CN108891365A - Automotive intelligent cockpit system and the automobile for using the system - Google Patents
Automotive intelligent cockpit system and the automobile for using the system Download PDFInfo
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- CN108891365A CN108891365A CN201810648130.4A CN201810648130A CN108891365A CN 108891365 A CN108891365 A CN 108891365A CN 201810648130 A CN201810648130 A CN 201810648130A CN 108891365 A CN108891365 A CN 108891365A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0231—Circuits relating to the driving or the functioning of the vehicle
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/20—Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves
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Abstract
The present invention provides a kind of automotive intelligent cockpit systems, the system includes vehicle-mounted information and entertainment system, digital virtual instrument system, left rear seat entertainment system, right rear seat entertainment system, automatic navigator system and high heat dissipation SOC chip, and the intelligence cockpit system is connected by height heat dissipation SOC chip with above-mentioned five subsystems.The SOC chip uses composite material to make have particularly preferred heat dissipation effect in a package.
Description
Technical field
The invention belongs to automotive fields, particularly belong to technical field of automotive electronics, are related to a kind of automotive intelligent cockpit
System and the automobile for using the system.
Background technique
Vehicle entertainment system supports the input of a variety of audios, video, CD/DVD, USB/SD card and iPod player etc.
The connection of wireline equipment, and support the connection of the wireless networks such as bluetooth/WiFi, support GPS navigation module, support front/after
Square camera video input and reception of Mobile Digital TV etc..Requirement of the user to system audio effect processing is also more abundant, even
Achieve the effect that home theater.Meanwhile with the rapid development of automotive electronic technology, vehicle entertainment system is also constantly being risen
Grade, is increasing enhancing along with function, in-vehicle electronic system becomes to become increasingly complex.These complicated car entertainment media systems
System all relies on SOC chip substantially.
As integrated circuit technology is developed rapidly towards sub-micron or nanoscale, the function of integrated circuit currently how is reduced
Consumption and raising heat dissipation are an extremely important problems.Power problems and heat dissipation problem restrict further mentioning for chip performance
Height, and increase the cost of integrated circuit, in order to reduce chip due to caused by the rapid growth of integrated level and performance not
It is disconnected to increase power consumption.Low energy consumption can save packaging cost, extend the battery life of Mobile portable equipment.Therefore, to low
The research and application of power consumption and high heat dissipation design technology are the following important directions for carrying out chip design.
Current many SOC chips will have under conditions of ten million or more integrated level and Gigahertz clock frequency
The power consumption of tens of watts or even upper hectowatt, huge power consumption increase the temperature of chip, to chip reliability in terms of bring and ask
Topic.As bottleneck effect of the power problems in the design of the system of deep-submicron and nanometer technology condition increasingly shows, low-power consumption
Design is that SOC chip designs the significant challenge faced.
CN106814666A (earlier application of the present inventor) discloses the intelligent cockpit system of colour display, including vehicle-mounted
Information entertainment, digital virtual instrument board, left rear seat entertainment system, right rear seat entertainment system, automatic navigator, SOC core
Piece and MCU chip, it is characterised in that：The intelligence cockpit system is connected by a SOC chip with above-mentioned five subsystems,
The information that each subsystem is sent is received, and each subsystem is controlled, thus by above-mentioned five sub- system combinations at a set of system
One intelligent cockpit system.The full content of the patent document is incorporated herein by quoting.
CN107933458A discloses a kind of vehicle mounted multimedia control system, and the vehicle mounted multimedia control system includes：
Former vehicle multimedia device, upgrading multimedia device and former vehicle operating device, it is more that the original vehicle operating device connects the upgrading
Media apparatus, the upgrading multimedia device connection former vehicle multimedia device；The original vehicle operating device, is used for receiving
Current operation instruction is sent to the upgrading multimedia device by the current operation instruction of family input；The more matchmakers of upgrading
Body device carries out type judgement for instructing to the current operation, belongs to predetermined registration operation type in the current operation type
When, current operation instruction is sent to the former vehicle multimedia device, is not belonging to default behaviour in current operation instruction
When making type, current operation instruction is responded；The original vehicle multimedia device, for receiving the upgrading multimedia
The current operation instruction that device is sent, and current operation instruction is responded.
CN104483687A discloses a kind of automobile multimedia device comprising operation module and operation module operate mould
Block includes host system, serial port unit, control unit, DC power supply, external antenna and wireless communication module, control unit difference
Serial port unit, DC power supply, external antenna and wireless communication module are connected, host system connects serial port unit, and described is wireless
Communication module includes antenna element, receiving unit, data-interface and computer, and antenna element connects receiving unit, receiving unit
Data-interface is connected, data-interface connects computer.
CN103287348A discloses a kind of automobile multimedia device comprising display unit, control unit, detection unit
And signal element, the display unit connect described control unit, the detection unit connects the detection unit, the signal
Unit connects the display unit, and the display unit is shown for multimedia interface design and touch control, and described control unit is used
The display unit is turned off or in the result detected according to the detection unit, the signal element is used for single according to display
First touch-control result is issued to induction signal to external multimedia computer.
CN207489012U discloses a kind of SOC chip, and wherein SOC chip includes：It non-connection module coprocessor and non-connects
Communication module, non-switched letter module are electrically connected with non-connection module coprocessor, including preliminary wake-up module and clock and data recovery
Module；Preliminary wake-up module is electrically connected with non-connection module coprocessor, for detecting the field strength of SOC chip place radiofrequency field, in
When detecting that field strength is greater than preset value, the first wake up instruction is sent to non-connection module coprocessor；Non- connection module coprocessor, with
The electrical connection of clock and data recovery module；Clock and data recovery module is extracted for entering working condition according to the first wake up instruction
The clock signal of input radio frequency signal, and sent according to clock signal to non-connection module coprocessor and wake up indication signal；It is non-to connect
Module coprocessor is also used to determine whether to wake up SOC chip according to wake-up indication signal.
CN107391232A discloses a kind of system level chip SOC and SOC system, belongs to data encryption processing technique neck
Domain, the SOC include：One or more cores；Internal security memory is located inside SOC, and the internal security memory passes through interior
Portion's secure memory interface is initialized, and data are stored in inside the internal security memory from processor.
CN202110536U discloses a kind of SOC chip for supporting various display screens, and the SOC chip includes microprocessor
Controller module and e-book display screen control module, which is characterized in that the e-book display screen control module includes being used for
Control at least two e-book displaying screen controllers of the e-book display screen EPD panel of different mode.
KR2013-0027658A disclose a kind of semiconductor devices include system on chip (SOC) and at least one width input/
Output storage part, the SOC include providing multiple SOC group of bumps in input/output channel independent of each other respectively, this at least one
A wide input/output memory device is stacked in the system on chip to be sent out by the SOC group of bumps to/from the system on chip
Data are sent/receive, the SOC group of bumps is so disposed and at least one wide input/output memory device is so matched
It sets, so that one of described width input/output memory device can be mounted to be connected to all SOC group of bumps on the SOC,
Or two wide input/output memory device can be mounted on the SOC, each width input/output memory device point
It is not connected to the SOC group of bumps of half.
KR2015-0138892A discloses a kind of side of battery charging state (SOC) for controlling hybrid vehicle
Method includes the following steps：The inclination of each speed of drive mode and the vehicle by controller based on to(for) the vehicle
Degree determines the driving load of the vehicle；Calibration is determined based on driving load and main battery SOC state by the controller
Value；And the calibration value is based on by the controller and adjusts boosting battery SOC state according to two driving load models, it is described
Two driving load models include high load mode and low-load mode.
JP2015-032487A discloses a kind of current SOC and corresponding with the variation of SOC of capable of intuitively grasping
The SOC display device of the hybrid vehicle of the change of driving mode.Mixing with EV driving mode and HV driving mode is dynamic
The SOC display device of power vehicle has display equipment, shows and carries out mobile mobile logo and along shifting according to the increase and decrease of SOC
The constant mark moving the moving range of mark and configuring.
" SoC chip design method and standardization ", Zhang Lisheng etc.,《Journal of Computer Research and Development》, 2002,39 (1):1-8,
It points out to have entered system level chip (SoC) design epoch, SoC chip with the rapid development of integrated circuit technique, integrated circuit
Integrated level it is higher and higher, the integrated level and operating frequency on single-chip are higher and higher, time to market require increasingly
Short, in order to realize such SoC chip, designer is increasingly dependent on the reuse of IP module, describes SoC IP module thus
With the standardization of on-chip bus structure, discusses and the system level description language of class libraries is extended based on C/C++ and based on the SoC of platform
Design method.
In the prior art, although recognizing the increase of power dissipation density, chip temperature can be made to increase, thus to circuit can
It is had an impact by property.However, only set about from the design of the structure of chip to reduce the power consumption of SOC chip substantially.In fact, core
The structure of piece designs the limitation by factors, and single start with from chip structure design (such as optimization of logic mechanism) is difficult to gram
Take chip integration quicklys increase generated power consumption and heat, often has to sacrifice certain core to save power consumption
Piece performance.The prior art lacks the comprehensive means for coping with this problem.
This field needs a kind of SOC chip power consumption is effectively reduced, improves and SOC chip heat dissipation performance and does not reduce its performance
Method, and need a kind of automotive intelligent cockpit system using the SOC chip.
Summary of the invention
In order to solve the highly integrated brought power consumption and heat dissipation problem of SOC chip, the present inventor is by further investigation
And a large number of experiments, on the basis of previous patent application, by with the multi-party cooperative research and development of colleges and universities and scientific research institutions, by chip structure
Design and encapsulation technology (selection and use including encapsulating material) combine, and reduce device by good heat dissipation
Crash rate to reduce the energy consumption of SOC chip, and then efficiently solves the above problem.
In one aspect of the invention, automotive intelligent cockpit system is provided, which includes：Vehicle-mounted information and entertainment system
(i.e. subsystem), digital virtual instrument system (i.e. subsystem), left rear seat entertainment system (i.e. subsystem), right rear seat entertainment system
It unites (i.e. subsystem), automatic navigator system (i.e. subsystem) and height radiate SOC chip (i.e. chip subsystem)；The intelligence seat
Cabin system is connected by height heat dissipation SOC chip with above-mentioned five subsystems, receives the information that each subsystem is sent, and to each son
System is controlled, thus by above-mentioned five sub- system combinations at a set of unified intelligent cockpit system；The intelligence cockpit system
System controls different display screen and/or digital instrument by different virtual machines respectively, allows different display equipment same
When show different contents；And optionally, the high heat dissipation SOC chip includes digital bare die and Flash bare die, the number
Word bare die and Flash bare die are packaged together in a stacked.
Preferably, the high heat dissipation SOC chip is packaged using cooling encapsulation material.Use the cooling encapsulation material generation
For the high heat dissipation SOC chip that traditional plastics are packaged, heat can be made to shed in time, to reduce the accumulation and temperature of temperature
The raising of degree.
Known in the art, due to the increase of power dissipation density, chip temperature will be increased, so that the reliability to circuit generates
It influences.Chip temperature raising can also cause many problems such as hot carrier, electromigration, and electronic circuit can also be caused short circuit occur
Or open circuit.It is, in general, that 10 degree are increased as the temperature of fruit chip is every, then the reliability of device can reduce half.Excessive function
Consumption can have a huge impact the reliability of system, and excessively high power consumption will lead to the rising of system temperature, and the raising of temperature is same
When increase the crash rate of system.Studies have shown that the every increase by 10 of system temperature is Celsius when temperature is greater than 85 degrees Celsius
Degree, the crash rate of system will will increase 1 times.Integrated circuit can consume a large amount of energy, these can come most will will become
Heat comes out, so the normal working temperature in order to guarantee chip, has to using effective heat dissipation technology.This is just needed
It spends and largely avoids chip from generating heat at the cooling and encapsulation that solve the problems, such as chip originally.
Having been reported that becomes ceramics from plastics for encapsulation, however, since package specific ceramics are inherently more expensive, it is more important
Ground, ceramic rigidity bring great difficulty to packaging technology, and technology difficulty will be bigger in highly integrated SOC chip,
Cause the price of encapsulation that will will appear 4 times or more of growth.Another method taken at present is, when the power consumption of chip is higher than
When 50W, increase radiator fan to radiate.But the use of radiator fan is sat in automobile has very big limitation in cabin system
First, it is the limitation in space first, in addition comes to be exactly high-heat environment in itself in automobile electric control system, heat is difficult to shed, furthermore
If the reliability of radiator fan is lower and power consumption is larger, be not suitable for the automobile-used environment that reliability requirement is high and power supply capacity is weak.
For this purpose, the present invention provides described high cooling encapsulation materials and preparation method thereof.Preferably, the cooling encapsulation material
Material is composite organic-inorganic material.It is highly preferred that the composite organic-inorganic material is beryllium oxide ceramics powder and poly- (bis-phenol
A-co- epichlorohydrin) compound.
Preferably, in the compound, beryllium oxide ceramics powder and the weight ratio of poly- (bisphenol-A-co- epichlorohydrin) are
(1:10)-(1:1), preferably (1:10)-(1:5).
Preferably, the average grain diameter of the beryllium oxide ceramics powder is 5nm-80nm, more preferable 10-50nm.
Preferably, the particle of the beryllium oxide ceramics powder is evenly embedded into the polymerization at poly- (bisphenol-A-co- epichlorohydrin)
In object network.
Preferably, the weight average molecular weight of poly- (bisphenol-A-co- epichlorohydrin) is 35,000-50,000, preferably 40,000-
45,000。
Preferably, poly- (bisphenol-A-co- epichlorohydrin) is glycidol sealing end.
In a preferred embodiment, the compound can be made by the following method：By poly- (bisphenol-A-co- epichlorohydrin)
It is dissolved in n-butanol and toluene (preferably 1:1 weight ratio) cosolvent in, obtained polymer solution is sufficiently stirred, then in proportion plus
Enter beryllium oxide ceramics powder (or colloidal solution of the beryllium oxide ceramics powder in the cosolvent of n-butanol and toluene is added),
It is sufficiently stirred at room temperature, until polymer solution and beryllium oxide ceramics powder are uniformly mixed, then evaporation of solvent is to get oxygen
Change the compound of beryllium ceramic powders and poly- (bisphenol-A-co- epichlorohydrin).
It is highly preferred that the particle surface of the beryllium oxide ceramics powder is modified with propionic acid, that is, the beryllium oxide pottery
Porcelain powder is the modified beryllium oxide ceramics powder of particle surface propionic acid.
The modification preferably carries out by the following method：Propionic acid (preferably excessive) is added in beryllium oxide ceramics powder,
It is stirred at room temperature 12-24 hours, then by the way that the sediment to be formed is collected by centrifugation, obtains wet cake, and washed with ethyl acetate
It washs to remove extra propionic acid, the wet cake through the modified undried beryllium oxide ceramics powder of propionic acid is added to weight ratio
It is 1:In 1 n-butanol and the cosolvent of toluene, be ultrasonically treated, make beryllium oxide ceramics powder be completely dispersed n-butanol and
In the cosolvent of toluene, then evaporation removes cosolvent, obtains the beryllium oxide ceramics powder modified through propionic acid；Alternatively, can not
Cosolvent is removed, obtains beryllium oxide ceramics powder colloidal solution, which is used directly for preparing beryllium oxide ceramics powder
The last compound with poly- (bisphenol-A-co- epichlorohydrin).
The present inventor has found after study, to obtain suitable thermal conductivity and packaging effect, beryllium oxide ceramics powder with
The dosage of poly- (bisphenol-A-co- epichlorohydrin) is preferably in the range.Studies have shown that with the increasing of beryllium oxide ceramics powder proportions
Adding, beryllium oxide ceramics powder particle average headway reduces, and reduces heat transmission resistance, significantly improve thermal conductivity, however the package material
The plasticity and machinability of material are substantially reduced, and seriously limit the scope of application of encapsulating material, it is caused to be difficult to use in this hair
The encapsulation of bright SOC chip structure, and increase process costs.And when the reduction of beryllium oxide ceramics powder proportions, then it can not play
Effective conductive force.It finds after tested, for the composite organic-inorganic material as cooling encapsulation material of the invention, when
When beryllium oxide ceramics content of powder is 20%, the thermal conductivity of encapsulating material can reach 0.979W/ (mK), than being added without
The organic silicon potting material for stating beryllium oxide ceramics powder improves about 570%.The collaboration of this organic-inorganic material of the invention
Cooperation significantly improves the thermal conductivity of encapsulating material and has little influence on machinability, and the present invention has taken into account thermal conductivity and can be processed
Property it is well balanced, such effect be previous institute it is not expected that.
Research also found, when using propionic acid modified beryllium oxide ceramics powder, than unmodified beryllium oxide ceramics powder
Better effect can be obtained, such as thermal conductivity can be improved 60% or more.As described in Figure 2, when beryllium oxide ceramics powder is with third
When acid is modified, the hydroxyl of the hydroxyl on surface and poly- (bisphenol-A-co- epichlorohydrin) forms hydrogen bond, to significantly improve beryllium oxide
The binding performance of ceramic powders and poly- (bisphenol-A-co- epichlorohydrin), the increase of this binding force improves composite effect, to have
Conducive to the dispersion of beryllium oxide ceramics powder particle, and isolation between the two can be prevented, therefore significantly improve thermally conductive effect
Fruit.
Preferably, SOC chip of the invention includes processor arm module (such as arm7 module), JTAG synchronization module,
SRAM module, EMI module, timer module timer, universal serial port controller UART, dedicated serial ports controller SUART are interrupted
Controller module, power managed module, data reception module and Flash module.Wherein, arm module, JTAG synchronization module,
SRAM module, EMI module, timer module timer, universal serial port controller UART, dedicated serial ports controller SUART are interrupted
Controller module, power managed module, data reception module can integrate to form digital bare die (it is also assumed that being integrated in number
On word bare die), the Flash module can be Flash bare die (it is also assumed that being integrated on Flash bare die).
For automotive intelligent cockpit system of the invention, it is preferable that the high heat dissipation SOC chip includes 1 number
Bare die and 2 Flash bare dies, 2 Flash bare dies are respectively placed in the two sides of digital bare die.
Preferably, the SOC chip includes chip input and output pin (i.e. IO Pad) and power supply line/ground pin is (i.e.
P/G Pad), wherein being inserted into a P/G Pad every 1-2 IO Pad.
Known in the art, the power consumption profile of chip is mainly by IO Pad arrangement, the quantity of P/G Pad and setting position
It influences., generally can be based on the considerations of Improving Working Timing characteristic after IO Pad, which arranges, to be determined, it will logic unit relevant to I/O signal
It is placed near the IO Pad.If nearby there is no P/G Pad if IO Pad is continuously placed, it is easy to because of part
Current needs are excessive to cause the region power supply power supply insufficient, and then causes disabler, will lead to higher power consumption instead.In order to
Guarantee good power supply, existing technique is usually to be inserted into a P/G Pad every 3-5 IO Pad.However, this law human hair
Existing, with the raising of SOC integrated level, the density of setting of this P/G Pad cannot particularly effectively meet power reguirements, to the greatest extent
Pipe using more highdensity P/G Pad it is thought that be arranged, and still, excessive density of setting will lead to calorific value and significantly improve,
Existing encapsulating material is unable to satisfy high density setting, therefore is typically all to be inserted into a P/G Pad every 3-5 IO Pad.
Since the present invention replaces traditional plastics such as silica gel packaging material using the encapsulating material of above-mentioned high thermal conductivity effect, allow
Using the density of setting of higher P/G Pad, so as to meet the requirement of SOC chip Highgrade integration.
Preferably, the SOC chip also includes multiple IP stones (or IP module), and the IP stone layout is the four of chip
Week.
It is preferably, described that state SOC chip also include power management module and gated clock module.
Clock Gating Technique is particularly critical for lower power consumption.With deep submicron integrated circuit and system SOC chip
It rapidly develops, the scale of single-chip circuit constantly increases, so that control chip power-consumption becomes one of the significant challenge of this field.And
Power management module is also especially significant for lower power consumption, and usually requiring to be combined with gated clock module can just be effectively reduced
Power consumption.For this purpose, present invention employs following power management modules and gated clock module set-up mode：By power management module reality
The dynamic power consumption control of existing chip manages the switch of the gated clock module of each SOC chip remaining each module, is worked as by closing
The clock of preceding unused module inputs to reduce power consumption.
For example, 3 universal serial port controller UART, 3 dedicated serial ports controls can be shared in SOC chip of the invention
Device SUART processed, timer module timer, 8 modules such as data reception module, they by power management module via gate when
Clock module turns off to control, these intermodules are weak coupling relationship, can be while a module works, other modules are real
Shutdown is applied, such as when data reception module work, other modules may be at off state.
It is highly preferred that in order to dynamically manage power consumption, 8 gated clocks are devised before the clock of 8 modules (can be with
It is designed according to conventional compilation logic).By the unlatching of gated clock, realize that several modules work and the pass of remaining module
It is disconnected, to dynamically manage power consumption, realize the reduction of power consumption.
Preferably, for automotive intelligent cockpit system of the invention, the intelligence cockpit system is using virtualization skill
Art virtualizes the hardware resource of SOC chip, and physical resource is abstracted into virtualization pool, then to virtual resource into
Row segmentation, and according to user demand, several virtual machines are created in virtualization pool, and different behaviour is run in each virtual machine
Make system, each virtual machine is responsible for controlling a subsystem, be realized based on same set of hardware platform to five differences to realize
The control function of subsystem.
Preferably, the intelligent cockpit system further includes MCU chip, passes through MCU chip and vehicle-mounted all kinds of buses and letter
Breath transferring element is connected, and completes the reception, transmission and pretreatment of all kinds of signals of communication, serves as the communication front-end machine of SOC chip,
Mitigate the load of SOC chip, and the SOC chip supports CPU and GPU hardware virtualization to accelerate, to enhance each virtual machine
Computing capability.
Preferably, the intelligent cockpit system is additionally provided with middle control module, and middle control module connects touch display screen, Yi Jisuo
It states intelligent cockpit system and is provided with wireless interconnected control module, for connecting car-mounted terminal and smart machine, by smart machine
Display interface shares to car-mounted terminal and realizes the control to smart machine.
Preferably, the intelligent cockpit system is provided with wireless charging module, is intelligent cockpit by wireless transmission method
System provides power supply.
Preferably, the wireless charging module includes rechargeable battery submodule and submodule is controlled electronically, described to fill
Electric battery submodule is sat cabin system with intelligence and is electrically connected to power to it.It is highly preferred that the electronic control submodule has the
One antenna, the first antenna are coupled with the second antenna of automobile power supply system (such as electric motor of automobile), so that the electronic control is sub
Module is rechargeable battery submodule charging using wireless charging signal.It is highly preferred that the electronic control submodule can
To control the time of coupling and the degree of coupling.
Preferably, the first antenna and second antenna respectively include ferrite pot core prefabricated rods and around institute
State the solenoid of the mandrel setting of ferrite pot core prefabricated rods.
During wireless charging module 100 works, SOC chip 106 periodically monitors rechargeable battery submodule 108
Charged state.SOC chip 106 is via bidirectional data communication link 112 by the charging shape on rechargeable battery submodule 108
State is periodically transmitted to electronic control submodule 102.Be controlled electronically submodule 102 via bidirectional data communication link 112 from
SOC chip 106 receives regularly updating about the charged state on rechargeable battery submodule 108.Electronic control module 102
Identify the charged state on rechargeable battery submodule 108 and by the charge value and threshold on rechargeable battery submodule 108
Value is compared.In a way of example, threshold value is 80% of the charge on full charge of battery.If rechargeable is electric
Charge value in pond module 108 has descended to threshold value hereinafter, submodule 102, which is then controlled electronically, determines that battery needs are filled
Electricity.If battery needs to charge, submodule 102 is controlled electronically and wirelessly sends out charge information via wireless charging link 114
It is sent to SOC chip 106, and opens simultaneously coupling to realize charging.Rechargeable battery submodule 108 can give cockpit system
110 power supplies.Therefore, which may be implemented discontinuous charging, and wherein charging signals do not transmit wirelessly always,
The discontinuous transmission of charged state based on rechargeable battery submodule 108.
The wireless charging module that fills overcomes over-charging of battery caused by wired charging system, and can give cockpit system
Design bring higher freedom degree.In addition, the charged state is discontinuous transmission mode, this mode can save electricity
Can, the waste of limited electric energy in automobile can be effectively reduced.In addition, by the way that storage battery is arranged in wireless charging module
Submodule, the power supply system for capableing of effective guarantee cockpit are stablized.If being directly connected to the power supply system of automobile, automobile will lead to
In peak of power consumption electricity shortage, and the voltage of automobile power supply system is usually unstable, and can give has the function of relatively abundant thus function
It consumes higher cockpit system and causes performance inconsistency or damage.Further, it is also possible to mitigate the load of the battery of automobile power supply system,
Especially peak load.
In addition, confession can be improved due to realizing intelligent intercommunication and control with SOC chip in wireless charging module of the invention
The good complementary and suitability of electrical property and SOC chip performance.
In another aspect of this invention, a kind of automobile is provided, it includes the intelligent cockpit systems of aforementioned automotive.More preferably
Ground, the automobile are electric car.
In order to make it easy to understand, term of the present invention is explained as follows：HUD：Head-up display (Head Up Display), is mesh
The preceding flight supplementary instrument on aircraft at present generally used on aircraft.Head-up is meant that pilot can see ... without looking down him
The important information needed.Head-up display first appears on military aircraft, and reduces pilot and needs to bow to check the frequency of instrument
Rate avoids attention from interrupting and lose the grasp to situation awareness (Situation Awareness).Because of the convenience of HUD
Property and can be improved flight safety, airliner also follow-up installation one after another.Now, head-up display is also generallyd use on automobile,
To facilitate driver in the case where watching the instruments without bowing, you can learn that important driving information.
ECU：ECU (Electronic Control Unit electronic control unit), electronics/electrical system (E/E) on automobile
Quantity constantly increases, and has a ECU up to more than 70 on some high-end limousines, wherein air bag system, braking system, bottom
Disk control system, engine control system and line control system etc. are all safety-related systems.When system breaks down,
System must be transferred to safe condition or be transformed into degraded mode, avoid system function failure and lead to casualties.Failure can
Can be due to standardize the mistake of wrong (for example demand for security is imperfect), artificial origin (such as：Software bug), the influence of environment
(such as：Electromagnetic interference) and other reasons caused by.In order to realize, electronics/electrical system functional safety is designed on automobile, road
The formal publication in 2011 of vehicle functions safety standard ISO 26262 provides guide for exploitation automotive safety related system, should
The basis of standard is electronic/electrical gas/programmable electronic system Functional Safety Standard IEC 61508 suitable for any industry.
ASIL：(Automotive Safety Integration Level, automotive safety integrity level),
When doing function safe design to system in ISO26262 standard, early period an important step be system is carried out hazard analysis and
Risk assessment identifies the harm of system and to the risk class of harm --- ASIL grade is assessed.There are four ASIL
Grade, respectively A, B, C, D, wherein A is minimum grade, and D is highest grade.Then, it is determined at least for every kind of harm
One security target, security target is the demand for security of the highest level of system, by the safety of security target guiding system rank
Demand, then demand for security is assigned to hardware and software.ASIL grade determines the requirement to security of system, and ASIL grade is got over
Height, it is higher to the security requirement of system, to realize that the cost paid safely is higher, it is meant that the diagnosis coverage rate of hardware is got over
Height, development process is stringenter, and corresponding development cost increases, the development cycle extends, and demands strict technology.It is mentioned in ISO 26262
Method-the ASIL for having gone out to reduce ASIL grade under the premise of meeting security target is decomposed, and is can solve in above-mentioned exploitation in this way
Difficult point.
IVI：(In-Vehicle Infotainment, vehicle-mounted information and entertainment system) is using vehicle-mounted dedicated central processing
Device is based on Vehicle Body Bus system and Internet service, the vehicle integrated information processing system of formation.IVI can be realized including three
Tie up navigation, real-time road, IPTV, auxiliary driving, fault detection, information of vehicles, Body Control, mobile office, wireless telecommunications, base
In a series of applications such as online amusement function and TSP (Telematics Service Provider) services, greatly promoted
Cartronic, networking and intelligent level.
AVB：(Ethernet Audio/Video Bridging, Ethernet audio-video bridging technology) is one new
IEEE802 standard, on the basis of traditional ethernet network, by ensureing bandwidth (Bandwidth), limited delay
(Latency) (Time synchronization) synchronous with precision clock, to support the various networks based on audio, video more
Media application.AVB focuses on the real-time audio and video performance of enhancing traditional ethernet, while maintaining 100% back compatible biography again
System Ethernet, is next generation network audio-video Real-time Transmission with development potential.
AVM：Panorama is parked image system (also known as AVM panoramic view monitoring image system, 360 degree of full-view cameras, 360 degree
Full-view image system, 360 degree of panoramic parking systems, 360 degree of panoramic visualization systems, 360 degree of panorama backing systems), pass through installation
In the 4 ultra wide-angle imaging heads of vehicle body all around, while acquiring the image of vehicle's surroundings, by Pu Jieli it is proprietary " in real time
Pattern distortion restores docking technique " processing such as distortion reduction-visual angle conversion-image mosaic-image enhancement is carried out to image,
Ultimately form a seamless complete vehicle Zhou Quanjing birds-eye view.The system can not only show panorama sketch, can also show and appoint simultaneously
The single-view in one direction；Driver is by cooperating scale line that can accurately read position and the distance of barrier.
MCU：(Microcontroller Unit, micro-control unit), also known as one chip microcomputer (Single Chip
It Microcomputer) or single-chip microcontroller, is central processing unit (Central Process Unit；CPU frequency and specification)
Do appropriate reduction, and by the perimeter interfaces such as memory (memory), counter (Timer), USB, A/D conversion, UART, PLC, DMA,
Even LCD driving circuit all integrates the computer for forming chip-scale on a single chip, does different groups for different applications
Close control.Such as mobile phone, PC periphery, remote controler or even automotive electronics, industrial stepper motor, the control of robotic arm etc.,
The figure of all visible MCU.
SOC (System on Chip, systems-on-a-chip), also referred to as system on chip, it is intended that it is a product, and being one has
The integrated circuit of application-specific target, wherein including holonomic system and the full content for having embedded software.It is a kind of technology again simultaneously,
To realize since determining system function, divided to software/hardware, and the whole process of complete design.
The present invention realizes the integration and control for more covering vehicle-mounted electronic information entertainment systems by systematization hardware system,
The control model of a machine multifrequency is realized, and each display unit can concurrently and independently show different contents.This design
Scheme simplifies the overall control architecture of in-vehicle electronic system, reduces design difficulty and manufacturing cost, while also meeting use
The diversified display demand at family, the user experience is improved.The hardware configuration of unified simplification is established for subsequent Function Extension
Solid foundation.Based on the hardware configuration, next-generation cockpit system can have been made.
In addition, by the present invention in that with the new lower power consumption of SOC chip and the method for improving heat dissipation, will reduce power consumption and
It improves heat dissipation to combine, allows SOC chip that there is higher integrated level and operation power, be the expansion of cockpit system function
Exhibition improves permission condition.Particularly, it in the present invention, by the design of specific cooling encapsulation material, improves SOC chip and sets
The set-up mode of the freedom degree of meter such as pin, so that heat dissipation effect can be improved in the case where not reducing SOC chip performance
Fruit reduces the risk that poor heat radiation may cause.
Detailed description of the invention
Fig. 1 is the block diagram of automotive intelligent cockpit system of the present invention；
Fig. 2 is to show the modified oxidized beryllium ceramic powders of propionic acid and poly- (bisphenol-A-co- epichlorohydrin) in compound of the invention
Binding performance schematic diagram；
Fig. 3 is the exemplary block diagram for showing wireless battery charging module.
Specific embodiment
It is to illustrate specific embodiments of the present invention and comparative example, but the present invention is not limited thereto below.
Embodiment 1
With reference to attached drawing 1, it is shown that the intelligent cockpit system of a machine multifrequency of the invention, including vehicle-mounted information and entertainment system,
Digital virtual instrument board, left rear seat entertainment system, right rear seat entertainment system, automatic navigator, SOC chip (Intel
Apollo lake) and MCU chip.It is characterized in that, the intelligence cockpit system passes through a SOC chip and above-mentioned five sons
System is connected, and the information that each subsystem is sent is received, and control each subsystem, so that above-mentioned five subsystems is whole
Synthesize a set of unified intelligent cockpit system.The intelligence cockpit system is by virtualization technology, to the hardware resource of SOC chip
It is virtualized, physical resource is abstracted into virtualization pool, then virtual resource is split, according to user demand,
2 virtual machines are created in virtualization pool, are run different operating system (OS) in each virtual machine, a virtual machine is responsible for control
Vehicle electronics entertainment systems (IVI) processed, another virtual machine is responsible for controlling digital meter panel (HUD), to realize based on same
Hardware platform realization is covered to the control function of above-mentioned five different sub-systems；The intelligence cockpit system passes through MCU chip and vehicle
All kinds of buses carried are connected with information transferring element, complete the reception, transmission and pretreatment of all kinds of signals of communication, serve as SOC
The communication front-end machine of chip, mitigates the load of SOC chip.Referring to attached drawing 1, the intelligence cockpit system passes through different virtual machines
Different display screen and/or digital instrument are controlled respectively, guarantee that different display equipment can show different contents simultaneously, from
And it realizes with multiple high definitions such as the seamless support vehicle-mounted information and entertainment system of a hardware platform, digital instrument and automatic navigators
Screen using and interacting, and meets the diversified information display requirements of user, promotes user experience, and the SOC chip supports CPU
It virtualizes and accelerates with GPU hardware, to enhance the computing capability of each virtual machine, the intelligence cockpit system is provided with middle control module,
Middle control module connects touch display screen, and the intelligence cockpit system is provided with wireless interconnected control module, for connecting vehicle-mounted end
The display interface of smart machine is shared to car-mounted terminal and realizes the control to smart machine, the intelligence by end and smart machine
Energy cockpit system is provided with wireless charging module, provides power supply by wireless transmission method for smart machine.
Embodiment 2
Excessive propionic acid 50mL is added to 4g beryllium oxide ceramics powder and (derives from Jiangsu Dingqi Science And Technology Co., Ltd., averagely
Partial size is about 15nm) in, after being stirred at room temperature 24 hours, by the way that the sediment to be formed is collected by centrifugation as wet cake, it is used in combination
Ethyl acetate washs 3 times to remove extra propionic acid, by the wet filter through the modified undried beryllium oxide ceramics powder of propionic acid
It is 1 that cake, which is added to 50g weight ratio,:In 1 n-butanol and the cosolvent of toluene, it is ultrasonically treated 1 hour, the solid of precipitating is complete
It is distributed in the cosolvent of n-butanol and toluene entirely, it is molten to obtain the colloid through the modified nano oxidized beryllium ceramic powder particle of propionic acid
Liquid.
30g poly- (bisphenol-A-co- epichlorohydrin) is dissolved in the cosolvent of 200mL n-butanol and toluene, aforementioned propionic acid is changed
The nano oxidized beryllium ceramic powder particle colloidal solution in n-butanol and toluene co-solvent of property is added in polymer solution,
At room temperature uniformly, solvent then is being removed at 60 DEG C, beryllium oxide ceramics powder and poly- (bisphenol-A-co- epichlorohydrin) is made
Compound.
Embodiment 2
It (is completed by contents electronics) using MCM package technology, SOC chip is carried out using compound made from embodiment 2
Encapsulation, the SOC chip after encapsulation are applied in the cockpit system of embodiment 1, and heat dispersal situations are tested.Test bench cabin system is being born entirely
3 hours SOC chip temperature are run under lotus state.After tested, SOC chip temperature is about 50 DEG C.
Comparative example 1
Embodiment 2 is repeated, the difference with embodiment 2 is only that encapsulating material is that (it is organic to be purchased from SHIN-ETSU HANTOTAI to electronics silica gel by RTV
Silicon (China) Co., Ltd).Test bench cabin system runs 3 hours SOC chip temperature under full load state.After tested, SOC
Chip temperature is about 79 DEG C.
By above-described embodiment and comparative example clearly it can be seen from the composite material of the invention tool when being used as encapsulating material
There is particularly preferred heat dissipation effect.Such heat dissipation effect is that the design of chip brings very high redundancy, such as allows in SOC core
It is inserted into a P/G Pad every 1-2 IO Pad in the design of piece, is supplied to both improve strong power supply for integrated circuit
It answers, and is unlikely to keep SOC chip temperature excessively high.The reduction of this chip temperature can also improve the reliability of circuit, reduce heat
The problems such as carrier, electromigration, avoids the crash rate for causing electronic circuit short circuit or open circuit and device occur, to effectively drop
Low-power consumption.
This written description discloses the present invention, including optimal mode using example, and also enables those skilled in the art
The manufacture and use present invention.It is of the invention can patentable scope be defined by the claims, and may include this field skill
Other examples that art personnel expect.If this other examples have not different from the structural elements of the literal language of claims
Element, or if this other examples include the equivalent structure element with the literal language of claims without substantial differences,
Then this other examples are intended within the scope of claims.In the case where not will cause inconsistent degree, by reference to
It will be incorporated herein in place of all references referred to herein.
Claims (10)
1. automotive intelligent cockpit system, the system include：It is vehicle-mounted information and entertainment system, digital virtual instrument system, left back
Seat entertainment systems, right rear seat entertainment system, automatic navigator system and high heat dissipation SOC chip, it is characterised in that：
The intelligence cockpit system is connected by height heat dissipation SOC chip with above-mentioned five subsystems, is received each subsystem and is sent
Information, and each subsystem is controlled, thus by above-mentioned five sub- system combinations at a set of unified intelligent cockpit system；
The intelligence cockpit system controls different display screen and/or digital instrument by different virtual machines respectively, so that not
Same display equipment can show different contents simultaneously；And
The high heat dissipation SOC chip includes digital bare die and Flash bare die, and the number bare die and Flash bare die are with the side of stacking
Formula is packaged together.
2. automotive intelligent cockpit system according to claim 1, it is characterised in that：The high heat dissipation SOC chip includes 1
A number bare die and 2 Flash bare dies, 2 Flash bare dies are respectively placed in the two sides of digital bare die.
3. automotive intelligent cockpit system according to claim 2, it is characterised in that：The SOC chip includes that chip is defeated
Enter output pin (i.e. IO Pad) and power supply line/ground pin (i.e. P/G Pad), wherein being inserted into one every 1-2 IO Pad
P/G Pad。
4. according to the described in any item automotive intelligent cockpit systems of preceding claims, it is characterised in that：The intelligence cockpit
System uses virtualization technology, virtualizes to the hardware resource of SOC chip, physical resource is abstracted into virtualization pool,
Then virtual resource is split, and according to user demand, several virtual machines is created in virtualization pool, it is each virtual
Different operating system is run in machine, each virtual machine is responsible for controlling a subsystem, to realize flat based on same set of hardware
Platform realizes the control function to five different sub-systems.
5. according to the described in any item automotive intelligent cockpit systems of preceding claims, it is characterised in that：The intelligence cockpit
System further includes MCU chip, is connected by MCU chip with vehicle-mounted all kinds of buses and information transferring element, is completed all kinds of logical
Reception, transmission and the pretreatment for believing signal, serve as the communication front-end machine of SOC chip, mitigate the load of SOC chip, and described
SOC chip supports CPU and GPU hardware virtualization to accelerate, to enhance the computing capability of each virtual machine.
6. according to the described in any item automotive intelligent cockpit systems of preceding claims, it is characterised in that：The intelligence cockpit
System is additionally provided with middle control module, and middle control module connection touch display screen and the intelligent cockpit system are provided with wireless mutual
Join control module, for connecting car-mounted terminal and smart machine, the display interface of smart machine is shared into car-mounted terminal and real
Now to the control of smart machine.
7. according to the described in any item automotive intelligent cockpit systems of preceding claims, it is characterised in that：The intelligence cockpit
System is provided with wireless charging module, provides power supply by wireless transmission method for intelligent cockpit system.
8. automotive intelligent cockpit system according to claim 7, the wireless charging module includes rechargeable battery
Module and electronic control submodule, the rechargeable battery submodule are sat cabin system with intelligence and are electrically connected to power to it.
9. automobile, it includes automotive intelligent cockpit systems according to claim 1-8.
10. automobile according to claim 9, which is electric car.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010234801.XA CN111332231B (en) | 2018-06-22 | 2018-06-22 | Intelligent cabin system for automobile and automobile using same |
| CN201810648130.4A CN108891365B (en) | 2018-06-22 | 2018-06-22 | Intelligent cabin system for automobile and automobile using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810648130.4A CN108891365B (en) | 2018-06-22 | 2018-06-22 | Intelligent cabin system for automobile and automobile using same |
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| CN202010234801.XA Division CN111332231B (en) | 2018-06-22 | 2018-06-22 | Intelligent cabin system for automobile and automobile using same |
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| CN201810648130.4A Active CN108891365B (en) | 2018-06-22 | 2018-06-22 | Intelligent cabin system for automobile and automobile using same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111114320A (en) * | 2019-12-27 | 2020-05-08 | 深圳市众鸿科技股份有限公司 | Vehicle-mounted intelligent cabin sharing display method and system |
| CN115285044A (en) * | 2022-08-04 | 2022-11-04 | 亿咖通(湖北)技术有限公司 | Resource sharing method, vehicle-mounted system and vehicle-mounted controller |
| US20240025257A1 (en) * | 2020-06-29 | 2024-01-25 | Audi Ag | Method for operating a vehicle information system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111332231B (en) * | 2018-06-22 | 2021-07-20 | 浙江航芯科技有限公司 | Intelligent cabin system for automobile and automobile using same |
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Also Published As
| Publication number | Publication date |
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| CN108891365B (en) | 2020-05-01 |
| CN111332231A (en) | 2020-06-26 |
| CN111332231B (en) | 2021-07-20 |
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