CN108615000B - Manufacturing method of high-adhesion thinned fingerprint module - Google Patents
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- CN108615000B CN108615000B CN201810354975.2A CN201810354975A CN108615000B CN 108615000 B CN108615000 B CN 108615000B CN 201810354975 A CN201810354975 A CN 201810354975A CN 108615000 B CN108615000 B CN 108615000B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/06—Copolymers with styrene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2244—Oxides; Hydroxides of metals of zirconium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
The invention discloses a manufacturing method of a high-adhesion thinned fingerprint module, and relates to the field of fingerprint modules; the method comprises the following steps: (1) packaging the fingerprint identification chip on a PCB (printed Circuit Board) by an SMT (surface mount technology); (2) wrapping the side surface of the fingerprint chip with an elastic material; (3) laser square patterns are formed on the bottom of the metal ring, underfil glue is dispensed, defoaming and baking are carried out, conductive silver glue and structural glue are dispensed on the side face of the metal ring after baking is carried out, and secondary baking is carried out; (4) attaching the treated metal ring to an elastic material, and baking at constant pressure; (5) performing laser square pattern on the bottom of the PCB and the upper part of the reinforcing plate, gluing the spot structure glue, and baking; (6) structural glue is dispensed on the cover plate, and the cover plate is attached to the fingerprint identification chip to obtain the high-adhesion thinned fingerprint module; the fingerprint module manufactured by the invention has thinner thickness, and the gap between the metal ring and the chip is more uniform and smaller.
Description
The technical field is as follows:
the invention relates to the field of fingerprint modules, in particular to a manufacturing method of a thinning fingerprint module with strong adhesion.
Background art:
the fingerprint module is a core component of the fingerprint lock, is installed on devices such as a fingerprint access control device or a hard disk and is used for finishing fingerprint acquisition and fingerprint identification.
The fingerprint identification system collects, analyzes and compares the living fingerprints through special photoelectric conversion equipment and a computer image processing technology, and can quickly and accurately identify the personal identity. The system generally mainly comprises processes of fingerprint image acquisition, fingerprint image processing, feature extraction, feature value comparison and matching and the like. The modern electronic integrated manufacturing technology enables fingerprint image reading and processing equipment to be miniaturized, meanwhile, the rapidly developed personal computer operation speed provides the possibility of fingerprint comparison operation on a microcomputer or even a single chip microcomputer, and the accuracy of identification results is guaranteed by excellent fingerprint processing and comparison algorithms.
In the equipment of present fingerprint module, the becket just glues on the fingerprint chip after the laminating of glass apron, and this kind of operation makes the becket produce the displacement easily when the pressurize toasts, leads to the big one side in gap between becket and the chip little on one side, seriously influences outward appearance and use, and it is low to cause experience satisfaction for the user, and thickness is thick on the contrary moreover, has restricted the application universality of fingerprint module.
The invention content is as follows:
the technical problem to be solved by the invention is to provide the manufacturing method of the thinning fingerprint module with strong adhesion, the thickness of the manufactured fingerprint module can be thinned by 0.15mm, the manufactured fingerprint module has better adhesion, the application universality of the fingerprint module is improved, and the service life of the fingerprint module is prolonged.
The technical problem to be solved by the invention is realized by adopting the following technical scheme:
the manufacturing method of the thinning fingerprint module with strong adhesion comprises the following steps:
(1) packaging the fingerprint identification chip on a PCB (printed Circuit Board) by an SMT (surface mount technology);
(2) wrapping the side surface of the fingerprint chip assembled in the step (1) with an elastic material, and baking the fingerprint chip in a baking machine at the temperature of 110-;
(3) square patterns are radiussed on the bottom of the metal ring, undercut glue is dispensed after the square patterns are radiussed, deaeration and baking are carried out, conductive silver glue and structural glue are dispensed on the side face of the metal ring after baking is carried out, and secondary baking is carried out;
(4) attaching the metal ring processed in the step (3) to the elastic material processed in the step (2), and baking at constant pressure;
(5) performing laser square pattern on the bottom of the PCB and the upper part of the reinforcing plate, gluing the spot structure glue, and baking;
(6) the point structure is glued on the apron, with the apron laminating on the fingerprint identification chip, makes the attenuate fingerprint module of strong adhesion nature.
Preferably, the secondary baking temperature in the step (3) is 140-.
Preferably, the side length of the square patterns in the step (3) and the step (5) is 0.5mm, and the depth is 0.2 mm.
Preferably, the elastic material in the step (2) comprises the following raw materials in parts by weight: 12-16 parts of methyl ethyl ketone, 18-20 parts of polysiloxane, 40-60 parts of styrene butadiene rubber, 10-12 parts of calcium carbonate, 30-40 parts of cis-1, 4-polyisoprene, 18-25 parts of palmitic acid and 5-10 parts of zirconium oxide.
Preferably, the preparation method of the elastic material comprises the following steps: (1) preparing 5-8% sodium hydroxide solution, adding butadiene styrene rubber and cis-1, 4-polyisoprene into the sodium hydroxide solution, stirring, placing into a 40-50 deg.C oven, keeping temperature for 20min, and adding hydrochloric acid until the solution is neutral; (2) uniformly mixing methyl ethyl ketone and polysiloxane, adding into an activating agent for activation for 30min, heating to 60-70 ℃, preserving heat for 1-2h, and then heating to 80-90 ℃, preserving heat for 15 min; (3) uniformly mixing the mixture prepared in the step (1) and the step (2), adding calcium carbonate, palmitic acid and zirconium oxide, uniformly stirring in a high-speed stirrer, heating to 130-.
Preferably, the preparation method of the activating agent in the step (2) comprises the following steps: (1) dissolving potassium permanganate and sodium chloride in water, and stirring at 35-45 deg.C for 30 min; (2) and (2) adding a ferrous sulfate solution with the mass concentration of 2.5% and a citric acid solution with the concentration of 12-15% into the mixed solution in the step (1), and performing ultrasonic treatment for 40min to obtain the softener.
Preferably, the mass concentration of the potassium permanganate in the step (1) is 3.5-4.5%, and the mass concentration of the sodium chloride is 5-7%.
The invention has the beneficial effects that: the invention provides a manufacturing method of a thinning fingerprint module with strong adhesion, which is characterized in that an elastic material is arranged between a fingerprint identification chip and a metal ring, when the metal ring is about to displace after being baked at high temperature, the displacement of the metal ring can be corrected due to the existence of the elastic material, so that the gap between the metal ring and the fingerprint chip is kept consistent everywhere, and the gap width can be reduced or the gap can not exist according to the requirement due to the existence of the elastic material.
The cover plate is attached after the metal rings are attached, so that gaps between the cover plate and the metal rings can be better controlled, and the problem that gaps between the cover plate and the metal rings are large on one side and small on the other side due to the fact that the cover plate is attached after the metal rings are attached in the prior art is solved.
Through radium-shine square decorative pattern on becket and circuit board to glue on the decorative pattern, make the whole thickness of fingerprint module obtain the attenuate, and the adhesion of glue and becket and circuit board obtains very big improvement, thereby has increased the adhesion of fingerprint module.
The specific implementation mode is as follows:
in order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Example 1:
the manufacturing method of the thinning fingerprint module with strong adhesion comprises the following steps:
(1) packaging the fingerprint identification chip on a PCB (printed Circuit Board) by an SMT (surface mount technology);
(2) wrapping the side surface of the fingerprint chip assembled in the step (1) with an elastic material, and baking the fingerprint chip in a baking machine at 110 ℃ for 1 h;
(3) square patterns are radiussed on the bottom of the metal ring, undercut glue is dispensed after the square patterns are radiussed, deaeration and baking are carried out, conductive silver glue and structural glue are dispensed on the side face of the metal ring after baking is carried out, and secondary baking is carried out;
(4) attaching the metal ring processed in the step (3) to the elastic material processed in the step (2), and baking at constant pressure;
(5) performing laser square pattern on the bottom of the PCB and the upper part of the reinforcing plate, gluing the spot structure glue, and baking;
(6) the point structure is glued on the apron, with the apron laminating on the fingerprint identification chip, makes the attenuate fingerprint module of strong adhesion nature.
The secondary baking temperature in the step (3) is 120 ℃, the time is 2 hours, the constant-pressure baking temperature in the step (4) is 140 ℃, the pressure is 0.2Mpa, the time is 4 hours, the baking temperature in the step (5) is 130 ℃, and the time is 1 hour.
And (5) the side length of the square patterns in the steps (3) and (5) is 0.5mm, and the depth of the square patterns is 0.2 mm.
The elastic material in the step (2) comprises the following raw materials in parts by weight: 14 parts of methyl ethyl ketone, 20 parts of polysiloxane, 40 parts of styrene butadiene rubber, 11 parts of calcium carbonate, 30 parts of cis-1, 4-polyisoprene, 20 parts of palmitic acid and 5 parts of zirconium oxide.
The preparation method of the elastic material comprises the following steps: (1) preparing 8% sodium hydroxide solution, adding butadiene styrene rubber and cis-1, 4-polyisoprene into the sodium hydroxide solution, stirring uniformly, placing into a 40 ℃ oven, preserving the temperature for 20min, and adding hydrochloric acid until the solution is neutral; (2) uniformly mixing methyl ethyl ketone and polysiloxane, adding the mixture into an activating agent for activation for 30min, heating to 65 ℃, preserving heat for 1h, and then heating to 90 ℃, preserving heat for 15 min; (3) and (3) uniformly mixing the mixture prepared in the step (1) and the mixture prepared in the step (2), adding calcium carbonate, palmitic acid and zirconium oxide, uniformly stirring in a high-speed stirrer, heating to 135 ℃, and feeding into an extruder to extrude into a sheet material.
The preparation method of the activating agent in the step (2) comprises the following steps: (1) dissolving potassium permanganate and sodium chloride in water, and stirring at 40 deg.C for 30 min; (2) and (2) adding a ferrous sulfate solution with the mass concentration of 2.5% and a citric acid solution with the concentration of 12% into the mixed solution in the step (1), and performing ultrasonic treatment for 40min to obtain the softener.
The mass concentration of the potassium permanganate in the step (1) is 4.5%, and the mass concentration of the sodium chloride is 5%.
Example 2:
the manufacturing method of the thinning fingerprint module with strong adhesion comprises the following steps:
(1) packaging the fingerprint identification chip on a PCB (printed Circuit Board) by an SMT (surface mount technology);
(2) wrapping the side surface of the fingerprint chip assembled in the step (1) with an elastic material, and baking the fingerprint chip in a baking machine at 120 ℃ for 2 hours;
(3) square patterns are radiussed on the bottom of the metal ring, undercut glue is dispensed after the square patterns are radiussed, deaeration and baking are carried out, conductive silver glue and structural glue are dispensed on the side face of the metal ring after baking is carried out, and secondary baking is carried out;
(4) attaching the metal ring processed in the step (3) to the elastic material processed in the step (2), and baking at constant pressure;
(5) performing laser square pattern on the bottom of the PCB and the upper part of the reinforcing plate, gluing the spot structure glue, and baking;
(6) the point structure is glued on the apron, with the apron laminating on the fingerprint identification chip, makes the attenuate fingerprint module of strong adhesion nature.
The secondary baking temperature in the step (3) is 130 ℃, the time is 3 hours, the constant-pressure baking temperature in the step (4) is 160 ℃, the pressure is 0.2Mpa, the time is 5 hours, the baking temperature in the step (5) is 120 ℃, and the time is 2 hours.
And (5) the side length of the square patterns in the steps (3) and (5) is 0.5mm, and the depth of the square patterns is 0.2 mm.
The elastic material in the step (2) comprises the following raw materials in parts by weight: 12 parts of methyl ethyl ketone, 19 parts of polysiloxane, 60 parts of styrene butadiene rubber, 12 parts of calcium carbonate, 40 parts of cis-1, 4-polyisoprene, 25 parts of palmitic acid and 10 parts of zirconium oxide.
The preparation method of the elastic material comprises the following steps: (1) preparing a sodium hydroxide solution with the concentration of 6%, adding styrene butadiene rubber and cis-1, 4-polyisoprene into the sodium hydroxide solution, uniformly stirring, placing the mixture into a 45 ℃ oven for heat preservation for 20min, and adding hydrochloric acid until the solution is neutral; (2) uniformly mixing methyl ethyl ketone and polysiloxane, adding the mixture into an activating agent for activation for 30min, heating to 70 ℃, preserving heat for 2h, and then heating to 80 ℃, and preserving heat for 15 min; (3) and (3) uniformly mixing the mixture prepared in the step (1) and the mixture prepared in the step (2), adding calcium carbonate, palmitic acid and zirconium oxide, uniformly stirring in a high-speed stirrer, heating to 130 ℃, and feeding into an extruder to extrude into a sheet material.
The preparation method of the activating agent in the step (2) comprises the following steps: (1) dissolving potassium permanganate and sodium chloride in water, and stirring at 45 deg.C for 30 min; (2) and (2) adding a ferrous sulfate solution with the mass concentration of 2.5% and a citric acid solution with the concentration of 13% into the mixed solution in the step (1), and performing ultrasonic treatment for 40min to obtain the softener.
The mass concentration of the potassium permanganate in the step (1) is 4%, and the mass concentration of the sodium chloride is 6%.
Example 3:
the manufacturing method of the thinning fingerprint module with strong adhesion comprises the following steps:
(1) packaging the fingerprint identification chip on a PCB (printed Circuit Board) by an SMT (surface mount technology);
(2) wrapping the side surface of the fingerprint chip assembled in the step (1) with an elastic material, and baking the fingerprint chip in a baking machine at 130 ℃ for 1 h;
(3) square patterns are radiussed on the bottom of the metal ring, undercut glue is dispensed after the square patterns are radiussed, deaeration and baking are carried out, conductive silver glue and structural glue are dispensed on the side face of the metal ring after baking is carried out, and secondary baking is carried out;
(4) attaching the metal ring processed in the step (3) to the elastic material processed in the step (2), and baking at constant pressure;
(5) performing laser square pattern on the bottom of the PCB and the upper part of the reinforcing plate, gluing the spot structure glue, and baking;
(6) the point structure is glued on the apron, with the apron laminating on the fingerprint identification chip, makes the attenuate fingerprint module of strong adhesion nature.
The secondary baking temperature in the step (3) is 140 ℃, the time is 2 hours, the constant-pressure baking temperature in the step (4) is 150 ℃, the pressure is 0.2Mpa, the time is 3 hours, and the baking temperature in the step (5) is 140 ℃, and the time is 1 hour.
And (5) the side length of the square patterns in the steps (3) and (5) is 0.5mm, and the depth of the square patterns is 0.2 mm.
The elastic material in the step (2) comprises the following raw materials in parts by weight: 16 parts of methyl ethyl ketone, 18 parts of polysiloxane, 50 parts of styrene butadiene rubber, 10 parts of calcium carbonate, 35 parts of cis-1, 4-polyisoprene, 18 parts of palmitic acid and 8 parts of zirconium oxide.
The preparation method of the elastic material comprises the following steps: (1) preparing a sodium hydroxide solution with the concentration of 5%, adding styrene butadiene rubber and cis-1, 4-polyisoprene into the sodium hydroxide solution, uniformly stirring, putting into a 50 ℃ oven, preserving the temperature for 20min, and adding hydrochloric acid until the solution is neutral; (2) uniformly mixing methyl ethyl ketone and polysiloxane, adding the mixture into an activating agent for activation for 30min, heating to 60 ℃, preserving heat for 1h, and then heating to 85 ℃, and preserving heat for 15 min; (3) and (3) uniformly mixing the mixture prepared in the step (1) and the mixture prepared in the step (2), adding calcium carbonate, palmitic acid and zirconium oxide, uniformly stirring in a high-speed stirrer, heating to 140 ℃, and feeding into an extruder to extrude into a sheet material.
The preparation method of the activating agent in the step (2) comprises the following steps: (1) dissolving potassium permanganate and sodium chloride in water, and stirring at 35 ℃ for 30 min; (2) and (2) adding a ferrous sulfate solution with the mass concentration of 2.5% and a citric acid solution with the concentration of 15% into the mixed solution in the step (1), and performing ultrasonic treatment for 40min to obtain the softener.
In the step (1), the mass concentration of the potassium permanganate is 3.5%, and the mass concentration of the sodium chloride is 7%.
Comparative example:
a fingerprint module assembling method comprises the following steps:
(1) packaging the fingerprint identification chip on a PCB (printed Circuit Board) by an SMT (surface mount technology);
(2) dispensing structural glue on the cover plate, and attaching the cover plate on the fingerprint identification chip;
(3) dotting underfil glue at the bottom of the metal ring, defoaming and baking at the baking temperature of 130 ℃ for 4 hours, dotting conductive silver glue and structural glue on the side surface of the metal ring after baking, and baking again at the baking temperature of 90 ℃ for 30 minutes;
(4) attaching the dispensed metal ring on a fingerprint identification chip, and baking for 3h under the pressure of 0.3MPA and the constant pressure of 150 ℃;
carry out the gap detection to the fingerprint module of above each embodiment and comparative example equipment, the result is as follows:
| uniformity of gap | Maximum size of gap | Thickness of fingerprint module | |
| Example 1 | Uniformity | 0.03mm | 1.20mm |
| Example 2 | Uniformity | 0.04mm | 1.20mm |
| Example 3 | Uniformity | 0.03mm | 1.21mm |
| Comparative example | Unevenness of | 0.06mm | 1.35mm |
According to the table, the fingerprint module manufactured by the invention has thinner thickness, and the gap between the metal ring and the chip is more uniform and smaller.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a preparation method of attenuate fingerprint module of strong adhesion nature which characterized in that: the method comprises the following steps:
(1) packaging the fingerprint identification chip on a PCB (printed Circuit Board) by an SMT (surface mount technology);
(2) wrapping the side surface of the fingerprint chip assembled in the step (1) with an elastic material, and baking the fingerprint chip in a baking machine at the temperature of 110-;
(3) square patterns are radiussed on the bottom of the metal ring, undercut glue is dispensed after the square patterns are radiussed, deaeration and baking are carried out, conductive silver glue and structural glue are dispensed on the side face of the metal ring after baking is carried out, and secondary baking is carried out;
(4) attaching the metal ring processed in the step (3) to the elastic material processed in the step (2), and baking at constant pressure;
(5) performing laser square pattern on the bottom of the PCB and the upper part of the reinforcing plate, gluing the spot structure glue, and baking;
(6) the point structure is glued on the apron, with the apron laminating on the fingerprint identification chip, makes the attenuate fingerprint module of strong adhesion nature.
2. The manufacturing method of the strongly adhesive thinned fingerprint module according to claim 1, wherein the manufacturing method comprises the following steps: the secondary baking temperature in the step (3) is 140 ℃ plus 120 ℃, the time is 2-3h, the constant-pressure baking temperature in the step (4) is 160 ℃ plus 140 ℃, the pressure is 0.2Mpa, the time is 3-5h, the baking temperature in the step (5) is 140 ℃ plus 120 ℃, and the time is 1-2 h.
3. The manufacturing method of the strongly adhesive thinned fingerprint module according to claim 1, wherein the manufacturing method comprises the following steps: and (5) the side length of the square patterns in the steps (3) and (5) is 0.5mm, and the depth of the square patterns is 0.2 mm.
4. The manufacturing method of the strongly adhesive thinned fingerprint module according to claim 1, wherein the manufacturing method comprises the following steps: the elastic material in the step (2) comprises the following raw materials in parts by weight: 12-16 parts of methyl ethyl ketone, 18-20 parts of polysiloxane, 40-60 parts of styrene butadiene rubber, 10-12 parts of calcium carbonate, 30-40 parts of cis-1, 4-polyisoprene, 18-25 parts of palmitic acid and 5-10 parts of zirconium oxide.
5. The manufacturing method of the strongly adhesive thinned fingerprint module according to claim 3, wherein the manufacturing method comprises the following steps: the preparation method of the elastic material comprises the following steps: (1) preparing 5-8% sodium hydroxide solution, adding butadiene styrene rubber and cis-1, 4-polyisoprene into the sodium hydroxide solution, stirring, placing into a 40-50 deg.C oven, keeping temperature for 20min, and adding hydrochloric acid until the solution is neutral; (2) uniformly mixing methyl ethyl ketone and polysiloxane, adding into an activating agent for activation for 30min, heating to 60-70 ℃, preserving heat for 1-2h, and then heating to 80-90 ℃, preserving heat for 15 min; (3) uniformly mixing the mixture prepared in the step (1) and the step (2), adding calcium carbonate, palmitic acid and zirconium oxide, uniformly stirring in a high-speed stirrer, heating to 130-.
6. The manufacturing method of the strongly adhesive thinned fingerprint module according to claim 5, wherein the manufacturing method comprises the following steps: the preparation method of the activating agent in the step (2) comprises the following steps: (1) dissolving potassium permanganate and sodium chloride in water, and stirring at 35-45 deg.C for 30 min; (2) and (2) adding a ferrous sulfate solution with the mass concentration of 2.5% and a citric acid solution with the concentration of 12-15% into the mixed solution obtained in the step (1), and carrying out ultrasonic treatment for 40min to obtain the activator.
7. The manufacturing method of the strongly adhesive thinned fingerprint module according to claim 6, wherein the manufacturing method comprises the following steps: the mass concentration of the potassium permanganate in the step (1) is 3.5-4.5%, and the mass concentration of the sodium chloride is 5-7%.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1519545A (en) * | 2003-02-03 | 2004-08-11 | ��ʽ�����װ | Sensor device and ceramic encapsulated outer hull for electronic component |
| TWI242749B (en) * | 2004-04-14 | 2005-11-01 | Advanced Semiconductor Eng | Pressing type fingerprint sensor package |
| JP2007114126A (en) * | 2005-10-21 | 2007-05-10 | Fujitsu Ltd | Semiconductor device and method of manufacturing same |
| CN203858645U (en) * | 2014-04-04 | 2014-10-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification sensor packaging structure |
| CN107077619A (en) * | 2017-02-16 | 2017-08-18 | 深圳市汇顶科技股份有限公司 | Fingerprint press-key structure, key press detection method and electronic equipment |
-
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- 2018-04-19 CN CN201810354975.2A patent/CN108615000B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1519545A (en) * | 2003-02-03 | 2004-08-11 | ��ʽ�����װ | Sensor device and ceramic encapsulated outer hull for electronic component |
| TWI242749B (en) * | 2004-04-14 | 2005-11-01 | Advanced Semiconductor Eng | Pressing type fingerprint sensor package |
| JP2007114126A (en) * | 2005-10-21 | 2007-05-10 | Fujitsu Ltd | Semiconductor device and method of manufacturing same |
| CN203858645U (en) * | 2014-04-04 | 2014-10-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification sensor packaging structure |
| CN107077619A (en) * | 2017-02-16 | 2017-08-18 | 深圳市汇顶科技股份有限公司 | Fingerprint press-key structure, key press detection method and electronic equipment |
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