig. 37, the first circuit board 2572 may include a via 2546 electrically coupled to the fourth operating member 2534 and a metal trace (not shown). In this way, the first operating member 2512 can be electrically connected to the fifth operating member 2536 through the metal traces, the through hole 2546 and the fourth operating member 2534. It should be noted that in some embodiments, the circuit board assembly 2570 includes a combination of the second and

third operating members

2514 and 2516 and the fourth and

fifth operating members

2534 and 2536.

Fig. 38 illustrates a cross-sectional view of an alternative embodiment of a circuit board assembly 2670 showing the circuit board assembly 2670 with several solder masks for supporting the circuit board according to some described embodiments. The circuit board assembly 2670 may include any of the components and/or features previously described for the circuit board assembly. For example, the circuit board assembly 2670 may include a first circuit board 2672 and a second circuit board 2674. Additionally, each of the first and

second circuit boards

2672, 2674 may include a number of solder joints (not labeled), wherein the interposer is electrically coupled with solder joints from the first circuit board 2672 and with solder joints from the second circuit board 2674. For example, fig. 38 shows a circuit board assembly 2670 having a first interposer 2602 electrically and mechanically coupled to pads (not labeled) on a first circuit board 2672 and a second circuit board 2674, a second interposer 2604 electrically and mechanically coupled to pads (not labeled) on the first circuit board 2672 and the second circuit board 2674, and a third interposer 2606 electrically and mechanically coupled to pads (not labeled) on the first circuit board 2672 and the second circuit board 2674.

To prevent the solder bumps from oxidizing and/or to prevent solder "bridges" from forming between adjacent solder bumps during the soldering operation, the circuit board assembly 2670 may include several solder resist layers. For example, the circuit board assembly 2670 may include a first solder resist layer 2622 between the first interposer 2602 and the second interposer 2604, and a second solder resist layer 2624 between the second interposer 2604 and the third interposer 2606. Based on their locations, the first solder resist layer 2622 may prevent solder bridges from forming between the first interposer 2602 and the second interposer 2604 (thereby preventing undesired electrical coupling between the first interposer 2602 and the second interposer 2604), and the second solder resist layer 2624 may prevent solder bridges from forming between the second interposer 2604 and the third interposer 2606 (thereby preventing undesired electrical coupling between the second interposer 2604 and the third interposer 2606). In addition, the first and second solder resist

layers

2622 and 2624 may provide a support structure that maintains a desired distance or spacing between the first and

second circuit boards

2672 and 2674. In addition, in order to hold the first and

second circuit boards

2672 and 2674, both the first and

second circuit boards

2672 and 2674 may be clipped onto ends of the first and second solder resist

layers

2622 and 2624. The interposer, solder joint, and solder mask may represent several additional interposers, solder joints, and solder masks, respectively.

Fig. 39 illustrates an isometric view of an embodiment of an audio module 2700 according to some described embodiments. The audio module 2700 may be used in place of the first audio module 182 (shown in fig. 4). The audio module 2700 may be used as a receiver module designed to generate acoustic energy in the form of audible sound. Generally, receiver modules are used in low power applications associated with relatively low frequency outputs. However, the audio module 2700 may include modifications to the enhanced audio performance associated with the audio speaker module.

The audio module 2700 may include an audio module housing 2702 having an audio module opening 2704. The audio module housing 2702 may define an interior acoustic cavity that is divided into a front cavity and a rear cavity. This will be shown below. The audio module housing 2702 may carry a diaphragm 2706 or membrane designed to vibrate to produce acoustic energy in the form of audible sound. Thus, the diaphragm 2706 may be referred to as a membrane or an acoustic membrane. This diaphragm 2706 may include additional thickness to handle additional vibrational energy (associated with additional power provided to audio module 2700), and thus additional audio frequencies. Additionally, audio module opening 2704 may represent a single unmodified opening in audio module housing 2702 and any other openings in audio module housing 2702 (e.g., for wiring and electrical communication) may be air-tight and liquid-tight. In this regard, during changes in air pressure within the electronic device (not shown), the diaphragm 2706 may be protected from undesired vibrations that may result from air entering the audio module housing 2702. This will be further explained below. Additionally, in some embodiments, the membrane 2706 comprises a liquid-resistant membrane (or liquid-resistant film) designed to withstand damage due to exposure to liquids, such as water.

Fig. 40 illustrates a cross-sectional view of the audio module 2700 shown in fig. 39 taken along line D-D in fig. 39, which illustrates several internal features of the audio module 2700. As shown, the audio module 2700 includes a voice coil 2708 and a magnet 2710. The voice coil 2708 is designed to receive an alternating current to form an electromagnet having alternating magnetic polarities. This alternating magnetic polarity may cause the sound coil to vibrate based on interaction (attraction and repulsion) with the external magnetic field of the magnet 2710.

The diaphragm 2706 is positioned within the audio module housing 2702 and divides the acoustic cavity (defined in part by the audio module housing 2702) into a front cavity 2720 and a rear cavity 2722. As shown, the front cavity 2720 can open into the audio module opening 2704, while the rear cavity 2722 is sealed from the audio module opening 2704. Additionally, when audio module 2700 is positioned in electronic device 100 (shown in fig. 1), audio module housing 2702 can seal the components of audio module 2700 from the air in electronic device 100 so that, for example, diaphragm 2706 is not affected by acoustic actuation or other means of air pressure changes in electronic device 100. As shown, the front chamber 2720 and the back chamber 2722 may be shielded from pressure changes in the electronic device 100. However, when the diaphragm 2706 vibrates to create acoustic energy, the acoustic energy exits the audio module opening 2704. Additionally, in some embodiments, audio module 2700 includes air ports 2730 that allow air (in the manner air enters audio module opening 2704) to enter rear cavity 2722 and exit rear cavity 2722 to audio module opening 2704 so that rear cavity 2722 can equalize with the ambient air as the air pressure of the outside ambient air changes. Additionally, although audio module 2700 may replace first audio module 182 (shown in fig. 4), audio module 2700 may include different designs and shapes such that audio module 2700 may also replace second audio module 184 (shown in fig. 4).

Fig. 41 shows a cross-sectional view of electronic device 100 showing audio module 2700 positioned in electronic device 100. As shown, the audio module 2700 and, in particular, the audio module opening 2704 is aligned with at least one of the openings 134 (both shown in fig. 1). Additionally, the mesh material 2724 can cover the opening 134 and provide an aesthetic finish. Additionally, in some embodiments, the audio module 2700 is equipped with a stand 2726. The support 2726 may be secured to the audio module 2700 with an adhesive 2728, which may include a liquid-resistant adhesive to prevent liquid from entering the electronic device 100 around the support 2726. Additionally, the bracket 2726 may include a sealing element 2732 that is positioned between the audio module 2700 and the bracket 2726 to form an access barrier between the audio module 2700 and the bracket 2726. As such, audio module 2700 is positioned in electronic device 100 such that any liquid entering opening 134 may extend into front cavity 2720, but not into rear cavity 2722. Additionally, any air entering opening 134 may extend into both anterior chamber 2720 and posterior chamber 2722, where the posterior chamber receives air using air port 2730. Air port 2730 may also allow air to exit posterior chamber 2722. Thus, the audio module 2700 can provide acoustic energy while preventing liquids from entering the electronic device 100. Additionally, acoustic energy generated by the diaphragm 2706 can exit the audio module 2700 via the audio module opening 2704 and can also exit the electronic device 100 via the opening 134.

Additionally, as shown in fig. 41, audio module 2700 can be positioned in electronic device 100 such that audio module opening 2704 is exposed only to ambient air (external to electronic device 100) that enters electronic device 100 through opening 134. In other words, the audio module housing 2702 is sealed in a manner such that internal cavity changes that cause air pressure changes in the electronic device 100 by, for example, pressing the first protective layer 104 and the display assembly 102, will not cause air to enter the audio module housing 2702, thereby preventing the diaphragm 2706 from generating undesirable acoustic noise.

Fig. 42 illustrates an exploded view of a heat distribution assembly 190 according to some described embodiments. The heat distribution assembly 190 may include several layers of materials that not only provide enhanced heat transfer characteristics, but also provide structural support. Enhanced heat transfer characteristics and structural support may be useful in the following situations: the thermal distribution assembly 190 is used in electronic devices having a substantially non-metallic exterior and thus reduced heat transfer capabilities, such as the electronic device 100 having the second protective layer 144 (shown in fig. 2). In this regard, the thermal distribution assembly 190 can be used in an electronic device to direct thermal energy away from a non-metallic bottom wall toward another structural feature of the electronic device, such as the aforementioned side wall member.

As shown, the heat distribution assembly 190 may include several layers of material. For example, the thermal distribution assembly 190 may include a first layer 2802 formed from a first type of material, which may include a durable material, such as stainless steel. The first layer 2802 can include a bottom wall 2812, and first and

second sidewalls

2822 and 2824, both of which extend from the bottom wall 2812 in a perpendicular, or at least substantially perpendicular, manner. When assembled in the electronic device 100 (shown in fig. 1 and 2), the thermal distribution assembly 190, and in particular the first layer 2802, is thermally coupled to one or more heat generating components in the electronic device 100. At least one of the bottom wall 2812, the first side wall 2822, and the second side wall 2824 can include a contact surface in direct thermal contact with, or at least thermally coupled to, a heat-generating component in the electronic device. This will be shown below.

The thermal distribution assembly 190 may also include a second layer 2804 designed to engage and thermally couple to the first layer 2802. The second layer 2804 can include a bottom wall 2814, and first and

second sidewalls

2832 and 2834, both of which extend from the bottom wall 2814 in a perpendicular, or at least substantially perpendicular, manner. When the thermal distribution assembly 190 has been assembled, the bottom wall 2814, the first side wall 2832, and the second side wall 2834 of the second layer 2804 may engage the bottom wall 2812, the first side wall 2822, and the second side wall 2824, respectively, of the first layer 2802. Additionally, the second layer 2804 can be formed from a second type of material, which can include a material having a relatively higher thermal conductivity (as compared to the first type of material of the first layer 2802), such as copper or graphite. In this regard, the second layer 2804 is designed to redistribute, redirect, or otherwise spread thermal energy away from heat generating components (not shown) in the electronic device when the heat generating components are thermally coupled with the thermal distribution assembly 190. The second layer 2804 can receive thermal energy from the first layer 2802 when the first layer 2802 receives thermal energy from one or more heat-generating components. At least one of the bottom wall 2816, the first sidewall 2842, and the second sidewall 2844 can include a contact surface in direct thermal contact with, or at least thermally coupled to, the second layer 2804.

Additionally, the thermal distribution assembly 190 may include a third layer 2806 that combines with the first layer 2802 and enhances the structural support and rigidity of the thermal distribution assembly 190. Thus, the third layer 2806 can be formed from a third type of material that is, in some cases, the same or similar to the first type of material of the first layer 2802. The third layer 2806 can include a bottom wall 2816, and first and

second sidewalls

2842 and 2844, both of which extend from the bottom wall 2816 in a perpendicular, or at least substantially perpendicular, manner. When the thermal distribution assembly 190 has been assembled, the bottom wall 2816, the first side wall 2842, and the second side wall 2844 of the third layer 2806 may engage the bottom wall 2814, the first side wall 2832, and the second side wall 2834, respectively, of the second layer 2804. Additionally, when the thermal distribution assembly 190 is positioned in the electronic device 100 (shown in fig. 1 and 2), the first and

second sidewalls

2842 and 2844 of the third layer 2806 may be engaged and thermally coupled to the third and

fourth sidewall members

116 and 118, respectively (shown in fig. 1). In this manner, heat distribution assembly 190 may be thermally coupled to portions of ribbon 110 (shown in fig. 1 and 2). At least one of the bottom wall 2814, the first sidewall 2832, and the second sidewall 2834 can include a contact surface in direct thermal contact with, or at least thermally coupled to, the first layer 2802.

Based on the aforementioned material composition of the thermal distribution assembly 190, the second layer 2804 may include heat transfer characteristics that are different from the heat transfer characteristics of the first layer 2802 and the third layer 2806. For example, the second layer 2804 can be formed from a material having a relatively higher thermal conductivity than the one or more materials forming the first layer 2802 and the third layer 2806. In addition, the first layer 2802 and the third layer 2806 can be formed of a material having relatively higher durability or stiffness than the material forming the second layer 2804.

To assemble the heat distribution assembly 190 with layers of different material combinations, the various layers may undergo a cladding operation designed to bond the layers together. The coating operation may include placing each layer of material on a separate roller and then laminating the layers together as they pass through the roller. The stitching effect can form molecular bonds between molecules of the metal. It should be noted that the cladding operation may be used when the second layer 2804 comprises copper. When the second layer 2804 comprises graphite, a different assembly operation may be used. As will be shown and discussed below. Additionally, the first layer 2802 and the third layer 2806 can provide support for the second layer 2804 when the thermal distribution assembly 190 is assembled, and can also provide some structural support for an electronic device (not shown) carrying the thermal distribution assembly 190. Although the second layer 2804 is primarily for heat transfer, the first layer 2802 and the third layer 2806 may also provide at least some heat transfer capability. Additionally, while the first layer 2802 and the third layer 2806 are primarily for structural support, the second layer 2804 may also provide at least some structural support.

Fig. 43 illustrates a partial cross-sectional view of the electronic device 100 shown in fig. 1, showing the heat distribution assembly 190 positioned in the electronic device 100. For illustrative purposes, some components of the electronic device 100 are removed. As shown, thermal distribution assembly 190 may be in direct thermal contact or at least thermally coupled with circuit board assembly 170 such that heat generated from one or more operational components of circuit board assembly 170 may be transferred from circuit board assembly 170 to at least some layers of thermal distribution assembly 190. For example, as shown in the first enlarged view 2850, a thermal energy flow (represented by dashed lines with arrows) or heat flow generated from operational components of the circuit board assembly 170 may pass through the first layer 2802 to the second layer 2804. As shown, the contact surface (bottom wall 2812, labeled in fig. 42) of the first layer 2802 is in thermal contact with the circuit board assembly 170. Additionally, due in part to the relatively high thermal conductivity of the second layer 2804 (compared to the third layer 2806), thermal energy tends to extend through the first layer 2802 and perpendicular, or at least partially perpendicular, to the first layer 2802, and continue through the second layer 2804 without passing through the third layer 2806. As further shown, the flow of thermal energy moves parallel, or at least partially parallel, with respect to the contact surface (bottom wall 2814, labeled in fig. 24) of the second layer 2804. Accordingly, the relatively low thermal conductivity of the third layer 2806 may prevent thermal energy build-up (also referred to as hot spots) at one or more locations near the second protective layer 144. As will be discussed further below.

Additionally, as shown in fig. 43, the heat distribution assembly 190 may be designed to engage the band 110. For example, as shown in the second enlarged view 2852, the contact surface of the first sidewall 2842 of the third layer 2806 of the thermal distribution assembly 190 can engage the third sidewall member 116 of the band 110. Accordingly, third layer 2806 can be in direct thermal contact or at least thermally coupled to third side wall member 116. The second layer 2804 can distribute or redirect thermal energy to the third layer 2806, and in particular, from the first sidewall 2832 of the second layer 2804 to the first sidewall 2842 of the third layer 2806, such that thermal energy is distributed to the third sidewall member 116 where it can then be dissipated from the third sidewall member 116 to ambient air. The thermal distribution assembly 190 may also engage the fourth sidewall member 118 of the band 110 such that the thermal distribution assembly 190 may distribute heat to the fourth sidewall member 118 in a manner similar to the third sidewall member 116 (i.e., through the sidewalls of the second and

third layers

2804 and 2806, shown in fig. 42). As such, at least one of the sidewall members, which is a distributed heat sink that prevents heat generated by circuit board assembly 170 from being trapped at or near second protective layer 144, must prevent the formation of hot spots.

In addition, the thermal distribution assembly 190 may prevent or limit the second protective layer 144 from receiving thermal energy generated from operating components of the circuit board assembly 170 because the third layer 2806 provides a minimum thermal conductivity compared to the second layer 2804 such that thermal energy in the electronic device 100 is carried primarily by the second layer 2804. In this regard, the second layer 2804 may define a thermal path or primary thermal path for thermal energy generated by the operational components of the circuit board assembly 170. Although fig. 43 shows the thermal distribution assembly 190 receiving heat from one or more operating components of the circuit board assembly 170, it should be noted that the thermal distribution assembly 190 may receive heat from any heat generating component of the electronic device 100 that is thermally coupled to the thermal distribution assembly 190. In addition, the heat distribution assembly 190 may provide a rigid support structure for supporting the second protective layer 144. For example, the first layer 2802 and the third layer 2806 of the thermal distribution assembly 190 can extend across a major surface of the second protective layer 144, as shown in fig. 43.

Fig. 44 illustrates a side view of an alternative embodiment of a thermal distribution assembly 2900 according to some described embodiments. The thermal distribution assembly 2900 may include any one or more materials and/or one or more features previously described for the thermal distribution assembly. The thermal distribution assembly 2900 may include a first layer 2902, a second layer 2904 (shown as a dashed line), and a third layer 2906, where the second layer 2904 is embedded between the first layer 2902 and the third layer 2906. As shown, second layer 2904 may be completely covered by first layer 2902 and third layer 2906. This may prevent second layer 2904 from moving or shifting relative to first layer 2902 and/or third layer 2906. However, it should be noted that second layer 2904 may still receive heat through first layer 2902 and/or third layer 2906.

Figure 45 illustrates an isometric view of an alternative embodiment of a thermal distribution assembly 3000 according to some such embodiments, showing the thermal distribution assembly 3000 modified to receive a component 3010. The heat distribution assembly 3000 may include any one or more of the materials and/or one or more features previously described for the heat distribution assembly. As shown, the heat distribution assembly 3000 can include a first layer 3002, a second layer 3004, and a third layer 3006, with the second layer 3004 being embedded between the first layer 3002 and the third layer 3006.

However, the second layer 3004 may be modified to reduce the size of the heat distribution assembly 3000. For example, a portion of the second layer 3004 may be locally removed at a desired location such that a portion of the heat distribution assembly 3000 includes only the first layer 3002 and the third layer 3006, thereby (locally) reducing the size of the heat distribution assembly 3000 without the second layer 3004. Due to the reduced size, the thermal distribution assembly 3000 may include a first channel 3012 that receives the component 3010. The heat distribution assembly 3000 can also include a second channel 3014 that can receive a second component (not shown). It should be noted that the locations of the first and

second channels

3012 and 3014 correspond to locations where the second layer 3004 is not present. However, any one or more components secured with the thermal distribution assembly 3000 at the first channel 3012 and/or the second channel 3014 can be thermally coupled to the second layer 3004 such that thermal energy generated by the one or more components can be pumped from the one or more components to the second layer 3004.

By way of non-limiting example, the component 3010 can be secured to the heat distribution assembly 3000 by welding, soldering, or adhering (by an adhesive). In addition, the dimensions of the first channel 3012 allow the component 3010 to be positioned in the thermal distribution assembly 3000 such that the component 3010 is at least co-planar with respect to the first layer 3002 and in some cases is slightly embedded. It should be noted that the second passageways 3014 can be sized to allow a second component (not shown) to be positioned in the thermal distribution assembly 3000 such that the second component is at least coplanar with respect to the third layer 3006 and in some cases slightly inset. Additionally, as a non-limiting example, the component 3010 may represent one or more components, such as the aforementioned heat generating components, audio modules, brackets, or joints. Alternatively, the component 3010 can include a thermally conductive layer designed to receive (and thereby dissipate) thermal energy from the thermal distribution assembly 3000.

Fig. 46 illustrates an isometric view of an alternative embodiment of a thermal distribution assembly 3100 in accordance with some such embodiments. The thermal distribution assembly 3100 may include any one or more of the materials and/or one or more features previously described for the thermal distribution assembly. As shown, the thermal distribution assembly 3100 can include a first layer 3102, a second layer 3104, and a third layer 3106, where the second layer 3104 is positioned between the first layer 3102 and the third layer 3106.

In some embodiments, the second layer 3104 comprises a metal, such as copper. In the embodiment shown in fig. 46, the second layer 3104 comprises graphite. To bond the second layer 3104 with the first layer 3102 and the third layer 3106, the thermal distribution assembly 3100 may undergo a welding operation. For example, as shown in fig. 46, thermal distribution assembly 3100 includes a number of welds, such as a first weld 3112 and a second weld 3114, both of which represent a number of welds located between first layer 3102 and second layer 3104. Additionally, the thermal distribution assembly 3100 can include several welds, represented by third weld 3116, between the third layer 3106 and the second layer 3104. By welding the second layer 3104 together with the first layer 3102 and the third layer 3106, the second layer 3104 can resist shear forces that would otherwise displace the second layer 3104 relative to the first layer 3102 and the third layer 3106, particularly when the second layer 3104 comprises a particulate material such as graphite.

Fig. 47 illustrates a flow diagram 3200 showing a method for forming a display assembly of an electronic device, according to some described embodiments. The electronic device may comprise a portable electronic device, such as a mobile wireless communications device including a smartphone or wearable electronic device.

In step 3202, a display layer is positioned between the touch-sensitive layer and the force-sensitive layer. The touch sensitive layer is configured to detect a touch input that controls the electronic device. The force-sensitive layer is configured to detect a magnitude of a force applied to the touch-sensitive layer. Each of the display layer, the touch-sensitive layer, and the force-sensitive layer may include an edge region that includes at least one connector. Further, some edge regions having one or more connectors may be perpendicular or parallel to other edge regions. For example, the touch sensitive layer may comprise edge regions with connectors and the display layer may comprise edge regions with connectors, wherein the aforementioned edge regions are parallel or at least substantially parallel with respect to each other. Additionally, the touch sensitive layer may include an edge region that includes the connector. However, the edge regions of the force-sensitive layer may be perpendicular, or at least substantially perpendicular, with respect to the edge regions of the display layer and/or the edge regions of the touch-sensitive layer.

In step 3204, the display layer is bent such that the display layer is at least partially bent around the force-sensitive layer. In some cases, the display layer is pre-curved. In addition, the edge region (carrying the connectors) of the display may be separated from the main part of the display layer. The major portion of the display layer refers to a surface defining a majority of the display layer, while the minor portion of the display layer refers to a portion separated from the major portion by a bend. The edge portion with the connector may be positioned on or carried by the secondary portion.

Fig. 48 illustrates a flow diagram 3300 showing a method for forming a battery assembly for an electronic device, in accordance with some described embodiments. The battery assembly may be used to provide electrical current to several internal components (such as integrated circuits, audio modules, cameras, lighting elements, etc.) positioned in the electronic device.

In step 3302, a housing is provided. The housing is designed to provide a housing for several components of the battery. The housing may include a first cover element that seals together after the component is positioned between the first cover element and the second cover element. Additionally, the housing may take one of several different shapes. In this regard, the housing may include an L-shaped configuration, an I-shaped configuration, or a C-shaped configuration (as non-limiting examples) based on the shape of the electrodes and separator. Further, any of the foregoing configurations may include an opening or through-hole designed to receive or provide space for an internal component of an electronic device.

In step 3304, a plurality of electrodes are inserted into the housing. The plurality of electrodes may include a plurality of anode pairs and cathode pairs. In addition, each pair of electrodes is separated by a separator that physically isolates the pair of electrodes from each other while still allowing charge to flow between the pair of electrodes. In addition, each electrode may undergo a die cutting operation to form the electrode in a particular size and shape. The size and shape may include a size and shape according to the housing. In this regard, as a non-limiting example, each electrode of the electrode pair may include an L-shape, a C-shape, or an I-shape. Further, when the housing includes openings, each separator and each electrode of the electrode pair can include the aforementioned openings to provide a through hole in the battery assembly.

In step 3306, a channel is formed in the housing. The passage may define a reduced dimension in the housing. In this regard, the housing may (substantially) comprise a first height. However, at a location corresponding to the channel, the housing may include a second height that is less than the first height. The channel is designed to thin the profile of the battery assembly so that additional components (such as a flexible circuit) can easily pass over the battery along the channel. In this regard, the channel may allow for repositioning of the additional component in the electronic device. However, the housing of the battery may still receive a component, such as a circuit board, at a location corresponding to (or within) the channel.

Fig. 49 illustrates a flow diagram 3400 showing a method for forming a circuit board assembly, according to some described embodiments. The circuit board assembly is designed to carry several operating components. The circuit board assembly may include a stacked configuration in which a first circuit board is stacked with a second circuit board, or alternatively the second circuit board is overlaid by the first circuit board. The stacked configuration may reduce the overall space (in multiple dimensions) occupied by the circuit board assembly when positioned in a housing or case of an electronic device.

In step 3402, a first circuit board is provided. The first circuit board may include a first operating member. The first operating member includes a recess. Additionally, the first circuit board may include multiple (opposing) surfaces, wherein each surface is designed to carry multiple operational components, some of which are in electrical communication with each other through metal traces and/or vias.

In step 3404, the second circuit board is secured with the first circuit board such that the first circuit board overlies the second circuit board. The second circuit board may include a second operating member having a protruding portion.

In step 3406, the protrusion of the second operating member is positioned (or at least partially positioned) in the recess. Thus, the first operating member "mates" with the second operating member via the recess and the protrusion. This can reduce the gap between the first circuit board and the second circuit board because the first operating member and the second operating member are positioned closer to each other, as opposed to operating members that cannot be mated to each other. Accordingly, the circuit board assembly may include a thinner profile and occupy less space in the electronic device.

Fig. 50 illustrates a flow diagram 3500 that illustrates a method for assembling an electronic device that includes a housing defining an interior cavity, in accordance with some described embodiments. The housing may include a through-hole to the internal cavity. In step 3502, an audio module is disposed in the interior cavity. The audio module may include an audio module housing carrying a diaphragm. The audio module may also include an audio module opening formed in the audio module housing and aligned with the through-hole. Additionally, the audio module housing may have no additional openings other than the audio module opening, or alternatively, may include one or more openings covered by a gas-impermeable and liquid-impermeable seal such that the audio module housing defines an acoustic cavity (including a front cavity and a rear cavity) that remains separate from air within the interior cavity defined by the housing.

In step 3504, a bracket is positioned around a portion of the audio module housing. For example, the bracket may at least partially surround a portion of the audio module housing associated with the audio module opening, thereby providing additional support to the audio module housing. In addition, the bracket may be adhesively secured to the housing at or near the through hole. The adhesive used to secure the bracket to the housing may include a liquid-resistant adhesive.

At step 3506, a sealing element seals the carrier from the housing at the through hole. The sealing element may be positioned between the bracket and the housing and may also engage the bracket and the housing. In this regard, the audio module housing may be sealed from the air in the interior cavity and the diaphragm may be sealed from the air in the interior cavity. In addition, the audio module housing is positioned and designed to receive air from or exhaust air to an external environment external to the electronic device, such as air entering the through-hole. Additionally, the audio module may use the diaphragm to emit acoustic energy out of the audio module opening and through-hole.

Fig. 51 illustrates a flow diagram 3600 showing a method for making a heat distribution assembly for removing thermal energy from a heat-generating component located in an electronic device having a housing sidewall, in accordance with some described embodiments. The heat distribution assembly is designed to provide structural support to the electronic device, particularly when the bottom glass wall coupled to the side walls of the housing defines a housing of the electronic device.

In step 3602, the first layer and the second layer are secured together. The first layer can include a first bottom wall and a first sidewall extending from the first bottom wall. The second layer may include a second bottom wall joined to the first bottom wall. Additionally, the second layer may further include a second sidewall extending from the second bottom wall and joining the first sidewall. In some cases, the first layer comprises a first type of material, such as steel (including stainless steel), in order to provide structural support. Additionally, in some cases, the second layer comprises a second type of material, such as copper or graphite, designed to enhance the thermal conductivity of the heat distribution assembly. Additionally, the first layer and the second layer may each include additional sidewalls.

In step 3604, the third layer is secured with the second layer. The third layer may include a third bottom wall joining the second bottom wall. The third layer may also include a third sidewall extending from the third bottom wall and joining the second sidewall and the housing sidewall. The third layer may comprise a third type of material, such as steel (including stainless steel). In this regard, the third layer may be combined with the first layer to provide additional structural support. In addition, the first and third layers may completely cover the second layer such that the second layer is hidden by the first and third layers.

The first layer is designed to distribute thermal energy from the heat-generating component to the second layer when the thermal distribution assembly has been assembled and positioned in the electronic device. In addition, the second layer is designed to distribute thermal energy in various locations of the second layer so that the thermal energy reaches the third layer and can be distributed to the housing side walls.

Various aspects, embodiments, implementations, or features of the described embodiments may be used alone or in any combination. Various aspects of the described implementations may be implemented in software, hardware, or a combination of hardware and software. The embodiments may also be embodied as computer readable code on a computer readable medium for controlling a production operation or as computer readable code on a computer readable medium for controlling a production line. The computer readable medium is any data storage device that can store data which can thereafter be read by a computer system. Examples of the computer readable medium include read-only memory, random-access memory, CD-ROMs, HDDs, DVDs, magnetic tape, and optical data storage devices. The computer readable medium can also be distributed over network coupled computer systems so that the computer readable code is stored and executed in a distributed fashion.

In the description above, for purposes of explanation, specific nomenclature is used to provide a thorough understanding of the embodiments. It will be apparent, however, to one skilled in the art that these specific details are not required in order to practice the embodiments. Thus, the foregoing descriptions of specific embodiments described herein are presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the above teaching.

Claims

1. A display assembly for an electronic device, the display assembly comprising:

a touch-sensitive layer capable of detecting touch inputs capable of controlling the electronic device;

a force-sensitive layer capable of detecting a magnitude of a force applied to the touch-sensitive layer; and

a display layer capable of presenting visual information, the display layer positioned at least partially between the touch-sensitive layer and the force-sensitive layer, wherein the display layer is bent at least partially around the force-sensitive layer to define a bend such that the force-sensitive layer is positioned at least partially between a first region of the display layer and a second region of the display layer.

2. The display assembly of claim 1, wherein:

the display layer includes a first edge region having a first connector capable of electrically and mechanically coupling with a first flexible circuit,

the force-sensitive layer includes a second edge region having a second connector capable of electrically and mechanically coupling with a second flexible circuit, and

the first edge region is perpendicular relative to the second edge region.

3. The display assembly of claim 2, wherein the touch sensitive layer includes a third edge region having a third connector that can be electrically and mechanically coupled to a third flexible circuit, wherein the third edge region is perpendicular relative to the second edge region.

4. The display assembly of claim 3, wherein the first edge region is parallel relative to the third edge region.

5. The display assembly of claim 1, wherein the display layer comprises a folded organic light emitting diode display.

6. An electronic device, comprising:

a protective layer formed of a transparent material;

a display assembly covered by the protective layer, the display assembly comprising:

a force sensitive layer capable of detecting the amount of force applied to the protective layer, and

a display layer disposed over the force-sensitive layer, wherein the display layer is bent at least partially around the force-sensitive layer defining a bend such that the force-sensitive layer is positioned at least partially between a first region of the display layer and a second region of the display layer; and

a frame carrying the protective layer, the frame comprising a recess at least partially receiving the display layer at the bend.

7. The electronic device of claim 6, further comprising:

a touch sensitive layer positioned over the display layer, the touch sensitive layer detecting touch inputs through the protective layer, the touch sensitive layer including a connector; and

a flexible circuit coupled to the touch-sensitive layer at the connector, the flexible circuit wrapping around the display layer and the force-sensitive layer, wherein the notch receives at least a portion of the flexible circuit.

8. The electronic device of claim 6, wherein:

the display layer includes a first edge region having a first connector electrically and mechanically coupled to a first flexible circuit,

the force-sensitive layer includes a second edge region having a second connector electrically and mechanically coupled to a second flexible circuit, and

the first edge region is perpendicular relative to the second edge region.

9. The electronic device defined in claim 8 further comprising a strap that is formed from metal, the strap comprising a first portion and a second portion, wherein the first connector is closer to the first portion than the second connector, and wherein the second connector is closer to the second portion than the first connector.

10. The electronic device defined in claim 9 wherein the band further comprises a third portion and a fourth portion and wherein the first, second, third, and fourth portions are electrically isolated from one another.

11. The electronic device defined in claim 8 further comprising a touch-sensitive layer, wherein the touch-sensitive layer comprises a third edge region that has a third connector that is electrically and mechanically coupled to a third flex circuit, wherein the third edge region is perpendicular relative to the second edge region.

12. The electronic device of claim 11, wherein the first edge region is parallel with respect to the third edge region.

13. The electronic device of claim 8, further comprising:

a support element embedded in the frame, the support element extending from the frame; and

an adhesive between the support element and the force-sensitive layer, the adhesive securing the first flexible circuit and the support element together.

14. The electronic device of claim 13, wherein the second flexible circuit is adhesively secured with the support element by a second adhesive.

15. The electronic device defined in claim 6 wherein the frame comprises a second recess and wherein the protective layer comprises an extension that is positioned in the second recess.

16. A method for forming a display assembly for an electronic device, the method comprising:

positioning a display layer between a touch-sensitive layer configured to detect touch inputs that control the electronic device and a force-sensitive layer configured to detect an amount of force applied to the touch-sensitive layer; and

bending the display layer such that the display layer at least partially bends around the force-sensitive layer and the force-sensitive layer is at least partially positioned between a first region of the display layer and a second region of the display layer.

17. The method of claim 16, wherein:

the first edge region is perpendicular relative to the second edge region.

18. The method of claim 17, wherein the touch sensitive layer includes a third edge region having a third connector capable of electrically and mechanically coupling with a third flex circuit, wherein the third edge region is perpendicular relative to the second edge region.

19. The method of claim 18, wherein the first edge region is parallel relative to the third edge region.

20. The method of claim 16, wherein positioning the display layer comprises positioning a folded organic light emitting diode display between the touch-sensitive layer and the force-sensitive layer.