CN108981788B - Modular sensor circuit - Google Patents
Modular sensor circuit Download PDFInfo
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- CN108981788B CN108981788B CN201810879465.7A CN201810879465A CN108981788B CN 108981788 B CN108981788 B CN 108981788B CN 201810879465 A CN201810879465 A CN 201810879465A CN 108981788 B CN108981788 B CN 108981788B
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Abstract
The invention discloses a modularized sensor circuit, which comprises a voltage stabilizing circuit, a power supply isolation module, a power supply circuit, a sensor probe, a sensor combination module and a control chip, wherein an analog-digital converter is connected between the control chip and the sensor probe, the sensor combination module comprises at least two sensor modules, the output end of a PC (personal computer) end is connected with the input end of a first sensor module, the output end of the first sensor module is electrically connected with the input end of a second sensor module, and the output end of the second sensor module is connected to the input end of the PC end. The modular sensor circuit can make various types of sensors into a standard modular structure, realizes the random combination of various types of sensors, can ensure that each sensor module is provided with a power supply isolator to supply power to the sensor probe, has high anti-interference capability, and can be applied to the environment with certain potential difference.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of industrial control, in particular to a modular sensor circuit.
[ background of the invention ]
In the aspect of sensor technology in the field of intelligent control at present, the number and types of interfaces of sensors are often determined from the beginning of project design, and when the number of sensors is to be increased, hardware is often redesigned, or corresponding interface modules are added, so that the flexibility of equipment is reduced, and the cost is high.
In addition, in the aspect of electrical connection, the problems that the existing sensors are poor in anti-interference capability, cannot be applied to a non-equipotential environment and the like are caused because the power supply applied to the sensors is the same power supply.
[ summary of the invention ]
The main object of the present invention is to provide a modular sensor circuit that not only allows each sensor module to be independently powered, but also allows for any combination of classes of sensors.
In order to achieve the main purpose, the invention provides a modular sensor circuit which comprises a voltage stabilizing circuit, a power isolation module, a power supply circuit, a sensor probe, a sensor combination module and a control chip, wherein an analog-to-digital converter is connected between the control chip and the sensor probe, the power supply circuit outputs a power signal for the voltage stabilizing circuit, the voltage stabilizing circuit outputs the power signal after voltage stabilization to the power isolation module, and the power isolation module respectively outputs the power signal after electrical isolation to the control chip and the sensor combination module; the sensor combination module comprises at least two sensor modules, the output end of the PC end is connected with the input end of the first sensor module, the output end of the first sensor module is electrically connected with the input end of the second sensor module, and the output end of the second sensor module is connected with the input end of the PC end.
Therefore, the modular sensor circuit provided by the invention can realize the combination of the sensor modules through the serial connection of the I/O interfaces of the sensor modules, namely, the output end of the PC end is connected with the input end of the first sensor module, the output end of the first sensor module is connected with the input end of the second sensor module, and so on, one path can be connected with the sensor modules, the output end of the last sensor module is connected with the input end of the PC end, and finally, a loop is formed, thereby realizing the random combination of various types of sensors.
Moreover, each sensor module can supply power to the sensor probe from the power isolator through the power isolation module, the A/D conversion end of each sensor module is electrically isolated from the power supply end and the communication end, the anti-interference capability is high, and the sensor probe can be applied to an environment with a certain potential difference.
The power supply circuit comprises a voltage input end, a voltage output end and a communication interface chip, wherein a first end and a second end of the communication interface chip are respectively and electrically connected with the voltage input end, a third end and a fourth end of the communication interface chip are respectively and electrically connected with the voltage output end, and an isolation chip is further connected between the communication interface chip and the control chip.
Therefore, the sensor modules are mutually connected in series through the data line I/O interface, a universal communication interface chip is adopted, the data of the sensor modules are read in a universal instruction mode, the specific positions of the sensor modules in the series connection are not limited, a plurality of modules can be connected in series, and the random combination of various types of sensors is realized.
In addition, the isolation chip is connected between the communication interface chip and the control chip and is used for cold ground and hot ground data isolation transmission.
The further scheme is that the voltage stabilizing circuit comprises a first power chip, a first diode, a second diode and an output filter circuit, wherein the first end of the first power chip is electrically connected with the cathode of the first diode, the second end of the first power chip is electrically connected with the cathode of the second diode, the third end of the first power chip is further connected with a power indication circuit, and a first inductor is further connected between the fourth end of the first power chip and the output filter circuit.
In a further aspect, the power indication circuit includes a first resistor and a first light emitting diode, and the first resistor is connected in series with the first light emitting diode.
Therefore, the first diode is an anti-reverse diode which can prevent the input power supply from being reversely connected to burn out the circuit, the second diode is a freewheeling diode which can play a freewheeling role in the circuit, and the voltage drop voltage of the light emitting diode in the power supply indicating circuit is simultaneously supplied to the enabling pin of the first power supply chip, so that the output stable voltage is supplied to other circuit modules.
The power isolation module comprises a second power chip, an isolation transformer, a sampling circuit and a first voltage reference chip, wherein two ends of a primary coil of the isolation transformer are electrically connected with two ends of the second power chip, a first end of a secondary coil of the isolation transformer is electrically connected with the sampling circuit, and a third diode is connected between a second end of the secondary coil of the isolation transformer and the first voltage reference chip.
In a further scheme, a first resistor and a first capacitor are connected between the first end of the secondary coil of the isolation transformer and the sampling circuit.
The sampling circuit comprises a photoelectric coupler and a second voltage reference chip, wherein the input end of the photoelectric coupler is electrically connected with the second voltage reference chip, and the output end of the photoelectric coupler is connected with the positive electrode of the power supply.
Therefore, the module power supply adopts a direct current wide voltage input range from 5V to 24V, can adapt to various application environments, and outputs 5V voltage to supply power to the analog-to-digital converter, the control chip, the active crystal oscillator and the 2.5V power supply reference chip through the power supply isolation module. Each sensor is independently powered, the anti-interference capability is high, and the sensor can be applied to the environment with a certain potential difference.
Preferably, the modular sensor circuit further comprises a status indication module, and the control chip outputs a status indication signal to the status indication module.
In a further aspect, the status indication module includes a current limiting resistor and a light emitting diode set, and the current limiting resistor is electrically connected to the light emitting diode set.
In a further aspect, the light emitting diode assembly includes a second light emitting diode for emitting a first indicating light signal, a third light emitting diode for emitting a second indicating light signal, and a fourth light emitting diode for emitting a third indicating light signal.
Therefore, the current limiting resistor array is a plurality of resistors with the same parameters, one pin of each resistor is connected together to serve as a common pin, and the rest pins are led out normally, so that the resistor array has the advantages of directionality, tidiness and small occupied space. The light emitting diode group is used for data transmission/reception indication, a/D conversion indication, status failure indication, and the like.
[ description of the drawings ]
FIG. 1 is a schematic diagram of a modular sensor circuit embodiment of the present invention.
FIG. 2 is a circuit schematic of a power module in one embodiment of a modular sensor circuit of the present invention.
FIG. 3 is a circuit schematic of a voltage regulator circuit in an embodiment of a modular sensor circuit of the present invention.
Fig. 4 is a circuit schematic of a power isolation module in a modular sensor circuit embodiment of the present invention.
FIG. 5 is a circuit schematic of a status indication module in one embodiment of a modular sensor circuit of the present invention.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention.
Referring to fig. 1, the modular sensor circuit of the present invention includes a voltage stabilizing circuit 10, a power isolation module 20, a power supply circuit 30, a sensor probe 80, a sensor combination module 40, and a control chip 50, where an analog-to-digital converter 70 is connected between the control chip 50 and the sensor probe 80, the power supply circuit 30 outputs a power signal to the voltage stabilizing circuit 10, the voltage stabilizing circuit 10 outputs the power signal after voltage stabilization to the power isolation module 20, and the power isolation module 20 outputs the power signal after electrical isolation to the control chip 50 and the sensor combination module 40, respectively.
Referring to fig. 2, the power supply circuit includes a voltage input terminal JP1, a voltage output terminal JP2, a communication interface chip U3, an input current limiting resistor R1, an input current limiting resistor R2, an output current limiting resistor R6, and an output current limiting resistor R7, wherein a first terminal and a second terminal of the communication interface chip U3 are electrically connected to the voltage input terminal JP1, and a third terminal and a fourth terminal of the communication interface chip U3 are electrically connected to the voltage output terminal JP 2. It can be seen that the resistor R1, the resistor R2, the resistor R6 and the resistor R7 are used to protect the communication interface chip U3, so as to limit the magnitude of the current in the branch, and prevent the communication interface chip U3 connected in series from being burned out due to excessive current. Therefore, the sensor modules are connected in series through the data line I/O interfaces, the universal communication interface chip U3 is adopted, the data of the sensor modules are read by using a universal instruction mode, the specific positions of the sensor modules in the series connection are not limited, a plurality of modules can be connected in series, and the random combination of various types of sensors is realized. Preferably, the communication interface chip U3 is an RS422 interface chip.
In addition, an isolation chip U5 is connected between the communication interface chip U3 and the control chip 50, and a digital isolation chip U5 is connected between the communication interface chip U3 and the control chip 50. The isolation chip U5 is used for cold ground and hot ground data isolation transmission.
Referring to fig. 3, the voltage stabilizing circuit 10 includes a first power chip U4, a diode D2, a diode D1, a filter capacitor C1, a bootstrap capacitor C2, a resistor R8, a resistor R9, and an output filter circuit, wherein a first end of the first power chip U4 is electrically connected to a cathode of the diode D2, a second end of the first power chip U4 is electrically connected to a cathode of the diode D1, an energy storage inductor L1 is further connected between a fourth end of the first power chip U4 and the output filter circuit, and the resistor R8 is connected in series with the resistor R9. The output filter circuit comprises a capacitor C6, a capacitor C7 and a capacitor C13, a diode D2 is an anti-reverse diode and can prevent an input power supply from being reversely connected to burn the circuit, and a diode D1 is a freewheeling diode and can play a freewheeling role in the circuit. Therefore, the regulator circuit 10 outputs a regulated voltage to other circuit modules, for example, the regulator circuit 10 may output a regulated voltage of 3.3 volts to the communication interface chip U3, the isolation chip U5, and the power isolation module 20.
In this embodiment, the third terminal of the first power chip U4 is further connected to a power indication circuit, the power indication circuit includes a resistor R5 and a light emitting diode D5, and the resistor R5 is connected in series with the light emitting diode D5. The voltage drop of the light emitting diode D5 in the power indication circuit is simultaneously supplied to the enable pin of the first power chip U4.
Referring to fig. 4, the power isolation module 20 includes a cold ground portion and a hot ground portion, the power isolation module 20 is composed of a second power chip U9, an isolation transformer T1, a sampling circuit, and a first voltage reference chip U2, two ends of a primary coil of the isolation transformer T1 are electrically connected to two ends of the second power chip U9, a first end of a secondary coil of the isolation transformer T1 is electrically connected to the sampling circuit, and a diode D3 is connected between a second end of a secondary coil of the isolation transformer T1 and the first voltage reference chip U2. Therefore, the module power supply adopts a wide direct-current voltage input range from 5V to 24V, can adapt to various application environments, outputs 5V voltage through the power isolation module 20, and can supply power to the analog-to-digital converter U6, the control chip 50, the active crystal oscillator and the 2.5V first power reference chip U2. Each sensor is independently powered, the anti-interference capability is high, and the sensor can be applied to the environment with a certain potential difference.
The power isolation module 20 further includes an output filter capacitor C9, a capacitor C10, a capacitor C14, a reference source filter capacitor C11, and a capacitor C15, wherein a resistor R11 and a capacitor C2 are further connected between the first end of the secondary winding of the isolation transformer T1 and the sampling circuit, and the resistor R11 is an EMC absorption resistor.
The sampling circuit comprises a photoelectric coupler U7, a second voltage reference chip U8, the input end of the photoelectric coupler U7 is electrically connected with the second voltage reference chip U8, and the output end of the photoelectric coupler U7 is connected with the positive electrode of a power supply. The sampling circuit further includes a resistor R14, a resistor R15, a resistor R5, a resistor R3, a resistor R13, and a capacitor C3.
The sensor combination module 40 includes at least two sensor modules, the output terminal of the PC terminal 90 is connected to the input terminal of the first sensor module, the output terminal of the first sensor module is electrically connected to the input terminal of the second sensor module, and the output terminal of the second sensor module is connected to the input terminal of the PC terminal 90. Of course, the number of the sensor modules may be one or a combination of a plurality of the sensor modules.
Specifically, the sensor modules are connected in series with each other through data line I/O interfaces to realize the combined use of the sensor modules, that is, the output end of the PC terminal 90 is connected to the input end of the first sensor module, the output end of the first sensor module is connected to the input end of the second sensor module, the output end of the second sensor module is connected to the input end of the next sensor module, and so on, one path can be connected to a plurality of sensor modules at most, and the output end of the last sensor module is connected to the input end of the PC terminal 90, so that a loop is formed. In this embodiment, the maximum number of sensor modules that can be connected is 255.
In the aspect of module power supply, a direct current wide voltage input range from 5V to 24V is adopted, the power supply module can adapt to various application environments, the power consumption of each sensor module is generally 0.2 watt, the maximum power consumption does not exceed 0.5 watt, the power isolation module 20 is arranged in the power supply module, and the A/D conversion end of each sensor module is electrically isolated from the power supply end and the communication end.
In terms of module communication, firstly, the PC terminal 90 sends a boot code (start parameter), after receiving the boot code, the first sensor module starts to send a data code to the second sensor module, where the data code includes the sensor type, the sensor number "1" and the measured analog data (temperature, pressure, etc.) of the sensor, and after transmission is complete, the PC terminal 90 forwards the boot code. Then, after receiving the data code sent by the first sensor module, the second sensor module first transparently transmits (transparently transmits) the data of the first sensor module, waits until receiving the boot code, then sends its own data, sends the complete boot code of the PC terminal 90, and so on until the PC terminal 90 receives the boot code sent by the phase, at this time, the data reading is completed.
In the aspect of module sorting, a user sets which data is the same type of the sensor on the software of the PC terminal 90, and at this time, the PC terminal 90 automatically groups data without requiring sorting between different types of sensors, and only requiring sorting between the same types of sensors. For example: a machine is provided with 5 temperature sensors, the serial numbers of the 5 temperature sensors are from T1 to T5, only the T1 position is required to be in front of the T2 position, namely T1 is more than T2 is more than T3 is more than T4 is more than T5, each sensor is not required to be close to each other, and the sensors can be placed in front of other types of sensors, can be placed behind the sensors, and can even be placed in the middle. Of course, for redundant sensors of the same category, the PC terminal 90 does not care, and if there are 6 temperature sensors (T1 to T6), the system only processes the data of the sensors T1 to T5, and the data of the sensor T6 is discarded.
Preferably, referring to fig. 5, the modular sensor circuit further includes a status indication module 60, and the control chip 50 outputs a status indication signal to the status indication module 60. The status indication module 60 comprises a current limiting resistor R12 and a light emitting diode group, wherein the current limiting resistor R12 is electrically connected with the light emitting diode group. The light emitting diode group comprises a light emitting diode D6, a light emitting diode D7 and a light emitting diode D8, wherein the light emitting diode D6 is used for emitting a first indicating light signal, the light emitting diode D7 is used for emitting a second indicating light signal, and the light emitting diode D8 is used for emitting a third indicating light signal. It can be seen that the current limiting resistor pack R12 is a plurality of resistors with the same parameters, one pin of the resistors is connected together to serve as a common pin, and the other pins are led out normally, so that the resistor pack has the advantages of directionality, tidiness and small occupied space. The light emitting diode group is used for data transmission/reception indication, a/D conversion indication, status failure indication, and the like.
Therefore, the modular sensor circuit provided by the invention can realize the combination of the sensor modules through the serial connection of the I/O interfaces of a plurality of sensor modules, namely, the output end of the PC end 90 is connected to the input end of the first sensor module, the output end of the first sensor module is connected to the input end of the second sensor module, and so on, one path can be connected with a plurality of sensor modules, the output end of the last sensor module is connected to the input end of the PC end 90, and finally, a loop is formed, thereby realizing the arbitrary combination of various types of sensors.
Moreover, each sensor module can supply power to the sensor probe by the power supply isolation module 20, the a/D conversion end of the sensor module is electrically isolated from the power supply end and the communication end, the anti-interference capability is high, and the sensor probe can be applied in an environment with a certain potential difference.
It should be noted that the above is only a preferred embodiment of the present invention, but the design concept of the present invention is not limited thereto, and any insubstantial modifications made by using the design concept also fall within the protection scope of the present invention.
Claims (9)
1. A modular sensor circuit, comprising:
the device comprises a voltage stabilizing circuit, a power isolation module, a power supply circuit, a sensor probe, a sensor combination module and a control chip, wherein an analog-digital converter is connected between the control chip and the sensor probe, the power supply circuit outputs a power signal for the voltage stabilizing circuit, the voltage stabilizing circuit outputs the power signal after voltage stabilization to the power isolation module, and the power isolation module respectively outputs the power signal after electrical isolation to the control chip and the sensor combination module;
the sensor combination module comprises at least two sensor modules, wherein the output end of a PC end is connected with the input end of a first sensor module, the output end of the first sensor module is electrically connected with the input end of a second sensor module, and the output end of the second sensor module is connected with the input end of the PC end;
the power supply circuit comprises a voltage input end, a voltage output end and a communication interface chip, wherein a first end and a second end of the communication interface chip are respectively electrically connected with the voltage input end, a third end and a fourth end of the communication interface chip are respectively electrically connected with the voltage output end, and an isolation chip is further connected between the communication interface chip and the control chip.
2. A modular sensor circuit as claimed in claim 1, wherein:
the voltage stabilizing circuit comprises a first power chip, a first diode, a second diode and an output filter circuit, wherein the first end of the first power chip is electrically connected with the cathode of the first diode, the second end of the first power chip is electrically connected with the cathode of the second diode, the third end of the first power chip is further connected with a power indication circuit, and a first inductor is further connected between the fourth end of the first power chip and the output filter circuit.
3. A modular sensor circuit as claimed in claim 2, wherein:
the power supply indicating circuit comprises a first resistor and a first light emitting diode, wherein the first resistor is connected with the first light emitting diode in series.
4. A modular sensor circuit according to any of claims 1 to 3, wherein:
the power isolation module comprises a second power chip, an isolation transformer, a sampling circuit and a first voltage reference chip, wherein two ends of a primary coil of the isolation transformer are electrically connected with two ends of the second power chip, a first end of a secondary coil of the isolation transformer is electrically connected with the sampling circuit, and a third diode is connected between a second end of the secondary coil of the isolation transformer and the first voltage reference chip.
5. The modular sensor circuit of claim 4, wherein:
and a first resistor and a first capacitor are also connected between the first end of the secondary coil of the isolation transformer and the sampling circuit.
6. The modular sensor circuit of claim 5, wherein:
the sampling circuit comprises a photoelectric coupler and a second voltage reference chip, wherein the input end of the photoelectric coupler is electrically connected with the second voltage reference chip, and the output end of the photoelectric coupler is connected with the positive electrode of a power supply.
7. A modular sensor circuit according to any of claims 1 to 3, wherein:
the modularized sensor circuit further comprises a state indicating module, and the control chip outputs a state indicating signal to the state indicating module.
8. The modular sensor circuit of claim 7, wherein:
the state indicating module comprises a current limiting exclusion and a light emitting diode group, and the current limiting exclusion is electrically connected with the light emitting diode group.
9. A modular sensor circuit as claimed in claim 8, wherein:
the light emitting diode group comprises a second light emitting diode, a third light emitting diode and a fourth light emitting diode, the second light emitting diode is used for emitting a first indicating light signal, the third light emitting diode is used for emitting a second indicating light signal, and the fourth light emitting diode is used for emitting a third indicating light signal.
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| CN109900367A (en) * | 2019-04-10 | 2019-06-18 | 重庆中科芯亿达电子有限公司 | A kind of anti-jamming signal processing chip |
| CN110596341A (en) * | 2019-06-28 | 2019-12-20 | 南京天补智联信息科技有限公司 | Integrated soil and surrounding environment detection system |
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