CN108966598A - Electronic computing device - Google Patents

Electronic computing device Download PDF

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Publication number
CN108966598A
CN108966598A CN201810869302.0A CN201810869302A CN108966598A CN 108966598 A CN108966598 A CN 108966598A CN 201810869302 A CN201810869302 A CN 201810869302A CN 108966598 A CN108966598 A CN 108966598A
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CN
China
Prior art keywords
air
air hose
equipment box
heat
computing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810869302.0A
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Chinese (zh)
Inventor
环瑛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foshan Xin Dazhi Hui Technology Co Ltd
Original Assignee
Foshan Xin Dazhi Hui Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foshan Xin Dazhi Hui Technology Co Ltd filed Critical Foshan Xin Dazhi Hui Technology Co Ltd
Priority to CN201810869302.0A priority Critical patent/CN108966598A/en
Publication of CN108966598A publication Critical patent/CN108966598A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20154Heat dissipaters coupled to components
    • H05K7/20163Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications

Abstract

The invention proposes a kind of electronic computing devices, comprising: at least one equipment box offers air inlet on equipment box, is provided in equipment box and is laid at least one circuit board;Heat sink, corresponding with circuit board to be disposed adjacent, heat sink is used to absorb heat to circuit board;First air hose is correspondingly connected with one by one with heat sink, and the air intake of the first air hose is connected to heat sink;External fan is set to the outside of equipment box, and can be connected with the first air hose, wherein by opening external fan, carries out air draught to electronic computing device.According to the technical solution of the present invention, external fan can be the external cooling fan of centralization, so as to improve radiating efficiency, and reduce energy consumption, heat directly can be drained into outdoor by external fan, so as to avoid indoor thermal cycle, further improve the efficiency of heat dissipation, external fan can also improve indoor environment, further increase the service life of electronic computing device.

Description

Electronic computing device
Technical field
The present invention relates to field of radiating, in particular to a kind of electronic computing device.
Background technique
In the related technology, it gives off heat in use for motor calculations equipment, chips such as virtual digit coin mine machines, In order to guarantee the normal work of mine machine core piece, it is necessary to which otherwise the heat discharge mine machine generated in time is not filled in heat dispersal situations Under conditions of point, mine machine is allowed to continue to work under conditions of high temperature that mine machine cisco unity malfunction or internal short circuits will be caused, Chip even is burnt, the continuous improvement of power is calculated recently as mine machine, heat generation density is also gradually increased, therefore it is to heat dissipation performance Requirement also more come also high, mine machine heat sink conception on the market predominantly installs multiple radiator fans, side at the mine machine back side now Portion installs a powerful main radiator fan or installs fan in the internal circuit board two sides of mine machine, forces blowing heat dissipation, These schemes have some effects to the heat dissipation of mine machine, but there are still following defects:
(1) there is heat dissipation gradient problem in the radiating mode of end through type, and the spot temperature close to fan can be relatively low, but Be the opposite of radiator fan will appear heat concentrate the case where, cause radiate terminal temperature sharply increase, exist burn out circuit board, The risk of the electronic components such as video card.
(2) radiator fan in indoor environment locating for heat dissipation to mine machine, will directly lead to room temperature rapid increase, and into Air port is directly sucked in room air, causes the cooling wind temperature of air inlet also very high, forms a thermal cycle indoors, can make to dissipate Worse and worse, efficiency is lower and lower for thermal effect.
(3) it radiates side by side in use multi-fan, the heat excluded can be made to interfere with each other, influence heat dissipation effect, and can incite somebody to action The impurity such as the particle dust of air are directly strongly blown on circuit board, and can reduce the last electronic component of circuit board uses the longevity Life.
(4) a large amount of heat can be generated when mine machine works, causes radiator fan that can be constantly in working condition, noise is special Greatly, lead to indoor bad environments.
Summary of the invention
At least one in order to solve the above-mentioned technical problem, it is an object of the present invention to provide a kind of calculating of electronics to set It is standby.
To achieve the goals above, technical solution of the present invention proposes a kind of electronic computing device, comprising: at least one Equipment box offers air inlet on equipment box, is provided in equipment box and is laid at least one circuit board;Heat absorption dress It sets, corresponding with circuit board to be disposed adjacent, heat sink is used to absorb heat to circuit board;First air hose, it is corresponding one by one with heat sink Connection, the air intake of the first air hose are connected to heat sink;External fan is set to the outside of equipment box, and can be with One air hose conducting, wherein by opening external fan, air draught is carried out to electronic computing device.
In the technical scheme, by the way that external fan is arranged in the external of equipment box, in external fan starting after, gas Stream is entered in equipment box by air inlet, and carries out heat exchange with circuit board, and the air-flow after heat absorption is sucked by heat sink In first air hose, after importing external fan, heat is drained into device external, on the one hand, external fan can be centralized External cooling fan so as to improve radiating efficiency, and reduces energy consumption, and on the other hand, external fan can be directly by heat Outdoor is drained into, so as to avoid indoor thermal cycle, further improves the efficiency of heat dissipation, in another aspect, external fan is being set When being placed in outdoor, room noise can also be reduced, to improve indoor environment, further increase electronic computing device uses the longevity Life,.
In addition, the electronic computing device in above-described embodiment provided by the invention can also have following supplementary technology special Sign:
In the above-mentioned technical solutions, it is preferable that the first air hose is set to the inside of equipment box;It is offered on equipment box The outlet air end of air outlet, the first air hose is adapted to assembling with air outlet;Electronic computing device further include: the second air hose is set to The outside of standby cabinet, the air intake of the second air hose are connected to the outlet air end of the first air hose;External fan is connected to the second air hose Outlet air end, wherein when equipment box has multiple, multiple second air hoses are connected to external fan.
In the technical scheme, by the way that the second air hose is arranged, external fan can be arranged far from equipment box as far as possible, and External fan is set to outdoor, avoids indoor circulation to realize.
In any of the above-described technical solution, it is preferable that electronic computing device further include: temperature sensor is arranged in equipment In cabinet, temperature sensor is for acquiring the intracorporal real time temperature of equipment box;Controller is respectively connected to temperature sensor and outer Set blower, wherein for controller when detecting that real time temperature is greater than or equal to preset temperature threshold, external fan is opened in control.
In the technical scheme, by setting temperature sensor and controller, the self-starting of heat sinking function is realized, thus Further promote user experience.
Wherein, control can be arranged directly on either circuit plate.
In any of the above-described technical solution, it is preferable that equipment box is configured to L shape cabinet, is equipped with L in L shape cabinet Multiple circuit boards are arranged side by side on L shape frame in shape frame;Heat sink have it is multiple, heat sink is correspondingly arranged in circuit board Side so that multiple heat sinks are staggered with multiple circuit boards;First air hose includes multiple branch air hoses and a master Air hose, branch air hose are connected to heat sink, and the sealing end that goes out of branch air hose is connected to main air hose, the outlet air end of main air hose with go out Air port adaptation assembling.
In the technical scheme, the plate face of heat sink and circuit board is correspondingly arranged, and is conducive to endotherm area maximization.
In any of the above-described technical solution, it is preferable that equipment box is configured to rectangular box, peace in rectangular box Equipped with rectangular frame, multiple circuit boards are arranged side by side on rectangular frame;The quantity of heat sink is two, two heat absorption dresses Set the both ends for being respectively arranged at multiple circuit boards, the setting of length adaptation side by side of the length of heat sink and multiple circuit boards;The One air hose includes two first branch air hoses, and the air intake of two first branch air hoses is corresponding with two heat sinks respectively to be connected It connects, the outlet air end of two first branch air hoses converges connection, and extends at air outlet;Air outlet is respectively arranged at air inlet On the opposite side wall of equipment box.
In the technical scheme, two heat sinks are set at the both ends of multiple circuit boards, i.e. heat-absorbent surface and circuit board hangs down Straight setting can make heat sink setting quantity minimum, and structure is most simple.
In any of the above-described technical solution, it is preferable that equipment box is configured to rectangular box, peace in rectangular box Equipped with rectangular frame, multiple circuit boards are arranged side by side on rectangular frame;The quantity of heat sink is multiple, each circuit board Both ends be respectively arranged with heat sink;First air hose includes two the first long air hoses and the multiple first short air hoses, the first long wind The air intake of pipe is respectively connected to two heat sinks far from air outlet, and multiple first short air hoses are arranged parallel, and connect respectively It is connected to the first long air hose of the same end, the outlet air end connection of two first branch air hoses, and is extended at air outlet;Air outlet with Air inlet is respectively arranged on the adjacent side wall of equipment box.
In the technical scheme, heat sink is respectively set at the both ends of each circuit board, is advantageously implemented heat dissipation effect It is optimal.
In any of the above-described technical solution, it is preferable that heat sink is heat absorption funnel, the expansion end for the funnel that absorbs heat and circuit Plate is correspondingly arranged, and the necking end for the funnel that absorbs heat is connected to the first air hose.
In the technical scheme, by setting heat absorption funnel structure for heat sink, in the two sides apart from circuit board Distance to a declared goal respectively places the heat absorption funnel of a heating conduction difference, to prevent heat during being expelled to electronic device exterior Leaking causes to influence radiating efficiency.
In any of the above-described technical solution, it is preferable that the necking end for the funnel that absorbs heat is sealed by sealant and the first air hose Connection.
In the technical scheme, anti-ageing by using heat resistanceheat resistant in the necking end of heat absorption funnel and the junction of the first air hose Changing performance, good sealant is sealed, and can prevent hot wind from revealing, thus heat radiation performance.
In addition, each branch air hose (short air hose) for belonging to the first air hose connect with main air hose (long air hose) between also using close Sealing sealing, prevents heat loss.
Wherein, all air hoses are the hose that heat-resisting, anti-aging, fire-retardant coefficient is good and heat-proof quality is good.
In any of the above-described technical solution, it is preferable that the outlet air end of the air intake of the second air hose and the first air hose passes through close Sealing is tightly connected.
In any of the above-described technical solution, it is preferable that air inlet includes three round air inlet regions opened up side by side, each Circle air inlet region opens up multiple air inlet micropores;Electronic computing device further include: filter screen, corresponding fitting are set to round air inlet The inside in region.
In the technical scheme, by installing filter screen in the inside of air inlet, to bulky grains such as dust in air Impurity is filtered, to extend the service life of circuit board.
Specifically, electronic computing device can dig mine equipment for bit coin, so as to which the following technical effects are achieved:
(1) by the two sides setting heat dissipation funnel of face circuit board, the heat generated wraps and is sucked out cabinet, can Heat diffusion is reduced to the greatest extent, improves the efficiency of heat dissipation, and be able to ascend the uniformity of heat dissipation.
(2) by using heat dissipation is concentrated, that is, a concentration air exhauster is used, can be solved simultaneously for multiple electronic equipment Heat dissipation problem, the blower can be placed in outdoor, heat are discharged in atmospheric environment, improve indoor thermal cycle situation, and reduce Indoor noise problem.
(3) mine machine can be optimized without installing radiator fan inside mine machine by using external air suction type radiating mode Internal structure, and reduce this heat source of radiator fan, improve heat dispersal situations further.
(4) radiating efficiency is improved, energy consumption is reduced, improves the income of output ratio and user.
Additional aspect and advantage of the invention will become obviously in following description section, or practice through the invention Recognize.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures Obviously and it is readily appreciated that, in which:
Fig. 1 shows the structural schematic diagram of electronic computing device according to an embodiment of the invention;
Fig. 2 shows the structural schematic diagrams inside the equipment box of the electronic computing device in Fig. 1;
Fig. 3 shows the structural schematic diagram of electronic computing device according to another embodiment of the invention;
Fig. 4 shows the structural schematic diagram inside the equipment box of the electronic computing device in Fig. 3;
Fig. 5 shows the structural schematic diagram of the electronic computing device of still another embodiment in accordance with the present invention;
Fig. 6 shows the structural schematic diagram inside the equipment box of the electronic computing device in Fig. 5.
Corresponding relationship of the Fig. 1 into Fig. 6 between appended drawing reference and component names in the present invention are as follows:
102 equipment box, 104 air inlets, 106 circuit boards, 108 heat absorption funnels, 110 first air hoses, 112 external fans, 114 second air hoses, 116 stability sensors.
Specific embodiment
To better understand the objects, features and advantages of the present invention, with reference to the accompanying drawing and specific real Applying mode, the present invention is further described in detail.It should be noted that in the absence of conflict, the implementation of the application Feature in example and embodiment can be combined with each other.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, still, the present invention may be used also To be implemented using other than the one described here other modes, therefore, protection scope of the present invention is not by described below Specific embodiment limitation.
The electronic computing device of embodiment according to the present invention, comprising: at least one equipment box opens up on equipment box There is air inlet, is provided in equipment box and is laid at least one circuit board;Heat sink, it is corresponding with circuit board to be disposed adjacent, Heat sink is used to absorb heat to circuit board;First air hose is correspondingly connected with one by one with heat sink, the air intake connection of the first air hose To heat sink;External fan is set to the outside of equipment box, and can be connected with the first air hose, wherein outer by opening Blower is set, air draught is carried out to electronic computing device.
In this embodiment, by the way that external fan is arranged in the external of equipment box, in external fan starting after, realize External fan air-breathing, air-flow are entered in equipment box by air inlet, and carry out heat exchange with circuit board, and the air-flow after heat absorption is logical It crosses heat sink to suck in the first air hose, after importing external fan, heat is drained into device external, on the one hand, external fan It can be the external cooling fan of centralization, so as to improve radiating efficiency, and reduce energy consumption, on the other hand, external fan Heat directly can be drained into outdoor, so as to avoid indoor thermal cycle, further improve the efficiency of heat dissipation, Zai Yifang Face, external fan can also reduce room noise when being set to outdoor, to improve indoor environment, further increase electronics Calculate the service life of equipment.
In addition, the electronic computing device in above-described embodiment provided by the invention can also have following supplementary technology special Sign:
In the above embodiment, it is preferable that the first air hose is set to the inside of equipment box;It is offered out on equipment box The outlet air end in air port, the first air hose is adapted to assembling with air outlet;Electronic computing device further include: the second air hose is set to equipment The outside of cabinet, the air intake of the second air hose are connected to the outlet air end of the first air hose;External fan is connected to going out for the second air hose Wind end, wherein when equipment box has multiple, multiple second air hoses are connected to external fan.
In this embodiment, by the way that the second air hose is arranged, external fan can be arranged far from equipment box as far as possible, and will External fan is set to outdoor, avoids indoor circulation to realize.
In any of the above-described embodiment, it is preferable that electronic computing device further include: temperature sensor is arranged in equipment box In vivo, temperature sensor is for acquiring the intracorporal real time temperature of equipment box;Controller, be respectively connected to temperature sensor with it is external Blower, wherein for controller when detecting that real time temperature is greater than or equal to preset temperature threshold, external fan is opened in control.
In this embodiment, by setting temperature sensor and controller, the self-starting of heat sinking function is realized, thus into One step promotes user experience.
Wherein, control can be arranged directly on either circuit plate.
In any of the above-described embodiment, it is preferable that heat sink is heat absorption funnel, the expansion end for the funnel that absorbs heat and circuit board It is correspondingly arranged, the necking end for the funnel that absorbs heat is connected to the first air hose.
In this embodiment, by setting heat absorption funnel structure for heat sink, the finger in the two sides apart from circuit board Set a distance respectively places the heat absorption funnel of a heating conduction difference, to prevent heat outer during being expelled to electronic device exterior Letting out causes to influence radiating efficiency.
Fig. 1 with Fig. 2 shows the structural schematic diagrams of electronic computing device according to an embodiment of the invention.
Embodiment one:
As shown in Figures 1 and 2, in any of the above-described embodiment, it is preferable that equipment box 102A is configured to L shape cabinet L shape frame is installed in 102A, L shape cabinet 102A, multiple circuit boards 106 are arranged side by side on L shape frame;Absorb heat funnel 108A tool Have multiple, heat absorption funnel 108A is correspondingly arranged in the side of circuit board 106, so that multiple heat absorption funnel 108A and multiple circuit boards 106 are staggered;First air hose 110A includes multiple branch air hoses and a main air hose, and branch air hose is connected to heat absorption funnel The sealing end that goes out of 108A, branch air hose are connected to main air hose, and the outlet air end of main air hose is adapted to assembling with air outlet;Air outlet and air inlet Mouth 104 is respectively arranged on the opposite side wall of equipment box.
Preferably, the second air hose 114 is set to the outside of equipment box 102A, and the air intake of the second air hose 114 is connected to The outlet air end of first air hose 110A;External fan 112 is connected to the outlet air end of the second air hose 114, wherein in equipment box 102A With it is multiple when, multiple second air hoses 114 are connected to external fan 112.
Preferably, electronic computing device further include: temperature sensor 116 is arranged in equipment box 102A, temperature sensing Device 116 is used to acquire the real time temperature in equipment box 102A;Controller is respectively connected to temperature sensor 116 and external wind Machine 112, wherein for controller when detecting that real time temperature is greater than or equal to preset temperature threshold, external fan is opened in control 112。
In example 1, on the one hand, the side of each heat absorption funnel 108A corresponding circuits plate 106, it can be by circuit board 106 Most of heat of generation all absorbs, and occurs the problem of temperature gradient when avoiding single fan heat dissipation, and radiate funnel and Air hose is all the lower material of thermal conductivity ratio, avoids the thermal diffusion in diabatic process, keeps heat dissipation effect more effective.
On the other hand, using a centralized external cooling fan, efficiency is improved, and reduce energy consumption, and external Heat is directly excluded interior by blower 112, is avoided indoor thermal cycle, is further improved the efficiency of heat dissipation.External fan 112 can improve indoor environment, further increase the service life of mine machine.
In another aspect, air-breathing heat dissipation avoids high-speed flow and directly impacts on circuit board 106, the powder in air-flow can avoid Damage of the large particles such as dirt to the precision components above it improves the service life of mine machine.
The radiating efficiency of motor calculation equipment can be improved in another aspect, reduces power consumption, improves making for motor calculation equipment With the service life, and then improve the economic benefit of user.
Fig. 3 and Fig. 4 show the structural schematic diagram of electronic computing device according to another embodiment of the invention.
Embodiment two:
As shown in Figure 3 and Figure 4, in any of the above-described embodiment, it is preferable that equipment box 102B is configured to rectangle case Rectangular frame is installed in body 102B, rectangular box 102B, multiple circuit boards 106 are arranged side by side on rectangular frame;It inhales The quantity of heat leak bucket 108B is two, and two heat absorption funnel 108B are respectively arranged at the both ends of multiple circuit boards 106, and absorb heat funnel The length adaptation side by side of the length of 108B and multiple circuit boards 106 is arranged;First air hose 110B includes two first branch air hoses, The air intake of two first branch air hoses is correspondingly connected with two heat absorption funnel 108B respectively, the outlet air of two first branch air hoses End convergence connection, and extend at air outlet;Air outlet and air inlet 104 side wall that be respectively arranged at equipment box 102B opposite On.
Preferably, the second air hose 114 is set to the outside of equipment box 102B, and the air intake of the second air hose 114 is connected to The outlet air end of first air hose 110B;External fan 112 is connected to the outlet air end of the second air hose 114, wherein in equipment box 102B With it is multiple when, multiple second air hoses 114 are connected to external fan 112.
Preferably, electronic computing device further include: temperature sensor 116 is arranged in equipment box 102B, temperature sensing Device 116 is used to acquire the real time temperature in equipment box 102B;Controller is respectively connected to temperature sensor 116 and external wind Machine 112, wherein for controller when detecting that real time temperature is greater than or equal to preset temperature threshold, external fan is opened in control 112。
In example 2, two heat absorption funnel 108B, i.e. heat-absorbent surface and circuit are set at the both ends of multiple circuit boards 106 Plate 106 is vertically arranged, and can make funnel 108B setting quantity minimum of absorbing heat, and structure is most simple.
In example 2, on the one hand, the both ends of two heat absorption funnel 108B corresponding circuits plates 106, it can be by circuit board 106 The heat of generation is absorbed from one end of circuit board 106, and radiates funnel and air hose is all the lower material of thermal conductivity ratio, is kept away The thermal diffusion in diabatic process is exempted from, has kept heat dissipation effect more effective.
On the other hand, using a centralized external cooling fan, efficiency is improved, and reduce energy consumption, and external Heat is directly excluded interior by blower 112, is avoided indoor thermal cycle, is further improved the efficiency of heat dissipation.External fan 112 can improve indoor environment, further increase the service life of mine machine.
In another aspect, air-breathing heat dissipation avoids high-speed flow and directly impacts on circuit board 106, the powder in air-flow can avoid Damage of the large particles such as dirt to the precision components above it improves the service life of mine machine.
The radiating efficiency of motor calculation equipment can be improved in another aspect, reduces power consumption, improves making for motor calculation equipment With the service life, and then improve the economic benefit of user.
Fig. 5 and Fig. 6 shows the structural schematic diagram of the electronic computing device of still another embodiment in accordance with the present invention.
Embodiment three:
As shown in figs. 5 and 6, in any of the above-described embodiment, it is preferable that equipment box 102C is configured to rectangle case Rectangular frame is installed in body 102C, rectangular box 102C, multiple circuit boards 106 are arranged side by side on rectangular frame;It inhales The quantity of heat leak bucket 108C be it is multiple, the both ends of each circuit board 106 be respectively arranged with heat absorption funnel 108C;First air hose 110C Including two the first long air hoses and the multiple first short air hoses, the air intake of the first long air hose is respectively connected to two far from air outlet A heat absorption funnel 108C, multiple first short air hoses are arranged parallel, and are respectively connected to the first long air hose of the same end, and two first The outlet air end of branch air hose is connected to, and is extended at air outlet;Air outlet and air inlet 104 are respectively arranged at equipment box 102C On adjacent side wall.
Preferably, the second air hose 114 is set to the outside of equipment box 102C, and the air intake of the second air hose 114 is connected to The outlet air end of first air hose 110C;External fan 112 is connected to the outlet air end of the second air hose 114, wherein in equipment box 102C With it is multiple when, multiple second air hoses 114 are connected to external fan 112.
Preferably, electronic computing device further include: temperature sensor 116 is arranged in equipment box 102C, temperature sensing Device 116 is used to acquire the real time temperature in equipment box 102C;Controller is respectively connected to temperature sensor 116 and external wind Machine 112, wherein for controller when detecting that real time temperature is greater than or equal to preset temperature threshold, external fan is opened in control 112。
In the third embodiment, on the one hand, two pairs of each circuit board 106 are to two small-sized heat absorption funnel 108C of setting, i.e., The both ends of circuit board 106 respectively correspond multiple heat absorption funnel 108C, and the heat that can generate circuit board 106 is from circuit board 106 Side absorbs, and the quantity for increasing heat absorption funnel 108C can increase its efficiency, and end installation heat absorption funnel 108C reduces circuit board 106 clipping room is away from convenient for optimization structure, and radiating funnel and air hose is all the lower material of thermal conductivity ratio, avoid Thermal diffusion in diabatic process keeps heat dissipation effect more effective.
On the other hand, using a centralized external cooling fan, efficiency is improved, and reduce energy consumption, and external Heat is directly excluded interior by blower 112, is avoided indoor thermal cycle, is further improved the efficiency of heat dissipation.External fan 112 can improve indoor environment, further increase the service life of mine machine.
In another aspect, air-breathing heat dissipation avoids high-speed flow and directly impacts on circuit board 106, the powder in air-flow can avoid Damage of the large particles such as dirt to the precision components above it improves the service life of mine machine.
The radiating efficiency of motor calculation equipment can be improved in another aspect, reduces power consumption, improves making for motor calculation equipment With the service life, and then improve the economic benefit of user.
In any of the above-described embodiment, it is preferable that the necking end for the funnel that absorbs heat is connected by sealant and the sealing of the first air hose It connects.
In this embodiment, anti-aging by using heat resistanceheat resistant in the necking end of heat absorption funnel and the junction of the first air hose The good sealant of performance is sealed, and can prevent hot wind from revealing, thus heat radiation performance.
In addition, each branch air hose (short air hose) for belonging to the first air hose connect with main air hose (long air hose) between also using close Sealing sealing, prevents heat loss.
Wherein, all air hoses are the hose that heat-resisting, anti-aging, fire-retardant coefficient is good and heat-proof quality is good.
In any of the above-described embodiment, it is preferable that the outlet air end of the air intake of the second air hose and the first air hose passes through sealing Glue is tightly connected.
In any of the above-described embodiment, it is preferable that air inlet includes three round air inlet regions opened up side by side, Mei Geyuan Shape air inlet region opens up multiple air inlet micropores;Electronic computing device further include: filter screen, corresponding fitting are set to round air inlet area The inside in domain.
In this embodiment, by installing filter screen in the inside of air inlet, with miscellaneous to bulky grains such as dust in air Matter is filtered, to extend the service life of circuit board.
Specifically, electronic computing device can dig mine equipment for bit coin.
In the present invention, term " first ", " second ", " third " are only used for the purpose of description, and should not be understood as indicating Or imply relative importance;Term " multiple " then refers to two or more, unless otherwise restricted clearly.Term " installation ", The terms such as " connected ", " connection ", " fixation " shall be understood in a broad sense, for example, " connection " may be a fixed connection, being also possible to can Dismantling connection, or be integrally connected;" connected " can be directly connected, can also be indirectly connected through an intermediary.For this For the those of ordinary skill in field, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In description of the invention, it is to be understood that the instructions such as term " on ", "lower", "left", "right", "front", "rear" Orientation or positional relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of the description present invention and simplification is retouched It states, rather than the device or unit of indication or suggestion meaning must have specific direction, be constructed and operated in a specific orientation, It is thus impossible to be interpreted as limitation of the present invention.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc. Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one reality of the invention It applies in example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or reality Example.Moreover, description particular features, structures, materials, or characteristics can in any one or more of the embodiments or examples with Suitable mode combines.
These are only the preferred embodiment of the present invention, is not intended to restrict the invention, for those skilled in the art For member, the invention may be variously modified and varied.All within the spirits and principles of the present invention, it is made it is any modification, Equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.

Claims (10)

1. a kind of electronic computing device characterized by comprising
At least one equipment box offers air inlet on the equipment box, be provided in the equipment box be laid with to A few circuit board;
Heat sink, corresponding with the circuit board to be disposed adjacent, the heat sink is used to absorb heat to the circuit board;
First air hose is correspondingly connected with one by one with the heat sink, and the air intake of first air hose is connected to the heat absorption dress It sets;
External fan is set to the outside of the equipment box, and can be connected with first air hose,
Wherein, by opening the external fan, air draught is carried out to the electronic computing device.
2. electronic computing device according to claim 1, which is characterized in that
First air hose is set to the inside of the equipment box;
Air outlet is offered on the equipment box, the outlet air end of first air hose is adapted to assembling with the air outlet;
The electronic computing device further include:
Second air hose, is set to the outside of the equipment box, and the air intake of second air hose is connected to first air hose Outlet air end;
The external fan is connected to the outlet air end of second air hose,
Wherein, when the equipment box has multiple, multiple second air hoses are connected to the external fan.
3. electronic computing device according to claim 1, which is characterized in that further include:
Temperature sensor is arranged in the equipment box, and the temperature sensor is for acquiring the intracorporal reality of the equipment box Shi Wendu;
Controller is respectively connected to the temperature sensor and the external fan,
Wherein, the controller is when detecting that the real time temperature is greater than or equal to preset temperature threshold, described in control unlatching External fan.
4. electronic computing device according to claim 2, which is characterized in that
The equipment box is configured to L shape cabinet, is equipped with L shape frame in the L shape cabinet, on the L shape frame side by side Multiple circuit boards are set;
The heat sink has multiple, and the heat sink is correspondingly arranged in the side of the circuit board, so that multiple described Heat sink is staggered with multiple circuit boards;
First air hose includes multiple branch air hoses and a main air hose, and the branch air hose is connected to the heat absorption dress It sets, the sealing end that goes out of the branch air hose is connected to the main air hose, and the outlet air end of the main air hose is adapted to group with the air outlet Dress.
5. electronic computing device according to claim 2, which is characterized in that
The equipment box is configured to rectangular box, and rectangular frame is equipped in the rectangular box, described rectangular Multiple circuit boards are arranged side by side on shape frame;
The quantity of the heat sink is two, and two heat sinks are respectively arranged at the both ends of multiple circuit boards, The length adaptation side by side of the length of the heat sink and multiple circuit boards is arranged;
First air hose include two first branch air hoses, the air intake of described two first branch air hoses respectively with two institutes It states heat sink to be correspondingly connected with, the outlet air end of described two first branch air hoses converges connection, and extends at the air outlet;
The air outlet and the air inlet are respectively arranged on the opposite side wall of the equipment box.
6. electronic computing device according to claim 2, which is characterized in that
The equipment box is configured to rectangular box, and rectangular frame is equipped in the rectangular box, described rectangular Multiple circuit boards are arranged side by side on shape frame;
The quantity of the heat sink be it is multiple, the both ends of each circuit board are respectively arranged with the heat sink;
First air hose includes two the first long air hoses and the multiple first short air hoses, and the air intake of the first long air hose is distinguished Two heat sinks far from the air outlet are connected to, the multiple first short air hose is arranged parallel, and is separately connected To the described first long air hose of the same end, the outlet air end of two first branch air hoses is connected to, and extends to the air outlet Place;
The air outlet and the air inlet are respectively arranged on the adjacent side wall of the equipment box.
7. electronic computing device according to any one of claim 1 to 6, which is characterized in that
The heat sink is heat absorption funnel, and the expansion end of the heat absorption funnel is correspondingly arranged with the circuit board, the heat absorption The necking end of funnel is connected to first air hose.
8. electronic computing device according to claim 7, which is characterized in that
The necking end of the heat absorption funnel is tightly connected by sealant and first air hose.
9. electronic computing device according to claim 2, which is characterized in that further include:
The outlet air end of the air intake of second air hose and first air hose is tightly connected by sealant.
10. electronic computing device according to claim 9, which is characterized in that
The air inlet includes three round air inlet regions opened up side by side, and each round air inlet region opens up multiple air inlets Micropore;
The electronic computing device further include:
Filter screen, corresponding fitting are set to the inside in the round air inlet region.
CN201810869302.0A 2018-08-02 2018-08-02 Electronic computing device Pending CN108966598A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810869302.0A CN108966598A (en) 2018-08-02 2018-08-02 Electronic computing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810869302.0A CN108966598A (en) 2018-08-02 2018-08-02 Electronic computing device

Publications (1)

Publication Number Publication Date
CN108966598A true CN108966598A (en) 2018-12-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810869302.0A Pending CN108966598A (en) 2018-08-02 2018-08-02 Electronic computing device

Country Status (1)

Country Link
CN (1) CN108966598A (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110268A (en) * 2001-09-28 2003-04-11 Makio Komatsu Cooler for semiconductor of electronic apparatus
CN201115184Y (en) * 2007-09-30 2008-09-10 田利军 Tube central heat radiation and discharge system for electronic device
CN203397294U (en) * 2013-08-16 2014-01-15 陈红 Radiating cooling system for computer
CN205721584U (en) * 2016-02-02 2016-11-23 新乡职业技术学院 A kind of heat dissipation system for computers
CN206365210U (en) * 2016-12-30 2017-07-28 深圳市海吉源科技有限公司 A kind of data center module heat abstractor
CN206379890U (en) * 2016-12-22 2017-08-04 中智电气南京有限公司 A kind of high-performance current vector frequency converter
US20180103561A1 (en) * 2016-10-11 2018-04-12 Pentair Technical Solutions GmbH Subrack Assembly for Electronic Equipment
CN110362170A (en) * 2018-04-11 2019-10-22 深圳市易链信息技术有限公司 A kind of electronic computing device
CN110362172A (en) * 2018-04-09 2019-10-22 深圳市易链信息技术有限公司 A kind of electronic computing device
CN110362169A (en) * 2018-04-10 2019-10-22 深圳市易链信息技术有限公司 A kind of electronic computing device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110268A (en) * 2001-09-28 2003-04-11 Makio Komatsu Cooler for semiconductor of electronic apparatus
CN201115184Y (en) * 2007-09-30 2008-09-10 田利军 Tube central heat radiation and discharge system for electronic device
CN203397294U (en) * 2013-08-16 2014-01-15 陈红 Radiating cooling system for computer
CN205721584U (en) * 2016-02-02 2016-11-23 新乡职业技术学院 A kind of heat dissipation system for computers
US20180103561A1 (en) * 2016-10-11 2018-04-12 Pentair Technical Solutions GmbH Subrack Assembly for Electronic Equipment
CN206379890U (en) * 2016-12-22 2017-08-04 中智电气南京有限公司 A kind of high-performance current vector frequency converter
CN206365210U (en) * 2016-12-30 2017-07-28 深圳市海吉源科技有限公司 A kind of data center module heat abstractor
CN110362172A (en) * 2018-04-09 2019-10-22 深圳市易链信息技术有限公司 A kind of electronic computing device
CN110362169A (en) * 2018-04-10 2019-10-22 深圳市易链信息技术有限公司 A kind of electronic computing device
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