CN108747039B - Liquid crystal panel marking method - Google Patents
Liquid crystal panel marking method Download PDFInfo
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- CN108747039B CN108747039B CN201811016877.4A CN201811016877A CN108747039B CN 108747039 B CN108747039 B CN 108747039B CN 201811016877 A CN201811016877 A CN 201811016877A CN 108747039 B CN108747039 B CN 108747039B
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- liquid crystal
- crystal panel
- marking
- laser
- glass substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
Abstract
The invention relates to a liquid crystal display panel marking method, which comprises the following steps: providing a liquid crystal panel, wherein an information recording part of the liquid crystal panel comprises a first glass substrate, a metal coating and a second glass substrate which are arranged in a laminated mode; and irradiating the metal coating film by adopting a picosecond laser, and forming a marking pattern. According to the marking method of the liquid crystal panel, the picosecond laser is adopted to irradiate the metal coating, and the picosecond laser is short in pulse width, high in peak power and small in heat effect, has small influence on a glass substrate and a thin film circuit, and is fine and clear in marking content and easy to identify.
Description
Technical Field
The invention relates to the field of laser marking, in particular to a marking method of a liquid crystal panel.
Background
In order to manage the manufacturing process of the liquid crystal panel, a mark is usually formed on the aluminum-plated interlayer of the liquid crystal panel. At present, the marking processing of the liquid crystal panel mainly adopts silk-screen printing ink marking and laser marking, wherein the silk-screen printing ink marking has the following defects: the printing ink is a chemical raw material and has adverse effects on human bodies, wherein the added diluent has the characteristics of flammability and explosiveness, potential safety hazards are left in the production process, and in addition, the marking fineness of the silk-screen printing ink is not high, the marking is easy to eliminate, and the silk-screen printing ink cannot be kept and prevented from counterfeiting for a long time. The existing laser marking technology has poor marking effect on marking contents requiring more fine, is easy to damage a glass substrate and influences the production yield.
Disclosure of Invention
Therefore, the marking method for the liquid crystal panel is provided aiming at the problems that the existing marking method is not environment-friendly and has low fineness degree.
A liquid crystal panel marking method comprises the following steps:
providing a liquid crystal panel, wherein an information recording part of the liquid crystal panel comprises a first glass substrate, a metal coating and a second glass substrate which are arranged in a laminated mode;
and irradiating the metal coating film by adopting a picosecond laser, and forming a marking pattern.
According to the marking method of the liquid crystal panel, the picosecond laser is adopted to irradiate the metal coating, and the picosecond laser is short in pulse width, high in peak power and small in heat effect, has small influence on a glass substrate and a thin film circuit, and is fine and clear in marking content and easy to identify.
In one embodiment, the metal coating includes a first surface and a second surface, the first glass substrate is attached to the first surface, the second surface of the metal coating is attached to the second glass substrate, and the light reflectivity of the first surface is smaller than that of the second surface, in the step of irradiating the metal coating with the picosecond laser, the laser emitted by the picosecond laser penetrates through the first glass substrate and is focused on the first surface of the metal coating.
In one embodiment, the picosecond laser emits a laser wavelength of 355 nm.
In one embodiment, the power of the picosecond laser is less than or equal to 2W.
In one embodiment, the picosecond laser has a marking speed of 100mm/s to 250 mm/s.
In one embodiment, the picosecond laser has a skip speed of 1000mm/s to 3000 mm/s.
In one embodiment, the picosecond laser has a Q frequency of 300KHz to 800 KHz.
In one embodiment, the picosecond laser has a Q-release time of 2 μ s.
In one embodiment, in the step of irradiating the metal coating film by using a picosecond laser, a single-line laser etching is adopted.
In one embodiment, the method further comprises the following steps: the marking pattern is read using a CCD microscope.
Drawings
FIG. 1 is a front view of an embodiment of a liquid crystal panel;
FIG. 2 is a cross-sectional view of the liquid crystal panel shown in FIG. 1;
FIG. 3 is a diagram illustrating the effect of marking a liquid crystal panel using a picosecond laser;
fig. 4 is a diagram illustrating the effect of marking the liquid crystal panel by using other lasers.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Referring to fig. 1 and 2, a surface of the liquid crystal panel may be divided into a liquid crystal display region a for displaying an image and a peripheral region B where the liquid crystal display region is removed, and the liquid crystal panel includes a first glass substrate 10 and a second glass substrate 20, wherein the first glass substrate 10 and the second glass substrate 20 are attached to each other by a sealing member in a manner of maintaining a certain distance therebetween, the sealing member is disposed in a manner of surrounding the liquid crystal display region a, and a space surrounded by the sealing member, the first glass substrate 10, and the second glass substrate 20 is filled with liquid crystal. The peripheral area B is provided with an information recording portion C, and a mark pattern in which various kinds of information are recorded is formed on the information recording portion C by laser marking, and the mark pattern may be a character or a two-dimensional code.
A liquid crystal panel marking method comprises the following steps:
s100, providing a liquid crystal panel, wherein the liquid crystal panel comprises a first glass substrate 10, a metal coating 30 and a second glass substrate 20 which are arranged in a laminated mode;
s200, irradiating the metal coating film 30 by adopting a picosecond laser, and forming a marking pattern.
According to the marking method of the liquid crystal panel, the picosecond laser is adopted to irradiate the metal coating 30 of the liquid crystal panel, and the picosecond laser is short in pulse width, high in peak power and small in heat effect, so that the influence on the first glass substrate 10, the second glass substrate 20 and the thin film circuit is small, the marking content is finer and clearer, and the marking is easy to identify.
It is understood that the marking pattern is formed on the information recording part C of the peripheral area B of the liquid crystal panel, which needs to avoid the thin film circuit for connecting the external driving circuit to avoid damage to the thin film circuit during the laser marking process.
Referring to fig. 3, the principle of marking the liquid crystal panel by the laser beam 200 in the present embodiment is as follows: the superficial layer of the metal coating 30 generates surface modification after absorbing laser, the metal coating 30 positioned on the superficial layer in the area acted by the laser is melted at instantaneous high temperature, a compact structure is formed on the surface of the metal coating 30 again, a groove 33 is generated, and the depth of the groove 33 is smaller than the thickness of the metal coating 30. The groove 33 is obtained by encoding various information such as sequence information and usage information with characters or two-dimensional data. The laser engraved area forms a fine mark trace composed of the groove 33, and exhibits a reflection luminance different from that of the surface of the surrounding metal plating film 30 under the action of light, suitable for reading by a transmission type or reflection type camera.
The laser carving character size can reach below 150 microns by adopting a picosecond laser, the size of the two-dimensional code can reach below 180 microns, and the laser carving character size has high fineness.
Referring to fig. 4, when other types of lasers are used for marking, when the laser beam 300 irradiates the liquid crystal panel, the energy is high, the metal coating 30 is broken down, the metal coating 30 is melted and even gasified, and the sputtered dust adheres to the glass substrate, and when the laser energy reaches the glass substrate damage threshold, the laser may damage the glass substrate, resulting in uneven line edges, uneven lines, unclear marking, and possibly causing a reading error when the camera is used for reading.
The metal plating film 30 may be a single-layer metal film made of aluminum, copper, tantalum, titanium, or the like. The thickness of the metal plating film 30 is 300nm to 450 nm.
Referring to fig. 2, the metal coating 30 includes a first surface 31 and a second surface 32, the first glass substrate 10 is attached to the first surface 31, the second surface 32 of the metal coating 30 is attached to the second glass substrate 20, and the reflectivity of the first surface 31 is smaller than that of the second surface 32, in the step of irradiating the metal coating 30 with the picosecond laser, the laser emitted by the picosecond laser penetrates through the first glass substrate 10 and is focused on the first surface 31 of the metal coating 30.
The first surface 31 of the metal coating 30 has sparse molecular accumulation, uneven microstructure and higher laser absorption rate; the molecules of the second surface 32 of the metal coating 30 are densely packed and attached to the second glass substrate 20, so that the second surface 32 presents a bright reflective effect, has a high reflectivity to laser, and accordingly has a low laser absorption rate. Focusing the laser on the first surface 31 of the metal plating film 30 can increase the laser absorption rate of the metal plating film 30, which facilitates the formation of marking marks.
When the liquid crystal panel is placed on the processing platform, the operator recognizes the first surface 31 of the metal plating film 30 by observation, places the first surface 31 of the metal plating film 30 upward, and positions the information recording portion within the processing range of the picosecond laser by positioning the jig. Then, the laser device is started, the lens is assembled, and the focal length of the picosecond laser is adjusted to enable the focal plane of the laser to be coplanar with the first surface 31.
Further, it is necessary to keep the surface of the first glass substrate 10 smooth to avoid affecting the laser marking effect.
The marking method of the liquid crystal panel further comprises the following steps:
and S300, reading the marking pattern by adopting a CCD microscope to check whether the marking pattern meets the requirement.
After the marking is finished, the liquid crystal panel can be packaged by adopting a plastic film. The surface of the information recording part is prevented from being polluted, and the mark information identification in the subsequent process is prevented from being influenced.
In order to ensure the laser marking effect, a LINOS series lens is selected, and the formed laser spot is small.
The picosecond laser emits a laser wavelength of 355 nm. Compared with laser with other wavelengths, the ultraviolet laser with the wavelength of 355nm has the advantages of the ultraviolet laser, the wavelength of the ultraviolet laser is short, the ultraviolet laser belongs to cold processing on materials under the same processing condition, the thermal influence is smaller than that of infrared light, green light and the like, and the fineness of laser marking is effectively improved.
The power of the picosecond laser is less than or equal to 2W.
The marking speed of the picosecond laser is 100mm/s-250 mm/s.
The skip speed of the picosecond laser is 1000-3000 mm/s.
The Q frequency of the picosecond laser is 300KHz-800 KHz.
The Q-release time of the picosecond laser was 2 μ s.
When laser marking is carried out, single-line laser carving is adopted, namely, characters or two-dimensional codes and the like are marked without filling, only single lines of outlines are marked, marking time can be shortened, and marking efficiency is improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A liquid crystal panel marking method is characterized by comprising the following steps:
providing a liquid crystal panel, wherein the liquid crystal panel comprises a first glass substrate, a metal coating and a second glass substrate which are arranged in a stacked mode, the metal coating comprises a first surface and a second surface, the first glass substrate is attached to the first surface, the second glass substrate is attached to the second surface, and the light reflectivity of the first surface is smaller than that of the second surface;
and irradiating the metal coating film by adopting a picosecond laser, wherein laser emitted by the picosecond laser penetrates through the first glass substrate and is focused on the first surface of the metal coating film to form a marking pattern, the marking pattern is a groove formed on the surface of the metal coating film, and the depth of the groove is smaller than the thickness of the metal coating film.
2. The liquid crystal panel marking method of claim 1, wherein the picosecond laser emits a laser wavelength of 355 nm.
3. The liquid crystal panel marking method of claim 1, wherein the picosecond laser has a power of less than or equal to 2W.
4. The liquid crystal panel marking method of claim 1, wherein the picosecond laser has a marking speed of 100mm/s to 250 mm/s.
5. The liquid crystal panel marking method of claim 1, wherein the picosecond laser has a skip speed of 1000mm/s to 3000 mm/s.
6. The liquid crystal panel marking method of claim 1, wherein the picosecond laser has a Q frequency of 300KHz to 800 KHz.
7. The liquid crystal panel marking method of claim 1, wherein the picosecond laser has a Q-release time of 2 μ β.
8. The method for marking a liquid crystal panel according to claim 1, wherein in the step of irradiating the metal plating film with a picosecond laser, a single line laser etching is used.
9. The liquid crystal panel marking method of claim 1, further comprising the steps of:
the marking pattern is read using a CCD microscope.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811016877.4A CN108747039B (en) | 2018-09-03 | 2018-09-03 | Liquid crystal panel marking method |
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| CN201811016877.4A CN108747039B (en) | 2018-09-03 | 2018-09-03 | Liquid crystal panel marking method |
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| CN108747039A CN108747039A (en) | 2018-11-06 |
| CN108747039B true CN108747039B (en) | 2021-02-26 |
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| CN110550873A (en) * | 2019-09-20 | 2019-12-10 | 中国建筑材料科学研究总院有限公司 | preparation method of coated laminated glass inner mark |
| CN114425655A (en) * | 2020-10-29 | 2022-05-03 | 大族激光科技产业集团股份有限公司 | Laser marking method and laser marking system for brittle material |
| CN112975139A (en) * | 2021-02-09 | 2021-06-18 | 杭州电子科技大学 | Laser engraving processing method of transparent glass surface microstructure |
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| CN101302079A (en) * | 2007-05-09 | 2008-11-12 | 深圳富泰宏精密工业有限公司 | Coated glass, coating system for preparing the same and coating method |
| BRPI1015380A2 (en) * | 2009-04-30 | 2019-09-24 | Sharp Kk | manufacturing method of liquid crystal panel, glass substrate for liquid crystal panel and liquid crystal panel including the same |
| CN202585440U (en) * | 2012-05-25 | 2012-12-05 | 浙江慈能光伏科技有限公司 | Amorphous silicon thin film solar cell chip |
| CN103495806B (en) * | 2013-09-27 | 2015-07-15 | 东莞市盛雄激光设备有限公司 | Picosecond laser etching microcircuit process |
| GB2527553B (en) * | 2014-06-25 | 2017-08-23 | Fianium Ltd | Laser processing |
| CN107414306B (en) * | 2016-05-20 | 2019-07-23 | 上海和辉光电有限公司 | A kind of metal mask preparation method |
| CN106098595B (en) * | 2016-06-27 | 2019-04-12 | 广东国玉科技有限公司 | Solving metal layer label in chip manufacturing influences the method for yield rate |
| CN206029021U (en) * | 2016-08-31 | 2017-03-22 | 武汉华工激光工程有限责任公司 | A device that is used for surperficial copper -plated liquid crystal display panel of radium carving |
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Effective date of registration: 20210826 Address after: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee after: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Patentee after: Shenzhen Han's micromachining Software Technology Co.,Ltd. Address before: 518051 Dazu laser building, 9 new West Road, North Nanshan District high tech park, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
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Effective date of registration: 20211028 Address after: 518000 Han's laser office building 301325, No. 29, Gaoxin North Sixth Road, songpingshan community, Xili street, Nanshan District, Shenzhen, Guangdong Patentee after: Shenzhen Han's micromachining Software Technology Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Patentee before: Shenzhen Han's micromachining Software Technology Co.,Ltd. |