CN108871026B - Ultrathin heat pipe capillary structure and preparation method thereof - Google Patents

Ultrathin heat pipe capillary structure and preparation method thereof Download PDF

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CN108871026B
CN108871026B CN201811004792.4A CN201811004792A CN108871026B CN 108871026 B CN108871026 B CN 108871026B CN 201811004792 A CN201811004792 A CN 201811004792A CN 108871026 B CN108871026 B CN 108871026B
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micro
copper
array
copper foil
column array
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CN108871026A (en
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张平
燕立培
许晖
史波
李娇
何虹
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Guilin University of Electronic Technology
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Guilin University of Electronic Technology
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention discloses an ultrathin heat pipeThe capillary structure comprises a substrate and a copper micro-column array arranged on the substrate, wherein micro or/and nano-scale holes are formed in the surface of the copper micro-column array. The preparation method comprises the following steps: depositing Cu-Al on the surface of the substrate by adopting a photoetching technology and an electrochemical deposition method2O3A micropillar array of nanocomposite material; soaking the deposited micro-column array in NaOH solution to obtain Al2O3Dissolving the nano particles to obtain the copper micro-column array with micro or/and nano-scale holes on the surface. The manufacturing method is simple, and the prepared porous structure on the surface of the capillary structure can effectively enhance the boiling heat transfer of the heat pipe and improve the critical heat flux of the heat pipe, thereby obviously improving the heat transfer performance of the heat pipe.

Description

Ultrathin heat pipe capillary structure and preparation method thereof
Technical Field
The invention relates to an ultrathin heat pipe capillary structure and a preparation method thereof, belonging to the technical field of heat transfer.
Background
With the development of modern electronic technology, the size of electronic products is smaller and smaller, so that electronic components are more and more compact, and the amount of heat generated in a unit area is increased sharply. In order to meet the heat dissipation requirements of modern electronic products, flexible ultrathin heat pipes are produced. As the most important component in the heat pipe, the heat transfer performance of the heat pipe is directly influenced by the quality of the capillary structure, but the traditional capillary structure is difficult to apply to the ultrathin heat pipe due to the small volume and the thin thickness of the ultrathin heat pipe, and the existing processing technologies such as laser processing, electron beam etching and the like have high cost and low efficiency and are difficult to realize large-scale application, so that the invention of the capillary structure with high performance, low cost and simple manufacture becomes the key for solving the heat dissipation problem of the heat pipe.
Disclosure of Invention
In order to solve the defects of poor performance and complex manufacturing process of the traditional ultrathin heat pipe capillary structure, the invention aims to provide the ultrathin heat pipe capillary structure and the manufacturing method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
a capillary structure of a heat pipe comprises a substrate and a copper micro-column array arranged on the substrate, wherein micro or/and nano-scale holes are formed in the surface of the copper micro-column array.
Further, the micro copper pillar array was composed of cylindrical copper pillars arranged in a rectangular array with a diameter of 40 μm, a pitch of 20 μm, and a height of 50 μm.
Furthermore, the substrate is a copper foil substrate.
The manufacturing method of the capillary structure comprises the following steps:
(1) depositing Cu-Al on the surface of the substrate by adopting a photoetching technology and an electrochemical deposition method2O3A micropillar array of nanocomposite material;
(2) soaking the micro-column array in the step (1) in NaOH solution, and soaking Al2O3Dissolving the nano particles to obtain the copper micro-column array with micro or/and nano-scale holes on the surface.
Preferably, the substrate is made of copper and has a thickness of 100 μm.
Preferably, the pattern of the mask plate adopted in the photoetching process is a circular array which is in rectangular arrangement and has the diameter of 40 mu m and the adjacent center distance of 60 mu m.
Preferably, the photoresist template used in the photolithography process is prepared as follows: firstly, putting a copper foil substrate into an ultrasonic cleaning machine for cleaning, then spin-coating KMPR photoresist on one surface of the copper foil substrate, wherein the spin-coating thickness is 50 mu m, and then putting the copper foil substrate coated with the photoresist in an oven for pre-drying; placing a mask plate on an experimental material coated with photoresist, and irradiating the mask plate by adopting deep ultraviolet after the position is calibrated, wherein the exposure time is 15 s; and (3) placing the exposed experimental material in a developing solution for 90s to obtain the photoresist template with the surface having the cylindrical hole array structure.
Preferably, the step of electrochemical deposition is: adjusting CuSO of 200g/L by using dilute sulfuric acid4The solution pH was 1. + -. 0.1 and then Al with an average diameter of 40nm was added2O3Dispersing the nanoparticles in the solution at a concentration of 30mg/L, and then ultrasonically oscillating the solution for 30 min; using a photoresist template with a cylindrical hole array structure on the surface as a cathode, another copper plate as an anode, and adopting a constant voltage power supply to supply current with a current density of 6 multiplied by 10-5mA/cm2Electrifying for 15min, taking out the copper foil, removing the photoresist, and cleaning with deionized water to obtain the copper foil with Cu-Al on the surface2O3Copper foil substrate of micropillar array.
Preferably, the preparation steps of the copper micro-column array with micro or/and nano-scale holes are as follows: the surface is provided with Cu-Al2O3Placing the copper foil substrate of the micro-column array in NaOH solution with the mass fraction of 5% for 30min, and placing Cu-Al2O3Al in composite micro-column array2O3The nanoparticles are dissolved and then dried after being washed with deionized water.
Compared with the prior art, the invention has the advantages that: due to Al constituting the micropillar array2O3The nano particles are dissolved, so that micro or/and nano-scale recesses and channels are formed on the surface of the micro-column array, stable vaporization cores are increased, the vaporization degree is greatly increased, the working medium in the heat pipe can boil under a very low superheat degree, the boiling heat exchange is enhanced, the critical heat flow of the heat pipe is improved, and the generation of the dry burning phenomenon of the heat pipe is avoided.
Drawings
Fig. 1 is a schematic diagram of a capillary structure according to the present invention.
Fig. 2 is an enlarged schematic view of the capillary structure of the present invention.
FIG. 3 is a diagram of the photolithography and electrochemical deposition process of the present invention.
Fig. 4 is a schematic view of an electrochemical reaction cell of the present invention.
Wherein, in fig. 1 to 3:
1-copper foil substrate, 2-copper micro-column array, 3-porous structure, 4-KMPR photoresist, 5-mask plate and 6-Cu-Al2O3A micro-pillar array.
Detailed Description
The present invention will be described in further detail below with reference to specific embodiments and the accompanying drawings.
With reference to fig. 1-2, the heat pipe capillary structure of the present invention includes a copper foil substrate 1 and a copper micro-pillar array 2 disposed on the copper foil substrate 1, wherein the surface of the copper micro-pillar array 2 has a micro-or/and nano-scale porous structure 3. Wherein, the micro copper column array 2 is composed of cylindrical copper columns which are arranged in a rectangular array and have the diameter of 40 mu m, the interval of 20 mu m and the height of 50 mu m.
With reference to fig. 3 to 4, the preparation process of the heat pipe capillary structure of the present invention is as follows:
(1) selection of substrates
In this embodiment, a copper foil with a thickness of 100 μm is selected as the substrate.
(2) Lithographic process
Firstly, putting a copper foil substrate 1 into an ultrasonic cleaner for cleaning, then spin-coating KMPR photoresist 4 on the upper surface of the copper foil substrate 1, wherein the spin-coating thickness is 50 mu m, and then putting the copper foil substrate 1 coated with the photoresist in an oven for pre-baking; a circular array mask 5 having a surface pattern of 40 μm in diameter and a pitch between adjacent circles of 60 μm in a rectangular arrangement was prepared. Placing a mask plate 5 on an experimental material coated with the photoresist 4, and irradiating the mask plate with deep ultraviolet light after the position is calibrated, wherein the exposure time is 15 s; and (3) placing the exposed experimental material in a developing solution for 90s to obtain the photoresist template with the surface having the cylindrical hole array structure.
(3)Cu-Al2O3Preparation of composite material micro-column array
Firstly to 200g/L of CuSO4Dropwise adding H into the solution2SO4Solution, adjusting pH of the solution to 1, and adding Al with average diameter of 40nm2O3The nanoparticles were dispersed in the solution at a concentration of 30mg/LIn the solution, then ultrasonically oscillating the solution for 30 min; using a photoresist template with a cylindrical hole array structure on the surface as a cathode, another copper plate as an anode, and adopting a constant voltage power supply to supply current with a current density of 6 multiplied by 10-5mA/cm2Electrifying for 15min, taking out, removing photoresist, cleaning with deionized water, and making Cu-Al on the surface of the copper foil substrate 12O3And a micro-column array 6.
(4) Preparation of porous structures
The surface is provided with Cu-Al2O3Placing the copper foil substrate 1 of the micro-column array 6 in NaOH solution with the mass fraction of 5% for 30min, and placing Cu-Al2O3Al in micro-pillar array 62O3Dissolving the nano particles, then washing with deionized water and drying to obtain the porous structure 3, and finally preparing the copper micro-column array 2 with the micro or/and nano-scale porous structure 3 on the surface.
The capillary structure is applied to an ultrathin heat pipe and is used for enhancing boiling heat transfer of the heat pipe and providing capillary force for working medium backflow. The capillary structure designed by the invention is a copper micro-column array with micro or/and nano-scale holes on the surface, a gap between the copper micro-columns can generate a larger capillary force to enable a working medium to flow back to an evaporation end, and the surface of each micro-copper column is provided with the micro or/and nano-scale holes and a micro channel, so that the micro-copper columns have super-hydrophilic characteristics, the capillary structure can be favorably infiltrated by the working medium, and the evaporation end is prevented from being burnt to dry; the micro or/and nano-scale holes and the micro channels on the surface of the micro copper column not only increase the heat transfer area of the capillary structure, but also can be attached with a liquid film, the liquid film has very small thermal resistance due to extremely thin thickness, the liquid film is rapidly evaporated into steam at higher wall temperature, the steam overflows and brings heat to a condensation end along with the continuous rise of steam pressure, and the structure on the surface of the micro column array enables the wall surface superheat degree required by the boiling of the working medium to be reduced, so that the working medium is easier to boil.
The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that variations may be made without departing from the principles of the invention.

Claims (5)

1. A capillary structure manufacturing method comprises a substrate and a copper micro-column array arranged on the substrate, wherein micro or/and nano-scale holes are formed in the surface of the copper micro-column array, the copper micro-column array is composed of cylindrical copper columns which are arranged in a rectangular array and have the diameter of 40 micrometers, the interval of 20 micrometers and the height of 50 micrometers, and the capillary structure manufacturing method is characterized by comprising the following steps of:
(1) depositing Cu-Al on the surface of the copper foil substrate by adopting a photoetching technology and an electrochemical deposition method2O3The micro-column array of the nano composite material is characterized in that a photoresist template adopted in the photoetching process comprises the following preparation steps: firstly, putting a copper foil substrate into an ultrasonic cleaning machine for cleaning, then spin-coating KMPR photoresist on one surface of the copper foil substrate, wherein the spin-coating thickness is 50 mu m, and then putting the copper foil substrate coated with the photoresist in an oven for pre-drying; placing a mask plate on an experimental material coated with photoresist, and irradiating the mask plate by adopting deep ultraviolet after the position is calibrated, wherein the exposure time is 15 s; placing the exposed experimental material in a developing solution for 90s to obtain a photoresist template with a cylindrical hole array structure on the surface; the electrochemical deposition comprises the following steps: adjusting CuSO of 200g/L by using dilute sulfuric acid4Solution pH =1 ± 0.1, then Al with an average diameter of 40nm2O3Dispersing the nanoparticles in the solution at a concentration of 30mg/L, and then ultrasonically oscillating the solution for 30 min; using a photoresist template with a cylindrical hole array structure on the surface as a cathode, another copper plate as an anode, and adopting a constant voltage power supply to supply current with a current density of 6 multiplied by 10-5mA/cm2Electrifying for 15min, taking out the copper foil, removing the photoresist, and cleaning with deionized water to obtain the copper foil with Cu-Al on the surface2O3A copper foil substrate of the micropillar array;
(2) soaking the micro-column array in the step (1) in NaOH solution, and soaking Al2O3Dissolving the nano particles to obtain the copper micro-column array with micro or/and nano-scale holes on the surface.
2. The method of claim 1, wherein the copper foil substrate has a thickness of 100 μm.
3. The manufacturing method of claim 1, wherein the pattern of the mask is a circular array of 40 μm diameter and 60 μm adjacent centers.
4. The method of claim 1, wherein the NaOH solution is present in an amount of 5% by weight.
5. The method of claim 1, wherein in step (2), the soaking time is 30 min.
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CN110793367A (en) * 2019-11-08 2020-02-14 北京航空航天大学 One-way heat conduction heat pipe
CN111640715B (en) * 2020-06-11 2023-09-29 常州大学 Ultra-thin micro heat pipe with micro-channel capillary structure and preparation method thereof
CN112484545A (en) * 2020-12-01 2021-03-12 奇鋐科技股份有限公司 Thin two-phase flow device
US11732974B2 (en) 2021-01-06 2023-08-22 Asia Vital Components Co., Ltd. Thin-type two-phase fluid device
CN114184072A (en) * 2021-12-10 2022-03-15 深圳市顺熵科技有限公司 Liquid absorption core preparation method and heat pipe comprising liquid absorption core
CN114485234B (en) * 2022-03-07 2022-11-11 大连理工大学 Radial radiation pulsating heat pipe of petal-shaped crotch structure
CN115900404B (en) * 2022-11-21 2023-07-21 上海交通大学 Heating flat boiling reinforced microstructure modified surface and realization method thereof

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CN101410685A (en) * 2006-03-03 2009-04-15 伊路米耐克斯公司 Heat pipe with nanotstructured wicking material
CN102877094A (en) * 2011-07-15 2013-01-16 中国科学院合肥物质科学研究院 Ordered hole array with gold-nanoparticle-based micro-nanometer composite structure and preparation method for ordered hole array
CN107112234A (en) * 2015-09-17 2017-08-29 南方科技大学 The engraving process of nano-wire array and nano-wire array
CN108132585A (en) * 2016-12-01 2018-06-08 清华大学 The preparation method of micro nano structure

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CN101410685A (en) * 2006-03-03 2009-04-15 伊路米耐克斯公司 Heat pipe with nanotstructured wicking material
CN102877094A (en) * 2011-07-15 2013-01-16 中国科学院合肥物质科学研究院 Ordered hole array with gold-nanoparticle-based micro-nanometer composite structure and preparation method for ordered hole array
CN107112234A (en) * 2015-09-17 2017-08-29 南方科技大学 The engraving process of nano-wire array and nano-wire array
CN108132585A (en) * 2016-12-01 2018-06-08 清华大学 The preparation method of micro nano structure

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