CN108966624B - Quantum chip packaging device - Google Patents
Quantum chip packaging device Download PDFInfo
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- CN108966624B CN108966624B CN201810997838.0A CN201810997838A CN108966624B CN 108966624 B CN108966624 B CN 108966624B CN 201810997838 A CN201810997838 A CN 201810997838A CN 108966624 B CN108966624 B CN 108966624B
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- magnetostatic
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
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- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention belongs to the field of chip packaging, and particularly discloses a quantum chip packaging device, which comprises: the electromagnetic shielding packaging box is used for horizontally placing the quantum chip to be packaged and has an electromagnetic shielding effect; and the magnetostatic shielding cover is wrapped outside the electromagnetic shielding packaging box and has magnetostatic shielding effect. The invention provides a quantum chip packaging device with a two-layer shielding structure, which is characterized in that the two-layer shielding structure is respectively an electromagnetic shielding packaging box with an electromagnetic shielding effect and a magnetostatic shielding cover with a magnetostatic shielding effect, wherein the magnetostatic shielding cover is wrapped outside the electromagnetic shielding packaging box, and the two-layer shielding structure acts together to respectively realize shielding of different types of magnetic fields and magnetic fields with different intensities, so that the working environment of the quantum chip to be packaged in the electromagnetic shielding packaging box is jointly ensured.
Description
Technical Field
The invention belongs to the technical field of chip packaging, and particularly relates to a quantum chip packaging device.
Background
The three-dimensional packaging technology is widely applied to packaging of the quantum chip because the signals on the quantum chip can be led out through the third dimension in the longitudinal direction, more quantum elements can be contained on the premise of not expanding the size of the quantum chip, meanwhile, the size of the packaging box can be reasonably adjusted according to the size of the quantum chip, redundant space around the quantum chip is compressed as much as possible, a space standing wave mode is improved, and interference between the space standing wave and the quantum elements is avoided.
Because of the working conditions and the rigors of the quantum chip, the quantum chip needs an extremely low working temperature and an effective noise shielding working environment, in the prior art, the application number 201721872396.4 of Chinese patent literature is as follows: 2017.12.28A patent name of a noise reduction device of a quantum chip discloses a noise shielding device for the quantum chip, which mainly aims at shielding and reducing magnetic field radiation noise and infrared radiation noise.
In the prior art, only the shielding barrel structure made of aluminum alloy 6061 is adopted as the packaging box structure for magnetic field radiation noise, and the shielding of electromagnetic radiation noise can only be realized and shielding including static magnetic fields can not be realized when the shielding barrel structure is used. In addition, in the disclosure, the infrared radiation shielding layer is coated on the inner wall of the shielding barrel, so that negative influence exists on the skin effect of electromagnetic shielding on the inner surface of the shielding barrel, the shielding effect is further influenced, and the working environment of the quantum chip to be packaged cannot be effectively ensured.
Disclosure of Invention
The invention aims to provide a quantum chip packaging device which solves the defects in the prior art, can realize different types of electromagnetic shielding of a quantum chip to be packaged and ensures that the quantum chip to be packaged has a good working environment.
The technical scheme adopted by the invention is as follows:
a quantum chip packaging apparatus, the quantum chip packaging apparatus comprising:
the electromagnetic shielding packaging box is used for horizontally placing the quantum chip to be packaged and has an electromagnetic shielding effect;
wherein, the quantum chip packaging device further includes:
and the magnetostatic shielding cover is wrapped outside the electromagnetic shielding packaging box and has magnetostatic shielding effect.
The quantum chip packaging apparatus as described above, wherein preferably, the electromagnetic shielding packaging box includes a box body and a cover body;
the cover body covers the top opening of the box body.
The quantum chip packaging device as described above, wherein preferably, a hook is provided at a periphery of the top opening of the case body;
the periphery of the cover body is provided with a notch for accommodating the clamping hook.
The quantum chip packaging apparatus as described above, wherein preferably the magnetostatic shield includes two housings;
the two covers are respectively covered at the upper end and the lower end of the electromagnetic shielding packaging box and are mutually abutted.
The quantum chip packaging apparatus as described above, wherein preferably, the housing includes:
a housing having an opening;
the wrapping columns are uniformly arranged at the opening of the shell at intervals and fixedly connected with the shell;
the shell is covered on the electromagnetic shielding packaging box through the opening, and the wrapping column is attached to the electromagnetic shielding packaging box.
The quantum chip packaging apparatus as described above, wherein preferably, a surface area of a side of the encapsulation post facing the electromagnetic shielding packaging box is smaller than a surface area of a side of the encapsulation post facing away from the electromagnetic shielding packaging box.
The quantum chip packaging device as described above, wherein preferably, at least one through hole is formed on a side wall of the electromagnetic shielding packaging box;
the through hole is arranged corresponding to a port of the periphery of the quantum chip to be packaged and is used for accommodating one end of a connector connected with the port of the quantum chip to be packaged;
and the magnetostatic shielding cover is provided with a through hole corresponding to the through hole, and the through hole is used for accommodating the other end of the connector connected with the port of the quantum chip to be packaged.
The quantum chip packaging apparatus as described above, wherein preferably, the quantum chip packaging apparatus further comprises:
and one end of the radiating piece is arranged in the electromagnetic shielding packaging box and is attached and fixed on the quantum chip to be packaged, and the other end of the radiating piece sequentially extends out of the electromagnetic shielding packaging box and the magnetostatic shielding cover.
The quantum chip packaging apparatus as described above, wherein preferably, the quantum chip packaging apparatus further comprises:
the heat conduction piece, the one end detachable of heat conduction piece is connected the radiating piece is kept away from the one end of waiting to encapsulate the quantum chip, the refrigeration platform is connected to the other end of heat conduction piece.
The quantum chip packaging apparatus as described above, wherein preferably, the quantum chip packaging apparatus further comprises:
the mounting tool comprises a mounting tool body, wherein one end of the mounting tool body is detachable, the radiating piece is far away from one end of the quantum chip to be packaged, the magnetostatic shielding cover is arranged on the mounting tool body, and the other end of the mounting tool body is connected with a part to be mounted.
Compared with the prior art, the quantum chip packaging device with the two-layer shielding structure has the advantages that requirements of harsh working environments of quantum chips are met, the two-layer shielding structure is an electromagnetic shielding packaging box with an electromagnetic shielding effect and a magnetostatic shielding cover with a magnetostatic shielding effect, the magnetostatic shielding cover is wrapped outside the electromagnetic shielding packaging box, the two-layer shielding structure acts together, shielding of different types of magnetic fields and magnetic fields with different intensities is achieved, and the working environments of quantum chips to be packaged in the electromagnetic shielding packaging box are guaranteed together.
In addition, when setting up, set up electromagnetic shield encapsulation box at the inlayer, and static magnetic shield cover sets up at the skin, and electromagnetic shield encapsulation box direct contact waits to encapsulate the quantum chip, and when carrying out electromagnetic shield effect, electromagnetic shield encapsulation box surface's effect of attaching is better, can effectively guarantee electromagnetic shield effect.
Furthermore, the static magnetic shielding cover has a certain space mechanical structure, and the static magnetic shielding cover wraps the outer surface of the electromagnetic shielding packaging box, so that on one hand, the space mechanical structure of the static magnetic shielding cover can increase the integral strength and the space stability of the packaging device, and on the other hand, the static magnetic shielding cover wraps the electromagnetic shielding packaging box, so that the integral volume of the packaging device cannot be greatly increased, and the integral miniaturization of the packaging device and the compression of the outer space of the electromagnetic shielding packaging box can be ensured.
Drawings
Fig. 1 is a schematic structural diagram of a quantum chip packaging device provided by the present invention;
FIG. 2 is a schematic structural view of the cartridge body;
FIG. 3 is a schematic view of the structure of the cover;
FIG. 4 is a schematic structural view of a heat sink;
FIG. 5 is a schematic structural view of the housing;
fig. 6 is a schematic structural view of the heat conductive member;
fig. 7 is a schematic structural diagram of the installation tool.
Reference numerals illustrate:
1-an electromagnetic shielding packaging box;
11-a box body, 111-a clamping hook;
12-cover body, 121-notch;
13-through holes;
2-magnetostatic shield;
21-via holes;
22-housing, 221-shell, 222-wrap post, 223-perforations;
3-a heat sink;
31-heat dissipation plates, 32-heat dissipation columns;
4-a heat conducting member;
and 5-installing the tool.
Detailed Description
The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
An embodiment of the present invention provides a quantum chip packaging apparatus, referring to fig. 1, which includes an electromagnetic shielding packaging box 1 and a magnetostatic shielding cover 2.
Wherein: the electromagnetic shielding packaging box 1 is used for horizontally placing the quantum chip to be packaged, and the electromagnetic shielding packaging box 1 has an electromagnetic shielding effect; and the magnetostatic shielding cover 2 is wrapped outside the electromagnetic shielding packaging box 1, and the magnetostatic shielding cover 2 has magnetostatic shielding effect.
The invention provides a quantum chip packaging device with a two-layer shielding structure, which is characterized in that the two-layer shielding structure comprises an electromagnetic shielding packaging box 1 with an electromagnetic shielding effect and a magnetostatic shielding cover 2 with a magnetostatic shielding effect, wherein the magnetostatic shielding cover 2 is wrapped outside the electromagnetic shielding packaging box 1, and the two-layer shielding structure acts together to respectively realize shielding of different types of magnetic fields and magnetic fields with different intensities, so that the working environment of the quantum chip to be packaged in the electromagnetic shielding packaging box 1 is jointly ensured.
In addition, when setting up, set up electromagnetic shield enclosure 1 in the inlayer, and static magnetic shield cover 2 sets up in the skin, and electromagnetic shield enclosure 1 direct contact waits to encapsulate the quantum chip, and when carrying out electromagnetic shield effect, electromagnetic shield enclosure 1 surface trend attaches the effect better, can effectively guarantee electromagnetic shield effect.
Furthermore, the magnetostatic shielding case 2 has a certain space mechanical structure, the magnetostatic shielding case 2 is wrapped on the outer surface of the electromagnetic shielding packaging box 1, and on one hand, the space mechanical structure of the magnetostatic shielding case 2 can increase the strength and the space stability of the whole packaging device; on the other hand, the magnetostatic shield case 2 is wrapped on the outer surface of the electromagnetic shielding packaging box 1, so that the whole volume of the packaging device is not greatly increased, and the miniaturization of the whole packaging device and the compression of the outer space of the electromagnetic shielding packaging box can be ensured.
When specifically set up, the material of this embodiment selection electromagnetic shielding enclosure 1 is aluminum alloy 6061, and aluminum alloy 6061 contains very little amount of magnetic component, has good superconducting property, can realize good magnetic field radiation shielding effect below 1.2K, can shield the quantum chip magnetic field through the electromagnetic shielding enclosure of this kind of material, and then reduces the electromagnetic radiation noise of the environment that the quantum chip is located by a wide margin.
In addition, the material of the magnetostatic shield 2 is permalloy, which is an iron-nickel alloy with higher magnetic permeability under a weaker magnetic field, and has good magnetic shielding effect on weak magnetostatic.
In a specific design, the shape and size of the electromagnetic shielding packaging box 1 and the shape and size of the magnetostatic shielding cover 2 are kept basically consistent, and are set according to the shape of the quantum chip to be packaged, and it should be noted that the quantum chip to be packaged in this embodiment at least includes a sub-chip with a quantum computing function and a substrate, the substrate is usually a PCB board, and the sub-chip with the quantum computing function is fixed on the PCB board and is located in the middle of the PCB board. The overall shape of the quantum chip to be packaged is determined by the shape of the PCB.
The shape of the electromagnetic shielding packaging box 1 is set according to the shape of the PCB, and may be generally a polygonal body with a shape similar to a column, and the number of sides of the polygonal body is set according to the number of ports of the quantum chip to be packaged, for example, a quadrilateral body, a hexagonal body, an octagonal body, a sixteen-sided body, a thirty-two-sided body, and the like; referring to fig. 2, in this embodiment, the shape of the PCB and the shape of the cross section of the electromagnetic shielding package 1 are preferably regular dodecagon.
In addition, in order to realize the extraction of the port of the quantum chip to be packaged, as shown in fig. 2, a through hole 13 needs to be formed on the side wall of the electromagnetic shielding packaging box 1, and the through hole 13 is arranged corresponding to the port of the periphery of the quantum chip to be packaged and is used for accommodating one end of a connector connected with the port of the quantum chip to be packaged; referring to fig. 5, the magnetostatic shield 2 needs to be provided with a via hole 21 corresponding to the through hole 13, and the via hole 21 is used for accommodating the other end of the connector connected with the port of the quantum chip to be packaged.
When specifically arranged, at least one through hole 13 is arranged, and the specific number of the through holes is matched with the number of ports of the quantum chip to be packaged.
Further, as a preferred solution of the present embodiment, referring to fig. 2 and 3, the electromagnetic shielding packaging box 1 includes a box body 11 and a cover 12; the cover 12 is sealed to the top opening of the case body 11. The electromagnetic shielding packaging box 1 is arranged to be a separation structure of the box body 11 and the cover body 12 which can be sealed, so that the quantum chip to be packaged can be placed inside the electromagnetic shielding packaging box 1.
In order to facilitate the sealing and limiting of the box body 11 and the cover 12, as shown in fig. 2 and 3, as a preferred technical solution of this embodiment, a hook 111 is disposed at the periphery of the top opening of the box body 11; the periphery of the cover 12 is provided with a notch 121 for accommodating the hook 111.
During assembly, the notch 121 is aligned with the hook 111, and then the cover 12 and the box body 11 are fixedly connected through bolts. The side wall of the top opening of the box body 11 can be reserved with a threaded hole, the cover body 12 is reserved with a threaded hole, then the cover body 12 and the box body 11 are assembled through bolts embedded in the threaded hole, and in the process, the notch 121 and the clamping hook 111 are matched to play a limiting role.
When the device is specifically arranged, at least two hooks 111 are arranged, and the hooks 111 are uniformly distributed; in this embodiment, preferably, four hooks 111 are provided, and the four hooks 111 are uniformly distributed; the corresponding notches 121 are provided in 4.
In order to facilitate the assembly of the magnetostatic shield 2, as a preferred technical solution of the present embodiment, the magnetostatic shield 2 includes two housings 22; the two covers 22 are respectively arranged at the upper end and the lower end of the electromagnetic shielding packaging box 1 and are mutually abutted.
In a specific implementation, the shapes and sizes of the two shells 22 may be completely consistent, and the sizes of the shells 22 may be improved according to needs, and the two shells 22 adopted by the magnetostatic shielding shell 2 provided in this embodiment are respectively covered at two ends of the electromagnetic shielding packaging box 1 from two directions, that is, the two shells 22 are respectively covered at the electromagnetic shielding packaging box 1 from the top and the bottom of the electromagnetic shielding packaging box 1, and according to installation needs, the height size of the shell 22 which is fixed by first installation may be designed to be larger than the height size of the shell 22 which is fixed by second installation, in this embodiment, the shell 22 which is covered on the electromagnetic shielding packaging box 1 from the bottom of the electromagnetic shielding packaging box 1 is fixed by first installation, and the shell 22 which is covered on the electromagnetic shielding packaging box 1 from the top of the electromagnetic shielding packaging box 1 is fixed by second installation.
In the embodiment, the static magnetic shielding cover 2 is formed by two covers 22, so that the installation is simple and convenient, and in addition, the whole structure of the packaging structure is more attractive by adopting the two covers 22 which are mutually abutted; furthermore, the cover shell 22 positioned at the upper end of the electromagnetic shielding packaging box 1, namely the cover shell 22 positioned at the top of the electromagnetic shielding packaging box 1, can cover the cover body 12 inside the cover shell 22, so that the stability of the cover body 12 relative to the box body 11 is ensured; further, the two covers 22 are basically consistent, and fixing holes can be formed in the covers 22, so long as the positions of the covers 22 positioned at the top of the electromagnetic shielding packaging box 1 and the covers 22 positioned at the bottom of the electromagnetic shielding packaging box 1 are ensured to be corresponding, the fixing of the whole structure of the packaging device can be realized through the corresponding mounting holes on the covers and by means of bolts.
Further, referring to fig. 5, the cover 22 includes a housing 221 and a wrapping post 222.
Wherein: the casing 221 has an opening, the casing 221 is covered on the electromagnetic shielding packaging box 1 through the opening, the wrapping posts 222 are uniformly arranged at intervals at the opening of the casing 221 and fixedly connected with the casing 221, and the wrapping posts 222 are attached to the electromagnetic shielding packaging box 1.
In this embodiment, the casing 22 is configured as a structure of the casing 221 and uniformly distributed wrapping columns 222, so that on one hand, the casing 221 can better wrap the top end of the electromagnetic shielding packaging box 1, namely the cover 12, or better wrap the bottom of the electromagnetic shielding packaging box 1, thereby playing a role in ensuring the overall structural strength of the packaging device and not increasing the overall volume of the packaging device; on the other hand, the gaps between the wrapping posts 222 form vias 21, and the vias 21 provide space for the extraction of the ports of the quantum chips to be packaged, for accommodating the other ends of connectors that match the ports of the quantum chips to be packaged.
As a preferred aspect of the present embodiment, the surface area of the side of the wrapping post 222 facing the electromagnetic shielding enclosure 1 is smaller than the surface area of the side of the wrapping post 222 facing away from the electromagnetic shielding enclosure 1. When the cross section of the electromagnetic shielding packaging box 1 is regular polygon, the outer surface of the peripheral side of the electromagnetic shielding packaging box 1 presents a polygon, the surface area of the wrapping column 222 facing to one side of the electromagnetic shielding packaging box 1 is smaller, for example, the wrapping column 222 is arranged to be isosceles trapezoid in cross section, so that on one hand, effective contact wrapping between the wrapping column 222 and the surface of the electromagnetic shielding packaging box 1 can be ensured, and on the other hand, the overall magnetostatic shielding effect of the wrapping column 222 can be ensured; furthermore, the arrangement makes the gap between any two adjacent wrapping posts 222 be large inside and small outside, wherein the inside refers to the side of the gap close to the electromagnetic shielding packaging box 1, and the outside refers to the side of the gap far away from the electromagnetic shielding packaging box 1, and the existence of the gap with the characteristics can expose part of the surface of the electromagnetic shielding packaging box 1, so as to ensure the whole electromagnetic shielding effect of the electromagnetic shielding packaging box 1, and can increase the effect of heat evacuation.
In addition, when the quantum chip operates in the electromagnetic shielding packaging box 1, a large amount of signals are input into the quantum chip for processing, so that the temperature of the quantum chip is possibly higher than 20mK, and a large amount of thermal noise is generated, and the thermal noise can directly damage information stored in the quantum chip, so that the quantum chip cannot operate normally. Therefore, as a preferred technical solution of this embodiment, the quantum chip packaging apparatus further includes a heat dissipation member 3, one end of the heat dissipation member 3 is disposed in the electromagnetic shielding packaging box 1 and is attached to and fixed on the quantum chip to be packaged, and the other end of the heat dissipation member 3 sequentially extends out of the electromagnetic shielding packaging box 1 and the magnetostatic shielding cover 2. The heat sink 3 may serve to draw heat from the electromagnetic shield package 1 and the magnetostatic shield 2 out of the electromagnetic shield package 1.
When specifically provided, the heat sink 3 may be made of a material having high thermal conductivity, for example: oxygen-free copper with high thermal conductivity.
The specific shape of the heat sink 3 is required to be set according to the shape of the entire quantum chip, the shape of the electromagnetic shield package 1, and the heat conduction path from the inside of the electromagnetic shield package 1 to the outside of the electromagnetic shield package 1.
As a preferable technical solution of the present embodiment, the heat sink 3 includes a heat dissipation plate 31 and a heat dissipation post 32; the heat dissipation plate 31 is disposed in the electromagnetic shielding packaging box 1 and is attached and fixed on the quantum chip to be packaged. It should be noted that, as described above, the quantum chip in this embodiment includes a sub-chip with a quantum computing function and a substrate, where the substrate is usually a PCB, and the quantum chip is fixed on the PCB. The overall shape of the quantum chip to be packaged is determined by the shape of the PCB. When the structure is specifically arranged, the shape of the heat dissipation plate 31 is consistent with that of the quantum chip to be packaged, namely, the shape of the heat dissipation plate 31 is consistent with that of the PCB, and the heat dissipation plate 31 is fixedly arranged on one side of the PCB, on which no sub-chip is arranged; the heat dissipation column 32 is disposed on one side of the heat dissipation member 3 away from the quantum chip to be packaged, extends in a direction away from the quantum chip to be packaged, and sequentially passes through the electromagnetic shielding packaging box 1 and the magnetostatic shielding cover 2, so that heat dissipation in the electromagnetic shielding packaging box 1 is realized.
In the present embodiment, the heat dissipation plate 31 is placed below the quantum chip to be packaged, and is simultaneously attached and fixed to the bottoms of the quantum chip to be packaged and the electromagnetic shielding packaging box 1; meanwhile, the bottom of the electromagnetic shielding packaging box 1 and the middle of the shell 221 of the housing 22 at the bottom of the electromagnetic shielding packaging box 1 are provided with through holes 223 for the heat dissipation columns 32 to pass through, wherein the shape of the through holes 223 is consistent with that of the heat dissipation columns 32, and the through holes and the heat dissipation columns 32 are in clearance fit.
In addition, the heat dissipation post 32 and the heat dissipation plate 31 may be integrally formed, riveted, welded, or the like. In order to ensure uniformity of heat transfer, the heat dissipation post 32 and the heat dissipation plate 31 are preferably integrally formed.
Furthermore, the number of the heat dissipation posts 32 can be set according to the needs, and one, two, three and the like can be set; when a plurality of heat dissipation posts 32 are provided, each heat dissipation post 32 is preferably uniformly provided and symmetrically provided about the central axis of the heat dissipation plate 31. Illustratively, the present embodiment symmetrically provides two heat dissipation posts 32.
Further, referring to fig. 6, the quantum chip packaging device further includes a heat conducting member 4, one end of the heat conducting member 4 is detachably connected to one end of the heat dissipating member 3 away from the quantum chip to be packaged, and the other end of the heat conducting member 4 is connected to a refrigeration platform. Through the cooperation of radiating part 3 and heat conduction piece 4, can effectively realize the cooling of electromagnetic shield enclosure 1, guarantee the low temperature operational environment of quantum chip.
At the time of installation, the heat conductive member 4 can be assembled and positioned by using the two heat dissipation posts 32.
Further, referring to fig. 7, the quantum chip packaging apparatus further includes a mounting tool 5, the heat dissipation member 3 with one detachable end of the mounting tool 5 is far away from one end of the quantum chip to be packaged, the magnetostatic shield 2 and the box body 11, and the other end of the mounting tool 5 is connected to the mounting position to be mounted. The material of the heat conductive member 4 may be oxygen-free copper with high heat conductivity.
The packaging device can be integrally mounted on the mounting part through the mounting tool 5, mounting holes can be reserved for the magnetostatic shielding cover 2 and the box body 11, and the mounting tool 5 is mounted on the packaging device through the mounting bolts and the reserved mounting holes.
The invention is assembled by the following steps:
the first step: to-be-packaged quantum chip, box body 11 and housing 22 at the bottom of electromagnetic shielding packaging box 1, specifically:
firstly, the heat dissipation element 3 is placed in the box body 11, one of the covers 22 is assembled on the box body 11 from the bottom of the box body 11, wherein: through holes 13 formed in the side walls of the electromagnetic shielding packaging box 1 can be reserved between the wrapping posts 222 of the housing 22.
Then pushing down the heat dissipation member 3, enabling the heat dissipation column 32 of the heat dissipation member 3 to sequentially pass through the bottom of the box body 11 and the through hole 223 arranged in the middle of the shell 221 of the housing 22, enabling the heat dissipation plate 31 of the heat dissipation member 3 to be attached and fixed at the bottom of the box body 11, then placing the quantum chip to be packaged on the heat dissipation plate 31, and taking care that the sub-chip with the quantum computing function of the quantum chip is arranged far away from the heat dissipation plate 31, and then realizing the fixed connection of the quantum chip to be packaged, the box body 11 and the housing 22 through the reserved fixing hole penetrating through the PCB of the quantum chip to be packaged, the reserved fixing hole on the bottom of the box body 11 and the bolt in the reserved fixing hole on the shell 221 of the housing 22;
and a second step of: leading out a port signal of a quantum chip to be packaged, and specifically:
the connector for signal extraction is inserted into the through hole 13 of the electromagnetic shielding packaging box 1 through the through hole 21 and is communicated with the port of the quantum chip to be packaged.
And a third step of: the cover body 12 and the cover shell 22 at the top end of the electromagnetic shielding packaging box 1 are assembled, specifically:
aligning the notch 121 of the cover 12 with the hook 111 on the box body 11, and then placing the cover 12 on the box body 11; then, the cover 12 and the box body 11 are fixedly connected through bolts; after the cover body 12 and the box body 11 are firmly fixedly connected, the other cover shell 22 is covered on the top end of the electromagnetic shielding packaging box 1 from the cover body 12, and the position of the cover shell 22 is adjusted to be corresponding to and relatively abutted against the position of the cover shell 22 positioned at the bottom of the electromagnetic shielding packaging box 1.
Fourth step: the assembly of the heat conducting member 4 or the installation tool 5, specifically:
the heat conductive member 4 or the mounting tool 5 may be assembled by means of the heat radiation column 32, the bottom of the case body 11, and the mounting hole provided in the case 221 of the cover 22.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (9)
1. A quantum chip packaging apparatus, the quantum chip packaging apparatus comprising:
an electromagnetic shielding packaging box (1) with electromagnetic shielding effect is used for horizontally placing the quantum chip to be packaged;
the quantum chip packaging device is characterized by further comprising:
a magnetostatic shielding cover (2) with magnetostatic shielding effect, wherein the magnetostatic shielding cover (2) is wrapped and arranged outside the electromagnetic shielding packaging box (1);
the static magnetic shielding cover (2) comprises wrapping posts (222) which are uniformly arranged at intervals and are attached to the electromagnetic shielding packaging box (1), and the surface area of one side of the wrapping posts (222) facing the electromagnetic shielding packaging box (1) is smaller than the surface area of one side of the wrapping posts (222) away from the electromagnetic shielding packaging box (1).
2. The quantum chip packaging apparatus according to claim 1, wherein the electromagnetic shielding package (1) comprises a package body (11) and a lid (12);
the cover body (12) covers the top opening of the box body (11).
3. The quantum chip packaging device according to claim 2, wherein a peripheral edge of the top opening of the cartridge body (11) is provided with a hook (111);
the periphery of the cover body (12) is provided with a notch (121) for accommodating the clamping hook (111).
4. The quantum chip packaging apparatus according to claim 1, wherein the magnetostatic shield (2) further includes: a housing (221),
the housing (221) has an opening;
the wrapping posts (222) are uniformly arranged at the opening of the shell (221) at intervals and fixedly connected with the shell (221) to form a housing (22).
5. The quantum chip packaging apparatus according to claim 4, wherein the magnetostatic shield (2) includes:
comprising two housings (22);
the two covers (22) are respectively arranged at the upper end and the lower end of the electromagnetic shielding packaging box (1) in a covering mode and are mutually abutted.
6. The quantum chip packaging apparatus of claim 1, wherein: at least one through hole (13) is formed in the side wall of the electromagnetic shielding packaging box (1);
the through hole (13) is arranged corresponding to a port of the periphery of the quantum chip to be packaged and is used for accommodating one end of a connector connected with the port of the quantum chip to be packaged;
and a via hole (21) corresponding to the through hole (13) is arranged on the magnetostatic shielding cover (2), and the via hole (21) is used for accommodating the other end of a connector connected with a port of the quantum chip to be packaged.
7. The quantum chip packaging apparatus of claim 1, wherein: the quantum chip packaging apparatus further includes:
the heat dissipation piece (3), the one end setting of heat dissipation piece (3) is in electromagnetic shield packaging box (1) to laminate and fix wait to encapsulate on the quantum chip, the other end of heat dissipation piece (3) stretches out in proper order electromagnetic shield packaging box (1) with magnetostatic shield cover (2).
8. The quantum chip packaging apparatus of claim 7, wherein: the quantum chip packaging apparatus further includes:
the heat conduction piece (4), the one end detachable of heat conduction piece (4) is connected radiating piece (3) is kept away from wait to encapsulate the one end of quantum chip, refrigerating platform is connected to the other end of heat conduction piece (4).
9. The quantum chip packaging apparatus of claim 7, wherein: the quantum chip packaging apparatus further includes:
the mounting tool comprises a mounting tool body (5), wherein one end of the mounting tool body (5) is detachable, the radiating piece (3) is far away from one end of the quantum chip to be packaged, the magnetostatic shielding cover (2) and the box body (11) are arranged, and the other end of the mounting tool body (5) is connected with a part to be mounted.
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| CN201810997838.0A CN108966624B (en) | 2018-08-29 | 2018-08-29 | Quantum chip packaging device |
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| CN201810997838.0A CN108966624B (en) | 2018-08-29 | 2018-08-29 | Quantum chip packaging device |
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Address after: 230008 6th floor, building E2, phase II, venture industrial park, high tech Zone, Hefei City, Anhui Province Applicant after: Benyuan Quantum Computing Technology (Hefei) Co.,Ltd. Address before: 230008 6th floor, building E2, phase II, venture industrial park, high tech Zone, Hefei City, Anhui Province Applicant before: ORIGIN QUANTUM COMPUTING COMPANY, LIMITED, HEFEI |
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