CN108747074B - Mounting structure and mounting method for micro welding spot on high-speed rotating part - Google Patents
Mounting structure and mounting method for micro welding spot on high-speed rotating part Download PDFInfo
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- CN108747074B CN108747074B CN201810561427.7A CN201810561427A CN108747074B CN 108747074 B CN108747074 B CN 108747074B CN 201810561427 A CN201810561427 A CN 201810561427A CN 108747074 B CN108747074 B CN 108747074B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/28—Multiple coating on one surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
Abstract
The invention relates to the field of wall surface parameter testing of a rotating part, in particular to a mounting structure and a mounting method of a micro welding spot on a high-speed rotating part. The high-speed rotating component is positioned in a high-temperature environment with the temperature of more than 900 ℃, and the installation method comprises the following steps: performing sand blowing treatment on the upper surface of the rotating component substrate; then carrying out acetone reagent washing treatment; spraying metal powder to form a metal bottom layer with a first preset thickness; forming a first ceramic layer by spraying ceramic powder; forming micro welding spots on the first ceramic layer; paving a high-temperature adhesive tape around the micro welding spot for protection; then, spraying ceramic powder to form a second ceramic layer; removing the high-temperature adhesive tape, and modifying and polishing the ceramic layer region; covering quartz cloth and fixing with metal foil. The mounting structure and the mounting method of the micro welding spot on the high-speed rotating part enable the micro welding spot not to be easily damaged in a high-temperature environment above 900 ℃, thereby prolonging the service life of the micro welding spot.
Description
Technical Field
The invention relates to the field of wall surface parameter testing of a rotating part, in particular to a mounting structure and a mounting method of a micro welding spot on a high-speed rotating part.
Background
Rotary parts are used as core parts in a large number of various mechanical devices in military and civilian fields. In particular in the field of aircraft engines, the reliability of the rotary part plays a decisive role in the safety of the engine. With the continuous development of engine development technology, wall parameter testing of rotating parts has become the key of aero-engine research.
The method generally adopted in the world industry at present is that a sensor is arranged on a rotating part to obtain wall parameters, and then data are transmitted to the outside through a test lead. The leads of the sensor and the test leads need to be connected, and generally current welding or silver brazing is adopted. The lead wire connected by the method can generate welding spots, and the welding spots have the characteristics of tiny volume, weak strength and the like due to the diameter of the wire rod, insulation and the like. Particularly for a rotating part, besides bearing the self gravity, a welding spot also bears the pulling force and the like generated by the lead which moves relative to the surface of the test piece due to the centrifugal force; further, wall parameter testing of rotating parts is often performed in high temperature environments (high temperatures are known in the art to mean temperatures up to 900 ℃ or higher). Therefore, the welding spot is easy to break under the high rotating speed and high temperature condition, thereby causing the failure of the measuring point.
According to incomplete statistics, more than 80% of the station failures are caused by solder joint failure. Therefore, the quality of the welding spot is a critical factor for limiting the success rate of the wall parameter test of the rotating part.
Disclosure of Invention
The invention aims to provide a mounting structure and a mounting method of micro welding spots on a high-speed rotating component, so as to alleviate or solve at least one problem of the mounting structure and the mounting method of the micro welding spots on the existing rotating component.
The technical scheme of the invention is as follows:
a mounting structure of micro solder joints on a high-speed rotating component, the high-speed rotating component being located in a high-temperature environment above 900 ℃, the mounting structure comprising:
the metal bottom layer is provided with a first preset thickness and is paved at a welding spot position on the rotating component substrate;
the first ceramic coating has a second preset thickness and is paved on the upper surface of the metal bottom layer, wherein the micro welding points are arranged on the surface of the first ceramic coating;
the second ceramic coating has a third preset thickness, is laid on the upper surface of the metal bottom layer and covers the micro welding spots;
the quartz material layer is laid on the upper surface of the second ceramic coating and covers the micro welding spots;
and the metal layer is paved on the upper surface of the quartz material layer and is fixedly connected with the rotating component substrate.
Optionally, the metal bottom layer is a CoNiCrAlYi layer, and the first predetermined thickness is 0.03 mm.
Optionally, the second predetermined thickness range of the first ceramic coating is 0.05-0.07 mm;
the third predetermined thickness range of the second ceramic coating is 0.2-0.25 mm.
Optionally, the quartz material layer is quartz cloth.
Optionally, the metal layer is a metal foil.
The invention also provides an installation method of the micro welding spot on the high-speed rotating component, wherein the high-speed rotating component is positioned in a high-temperature environment with the temperature of more than 900 ℃, and the installation method comprises the following steps:
firstly, performing sand blowing treatment on a position where a micro welding spot is preformed on the upper surface of a rotating component substrate, and reaching a preset roughness;
secondly, washing the surface subjected to the sand blasting treatment by using an acetone reagent;
thirdly, spraying metal powder on the surface washed by the acetone reagent to form a metal bottom layer with a first preset thickness;
step four, spraying ceramic powder on the metal layer to form a first ceramic layer with a second preset thickness;
covering a test lead above the sensor lead on the first ceramic layer, and performing spot welding for a preset number of times along the overlapped part of the two groups of wires to form a micro welding spot;
sixthly, paving a high-temperature adhesive tape around the micro welding spots for protection;
seventhly, spraying ceramic powder on the micro welding spot area protected by the high-temperature adhesive tape to form a second ceramic layer with a third preset thickness;
eighthly, removing the high-temperature adhesive tape around the micro welding spot, and performing shape modification and polishing on the ceramic layer area formed in the seventeenth step;
step nine, covering quartz cloth on the ceramic layer area after shape trimming and polishing in the step eight, and fixing the test lead and the quartz cloth by using metal foils respectively.
Optionally, the metal bottom layer is a CoNiCrAlYi layer, and the first predetermined thickness is 0.03 mm.
Optionally, the second predetermined thickness range of the first ceramic layer is 0.05-0.07 mm;
the third preset thickness range of the second ceramic layer is 0.2-0.25 mm.
The invention has the following effects:
the mounting structure and the mounting method of the micro welding spot on the high-speed rotating part enable the micro welding spot not to be easily damaged in a high-temperature environment above 900 ℃, thereby prolonging the service life of the micro welding spot.
Drawings
FIG. 1 is a schematic view of the mounting structure of the micro solder joints on the high-speed rotating component according to the present invention;
FIG. 2 is a schematic structural view of a micro solder joint portion in the mounting structure of the micro solder joint on the high-speed rotating member according to the present invention.
Detailed Description
In order to make the implementation objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be described in more detail below with reference to the accompanying drawings in the embodiments of the present invention. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The described embodiments are only some, but not all embodiments of the invention. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience in describing the present invention and for simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be taken as limiting the scope of the present invention.
The following describes in detail the mounting structure and mounting method of micro solder joints on a high-speed rotating component according to the present invention with reference to fig. 1 to 2.
The invention provides a mounting structure of a micro welding spot on a high-speed rotating component, which needs to be explained that the high-speed rotating component is positioned in a high-temperature test environment with the temperature of over 900 ℃. In particular, the mounting structure may comprise a metal bottom layer 2, a ceramic coating, a quartz material layer and a metal layer.
The metal bottom layer 2 has a first predetermined thickness and is laid on the rotating component substrate 1 at the welding point. Further, in the present embodiment, the material of the metal bottom layer 2 is preferably CoNiCrAlYi, wherein the first predetermined thickness is preferably 0.03 mm.
The first ceramic coating 31 has a second predetermined thickness and is disposed on the upper surface of the metal substrate 2, wherein the micro solder joints 6 are disposed on the surface of the first ceramic coating 31. In this embodiment, the second predetermined thickness range is preferably 0.05 to 0.07 mm. It should be noted that the micro solder joints 6 are usually formed by covering the test leads 61 above the sensor leads 62, and performing spot welding for a predetermined number of times (for example, 3 times) along the overlapped portions of the two sets of wires to form the micro solder joints 6.
The second ceramic coating 32, having a third predetermined thickness, is applied to the upper surface of the metal base layer 2 covering the micro-solder-bumps 6. In this embodiment, the third predetermined thickness range is preferably 0.2 to 0.25 mm.
The quartz material layer 4 is laid on the upper surface of the second ceramic coating 32 and covers the micro solder joints 6. In the present embodiment, the quartz material layer 4 is preferably quartz cloth.
The metal layer 5 is laid on the upper surface of the quartz material layer and is fixedly connected with the rotating component substrate 1. In this embodiment, the metal layer 5 is preferably a metal foil, and the metal foil covers the entire welding spot area, so as to complete the operations of installing, fixing and protecting the welding spot.
The invention also provides a method for installing the micro welding spot on the high-speed rotating part, and similarly, the high-speed rotating part is positioned in a high-temperature environment above 900 ℃; the mounting method specifically comprises the following steps:
firstly, performing sand blowing process treatment on a position where a micro welding spot is preformed on the upper surface of a rotating part substrate, and reaching a preset roughness; in this embodiment, the roughness is preferably (approximately) 6.3.
And step two, washing the surface subjected to sand blasting process with an acetone reagent.
Thirdly, spraying metal powder on the surface washed by the acetone reagent to form a metal bottom layer (also called a transition coating) with a first preset thickness; in this embodiment, it is preferable to spray conicraiyi powder so as to form a conicraiyi layer, and the first predetermined thickness is 0.03 mm.
Step four, spraying ceramic powder on the metal layer to form a first ceramic layer with a second preset thickness; in this embodiment, the second predetermined thickness is preferably 0.05 to 0.07 mm.
Fifthly, on the first ceramic layer, firstly adjusting the energy of the spot welding machine to 20J, covering the test lead 61 above the sensor lead 62, aligning, and using a probe to sequentially spot-weld three welding spots on the overlapped part of the two groups of wires under the pressure of 1 kg-3 kg to form a micro welding spot 6; as shown in fig. 2, a total of 6 micro solder bumps 6 are formed; after the welding spot is finished, visual inspection is carried out, the lead is not forked after welding, and then the lead is slightly pulled by using tweezers, so that the welding spot is not separated.
And step six, paving high-temperature adhesive tapes around the micro welding spots 6 for protection operation.
And seventhly, spraying ceramic powder on the micro welding spot area protected by the high-temperature adhesive tape to form a second ceramic layer with a third preset thickness. Wherein, the third predetermined thickness range is preferably 0.2 to 0.25 mm.
Further, in this embodiment, before the seventh step, a section of high temperature adhesive tape with a width of 1mm is adhered near the welding point (on the test lead), so that the welding point and the ceramic coating are visually attached, and then the ceramic powder is sprayed on the exposed part to form the second ceramic layer.
And step eight, removing the high-temperature adhesive tape around the micro welding points 6 by using tweezers, and performing shape modification and polishing on the ceramic layer area formed in the step seven.
Step nine, covering quartz cloth on the ceramic layer area after shape trimming and polishing in the step eight, and fixing the test lead and the quartz cloth by using metal foils respectively, wherein the metal foils are installed in a current welding mode, the energy is 20-30J, the single side is provided with two rows of welding points, the probe pressure is 3kg, and the welding point interval is 2-2.5 mm. And finally, covering the whole welding spot area by the metal foil, and realizing the installation, fixation and protection operation of the welding spot.
The mounting structure and the mounting method of the miniature welding spot on the high-speed rotating part can ensure that the miniature welding spot is not easy to damage in a high-temperature environment of more than 900 ℃, thereby prolonging the service life of the miniature welding spot by more than 30 percent, providing reliable guarantee for the development of an aeroengine, shortening the development period and saving a large amount of scientific research expenses.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (8)
1. A mounting structure of miniature solder joint on high-speed rotating part, high-speed rotating part is arranged in the high temperature environment more than 900 ℃, its characterized in that, mounting structure includes:
the metal bottom layer (2) is provided with a first preset thickness and is paved at a welding spot position on the rotating component substrate (1);
the first ceramic coating (31) is provided with a second preset thickness and is paved on the upper surface of the metal bottom layer (2), wherein micro welding points are arranged on the surface of the first ceramic coating (31);
a second ceramic coating (32) with a third predetermined thickness, which is laid on the upper surface of the metal bottom layer (2) and covers the micro welding points (6);
a quartz material layer (4) which is laid on the upper surface of the second ceramic coating (32) and covers the micro welding spots (6);
and the metal layer (5) is paved on the upper surface of the quartz material layer and is fixedly connected with the rotating component substrate (1).
2. The structure for mounting micro solder joints on a high-speed rotating component according to claim 1, wherein the metallic underlayer (2) is a conicraiyi layer, and the first predetermined thickness is 0.03 mm.
3. The structure for mounting micro solder joints on a high-speed rotating member according to claim 1, wherein the second predetermined thickness of the first ceramic coating (31) is in the range of 0.05 to 0.07 mm;
the third predetermined thickness range of the second ceramic coating (32) is 0.2-0.25 mm.
4. The structure for mounting micro solder joints on a high-speed rotating member according to claim 1, wherein the quartz material layer (4) is quartz cloth.
5. The structure for mounting micro solder joints on a high-speed rotating member according to claim 1, wherein the metal layer (5) is a metal foil.
6. A method for installing micro welding spots on a high-speed rotating component, wherein the high-speed rotating component is positioned in a high-temperature environment with the temperature of more than 900 ℃, and the method for installing the micro welding spots on the high-speed rotating component is characterized by comprising the following steps of:
firstly, performing sand blowing treatment on a position where a micro welding spot is preformed on the upper surface of a rotating component substrate, and reaching a preset roughness;
secondly, washing the surface subjected to the sand blasting treatment by using an acetone reagent;
thirdly, spraying metal powder on the surface washed by the acetone reagent to form a metal bottom layer with a first preset thickness;
step four, spraying ceramic powder on the metal layer to form a first ceramic layer with a second preset thickness;
covering a test lead above the sensor lead on the first ceramic layer, and performing spot welding along the overlapped part of the two groups of wires to form a micro welding spot;
sixthly, paving a high-temperature adhesive tape around the micro welding spots for protection;
seventhly, spraying ceramic powder on the micro welding spot area protected by the high-temperature adhesive tape to form a second ceramic layer with a third preset thickness;
eighthly, removing the high-temperature adhesive tape around the micro welding spot, and performing shape modification and polishing on the ceramic layer area formed in the seventeenth step;
step nine, covering quartz cloth on the ceramic layer area after shape trimming and polishing in the step eight, and fixing the test lead and the quartz cloth by using metal foils respectively.
7. The method of claim 6, wherein the metal underlayer is a CoNiCrAlYi layer and the first predetermined thickness is 0.03 mm.
8. The method for mounting micro solder joints on a high-speed rotating member according to claim 6, wherein the second predetermined thickness of the first ceramic layer is in the range of 0.05 to 0.07 mm;
the third preset thickness range of the second ceramic layer is 0.2-0.25 mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810561427.7A CN108747074B (en) | 2018-06-04 | 2018-06-04 | Mounting structure and mounting method for micro welding spot on high-speed rotating part |
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| CN201810561427.7A CN108747074B (en) | 2018-06-04 | 2018-06-04 | Mounting structure and mounting method for micro welding spot on high-speed rotating part |
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| CN108747074A CN108747074A (en) | 2018-11-06 |
| CN108747074B true CN108747074B (en) | 2020-12-01 |
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| CN105252094A (en) * | 2015-10-23 | 2016-01-20 | 北京卫星制造厂 | High-reliability installation method for high-voltage welding spots |
| CN106513901A (en) * | 2016-12-15 | 2017-03-22 | 山东科技大学 | Simple device for facilitating welding strain gauge and using method of simple device |
| CN107462209A (en) * | 2017-07-11 | 2017-12-12 | 中国航发沈阳发动机研究所 | A kind of installation method of high-temp strain test sensor |
| CN107843371A (en) * | 2017-11-09 | 2018-03-27 | 中国航发湖南动力机械研究所 | The installation method of strain gauge |
| CN107876355A (en) * | 2017-11-09 | 2018-04-06 | 中国航发湖南动力机械研究所 | The optimize technique of strain gauge installation method |
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2018
- 2018-06-04 CN CN201810561427.7A patent/CN108747074B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS594060A (en) * | 1982-06-30 | 1984-01-10 | Fujitsu Ltd | Semiconductor device |
| CN101997136A (en) * | 2009-08-14 | 2011-03-30 | 三星Sdi株式会社 | Secondary battery and method of manufacturing the same |
| CN105252094A (en) * | 2015-10-23 | 2016-01-20 | 北京卫星制造厂 | High-reliability installation method for high-voltage welding spots |
| CN106513901A (en) * | 2016-12-15 | 2017-03-22 | 山东科技大学 | Simple device for facilitating welding strain gauge and using method of simple device |
| CN107462209A (en) * | 2017-07-11 | 2017-12-12 | 中国航发沈阳发动机研究所 | A kind of installation method of high-temp strain test sensor |
| CN107843371A (en) * | 2017-11-09 | 2018-03-27 | 中国航发湖南动力机械研究所 | The installation method of strain gauge |
| CN107876355A (en) * | 2017-11-09 | 2018-04-06 | 中国航发湖南动力机械研究所 | The optimize technique of strain gauge installation method |
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