CN108966584A - Radiator control method and electronic device - Google Patents
Radiator control method and electronic device Download PDFInfo
- Publication number
- CN108966584A CN108966584A CN201710350693.0A CN201710350693A CN108966584A CN 108966584 A CN108966584 A CN 108966584A CN 201710350693 A CN201710350693 A CN 201710350693A CN 108966584 A CN108966584 A CN 108966584A
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- Prior art keywords
- temperature
- electronic component
- peripheral element
- fan
- processor
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of radiator control method, to radiate to the electronic component for not having self heat sinking function in electronic device.The above method includes: detecting the first temperature of electronic component;And when the first temperature is higher than the first temperature upper limit threshold value, control is located at the fan of the peripheral element around electronic component, to radiate to electronic component.
Description
Technical field
This case relates to a kind of radiator control method and electronic device, and in particular to dissipating to not having self
The radiator control method and electronic device that the electronic component of heat function radiates.
Background technique
The electronic component of many of electronic device, in these electronic components, some electronic components have fan, can be with
It actively radiates in electronic component overheat.However, some electronic components do not have fan or self other heat sinking function,
If additional by the electronic component for not having self heat sinking function place fan, though it can be to the electronics member for not having self heat sinking function
Part radiates, but will increase outer cost and need additional space.
Therefore, how first to the electronics for not having self heat sinking function under the case where not increasing additional space and cost
Part radiates, and is this field one of problem to be modified.
Summary of the invention
One of this case aspect is to provide a kind of radiator control method, to not having self heat dissipation in electronic device
The electronic component of function radiates.The above method includes: detecting the first temperature of electronic component;And when the first temperature is higher than
When the first temperature upper limit threshold value, control is located at the fan of the peripheral element around electronic component, scattered to carry out to electronic component
Heat.
Another aspect of this case is to provide a kind of electronic device, includes processor, electronic component and peripheral element.On
It states electronic component and does not have self heat sinking function.Above-mentioned peripheral element is located at around electronic component, and includes fan.When electronics member
When first temperature of part is higher than the first temperature upper limit threshold value, processor controls the fan of peripheral element, to carry out to electronic component
Heat dissipation.
Therefore, according to the technology aspect of this case, the embodiment of this case is by providing a kind of radiator control method and electricity
Sub-device, and in particular to the radiator control method to radiate to the electronic component for not having self heat sinking function and
Electronic device, so as under the case where not increasing additional space and cost to the electronic component for not having self heat sinking function into
Row heat dissipation.
Detailed description of the invention
For above and other purpose, feature, advantage and embodiment of the invention can be clearer and more comprehensible, institute's accompanying drawings are said
It is bright as follows:
Fig. 1 is a kind of schematic diagram of electronic device according to depicted in some embodiments of this case;And
Fig. 2 is a kind of radiator control method according to depicted in some embodiments of this case.
[symbol description]
100: electronic device
110: processor
120: memory body
130,132: electronic component
140,142: peripheral element
150: input/output interface
200: radiator control method
S210, S215, S220, S230: step
S240, S250, S260: step
Specific embodiment
The many different embodiments or illustration disclosed below of providing are to implement different characteristic of the invention.In special illustration
Element and configuration are used to simplify this case in the following discussion.The purposes that any illustration discussed only is used to narrate, not
It can limit the invention in any way or the range and meaning of its illustration.
Fig. 1 is a kind of schematic diagram of electronic device 100 according to depicted in some embodiments of this case.Show as depicted in FIG. 1,
Electronic device 100 includes processor 110, memory body 120, electronic component 130, electronic component 132, peripheral element 140, periphery member
Part 142 and input/output interface 150.Above-mentioned electronic component 130 and 132 does not have fan or automatic dissipating heat function, and periphery
There is fan can carry out automatic heat radiation for element 140 and 142 and processor 110.The only conduct of electronic device 100 depicted in Fig. 1
It illustrates, but this case is not limited thereto.
In some embodiments, processor 110 judges the peripheral element for being located at electronic component 130 or 132 peripheries.One
In a little embodiments, processor 110 opens the fan of the multiple element in electronic device 100 with fan in turn, and determines electronics
Making the temperature change of electronic component 130 or 132 in multiple element in device 100 with fan has one of maximum value for electricity
The peripheral element of subcomponent 130 or 132.For example, there is one of maximum value if making the temperature change of electronic component 130
For the fan of processor 110, then determine the peripheral element of electronic component 130 for processor 110.And if making electronic component 132
Temperature change to have one of maximum value be the fan of peripheral element 142, then determine the peripheral element of electronic component 132 for week
Side element 142.If alternatively, so that the temperature change of electronic component 132 is had one of maximum value is the wind of peripheral element 140
Fan, then determine the peripheral element of electronic component 132 for peripheral element 140.
In some embodiments, 110 send instructions of processor are to electronic component 130 or 132, to require electronic component 130
Or 132 return its temperature.Electronic component 130 or 132 voluntarily detects the temperature of electronic component 130 or 132, and by the temperature of detecting
Reach processor 110.In some embodiments, the temperature of detecting actively can be sent to processor by electronic component 130 or 132
110, rather than when processor 110 requires, temperature is passively just returned by electronic component 130 or 132, end is set depending on actual demand
It is fixed.
In some embodiments, processor 110 judges whether the temperature of electronic component 130 or 132 is higher than in the first temperature
Limit threshold value.If processor 110 determines that the temperature of electronic component 130 or 132 is higher than the first temperature upper limit threshold value, processor 110
The fan of the peripheral element 110,140 or 142 of control electronics 130 or 132 is scattered to carry out to electronic component 130 or 132
Heat.For example, if processor 110 determines that the temperature of electronic component 132 is higher than the first temperature upper limit threshold value, processor 110
The fan of peripheral element 142 is controlled to radiate to electronic component 132.And if processor 110 determines electronic component 130
Temperature is higher than the first temperature upper limit threshold value, and the fan of 110 control processor 110 of processor is to radiate to electronic component 130.
In some embodiments, processor 110 judges whether the temperature of electronic component 130 or 132 is lower than at a temperature of first
Limit threshold value.If processor 110 determines that the temperature of electronic component 130 or 132 is lower than the first lowest temperature threshold value, processor 110
The fan of the peripheral element 110,140 or 142 of control electronics 130 or 132, to stop carrying out electronic component 130 or 132
Heat dissipation.For example, if processor 110 determines that the temperature of electronic component 132 is lower than the first lowest temperature threshold value, processor
The fan of 110 control peripheral elements 142 is to stop radiating to electronic component 132.
In some implementations, when processor 110 determines that the temperature of electronic component 130 or 132 is higher than the first temperature upper limit threshold
When value, processor 110 improves the voltage and/or revolving speed of the fan of peripheral element 110,140 or 142, with to electronic component 130 or
132 radiate.When processor 110 determines the temperature of electronic component 130 or 132 lower than the first lowest temperature threshold value, processing
Device 110 reduce peripheral element 110,140 or 142 fan voltage and/or revolving speed, with stop to electronic component 130 or 132 into
Row heat dissipation.
In some embodiments, when processor 110 determines that the temperature of electronic component 130 or 132 is higher than the first temperature upper limit
Threshold value is lower than the first lowest temperature threshold value, and processor 110 more judges whether the temperature of peripheral element 110,140 or 142 is higher than
Second temperature upper limit threshold is lower than second temperature lower threshold.And if processor 110 determine peripheral element 110,140 or
142 temperature is not higher than second temperature upper limit threshold and is not less than second temperature lower threshold, and processor 110 adjusts peripheral element
110,140 or 142 fan is to radiate to electronic component 130 or 132.For example, if processor 110 determines electronics
The temperature of element 132 be higher than the temperature of the first temperature upper limit threshold value and peripheral element 142 not higher than second temperature upper limit threshold and
Not less than second temperature lower threshold, processor 110 adjusts the fan of peripheral element 142 to radiate to electronic component 132.
And if processor 110 determine the temperature of electronic component 132 lower than the first lowest temperature threshold value and the temperature of peripheral element 142 not
Higher than second temperature upper limit threshold and be not less than second temperature lower threshold, processor 110 adjust peripheral element 142 fan with
Stopping radiates to electronic component 132.
In some embodiments, when processor 110 determines that the temperature of electronic component 130 or 132 is higher than the first temperature upper limit
Threshold value is lower than the first lowest temperature threshold value, and processor 110 determines that the temperature of peripheral element 110,140 or 142 is higher than second
Temperature upper limit threshold value or be lower than second temperature lower threshold when, then processor 110 judges whether that peripheral element 110,140 need to be adjusted
Or 142 fan is to radiate to electronic component 130 or 132.In some embodiments, when the temperature of electronic component 130 or 132
When degree is higher than the first temperature upper limit threshold value or peripheral element 110,140 or 142 higher than second temperature upper limit threshold, processor 110
Determine voltage and/or the revolving speed that need to improve the fan of peripheral element 110,140 or 142 to carry out to electronic component 130 or 132
Heat dissipation.
For example, if processor 110 determines that the temperature of electronic component 132 is lower than the first lowest temperature threshold value, and it is electric
The temperature of the peripheral element 142 of subcomponent 132 is higher than second temperature upper limit threshold, then the judgement of processor 110 need to improve periphery member
The voltage and/or revolving speed of the fan of part 142, to radiate to peripheral element 142.And if processor 110 determines electronics member
The temperature of part 132 is lower than the first lowest temperature threshold value and the temperature of peripheral element 142 is lower than second temperature lower threshold, then handles
Device 110 determines that the voltage and/or revolving speed of the fan of peripheral element 142 need to be reduced, to stop to electronic component 132 and peripheral element
142 radiate.It, must be by periphery when the temperature of electronic component 130 or 132 is higher than the first temperature upper limit threshold value in summary
Element 110,140 or 142 radiates to it, in addition, when the temperature of peripheral element 110,140 or 142 itself is higher than the second temperature
When spending upper limit threshold, also must voluntarily it radiate.
In some embodiments, the first temperature upper limit threshold value, the first lowest temperature threshold value, second temperature upper limit threshold and
Two lowest temperature threshold values are stored in memory body 120.When processor judges whether the temperature of electronic component 130 or 132 is higher than first
Whether temperature upper limit threshold value is higher than second lower than the temperature of the first lowest temperature threshold value and peripheral element 110,140 or 142
Temperature upper limit threshold value or when being lower than second temperature lower threshold, processor is according in stored the first temperature in memory body 120
Limit threshold value, the first lowest temperature threshold value, second temperature upper limit threshold and second temperature lower threshold are judged.
In some embodiments, electronic device 100 further includes input/output interface 150, to other electronic component phases
Connection, and input/output instruction and/or message.
Please refer to Fig. 2.Fig. 2 is a kind of radiator control method 200 according to depicted in some embodiments of this case.Such as
Shown in Fig. 2, radiator control method 200 includes step S210~step S260.For the radiator control for making embodiment of this case
Method 200 processed is it can be readily appreciated that also referring to Fig. 1 and Fig. 2.
Step S210: determine peripheral element.For example, determined to be located at electronic component 130 or 132 weeks by processor 110
The peripheral element 110,140 or 142 on side.Detailed determination method is as above opened described in embodiment, and details are not described herein.
Step S215: the temperature of electronic component is detected.For example, electronics member is voluntarily detected by electronic component 130 or 132
The temperature of part 130 or 132, and the temperature of detecting is reached into processor 110.Or electronic component 130 or 132 can be actively by detecting
Temperature be sent to processor 110, rather than when processor 110 requires, temperature is just passively returned by electronic component 130 or 132
Degree, end are set depending on actual demand.
Step S220: judge whether the temperature of electronic component is higher than the first temperature upper limit threshold value.For example, by processor
110 judge whether the temperature of electronic component 130 or 132 is higher than the first temperature upper limit threshold value.And if it is determined that electronic component 130 or
132 temperature is higher than the first temperature upper limit threshold value, executes step S240.If it is determined that the temperature of electronic component 130 or 132 is not higher than
First temperature upper limit threshold value executes step S230.
Step S230: judge whether the temperature of electronic component is lower than the first lowest temperature threshold value.For example, by processor
110 judge whether the temperature of electronic component 130 or 132 is lower than the first lowest temperature threshold value.And if it is determined that electronic component 130 or
132 temperature is lower than the first lowest temperature threshold value, executes step S240.If it is determined that the temperature of electronic component 130 or 132 is not less than
First lowest temperature threshold value executes step S215.
Step S240: judge whether the temperature of peripheral element is higher than second temperature upper limit threshold or lower than second temperature lower limit
Threshold value.For example, determine whether the temperature of the peripheral element 142 of electronic component 132 is higher than in second temperature by processor 110
It limits threshold value or is lower than second temperature lower threshold.If it is determined that the temperature of peripheral element 142 is higher than second temperature upper limit threshold or low
In second temperature lower threshold, step S250 is executed.That is, when step S240 judging result be peripheral element 110,
When 140 or 142 temperature is higher than second temperature upper limit threshold or is lower than second temperature lower threshold, electronic component 130 must be considered
Or 132 temperature and peripheral element 110,140 or 142 temperature, and temperature and week according to electronic component 130 or 132
The temperature of side element 110,140 or 142 judges whether the fan of peripheral element 110,140 or 142 needs to adjust.And if it is determined that periphery
The temperature of element is not higher than second temperature upper limit threshold and is not less than second temperature lower threshold, executes step S260.Namely
It says, when the temperature that the judging result of step S240 is peripheral element 110,140 or 142 is not higher than second temperature upper limit threshold and not
It when lower than second temperature lower threshold, is not required to consider the temperature of peripheral element 110,140 or 142, and only needs according to electronic component
130 or 132 temperature is to adjust the fan of peripheral element 110,140 or 142.
Step S250: judge whether the fan of peripheral element needs to adjust.In step S250, when electronic component and periphery member
The temperature of one of part person be higher than temperature upper limit threshold value when, determine need to improve peripheral element fan voltage and/or revolving speed with
It radiates to electronic component.That is, when electronic component is higher than the first temperature upper limit threshold value or peripheral element higher than second
When temperature upper limit threshold value, that is, determine voltage and/or the revolving speed that need to improve the fan of peripheral element to electronic component or periphery member
Part radiates.And if electronic component and peripheral element determine the wind that need to reduce peripheral element when being all lower than lowest temperature threshold value
The voltage and/or revolving speed of fan are to stop radiating to electronic component.If it is determined that the fan of peripheral element needs to adjust, step is executed
S260.If it is determined that the fan of peripheral element is not required to adjust, step S215 is executed.
Step S260: the voltage and/or revolving speed of the fan of peripheral element are adjusted.In some embodiments, processor 110 can
Through the interface parameter of modification input-output system (BIOS), to adjust the voltage and/or revolving speed of the fan of peripheral element.It is holding
It has gone after step S260, step S215 has been executed, to detect the temperature of electronic component.
In some embodiments, electronic component 130 or 132 can be solid hard disc, the amplifier at audio interface or memory
Body etc. is any without self radiator or the element of function.In some embodiments of this case, peripheral element can be processing
Any element with self radiator or function such as device, display card or active fans.
In some embodiments, processor 110 can be with storage, operation, data read, reception signal or message,
Transmit the servomechanism of the functions such as signal or message, circuit, central processing unit (central processor unit, CPU), micro-
Processor (MCU) or other devices with same function.
By the embodiment of above-mentioned this case it is found that the embodiment of this case is by providing a kind of radiator control method and electricity
Sub-device, and in particular to the radiator control method to radiate to the electronic component for not having self heat sinking function and
Electronic device, so as under the case where not increasing additional space and cost to the electronic component for not having self heat sinking function into
Row heat dissipation.
In addition, above-mentioned illustration includes example steps sequentially, but those steps need not be sequentially executed according to shown.With
Different order executes those steps all considering in range in this disclosure.In the spirit and model of the embodiment of this disclosure
In enclosing, it can optionally increase, replace, change sequence and/or omitting those steps.
Although this case is disclosed as above with embodiment, so it is not limited to this case, any to be familiar with this those skilled in the art,
It does not depart from the spirit and scope of this case, when can be used for a variety of modifications and variations, therefore the protection scope of this case is appended when regarding
Subject to claim institute defender.
Claims (10)
1. a kind of radiator control method, to be carried out to the electronic component for not having self heat sinking function in an electronic device
Heat dissipation, wherein this method includes:
Detect one first temperature of the electronic component;And
When first temperature is higher than one first temperature upper limit threshold value, control is located at the peripheral element around the electronic component
Fan, to radiate to the electronic component.
2. control method according to claim 1, includes:
When first temperature is lower than one first lowest temperature threshold value, control is located at the peripheral element around the electronic component
Fan, to stop radiating to the electronic component, wherein control is located at the peripheral element around the electronic component
Fan includes:
When first temperature is more than the first temperature upper limit threshold value, the voltage and/or revolving speed of the fan of the peripheral element are improved;
And
When first temperature is lower than the first lowest temperature threshold value, the voltage and/or revolving speed of the fan of the peripheral element are reduced.
3. control method according to claim 1, includes:
Open the fan of one of a plurality of elements of electronic device person;
Detect a temperature change of the electronic component;And
Determine to make in those elements the temperature change of the electronic component to have one of maximum value for the peripheral element.
4. control method according to claim 1, wherein the fan for controlling the peripheral element of the electronic component includes:
A control instruction is transmitted to the peripheral element, to control the fan of the peripheral element.
5. control method according to claim 1, wherein the fan for controlling the peripheral element of the electronic component further includes:
Detect a second temperature of the peripheral element;
When the second temperature is more than a second temperature upper limit threshold, the voltage and/or revolving speed of the fan of the peripheral element are improved;
And
When the second temperature is more than the second temperature upper limit threshold or first temperature is more than the first temperature upper limit threshold value, mention
The voltage and/or revolving speed of the fan of the high peripheral element.
6. a kind of electronic device, includes:
One processor;
One electronic component, the electronic component do not have self heat sinking function;And
One peripheral element, the peripheral element are located at around the electronic component, and include a fan;
Wherein when one first temperature of the electronic component is higher than one first temperature upper limit threshold value, which controls periphery member
The fan of part, to radiate to the electronic component.
7. electronic device according to claim 6, wherein the processor is more to when first temperature is lower than one first temperature
When spending lower threshold, control is located at the fan of the peripheral element around the electronic component, and reduces the wind of the peripheral element
The voltage and/or revolving speed of fan, to stop radiating to the electronic component, wherein the processor when first temperature more to surpass
When crossing the first temperature upper limit threshold value, the voltage and/or revolving speed of the fan of the peripheral element are improved.
8. electronic device according to claim 6, wherein a plurality of members of the processor more to open the electronic device
The fan of one of part person, and determine to make in those elements the temperature change of the electronic component that there is one of maximum value to be
The peripheral element.
9. electronic device according to claim 6, wherein the processor is more to judge that the one second of the peripheral element is warm
Whether degree is more than a second temperature upper limit threshold, and the second temperature for working as the peripheral element is more than the second temperature upper limit threshold
Or first temperature be more than the first temperature upper limit threshold value when, the processor improve the fan of the peripheral element voltage and/or
Revolving speed.
10. electronic device according to claim 6, wherein the electronic component more to detect the electronic component this first
Temperature, wherein the electronic component is more actively to transmit first temperature to the processor, and wherein the processor is more to judge
Whether first temperature is within the scope of first temperature threshold.
Priority Applications (1)
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CN201710350693.0A CN108966584A (en) | 2017-05-18 | 2017-05-18 | Radiator control method and electronic device |
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CN201710350693.0A CN108966584A (en) | 2017-05-18 | 2017-05-18 | Radiator control method and electronic device |
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CN201710350693.0A Pending CN108966584A (en) | 2017-05-18 | 2017-05-18 | Radiator control method and electronic device |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6927978B2 (en) * | 2003-02-10 | 2005-08-09 | Kabushiki Kaisha Toshiba | Electronic apparatus and method of cooling the electronic apparatus |
TWI297429B (en) * | 2006-04-24 | 2008-06-01 | Inventec Corp | System and method for controlling heat dissipation |
CN101819457A (en) * | 2010-04-23 | 2010-09-01 | 华为技术有限公司 | Heat dissipation method and heat dissipation system for communication equipment |
-
2017
- 2017-05-18 CN CN201710350693.0A patent/CN108966584A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6927978B2 (en) * | 2003-02-10 | 2005-08-09 | Kabushiki Kaisha Toshiba | Electronic apparatus and method of cooling the electronic apparatus |
TWI297429B (en) * | 2006-04-24 | 2008-06-01 | Inventec Corp | System and method for controlling heat dissipation |
CN101819457A (en) * | 2010-04-23 | 2010-09-01 | 华为技术有限公司 | Heat dissipation method and heat dissipation system for communication equipment |
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