CN109029236A - It is a kind of to eliminate the engineering structure mechanical strain test method and device that temperature influences - Google Patents
It is a kind of to eliminate the engineering structure mechanical strain test method and device that temperature influences Download PDFInfo
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- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
- G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
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Abstract
The invention discloses a kind of engineering structure mechanical strain test method that elimination temperature influences and devices, it is by the actual strain of discovery engineering structure in addition to construction machine strain, also influenced comprising engineering structure by external constraint or material itself, expansion or shrinkage is caused to deform and can not freely occur, it is strained so as to cause the effective temperature of engineering structure corresponding to engineering structure stress, from there through the relationship of the first strain constructing environment temperature and the first dependent variable of engineering structure when being acted at a temperature of temperature-compensation method acquisition varying environment without external mechanical load；And then measure the actual strain of structure when having mechanical load action under operating ambient temperature；According to unitary variant principle, the first strain of engineering structure strains when being subtracted under corresponding temperature according to the actual strain of engineering structure under operating ambient temperature without the effect of external mechanical load to counteract the effective temperature of engineering structure, obtain the mechanical load strain of engineering structure, to accurately reflect that external mechanical load acts on the influence to structure, be conducive to the Performance Evaluation of engineering structure.
Description
Technical field
The invention belongs to engineering structure mechanical strain testing fields, and in particular to a kind of engineering structure eliminating temperature and influencing
Mechanical strain test method and device.
Background technique
Structural resistance strain testing technology is that resistance strain gage is pasted onto the surface of test structure, guarantees structure and strain
Piece cooperative transformation, the variation by measuring resistance-strain sheet resistance then obtain structure measuring point to extrapolate the strain of structure
The stress intensity at place.However, the resistance value variation with temperature of resistance strain gage sensitive grid changes, strain measurement data
It cannot reflect the actual strain of engineering structure, generally be solved using the method for temperature strain compensation, that is, choose one piece and be tested
The object block for trying the identical material of works, its surface mount is good and the same type of temperature strain compensating plate (structure of working strain gauge
At temperature strain compensation block), and be placed in environment temperature identical with engineering structure working strain gauge to be tested；Benefit
With the connection type of resistance bridge in resistance strain gauge, the temperature strain of working strain gauge is eliminated.
In order to reflect external mechanical load (except self weight and temperature are with the external load) influence of effect to structure in engineering, need
The mechanical strain of engineering structure is effectively separated from complicated strain composition.Fig. 1 and Fig. 2 is in the prior art respectively
Cantilever beam resistor straining testing arrangement schematic diagram and temperature strain in the prior art compensation 1/4 bridge of Hui Sidun circuit signal
Figure.As shown in Figure 1, the end square equal cross-section beam AB, A of a length of l is fixed, the end B and another stationary plane distance δ.It is viscous in the bottom surface of beam
A resistance-strain active gage Y1 is pasted, in the temperature strain compensation block that it closes on one sticking temperature compensating plate Y2 of placement.Active gage Y1
1/4 bridge circuit shown in Fig. 2 is just formed with compensating plate Y2.When environment temperature increases Δ T (homogeneous temperature field is formed, and is not had
Have external force), beam AB extends δ (δ < α Δ Tl), at this point, the temperature strain of beam AB is ε1=δ/l, and temperature compensation block is free
Expansion, temperature rise strain are ε2=α Δ T (the wherein thermal expansion coefficient that α is material).Due to the effect of binder, foil gauge with
Structural coordination deforms, then the corresponding strain stress of working strain gauge Y11The corresponding strain stress of=δ/l, temperature-compensating foil gauge Y22=α Δ
T.Finally, the strain stress=ε obtained by resistance strain gauge measurement1-ε2=δ/l- α Δ T, the strain are that temperature causes structure to generate
The effective temperature of engineering structure corresponding to stress strains, however engineering structure is tied there is no the effect of external mechanical load
Structure mechanical strain is 0, and existing resistor straining testing technique described above can not be removed from acquired structure actual strain
The temperature strain component of structure, existing temperature strain compensation technique cannot accurately obtain the mechanical strain of engineering structure.
Patent document CN10319600A discloses a kind of mathematics temperature-compensation method of strain gauge load cell, the party
Method passes through and applies the load value that standard load obtains load sensor output step by step to load sensor at different ambient temperatures
It with the curve that elastomer temperature changes, is set in temperature adjustmemt module after carrying out numerical fitting to curve, when work, temperature is repaired
Positive module calls curvilinear equation to repair the temperature value of sensor output loads value, the acquired elastomer of thermistor automatically
Just, reach compensation effect.This method needs apply standard load to load sensor under each environment temperature step by step, are only applicable in
In small-scale structure and the little situation of load, in the case of heavy construction structure and big weight bearing, bridge structure is such as measured in vehicle
Strain under load action obtains the curve that the load value of load sensor output changes with different temperatures and infeasible, because
This, needs to seek a kind of mechanical strain test method for being widely used in engineering structure.
Summary of the invention
Aiming at the above defects or improvement requirements of the prior art, it is found by studying existing resistor straining testing technique,
Mainly the temperature strain including structure, construction machine strain and the temperature of working strain gauge is answered for the strain that working strain gauge obtains
Become, the strain that dummy gauge obtains mainly includes the temperature strain of compensation block and the temperature strain of dummy gauge, this method
The actual strain of obtained engineering structure is strained in addition to construction machine, also comprising engineering structure by external constraint or material itself
Influence, cause expansion or shrinkage deform and can not freely occur, so as to cause engineering knot corresponding to engineering structure stress
The effective temperature of structure strains, and the temperature strain that value is equal to compensation block subtracts the temperature strain of engineering structure.In order to accurately reflect
External mechanical load acts on the influence to structure, obtains the mechanical strain of mechanical load flowering structure, it is necessary to eliminate existing temperature and mend
Repay the effective temperature strain in rear engineering structure actual strain.
The engineering when present invention at a temperature of existing temperature-compensation method acquisition varying environment without external mechanical load by acting on
First strain of structure, and then measure the actual strain of engineering structure when having mechanical load action under operating ambient temperature, foundation
Unitary variant principle subtracts under corresponding temperature according to the actual strain of engineering structure under operating ambient temperature without external mechanical load
The first strain of engineering structure strains when effect to counteract the effective temperature of engineering structure, obtains the mechanical lotus of engineering structure
Strain is carried, to accurately reflect that external mechanical load acts on the influence to engineering structure, to be conducive to the performance of engineering structure
Assessment.
To achieve the above object, according to one aspect of the present invention, a kind of engineering structure that elimination temperature influences is provided
Mechanical strain test method, specifically comprises the following steps:
S1. the relationship for determining the first dependent variable of environment temperature and engineering structure, i.e., measure nothing by temperature-compensation method
Engineering structure the first dependent variable, and then the environment temperature of building engineering structure at different ambient temperatures under mechanical load state
With the relationship of the first dependent variable；
S2. the environment temperature and corresponding temperature of the engineering structure by temperature-compensation method measurement under with mechanical load
The actual strain amount of lower engineering structure；
S3. the relationship according to environment temperature and the first dependent variable in step S1, determines engineering structure under the environment temperature
The first dependent variable, further calculate in step S2 the actual strain amount of the engineering structure under the environment temperature with mechanical load
With the difference of the first dependent variable of engineering structure at this ambient temperature, which is the institute's engineering knot having under mechanical load
The mechanical strain amount for eliminating temperature influence of structure.
As a further improvement of the present invention, temperature-compensation method in engineering structure by being provided with temperature-compensating plate
Mechanical strain measurement circuit realize.
As a further improvement of the present invention, mechanical strain measurement circuit is whiston bridge circuit, the bridge circuit
Including resistance-strain active gage and temperature-compensating plate, the measuring point surface of engineering structure is arranged in resistance-strain active gage, and temperature is mended
Repay the surface that the compensating plate of material identical as engineering structure is arranged in block, resistance-strain active gage and temperature-compensating plate by favour this
1/4 bridge circuit that pauses connects.
As a further improvement of the present invention, step S1 constructs the environment temperature of engineering structure and the relationship of the first dependent variable
First strain value march of engineering structure when can be according to the temperature value for measuring resulting different moments and without mechanical load
Line fitting is realized.
To achieve the above object, other side according to the invention provides a kind of engineering knot that elimination temperature influences
Structure mechanical strain test device, the device include engineering structure strain testing module, temperature-measuring module and main control module,
In,
Engineering structure strain testing module is used for the first dependent variable and actual strain amount of survey engineering structure, temperature measurement
Module is for the temperature at survey engineering structure measuring point；
Main control module connection engineering structure strain testing module and temperature test module, main control module determine environment temperature
The relationship of degree and the first dependent variable of engineering structure is measured by engineering structure strain testing module without under mechanical loading status
Engineering structure the first dependent variable at different ambient temperatures, and then construct the environment temperature and the first dependent variable of engineering structure
Relationship；
And obtain the engineering knot of temperature-measuring module and the measurement of engineering structure strain testing module under with mechanical load
The actual strain amount of engineering structure under the environment temperature and corresponding temperature of structure；
And then the relationship according to above-mentioned environment temperature and the first dependent variable, determine first of engineering structure under the environment temperature
Dependent variable, the actual strain amount and engineering structure for further calculating the engineering structure under the environment temperature with mechanical load are at this
The difference of the first dependent variable under environment temperature, the difference be there is engineering structure under mechanical load eliminate temperature shadow
Loud mechanical strain amount.
As a further improvement of the present invention, engineering structure strain testing module is provided with temperature-compensating plate to provide
Mechanical strain measurement circuit is realized.
As a further improvement of the present invention, engineering structure strain testing module is provided with measuring bridge, measuring bridge packet
Resistance-strain active gage and temperature-compensating plate are included, the measuring point surface of engineering structure, temperature-compensating is arranged in resistance-strain active gage
The surface of the compensation block of material identical as engineering structure is arranged in piece, and resistance-strain active gage and temperature-compensating plate pass through Hui Sidun
The connection of 1/4 bridge circuit.
As a further improvement of the present invention, engineering structure strain testing module also includes signal amplifier, for amplifying
The test signal of measuring bridge, the measurement data of measuring bridge is accurately read convenient for main control module.
As a further improvement of the present invention, the environment temperature of main control module building engineering structure and the first dependent variable
When relationship can be according to the temperature value for measuring resulting different moments and without mechanical load the first strain value of engineering structure into
Row curve matching is realized.
As a further improvement of the present invention, which further includes data disaply moudle, and data disaply moudle setting connects
Main control module is connect, for showing the calculated result of main control module.
In general, through the invention it is contemplated above technical scheme is compared with the prior art, have below beneficial to effect
Fruit:
The engineering structure mechanical strain test method and device that a kind of elimination temperature of the invention influences, pass through existing temperature
First strain of engineering structure when without the effect of external mechanical load, then, measurement are spent at a temperature of compensation method acquisition varying environment
The actual strain of engineering structure, utilizes engineering knot under the operating ambient temperature when under operating ambient temperature with mechanical load effect
The actual strain of structure subtracts the first strain of engineering structure when without the effect of external mechanical load, to counteract having for engineering structure
Effect temperature strain obtains the mechanical load strain of engineering structure, solves temperature strain compensation in existing resistor straining testing technique
The mechanical strain problem of engineering structure cannot be accurately obtained, can accurately reflect external mechanical load effect to the shadow of engineering structure
It rings, to be conducive to the Performance Evaluation of engineering structure.
The engineering structure mechanical strain test method and device that a kind of elimination temperature of the invention influences, wherein without mechanical lotus
The first strain of engineering structure-environment temperature relationship when load acts on is closed by the first strain-environment temperature of existing engineering structure
Coefficient evidence is obtained by curve matching, can also be introduced directly into obtain by available data, be made full use of existing data, thus
Improve measurement efficiency.
The engineering structure mechanical strain test method and device, engineering structure that a kind of elimination temperature of the invention influences are answered
Become test module and be provided with signal amplifier, is used for measurement by magnification signal convenient for main control module and carries out reading data, with suitable
It is tested for various types of engineering structures.
Detailed description of the invention
Fig. 1 is cantilever beam resistor straining testing arrangement schematic diagram in the prior art；
Fig. 2 is the 1/4 bridge schematic diagram of Hui Sidun circuit of temperature strain compensation in the prior art；
Fig. 3 is the structural representation for the engineering structure mechanical strain test device that the elimination temperature of the embodiment of the present invention influences
Figure；
Fig. 4 is the first strain value of building engineering structure-environment temperature graph of relation of the embodiment of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention.
In addition, as long as technical characteristic involved in the various embodiments of the present invention described below is each other not
Constituting conflict can be combined with each other.The present invention is described in more detail With reference to embodiment.
A kind of engineering structure mechanical strain test method eliminating temperature and influencing, specifically comprises the following steps:
S1. the relationship for determining the first dependent variable of environment temperature and engineering structure, i.e., measure nothing by temperature-compensation method
Engineering structure the first dependent variable, and then the environment temperature of building engineering structure at different ambient temperatures under mechanical load state
With the relationship of the first dependent variable.Specifically: it is measured respectively using temperature-compensation method without engineering structure under mechanical load action not
The first strain value of engineering structure corresponding with the temperature of environment temperature in the same time carries out curve according to corresponding data are measured
Fitting constructs the first strain value of engineering structure εΔTThe relation curve of environment temperature T, and relation curve data are stored in master
The storage unit of control module；For having the engineering structure of related data, the storage unit of main control module can also be direct
Import existing the first strain value of engineering structure εΔTEnvironment temperature T relationship curve, makes full use of existing data, to mention
High measurement efficiency；
S2. the environment temperature and corresponding temperature of the engineering structure by temperature-compensation method measurement under with mechanical load
The actual strain amount of lower engineering structure.Specifically: further being measured by temperature-compensation method has under operating ambient temperature
The environment temperature numerical value T of engineering structure when mechanical load0With corresponding engineering structure actual strain numerical value ε；
S3. the relationship according to environment temperature and the first dependent variable in step S1, determines engineering structure under the environment temperature
The first dependent variable, further calculate in step S2 the actual strain amount of the engineering structure under the environment temperature with mechanical load
With the difference of the first dependent variable of engineering structure at this ambient temperature, which is the institute's engineering knot having under mechanical load
The mechanical strain amount for eliminating temperature influence of structure.Specifically: according to the first strain stress of engineering structure in step S1ΔTEnvironment temperature
T relationship curve is spent, calculating environment temperature is T0When corresponding the first strain stress of engineering structureΔT, finally obtain and eliminate temperature shadow
Loud engineering structure mechanical strain numerical value εF.Wherein,
εF=ε-εΔT (1)
It can accurately reflect that external mechanical load acts on the influence to structure according to engineering structure mechanical strain numerical value, to have
Conducive to the Performance Evaluation of engineering structure.
Based on the resistor straining testing method that above-mentioned elimination temperature influences, a kind of elimination temperature influence is had also been devised in the present invention
Engineering structure mechanical strain test device.Fig. 3 is the engineering structure mechanical strain test dress that elimination temperature of the invention influences
The structural schematic diagram set.As shown in figure 3, the device includes engineering structure strain testing module, temperature-measuring module, master control molding
Block and data disaply moudle.Wherein engineering structure strain testing module includes measuring bridge, and measuring bridge is resistance bridge,
Its connection type is that 1/4 bridging connects, and resistance-strain active gage Y1 is pasted on to the measuring point surface of measured structure, while temperature being mended
It repays piece Y2 to be pasted on compensation block, compensation block and temperature sensor is placed near active gage Y1, so that active gage Y1 and temperature
Compensating plate Y2 is under same environment temperature, connects active gage and temperature-compensating using 1/4 bridging of Hui Sidun circuit as shown in Figure 2
Piece, wherein the working principle of the measuring bridge is as follows: active gage Y1 and compensating plate Y2 just forms 1/4 bridge circuit shown in Fig. 2,
When environment temperature increases Δ T (homogeneous temperature field is formed, and does not have external force), due to the effect of binder, work strain
Piece Y1 and engineering structure compatible deformation, then working strain gauge Y1 corresponds to resistance value and changes, while compensation block free wxpansion, temperature
The corresponding resistance value of dummy gauge Y2 changes, at this point, measuring bridge output strain value, that is, engineering structure first strains
Numerical value εΔT；
Engineering structure strain testing module is additionally provided with signal amplifier, and input terminal connects the output end of measuring bridge,
For the measuring signal of measurement by magnification electric bridge, in order to which main control module carries out reading data.
Temperature-measuring module in the device utilizes temperature sensing for the temperature at survey engineering structural strain measuring point
What device measured is the environment temperature of active gage Y1 and compensating plate Y2；Data disaply moudle is for showing that main control module is calculated
Result；
Wherein, main control module obtains temperature-measuring module and engineering structure strain testing module is measured respectively without mechanical lotus
Load acts on environment temperature the first strain value of engineering structure corresponding with the temperature of lower engineering structure different moments, and foundation measures
Corresponding data carry out curve fitting, and construct the first strain value of engineering structure εΔTThe relation curve of environment temperature T, specifically
Are as follows: it is measured respectively using temperature-measuring module and engineering structure strain testing module without engineering structure difference under mechanical load action
The environment temperature at moment the first strain value of engineering structure corresponding with the temperature constructs engineering knot according to corresponding data are measured
The first strain value of structure-environment temperature relationship, wherein can carry out curve fitting according to corresponding data value is measured, construct work
The first strain value of journey structure εΔTThe relation curve of environment temperature T, and relation curve data are stored in main control module
Storage unit；For having the engineering structure of related data, the storage unit of main control module can also be introduced directly into existing
The first strain value of engineering structure εΔTEnvironment temperature T relationship data, make full use of existing data, to improve measurement effect
Rate.Specific curve-fitting method is as shown in table 1 below:
| Environment temperature T (degree) when no mechanical load action | First strain value εΔT |
| 14.5 | 24 |
| 15.0 | 25 |
| 15.5 | 32 |
| 16.0 | 37 |
| 16.5 | 37 |
| 17.0 | 43 |
| 17.5 | 47 |
| 18.0 | 59 |
| 18.5 | 63 |
Table 1
Fig. 4 is the first strain value of building engineering structure-environment temperature graph of relation of the embodiment of the present invention.Such as figure
4 bases measure corresponding data value and carry out curve fitting, and obtain following relationship:
εΔT=0.0006* (T)3.9646 (2)
It is as shown in Figure 4 to obtain relation curve.
The environment temperature numerical value T of engineering structure when main control module is further measured with mechanical load0And correspondence
Engineering structure actual strain numerical value ε.
The first strain stress stored in storage unit according to above-mentioned main control moduleΔTEnvironment temperature T relationship curve, it is main
It is T that control module, which calculates environment temperature,0When corresponding first strain stressΔT, can be obtained eliminating temperature influence according to formula (1)
Engineering mechanism mechanical strain numerical value εF, while main control module will eliminate the engineering mechanism mechanical strain numerical value ε of temperature influenceF
Data disaply moudle is sent to for showing final calculated result, meanwhile, it can be according to the mechanical strain for eliminating temperature influence
Numerical value carrys out the performance of accurate evaluation engineering structure, and solving temperature strain compensation in existing resistor straining testing technique cannot be accurate
The mechanical strain problem of engineering structure is obtained, to be conducive to the Performance Evaluation of engineering structure.
It is assumed that taking T0=18.2 °, ε=400, by T0Substitution formula (2), obtains:
εΔT=0.0006* (18.2)3.9646=59.406
By εΔT=59.406 substitute into formula (1), obtain:
εF=ε-εΔT=400-59.406=340.594
The construction machine strain value for eliminating temperature influence is εF=340.594.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include
Within protection scope of the present invention.
Claims (10)
1. a kind of engineering structure mechanical strain test method eliminating temperature and influencing, specifically comprises the following steps:
S1. the relationship for determining the first dependent variable of environment temperature and engineering structure, i.e., measured by temperature-compensation method without machinery
Engineering structure the first dependent variable, and then the environment temperature of the building engineering structure at different ambient temperatures under loading status
With the relationship of the first dependent variable；
S2. by the environment temperature of the engineering structure of the temperature-compensation method measurement under with mechanical load with it is corresponding
At a temperature of engineering structure actual strain amount；
S3. the relationship according to environment temperature and the first dependent variable described in step S1, determines engineering structure under the environment temperature
The first dependent variable, the reality for further calculating in step S2 the engineering structure under the environment temperature with mechanical load answers
The difference of variable and the first dependent variable of engineering structure at this ambient temperature, the difference as have described under mechanical load
The mechanical strain amount for eliminating temperature influence of engineering structure.
2. a kind of engineering structure mechanical strain test method eliminating temperature and influencing according to claim 1, the temperature
Compensation method is realized by being provided with the mechanical strain measurement circuit of temperature-compensating plate in the engineering structure.
3. a kind of engineering structure mechanical strain test method eliminating temperature and influencing according to claim 2, wherein described
Mechanical strain measurement circuit is whiston bridge circuit, which includes resistance-strain active gage and temperature-compensating plate,
The measuring point surface of engineering structure is arranged in resistance-strain active gage, and the benefit of material identical as engineering structure is arranged in temperature-compensating plate
The surface of block is repaid, the resistance-strain active gage is connected with temperature-compensating plate by 1/4 bridge circuit of Hui Sidun.
4. a kind of engineering structure mechanical strain test side for eliminating temperature and influencing according to any one of claim 1 to 3
Method, wherein the relationship of environment temperature and the first dependent variable that step S1 constructs the engineering structure can be resulting not according to measurement
Temperature value in the same time and the first strain value of engineering structure carries out curve fitting realization when without mechanical load.
5. a kind of engineering structure mechanical strain test device eliminating temperature and influencing, which is characterized in that the device includes engineering knot
Structure strain testing module, temperature-measuring module and main control module, wherein
The engineering structure strain testing module is used for the first dependent variable and actual strain amount of survey engineering structure, the temperature
Measurement module is for the temperature at survey engineering structure measuring point；
The main control module connects the engineering structure strain testing module and the temperature test module, the main control module
It determines the relationship of the first dependent variable of environment temperature and engineering structure, i.e., nothing is measured by the engineering structure strain testing module
The first dependent variable of engineering structure at different ambient temperatures under mechanical load state, and then construct the ring of the engineering structure
The relationship of border temperature and the first dependent variable；
And obtain the engineering knot of temperature-measuring module and the measurement of engineering structure strain testing module under with mechanical load
The actual strain amount of engineering structure under the environment temperature and corresponding temperature of structure；
And then the relationship according to above-mentioned environment temperature and the first dependent variable, determine the first strain of engineering structure under the environment temperature
Amount, the actual strain amount and engineering structure for further calculating the engineering structure under the environment temperature with mechanical load are at this
The difference of the first dependent variable under environment temperature, the difference be there is the engineering structure under mechanical load eliminate temperature
Spend the mechanical strain amount influenced.
6. a kind of engineering structure mechanical strain test device eliminating temperature and influencing according to claim 5, wherein described
Engineering structure strain testing module is provided with the mechanical strain measurement circuit realization of temperature-compensating plate to provide.
7. a kind of engineering structure mechanical strain test device eliminating temperature and influencing according to claim 6, wherein described
Engineering structure strain testing module is provided with measuring bridge, and the measuring bridge includes resistance-strain active gage and temperature-compensating
The measuring point surface of engineering structure is arranged in piece, resistance-strain active gage, and temperature-compensating plate is arranged in material identical as engineering structure
Compensation block surface, the resistance-strain active gage connected with temperature-compensating plate by 1/4 bridge circuit of Hui Sidun.
8. a kind of engineering structure mechanical strain test device eliminating temperature and influencing according to claim 7, wherein described
Engineering structure strain testing module also includes signal amplifier, for the test signal of measurement by magnification electric bridge, is convenient for master control molding
Block accurately reads the measurement data of measuring bridge.
9. a kind of engineering structure mechanical strain test dress that elimination temperature influences according to any one of claim 5-8
It sets, wherein the relationship of environment temperature and the first dependent variable that the main control module constructs the engineering structure can be according to measurement
The temperature value of resulting different moments and the first strain value of engineering structure carries out curve fitting realization when without mechanical load.
10. a kind of engineering structure mechanical strain test dress that elimination temperature influences according to any one of claim 5-9
It sets, wherein the device further includes data disaply moudle, data disaply moudle setting connection main control module, for showing master
The calculated result of control module.
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| CN110715854A (en) * | 2019-09-29 | 2020-01-21 | 山东大学 | Temperature effect-considered nonlinear calibration method for tension-sensitive effect of conductive polymer |
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