CN108447834B - Heat abstractor for be used for thyristor - Google Patents
Heat abstractor for be used for thyristor Download PDFInfo
- Publication number
- CN108447834B CN108447834B CN201810502522.XA CN201810502522A CN108447834B CN 108447834 B CN108447834 B CN 108447834B CN 201810502522 A CN201810502522 A CN 201810502522A CN 108447834 B CN108447834 B CN 108447834B
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- Prior art keywords
- heat dissipation
- heat
- thyristor
- sine wave
- plate
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 80
- 238000001816 cooling Methods 0.000 claims description 12
- 239000002826 coolant Substances 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000428 dust Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat dissipation device for a thyristor, which comprises a first heat dissipation part, a supporting part and a second heat dissipation part which are sequentially connected, wherein the thyristor is arranged between the first heat dissipation part and the supporting part; the first heat dissipation part comprises a plurality of channels; the support component comprises a support plate and a support column, the thyristor is fixedly arranged on the support plate, and the support plate is connected with the first heat dissipation component through the support column; the second heat dissipation part comprises a plurality of heat dissipation fins and a plurality of heat conduction strips, wherein the heat dissipation fins are arranged at intervals in parallel, and each heat dissipation fin is connected with the support plate through the corresponding heat conduction strip. The invention can truly and effectively play the role of thyristor heat dissipation by combining the first heat dissipation part and the second heat dissipation part, and has good heat dissipation effect.
Description
Technical Field
The invention relates to the technical field of thyristor heat dissipation, in particular to a heat dissipation device for a thyristor.
Background
The thyristor can work under the conditions of high voltage and high power, and the working process of the thyristor can be controlled, and the thyristor is widely used in electronic circuits such as controllable rectification, alternating current voltage regulation, contactless electronic switches, inversion, frequency conversion and the like.
Typically, thyristors are operated indoors, but not at rated voltage and current conditions, but at undervoltage and undercurrent conditions. When the thyristor is in too long circulation time, severe heat is caused, and the heat loss is exponentially increased, so that the circulation performance of the thyristor is greatly reduced, and the electric energy transmission is affected. Therefore, whether the heat generated by the thyristor can be quickly transferred out becomes a key factor for ensuring and improving the stability of the performance of the thyristor.
The thyristor is generally installed in a closed mode and dissipates heat by virtue of the radiator, and although part of heat on the thyristor can transfer the radiator contacted with the thyristor, the heat on the radiator can only be gathered in a closed space, so that a certain influence is generated on the thyristor. In addition, the existing radiator mostly relies on the tabular radiating fins to radiate heat, has a simple structure and poor radiating effect, cannot achieve an effective radiating effect on the thyristor, and is easy to damage the thyristor.
Disclosure of Invention
The invention aims to provide the heat dissipation device which can effectively dissipate heat of the thyristor and avoid damage of the thyristor.
The technical scheme adopted for solving the technical problems is as follows:
the heat dissipation device for the thyristor comprises a first heat dissipation part, a supporting part and a second heat dissipation part which are sequentially connected, wherein the thyristor is arranged between the first heat dissipation part and the supporting part;
the first heat dissipation part comprises a plurality of channels;
the support component comprises a support plate and a support column, the thyristor is fixedly arranged on the support plate, and the support plate is connected with the first heat dissipation component through the support column;
the second heat dissipation part comprises a plurality of heat dissipation fins and a plurality of heat conduction strips, wherein the heat dissipation fins are arranged in parallel at intervals, and each heat dissipation fin is connected with the supporting plate through the corresponding heat conduction strip.
In the present invention, preferably, the first heat dissipation member has a circular shape, and the plurality of channels are provided on a side of the first heat dissipation member facing the support plate.
In the present invention, preferably, the plurality of channels are arranged at intervals with the center of the circle as the center of the circle.
In the invention, the first heat dissipation part plays roles of dust prevention and heat dissipation for the thyristor, and the heat dissipated by the thyristor can be contained in the channel on the first heat dissipation part and gradually dissipated to the outside. Meanwhile, the channel can also reduce the weight of the first heat dissipation part, and save materials.
In the present invention, preferably, the heat sink is a hollow plate, and the hollow plate has a hollow structure and a cooling flow passage.
In the present invention, preferably, the hollow plate has a sinusoidal waveform cross section, and the sinusoidal waveform has a sinusoidal waveform shape including half or more wavelengths.
In the present invention, preferably, a hole portion is provided at a peak of the sine wave shape, and a hook portion is provided at a trough of the sine wave shape; or a hole part is arranged at the trough of the sine wave shape, and a hook part is arranged at the crest of the sine wave shape.
In the present invention, preferably, the hole portion is a closed structure formed to extend from one place of the surface of the hollow plate outward to another place of the surface of the hollow plate.
In the present invention, preferably, the hook portion is a semi-closed structure formed by extending outward from one portion of the surface of the hollow plate.
In the present invention, preferably, the end portion of the hollow plate has an extension portion, and the extension portion is a solid structure.
In the second heat dissipation component, end plates are arranged at two ends of the heat dissipation plate, and the heat dissipation plates are connected together through connecting strips.
In the present invention, preferably, the end plate is provided to an extension of the hollow plate.
In the present invention, preferably, the coolant in the coolant flow channel is water.
In the present invention, preferably, the second heat dissipating component is connected to an external cooling medium supply system, and the cooling medium supply system is a circulation system, so that the cooling object in the cooling object flow channel can circulate to take away the heat absorbed by the second heat dissipating component.
The invention has the beneficial effects that:
1. in the invention, the first heat dissipation part effectively accommodates heat emitted by the thyristor by arranging the annular channel; the second heat dissipation part is used for transmitting heat of the thyristor to the heat dissipation fin through the heat conduction strip on one hand, and continuously taking away the heat through circulating water in a cooling flow passage in the heat dissipation fin on the other hand. The invention can truly and effectively play the role of thyristor heat dissipation by combining the first heat dissipation part and the second heat dissipation part, and has good heat dissipation effect.
2. The hole part and the hook part are arranged on the second heat dissipation part, so that the actual length of the cooling flow passage is prolonged, and the heat of the thyristor is further taken away by circulating water.
Drawings
Fig. 1 is a schematic view of a heat sink for a thyristor according to a preferred embodiment of the invention.
Fig. 2 is a schematic view of a first heat dissipating component according to a preferred embodiment of the present invention.
Fig. 3 is a schematic view of a second heat sink member according to a preferred embodiment of the present invention.
Fig. 4 is a cross-sectional view of a heat sink in a second heat sink member according to a preferred embodiment of the present invention.
In the figure: 1. the heat dissipation device comprises a first heat dissipation part, 2, thyristors, 3, support plates, 4, support columns, 5, a second heat dissipation part, 6, heat conducting strips, 11, channels, 51, heat dissipation fins, 52, connecting strips, 53, end plates, 511, extension parts, 512, hole parts, 513 and hook parts.
Detailed Description
The invention is further described below with reference to the drawings and embodiments.
As shown in fig. 1 to 4, a preferred embodiment of the present invention provides a heat dissipating device for a thyristor 2, which includes a first heat dissipating member 1, a supporting member, and a second heat dissipating member 5 connected in sequence, the thyristor 2 being disposed between the first heat dissipating member 1 and the supporting member.
As shown in fig. 2, the first heat dissipation part 1 is circular and includes a plurality of channels 11. A plurality of channels 11 are provided on the side of the first heat sink member 1 facing the support plate 3. The plurality of channels 11 are arranged at intervals with the center of the circle as the center of the circle. In this embodiment, the first heat dissipation component 1 plays roles of dust prevention and heat dissipation for the thyristor 2, and the heat dissipated by the thyristor 2 can be accommodated in the channel 11 on the first heat dissipation component 1 and gradually dissipated to the outside. At the same time, the channel 11 can also reduce the weight of the first heat dissipation part 1, and save materials.
The support part includes backup pad 3 and support column 4, and thyristor 2 fixed mounting is on backup pad 3, and backup pad 3 passes through support column 4 to be connected with first heat dissipation part 1.
The second heat dissipation part 5 includes a plurality of heat dissipation fins 51 arranged in parallel at intervals and a plurality of heat conduction bars 6, and each heat dissipation fin 51 is connected with the support plate 3 through the corresponding heat conduction bar 6. Each heat sink 51 may be connected to the support plate 3 by a plurality of heat conductive strips 6. The heat sink 51 is a hollow plate having a hollow structure and a cooling flow passage. As shown in fig. 4, the hollow plate has a sine wave-shaped cross section, and the sine wave shape is a sine wave shape including half or more wavelengths. The end of the hollow plate has an extension 511, the extension 511 being of solid construction.
In the present embodiment, a hole portion 512 is provided at a peak of the sine wave shape, and a hook portion 513 is provided at a trough of the sine wave shape; or a hole 512 is provided at a trough of the sine wave shape, and a hook 513 is provided at a peak of the sine wave shape. Wherein the hole portion 512 is a closed structure formed to extend from one place of the surface of the hollow plate back to another place of the surface of the hollow plate. The hook 513 is a semi-closed structure formed by extending outward from one place of the surface of the hollow plate.
As shown in fig. 3, in the second heat sink member 5, both ends of the heat sink 51 have end plates 53, and the heat sinks 51 are connected together by connecting bars 52. The end plate 53 is provided to the extension 511 of the hollow plate.
In this embodiment, the coolant in the coolant flow passage is preferably water, but may be oil in other embodiments.
In this embodiment, the second heat dissipation part 5 is connected with an external cooling medium supply system, and the cooling medium supply system is a circulation system, so that the cooling object in the cooling fluid flow channel can circulate to take away the heat absorbed by the second heat dissipation part 5.
Compared with the prior art, the heat dissipation device for the thyristor has the following advantages:
1. the first heat dissipation part 1 effectively accommodates heat dissipated by the thyristor 2 by providing the annular channel 11; the second heat sink member 5 transfers heat of the thyristor 2 to the heat sink 51 via the heat conductive strip 6 on the one hand, and continuously takes away heat via circulating water in a cooling flow passage in the heat sink 51 on the other hand. According to the invention, through the combination of the first heat dissipation part 1 and the second heat dissipation part 5, the effect of heat dissipation of the thyristor 2 can be truly and effectively achieved, and the heat dissipation effect is good.
2. By providing the hole portion 512 and the hook portion 513 on the second heat dissipating member 5, the actual length of the cooling flow passage is prolonged, further facilitating the circulating water to take away the heat of the thyristor 2.
The foregoing describes in detail preferred embodiments of the present invention. It should be understood that numerous modifications and variations can be made in accordance with the concepts of the invention by one of ordinary skill in the art without undue burden. Therefore, all technical solutions which can be obtained by logic analysis, reasoning or limited experiments based on the prior art by the person skilled in the art according to the inventive concept shall be within the scope of protection defined by the claims.
Claims (4)
1. A heat sink for a thyristor, characterized by: the thyristor is arranged between the first heat dissipation part and the supporting part;
the first heat dissipation part comprises a plurality of channels;
the support component comprises a support plate and a support column, the thyristor is fixedly arranged on the support plate, and the support plate is connected with the first heat dissipation component through the support column;
the second heat dissipation part comprises a plurality of heat dissipation fins and a plurality of heat conduction strips which are arranged in parallel at intervals, and each heat dissipation fin is connected with the supporting plate through the corresponding heat conduction strip;
the radiating fin is a hollow plate, and the hollow plate is of a hollow structure and is provided with a cooling flow passage;
the hollow plate has a sine wave-shaped cross section, the sine wave shape being a sine wave shape including more than half a wavelength;
a hole part is arranged at the crest of the sine wave shape, and a hook part is arranged at the trough of the sine wave shape; or a hole part is arranged at the trough of the sine wave shape, and a hook part is arranged at the crest of the sine wave shape;
the first heat dissipation part is circular, and the plurality of channels are arranged on one side of the first heat dissipation part, which faces the supporting plate.
2. The heat sink as recited in claim 1, wherein: the plurality of channels are arranged at intervals by taking the circle center of the round first heat dissipation part as the circle center.
3. The heat sink as recited in claim 1, wherein: the hole part is a closed structure formed by extending outwards from one place of the surface of the hollow plate to the other place of the surface of the hollow plate;
the hook part is a semi-closed structure formed by extending outwards from one part of the surface of the hollow plate;
in the second heat dissipation part, end plates are arranged at two ends of the heat dissipation plate, and the heat dissipation plates are connected together through connecting strips.
4. The heat sink as recited in claim 1, wherein: the second heat dissipation part is connected with an external cooling medium supply system, and the cooling medium supply system is a circulation system, so that the cooling object in the cooling object flow channel can circulate to take away the heat absorbed by the second heat dissipation part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810502522.XA CN108447834B (en) | 2018-05-23 | 2018-05-23 | Heat abstractor for be used for thyristor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810502522.XA CN108447834B (en) | 2018-05-23 | 2018-05-23 | Heat abstractor for be used for thyristor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108447834A CN108447834A (en) | 2018-08-24 |
| CN108447834B true CN108447834B (en) | 2024-01-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810502522.XA Active CN108447834B (en) | 2018-05-23 | 2018-05-23 | Heat abstractor for be used for thyristor |
Country Status (1)
| Country | Link |
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| CN (1) | CN108447834B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08166100A (en) * | 1994-12-13 | 1996-06-25 | Mitsubishi Electric Corp | Water-cooled thyristor module |
| JP3100594U (en) * | 2003-09-22 | 2004-05-20 | 珍通科技股▲ふん▼有限公司 | Integrated heat dissipation device |
| JP2008294177A (en) * | 2007-05-24 | 2008-12-04 | Kuo-Chun Lin | Heat conduction sheet |
| CN201335349Y (en) * | 2009-02-09 | 2009-10-28 | 顾亚梅 | Heat radiator for LED (light emitting diode) lamp |
| KR20100005767U (en) * | 2008-11-27 | 2010-06-07 | 농업회사법인 제이테크(주) | Structure of radiator |
| KR20120058862A (en) * | 2010-11-30 | 2012-06-08 | (주)에스.케이.이 | Heat-exchanger structure |
| CN104167398A (en) * | 2013-05-17 | 2014-11-26 | 国家电网公司 | Micro-channel heat radiator |
| CN106693590A (en) * | 2015-08-17 | 2017-05-24 | 德梅斯特(上海)环保科技有限公司 | Fine particle polymerizer and high-efficiency dedusting defogging integrated system |
| CN207052598U (en) * | 2017-06-15 | 2018-02-27 | 江苏默顿电气有限公司 | A kind of heat abstractor for IGCT |
| CN207151055U (en) * | 2017-08-02 | 2018-03-27 | 深圳市迈安热控科技有限公司 | Porous heat pipe and heat pipe for conductive heat dissipation device |
| CN208385393U (en) * | 2018-05-23 | 2019-01-15 | 杭州汉安半导体有限公司 | A kind of radiator for thyristor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100389920B1 (en) * | 2000-12-12 | 2003-07-04 | 삼성전자주식회사 | Semiconductor module improving a reliability deterioration due to coefficient of thermal expansion |
| US6765793B2 (en) * | 2002-08-30 | 2004-07-20 | Themis Corporation | Ruggedized electronics enclosure |
-
2018
- 2018-05-23 CN CN201810502522.XA patent/CN108447834B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08166100A (en) * | 1994-12-13 | 1996-06-25 | Mitsubishi Electric Corp | Water-cooled thyristor module |
| JP3100594U (en) * | 2003-09-22 | 2004-05-20 | 珍通科技股▲ふん▼有限公司 | Integrated heat dissipation device |
| JP2008294177A (en) * | 2007-05-24 | 2008-12-04 | Kuo-Chun Lin | Heat conduction sheet |
| KR20100005767U (en) * | 2008-11-27 | 2010-06-07 | 농업회사법인 제이테크(주) | Structure of radiator |
| CN201335349Y (en) * | 2009-02-09 | 2009-10-28 | 顾亚梅 | Heat radiator for LED (light emitting diode) lamp |
| KR20120058862A (en) * | 2010-11-30 | 2012-06-08 | (주)에스.케이.이 | Heat-exchanger structure |
| CN104167398A (en) * | 2013-05-17 | 2014-11-26 | 国家电网公司 | Micro-channel heat radiator |
| CN106693590A (en) * | 2015-08-17 | 2017-05-24 | 德梅斯特(上海)环保科技有限公司 | Fine particle polymerizer and high-efficiency dedusting defogging integrated system |
| CN207052598U (en) * | 2017-06-15 | 2018-02-27 | 江苏默顿电气有限公司 | A kind of heat abstractor for IGCT |
| CN207151055U (en) * | 2017-08-02 | 2018-03-27 | 深圳市迈安热控科技有限公司 | Porous heat pipe and heat pipe for conductive heat dissipation device |
| CN208385393U (en) * | 2018-05-23 | 2019-01-15 | 杭州汉安半导体有限公司 | A kind of radiator for thyristor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108447834A (en) | 2018-08-24 |
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