CN109003765B - Temperature-sensitive resistor and assembling method thereof - Google Patents
Temperature-sensitive resistor and assembling method thereof Download PDFInfo
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- CN109003765B CN109003765B CN201810872508.9A CN201810872508A CN109003765B CN 109003765 B CN109003765 B CN 109003765B CN 201810872508 A CN201810872508 A CN 201810872508A CN 109003765 B CN109003765 B CN 109003765B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
Abstract
The invention relates to a temperature-sensitive resistor, comprising: a wafer-shaped temperature-sensitive resistor chip; the disc-shaped sealing box comprises a circular ring-shaped temperature-sensitive resistor accommodating device, a disc-shaped upper sealing cover and a disc-shaped lower sealing cover; the upper disc-shaped sealing cover seals an upper opening of the circular ring-shaped temperature-sensitive resistor accommodating device; the lower sealing cover is used for sealing the lower opening of the annular temperature-sensitive resistor accommodating device; the annular temperature-sensitive resistor accommodating device comprises an annular main body; the inner side wall of the circular main body is at least provided with three blind holes which are uniformly and annularly distributed; and a temperature-sensitive resistor chip clamping device is arranged in the blind hole. A method for assembling the temperature sensor and the temperature-sensitive resistor is also provided. The temperature-sensitive resistor avoids performance reduction along with time change, and service life is prolonged.
Description
Technical Field
The invention relates to the technical field of electrical devices, in particular to a temperature-sensitive resistor.
Background
The temperature-sensitive resistor is a kind of sensitive element, and is divided into a positive temperature coefficient temperature-sensitive resistor (PTC) and a negative temperature coefficient temperature-sensitive resistor (NTC) according to different temperature coefficients. The temperature-sensitive resistor is typically temperature-sensitive and exhibits different resistance values at different temperatures. A positive temperature coefficient temperature sensitive resistor (PTC) has a higher resistance value at a higher temperature, and a negative temperature coefficient temperature sensitive resistor (NTC) has a lower resistance value at a higher temperature, which are semiconductor devices.
A temperature sensor (temperature sensor) refers to a sensor that senses temperature and converts it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument and has a plurality of varieties. The measurement method can be divided into a contact type and a non-contact type, and the measurement method can be divided into a thermal resistor and a thermocouple according to the characteristics of sensor materials and electronic elements. The negative temperature coefficient temperature-sensitive resistor is adopted for thermal resistor type temperature sensors.
The traditional technology has the following technical problems:
because the temperature-sensitive resistor is exposed outside and contacts with air, the performance of the temperature-sensitive resistor is reduced along with the change of time, and the service life is shortened, so that related devices adopting the temperature-sensitive resistor are also reduced along with the change of time, and the service life is shortened.
Disclosure of Invention
In view of the above, it is necessary to provide a temperature sensitive resistor to avoid performance degradation with time and to improve service life.
A temperature-sensitive resistor comprising:
a wafer-shaped temperature-sensitive resistor chip;
the disc-shaped sealing box comprises a circular ring-shaped temperature-sensitive resistor accommodating device, a disc-shaped upper sealing cover and a disc-shaped lower sealing cover; the upper disc-shaped sealing cover seals an upper opening of the circular ring-shaped temperature-sensitive resistor accommodating device; the lower sealing cover is used for sealing the lower opening of the annular temperature-sensitive resistor accommodating device;
the annular temperature-sensitive resistor accommodating device comprises an annular main body; the inner side wall of the annular main body is provided with six blind holes which are uniformly distributed in an annular shape; a temperature-sensitive resistor chip clamping device is arranged in the blind hole; the temperature-sensitive resistor chip clamping device comprises a clamping spring, a spring limiting sleeve and a temperature-sensitive resistor chip limiting buckle; the temperature-sensitive resistor chip limiting buckle comprises a buckle main body; an arc-shaped clamping groove is formed in the inner side of the buckle main body; the wafer-shaped temperature-sensitive resistor chip is surrounded and clamped by the arc-shaped clamping groove; the upper end and the lower end of the buckle main body are both provided with inclined temperature-sensitive resistor chips which are clamped into the transition blocks; one end of the clamping spring is fixedly connected with the bottom wall of the blind hole, and the other end of the clamping spring is fixedly connected with the outer side of the buckle main body; the spring limiting sleeve sleeves the clamping spring; one end of the spring limiting sleeve is fixedly connected with the outer side of the buckle main body, and when the clamping spring is in a natural state, the other end of the spring limiting sleeve extends into the blind hole and is not in contact with the bottom wall of the blind hole;
the lower end face of the upper disk-shaped copper foil is fixed on the upper end face of the disk-shaped upper sealing cover;
the upper end face of the lower disk-shaped copper foil is fixed on the lower end face of the disk-shaped lower sealing cover;
the upper pin is fixedly connected with the upper end face of the upper disc-shaped copper foil; and
the lower pin is fixedly connected with the lower end face of the lower wafer-shaped copper foil;
the upper end face of the upper disk-shaped copper foil is provided with an upper conductive unit; the upper conductive unit comprises a conductive material upper spring and a conductive material upper conductive block; one end of the upper spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the upper spring is fixedly connected with one end of the upper conductive block; one end of the upper conductive block, which is far away from the upper spring, is electrically connected with the upper end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip;
a lower first through hole is formed in the disc-shaped lower sealing cover, and a lower conductive unit is arranged on the upper end face of the lower disc-shaped copper foil; the lower conductive unit comprises a lower spring made of a conductive material and a lower conductive block made of a conductive material; one end of the lower spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the lower spring is fixedly connected with one end of the lower conductive block; one end of the lower conductive block, which is far away from the lower spring, is electrically connected with the lower end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip.
In another embodiment, the upper pins and the lower pins are distributed in a mirror symmetry manner with respect to the wafer-shaped sealing case or the upper pins and the lower pins are distributed in a mirror symmetry manner with respect to a center of the wafer-shaped sealing case.
In another embodiment, the disc-shaped temperature-sensitive resistor chip is a semiconductor disc-shaped temperature-sensitive resistor chip, a metal disc-shaped temperature-sensitive resistor chip or an alloy disc-shaped temperature-sensitive resistor chip.
In another embodiment, the upper pin is a strip-shaped conductive sheet made of copper.
In another embodiment, the lower lead is a copper strip-shaped conductive sheet.
A temperature sensor comprises a negative temperature coefficient temperature-sensitive resistor; the negative temperature coefficient temperature-sensitive resistor comprises:
a wafer-shaped negative temperature coefficient temperature-sensitive resistor chip;
the disc-shaped sealing box comprises a circular ring-shaped temperature-sensitive resistor accommodating device, a disc-shaped upper sealing cover and a disc-shaped lower sealing cover; the upper disc-shaped sealing cover seals an upper opening of the circular ring-shaped temperature-sensitive resistor accommodating device; the lower sealing cover is used for sealing the lower opening of the annular temperature-sensitive resistor accommodating device;
the annular temperature-sensitive resistor accommodating device comprises an annular main body; the inner side wall of the circular main body is at least provided with three blind holes which are uniformly and annularly distributed; a temperature-sensitive resistor chip clamping device is arranged in the blind hole; the temperature-sensitive resistor chip clamping device comprises a clamping spring, a spring limiting sleeve and a temperature-sensitive resistor chip limiting buckle; the temperature-sensitive resistor chip limiting buckle comprises a buckle main body; an arc-shaped clamping groove is formed in the inner side of the buckle main body; the wafer-shaped temperature-sensitive resistor chip is surrounded and clamped by the arc-shaped clamping groove; at least one end of the upper end or the lower end of the buckle main body is provided with an inclined temperature-sensitive resistor chip clamped into the transition block; one end of the clamping spring is fixedly connected with the bottom wall of the blind hole, and the other end of the clamping spring is fixedly connected with the outer side of the buckle main body; the spring limiting sleeve sleeves the clamping spring; one end of the spring limiting sleeve is fixedly connected with the outer side of the buckle main body, and when the clamping spring is in a natural state, the other end of the spring limiting sleeve extends into the blind hole and is not in contact with the bottom wall of the blind hole;
the lower end face of the upper disk-shaped copper foil is fixed on the upper end face of the disk-shaped upper sealing cover;
the upper end face of the lower disk-shaped copper foil is fixed on the lower end face of the disk-shaped lower sealing cover;
the upper pin is fixedly connected with the upper end face of the upper disc-shaped copper foil; and
the lower pin is fixedly connected with the lower end face of the lower wafer-shaped copper foil;
the upper end face of the upper disk-shaped copper foil is provided with an upper conductive unit; the length of the upper conductive unit can be changed, the upper conductive unit penetrates through the upper first through hole, the upper conductive unit is used for realizing the electric connection between the lower end face of the upper disc-shaped copper foil and the upper end face of the temperature-sensitive resistance chip, and one end of the upper conductive unit, which is electrically connected with the upper disc-shaped copper foil, applies thrust to the temperature-sensitive resistance chip;
a lower first through hole is formed in the disc-shaped lower sealing cover, and a lower conductive unit is arranged on the upper end face of the lower disc-shaped copper foil; the length of the lower conductive unit can be changed, the lower conductive unit penetrates through the lower first through hole, the lower conductive unit is used for achieving electric connection between the upper end face of the lower disc-shaped copper foil and the lower end face of the temperature-sensitive resistance chip, and one end, electrically connected with the upper disc-shaped copper foil, of the lower conductive unit applies thrust to the temperature-sensitive resistance chip.
In another embodiment, the upper conductive element comprises a conductive material upper spring and a conductive material upper conductive block; one end of the upper spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the upper spring is fixedly connected with one end of the upper conductive block; one end of the upper conductive block, which is far away from the upper spring, is electrically connected with the upper end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip.
In another embodiment, the lower conductive unit includes a lower spring made of a conductive material and a lower conductive block made of a conductive material; one end of the lower spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the lower spring is fixedly connected with one end of the lower conductive block; one end of the lower conductive block, which is far away from the lower spring, is electrically connected with the lower end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip.
In another embodiment, the upper pins and the lower pins are distributed in a mirror symmetry manner with respect to the wafer-shaped sealing case or the upper pins and the lower pins are distributed in a mirror symmetry manner with respect to a center of the wafer-shaped sealing case.
In another embodiment, the disc-shaped temperature-sensitive resistor chip is a semiconductor disc-shaped negative temperature coefficient temperature-sensitive resistor chip, a metal disc-shaped negative temperature coefficient temperature-sensitive resistor chip or an alloy disc-shaped negative temperature coefficient temperature-sensitive resistor chip.
In another embodiment, the upper pin is a strip-shaped conductive sheet made of copper.
In another embodiment, the lower lead is a copper strip-shaped conductive sheet.
A temperature-sensitive resistor comprising:
a wafer-shaped temperature-sensitive resistor chip;
the disc-shaped sealing box comprises a circular ring-shaped temperature-sensitive resistor accommodating device, a disc-shaped upper sealing cover and a disc-shaped lower sealing cover; the upper disc-shaped sealing cover seals an upper opening of the circular ring-shaped temperature-sensitive resistor accommodating device; the lower sealing cover is used for sealing the lower opening of the annular temperature-sensitive resistor accommodating device;
the annular temperature-sensitive resistor accommodating device comprises an annular main body; the inner side wall of the circular main body is at least provided with three blind holes which are uniformly and annularly distributed; a temperature-sensitive resistor chip clamping device is arranged in the blind hole; the temperature-sensitive resistor chip clamping device comprises a clamping spring, a spring limiting sleeve and a temperature-sensitive resistor chip limiting buckle; the temperature-sensitive resistor chip limiting buckle comprises a buckle main body; an arc-shaped clamping groove is formed in the inner side of the buckle main body; the wafer-shaped temperature-sensitive resistor chip is surrounded and clamped by the arc-shaped clamping groove; at least one end of the upper end or the lower end of the buckle main body is provided with an inclined temperature-sensitive resistor chip clamped into the transition block; one end of the clamping spring is fixedly connected with the bottom wall of the blind hole, and the other end of the clamping spring is fixedly connected with the outer side of the buckle main body; the spring limiting sleeve sleeves the clamping spring; one end of the spring limiting sleeve is fixedly connected with the outer side of the buckle main body, and when the clamping spring is in a natural state, the other end of the spring limiting sleeve extends into the blind hole and is not in contact with the bottom wall of the blind hole;
the lower end face of the upper disk-shaped copper foil is fixed on the upper end face of the disk-shaped upper sealing cover;
the upper end face of the lower disk-shaped copper foil is fixed on the lower end face of the disk-shaped lower sealing cover;
the upper pin is fixedly connected with the upper end face of the upper disc-shaped copper foil; and
the lower pin is fixedly connected with the lower end face of the lower wafer-shaped copper foil;
the upper end face of the upper disk-shaped copper foil is provided with an upper conductive unit; the length of the upper conductive unit can be changed, the upper conductive unit penetrates through the upper first through hole, the upper conductive unit is used for realizing the electric connection between the lower end face of the upper disc-shaped copper foil and the upper end face of the temperature-sensitive resistance chip, and one end of the upper conductive unit, which is electrically connected with the upper disc-shaped copper foil, applies thrust to the temperature-sensitive resistance chip;
a lower first through hole is formed in the disc-shaped lower sealing cover, and a lower conductive unit is arranged on the upper end face of the lower disc-shaped copper foil; the length of the lower conductive unit can be changed, the lower conductive unit penetrates through the lower first through hole, the lower conductive unit is used for achieving electric connection between the upper end face of the lower disc-shaped copper foil and the lower end face of the temperature-sensitive resistance chip, and one end, electrically connected with the upper disc-shaped copper foil, of the lower conductive unit applies thrust to the temperature-sensitive resistance chip.
In another embodiment, the upper conductive element comprises a conductive material upper spring and a conductive material upper conductive block; one end of the upper spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the upper spring is fixedly connected with one end of the upper conductive block; one end of the upper conductive block, which is far away from the upper spring, is electrically connected with the upper end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip.
In another embodiment, the lower conductive unit includes a lower spring made of a conductive material and a lower conductive block made of a conductive material; one end of the lower spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the lower spring is fixedly connected with one end of the lower conductive block; one end of the lower conductive block, which is far away from the lower spring, is electrically connected with the lower end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip.
In another embodiment, the upper pins and the lower pins are distributed in a mirror symmetry manner with respect to the wafer-shaped sealing case or the upper pins and the lower pins are distributed in a mirror symmetry manner with respect to a center of the wafer-shaped sealing case.
In another embodiment, the disc-shaped temperature-sensitive resistor chip is a semiconductor disc-shaped negative temperature coefficient temperature-sensitive resistor chip, a metal disc-shaped negative temperature coefficient temperature-sensitive resistor chip or an alloy disc-shaped negative temperature coefficient temperature-sensitive resistor chip.
In another embodiment, the upper pin is a strip-shaped conductive sheet made of copper.
In another embodiment, the lower lead is a copper strip-shaped conductive sheet.
A method of assembling a temperature-sensitive resistor according to any of the preceding claims, comprising:
clamping the temperature-sensitive resistor chip into an arc-shaped clamping groove of the temperature-sensitive resistor chip limiting buckle;
sealing the upper opening of the circular temperature-sensitive resistor accommodating device by the circular upper sealing cover;
sealing the lower opening of the annular temperature-sensitive resistor accommodating device by the circular lower sealing cover;
the upper conductive unit penetrates through the upper first through hole to realize the electric connection between the lower end face of the upper disc-shaped copper foil and the upper end face of the temperature-sensitive resistance chip, and thrust is applied to the temperature-sensitive resistance chip;
fixing the lower end face of the upper disc-shaped copper foil on the upper end face of the disc-shaped upper sealing cover;
the lower conductive unit penetrates through the lower first through hole to realize the electric connection between the upper end face of the lower disc-shaped copper foil and the lower end face of the temperature-sensitive resistance chip, and thrust is applied to the temperature-sensitive resistance chip;
the upper end face of the lower disk-shaped copper foil is fixed on the lower end face of the disk-shaped upper seal cover;
fixedly connecting the upper pin with the upper end face of the upper wafer-shaped copper foil;
and fixedly connecting the lower pin with the lower end face of the lower disk-shaped copper foil.
The temperature-sensitive resistor avoids performance reduction along with time change, and service life is prolonged.
Drawings
Fig. 1 is an exploded schematic view of a temperature-sensitive resistor according to an embodiment of the present disclosure.
Fig. 2 is a schematic cross-sectional view of a temperature-sensitive resistor according to an embodiment of the present disclosure.
Fig. 3 is an enlarged schematic view of fig. 2 at the circle.
Fig. 4 is a schematic structural diagram of a temperature-sensitive resistor accommodating device in a temperature-sensitive resistor according to an embodiment of the present application.
Fig. 5 is an enlarged schematic view of the circle in fig. 4.
Fig. 6 is a flowchart of an assembly method of a temperature-sensitive resistor according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 5, a temperature-sensitive resistor includes:
a wafer-shaped temperature-sensitive resistor chip 100;
the disc-shaped sealing box comprises a circular ring-shaped temperature-sensitive resistor accommodating device 210, a disc-shaped upper sealing cover 220 and a disc-shaped lower sealing cover 230; the upper disc-shaped sealing cover seals an upper opening of the circular ring-shaped temperature-sensitive resistor accommodating device; the lower sealing cover is used for sealing the lower opening of the annular temperature-sensitive resistor accommodating device;
the annular temperature-sensitive resistor accommodating device comprises an annular main body 211; the inner side wall of the annular main body is provided with six blind holes 2111 which are uniformly distributed in an annular shape; a temperature-sensitive resistor chip clamping device is arranged in the blind hole; the temperature-sensitive resistor chip clamping device comprises a clamping spring 2121, a spring limiting sleeve 2122 and a temperature-sensitive resistor chip limiting buckle 2123; the temperature-sensitive resistor chip limiting buckle comprises a buckle main body; the inner side of the buckle main body is provided with an arc-shaped clamping groove 21231; the wafer-shaped temperature-sensitive resistor chip is surrounded and clamped by the arc-shaped clamping groove; the upper end and the lower end of the buckle main body are both provided with inclined temperature-sensitive resistor chips which are clamped into the transition block 21232; one end of the clamping spring is fixedly connected with the bottom wall of the blind hole, and the other end of the clamping spring is fixedly connected with the outer side of the buckle main body; the spring limiting sleeve sleeves the clamping spring; one end of the spring limiting sleeve is fixedly connected with the outer side of the buckle main body, and when the clamping spring is in a natural state, the other end of the spring limiting sleeve extends into the blind hole and is not in contact with the bottom wall of the blind hole;
an upper disk-shaped copper foil 300, the lower end face of which is fixed on the upper end face of the disk-shaped upper seal cover;
a lower disk-shaped copper foil 400, wherein the upper end face of the lower disk-shaped copper foil is fixed on the lower end face of the disk-shaped lower sealing cover;
an upper pin 500 fixedly connected to an upper end surface of the upper wafer-shaped copper foil; and
a lower pin 600 fixedly connected to a lower end surface of the lower wafer-shaped copper foil;
an upper first through hole 221 is formed in the wafer-shaped upper sealing cover, and an upper conductive unit is arranged on the lower end face of the upper wafer-shaped copper foil; the upper conductive unit comprises a conductive material upper spring and a conductive material upper conductive block; one end of the upper spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the upper spring is fixedly connected with one end of the upper conductive block; one end of the upper conductive block, which is far away from the upper spring, is electrically connected with the upper end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip;
a lower first through hole 231 is formed in the disc-shaped lower sealing cover, and a lower conductive unit is arranged on the upper end face of the lower disc-shaped copper foil; the lower conductive unit includes a lower spring 410 made of a conductive material and a lower conductive block 420 made of a conductive material; one end of the lower spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the lower spring is fixedly connected with one end of the lower conductive block; one end of the lower conductive block, which is far away from the lower spring, is electrically connected with the lower end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip.
It can be understood that the temperature-sensitive resistor chip of the present application may be a positive temperature coefficient temperature-sensitive resistor chip, or a negative temperature coefficient temperature-sensitive resistor chip.
The temperature-sensitive resistor avoids performance reduction along with time change, and service life is prolonged. Specifically, the temperature-sensitive resistor chip is sealed by a wafer-shaped sealing box (specifically, the annular temperature-sensitive resistor accommodating device 210, the wafer-shaped upper sealing cover 220 and the wafer-shaped lower sealing cover 230 are utilized), so that the probability of contacting with the outside air is greatly reduced, and the service life is prolonged. The temperature-sensitive resistor chips with different sizes (thickness and diameter) can be sealed by clamping the temperature-sensitive resistor chip by the temperature-sensitive resistor chip clamping device, the upper conductive unit and the lower conductive unit, and specifically, the annular temperature-sensitive resistor accommodating device can clamp the temperature-sensitive resistor chips with different diameters by pressing the clamping spring through the buckle main body. It can be understood that the height of the arc-shaped clamping groove is larger than the thickness of the temperature-sensitive resistor chip. When the temperature-sensitive resistor chip is positioned in the arc-shaped clamping groove, the upper conductive unit and the lower conductive unit respectively apply thrust to the temperature-sensitive resistor chip, so that the upper end face and the lower end face of the temperature-sensitive resistor chip with different thicknesses are clamped.
Through go up the pin with go up electrically conductive copper post electricity and then go up the conducting block and keep away from the one end of going up the pin and contradict the up end of temperature sensitive resistance chip, give through last pin like this temperature sensitive resistance chip supplies power. Similarly, the lower pin supplies power to the temperature-sensitive resistor chip by the similar same principle.
In another embodiment, the upper pins and the lower pins are distributed in a mirror symmetry manner with respect to the wafer-shaped sealing case or the upper pins and the lower pins are distributed in a mirror symmetry manner with respect to a center of the wafer-shaped sealing case.
It should be noted that the drawings in the present application only show the schematic view of the mirror-symmetrical distribution of the upper pins and the lower pins with respect to the disc-shaped sealing box.
It is understood that the present application is not limited to the positional relationship of the upper lead and the lower lead, and the mirror symmetry and the reverse mirror symmetry are only two examples of the possible.
In another embodiment, the disc-shaped temperature-sensitive resistor chip is a semiconductor disc-shaped temperature-sensitive resistor chip, a metal disc-shaped temperature-sensitive resistor chip or an alloy disc-shaped temperature-sensitive resistor chip. That is, the present application does not limit the type of the temperature sensitive resistance chip.
In another embodiment, the upper pin is a strip-shaped conductive sheet made of copper.
In another embodiment, the lower lead is a copper strip-shaped conductive sheet.
It is understood that the upper lead and the lower lead may be made of the same conductive material, or different conductive materials. In another embodiment, the upper pin and the lower pin are both copper strip-shaped conductive sheets. Of course, conductive sheets made of other materials may be used.
A temperature sensor comprises a negative temperature coefficient temperature-sensitive resistor; the negative temperature coefficient temperature-sensitive resistor comprises:
a wafer-shaped negative temperature coefficient temperature-sensitive resistor chip;
the disc-shaped sealing box comprises a circular ring-shaped temperature-sensitive resistor accommodating device, a disc-shaped upper sealing cover and a disc-shaped lower sealing cover; the upper disc-shaped sealing cover seals an upper opening of the circular ring-shaped temperature-sensitive resistor accommodating device; the lower sealing cover is used for sealing the lower opening of the annular temperature-sensitive resistor accommodating device;
the annular temperature-sensitive resistor accommodating device comprises an annular main body; the inner side wall of the circular main body is at least provided with three blind holes which are uniformly and annularly distributed; a temperature-sensitive resistor chip clamping device is arranged in the blind hole; the temperature-sensitive resistor chip clamping device comprises a clamping spring, a spring limiting sleeve and a temperature-sensitive resistor chip limiting buckle; the temperature-sensitive resistor chip limiting buckle comprises a buckle main body; an arc-shaped clamping groove is formed in the inner side of the buckle main body; the wafer-shaped temperature-sensitive resistor chip is surrounded and clamped by the arc-shaped clamping groove; at least one end of the upper end or the lower end of the buckle main body is provided with an inclined temperature-sensitive resistor chip clamped into the transition block; one end of the clamping spring is fixedly connected with the bottom wall of the blind hole, and the other end of the clamping spring is fixedly connected with the outer side of the buckle main body; the spring limiting sleeve sleeves the clamping spring; one end of the spring limiting sleeve is fixedly connected with the outer side of the buckle main body, and when the clamping spring is in a natural state, the other end of the spring limiting sleeve extends into the blind hole and is not in contact with the bottom wall of the blind hole;
the lower end face of the upper disk-shaped copper foil is fixed on the upper end face of the disk-shaped upper sealing cover;
the upper end face of the lower disk-shaped copper foil is fixed on the lower end face of the disk-shaped lower sealing cover;
the upper pin is fixedly connected with the upper end face of the upper disc-shaped copper foil; and
the lower pin is fixedly connected with the lower end face of the lower wafer-shaped copper foil;
the upper end face of the upper disk-shaped copper foil is provided with an upper conductive unit; the length of the upper conductive unit can be changed, the upper conductive unit penetrates through the upper first through hole, the upper conductive unit is used for realizing the electric connection between the lower end face of the upper disc-shaped copper foil and the upper end face of the temperature-sensitive resistance chip, and one end of the upper conductive unit, which is electrically connected with the upper disc-shaped copper foil, applies thrust to the temperature-sensitive resistance chip;
a lower first through hole is formed in the disc-shaped lower sealing cover, and a lower conductive unit is arranged on the upper end face of the lower disc-shaped copper foil; the length of the lower conductive unit can be changed, the lower conductive unit penetrates through the lower first through hole, the lower conductive unit is used for achieving electric connection between the upper end face of the lower disc-shaped copper foil and the lower end face of the temperature-sensitive resistance chip, and one end, electrically connected with the upper disc-shaped copper foil, of the lower conductive unit applies thrust to the temperature-sensitive resistance chip.
The temperature sensor avoids performance reduction along with time change, and service life is prolonged. Specifically, the negative temperature coefficient temperature-sensitive resistor chip is sealed by a wafer-shaped sealing box (specifically, by using the annular temperature-sensitive resistor accommodating device 210, the wafer-shaped upper sealing cover 220 and the wafer-shaped lower sealing cover 230), so that the probability of contacting with the outside air is greatly reduced, and the service life is prolonged. The temperature-sensitive resistor chip clamping device, the upper conductive unit and the lower conductive unit clamp the temperature-sensitive resistor chip with negative temperature coefficient, the temperature-sensitive resistor chips with negative temperature coefficient of different sizes (thickness and diameter) can be sealed, and specifically, the annular temperature-sensitive resistor accommodating device can clamp the temperature-sensitive resistor chips with negative temperature coefficient of different diameters by pressing the clamping spring through the buckle main body. It can be understood that the height of the arc-shaped clamping groove is larger than the thickness of the negative temperature coefficient temperature-sensitive resistor chip. When the negative temperature coefficient temperature-sensitive resistor chip is positioned in the arc-shaped clamping groove, the upper conductive unit and the lower conductive unit respectively apply thrust to the temperature-sensitive resistor chip, so that the upper end face and the lower end face of the negative temperature coefficient temperature-sensitive resistor chip with different thicknesses are clamped.
In another embodiment, the upper pins and the lower pins are distributed in a mirror symmetry manner with respect to the wafer-shaped sealing case or the upper pins and the lower pins are distributed in a mirror symmetry manner with respect to a center of the wafer-shaped sealing case.
It should be noted that the drawings in the present application only show the schematic view of the mirror-symmetrical distribution of the upper pins and the lower pins with respect to the disc-shaped sealing box.
It is understood that the present application is not limited to the positional relationship of the upper lead and the lower lead, and the mirror symmetry and the reverse mirror symmetry are only two examples of the possible.
In another embodiment, the upper conductive element comprises a conductive material upper spring and a conductive material upper conductive block; one end of the upper spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the upper spring is fixedly connected with one end of the upper conductive block; one end of the upper conductive block, which is far away from the upper spring, is electrically connected with the upper end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip. It is understood that the present application only provides a specific example of the upper conductive element, and other upper conductive elements with other structures may be adopted, and the related functions may be realized by industry practice.
In another embodiment, the lower conductive unit includes a lower spring made of a conductive material and a lower conductive block made of a conductive material; one end of the lower spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the lower spring is fixedly connected with one end of the lower conductive block; one end of the lower conductive block, which is far away from the lower spring, is electrically connected with the lower end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip. It is understood that the present application only provides a specific example of the upper conductive element, and other upper conductive elements with other structures may be adopted, and the related functions may be realized by industry practice.
In another embodiment, the disc-shaped temperature-sensitive resistor chip is a semiconductor disc-shaped negative temperature coefficient temperature-sensitive resistor chip, a metal disc-shaped negative temperature coefficient temperature-sensitive resistor chip or an alloy disc-shaped negative temperature coefficient temperature-sensitive resistor chip. That is, the present application does not limit the type of the negative temperature coefficient temperature sensitive resistance chip.
In another embodiment, the upper pin is a strip-shaped conductive sheet made of copper.
In another embodiment, the lower lead is a copper strip-shaped conductive sheet.
It is understood that the upper lead and the lower lead may be made of the same conductive material, or different conductive materials. In another embodiment, the upper pin and the lower pin are both copper strip-shaped conductive sheets. Of course, conductive sheets made of other materials may be used.
A temperature-sensitive resistor comprising:
a wafer-shaped temperature-sensitive resistor chip;
the disc-shaped sealing box comprises a circular ring-shaped temperature-sensitive resistor accommodating device, a disc-shaped upper sealing cover and a disc-shaped lower sealing cover; the upper disc-shaped sealing cover seals an upper opening of the circular ring-shaped temperature-sensitive resistor accommodating device; the lower sealing cover is used for sealing the lower opening of the annular temperature-sensitive resistor accommodating device;
the annular temperature-sensitive resistor accommodating device comprises an annular main body; the inner side wall of the circular main body is at least provided with three blind holes which are uniformly and annularly distributed; a temperature-sensitive resistor chip clamping device is arranged in the blind hole; the temperature-sensitive resistor chip clamping device comprises a clamping spring, a spring limiting sleeve and a temperature-sensitive resistor chip limiting buckle; the temperature-sensitive resistor chip limiting buckle comprises a buckle main body; an arc-shaped clamping groove is formed in the inner side of the buckle main body; the wafer-shaped temperature-sensitive resistor chip is surrounded and clamped by the arc-shaped clamping groove; at least one end of the upper end or the lower end of the buckle main body is provided with an inclined temperature-sensitive resistor chip clamped into the transition block; one end of the clamping spring is fixedly connected with the bottom wall of the blind hole, and the other end of the clamping spring is fixedly connected with the outer side of the buckle main body; the spring limiting sleeve sleeves the clamping spring; one end of the spring limiting sleeve is fixedly connected with the outer side of the buckle main body, and when the clamping spring is in a natural state, the other end of the spring limiting sleeve extends into the blind hole and is not in contact with the bottom wall of the blind hole;
the lower end face of the upper disk-shaped copper foil is fixed on the upper end face of the disk-shaped upper sealing cover;
the upper end face of the lower disk-shaped copper foil is fixed on the lower end face of the disk-shaped lower sealing cover;
the upper pin is fixedly connected with the upper end face of the upper disc-shaped copper foil; and
the lower pin is fixedly connected with the lower end face of the lower wafer-shaped copper foil;
the upper end face of the upper disk-shaped copper foil is provided with an upper conductive unit; the length of the upper conductive unit can be changed, the upper conductive unit penetrates through the upper first through hole, the upper conductive unit is used for realizing the electric connection between the lower end face of the upper disc-shaped copper foil and the upper end face of the temperature-sensitive resistance chip, and one end of the upper conductive unit, which is electrically connected with the upper disc-shaped copper foil, applies thrust to the temperature-sensitive resistance chip;
a lower first through hole is formed in the disc-shaped lower sealing cover, and a lower conductive unit is arranged on the upper end face of the lower disc-shaped copper foil; the length of the lower conductive unit can be changed, the lower conductive unit penetrates through the lower first through hole, the lower conductive unit is used for achieving electric connection between the upper end face of the lower disc-shaped copper foil and the lower end face of the temperature-sensitive resistance chip, and one end, electrically connected with the upper disc-shaped copper foil, of the lower conductive unit applies thrust to the temperature-sensitive resistance chip.
The temperature sensor avoids performance reduction along with time change, and service life is prolonged. Specifically, the negative temperature coefficient temperature-sensitive resistor chip is sealed by a wafer-shaped sealing box (specifically, by using the annular temperature-sensitive resistor accommodating device 210, the wafer-shaped upper sealing cover 220 and the wafer-shaped lower sealing cover 230), so that the probability of contacting with the outside air is greatly reduced, and the service life is prolonged. The temperature-sensitive resistor chip clamping device, the upper conductive unit and the lower conductive unit clamp the temperature-sensitive resistor chip with negative temperature coefficient, the temperature-sensitive resistor chips with negative temperature coefficient of different sizes (thickness and diameter) can be sealed, and specifically, the annular temperature-sensitive resistor accommodating device can clamp the temperature-sensitive resistor chips with negative temperature coefficient of different diameters by pressing the clamping spring through the buckle main body. It can be understood that the height of the arc-shaped clamping groove is larger than the thickness of the negative temperature coefficient temperature-sensitive resistor chip. When the negative temperature coefficient temperature-sensitive resistor chip is positioned in the arc-shaped clamping groove, the upper conductive unit and the lower conductive unit respectively apply thrust to the temperature-sensitive resistor chip, so that the upper end face and the lower end face of the negative temperature coefficient temperature-sensitive resistor chip with different thicknesses are clamped.
In another embodiment, the upper pins and the lower pins are distributed in a mirror symmetry manner with respect to the wafer-shaped sealing case or the upper pins and the lower pins are distributed in a mirror symmetry manner with respect to a center of the wafer-shaped sealing case.
It should be noted that the drawings in the present application only show the schematic view of the mirror-symmetrical distribution of the upper pins and the lower pins with respect to the disc-shaped sealing box.
It is understood that the present application is not limited to the positional relationship of the upper lead and the lower lead, and the mirror symmetry and the reverse mirror symmetry are only two examples of the possible.
In another embodiment, the upper conductive element comprises a conductive material upper spring and a conductive material upper conductive block; one end of the upper spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the upper spring is fixedly connected with one end of the upper conductive block; one end of the upper conductive block, which is far away from the upper spring, is electrically connected with the upper end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip. It is understood that the present application only provides a specific example of the upper conductive element, and other upper conductive elements with other structures may be adopted, and the related functions may be realized by industry practice.
In another embodiment, the lower conductive unit includes a lower spring made of a conductive material and a lower conductive block made of a conductive material; one end of the lower spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the lower spring is fixedly connected with one end of the lower conductive block; one end of the lower conductive block, which is far away from the lower spring, is electrically connected with the lower end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip. It is understood that the present application only provides a specific example of the upper conductive element, and other upper conductive elements with other structures may be adopted, and the related functions may be realized by industry practice.
In another embodiment, the disc-shaped temperature-sensitive resistor chip is a semiconductor disc-shaped negative temperature coefficient temperature-sensitive resistor chip, a metal disc-shaped negative temperature coefficient temperature-sensitive resistor chip or an alloy disc-shaped negative temperature coefficient temperature-sensitive resistor chip. That is, the present application does not limit the type of the negative temperature coefficient temperature sensitive resistance chip.
In another embodiment, the upper pin is a strip-shaped conductive sheet made of copper.
In another embodiment, the lower lead is a copper strip-shaped conductive sheet.
It is understood that the upper lead and the lower lead may be made of the same conductive material, or different conductive materials. In another embodiment, the upper pin and the lower pin are both copper strip-shaped conductive sheets. Of course, conductive sheets made of other materials may be used.
Referring to fig. 6, a method for assembling the temperature-sensitive resistor of any one of the above embodiments includes:
s110, clamping the temperature-sensitive resistor chip into an arc-shaped clamping groove of the temperature-sensitive resistor chip limiting buckle;
s120, sealing the upper opening of the annular temperature-sensitive resistor accommodating device by the wafer-shaped upper sealing cover;
s130, sealing the lower opening of the annular temperature-sensitive resistor accommodating device by the circular sheet-shaped lower sealing cover;
s140, enabling the upper conductive unit to penetrate through the upper first through hole to achieve electric connection between the lower end face of the upper disc-shaped copper foil and the upper end face of the temperature-sensitive resistance chip, and applying pushing force to the temperature-sensitive resistance chip;
s150, fixing the lower end face of the upper disc-shaped copper foil on the upper end face of the disc-shaped upper sealing cover;
s160, enabling the lower conductive unit to penetrate through the lower first through hole to achieve electric connection between the upper end face of the lower disc-shaped copper foil and the lower end face of the temperature-sensitive resistance chip, and applying pushing force to the temperature-sensitive resistance chip;
s170, fixing the upper end face of the lower disk-shaped copper foil on the lower end face of the disk-shaped upper sealing cover;
s180, fixedly connecting the upper pin with the upper end face of the upper wafer-shaped copper foil;
and S190, fixedly connecting the lower pin with the lower end face of the lower disk-shaped copper foil.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A temperature-sensitive resistor, comprising:
a wafer-shaped temperature-sensitive resistor chip;
the disc-shaped sealing box comprises a circular ring-shaped temperature-sensitive resistor accommodating device, a disc-shaped upper sealing cover and a disc-shaped lower sealing cover; the upper disc-shaped sealing cover seals an upper opening of the circular ring-shaped temperature-sensitive resistor accommodating device; the lower sealing cover is used for sealing the lower opening of the annular temperature-sensitive resistor accommodating device;
the annular temperature-sensitive resistor accommodating device comprises an annular main body; the inner side wall of the annular main body is provided with six blind holes which are uniformly distributed in an annular shape; a temperature-sensitive resistor chip clamping device is arranged in the blind hole; the temperature-sensitive resistor chip clamping device comprises a clamping spring, a spring limiting sleeve and a temperature-sensitive resistor chip limiting buckle; the temperature-sensitive resistor chip limiting buckle comprises a buckle main body; an arc-shaped clamping groove is formed in the inner side of the buckle main body; the wafer-shaped temperature-sensitive resistor chip is surrounded and clamped by the arc-shaped clamping groove; the upper end and the lower end of the buckle main body are both provided with inclined temperature-sensitive resistor chips which are clamped into the transition blocks; one end of the clamping spring is fixedly connected with the bottom wall of the blind hole, and the other end of the clamping spring is fixedly connected with the outer side of the buckle main body; the spring limiting sleeve sleeves the clamping spring; one end of the spring limiting sleeve is fixedly connected with the outer side of the buckle main body, and when the clamping spring is in a natural state, the other end of the spring limiting sleeve extends into the blind hole and is not in contact with the bottom wall of the blind hole;
the lower end face of the upper disk-shaped copper foil is fixed on the upper end face of the disk-shaped upper sealing cover;
the upper end face of the lower disk-shaped copper foil is fixed on the lower end face of the disk-shaped lower sealing cover;
the upper pin is fixedly connected with the upper end face of the upper disc-shaped copper foil; and
the lower pin is fixedly connected with the lower end face of the lower wafer-shaped copper foil;
the upper end face of the upper disk-shaped copper foil is provided with an upper conductive unit; the upper conductive unit comprises a conductive material upper spring and a conductive material upper conductive block; one end of the upper spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the upper spring is fixedly connected with one end of the upper conductive block; one end of the upper conductive block, which is far away from the upper spring, is electrically connected with the upper end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip;
a lower first through hole is formed in the disc-shaped lower sealing cover, and a lower conductive unit is arranged on the upper end face of the lower disc-shaped copper foil; the lower conductive unit comprises a lower spring made of a conductive material and a lower conductive block made of a conductive material; one end of the lower spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the lower spring is fixedly connected with one end of the lower conductive block; one end of the lower conductive block, which is far away from the lower spring, is electrically connected with the lower end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip.
2. A temperature sensor is characterized by comprising a negative temperature coefficient temperature-sensitive resistor; the negative temperature coefficient temperature-sensitive resistor comprises:
a wafer-shaped negative temperature coefficient temperature-sensitive resistor chip;
the disc-shaped sealing box comprises a circular ring-shaped temperature-sensitive resistor accommodating device, a disc-shaped upper sealing cover and a disc-shaped lower sealing cover; the upper disc-shaped sealing cover seals an upper opening of the circular ring-shaped temperature-sensitive resistor accommodating device; the lower sealing cover is used for sealing the lower opening of the annular temperature-sensitive resistor accommodating device;
the annular temperature-sensitive resistor accommodating device comprises an annular main body; the inner side wall of the circular main body is at least provided with three blind holes which are uniformly and annularly distributed; a temperature-sensitive resistor chip clamping device is arranged in the blind hole; the temperature-sensitive resistor chip clamping device comprises a clamping spring, a spring limiting sleeve and a temperature-sensitive resistor chip limiting buckle; the temperature-sensitive resistor chip limiting buckle comprises a buckle main body; an arc-shaped clamping groove is formed in the inner side of the buckle main body; the wafer-shaped temperature-sensitive resistor chip is surrounded and clamped by the arc-shaped clamping groove; at least one end of the upper end or the lower end of the buckle main body is provided with an inclined temperature-sensitive resistor chip clamped into the transition block; one end of the clamping spring is fixedly connected with the bottom wall of the blind hole, and the other end of the clamping spring is fixedly connected with the outer side of the buckle main body; the spring limiting sleeve sleeves the clamping spring; one end of the spring limiting sleeve is fixedly connected with the outer side of the buckle main body, and when the clamping spring is in a natural state, the other end of the spring limiting sleeve extends into the blind hole and is not in contact with the bottom wall of the blind hole;
the lower end face of the upper disk-shaped copper foil is fixed on the upper end face of the disk-shaped upper sealing cover;
the upper end face of the lower disk-shaped copper foil is fixed on the lower end face of the disk-shaped lower sealing cover;
the upper pin is fixedly connected with the upper end face of the upper disc-shaped copper foil; and
the lower pin is fixedly connected with the lower end face of the lower wafer-shaped copper foil;
the upper end face of the upper disk-shaped copper foil is provided with an upper conductive unit; the length of the upper conductive unit can be changed, the upper conductive unit penetrates through the upper first through hole, the upper conductive unit is used for realizing the electric connection between the lower end face of the upper disc-shaped copper foil and the upper end face of the temperature-sensitive resistance chip, and one end of the upper conductive unit, which is electrically connected with the upper disc-shaped copper foil, applies thrust to the temperature-sensitive resistance chip;
a lower first through hole is formed in the disc-shaped lower sealing cover, and a lower conductive unit is arranged on the upper end face of the lower disc-shaped copper foil; the length of the lower conductive unit can be changed, the lower conductive unit penetrates through the lower first through hole, the lower conductive unit is used for achieving electric connection between the upper end face of the lower disc-shaped copper foil and the lower end face of the temperature-sensitive resistance chip, and one end, electrically connected with the upper disc-shaped copper foil, of the lower conductive unit applies thrust to the temperature-sensitive resistance chip.
3. A temperature-sensitive resistor, comprising:
a wafer-shaped temperature-sensitive resistor chip;
the disc-shaped sealing box comprises a circular ring-shaped temperature-sensitive resistor accommodating device, a disc-shaped upper sealing cover and a disc-shaped lower sealing cover; the upper disc-shaped sealing cover seals an upper opening of the circular ring-shaped temperature-sensitive resistor accommodating device; the lower sealing cover is used for sealing the lower opening of the annular temperature-sensitive resistor accommodating device;
the annular temperature-sensitive resistor accommodating device comprises an annular main body; the inner side wall of the circular main body is at least provided with three blind holes which are uniformly and annularly distributed; a temperature-sensitive resistor chip clamping device is arranged in the blind hole; the temperature-sensitive resistor chip clamping device comprises a clamping spring, a spring limiting sleeve and a temperature-sensitive resistor chip limiting buckle; the temperature-sensitive resistor chip limiting buckle comprises a buckle main body; an arc-shaped clamping groove is formed in the inner side of the buckle main body; the wafer-shaped temperature-sensitive resistor chip is surrounded and clamped by the arc-shaped clamping groove; at least one end of the upper end or the lower end of the buckle main body is provided with an inclined temperature-sensitive resistor chip clamped into the transition block; one end of the clamping spring is fixedly connected with the bottom wall of the blind hole, and the other end of the clamping spring is fixedly connected with the outer side of the buckle main body; the spring limiting sleeve sleeves the clamping spring; one end of the spring limiting sleeve is fixedly connected with the outer side of the buckle main body, and when the clamping spring is in a natural state, the other end of the spring limiting sleeve extends into the blind hole and is not in contact with the bottom wall of the blind hole;
the lower end face of the upper disk-shaped copper foil is fixed on the upper end face of the disk-shaped upper sealing cover;
the upper end face of the lower disk-shaped copper foil is fixed on the lower end face of the disk-shaped lower sealing cover;
the upper pin is fixedly connected with the upper end face of the upper disc-shaped copper foil; and
the lower pin is fixedly connected with the lower end face of the lower wafer-shaped copper foil;
the upper end face of the upper disk-shaped copper foil is provided with an upper conductive unit; the length of the upper conductive unit can be changed, the upper conductive unit penetrates through the upper first through hole, the upper conductive unit is used for realizing the electric connection between the lower end face of the upper disc-shaped copper foil and the upper end face of the temperature-sensitive resistance chip, and one end of the upper conductive unit, which is electrically connected with the upper disc-shaped copper foil, applies thrust to the temperature-sensitive resistance chip;
a lower first through hole is formed in the disc-shaped lower sealing cover, and a lower conductive unit is arranged on the upper end face of the lower disc-shaped copper foil; the length of the lower conductive unit can be changed, the lower conductive unit penetrates through the lower first through hole, the lower conductive unit is used for achieving electric connection between the upper end face of the lower disc-shaped copper foil and the lower end face of the temperature-sensitive resistance chip, and one end, electrically connected with the upper disc-shaped copper foil, of the lower conductive unit applies thrust to the temperature-sensitive resistance chip.
4. The temperature-sensitive resistor according to claim 3, wherein the upper conductive element comprises a conductive material upper spring and a conductive material upper conductive block; one end of the upper spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the upper spring is fixedly connected with one end of the upper conductive block; one end of the upper conductive block, which is far away from the upper spring, is electrically connected with the upper end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip.
5. The temperature-sensitive resistor according to claim 3, wherein the lower conductive element comprises a lower spring made of a conductive material and a lower conductive block made of a conductive material; one end of the lower spring is fixedly connected with the lower end face of the upper disc-shaped copper foil, and the other end of the lower spring is fixedly connected with one end of the lower conductive block; one end of the lower conductive block, which is far away from the lower spring, is electrically connected with the lower end face of the temperature-sensitive resistance chip and applies thrust to the temperature-sensitive resistance chip.
6. The temperature-sensitive resistor according to claim 3, wherein the upper lead and the lower lead are arranged in mirror symmetry with respect to the wafer-shaped sealing case or are arranged in mirror symmetry with respect to the center of the wafer-shaped sealing case.
7. The temperature-sensitive resistor according to claim 3, wherein the wafer-shaped temperature-sensitive resistor chip is a semiconductor wafer-shaped temperature-sensitive resistor chip, a metal wafer-shaped temperature-sensitive resistor chip, or an alloy wafer-shaped temperature-sensitive resistor chip.
8. The temperature-sensitive resistor according to claim 3, wherein the upper pin is a strip-shaped conductive sheet made of copper.
9. The temperature-sensitive resistor according to claim 3, wherein the lower lead is a strip-shaped conductive sheet made of copper.
10. A method of assembling a temperature-sensitive resistor according to any of claims 3 to 9, comprising:
clamping the temperature-sensitive resistor chip into an arc-shaped clamping groove of the temperature-sensitive resistor chip limiting buckle;
sealing the upper opening of the circular temperature-sensitive resistor accommodating device by the circular upper sealing cover;
sealing the lower opening of the annular temperature-sensitive resistor accommodating device by the circular lower sealing cover;
the upper conductive unit penetrates through the upper first through hole to realize the electric connection between the lower end face of the upper disc-shaped copper foil and the upper end face of the temperature-sensitive resistance chip, and thrust is applied to the temperature-sensitive resistance chip;
fixing the lower end face of the upper disc-shaped copper foil on the upper end face of the disc-shaped upper sealing cover;
the lower conductive unit penetrates through the lower first through hole to realize the electric connection between the upper end face of the lower disc-shaped copper foil and the lower end face of the temperature-sensitive resistance chip, and thrust is applied to the temperature-sensitive resistance chip;
the upper end face of the lower disk-shaped copper foil is fixed on the lower end face of the disk-shaped upper seal cover;
fixedly connecting the upper pin with the upper end face of the upper wafer-shaped copper foil;
and fixedly connecting the lower pin with the lower end face of the lower disk-shaped copper foil.
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| CN201000799Y (en) * | 2006-12-26 | 2008-01-02 | 深圳Tcl新技术有限公司 | Thermal resistance |
| CN201707984U (en) * | 2010-06-23 | 2011-01-12 | 西安神电高压电器有限公司 | Resistor clamping device |
| CN107170540B (en) * | 2017-05-15 | 2023-02-10 | 隆科电子(惠阳)有限公司 | FDMOV subassembly that long service life weatherability is strong |
| CN207474174U (en) * | 2017-11-30 | 2018-06-08 | 蚌埠市伟创远东电子有限公司 | A kind of high voltage type resistor with aluminum shell |
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Effective date of registration: 20230914 Address after: 645150 No.9, gaotan formation, Xinzhai village, luorun Township, Gaoxian County, Yibin City, Sichuan Province Patentee after: Liu Kaixin Address before: 215000 Suzhou Wuzhong Economic Development Zone, Wuxi Economic Development Zone, Wuzhong Road, No. 2588, 5, 101, room 1030, Jiangsu Patentee before: SUZHOU HANXUAN INFORMATION TECHNOLOGY Co.,Ltd. |
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