CN108696254B - Microwave power synthesis amplifier - Google Patents
Microwave power synthesis amplifier Download PDFInfo
- Publication number
- CN108696254B CN108696254B CN201810495132.4A CN201810495132A CN108696254B CN 108696254 B CN108696254 B CN 108696254B CN 201810495132 A CN201810495132 A CN 201810495132A CN 108696254 B CN108696254 B CN 108696254B
- Authority
- CN
- China
- Prior art keywords
- groove
- antenna board
- antenna
- seat
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 24
- 238000003786 synthesis reaction Methods 0.000 title claims abstract description 24
- 230000003321 amplification Effects 0.000 claims abstract description 54
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 54
- 230000017525 heat dissipation Effects 0.000 claims abstract description 53
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000005192 partition Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 3
- 238000004378 air conditioning Methods 0.000 claims description 2
- 230000004308 accommodation Effects 0.000 claims 2
- 230000007704 transition Effects 0.000 claims 2
- 210000001503 joint Anatomy 0.000 claims 1
- 230000010354 integration Effects 0.000 abstract description 9
- 230000002093 peripheral effect Effects 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/30—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Non-Reversible Transmitting Devices (AREA)
Abstract
The invention relates to a microwave power synthesis amplifier which comprises a heat dissipation seat, a supporting seat, a first antenna board, a cover plate and a second antenna board. The supporting seat and the radiating seat enclose a first accommodating cavity together, the first antenna board is arranged in the first accommodating cavity, one end of the first heat conducting rod on the radiating seat extends into the first through hole on the first antenna board and is abutted to the back surface of the first power amplification tube, so that heat of the first power amplification tube can be transferred to the radiating seat by the first heat conducting rod. The cover plate and the supporting seat jointly enclose a second accommodating cavity, the second antenna plate is arranged in the second accommodating cavity, and one end of the second heat conducting rod on the heat radiating seat extends into the second through hole on the second antenna plate and is abutted to the back surface of the second power amplifier tube. The heat of the second power amplifier tube can be transferred to the heat radiating seat by the second heat conducting rod, so that the first power amplifier tube and the second power amplifier tube are simultaneously radiated by the heat radiating seat, the heat radiating design is greatly simplified, the integration of the system is facilitated, and the heat radiating device is applicable to higher microwave frequency bands.
Description
Technical Field
The invention relates to the technical field of power amplifiers, in particular to a microwave power synthesis amplifier.
Background
With the rapid development of wireless communication, the use of a microwave amplifier becomes more and more popular, and is limited by factors such as small output power and large transmission loss of elements of the microwave amplifier, so that the technical indexes such as output power, volume, weight, system adaptability and the like of the conventional microwave amplifier are often difficult to meet the application requirements of the fields such as communication, radar and the like.
The traditional microwave amplifier includes two antenna boards, and two antenna boards symmetry are placed, and the front of the power amplifier pipe on two antenna boards sets up relatively for the power amplifier pipe on each antenna board all needs to correspond a radiating piece, not only leads to microwave amplifier to need two opposite sides to set up the radiating piece, is unfavorable for system integration, can't be effectively applicable to on the higher microwave frequency channel simultaneously.
Disclosure of Invention
Based on this, it is necessary to provide a microwave power combining amplifier which is more advantageous for system integration and can be applied to a higher microwave frequency band, in view of the above problems.
A microwave power combining amplifier, one side of which is provided with a waveguide input port and the opposite side is provided with a waveguide output port, the microwave power combining amplifier comprising:
the heat dissipation seat is provided with a first heat conduction rod and a second heat conduction rod which is arranged in parallel with the first heat conduction rod;
the support seat is arranged on one side of the radiating seat, a first accommodating cavity is formed by the support seat and the radiating seat in a surrounding mode, the first heat conducting rod and the second heat conducting rod are both positioned on one side, facing the support seat, of the radiating seat and are positioned in the first accommodating cavity, and the first accommodating cavity is communicated with the waveguide input port and the waveguide output port;
the first antenna board is arranged in the first accommodating cavity, a first power amplification tube is arranged on the first antenna board, a first through hole is formed in the first antenna board, the first power amplification tube corresponds to the first through hole, the first power amplification tube is provided with a front face and a back face which is opposite to the front face, and one end of the first heat conduction rod, which is far away from the heat dissipation seat, extends into the first through hole and is abutted to the back face of the first power amplification tube;
the cover plate is covered on one side of the supporting seat, which is opposite to the heat dissipation seat, and the cover plate and the supporting seat jointly enclose a second accommodating cavity which is communicated with the waveguide input port and the waveguide output port; a kind of electronic device with high-pressure air-conditioning system
The second antenna board set up in the second holding chamber, be provided with the second power amplifier pipe on the second antenna board, the second through-hole has been seted up on the second antenna board, the second power amplifier pipe corresponds the second through-hole, the second power amplifier pipe have openly and with the back that openly set up opposite to each other, the second heat-conducting rod is kept away from the one end of heat dissipation seat is passed in proper order first antenna board the supporting seat stretches into in the second through-hole, with the butt in the back of second power amplifier pipe.
The microwave power synthesis amplifier has at least the following advantages:
during installation, the first antenna board is arranged in the first accommodating cavity, the first power amplification tube is arranged on the first antenna board, the first through hole is formed in the first antenna board, and one end, away from the radiating seat, of the first heat conducting rod extends into the first through hole in the first antenna board and is abutted to the back surface of the first power amplification tube. Therefore, the heat generated by the first power amplifier tube can be transferred to the heat dissipation seat by the first heat conduction rod to dissipate heat. The second antenna board is arranged in the second accommodating cavity, the second antenna board is connected with a second power amplification tube, a second through hole is formed in the second antenna board, and one end, far away from the second heat conducting rod, of the second heat conducting rod sequentially penetrates through the first antenna board and the supporting seat and stretches into the second through hole to be abutted to the back face of the second power amplification tube. Therefore, the heat generated by the second power amplification tube can be transferred to the heat dissipation seat by the second heat conduction rod to dissipate heat, so that the first power amplification tube and the second power amplification tube are simultaneously dissipated by the heat dissipation seat, the number of heat dissipation parts can be reduced, the two heat dissipation parts are reduced to be single heat dissipation parts by the traditional requirement, the integration of the system is facilitated, and the size and the weight of the microwave power synthesis amplifier can be smaller.
In engineering, the first power amplification tube and the second power amplification tube are required to be arranged in an air cavity with a certain height. Because the one end butt of first heat-conducting rod is in the back of first power amplifier pipe in this application, the one end butt of second heat-conducting rod is in the back of second power amplifier pipe for the front of first power amplifier pipe and the front of second power amplifier pipe all face same one side, make this side space effectively utilize, effectively reduce the requirement to air cavity height when first power amplifier pipe and second power amplifier pipe symmetric distribution. Therefore, the restriction of the sizes of the waveguide input port and the waveguide output port on the arrangement space of the first power amplification tube and the second power amplification tube is effectively reduced, the sizes of the waveguide input port and the waveguide output port can be further reduced, the microwave power synthesis with higher frequency is realized, and the adaptability of the microwave power synthesis amplifier is effectively improved. Meanwhile, the thickness of the supporting seat can be further reduced, so that the distance between the first power amplification tube and the second power amplification tube is shortened, more supporting seats and second antenna plates can be further increased, and the requirement of higher output power is met.
In one embodiment, the first power amplifier tube is fixed on an end face of one end of the first heat conducting rod, and the second power amplifier tube is fixed on an end face of one end of the second heat conducting rod.
In one embodiment, a first mounting groove is formed in the surface of the heat dissipation seat facing the supporting seat, the first heat conducting rod and the second heat conducting rod are both arranged on the bottom wall of the first mounting groove, a first accommodating groove is formed in the surface of the supporting seat facing the heat dissipation seat, the first accommodating groove is communicated with the first mounting groove to form a first accommodating cavity, the first antenna board is arranged in the first mounting groove, and the front face of the first power amplifier tube is arranged facing the first accommodating groove.
In one embodiment, a second mounting groove is formed in the surface of the supporting seat facing the cover plate, a second accommodating groove is formed in the surface of the cover plate facing the supporting seat, the second accommodating groove is communicated with the second mounting groove to form a second accommodating cavity, the second antenna board is arranged in the second mounting groove, and the front surface of the second power amplifier tube faces the second accommodating groove.
In one embodiment, a metal partition plate is disposed on the bottom wall of the second accommodating groove, and the metal partition plate corresponds to between the first power amplifier tube and the second power amplifier tube.
In one embodiment, a first groove is formed in the bottom wall of the first mounting groove, the first groove penetrates through a side wall of the heat dissipation seat, a first through groove is formed in the bottom wall of the first accommodating groove, the first through groove penetrates through a side wall of the supporting seat, a second groove is formed in the surface, facing the supporting seat, of the cover plate, the second groove penetrates through a side wall of the cover plate and is communicated with the second accommodating groove, and the first groove is communicated with the first through groove and the second groove to form the waveguide input port; the bottom wall of the first mounting groove is also provided with a third groove, the third groove penetrates through the other opposite side wall of the heat dissipation seat, the bottom wall of the first accommodating groove is also provided with a second through groove, the second through groove penetrates through the other opposite side wall of the supporting seat, the cover plate faces the supporting seat, the surface of the cover plate is also provided with a fourth groove, the fourth groove penetrates through the other opposite side wall of the cover plate and is communicated with the second accommodating groove, and the third groove is communicated with the second through groove and the fourth groove to form the waveguide output port.
In one embodiment, the number of the second antenna boards is at least two, each second antenna board is provided with the second power amplification tube, the number of the supporting seats corresponds to the number of the second antenna boards, every two adjacent supporting seats are mutually overlapped and jointly enclose a third accommodating cavity, and each third accommodating cavity is internally provided with one second antenna board.
In one embodiment, the number of the second heat conducting rods corresponds to the number of the second antenna boards, wherein one end of one second heat conducting rod sequentially passes through the first antenna board, the support seat closest to the first antenna board and stretches into the second through hole closest to the first antenna board so as to be abutted to the back surface of the second power amplification tube on the second antenna board closest to the first antenna board; for the second antenna board far away from the first antenna board, one end of the other second heat conducting rod sequentially penetrates through the first antenna board, the supporting seat and the second antenna board between the second antenna board and the heat radiating seat and stretches into the second through hole on the second antenna board to be abutted to the back surface of the second power amplifier tube on the second antenna board.
In one embodiment, the first antenna board and the second antenna board are active antenna boards, and the active antenna boards include input dual-path fin-microstrip conversion, delay microstrip transmission line, and output microstrip-fin line conversion.
Drawings
FIG. 1 is a schematic diagram of a microwave power combining amplifier according to an embodiment;
FIG. 2 is an exploded schematic view of the microwave power combining amplifier shown in FIG. 1;
FIG. 3 is a schematic view of the support base of FIG. 2 from another view;
fig. 4 is a schematic structural view of the cover plate of fig. 2 from another view.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit or scope of the invention, which is therefore not limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
Referring to fig. 1 and 2, the microwave power synthesis amplifier 10 in an embodiment is applied to the fields of wireless communication, radar, etc., and not only can realize the same-side heat dissipation of a power amplification tube, which is beneficial to the integration of a system, but also the microwave power synthesis amplifier 10 can be applied to a higher microwave frequency band, thereby effectively improving the applicability of the microwave power synthesis amplifier 10. In particular, in the present embodiment, the microwave power combining amplifier 10 is suitable for power combining amplification of microwave and millimeter waves. Specifically, the microwave power combining amplifier 10 includes a heat sink 100, a support 200, a first antenna board 300, a cover 400, and a second antenna board 500. In particular, in the present embodiment, the second antenna board 500 is one.
The microwave power combining amplifier 10 has a waveguide input port 610 on one side and a waveguide output port on the opposite side. Electromagnetic waves enter the microwave power combining amplifier 10 through the waveguide input port 610, are amplified in power, are combined through the waveguide output port, and output the combined and amplified electromagnetic waves.
The heat sink 100 is provided with a first heat conduction rod 110 and a second heat conduction rod 120 juxtaposed with the first heat conduction rod 110. The supporting seat 200 is disposed on one side of the heat dissipation seat 100, the supporting seat 200 and the heat dissipation seat 100 together define a first accommodating cavity, and the first heat conducting rod 110 and the second heat conducting rod 120 are both located on one side of the heat dissipation seat 100 facing the supporting seat 200 and located in the first accommodating cavity. The first receiving chamber communicates with the waveguide input port 610 and the waveguide output port. The first antenna board 300 is disposed in the first accommodating cavity, a first power amplifier tube is disposed on the first antenna board 300, a first through hole 310 is disposed on the first antenna board 300, the first power amplifier tube corresponds to the first through hole 310, and one end of the first heat conducting rod 110, which is far away from the heat dissipation seat 100, extends into the first through hole 310 and is abutted to the back of the first power amplifier tube. The first power amplifier tube is provided with a front face and a back face which is opposite to the front face. The heat generated by the first power amplifier tube can be transferred to the heat dissipation seat 100 by the first heat conduction rod 110 for heat dissipation, so that the damage caused by overheating of the first power amplifier tube is effectively avoided.
In this embodiment, two first power amplifier tubes are provided, two first through holes 310 are provided, and the two first through holes are arranged in parallel, and each first power amplifier tube corresponds to one first through hole 310. Of course, in other embodiments, the number of the first power amplifier tubes may be one, and the number of the first through holes 310 may be one.
In this embodiment, the first power amplifier tube is located in the first through hole 310. Of course, in other embodiments, the first power amplifier tube is located on the first antenna board 300 and completely or partially covers the first through hole 310, so long as the first heat conduction rod 110 can be abutted against the back surface of the first power amplifier tube.
The cover plate 400 is disposed on a side of the support base 200 opposite to the heat sink base 100, and the cover plate 400 and the support base 200 together define a second accommodating cavity, where the second accommodating cavity is communicated with the waveguide input port 610 and the waveguide output port. The second antenna board 500 is disposed in the second accommodating cavity, a second power amplifier tube is disposed on the second antenna board 500, and a second through hole 510 is disposed on the second antenna board 500, where the second power amplifier tube corresponds to the second through hole 510. One end of the second heat conducting rod 120 far away from the heat dissipation base 100 sequentially passes through the first antenna board 300 and the supporting base 200 and stretches into the second through hole 510 to be abutted against the back surface of the second power amplifier tube. The second power amplifier tube is provided with a front face and a back face which is opposite to the front face. The heat generated by the second power amplification tube can be transferred to the heat dissipation seat 100 by the second heat conduction rod 120 to dissipate heat, so that the first power amplification tube and the second power amplification tube are simultaneously dissipated by the heat dissipation seat 100, the number of heat dissipation parts can be reduced, the integration of a system is facilitated, and meanwhile, the size and the weight of the microwave power synthesis amplifier 10 are smaller.
In engineering, the first power amplification tube and the second power amplification tube are required to be arranged in an air cavity with a certain height. In this application, because the one end butt of first heat conduction pole 110 is at the back of first power amplifier pipe, the one end butt of second heat conduction pole 120 is at the back of second power amplifier pipe for the front of first power amplifier pipe all faces same one side with the front of second power amplifier pipe, can make full use of this side space, effectively reduces the requirement to air cavity height when first power amplifier pipe and second power amplifier pipe symmetric distribution. Therefore, the space for placing the first power amplifier tube and the second power amplifier tube is not limited by the heights of the long sides of the waveguide input port 610 and the waveguide output port, so that the sizes of the waveguide input port 610 and the waveguide output port can be reduced, the microwave power synthesis with higher frequency can be realized, and the adaptability of the microwave power synthesis amplifier 10 can be effectively improved.
Meanwhile, the thickness of the supporting seat 200 can be further reduced, so that the distance between the first power amplification tube and the second power amplification tube is closer, the size of the microwave power synthesis amplifier 10 is smaller, and the integration of the system is more facilitated. Alternatively, more supporting seats 200 and second antenna plates 500 may be further added to achieve higher output power requirements.
In this embodiment, two second power amplification tubes are provided, and the second power amplification tubes correspond to the second through holes 510 in parallel. Of course, in other embodiments, the second power amplifier tube may be one.
In this embodiment, the second power amplifier tube is located in the second through hole 510. Of course, in other embodiments, the second power amplifier tube is located on the second antenna board 500 and completely or partially covers the second through hole 510, so long as the second heat conduction rod 120 can be abutted against the back surface of the second power amplifier tube.
Specifically, the first antenna board 300 is further provided with a third through hole 320, and the supporting seat 200 is provided with a fourth through hole 210, where the fourth through hole 210 is communicated with the third through hole 320 and the second through hole 510. One end of the second heat conducting rod 120 sequentially passes through the third through hole 320 and the fourth through hole 210 and stretches into the second through hole 510 to be abutted against the back surface of the second power amplification tube, so that the contact between the second heat conducting rod 120 and the second power amplification tube is more convenient, and the heat generated by the second power amplification tube is more effectively transferred to the heat dissipation seat 100.
The first heat conducting rod 110 and the second heat conducting rod 120 are arranged in parallel at intervals, so that the projections of the first power amplification tube and the second power amplification tube on the heat dissipation base 100 are not overlapped, and the heat dissipation efficiency of the first power amplification tube and the second power amplification tube is effectively improved. Meanwhile, in space, the first power amplifier tube and the second power amplifier tube are located at different heights, so that mutual coupling interference of the first power amplifier tube and the second power amplifier tube is further effectively avoided. In this embodiment, the number of the first heat conducting rods 110 may be two to achieve the respective heat dissipation of the two first power amplifier tubes. Specifically, there are two first heat conducting rods 110, and the two first heat conducting rods 110 are arranged in parallel at intervals.
In particular, in the present embodiment, the first and second heat conductive rods 110 and 120 are made of copper. Of course, in other embodiments, the first heat conducting rod 110 and the second heat conducting rod 120 may be made of other materials with better heat conducting effect.
The first power amplifier tube is fixed on the terminal surface of first heat conduction pole 110 one end, and the second power amplifier tube is fixed on the terminal surface of second heat conduction pole 120 one end, further effectively fixes first power amplifier tube and second power amplifier tube, makes first power amplifier tube and first heat conduction pole 110 more effectively contact simultaneously, and the second power amplifier tube contacts more effectively with second heat conduction pole 120, still further improves the radiating efficiency of first power amplifier tube and second power amplifier tube. In particular, in the present embodiment, the first power amplifier tube is welded to the end face of one end of the first heat conducting rod 110, and the second power amplifier tube is welded to the end face of one end of the second heat conducting rod 120.
In this embodiment, the heat dissipation base 100 is made of copper, which has a good heat dissipation effect, and can effectively dissipate heat on the first power amplifier tube and the second power amplifier tube. Of course, in other embodiments, the heat sink 100 may be made of other materials with better heat dissipation effect.
Specifically, the heat sink 100 is provided with a plurality of heat sinks disposed at intervals, and the heat dissipation efficiency of the heat sink 100 can be further improved by the heat sinks.
Referring to fig. 3, a first mounting groove 130 is formed on a surface of the heat sink 100 facing the supporting seat 200, and the first heat conducting rod 110 and the second heat conducting rod 120 are disposed on a bottom wall of the first mounting groove 130. The surface of the supporting seat 200 facing the heat sink 100 is provided with a first accommodating groove 220, and the first accommodating groove 220 is communicated with the first mounting groove 130 to form a first accommodating cavity. The first antenna board 300 is disposed in the first mounting groove 130, and the front surface of the first power amplifier tube is disposed towards the first accommodating groove 220.
Because the first power amplifier tube is provided with the peripheral circuit, the first power amplifier tube and the peripheral circuit thereof need to be arranged in an air cavity with a certain height, and a wave absorbing material is arranged in the air cavity. The first antenna board 300 can be disposed on the heat sink 100 through the first mounting groove 130, and an air cavity required by the first power amplifier tube and its peripheral circuit can be formed through the first accommodating groove 220.
Specifically, the first antenna board 300 is fixed in the first mounting groove 130, so that the first antenna board 300 forms a good grounding and reliable electromagnetic structure. Specifically, in the present embodiment, the first antenna board 300 is soldered in the first mounting groove 130. Of course, in other embodiments, the first antenna board 300 may also be fixed in the first mounting groove 130 by screws or glue, etc.
Further, the size of the first mounting groove 130 matches the size of the first antenna board 300, further preventing the first antenna board 300 from moving relative to the heat sink 100.
Referring to fig. 4, a second mounting groove 230 is formed on a surface of the support base 200 facing the cover plate 400, and a second accommodating groove 410 is formed on a surface of the cover plate 400 facing the support base 200, where the second accommodating groove 410 is communicated with the second mounting groove 230 to form a second accommodating cavity. The second antenna board 500 is disposed in the second mounting groove 230, and the front surface of the second power amplifier tube is disposed towards the second accommodating groove 410.
Because the second power amplifier tube is provided with a peripheral circuit, the second power amplifier tube and the peripheral circuit thereof need to be arranged in an air cavity with a certain height, and a wave absorbing material is arranged in the air cavity. The second antenna board 500 can be disposed on the supporting seat 200 through the second mounting groove 230, and an air cavity required by the second power amplifier tube and its peripheral circuit can be formed through the second accommodating groove 410.
Specifically, the second antenna board 500 is fixed in the second mounting groove 230, so that the second antenna board 500 forms a good grounding and reliable electromagnetic structure. Specifically, in the present embodiment, the second antenna plate 500 is welded in the second mounting groove 230. Of course, in other embodiments, the second antenna board 500 may also be fixed in the second mounting groove 230 by screws or glue, etc.
Further, the size of the second mounting groove 230 matches the size of the second antenna plate 500, further preventing the second antenna plate 500 from moving relative to the support base 200.
A metal partition (not shown) is disposed on the bottom wall of the second accommodating groove 410, and the metal partition corresponds to between the first power amplifier tube and the second power amplifier tube. The first power amplifier tube and the second power amplifier tube are further isolated through the metal partition plate, and mutual coupling interference of the first power amplifier tube and the second power amplifier tube is further avoided.
Referring to fig. 1 and 2 again, a first groove 140 is formed in the bottom wall of the first mounting groove 130, the first groove 140 penetrates through a side wall of the heat sink 100, a first through groove 240 is formed in the bottom wall of the first accommodating groove 220, the first through groove 240 penetrates through a side wall of the supporting seat 200, a second groove 420 is formed in the surface of the cover plate 400 facing the supporting seat 200, the second groove 420 penetrates through a side wall of the cover plate 400 and is communicated with the second accommodating groove 410, and the first groove 140 is communicated with the first through groove 240 and the second groove 420 to form a waveguide input port 610.
The bottom wall of the first mounting groove 130 is further provided with a third groove 150, the third groove 150 penetrates through the other opposite side wall of the heat dissipation seat 100, the bottom wall of the first accommodating groove 220 is further provided with a second through groove 250, the second through groove 250 penetrates through the other opposite side wall of the supporting seat 200, the surface of the cover plate 400 facing the supporting seat 200 is further provided with a fourth groove 430, the fourth groove 430 penetrates through the other opposite side wall of the cover plate 400 and is communicated with the second accommodating groove 410, and the third groove 150 is communicated with the second through groove 250 and the fourth groove 430 to form a waveguide output port.
The first antenna board 300 and the second antenna board 500 are active antenna boards, and the active antenna boards include input dual-path fin-microstrip conversion, delay microstrip transmission line, and output microstrip-fin-line conversion. The delay microstrip transmission line is used to align the phase between the first antenna plate 300 and the second antenna plate 500. Specifically, the front face of the first power amplification tube and the front face of the second power amplification tube face the same side.
The front surface of the first power amplifier tube and the front surface of the second power amplifier tube face the same side, so that the mutual coupling interference between the first power amplifier tube and the peripheral circuit thereof and the mutual coupling interference between the second power amplifier tube and the peripheral circuit thereof are small. Therefore, the thickness of the supporting seat 200 can be further reduced, so that the depths of the first through slot 240 and the second through slot 250 are smaller, and the dimensions of the waveguide input port 610 and the waveguide output port are smaller, so as to be suitable for higher microwave frequency bands.
Meanwhile, when the dimensions of the waveguide input port 610 and the waveguide output port are unchanged, the thickness of the supporting seat 200 can be further reduced, so that more second antenna plates 500 and supporting seats 200 for supporting the second antenna plates 500 can be further increased, and the output power of the microwave power combining amplifier 10 can be further improved, so that the microwave power combining amplifier 10 is suitable for products or devices requiring higher power output.
Of course, in another embodiment, the number of the second antenna boards 500 may be at least two, the number of the supporting seats 200 corresponds to the number of the second antenna boards 500, and every two adjacent supporting seats 200 are stacked on each other and jointly enclose a third accommodating cavity, and each third accommodating cavity is provided with a second antenna board 500 therein. The output power of the microwave power combining amplifier 10 can be further increased by adding the second antenna plate 500.
Specifically, the number of the second heat conductive rods 120 corresponds to the number of the second antenna boards 500, wherein one end of a second heat conductive rod 120 sequentially passes through the first antenna board 300, the support base 200 closest to the first antenna board 300, and extends into the second through hole 510 closest to the first antenna board 300 to be abutted against the back surface of the second power amplifier tube on the second antenna board 500 closest to the first antenna board 300. For the second antenna board 500 far from the first antenna board 300, one end of the other second heat conducting rod 120 sequentially passes through the first antenna board 300, the supporting seat 200 and the second antenna board 500 between the second antenna board 500 and the heat dissipation seat 100, and stretches into the second through hole 510 on the second antenna board 500 to be abutted against the back surface of the second power amplifier tube on the second antenna board 500.
The heat on the second antenna board 500 can be led to the heat dissipation seat 100 through the second heat conduction rod 120, and the heat is dissipated by the heat dissipation seat 100, so that the volume and the weight of the microwave power synthesis amplifier 10 can be smaller, and the integration of the system is facilitated.
For example, the number of the second antenna plates 500 is two, and the number of the supporting seats 200 and the number of the second heat conducting rods 120 are two corresponding to the number of the second antenna plates 500. Two supporting seats 200 are stacked on each other, wherein one second antenna board 500 is located between the two supporting seats 200, and the other second antenna board 500 is located between the supporting seat 200 and the cover plate 400.
One end of the second heat conducting rod 120 sequentially passes through the first antenna plate 300, the supporting seat 200 close to the first antenna plate 300 and stretches into the second through hole 510 close to the first antenna plate 300 to be abutted against the back surface of the second power amplifier tube on the second antenna plate 500 close to the first antenna plate 300. One end of the other second heat conducting rod 120 sequentially passes through the first antenna board 300, the two supporting seats 200 and the second antenna board 500 close to the first antenna board 300, and stretches into the second through hole 510 on the second antenna board 500 far from the first antenna board 300 to be abutted against the back surface of the second power amplifier tube far from the first antenna board 300. By providing two second antenna plates 500, the number of second power amplification tubes is increased, and thus the output power of the microwave power combining amplifier 10 is increased.
The microwave power combining amplifier 10 has at least the following advantages:
during installation, the first antenna board 300 is disposed in the first mounting groove 130, so that the front surface of the first power amplifier tube faces the first accommodating groove 220, one end of the first heat conducting rod 110, far away from the heat dissipation seat 100, extends into the first through hole 310 on the first antenna board 300, and the back surface of the first power amplifier tube is fixed on the end surface of one end of the first heat conducting rod 110. Therefore, the heat generated by the first power amplifier tube can be transferred to the heat dissipation base 100 by the first heat conduction rod 110 for heat dissipation. The second antenna board 500 is disposed in the second mounting groove 230, so that the front surface of the second power amplifier tube faces the second accommodating groove 410, and the far end of the second heat conducting rod 120 sequentially passes through the third through hole 320 and the fourth through hole 210 and stretches into the second through hole 510, and the back surface of the second power amplifier tube is fixed on the end surface of one end of the second heat conducting rod 120. Therefore, the heat generated by the second power amplifier tube can be transferred to the heat dissipation seat 100 by the second heat conduction rod 120 to dissipate heat, so that the first power amplifier tube and the second power amplifier tube are simultaneously dissipated by the heat dissipation seat 100, and the first antenna board 300 and the second antenna board 500 are further dissipated by the same side, so that the number of heat dissipation elements can be reduced, the size and weight of the microwave power synthesis amplifier 10 can be smaller, and the integration of an electronic system is facilitated.
Because the front of the first power amplifier tube is arranged towards the supporting seat 200, the front of the second power amplifier tube is arranged towards the cover plate 400, so that the front of the first power amplifier tube and the front of the second power amplifier tube face the same side, the side space can be fully utilized, the air cavities required by the first power amplifier tube and the peripheral circuits thereof and the second power amplifier tube and the peripheral circuits thereof are formed, the restriction of the sizes of the waveguide input port 610 and the waveguide output port on the air cavities is reduced, the sizes of the waveguide input port 610 and the waveguide output port can be reduced, the microwave power synthesis amplifier 10 is suitable for higher microwave frequency bands, and the adaptability of the microwave power synthesis amplifier 10 is effectively improved.
Meanwhile, when the dimensions of the waveguide input port 610 and the waveguide output port are unchanged, the thickness of the supporting seat 200 can be further reduced, so that more second antenna plates 500 and supporting seats 200 for supporting the second antenna plates 500 can be further increased, and the output power of the microwave power combining amplifier 10 can be further improved, so that the microwave power combining amplifier 10 is suitable for products or devices requiring higher power output.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (8)
1. The utility model provides a microwave power synthesis amplifier which characterized in that, waveguide input port has been seted up to one side of microwave power synthesis amplifier, and waveguide output port has been seted up to opposite side, microwave power synthesis amplifier includes:
the heat dissipation seat is provided with a first heat conduction rod and a second heat conduction rod which is arranged in parallel with the first heat conduction rod;
the support seat is arranged on one side of the radiating seat, a first accommodating cavity is formed by the support seat and the radiating seat in a surrounding mode, the first heat conducting rod and the second heat conducting rod are both positioned on one side, facing the support seat, of the radiating seat and are positioned in the first accommodating cavity, and the first accommodating cavity is communicated with the waveguide input port and the waveguide output port;
the first antenna board is arranged in the first accommodating cavity, a first power amplification tube is arranged on the first antenna board, a first through hole is formed in the first antenna board, the first power amplification tube corresponds to the first through hole, the first power amplification tube is provided with a front face and a back face which is opposite to the front face, and one end of the first heat conduction rod, which is far away from the heat dissipation seat, extends into the first through hole and is abutted to the back face of the first power amplification tube;
the cover plate is covered on one side of the supporting seat, which is opposite to the heat dissipation seat, and the cover plate and the supporting seat jointly enclose a second accommodating cavity which is communicated with the waveguide input port and the waveguide output port; a kind of electronic device with high-pressure air-conditioning system
The second antenna board is arranged in the second accommodating cavity, a second power amplification tube is arranged on the second antenna board, a second through hole is formed in the second antenna board, the second power amplification tube corresponds to the second through hole, the second power amplification tube is provided with a front face and a back face which is opposite to the front face, and one end of the second heat conduction rod, which is far away from the heat dissipation seat, sequentially penetrates through the first antenna board, the support seat and stretches into the second through hole to be in butt joint with the back face of the second power amplification tube; the first heat conducting rod and the second heat conducting rod are arranged at intervals, so that the projection of the first power amplification tube and the second power amplification tube on the heat dissipation seat is not overlapped; the heat dissipation seat is towards the first mounting groove is formed in the surface of the support seat, the first heat conduction rod and the second heat conduction rod are arranged on the bottom wall of the first mounting groove, the support seat is towards the first containing groove is formed in the surface of the heat dissipation seat, the first containing groove is communicated with the first mounting groove to form the first containing cavity, the first antenna board is arranged in the first mounting groove, and the front face of the first power amplification tube is arranged towards the first containing groove.
2. The microwave power combining amplifier of claim 1, wherein the first power amplifying tube is fixed to an end face of one end of the first heat conducting rod, and the second power amplifying tube is fixed to an end face of one end of the second heat conducting rod.
3. The microwave power synthesis amplifier according to claim 1, wherein a second mounting groove is formed in a surface of the support base facing the cover plate, a second accommodating groove is formed in a surface of the cover plate facing the support base, the second accommodating groove is communicated with the second mounting groove to form the second accommodating cavity, the second antenna board is arranged in the second mounting groove, and a front surface of the second power amplification tube is arranged facing the second accommodating groove.
4. A microwave power combining amplifier according to claim 3, wherein a metal partition is provided on a bottom wall of the second accommodating groove, and the metal partition corresponds to between the first power amplifying tube and the second power amplifying tube.
5. The microwave power synthesis amplifier according to claim 3, wherein a bottom wall of the first installation groove is provided with a first groove, the first groove penetrates through a side wall of the heat dissipation base, a bottom wall of the first accommodation groove is provided with a first through groove, the first through groove penetrates through a side wall of the support base, a surface of the cover plate facing the support base is provided with a second groove, the second groove penetrates through a side wall of the cover plate and is communicated with the second accommodation groove, and the first groove is communicated with the first through groove and the second groove to form the waveguide input port; the bottom wall of the first mounting groove is also provided with a third groove, the third groove penetrates through the other opposite side wall of the heat dissipation seat, the bottom wall of the first accommodating groove is also provided with a second through groove, the second through groove penetrates through the other opposite side wall of the supporting seat, the cover plate faces the supporting seat, the surface of the cover plate is also provided with a fourth groove, the fourth groove penetrates through the other opposite side wall of the cover plate and is communicated with the second accommodating groove, and the third groove is communicated with the second through groove and the fourth groove to form the waveguide output port.
6. The microwave power combining amplifier according to any one of claims 1-5, wherein the number of the second antenna plates is at least two, the second power amplifying tubes are disposed on each of the second antenna plates, the number of the supporting seats corresponds to the number of the second antenna plates, and every two adjacent supporting seats are stacked on each other and jointly enclose a third accommodating cavity, and each third accommodating cavity is provided with one of the second antenna plates.
7. The microwave power combining amplifier of claim 6, wherein the number of the second heat conducting rods corresponds to the number of the second antenna boards, wherein one end of one second heat conducting rod sequentially passes through the first antenna board, the support seat closest to the first antenna board and stretches into the second through hole closest to the first antenna board to be abutted against the back surface of the second power amplifying tube on the second antenna board closest to the first antenna board; for the second antenna board far away from the first antenna board, one end of the other second heat conducting rod sequentially penetrates through the first antenna board, the supporting seat and the second antenna board between the second antenna board and the heat radiating seat and stretches into the second through hole on the second antenna board to be abutted to the back surface of the second power amplifier tube on the second antenna board.
8. The microwave power combining amplifier of any of claims 1-5, wherein the first antenna plate and the second antenna plate are active antenna plates, the active antenna plates including an input dual-path fin-to-microstrip transition first microwave transmission line, a delay microstrip transmission line first antenna, and an output microstrip-to-fin transition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810495132.4A CN108696254B (en) | 2018-05-22 | 2018-05-22 | Microwave power synthesis amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810495132.4A CN108696254B (en) | 2018-05-22 | 2018-05-22 | Microwave power synthesis amplifier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108696254A CN108696254A (en) | 2018-10-23 |
| CN108696254B true CN108696254B (en) | 2023-12-26 |
Family
ID=63846843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810495132.4A Active CN108696254B (en) | 2018-05-22 | 2018-05-22 | Microwave power synthesis amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108696254B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346376A (en) * | 2013-06-27 | 2013-10-09 | 中国电子科技集团公司第四十一研究所 | Gradual change fin line extension waveguide space power distribution synthesizer |
| CN104467708A (en) * | 2014-12-22 | 2015-03-25 | 中国电子科技集团公司第五十四研究所 | C-band space power synthesis solid-state power amplifier |
| CN208353296U (en) * | 2018-05-22 | 2019-01-08 | 广州联星科技有限公司 | microwave power combining amplifier |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030027530A1 (en) * | 2001-07-17 | 2003-02-06 | Netro Corporation | Highly integrated planar stacked millimeter wave transceiver |
| US10218325B2 (en) * | 2016-04-27 | 2019-02-26 | California Institute Of Technology | Spatial power combining mechanism (SPCM) for the generation and amplification of electromagnetic radiation |
-
2018
- 2018-05-22 CN CN201810495132.4A patent/CN108696254B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346376A (en) * | 2013-06-27 | 2013-10-09 | 中国电子科技集团公司第四十一研究所 | Gradual change fin line extension waveguide space power distribution synthesizer |
| CN104467708A (en) * | 2014-12-22 | 2015-03-25 | 中国电子科技集团公司第五十四研究所 | C-band space power synthesis solid-state power amplifier |
| CN208353296U (en) * | 2018-05-22 | 2019-01-08 | 广州联星科技有限公司 | microwave power combining amplifier |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108696254A (en) | 2018-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI680642B (en) | Solid state microwave generator and power amplifier | |
| CN107611545B (en) | Roundabout type broadband efficient multi-path space power synthesis network | |
| KR102233029B1 (en) | Antenna apparatus | |
| US7002429B2 (en) | Nonreflective waveguide terminator and waveguide circuit | |
| EP3370306A1 (en) | High-frequency antenna module and array antenna device | |
| CN105375906A (en) | Amplitude limiting unit circuit, installation device, single-stage amplitude limiting circuit, and amplitude limiting device | |
| CN212116087U (en) | Electromagnetic shielding cover and electronic product | |
| CN108696254B (en) | Microwave power synthesis amplifier | |
| KR101833241B1 (en) | Spatial power combiner for millimeter wave having transition substrates with different width | |
| US11637361B2 (en) | Antenna structure and wireless communication device | |
| KR101841723B1 (en) | Assembly for radio-frequency (rf) power coupling and method of using the assembly | |
| KR20160058775A (en) | Device for radio-frequency power coupling and method of using the device | |
| TW201834310A (en) | Wireless communication device | |
| CN208353296U (en) | microwave power combining amplifier | |
| KR20210102459A (en) | Radiation amplifiers in radio devices, radiating systems and radio devices | |
| CN204333200U (en) | The spatial power combiner of a kind of waveguide-bis-Coupler in finline-microstrip line form | |
| JP6022136B1 (en) | High frequency power amplifier | |
| KR101588129B1 (en) | Wireless communication apparatus and method for manufacturing wireless communication apparatus | |
| CN104538718A (en) | Waveguide double antipodal fin-line and microstrip line type space power synthesizer | |
| KR101949672B1 (en) | Compact mmWave power amplifier with three dimensional structure | |
| CN205142162U (en) | Amplitude limiting element circuit and installation device , single -stage limit circuit and clipper -limiter | |
| WO2023098648A1 (en) | Active antenna unit and base station | |
| CN212033227U (en) | Multi-port miniaturized 5G rectangular lobe reflector lamp antenna | |
| CN214378783U (en) | P wave band ferrite piece isolator | |
| CN212649448U (en) | Small-size receiving and dispatching subassembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |