CN108705829A - A kind of lightweight epoxy foam base battenboard and preparation method thereof - Google Patents
A kind of lightweight epoxy foam base battenboard and preparation method thereof Download PDFInfo
- Publication number
- CN108705829A CN108705829A CN201810300079.8A CN201810300079A CN108705829A CN 108705829 A CN108705829 A CN 108705829A CN 201810300079 A CN201810300079 A CN 201810300079A CN 108705829 A CN108705829 A CN 108705829A
- Authority
- CN
- China
- Prior art keywords
- epoxy
- parts
- epoxy foam
- battenboard
- lightweight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 187
- 239000006260 foam Substances 0.000 title claims abstract description 175
- 238000002360 preparation method Methods 0.000 title claims description 12
- 239000002131 composite material Substances 0.000 claims abstract description 46
- 239000003822 epoxy resin Substances 0.000 claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 26
- 239000003063 flame retardant Substances 0.000 claims abstract description 14
- 239000004088 foaming agent Substances 0.000 claims abstract description 10
- 238000005187 foaming Methods 0.000 claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 239000007822 coupling agent Substances 0.000 claims abstract description 5
- 238000007711 solidification Methods 0.000 claims description 24
- 230000008023 solidification Effects 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 22
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 18
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 18
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 11
- 239000010959 steel Substances 0.000 claims description 11
- 229910000838 Al alloy Inorganic materials 0.000 claims description 10
- -1 fatty acid glycerine ester Chemical class 0.000 claims description 9
- 239000004615 ingredient Substances 0.000 claims description 9
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 8
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 8
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims description 7
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 claims description 7
- 235000012538 ammonium bicarbonate Nutrition 0.000 claims description 7
- 239000001099 ammonium carbonate Substances 0.000 claims description 7
- 229920001276 ammonium polyphosphate Polymers 0.000 claims description 7
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 239000004917 carbon fiber Substances 0.000 claims description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 6
- 235000006408 oxalic acid Nutrition 0.000 claims description 6
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 6
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 5
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 5
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 5
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 claims description 5
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 4
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 claims description 4
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 4
- 235000019253 formic acid Nutrition 0.000 claims description 4
- 235000011187 glycerol Nutrition 0.000 claims description 4
- 150000002924 oxiranes Chemical class 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 4
- 239000004156 Azodicarbonamide Substances 0.000 claims description 3
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 claims description 3
- 235000019399 azodicarbonamide Nutrition 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 claims description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 2
- 239000004114 Ammonium polyphosphate Substances 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical class NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 2
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- 235000011054 acetic acid Nutrition 0.000 claims description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- 235000019826 ammonium polyphosphate Nutrition 0.000 claims description 2
- 229910000410 antimony oxide Inorganic materials 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 2
- BQQUFAMSJAKLNB-UHFFFAOYSA-N dicyclopentadiene diepoxide Chemical compound C12C(C3OC33)CC3C2CC2C1O2 BQQUFAMSJAKLNB-UHFFFAOYSA-N 0.000 claims description 2
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- 235000019441 ethanol Nutrition 0.000 claims description 2
- GCSJLQSCSDMKTP-UHFFFAOYSA-N ethenyl(trimethyl)silane Chemical compound C[Si](C)(C)C=C GCSJLQSCSDMKTP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000194 fatty acid Substances 0.000 claims description 2
- 229930195729 fatty acid Natural products 0.000 claims description 2
- 239000011152 fibreglass Substances 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 claims description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 2
- 229940100630 metacresol Drugs 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 239000004005 microsphere Substances 0.000 claims description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 2
- 229960003742 phenol Drugs 0.000 claims description 2
- 125000003170 phenylsulfonyl group Chemical group C1(=CC=CC=C1)S(=O)(=O)* 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 229960001755 resorcinol Drugs 0.000 claims description 2
- 229960004889 salicylic acid Drugs 0.000 claims description 2
- 229960001124 trientine Drugs 0.000 claims description 2
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 claims 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 claims 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims 1
- YLFBFPXKTIQSSY-UHFFFAOYSA-N dimethoxy(oxo)phosphanium Chemical compound CO[P+](=O)OC YLFBFPXKTIQSSY-UHFFFAOYSA-N 0.000 claims 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 claims 1
- 235000007686 potassium Nutrition 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 11
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 8
- 238000000465 moulding Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 3
- 239000002341 toxic gas Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 239000011162 core material Substances 0.000 description 71
- 239000010410 layer Substances 0.000 description 20
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 11
- 235000011613 Pinus brutia Nutrition 0.000 description 11
- 241000018646 Pinus brutia Species 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 238000013016 damping Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 5
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical class [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 235000017557 sodium bicarbonate Nutrition 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229920005830 Polyurethane Foam Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000011496 polyurethane foam Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000011157 advanced composite material Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical compound N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 230000000505 pernicious effect Effects 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 229920003225 polyurethane elastomer Polymers 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 102220168734 rs79042365 Human genes 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 150000005207 1,3-dihydroxybenzenes Chemical class 0.000 description 1
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 1
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
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- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
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- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 1
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- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- KYBYPDUGGWLXNO-GRVYQHKQSA-N ethane-1,2-diamine;(9z,12z)-octadeca-9,12-dienoic acid Chemical compound NCCN.CCCCC\C=C/C\C=C/CCCCCCCC(O)=O.CCCCC\C=C/C\C=C/CCCCCCCC(O)=O KYBYPDUGGWLXNO-GRVYQHKQSA-N 0.000 description 1
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- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/02—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles for articles of definite length, i.e. discrete articles
- B29C44/08—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles for articles of definite length, i.e. discrete articles using several expanding or moulding steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/02—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles for articles of definite length, i.e. discrete articles
- B29C44/12—Incorporating or moulding on preformed parts, e.g. inserts or reinforcements
- B29C44/18—Filling preformed cavities
-
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Abstract
The present invention is a kind of lightweight epoxy foam base battenboard, its structure is followed successively by exterior skin, epoxy foam core and inside panel from outside to inside, epoxy foam core is foamed by epoxy foam based composites and is formed, and epoxy foam based composites are 100 by the weight ratio of A, B component：The two-component system of 30-80 is constituted, and wherein component A includes 100 parts of epoxy resin, 5-20 parts of fire retardants, 1-10 parts of foaming agents, 0.5-1.5 parts of coupling agents；B component includes 1-100 parts of curing agent, 1-10 parts of foaming agents, 0.5-5 parts of fire retardants, 1-10 parts of curing accelerators.The present invention is prepared by secondary foam-in-place Process, is carried out one step foaming by placing 4-24 hours at room temperature, is then reacted at 110-140 DEG C 1-3 hours and carry out second time of foaming and curing molding.The present invention may be implemented filling, embedding, be bonded and integrated completion, and epoxy foam base sandwich sheet metal forming is easy, is not limited by cleat shapes and type, realize it is light-weighted simultaneously, have both heat-insulated, sound insulation, flame retardant property, it is generated without toxic gas when fire occurs, with good environmental-protecting performance, it can be used for crowded place.
Description
Technical field
The present invention relates to a kind of battenboard and preparation method thereof, specifically a kind of lightweight epoxy foam base battenboard and
Preparation method.
Background technology
Battenboard is made of laminboard layer and inside and outside covering, and inside and outside covering passes through the two sides of adhesive and laminboard layer respectively
It is bonded to one；Wherein laminboard layer is honeycomb sandwich layer or foamed core, and honeycomb sandwich layer is paper honeycomb core, aluminium honeycomb core or plastics bee
Nest core, foamed core are the foamed materials such as polyurethane (PU) foam, phenol formaldehyde foam and polystyrene foam (EPS)；Laminboard layer is
Honeycomb sandwich layer is called honeycomb sandwich board, as shown in Figure 1, laminboard layer, which is foamed core, is called foam battenboard.
Honeycomb sandwich board has the characteristics that stiffness is good, load ratio is high and is most saved using material, but due to its inside and outside two pieces
Between covering in honeycomb lattice air convection current and heat radiation, cause honeycomb sandwich board heat insulating ability bad, there are heat-proof quality difference
Defect.
Chinese patent CN103291035A discloses a kind of honeycomb sandwich panel, which leads to honeycomb aluminum and glass fabric
It crosses agent and is bonded together into honeycomb sandwich board, upper and lower covering is adhesively fixed by adhesive layer and honeycomb core, which carries
It is easy to happen stripping between the sandwich board core material knead dough plate of confession, is affected the mechanical properties.
Chinese patent CN201510108674 discloses a kind of honeycomb aluminum-epoxy resin composite laminboard and its preparation side
Method, the battenboard be five-layer structure battenboard, (1) pure epoxy resin protection face layer, (2) epoxy resin/honeycomb aluminum composite layer,
(3) honeycomb aluminum sandwich layer, (4) epoxy resin/honeycomb aluminum composite layer, (5) pure epoxy resin protection face layer；The sandwich that the patent provides
Plate stiffness is preferable, but the Sandwich structure number of plies is more, and complex manufacturing technology, the period is also very long, and covering and laminboard layer
Bonding mode does not explain.
Chinese patent CN102198744A discloses a kind of system of phenol-formaldehyde-foam-filled honeycomb core reinforced advanced compound material
Method is made, feature is to impregnate honeycomb as base material using Open-cell phenolic, and it is concurrent to fill expansion type phenolic resin in the base material position of opening
It is brewed to phenol-formaldehyde-foam-filled honeycomb core material, then the core material is combined phenol formaldehyde foam with phenolic fibre enhancing surfacing and is filled out
Honeycomb core enhancing advanced composite material is filled, the advanced composite material is light, adiabatic, sound insulation, good flame resistance, corrosion resistance are strong,
It can be widely used for the fields such as aviation, naval vessel and the manufacture of rail traffic facility；But the Sandwich structure layer of this method manufacture is more, at
Type complex process, it is of high cost, and cause the deformation of honeycomb lattice and squeeze crack after Foam Expansion, destroy the intensity of honeycomb core.
Chinese patent CN201510024686 discloses a kind of epoxy foam core filled composite material and its manufacturing method, the folder
Core composite material is made of core material, plane materiel and damping layer.Core material is a kind of hollow glass micropearl reinforced epoxy foamed plastics, plane materiel
For glass fiber reticular cloth reinforced epoxy fiberglass, damping layer is polyether polyurethane elastomer.The composite material of the invention is with having
The polyurethane elastomer of good adhesion performance and damping capacity, as cohering between foam core material and core material, core material and plane materiel
Damping layer, foam sandwich construction composite material obtained have light weight, intensity height, sound insulation, thermal insulation, damping, vibration damping, noise reduction
Integrated function.But the core filled composite material complex manufacturing technology, the density of epoxy foam is larger, and it is heavier to easily cause product, gently
Quantization is insufficient, and flame retardant property does not explain.
Polyurethane heat insulation material generally mostly uses the polyether polyol that degree of functionality is more, hydroxyl value is high and is reacted with polyisocyanates,
The high molecular polymer of cross-linked structure is made, polyurethane is preferable with dimensional stability as thermal insulation material, light weight, leads
Hot coefficient is low, 95% or more rate of closed hole, the advantages that anticorrosion antiwear is good；But in hard polyurethane foam, common foaming agent is
Chlorofluorocarbons (CFC) foaming agent, chlorofluorocarbons (CFC) foaming agent have destruction to atmospheric ozone layer；Secondly, polyurethane foam is prepared
During need a large amount of organic solvents and a variety of auxiliary agents, with the extension of time, the volatile organic molecule object in foam
Matter (such as：Benzene, toluene etc.) it can constantly evaporate, serious damage can all be caused to environment and human body；In addition, when encountering fire
When calamity, porous structure hard polyurethane foam is easy to be ignited, and big with release hydrogen cyanide, CO, NO etc. in combustion
Poisonous gas is measured, can make one to be poisoned when concentration reaches 400ppm lethal, cause prodigious potential hazard.
Invention content
The technical problem to be solved by the present invention is to the shortcomings that overcoming the prior art, propose a kind of lightweight epoxy foam base
Battenboard, molding is easy, stiffness is high, heat insulating, sound isolating and flame-retardant performance is good, is exposed under the conditions of high temperature and open fire without toxic gas
It generates, there is good environmental-protecting performance, and can be used for crowded place.
Another technical problem to be solved by this invention is to propose a kind of preparation side of lightweight epoxy foam base battenboard
Method, collection filling, embedding bond one completion, simple and practical, and preparation process is without pernicious gas and volatile harmful solvent.
The technical solution that the present invention solves the above technical problem is：
A kind of lightweight epoxy foam base battenboard, is followed successively by exterior skin, epoxy foam core and inside panel, epoxy from outside to inside
Foam core is foamed by epoxy foam based composites and is formed, and epoxy foam based composites are made of component A and B component, component A
Weight ratio with B component is 100：30-80；Component A includes the component of following parts by weight：100 parts of epoxy resin, 1-10 parts of hairs
Infusion, 0.5-1.5 part coupling agent；B component includes the component of following parts by weight：1-100 parts of curing agent, 1-10 parts of foaming agents,
0.5-5 parts of fire retardants, 1-10 parts of curing accelerators.
A kind of preparation method of lightweight epoxy foam base battenboard, includes the following steps：
(i) the identical inside panel of height and exterior skin are put into a mold and fixed, mold bottom against mould inner wall vertically
It is in close contact with inside and outside covering；
(ii) epoxy foam based composites A, B component are uniformly mixed, are then injected a mixture into mold, first in room temperature
Lower placement is foamed for 4-24 hours, is then reacted at 110-140 DEG C and is carried out within 1-3 hours second time of foaming, to be foamed to have cured
It is demoulded after, lightweight epoxy foam base battenboard is made.
The technical solution that the present invention further limits is：
Lightweight epoxy foam base battenboard above-mentioned, epoxy resin are one or more in following ingredients：It is double
Phenol A epoxy resin (name of an article NPEL-128, NPEL-127, NPEL-144, DER-330, DER-331, YD-127, YD-128, R-
139, R-140, E-51, E-54, E-44), bisphenol F epoxy resin (name of an article NPEF-170, EPALLOY 8220, EPALLOY
8230), aliphatic epoxy resin (name of an article EPALLOY 5200, JE-8421), tricyanic epoxy resin, glycerol epoxy tree
Fat, fatty acid glycerine ester epoxy resin, aliphatic glycidyl ester epoxy resin, bicyclopentadiene dioxide expoxy resin, two
Vinylcyclohexene oxide epoxy resin, polybutadiene epoxy resin.Wherein, bisphenol A epoxide resin epoxide equivalent 176-220g/
eq；The bisphenol F epoxy resin epoxide equivalent 160-180g/eq；The aliphatic epoxy resin epoxide equivalent 131-180g/
eq。
Lightweight epoxy foam base battenboard above-mentioned, wherein foaming agent are one or more in following ingredients：Carbonic acid
Hydrogen sodium, ammonium hydrogen carbonate, potassium borohydride, expended microsphere (name of an article pine this F20, F30, F36, F36LV, F48), hydrogeneous organosilicon,
Two benzene sulfonyl hydrazides, unifor, azodicarbonamide (AC), ethyl alcohol, formic acid, acetic acid, oxalic acid；Coupling agent be selected from it is following at
It is one or more in point：γ-(2,3- glycidoxies) propyl trimethoxy silicane (KH-560), γ-methacryloxypropyl
Base propyl trimethoxy silicane (KH -570), vinyl trimethylsilane (A-171), β-(3,4- epoxycyclohexyls) ethyl three
Methoxy silane, isopropyl triisostearoyltitanate；Fire retardant is one or more in following ingredients：Ammonium polyphosphate
(APP), melamine, triphenyl phosphate, dimethyl phosphine dimethyl phthalate (DMMP), tri-2-ethylhexyl phosphate, phosphoric acid (2-
Ethylhexyl)-diphenyl ester, isopropylated triphenyl phosphates, aluminium hydroxide, antimony oxide, antimony pentoxide, encapsulated red phosphorus,
Expansile graphite, superfine talcum powder, mica powder；Curing agent is one or more in following ingredients：Dicyandiamide, isophthalic diformazan
Amine, tetren (TEPA), isophorone diamine, trien, diethylenetriamines, the polyetheramine (name of an article
EC301, EC302, EC310, EC303), polyamide (name of an article Versamid 125, Versamid 140, Versamid 150,
500 types, 650 types, ANCAMIDE 220, ANCAMIDE 261A, ANCAMIDE 351A, ANCAMIDE 375A, ANCAMIDE
400,EPIKURE 3140A,EPIKURE 3115A)；Curing accelerator is one or more in following ingredients：2,4,6-
Three (dimethylamino methyl) phenol, metacresol, resorcinol, phenol, salicylic acid.
Lightweight epoxy foam base battenboard above-mentioned, wherein exterior skin and Inner Mongol skin thickness more than or equal to 0.1mm or more,
Epoxy foam core thickness is more than or equal to 3mm.
Lightweight epoxy foam base battenboard above-mentioned, wherein exterior skin and Inner Mongol skin thickness are 0.15-10mm, epoxy foam
The thickness of core is 3-100mm.
Lightweight epoxy foam base battenboard above-mentioned, wherein exterior skin and inside panel are metal, plastics, glass fibre, glass
Glass steel or carbon fiber.
Lightweight epoxy foam base battenboard above-mentioned, wherein exterior skin and inside panel be aluminium alloy, steel plate, PC, ABS,
PA66 or PVC.
The preparation method of lightweight epoxy foam base battenboard above-mentioned, wherein step (ii) in, epoxy foam based composites
After foamed solidification, expansion multiplying power 130-500%.
The beneficial effects of the invention are as follows：
The present invention epoxy foam Ji Jiaxinbanji fillings, embedding, bonding process in one, epoxy foam core is steeped by epoxy
Foam based composites are formed by low-temp foaming and high temperature foaming second time of foaming, internal shape after the foaming of epoxy foam based composites
At many closed pore formula minute bubbles, effectively prevent the heat radiation effect of epoxy foam battenboard and the conduction of sound, reach every
The effect that heat drop is made an uproar, more preferably compared to its heat-insulated, anti-acoustic capability than honeycomb sandwich board；In addition epoxy foam base battenboard prepares institute
With epoxy foam based composites environmental protection flame retardant, when encountering open fire, not only ontology is nonflammable, can also release non-flammable nothing
Evil gas inhibits open fire burning to reach environmental protection flame retardant effect.Epoxy composite material and inside and outside covering cementability are good, without using glue
Glutinous agent bonding, without adding hazardous solvent, by between epoxy foam based composites disposably poured casting from inside and outside covering,
By low temperature and high temperature, foamed solidification technique forms sandwich-like entirety, as epoxy foam base battenboard twice, nor
It is limited to complex face shaping.Epoxy foam Sandwich structure is simple, molding is easy, sandwich-like overall structure stiffness is good,
Heat-insulation noise-reduction performance is good, and environmental-protecting performance is excellent, can be applied to the manufacture of high-strength composite material；Epoxy foam composite material can not only
It is effective to improve structure specific strength, the energy of shock loading can also be absorbed, the effect of structure shock resistance damage performance is improved.
When the epoxy foam base battenboard sound frequency of the present invention is between 315-2000Hz, there is good sound-proofing
Energy；Under identical heat source, temperature is 10-25 DEG C low compared with honeycomb sandwich board, has good heat-proof quality；For epoxy foam base
Class, volume density 0.15-1.00g/cm3, the composite material with flame retardant property；Heat-proof quality, sound insulation value and flame retardant property
It is superior to honeycomb sandwich board.In addition, preparation process without pernicious gas and volatile harmful solvent, be exposed to high temperature and open fire condition
Lower no toxic gas generates, and has good environmental-protecting performance.
The epoxy foam base battenboard of the present invention can be used for the technical fields such as automobile, rail traffic, ship and space flight and aviation,
Also can be applied in naval ship, military spacecraft, aircraft, building and offshore structure field, such as with ship shell,
Aircraft light structures part, amph. tank floating drum, caisson etc., have molding be easy, flame retardant property is good, stiffness is high,
The good advantage of heat insulation performance, and not will produce hypertoxic gas cyaniding hydrogen in combustion, it can be used for crowded place.
Description of the drawings
Fig. 1 is cellular sandwich plate structure schematic diagram.
Fig. 2 is the structural schematic diagram of epoxy foam base battenboard of the present invention.
Fig. 3 is the heat conductivility comparison diagram of sample AL and AL-AL.
Fig. 4 is the heat conductivility comparison diagram of sample SS and SS-SS.
Specific implementation mode
Embodiment 1
The epoxy foam base Sandwich structure of the present embodiment as shown in Fig. 2, be followed successively by exterior skin 1, epoxy bubble from outside to inside
Foam core 2 and inside panel 3.Exterior skin 1 and inside panel 3 are aluminum alloy materials, and the thickness of aluminium alloy is 1.5mm.Epoxy foam core 2
Thickness is 30mm.
Epoxy foam core 2 is foamed by epoxy foam based composites and is formed, and epoxy foam based composites are by weight
Including：Component A：100 parts of NPEL-128,3 parts of acetic acid, 1.6 parts of inflatable microballon pine this F36L, 0.5 part of KH-560；B component：45
125,5 parts of EC301 of part Versamid, 4 parts of ammonium hydrogen carbonate, 3 parts of encapsulated red phosphorus, 3 parts of resorcinols.
It is prepared by epoxy foam base battenboard：(1) the identical inside panel of height and exterior skin are placed on vertically against mold wall
In mold and fixed, mold height is consistent or slightly lower with inside and outside covering, and mold bottom is in close contact with inside and outside covering.(2)
By in gap between the epoxy foam mixture the prepared by a certain percentage injection fixed covering of mold, it is small that 24 are first placed at room temperature
When, it then reacts 1 hour at 140 DEG C, is demoulded after the completion of foamed solidification, epoxy foam base battenboard is made.Epoxy is sent out
Expansion multiplying power is 200% after steeping the foamed solidification of mixture, and epoxy foam core density is 0.25g/cm3。
Embodiment 2
The epoxy foam base Sandwich structure of the present embodiment as shown in Fig. 2, be followed successively by exterior skin 1, epoxy bubble from outside to inside
Foam core 2 and inside panel 3.Exterior skin 1 and inside panel 3 are steel plate, and the thickness of steel plate is 1.5mm.The thickness of epoxy foam core 2 is
30mm。
Epoxy foam core 2 is foamed by epoxy foam based composites and is formed, and epoxy foam based composites are by weight
Including：Component A：100 parts of NPEL-127,5 parts of acetic acid, 1.5 parts of inflatable microballon pine this F48,0.5 part of KH-560；B component：50
140,7 parts of sodium bicarbonates of part Versamid, 3 parts of APP, 3 parts of 2,4,6- tri- (dimethylamino methyl) phenol.
It is prepared by epoxy foam base battenboard：(1) the identical inside panel of height and exterior skin are placed on vertically against mold wall
In mold and fixed, mold height is consistent or slightly lower with inside and outside covering, and mold bottom is in close contact with inside and outside covering.(2)
By in gap between the epoxy foam mixture the prepared by a certain percentage injection fixed covering of mold, it is small that 12 are first placed at room temperature
When, it then reacts 1 hour at 140 DEG C, is demoulded after the completion of foamed solidification, epoxy foam base battenboard is made.Epoxy is sent out
Expansion multiplying power is 200% after steeping the foamed solidification of mixture, and epoxy foam core density is 0.4g/cm3。
Embodiment 3
The epoxy foam base Sandwich structure of the present embodiment as shown in Fig. 2, be followed successively by exterior skin 1, epoxy bubble from outside to inside
Foam core 2 and inside panel 3.Exterior skin 1 is aluminum alloy materials, and the thickness of aluminium alloy is 2mm.The thickness of epoxy foam core 2 is 10mm.
Inside panel 3 is steel plate, and the thickness of steel plate is 0.15mm.
Epoxy foam core 2 is foamed by epoxy foam based composites and is formed, and epoxy foam based composites are by weight
Including：Component A：100 parts of NPEL-144,2.5 parts of acetic acid, 1 part of inflatable microballon pine this F36L, 1 part of A-171；B component：15 parts
TEPA, 3.5 parts of sodium bicarbonates, 4 parts of aluminium hydroxides, 3 parts of 2,4,6- tri- (dimethylamino methyl) phenol.
It is prepared by epoxy foam base battenboard：(1) the identical inside panel of height and exterior skin are placed on vertically against mold wall
In mold and fixed, mold height is consistent or slightly lower with inside and outside covering, and mold bottom is in close contact with inside and outside covering.(2)
By in gap between the epoxy foam mixture the prepared by a certain percentage injection fixed covering of mold, it is small that 2 are first placed at room temperature
When, it then reacts 2 hours at 130 DEG C, is demoulded after the completion of foamed solidification, epoxy foam base battenboard is made.Epoxy is sent out
Expansion multiplying power is 130% after steeping the foamed solidification of mixture, and epoxy foam core density is 0.7g/cm3。
Embodiment 4
The epoxy foam base Sandwich structure of the present embodiment as shown in Fig. 2, be followed successively by exterior skin 1, epoxy bubble from outside to inside
Foam core 2 and inside panel 3.Exterior skin 1 and inside panel 3 are PA66 materials, and the thickness of PA66 is 2mm.The thickness of epoxy foam core 2 is
50mm。
Epoxy foam core 2 is foamed by epoxy foam based composites and is formed, and epoxy foam based composites are by weight
Including：Component A：100 parts of DER-330,4.5 parts of oxalic acid, 3 parts of inflatable microballon pine this F36,0.5 part of KH-570；B component：45 parts
220,5 parts of EC302 of ANCAMIDE, 8 parts of ammonium hydrogen carbonate, 3 parts of APP, 3 parts of phenol.
It is prepared by epoxy foam base battenboard：(1) the identical inside panel of height and exterior skin are placed on vertically against mold wall
In mold and fixed, mold height is consistent or slightly lower with inside and outside covering, and mold bottom is in close contact with inside and outside covering.(2)
By in gap between the epoxy foam mixture the prepared by a certain percentage injection fixed covering of mold, it is small that 20 are first placed at room temperature
When, it then reacts 2 hours at 120 DEG C, is demoulded after the completion of foamed solidification, epoxy foam base battenboard is made.Epoxy is sent out
Expansion multiplying power is 300% after steeping the foamed solidification of mixture, and epoxy foam core density is 0.3g/cm3。
Embodiment 5
The epoxy foam base Sandwich structure of the present embodiment as shown in Fig. 2, be followed successively by exterior skin 1, epoxy bubble from outside to inside
Foam core 2 and inside panel 3.Exterior skin 1 and inside panel 3 are ABS material, and the thickness of ABS is 3mm.The thickness of epoxy foam core 2 is
40mm。
Epoxy foam core 2 is foamed by epoxy foam based composites and is formed, and epoxy foam based composites are by weight
Including：Component A：100 parts of YD-128,3 parts of oxalic acid, 2.5 parts of inflatable microballon pine this F36,0.5 part of KH-570；B component：45 parts
ANCAMIDE 351A, 5 parts of EC310,8 parts of sodium bicarbonates, 2 parts of tri-2-ethylhexyl phosphates, 1 part of aluminium hydroxide, between 10 parts
Benzenediol.
It is prepared by epoxy foam base battenboard：(1) the identical inside panel of height and exterior skin are placed on vertically against mold wall
In mold and fixed, mold height is consistent or slightly lower with inside and outside covering, and mold bottom is in close contact with inside and outside covering.(2)
By in gap between the epoxy foam mixture the prepared by a certain percentage injection fixed covering of mold, it is small that 18 are first placed at room temperature
When, it then reacts 2 hours at 120 DEG C, is demoulded after the completion of foamed solidification, epoxy foam base battenboard is made.Epoxy is sent out
Expansion multiplying power is 250% after steeping the foamed solidification of mixture, and epoxy foam core density is 0.4g/cm3。
Embodiment 6
The epoxy foam base Sandwich structure of the present embodiment as shown in Fig. 2, be followed successively by exterior skin 1, epoxy bubble from outside to inside
Foam core 2 and inside panel 3.Exterior skin 1 is PA66 materials, and the thickness of PA66 is 2mm.The thickness of epoxy foam core 2 is 30mm.Inner Mongol
Skin 3 is ABS material, and the thickness of ABS is 2mm.
Epoxy foam core 2 is foamed by epoxy foam based composites and is formed, and epoxy foam based composites are by weight
Including：Component A：100 parts of DER-331,6 parts of acetic acid, 1.5 parts of inflatable microballon pine this F30,0.5 part of KH-570；B component：50 parts
140,8 parts of ammonium hydrogen carbonate of Versamid, 2 parts of encapsulated red phosphorus, 2 parts of APP, 3 parts of 2,4,6- tri- (dimethylamino methyl) phenol.
It is prepared by epoxy foam base battenboard：(1) the identical inside panel of height and exterior skin are placed on vertically against mold wall
In mold and fixed, mold height is consistent or slightly lower with inside and outside covering, and mold bottom is in close contact with inside and outside covering.(2)
By in gap between the epoxy foam mixture the prepared by a certain percentage injection fixed covering of mold, it is small that 12 are first placed at room temperature
When, it then reacts 2 hours at 120 DEG C, is demoulded after the completion of foamed solidification, epoxy foam base battenboard is made.Epoxy is sent out
Expansion multiplying power is 200% after steeping the foamed solidification of mixture, and epoxy foam core density is 0.33g/cm3。
Embodiment 7
The epoxy foam base Sandwich structure of the present embodiment as shown in Fig. 2, be followed successively by exterior skin 1, epoxy bubble from outside to inside
Foam core 2 and inside panel 3.Exterior skin 1 is aluminum alloy materials, and the thickness of aluminium alloy is 2mm.The thickness of epoxy foam core 2 is 40mm.
Inside panel 3 is PA66 materials, and the thickness of PA66 is 3mm.
Epoxy foam core 2 is foamed by epoxy foam based composites and is formed, and epoxy foam based composites are by weight
Including：Component A：100 parts of R-139,3 parts of formic acid acid, 1.5 parts of inflatable microballon pine this F20,0.5 part of KH-570；B component：40 parts
ANCAMIDE 261A, 3 parts of TEPA, 7 parts of sodium bicarbonates, 2 parts of DMMP, 1 part of aluminium hydroxide, 3 parts of phenol.
It is prepared by epoxy foam base battenboard：(1) the identical inside panel of height and exterior skin are placed on vertically against mold wall
In mold and fixed, mold height is consistent or slightly lower with inside and outside covering, and mold bottom is in close contact with inside and outside covering.(2)
By in gap between the epoxy foam mixture the prepared by a certain percentage injection fixed covering of mold, it is small that 8 are first placed at room temperature
When, it then reacts 1 hour at 130 DEG C, is demoulded after the completion of foamed solidification, epoxy foam base battenboard is made.Epoxy is sent out
Expansion multiplying power is 230% after steeping the foamed solidification of mixture, and epoxy foam core density is 0.4g/cm3。
Embodiment 8
The epoxy foam base Sandwich structure of the present embodiment as shown in Fig. 2, be followed successively by exterior skin 1, epoxy bubble from outside to inside
Foam core 2 and inside panel 3.Exterior skin 1 is carbon fiber board, and the thickness of carbon fiber board is 0.2mm.The thickness of epoxy foam core 2 is
90mm.Inside panel 3 is carbon fiber board, and the thickness of carbon fiber board is 1mm.
Epoxy foam core 2 is foamed by epoxy foam based composites and is formed, and epoxy foam based composites are by weight
Including：Component A：100 parts of E-51,3 parts of oxalic acid, 4 parts of inflatable microballon pine this F30,1 part of KH-570；B component：35 parts
ANCAMIDE 375A, 3 parts of TEPA, 5 parts of EC303,8 parts of sodium bicarbonates, 3 parts of APP, 3 parts of 2,4,6- tri- (dimethylamino methyl) benzene
Phenol.
It is prepared by epoxy foam base battenboard：(1) the identical inside panel of height and exterior skin are placed on vertically against mold wall
In mold and fixed, mold height is consistent or slightly lower with inside and outside covering, and mold bottom is in close contact with inside and outside covering.(2)
By in gap between the epoxy foam mixture the prepared by a certain percentage injection fixed covering of mold, it is small that 14 are first placed at room temperature
When, it then reacts 3 hours at 110 DEG C, is demoulded after the completion of foamed solidification, epoxy foam base battenboard is made.Epoxy is sent out
Expansion multiplying power is 400% after steeping the foamed solidification of mixture, and epoxy foam core density is 0.5g/cm3。
Embodiment 9
The epoxy foam base Sandwich structure of the present embodiment as shown in Fig. 2, be followed successively by exterior skin 1, epoxy bubble from outside to inside
Foam core 2 and inside panel 3.Exterior skin 1 is steel plate, and the thickness of steel plate is 2mm.The thickness of epoxy foam core 2 is 100mm.Inside panel 3
Thickness for glass fabric, glass fabric is 0.2mm.
Epoxy foam core 2 is foamed by epoxy foam based composites and is formed, and epoxy foam based composites are by weight
Including：Component A：100 parts of E-44,4.5 parts of oxalic acid, 4.5 parts of inflatable microballon pine this F20,1 part of KH-570；B component：45 part 650
Type, 5 parts of EC301,8 parts of ammonium hydrogen carbonate, 3 parts of DMMP, 3 parts of 2,4,6- tri- (dimethylamino methyl) phenol.
It is prepared by epoxy foam base battenboard：(1) the identical inside panel of height and exterior skin are placed on vertically against mold wall
In mold and fixed, mold height is consistent or slightly lower with inside and outside covering, and mold bottom is in close contact with inside and outside covering.(2)
By in gap between the epoxy foam mixture the prepared by a certain percentage injection fixed covering of mold, it is small that 24 are first placed at room temperature
When, it then reacts 3 hours at 110 DEG C, is demoulded after the completion of foamed solidification, epoxy foam base battenboard is made.Epoxy is sent out
Expansion multiplying power is 500% after steeping the foamed solidification of mixture, and epoxy foam core density is 0.2g/cm3。
Embodiment 10
The epoxy foam base Sandwich structure of the present embodiment as shown in Fig. 2, be followed successively by exterior skin 1, epoxy bubble from outside to inside
Foam core 2 and inside panel 3.Exterior skin 1 is PA66 materials, and the thickness of PA66 is 2mm.The thickness of epoxy foam core 2 is 50mm.Inner Mongol
Skin 3 is glass epoxy, and the thickness of glass epoxy is 5mm.
Epoxy foam core 2 is foamed by epoxy foam based composites and is formed, and epoxy foam based composites are by weight
Including：Component A：100 parts of R-140,3 parts of formic acid, 2 parts of inflatable microballon pine this F36,0.5 part of KH-570；B component：50 parts
EPIKURE 3115A, 5 parts of ammonium hydrogen carbonate, 3 parts of isopropylated triphenyl phosphates, 3 parts of phenol.
It is prepared by epoxy foam base battenboard：(1) the identical inside panel of height and exterior skin are placed on vertically against mold wall
In mold and fixed, mold height is consistent or slightly lower with inside and outside covering, and mold bottom is in close contact with inside and outside covering.(2)
By in gap between the epoxy foam mixture the prepared by a certain percentage injection fixed covering of mold, it is small that 4 are first placed at room temperature
When, it then reacts 1 hour at 130 DEG C, is demoulded after the completion of foamed solidification, epoxy foam base battenboard is made.Epoxy is sent out
Expansion multiplying power is 280% after steeping the foamed solidification of mixture, and epoxy foam core density is 0.35g/cm3。
Comparative example 1
This comparative example provides a kind of honeycomb sandwich board, as shown in Figure 1, being followed successively by exterior skin, glue-line, honeycomb from outside to inside
Core, glue-line and inside panel.Exterior skin and inside panel are aluminum alloy materials, and the thickness of aluminium alloy is 1.5mm.The structure of honeycomb core is equal
For aluminum honeycomb, aluminum honeycomb height is 30mm.
Comparative example 2
This comparative example provides a kind of honeycomb sandwich board, as shown in Figure 1, being followed successively by exterior skin, glue-line, honeycomb from outside to inside
Core, glue-line and inside panel.Exterior skin and inside panel are steel plate, and the thickness of steel plate is 1.5mm.The structure of honeycomb core is aluminium bee
Nest, aluminum honeycomb height are 30mm.
Experimental example
It is AL and SS to epoxy foam base battenboard sample number consecutively described in Examples 1 and 2, described in comparative example 1 and 2
Core plate sample number into spectrum is AL-AL and SS-SS between honeycomb, is thermally shielded sound insulation value test, and test result is shown in Fig. 3 and Fig. 4.From figure
Two groups of check experiment results can be seen that temperature rise is faster in 3 and Fig. 4, and equilibrium temperature is closer to heat source temperature, thermal conductivity
Can be better, heat-proof quality is poorer, may determine that according to the speed of final equilibrium temperature and temperature rise：Heat conductivility：
AL-AL>SS-SS>SS>AL；That is heat-proof quality：AL>SS>SS-SS>AL-AL, illustrate epoxy foam base battenboard heat-proof quality compared with
It is good.From sound in table 1, in 1000HZ, sound pressure test result can be seen that the Pq value minimums of AL, the Pq of AL-AL after sample
Value is maximum；It is analyzed according to sound insulation value test philosophy it is found that Pq values are smaller, sound insulation coefficient is bigger, therefore may determine that heat-insulated
Performance：AL>SS>SS-SS>AL-AL illustrates that epoxy foam base battenboard sound insulation value is preferable.
1. sound of table sound pressure test result after sample in 1000HZ
| AL-AL | SS-SS | SS | AL | |
| Pq values | 0.0075 | 0.00343 | 0.00258 | 0.00172 |
In addition to the implementation, the present invention can also have other embodiment.It is all to use equivalent substitution or equivalent transformation shape
At technical solution, fall within the scope of protection required by the present invention.
Claims (10)
1. a kind of lightweight epoxy foam base battenboard, it is characterised in that：It is followed successively by exterior skin, epoxy foam core and interior from outside to inside
Covering, the epoxy foam core is foamed by epoxy foam based composites to be formed, and the epoxy foam based composites are by component A
It is constituted with B component, the weight ratio of component A and B component is 100：30-80；The A components include the component of following parts by weight：
100 parts of epoxy resin, 1-10 parts of foaming agents, 0.5-1.5 parts of coupling agents；The B components include the component of following parts by weight：
1-100 parts of curing agent, 1-10 parts of foaming agents, 0.5-5 parts of fire retardants, 1-10 parts of curing accelerators.
2. lightweight epoxy foam base battenboard as described in claim 1, it is characterised in that：The epoxy resin be selected from it is following at
It is one or more in point：Bisphenol A epoxide resin, bisphenol F epoxy resin, aliphatic epoxy resin, tricyanic epoxy resin,
Glycerol epoxy resin, fatty acid glycerine ester epoxy resin, aliphatic glycidyl ester epoxy resin, bicyclopentadiene dioxide
Epoxy resin, vinyl cyclohexene dioxide epoxy resin, polybutadiene epoxy resin.
3. lightweight epoxy foam base battenboard as claimed in claim 2, it is characterised in that：The bisphenol A epoxide resin epoxy
Equivalent 176-220g/eq；The bisphenol F epoxy resin epoxide equivalent 160-180g/eq；The aliphatic epoxy resin epoxy is worked as
Measure 131-180g/eq.
4. lightweight epoxy foam base battenboard as described in claim 1, it is characterised in that：The foaming agent be selected from it is following at
It is one or more in point：Sodium bicarbonate, ammonium hydrogen carbonate, potassium borohydride, expended microsphere, hydrogeneous organosilicon, two benzene sulfonyl hydrazides,
Unifor, azodicarbonamide, ethyl alcohol, formic acid, acetic acid, oxalic acid；
The coupling agent is one or more in following ingredients：γ-(2,3- glycidoxies) propyl trimethoxy silicon
Alkane (KH-560), γ-methacryloxypropyl trimethoxy silane, vinyl trimethylsilane, β-（3,4- epoxy hexamethylenes
Base）Ethyl trimethoxy silane, isopropyl triisostearoyltitanate；
The fire retardant is one or more in following ingredients：Ammonium polyphosphate, melamine, triphenyl phosphate, diformazan
Base dimethyl phosphonate, tri-2-ethylhexyl phosphate, phosphoric acid (2- ethylhexyls)-diphenyl ester, isopropylated triphenyl phosphates,
Aluminium hydroxide, antimony oxide, antimony pentoxide, encapsulated red phosphorus, expansile graphite, superfine talcum powder, mica powder；
The curing agent is one or more in following ingredients：It is dicyandiamide, m-xylene diamine, tetren, different
Isophoronediamine, trien, diethylenetriamines, polyetheramine；
The curing accelerator is one or more in following ingredients：2,4,6- tri- (dimethylamino methyl) phenol,
Metacresol, resorcinol, phenol, salicylic acid.
5. lightweight epoxy foam base battenboard as described in claim 1, it is characterised in that：The exterior skin and Inner Mongol skin thickness
More than or equal to 0.1mm or more, the epoxy foam core thickness is more than or equal to 3mm.
6. lightweight epoxy foam base battenboard as claimed in claim 5, it is characterised in that：The exterior skin and Inner Mongol skin thickness
Thickness for 0.15-10mm, the epoxy foam core is 3-100mm.
7. lightweight epoxy foam base battenboard as described in claim 1, it is characterised in that：The exterior skin and inside panel are gold
Category, plastics, glass fibre, fiberglass or carbon fiber.
8. lightweight epoxy foam base battenboard as claimed in claim 7, it is characterised in that：The exterior skin and inside panel are aluminium
Alloy, steel plate, PC, ABS, PA66 or PVC.
9. the preparation method of the lightweight epoxy foam base battenboard as described in any claim in claim 1-8, feature
It is：Include the following steps：
(i) the identical inside panel of height and exterior skin are put vertically against mould inner wall it is in a mold and fixed, mold bottom with
Inside and outside covering is in close contact；
(ii) epoxy foam based composites A, B component are uniformly mixed, are then injected a mixture into mold, first at room temperature
It places 4-24 hours and foams, then reacted at 110-140 DEG C and carry out within 1-3 hours second time of foaming, solidification to be foamed is completed
After demoulded, lightweight epoxy foam base battenboard is made.
10. the preparation method of lightweight epoxy foam base battenboard as claimed in claim 10, it is characterised in that：The step is (ii)
In, the epoxy foam based composites are after foamed solidification, expansion multiplying power 130-500%.
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| CN113414998A (en) * | 2021-07-12 | 2021-09-21 | 重庆泛锐科技有限公司 | High-strength heat-insulation composite board and preparation method thereof |
| WO2023099831A1 (en) | 2021-12-03 | 2023-06-08 | Safran Aircraft Engines | Lightweight epoxy resin core for a hollow composite part |
| FR3129867A1 (en) * | 2021-12-03 | 2023-06-09 | Safran Aircraft Engines | LIGHTWEIGHT CORE IN EPOXY RESIN FOR HOLLOW COMPOSITE PARTS |
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