CN108427899B - High-precision ultrahigh-frequency RFID near-field tag detection system - Google Patents

High-precision ultrahigh-frequency RFID near-field tag detection system Download PDF

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CN108427899B
CN108427899B CN201810449204.1A CN201810449204A CN108427899B CN 108427899 B CN108427899 B CN 108427899B CN 201810449204 A CN201810449204 A CN 201810449204A CN 108427899 B CN108427899 B CN 108427899B
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pin
resistor
capacitor
chip
grounded
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CN108427899A (en
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庄程星
高政
胡俊杰
侯丰
吴国驭
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Hangzhou Kongtrolink Information Technology Co ltd
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Hangzhou Kongtrolink Information Technology Co ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
    • G06K7/10198—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves setting parameters for the interrogator, e.g. programming parameters and operating modes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
    • G06K7/10158—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves methods and means used by the interrogation device for reliably powering the wireless record carriers using an electromagnetic interrogation field
    • G06K7/10168—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves methods and means used by the interrogation device for reliably powering the wireless record carriers using an electromagnetic interrogation field the powering being adversely affected by environmental influences, e.g. unwanted energy loss in the interrogation signal due to metallic or capacitive objects in the proximity of the interrogation device or in the proximity of the interrogated record carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
    • G06K7/10297—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves arrangements for handling protocols designed for non-contact record carriers such as RFIDs NFCs, e.g. ISO/IEC 14443 and 18092
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
    • G06K7/10316—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves using at least one antenna particularly designed for interrogating the wireless record carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

Abstract

The invention discloses a high-precision ultrahigh frequency RFID near-field tag detection system, which comprises a main control module, an ultrahigh frequency RFID induction coil, a variable damping system, a shielding transmission line structure, an impedance matching network, a radio frequency module, a power supply module, a Bluetooth module, a USB data interface, an LED lamp, an illumination module and a buzzer module, wherein the main control module is connected with the main control module; the output end of the radio frequency module is connected with the input end of the impedance matching network, the output end of the impedance matching network is connected with the input end of the variable damping system through the shielding transmission line structure, the output end of the variable damping system is connected with the ultrahigh frequency RFID induction coil, and the power module supplies power to each module; the shielding transmission line structure is made of elastic materials. The patent is convenient to determine the detection range, and invalid labels can be recorded; adding Bluetooth and USB data interfaces to exchange data with the outside; and a built-in lithium battery is added to supply power for the whole system.

Description

High-precision ultrahigh-frequency RFID near-field tag detection system
Technical Field
The invention belongs to the field of communication, and particularly relates to a high-precision ultrahigh-frequency RFID near-field tag detection system.
Background
With the development of economy and society, the three-foot situation of the traditional RFID low-frequency, high-frequency and ultra-high-frequency technology is broken. Ultrahigh frequency RFID technology has shown a general trend. This is mainly due to the wide application and numerous hugs, resulting in rapid cost reduction and gradual performance improvement. However, because the ultra-high frequency RFID technology is mainly applied to the electromagnetic far field, based on the far field radiation principle, the ultra-high frequency RFID technology is inevitably affected by various reflections and refractions in space, and the identification range cannot be accurately controlled. In recent years, there have been some studies on near field application of ultra-high frequency RFID technology, but there are problems such as: how to accurately distinguish between adjacent ultra-high frequency RFID near field tags of only 2mm has not yet been a mature solution.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a high-precision ultrahigh-frequency RFID near-field tag detection system.
A high-precision ultrahigh frequency RFID near-field tag detection system comprises a main control module, an ultrahigh frequency RFID induction coil, a variable damping system, a shielding transmission line structure, an impedance matching network, a radio frequency module, a power module, a Bluetooth module, a USB data interface, an LED lamp, an illumination module and a buzzer module;
the output end of the radio frequency module is connected with the input end of the impedance matching network, the output end of the impedance matching network is connected with the input end of the variable damping system through the shielding transmission line structure, the output end of the variable damping system is connected with the ultrahigh frequency RFID induction coil, and the power module supplies power to each module; the shielding transmission line structure is made of elastic materials.
The main control module comprises a radio frequency module, a main controller module, an LED control module, a buzzer module, an illumination module, a Bluetooth module, a USB management module, a power control key module and a tag reading key module;
the radio frequency module comprises a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eleventh capacitor C11, a twelfth capacitor C12, a thirteenth capacitor C13, a fourteenth capacitor C14, a fifteenth capacitor C15, a sixteenth capacitor C16, a seventeenth capacitor C17, an eighteenth capacitor C18, a twenty-first capacitor C21, a twenty-third capacitor C23, a twenty-fifth capacitor C25, a thirty-fourth capacitor C34, a fortieth capacitor C44, a thirty-second capacitor C32, a thirty-third capacitor C33, a thirty-fifth capacitor C35, a thirty-sixth capacitor C36 thirty-ninth capacitor C39, second resistor R2, third resistor R3, fourth resistor R4, sixth resistor R6, seventh resistor R7, eighth resistor R8, ninth resistor R9, fourteenth resistor R14, fifteenth resistor R15, seventeenth resistor R17, nineteenth resistor R19, twenty-second resistor R22, twenty-third resistor R23, second inductor L2, third inductor L3, fourth inductor L4, fifth inductor L5, singlechip U5, radio frequency chip U4, passive crystal oscillator chip U2, radio frequency protocol processing chip U9, conditioning chip U3, and radio frequency signal conditioning chip U7;
The 1 pin of the singlechip U5 is grounded with MCU-3.3V and 2 pins, the 3 pin is grounded with VCC-3.3,4 pins, the 4 pin of the radio frequency signal regulating chip U7 is connected with one end of the fourth inductor L4, the 5 pin is connected with the other end of the fourth inductor L4 and the 3 pin of the radio frequency signal regulating chip U7, the 8 pin is grounded, the 9 pin is connected with one end of the fifteenth capacitor C15, one end of the sixteenth capacitor C16 and one end of the third inductor L3, the 10 pin is connected with the 11 pin of the singlechip U5 and the other end of the fifteenth capacitor C15 and connected with VCC-3.3 in parallel, the other end of the sixteenth capacitor C16 is grounded, the 13 pin of the singlechip U5 is connected with one end of the twelfth capacitor C12 and the 1 pin of the passive crystal oscillator chip U2, the 14 pin is connected with one end of the eleventh capacitor C11, the other end of the passive crystal oscillator chip U2, the other end of the twelfth capacitor C12 and the other end of the passive crystal oscillator chip U2 are grounded, the 15 pin of the single chip U5 is connected with the 4 pin of the voltage stabilizing chip U10, the 16 pin is connected with one end of the fifteenth resistor, the 18 pin is connected with the system ground GND, the 19 pin is connected with one end of the eighteenth capacitor C18 and connected with VCC-3.3 in parallel, the other end of the eighteenth capacitor C18 is grounded, the 20 pin of the single chip U5 is connected with one end of the seventh resistor R7, the 21 pin of the single chip U5 is connected with one end of the ninth resistor R9, the other end of the seventh resistor R7 is connected with the 5 pin of the radio frequency protocol processing chip U9, the other end of the ninth resistor R9 is connected with the 3 pin of the radio frequency protocol processing chip U9, the 22 pin is connected with the 8 pin of the radio frequency protocol processing chip U9, the 23 pin is connected with the 7 pin of the radio frequency protocol processing chip U9, the 24 pin is connected with the 5 pin of the voltage stabilizing chip U10, the 25 pin is connected with one end of the twenty-first capacitor C21 and connected with MCU-3.3V, the 26 pin is suspended, the 27 pin is connected with one end of a third resistor, the 28 pin is connected with one end of a fourth resistor, the other end of the third inductor L3 is connected with one end of a seventeenth capacitor C17 and one end of a radio frequency chip U4, the other end of the seventeenth capacitor C17 is grounded, the 4 pin of the radio frequency chip U4 is connected with one end of a fourth resistor R4 and one end of a sixth resistor R6, the other end of the sixth resistor R6 is grounded, the other end of the fourth resistor R4 is connected with the 28 pin of a singlechip U5, the 5 pin of the radio frequency chip U4 is connected with one end of the third resistor R3 and one end of an eighth resistor R8, the other end of the third resistor R3 is grounded, the other end of the eighth resistor R8 is grounded, the 6 pin of the radio frequency chip U4 is connected with one end of a second resistor R2, the other end of the second resistor R2 is grounded, the 7 pin of the radio frequency chip U4 is grounded, the 8 pin of the radio frequency chip U4 is connected with one end of a twenty-third capacitor C23, the other end of the twenty-third capacitor C23 is grounded, the other end of the radio frequency chip U23 is connected with the 1 pin of a radio frequency signal adjusting chip U7, the radio frequency signal adjusting chip U2 and the overhead pins are grounded, and the overhead pins are grounded at 6; the pin 9 of the radio frequency chip U4 is connected with the pin 4 of the conditioning chip U3, the pin 10 is connected with the pin 1 of the radio frequency chip U4, one end of a fifth capacitor C5, one end of a sixth capacitor C6, one end of a seventh capacitor C7 and the pin 8 of the voltage stabilizing chip U10, the other end of the fifth capacitor C5, the other end of the sixth capacitor C6 and the other end of the seventh capacitor C7 are grounded, the pin 1, the pin 3, the pin 5 and the pin 7 of the conditioning chip U3 are grounded, the pin 2 and the pin 6 are overhead, the pin 8 is connected with one end of a thirteenth capacitor C13 and one end of a second inductor L2, the other end of the thirteenth capacitor C13 is grounded, the other end of the second inductor L2 is connected with one end of a fourteenth capacitor C14 and the input end of a radio frequency connector, the other end of the fourteenth capacitor C14 is grounded, the pin 0 of the radio frequency protocol processing chip U9 is grounded, the pin 2 is connected with one end of a fortieth capacitor C44, the other end of the fortieth capacitor C44 is connected, the 3 pin of the radio frequency protocol processing chip U9 is connected with one end of a ninth resistor, the 4 pin is grounded, the 5 pin is connected with one end of a seventh resistor, the 7 pin is connected with one end of a seventeenth resistor R17, the other end of the seventeenth resistor R17 is connected with MCU-3.3V, the 8 pin of the radio frequency protocol processing chip U9 is connected with one end of a nineteenth resistor R19, one end of the nineteenth resistor R19 is connected with MCU-3.3V, the 12 pin of the radio frequency protocol processing chip U9 is grounded, the 13 pin is connected with one end of a thirty-fourth capacitor C34, the other end of the thirty-fourth capacitor C34 is grounded, the 18 pin is connected with the 32 pin of the singlechip U5, the 26 pin is connected with the 30 pin of the radio frequency protocol processing chip U9 and one end of a fourteenth resistor R14, the other end of the fourteenth resistor R14 is connected with one end of the twentieth resistor, the 27 pins and 28 pins are connected with the one end of the twenty-fifth capacitor C25 in parallel connection with MCU-3.3V, the other end of the twenty-fifth capacitor C25 is grounded, the 31 pin of the radio frequency protocol processing chip U9 is connected with one end of the fifteenth resistor R15, the other end of the fifteenth resistor R15 is connected with one end of the twenty first resistor, and the 1 pin, the 6 pin, the 9 pin, the 10 pin, the 11 pin, the 14 pin, the 15 pin, the 16 pin, the 17 pin, the 19 pin, the 20 pin, the 21 pin, the 22 pin, the 23 pin, the 24 pin, the 25 pin, the 28 pin and the 32 pin are overhead; one end of the thirty-second capacitor C32 is grounded, the other end of the thirty-second capacitor C32 is connected with the 1 pin of the voltage stabilizing chip U10 and connected with the power VCC-BAT in parallel, the 2 pin of the voltage stabilizing chip U10 is grounded, the 3 pin of the voltage stabilizing chip U10 is connected with one end of the thirty-fifth capacitor C35, the other end of the thirty-fifth capacitor C35 is grounded, the 4 pin of the voltage stabilizing chip U10 is connected with one end of the twenty-second resistor R22, the 5 pin of the voltage stabilizing chip U10 is connected with one end of the twenty-third resistor R23 and connected with PA_VPD in parallel, the 6 pin of the voltage stabilizing chip is overhead, the 7 pin of the voltage stabilizing chip U5 is connected with one end of the thirty-sixth capacitor C36, one end of the fifth inductor L5 is connected with VCC-3.3,8 pin of the thirty-third capacitor C33 and connected with PA-3.3 in parallel, the other end of the twenty-second resistor R22, the other end of the twenty-third resistor R23, the other end of the thirty-sixth capacitor C36 and the other end of the thirty-third capacitor C33 are grounded, and the other end of the fifth inductor L5 is connected with one end of the thirty-ninth capacitor C39 and connected with MCU-3.3; the other end of the thirty-ninth capacitor C39 is grounded.
The model of the singlechip U5 is STR09, the model of the radio frequency chip U4 is RF7418, the model of the radio frequency protocol processing chip U9 is STR01, the model of the conditioning chip U3 is 0915LP15B026, the model of the radio frequency signal conditioning chip U7 is BD0810J50100AHF, and the model of the voltage stabilizing chip U10 is mic5330;
the main control module comprises a main control chip U8, wherein a pin 1 is connected with one end of a twenty-seventh capacitor C20 and a pin 2 of a sixth chip U6, the other end of the twenty-eighth capacitor C20 is grounded, a pin 1 of the sixth chip U6 is grounded, a pin 3 of the sixth chip U6 is connected with one end of a twenty-second capacitor C22 and is connected with VCC-BAT in parallel, the other end of the twenty-second capacitor C22 is grounded, the pin 2 of the main control chip U8 is grounded, the pin 3 is connected with one end of a twenty-seventh capacitor C27 and one end of a first crystal oscillator Y1, the other end of the twenty-seventh capacitor C27 is grounded, a pin 4 is connected with the other end of the first crystal oscillator Y1 and one end of a twenty-eighth capacitor C28, a pin 5 is connected with one end of an eighteenth resistor 18, one end of a twenty-ninth capacitor C29 and the 1 pin of a passive crystal oscillator Y2, the other end of the twenty-ninth capacitor C29 is grounded, the pin 6 of the main control chip U8 is connected with the other end of the eighteenth resistor 18, one end of the thirty-first capacitor C31 and the pin 3 of the passive crystal oscillator Y2, the other end of the thirty-first capacitor C31 is grounded, the 2 pins and the 4 pins of the passive crystal oscillator Y2 are grounded, the 7 pin of the main control chip U8 is connected with MCU_RESET, the 8 pin is connected with BLPOWER-KZ, the 9 pin is overhead, the 10 pin is connected with POWERLED, the 11 pin is overhead, the 12 pin is grounded, the 13 pin is connected with one end of the thirty-first capacitor C30 and connected with MCU-VCC in parallel, the other end of the thirty-first capacitor C30 is grounded, the 14 pin of the main control chip U8 is connected with the POWER-B-JC, the 15 pins RF_EN, the 16 pin is connected with one end of the twentieth resistor R20, the other end of the twentieth resistor R20 is connected with RXD-TTL, the other end of the twenty-first resistor R21 is connected with TXD-TTL, the 18 pin of the main control chip U8 is grounded, the 19 pin is connected with one end of the thirty-eighth capacitor C38 and connected with MCU-VCC, the other end of the thirty-eighth capacitor C38 is grounded, the main control chip U8 is composed of 20, 21, 22, 23, 24, 26, 30, 38, 45, 51, 54, 62, 25, 27, 28, 29, 30, 31, 32 and 32 feet, 33, 34, 35, 36, 37 feet BL, 39 feet READER, 40 feet are connected with cathode of the first LED D1, anode of the first LED D1 is connected with one end of the sixteenth resistor R16, the other end of the sixteenth resistor R16 is connected with MCU-VCC, the other end of the thirty seventh capacitor C37 is grounded, 33 feet of the main control chip U8 are connected with IDLE, 34 feet BL, 35 feet BL, 36 feet BL, RST,37 feet BL, LED,39 feet READER, MCU,40 feet are connected with cathode of the first LED D1, anode of the first LED D1 is connected with one end of the sixteenth resistor R16, the other end of the sixteenth resistor R16 is connected with MCU-VCC, 41 feet of the main control chip U8 are connected with the fifty seventh resistor R57, the other end of the fifty-seventh resistor R57 is connected with RXD-MCU, the other end of the fifty-sixth resistor R56 is connected with TXD-MCU, the other end of the fifty-sixth resistor R56 is connected with BELL,46 is connected with J_TMS,47 is connected with ground, 48 is connected with one end of the twenty-sixth capacitor C26 and connected with MCU-VCC, the other end of the twenty-sixth capacitor C26 is connected with ground, 49 is connected with J_TCK,50 is connected with J_TDI,52 is connected with POWERLED-B,53 is connected with POWER-B,55 is connected with J_TDO,56 is connected with J_RST,57 is connected with one end of the thirteenth resistor R13, 58 is connected with one end of the twelfth resistor R12, 59 is connected with one end of the eleventh resistor R11, 60 is connected with BOOT0, 61 is connected with one end of the tenth resistor R10, 63 is connected with ground, 64 is connected with two ends of the twenty-fourth capacitor C24 and connected with MCU-VCC, the other end of the tenth resistor R10 is connected with the BAT_L4, the other end BAT_L3 of the eleventh resistor R11, the other end BAT_L2 of the twelfth resistor R12 and the other end BAT_L1 of the thirteenth resistor R13;
The model of the main control chip U8 is STM32F103RCT6, the model of the sixth chip U6 is XC6206P332MR, and Y2 is a passive crystal oscillator.
The first voltage stabilizer chip U1 in the LED control module is connected with one end of a first capacitor C1 and connected with VCC-BAT in parallel, the 2 pin is grounded, the 3 pin is connected with one end of a third capacitor C3, the 4 pin is connected with one end of a twenty-fourth resistor R24 and connected with BLPOWER-KZ in parallel, the 5 pin is connected with one end of an eighty-fifth resistor R85 and connected with POWERLED-B in parallel, the 6 pin is overhead, the 7 pin is connected with one end of a fourth capacitor C4 and one end of a first inductor, the 8 pin is connected with one end of a second capacitor C2 and connected with VCC-LED in parallel, the 9 pin is grounded, the other end of the first inductor L1 is connected with the other end of an eighth capacitor C8 and connected with BL_VCC in parallel, the other end of the first capacitor C1, the other end of the second capacitor C2, the other end of the third capacitor C3, the other end of the fourth capacitor C4, the other end of the eighth capacitor C8, the other end of the twenty-fourth resistor R24 and the other end of the eighty-fifth resistor R85 are grounded;
the model of the first voltage stabilizer chip U1 is mic5330
In the buzzer module, a 1 pin of a buzzer U17 is connected with one end of a fifty-eighth resistor R58, the other end of the fifty-eighth resistor R58 is connected with MCU-VCC, a 2 pin of one end of the buzzer U17 is connected with a C pin of a triode Q1, a B pin of the triode Q1 is connected with one end of a fifty-ninth resistor R59, the other end of the fifty-ninth resistor R59 is connected with BELL, and an E pin of the triode Q1 is grounded; the model of the triode Q1 is S9013;
In the lighting module, pin 1 of the fifth connector P5 is connected with one end of a seventy resistor R70 and one end of a seventy-two resistor R72, the other end of the seventy resistor R70 and the other end of the seventy-two resistor R72 are connected with one end of a fifty-first capacitor C51 and connected with a VCC-LED in parallel, the other end of the fifty-first capacitor C51 is grounded, and pin 2 of the fifth connector P5 is grounded; the pin 1 of the fourth connector P4 is connected with one end of a sixty-sixth resistor R66 and one end of a sixty-eighth resistor R68, the other end of the sixty-sixth resistor R66 and the other end of the sixty-eighth resistor R68 are connected with one end of a fifty-seventh capacitor C50 and connected with a VCC-LED in parallel, the other end of the fifty-seventh capacitor C50 is grounded, and the pin 2 of the fourth connector P4 is grounded; one end of the seventy-third resistor R73 is connected with MCU-VCC, the other end of the seventy-third resistor R73 is connected with one end of the seventh switch S7, one end of the fifty-second capacitor C52 is connected with BL-RST in parallel, and the other end of the fifty-second capacitor C52 is connected with the other end of the seventh switch S7 and is grounded;
in the bluetooth module, pin 1 of the sixteenth chip U16 is connected to one end of the forty-third capacitor C43 and connected with bl_vcc, the other end of the forty-third capacitor C43 is grounded, pin 2, pin 3, pin 4, pin 5, pin 7, pin 8, pin 9, pin 10, pin 11, pin 12, pin 13, pin 14, pin 15, pin 16, pin 17, pin 18 are empty, pin 6 is connected to one end of the fifty-th resistor R50, the other end of the fifty-th resistor R50 is connected to the anode of the ninth light emitting diode D9, the cathode of the ninth light emitting diode D9 is grounded, pin 19 of the sixteenth chip U16 is connected to one end of the forty-fourth resistor R44, the other end of the forty-fourth resistor R44 is connected with bl_txd, the other end of the sixteenth chip U16 is connected with one end of the forty-second resistor R42, the other end of the sixteenth chip U16 is connected with one end of the fifty-second resistor R52, the other end of the fifty-second resistor R52 is connected with the fifty-fifth resistor R55 and connected with the other end of the fifty-fifth resistor bl_55 AT; the pin 22 of the sixteenth chip U16 is connected with one end of a forty-ninth resistor R49, the other end of the forty-ninth resistor R49 is connected with BL_EN, the pin 23 of the sixteenth chip U16 is connected with one end of a forty-seventh resistor R47, the other end of the forty-seventh resistor R47 is connected with one end of a forty-fifth resistor R45 in parallel connection with BL_RST, the other end of the forty-fifth resistor R45 is connected with BL_VCC, and the pin 24 of the sixteenth chip U16 is grounded.
In the battery management module, a pin 1 of a thirteenth chip U13 is connected with one end of a thirty-second resistor R32 and one end of a thirty-fourth resistor R34, a pin 2 is connected with one end of a forty-first resistor R41, a pin 3 is connected with one end of a thirty-seventh resistor R37 and the other end of the thirty-fourth resistor R34, a pin 4 is connected with one end of a forty-third resistor R43, a pin 5 is connected with the other end of the thirty-seventh resistor R37 and one end of a thirty-ninth resistor R39, a pin 6 is connected with one end of a forty-sixth resistor R46, a pin 7 is connected with the other end of the thirty-ninth resistor R39 and one end of a forty-fourth resistor R40, a pin 8 is connected with one end of a forty-first resistor R51, a pin 9 is connected with 11 of the thirteenth chip U13, a pin 16 of the thirteenth chip U13, one end of a forty-second capacitor C42, the other end of the thirty-second resistor R32 and is connected with VCC-POWERJC, the other end of the forty-second capacitor C42, the other end of the thirteenth capacitor C13, the thirteen chip 12, the thirteen pins 13, and the thirteenth chip 13, and the thirteen pins 13 are connected with ground 10; the other end of the forty-first resistor R41 is connected with the cathode of the fourth diode D4, one end of the forty-third resistor R43 is connected with the cathode of the fifth diode D5, one end of the forty-sixth resistor R46 is connected with the cathode of the sixth diode D6, one end of the fifty-first resistor R51 is connected with the cathode of the seventh diode D7, and the anode of the fourth diode D4, the anode of the fifth diode D5, the anode of the sixth diode D6 and the anode of the seventh diode D7 are connected with MCU-VCC;
The thirteenth power detection chip U13 is model CN1185,
in the USB management module, pin 1 of the first chip J1 is connected to one end of a forty-ninth capacitor C49, pin 2 of the fourteenth chip U14 is connected to and connected to usb_vbus, pin 2 is connected to and connected to pin 4 of the fourteenth chip U14, pin 3 is connected to and connected to usb_dp, pin 4 is overhead, pin 5 and pin 6 are grounded, pin 4 of the fourteenth chip U14 and the other end of the forty-ninth capacitor C49 are grounded, pin 1 of the eleventh chip U11 is connected to one end of a forty-first capacitor C41 and connected to usb_vbus, pin 2 and pin 4 are overhead, pin 3 is connected to the cathode of the second diode D2, pin 5 and pin 9 are grounded, pin 6 is connected to one end of a thirty-sixth resistor R36, pin 7 is connected to one end of a thirty-third resistor R33, pin 8 is connected to one end of the forty-capacitor C40, pin 1 of the connector P1, one end of the thirty-fifth resistor R35 is connected to and connected to-BAT, and anode of the second diode D2 is grounded to the other end of the forty-first resistor C35, the forty-third resistor C33, and the other end of the forty-third resistor C2 is connected to the forty-third resistor R33; the fifteenth chip U15 has pins 1, 10, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 27, 4, 5, 6 and 6 pins connected with one end of a forty-fifth capacitor C45 and connected with pin 2 of U6, 7 and one end of a forty-seventh capacitor C47, one end of a forty-eighth capacitor C48, one end of a fifty-third resistor R53, 8 pins of the fifteenth chip U15, 10 and one end of a fifty-third resistor R53, 11 and one end of a fifty-fourth resistor R54, 24 pins RTSB, 25 pins RXD-MCU,26 pins TXD-MCU,28 pins DTRUSB, one end of the forty-fifth capacitor C45, one end of the forty-seventh capacitor C47, one end of the forty-eighth capacitor C48, one end of the fifty-fourth resistor R54, and one end of the fifteenth chip U15, and the fifteenth chip U29 connected with ground;
The first chip J1 is a universal microUSB interface, and the model number of the eleventh chip U11 is SGM4056.
One end of an eighty-second resistor R82 in the POWER control key module is connected with MCU-VCC, the other end of the eighty-second resistor R82 is connected with one end of an eighth key S8, the other end of the eighth key S8 is connected with one end of an eighty-third resistor R83 and one end of a fifty-fourth capacitor C54 in parallel connection with POWER-B-JC, and the other end of the eighty-third resistor R83 and the other end of the fifty-fourth capacitor C54 are grounded;
one end of a first resistor R1 in the tag reading key module is connected with MCU-VCC, the other end of the first resistor R1 is connected with one end of a first key S1 and one end of a tenth capacitor C10 in parallel connection with READER_MCU, and the other end of the tenth capacitor C10 is connected with the other end of the first key S1 and grounded.
The beneficial effects are that: in the high-precision ultrahigh-frequency RFID near-field tag detection system, a shielding transmission line structure, a variable damping system and an ultrahigh-frequency RFID induction coil are made into the appearance of a probe, so that the detection range is convenient to determine; a luminous LED is added near the probe to help the label to be identified to be seen in a dim condition; an IDLE IDLE button is added in the detection system to help record invalid labels; adding Bluetooth and USB data interfaces to exchange data with the outside; and a built-in lithium battery is added to supply power for the whole system.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a radio frequency module;
FIG. 3 is a master controller module;
FIG. 4 is an LED control module;
FIG. 5 is a buzzer module;
FIG. 6 is a lighting module;
FIG. 7 is a Bluetooth module;
FIG. 8 is a battery management module;
FIG. 9 is a USB management module;
FIG. 10 is a power control key module;
fig. 11 is a label reading key module.
Detailed Description
As shown in fig. 1, a high-precision ultrahigh frequency RFID near field tag detection system includes a main control module, an ultrahigh frequency RFID induction coil, a variable damping system, a shielding transmission line structure, an impedance matching network, a radio frequency module, a power module, a bluetooth module, a USB data interface, an LED lamp, a lighting module and a buzzer module;
the output end of the radio frequency module is connected with the input end of the impedance matching network, the output end of the impedance matching network is connected with the input end of the variable damping system through the shielding transmission line structure, the output end of the variable damping system is connected with the ultrahigh frequency RFID induction coil, and the power module supplies power to each module; the shielding transmission line structure is made of elastic materials.
The main control module comprises a radio frequency module, a main controller module, an LED control module, a buzzer module, an illumination module, a Bluetooth module, a USB management module, a power control key module and a tag reading key module;
As shown in the figure 2 of the drawings, the radio frequency module comprises a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eleventh capacitor C11, a twelfth capacitor C12, a thirteenth capacitor C13, a fourteenth capacitor C14, a fifteenth capacitor C15, a sixteenth capacitor C16, a seventeenth capacitor C17, an eighteenth capacitor C18, a twenty-first capacitor C21, a twenty-third capacitor C23, a twenty-fifth capacitor C25, a thirty-fourth capacitor C34, a fortieth capacitor C44, a thirty-second capacitor C32, a thirty-third capacitor C33, a thirty-fifth capacitor C35, a thirty-sixth capacitor C36 thirty-ninth capacitor C39, second resistor R2, third resistor R3, fourth resistor R4, sixth resistor R6, seventh resistor R7, eighth resistor R8, ninth resistor R9, fourteenth resistor R14, fifteenth resistor R15, seventeenth resistor R17, nineteenth resistor R19, twenty-second resistor R22, twenty-third resistor R23, second inductor L2, third inductor L3, fourth inductor L4, fifth inductor L5, singlechip U5, radio frequency chip U4, passive crystal oscillator chip U2, radio frequency protocol processing chip U9, conditioning chip U3, and radio frequency signal conditioning chip U7;
the 1 pin of the singlechip U5 is grounded with MCU-3.3V and 2 pins, the 3 pin is grounded with VCC-3.3,4 pins, the 4 pin of the radio frequency signal regulating chip U7 is connected with one end of the fourth inductor L4, the 5 pin is connected with the other end of the fourth inductor L4 and the 3 pin of the radio frequency signal regulating chip U7, the 8 pin is grounded, the 9 pin is connected with one end of the fifteenth capacitor C15, one end of the sixteenth capacitor C16 and one end of the third inductor L3, the 10 pin is connected with the 11 pin of the singlechip U5 and the other end of the fifteenth capacitor C15 and connected with VCC-3.3 in parallel, the other end of the sixteenth capacitor C16 is grounded, the 13 pin of the singlechip U5 is connected with one end of the twelfth capacitor C12 and the 1 pin of the passive crystal oscillator chip U2, the 14 pin is connected with one end of the eleventh capacitor C11, the other end of the passive crystal oscillator chip U2, the other end of the twelfth capacitor C12 and the other end of the passive crystal oscillator chip U2 are grounded, the 15 pin of the single chip U5 is connected with the 4 pin of the voltage stabilizing chip U10, the 16 pin is connected with one end of the fifteenth resistor, the 18 pin is connected with the system ground GND, the 19 pin is connected with one end of the eighteenth capacitor C18 and connected with VCC-3.3 in parallel, the other end of the eighteenth capacitor C18 is grounded, the 20 pin of the single chip U5 is connected with one end of the seventh resistor R7, the 21 pin of the single chip U5 is connected with one end of the ninth resistor R9, the other end of the seventh resistor R7 is connected with the 5 pin of the radio frequency protocol processing chip U9, the other end of the ninth resistor R9 is connected with the 3 pin of the radio frequency protocol processing chip U9, the 22 pin is connected with the 8 pin of the radio frequency protocol processing chip U9, the 23 pin is connected with the 7 pin of the radio frequency protocol processing chip U9, the 24 pin is connected with the 5 pin of the voltage stabilizing chip U10, the 25 pin is connected with one end of the twenty-first capacitor C21 and connected with MCU-3.3V, the 26 pin is suspended, the 27 pin is connected with one end of a third resistor, the 28 pin is connected with one end of a fourth resistor, the other end of the third inductor L3 is connected with one end of a seventeenth capacitor C17 and one end of a radio frequency chip U4, the other end of the seventeenth capacitor C17 is grounded, the 4 pin of the radio frequency chip U4 is connected with one end of a fourth resistor R4 and one end of a sixth resistor R6, the other end of the sixth resistor R6 is grounded, the other end of the fourth resistor R4 is connected with the 28 pin of a singlechip U5, the 5 pin of the radio frequency chip U4 is connected with one end of the third resistor R3 and one end of an eighth resistor R8, the other end of the third resistor R3 is grounded, the other end of the eighth resistor R8 is grounded, the 6 pin of the radio frequency chip U4 is connected with one end of a second resistor R2, the other end of the second resistor R2 is grounded, the 7 pin of the radio frequency chip U4 is grounded, the 8 pin of the radio frequency chip U4 is connected with one end of a twenty-third capacitor C23, the other end of the twenty-third capacitor C23 is grounded, the other end of the radio frequency chip U23 is connected with the 1 pin of a radio frequency signal adjusting chip U7, the radio frequency signal adjusting chip U2 and the overhead pins are grounded, and the overhead pins are grounded at 6; the pin 9 of the radio frequency chip U4 is connected with the pin 4 of the conditioning chip U3, the pin 10 is connected with the pin 1 of the radio frequency chip U4, one end of a fifth capacitor C5, one end of a sixth capacitor C6, one end of a seventh capacitor C7 and the pin 8 of the voltage stabilizing chip U10, the other end of the fifth capacitor C5, the other end of the sixth capacitor C6 and the other end of the seventh capacitor C7 are grounded, the pin 1, the pin 3, the pin 5 and the pin 7 of the conditioning chip U3 are grounded, the pin 2 and the pin 6 are overhead, the pin 8 is connected with one end of a thirteenth capacitor C13 and one end of a second inductor L2, the other end of the thirteenth capacitor C13 is grounded, the other end of the second inductor L2 is connected with one end of a fourteenth capacitor C14 and the input end of a radio frequency connector, the other end of the fourteenth capacitor C14 is grounded, the pin 0 of the radio frequency protocol processing chip U9 is grounded, the pin 2 is connected with one end of a fortieth capacitor C44, the other end of the fortieth capacitor C44 is connected, the 3 pin of the radio frequency protocol processing chip U9 is connected with one end of a ninth resistor, the 4 pin is grounded, the 5 pin is connected with one end of a seventh resistor, the 7 pin is connected with one end of a seventeenth resistor R17, the other end of the seventeenth resistor R17 is connected with MCU-3.3V, the 8 pin of the radio frequency protocol processing chip U9 is connected with one end of a nineteenth resistor R19, one end of the nineteenth resistor R19 is connected with MCU-3.3V, the 12 pin of the radio frequency protocol processing chip U9 is grounded, the 13 pin is connected with one end of a thirty-fourth capacitor C34, the other end of the thirty-fourth capacitor C34 is grounded, the 18 pin is connected with the 32 pin of the singlechip U5, the 26 pin is connected with the 30 pin of the radio frequency protocol processing chip U9 and one end of a fourteenth resistor R14, the other end of the fourteenth resistor R14 is connected with one end of the twentieth resistor, the 27 pins and 28 pins are connected with the one end of the twenty-fifth capacitor C25 in parallel connection with MCU-3.3V, the other end of the twenty-fifth capacitor C25 is grounded, the 31 pin of the radio frequency protocol processing chip U9 is connected with one end of the fifteenth resistor R15, the other end of the fifteenth resistor R15 is connected with one end of the twenty first resistor, and the 1 pin, the 6 pin, the 9 pin, the 10 pin, the 11 pin, the 14 pin, the 15 pin, the 16 pin, the 17 pin, the 19 pin, the 20 pin, the 21 pin, the 22 pin, the 23 pin, the 24 pin, the 25 pin, the 28 pin and the 32 pin are overhead; one end of the thirty-second capacitor C32 is grounded, the other end of the thirty-second capacitor C32 is connected with the 1 pin of the voltage stabilizing chip U10 and connected with the power VCC-BAT in parallel, the 2 pin of the voltage stabilizing chip U10 is grounded, the 3 pin of the voltage stabilizing chip U10 is connected with one end of the thirty-fifth capacitor C35, the other end of the thirty-fifth capacitor C35 is grounded, the 4 pin of the voltage stabilizing chip U10 is connected with one end of the twenty-second resistor R22, the 5 pin of the voltage stabilizing chip U10 is connected with one end of the twenty-third resistor R23 and connected with PA_VPD in parallel, the 6 pin of the voltage stabilizing chip is overhead, the 7 pin of the voltage stabilizing chip U5 is connected with one end of the thirty-sixth capacitor C36, one end of the fifth inductor L5 is connected with VCC-3.3,8 pin of the thirty-third capacitor C33 and connected with PA-3.3 in parallel, the other end of the twenty-second resistor R22, the other end of the twenty-third resistor R23, the other end of the thirty-sixth capacitor C36 and the other end of the thirty-third capacitor C33 are grounded, and the other end of the fifth inductor L5 is connected with one end of the thirty-ninth capacitor C39 and connected with MCU-3.3; the other end of the thirty-ninth capacitor C39 is grounded.
The model of the singlechip U5 is STR09, the model of the radio frequency chip U4 is RF7418, the model of the radio frequency protocol processing chip U9 is STR01, the model of the conditioning chip U3 is 0915LP15B026, the model of the radio frequency signal conditioning chip U7 is BD0810J50100AHF, and the model of the voltage stabilizing chip U10 is mic5330;
as shown in fig. 3, the master control module includes a first pin 1 of the master control chip U8 connected to one end of the twenty-seventh capacitor C20 and a second pin 2 of the sixth chip U6, a second pin 5 connected to one end of the eighteenth resistor 18, a first pin 1 of the sixth chip U6 connected to the other end of the twenty-second capacitor C22 and connected to VCC-BAT, a second pin 2 of the twenty-second capacitor C22 connected to ground, a third pin 3 connected to one end of the twenty-seventh capacitor C27 and one end of the first crystal oscillator Y1 connected to ground, a fourth pin 4 connected to one end of the first crystal oscillator Y1 and one end of the twenty-eighth capacitor C28 connected to ground, a second pin 5 connected to one end of the eighteenth resistor 18, a first pin 29 of the twenty-ninth capacitor C29 connected to ground, a third pin 6 of the master control chip U8 connected to the other end of the eighteenth resistor Y2 and connected to ground, a third pin 3 of the thirty-first capacitor C31 connected to the thirty-second capacitor C2, a fourth pin 2 connected to the third capacitor C8, a fourth pin 2 connected to the third pin 2 of the thirty-third capacitor C31, a fourth pin 2 connected to the third capacitor C8 connected to ground, a fourth pin 21 of the third capacitor C8 connected to the third capacitor C9 and the other end of the twenty-fourth capacitor C20 connected to ground, a fourth pin 21 connected to the third pin 12 and the third capacitor C9 connected to the third capacitor C9 and the third capacitor C12 and the fourth capacitor C20 connected to the fourth pin 12 and the fourth resistor 12 and the eighth resistor 12 connected to the third resistor 12 and the fourth resistor 12 and the eighth resistor 12 and the fourth resistor 2 connected to the eighth resistor 12 and the fourth resistor 2, the other end of the thirty-eighth capacitor C38 is grounded, the other end of the thirty-seventh capacitor C8 is grounded, the other end of the thirty-seventh capacitor C37 is grounded, the 33 pin of the master control chip U8 is connected with the IDLE_MCU, the 34 pin BL_AT, the 35 pin BL_EN, the 36 pin BL_RST, the 37 pin BL_LED, the 39 pin READER_MCU, the 40 pin BL-RST, the 27 pin POWERLED-B-JC, the 28 pin BOOT1, the 29 pin BL-RXD, the 30 pin BL-TXD, the 31 pin is grounded, the 32 pin is connected with one end of the thirty-seventh capacitor C37 and connected with the MCU-VCC, the other end of the thirty-seventh capacitor C37 is grounded, the 33 pin of the master control chip U8 is connected with the IDLE_MCU, the 34 pin BL_AT, the 35 pin BL_EN, the 36 pin BL_RST, the 37 pin BL_LED, the 39 pin READER_MCU are connected with the cathode of the first light emitting diode D1, the anode of the first light emitting diode D1 is connected with one end of the sixteenth resistor R16 and the other end of the sixteenth resistor R16 is connected with the MCU-VCC, the other end of the thirty-seventh resistor C16 is connected with the MCU_TEST 8, the pin 42 is connected with one end of a fifty-seventh resistor R57, the other end of the fifty-seventh resistor R57 is connected with RXD-MCU, the pin 43 of the main control chip U8 is connected with one end of a fifty-sixth resistor R56, the other end of the fifty-sixth resistor R56 is connected with TXD-MCU, the pin 44 of the main control chip U8 is connected with the BELL, the pin 46 is connected with the J_TMS, the pin 47 is grounded, the pin 48 is connected with one end of a twenty-sixth capacitor C26 and connected with MCU-VCC, the other end of the twenty-sixth capacitor C26 is grounded, the pin 49 is connected with the J_TCK, the pin 50 is connected with the J_TDI, the pin 52 is connected with the POWERLED-B, the pin 53 is connected with the POWER-B, the pin 55 is connected with the J_TDO, the pin 56 is connected with one end of a thirteenth resistor R13, the pin 58 is connected with one end of a twelfth resistor R12, the pin 59 is connected with one end of an eleventh resistor R11, the pin 60 is connected with the BOOT0, the pin 61 is connected with one end of a tenth resistor R10, the 63 is grounded, two ends of the 64 pins and one end of the twenty-fourth capacitor C24 are connected in parallel with MCU-VCC, the other end of the tenth resistor R10 is connected with BAT_L4, the other end of the eleventh resistor R11 is connected with BAT_L3, the other end of the twelfth resistor R12 is connected with BAT_L2, and the other end of the thirteenth resistor R13 is connected with BAT_L1;
The model of the main control chip U8 is STM32F103RCT6, the model of the sixth chip U6 is XC6206P332MR, and Y2 is a passive crystal oscillator.
As shown in fig. 4, in the LED control module, pin 1 of the first voltage regulator chip U1 is connected to one end of the first capacitor C1 and connected in parallel to VCC-BAT, pin 2 is grounded, pin 3 is connected to one end of the third capacitor C3, pin 4 is connected to one end of the fourth resistor R24 and connected in parallel to BLPOWER-KZ, pin 5 is connected to one end of the eighth fifth resistor R85 and connected in parallel to powerrled-B, pin 6 is overhead, pin 7 is connected to one end of the fourth capacitor C4 and one end of the first inductor, pin 8 is connected to one end of the second capacitor C2 and connected in parallel to VCC-LED, pin 9 is grounded, the other end of the first inductor L1 is connected to the other end of the eighth capacitor C8 and connected in parallel to bl_vcc, the other end of the first capacitor C1, the other end of the second capacitor C2, the other end of the third capacitor C3, the other end of the fourth capacitor C4, the other end of the eighth capacitor C8, the other end of the twenty-fourth resistor R24, and the other end of the eighth fifth resistor R85 are grounded;
the model of the first voltage stabilizer chip U1 is mic5330
As shown in fig. 5, in the buzzer module, the 1 pin of the buzzer U17 is connected with one end of the fifty-eighth resistor R58, the other end of the fifty-eighth resistor R58 is connected with the MCU-VCC, the 2 pin of one end of the buzzer U17 is connected with the C pin of the triode Q1, the B pin of the triode Q1 is connected with one end of the fifty-ninth resistor R59, the other end of the fifty-ninth resistor R59 is connected with the BELL, and the E pin of the triode Q1 is grounded; the model of the triode Q1 is S9013;
As shown in fig. 6, in the lighting module, pin 1 of the fifth connector P5 is connected to one end of a seventy resistor R70 and one end of a seventy-two resistor R72, the other end of the seventy resistor R70 and the other end of the seventy-two resistor R72 are connected to one end of a fifty-first capacitor C51 and connected in parallel to VCC-LEDs, the other end of the fifty-first capacitor C51 is grounded, and pin 2 of the fifth connector P5 is grounded; the pin 1 of the fourth connector P4 is connected with one end of a sixty-sixth resistor R66 and one end of a sixty-eighth resistor R68, the other end of the sixty-sixth resistor R66 and the other end of the sixty-eighth resistor R68 are connected with one end of a fifty-seventh capacitor C50 and connected with a VCC-LED in parallel, the other end of the fifty-seventh capacitor C50 is grounded, and the pin 2 of the fourth connector P4 is grounded; one end of the seventy-third resistor R73 is connected with MCU-VCC, the other end of the seventy-third resistor R73 is connected with one end of the seventh switch S7, one end of the fifty-second capacitor C52 is connected with BL-RST in parallel, and the other end of the fifty-second capacitor C52 is connected with the other end of the seventh switch S7 and is grounded;
as shown in fig. 7, in the bluetooth module, pin 1 of the sixteenth chip U16 is connected to one end of the forty-third capacitor C43 and connected in parallel to bl_vcc, the other end of the forty-third capacitor C43 is grounded, pin 2, pin 3, pin 4, pin 5, pin 7, pin 8, pin 9, pin 10, pin 11, pin 12, pin 13, pin 14, pin 15, pin 16, pin 17, pin 18 are empty, pin 6 is connected to one end of the fifty-first resistor R50, the other end of the fifty-first resistor R50 is connected to the anode of the ninth light-emitting diode D9, the cathode of the ninth light-emitting diode D9 is grounded, pin 19 of the sixteenth chip U16 is connected to one end of the forty-fourth resistor R44, the other end of the forty-fourth resistor R44 is connected to bl_txd, pin 20 of the sixteenth chip U16 is connected to one end of the forty-second resistor R42, the other end of the forty-second resistor R42 is connected to bl_rxd, pin 21 of the sixteenth chip U16 is connected to one end of the second resistor R52, the other end of the fifty-second resistor R52 is connected to the other end of the fifty-first resistor R55 and connected to the other end of the fifty-fifth resistor bl_55; the pin 22 of the sixteenth chip U16 is connected with one end of a forty-ninth resistor R49, the other end of the forty-ninth resistor R49 is connected with BL_EN, the pin 23 of the sixteenth chip U16 is connected with one end of a forty-seventh resistor R47, the other end of the forty-seventh resistor R47 is connected with one end of a forty-fifth resistor R45 in parallel connection with BL_RST, the other end of the forty-fifth resistor R45 is connected with BL_VCC, and the pin 24 of the sixteenth chip U16 is grounded.
As shown in fig. 8, in the battery management module, pin 1 of the thirteenth chip U13 is connected to one end of the thirty-second resistor R32 and one end of the thirty-fourth resistor R34, pin 2 is connected to one end of the fortieth first resistor R41, pin 3 is connected to one end of the thirty-seventh resistor R37 and one end of the thirty-fourth resistor R34, pin 4 is connected to one end of the fortieth third resistor R43, pin 5 is connected to one end of the thirty-seventh resistor R37 and one end of the thirty-ninth resistor R39, pin 6 is connected to one end of the fortieth sixth resistor R46, pin 7 is connected to one end of the thirty-ninth resistor R39 and one end of the fortieth resistor R40, pin 8 is connected to one end of the fifty-first resistor R51, pin 9 is connected to one end of the thirteenth chip U13, pin 16 of the thirteenth chip U13, one end of the fortieth second capacitor C42, the other end of the thirty-second resistor R32 and the other end of the fortieth capacitor C32 are connected to the pin-power element jc, pin 6 is connected to the pin C-power element, pin C42, the other end of the fortieth capacitor C42, the other end of the thirteen capacitor C42, the thirteen pins 12, the thirteen pins 13 and the thirteen chips 13 are connected to ground, and 10 are connected to the ground; the other end of the forty-first resistor R41 is connected with the cathode of the fourth diode D4, one end of the forty-third resistor R43 is connected with the cathode of the fifth diode D5, one end of the forty-sixth resistor R46 is connected with the cathode of the sixth diode D6, one end of the fifty-first resistor R51 is connected with the cathode of the seventh diode D7, and the anode of the fourth diode D4, the anode of the fifth diode D5, the anode of the sixth diode D6 and the anode of the seventh diode D7 are connected with MCU-VCC;
The thirteenth power detection chip U13 is model CN1185,
as shown in fig. 9, in the USB management module, pin 1 of the first chip J1 is connected to one end of a forty-ninth capacitor C49, pin 2 of the fourteenth chip U14 is connected to and connected to usb_vbus, pin 2 is connected to and connected to usb_dm, pin 3 is connected to and connected to pin 3 of the fourteenth chip U14, pin 4 is overhead, pin 5 and pin 6 are grounded, pin 4 of the fourteenth chip U14 and the other end of a forty-ninth capacitor C49 are grounded, pin 1 of the eleventh chip U11 is connected to one end of a forty-first capacitor C41 and connected to usb_vbus, pin 2 and pin 4 are overhead, pin 3 is connected to the cathode of the second diode D2, pin 5 and pin 9 are grounded, pin 6 is connected to one end of a thirty-sixth resistor R36, pin 7 is connected to one end of a thirty-third resistor R33, pin 8 is connected to one end of the forty-capacitor C40, pin 1 of a connector P1, pin thirty-fifth resistor R35 is connected to and connected to one end of a VCC-BAT, and pin 2 is connected to the other end of the fortieth capacitor C35 and the other end of the fortieth resistor C2 and the fortieth resistor C33; the fifteenth chip U15 has pins 1, 10, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 27, 4, 5, 6 and 6 pins connected with one end of a forty-fifth capacitor C45 and connected with pin 2 of U6, 7 and one end of a forty-seventh capacitor C47, one end of a forty-eighth capacitor C48, one end of a fifty-third resistor R53, 8 pins of the fifteenth chip U15, 10 and one end of a fifty-third resistor R53, 11 and one end of a fifty-fourth resistor R54, 24 pins RTSB, 25 pins RXD-MCU,26 pins TXD-MCU,28 pins DTRUSB, one end of the forty-fifth capacitor C45, one end of the forty-seventh capacitor C47, one end of the forty-eighth capacitor C48, one end of the fifty-fourth resistor R54, and one end of the fifteenth chip U15, and the fifteenth chip U29 connected with ground;
The first chip J1 is a universal microUSB interface, and the model number of the eleventh chip U11 is SGM4056.
As shown in fig. 10, in the POWER control key module, one end of an eighteenth resistor R82 is connected to MCU-VCC, the other end of the eighteenth resistor R82 is connected to one end of an eighth key S8, the other end of the eighth key S8 is connected to one end of an eighteenth resistor R83 and one end of a fifty-fourth capacitor C54, and connected in parallel to a POWER-B-JC, and the other end of the eighteenth resistor R83 and the other end of the fifty-fourth capacitor C54 are grounded;
as shown in fig. 11, in the tag reading key module, one end of the first resistor R1 is connected to the MCU-VCC, the other end of the first resistor R1 is connected to one end of the first key S1, one end of the tenth capacitor C10 is connected in parallel to the reader_mcu, and the other end of the tenth capacitor C10 is connected to the other end of the first key S1 and grounded. The working process of the whole circuit comprises the following steps:
the system takes MCU as a control core, coordinates each functional module to accurately complete each function, responds to external control through a key interface, reflects the working state of the whole system through a buzzer and an indicator lamp, realizes data interaction with an external wired mode through a usb interface, realizes data interaction with an external wireless mode through a Bluetooth module, performs data interaction between the MCU and a radio frequency module through USART to acquire tag information in the electromagnetic field range of an induction coil, transmits a modulation signal to a radio frequency amplifier to amplify power, and effectively suppresses external EMI interference for ensuring that the induction antenna can obtain an integrity signal with maximum power so as to excite a sufficient electromagnetic field environment in which the tag can normally work, and an impedance matching network realizes the maximum power acquisition of the induction antenna.
The ultra-high frequency RFID induction coil performs energy interaction with the ultra-high frequency RFID near field tag through an inductive coupling principle. The main effect at this time is not the electromagnetic far field, but the strong magnetic near field. The strong magnetic near field has a clear range limit. The size of the induction coil should be comparable to the near field tag size. The variable damping system is used for continuously and steplessly trimming the range of the strong magnetic near field generated by the induction coil. The range of the induction coil for identifying the ultrahigh frequency near field tag can be accurately controlled within the size range of the induction coil through adjustment of the damping system.
The shielded transmission line structure is configured to transfer radio frequency signals between the RFID radio frequency module and the induction coil. The shielding is to avoid that the energy leakage during transmission causes misreading of other tags. The shielding transmission line structure can be made into a bendable rebound type appearance according to the requirement, so that the shielding transmission line structure is convenient for a user to use.
The input impedance of the prior induction coil and variable damping system after passing through the shielding transmission line is far away from the output impedance of the RFID radio frequency module. At this time, an impedance matching network needs to be added to match the two networks, so as to achieve the maximum power transmission effect.

Claims (1)

1. A high-precision ultrahigh frequency RFID near-field tag detection system is characterized in that: the system comprises a main control module, an ultrahigh frequency RFID induction coil, a variable damping system, a shielding transmission line structure, an impedance matching network, a radio frequency module, a power module, a Bluetooth module, a USB data interface, an LED lamp, an illumination module and a buzzer module;
The output end of the radio frequency module is connected with the input end of the impedance matching network, the output end of the impedance matching network is connected with the input end of the variable damping system through the shielding transmission line structure, the output end of the variable damping system is connected with the ultrahigh frequency RFID induction coil, and the power module supplies power to each module; the shielding transmission line structure is made of elastic materials;
the main control module comprises a radio frequency module, a main controller module, an LED control module, a buzzer module, an illumination module, a Bluetooth module, a USB management module, a power control key module and a tag reading key module;
the radio frequency module comprises a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eleventh capacitor C11, a twelfth capacitor C12, a thirteenth capacitor C13, a fourteenth capacitor C14, a fifteenth capacitor C15, a sixteenth capacitor C16, a seventeenth capacitor C17, an eighteenth capacitor C18, a twenty-first capacitor C21, a twenty-third capacitor C23, a twenty-fifth capacitor C25, a thirty-fourth capacitor C34, a fortieth capacitor C44, a thirty-second capacitor C32, a thirty-third capacitor C33, a thirty-fifth capacitor C35, a thirty-sixth capacitor C36 thirty-ninth capacitor C39, second resistor R2, third resistor R3, fourth resistor R4, sixth resistor R6, seventh resistor R7, eighth resistor R8, ninth resistor R9, fourteenth resistor R14, fifteenth resistor R15, seventeenth resistor R17, nineteenth resistor R19, twenty-second resistor R22, twenty-third resistor R23, second inductor L2, third inductor L3, fourth inductor L4, fifth inductor L5, singlechip U5, radio frequency chip U4, passive crystal oscillator chip U2, radio frequency protocol processing chip U9, conditioning chip U3, and radio frequency signal conditioning chip U7;
The 1 pin of the singlechip U5 is grounded with MCU-3.3V and 2 pins, the 3 pin is grounded with VCC-3.3,4 pins, the 4 pin of the radio frequency signal regulating chip U7 is connected with one end of the fourth inductor L4, the 5 pin is connected with the other end of the fourth inductor L4 and the 3 pin of the radio frequency signal regulating chip U7, the 8 pin is grounded, the 9 pin is connected with one end of the fifteenth capacitor C15, one end of the sixteenth capacitor C16 and one end of the third inductor L3, the 10 pin is connected with the 11 pin of the singlechip U5 and the other end of the fifteenth capacitor C15 and connected with VCC-3.3 in parallel, the other end of the sixteenth capacitor C16 is grounded, the 13 pin of the singlechip U5 is connected with one end of the twelfth capacitor C12 and the 1 pin of the passive crystal oscillator chip U2, the 14 pin is connected with one end of the eleventh capacitor C11, the other end of the passive crystal oscillator chip U2, the other end of the twelfth capacitor C12 and the other end of the passive crystal oscillator chip U2 are grounded, the 15 pin of the single chip U5 is connected with the 4 pin of the voltage stabilizing chip U10, the 16 pin is connected with one end of the fifteenth resistor, the 18 pin is connected with the system ground GND, the 19 pin is connected with one end of the eighteenth capacitor C18 and connected with VCC-3.3 in parallel, the other end of the eighteenth capacitor C18 is grounded, the 20 pin of the single chip U5 is connected with one end of the seventh resistor R7, the 21 pin of the single chip U5 is connected with one end of the ninth resistor R9, the other end of the seventh resistor R7 is connected with the 5 pin of the radio frequency protocol processing chip U9, the other end of the ninth resistor R9 is connected with the 3 pin of the radio frequency protocol processing chip U9, the 22 pin is connected with the 8 pin of the radio frequency protocol processing chip U9, the 23 pin is connected with the 7 pin of the radio frequency protocol processing chip U9, the 24 pin is connected with the 5 pin of the voltage stabilizing chip U10, the 25 pin is connected with one end of the twenty-first capacitor C21 and connected with MCU-3.3V, the 26 pin is suspended, the 27 pin is connected with one end of a third resistor, the 28 pin is connected with one end of a fourth resistor, the other end of the third inductor L3 is connected with one end of a seventeenth capacitor C17 and one end of a radio frequency chip U4, the other end of the seventeenth capacitor C17 is grounded, the 4 pin of the radio frequency chip U4 is connected with one end of a fourth resistor R4 and one end of a sixth resistor R6, the other end of the sixth resistor R6 is grounded, the other end of the fourth resistor R4 is connected with the 28 pin of a singlechip U5, the 5 pin of the radio frequency chip U4 is connected with one end of the third resistor R3 and one end of an eighth resistor R8, the other end of the third resistor R3 is grounded, the other end of the eighth resistor R8 is grounded, the 6 pin of the radio frequency chip U4 is connected with one end of a second resistor R2, the other end of the second resistor R2 is grounded, the 7 pin of the radio frequency chip U4 is grounded, the 8 pin of the radio frequency chip U4 is connected with one end of a twenty-third capacitor C23, the other end of the twenty-third capacitor C23 is grounded, the other end of the radio frequency chip U23 is connected with the 1 pin of a radio frequency signal adjusting chip U7, the radio frequency signal adjusting chip U2 and the overhead pins are grounded, and the overhead pins are grounded at 6; the pin 9 of the radio frequency chip U4 is connected with the pin 4 of the conditioning chip U3, the pin 10 is connected with the pin 1 of the radio frequency chip U4, one end of a fifth capacitor C5, one end of a sixth capacitor C6, one end of a seventh capacitor C7 and the pin 8 of the voltage stabilizing chip U10, the other end of the fifth capacitor C5, the other end of the sixth capacitor C6 and the other end of the seventh capacitor C7 are grounded, the pin 1, the pin 3, the pin 5 and the pin 7 of the conditioning chip U3 are grounded, the pin 2 and the pin 6 are overhead, the pin 8 is connected with one end of a thirteenth capacitor C13 and one end of a second inductor L2, the other end of the thirteenth capacitor C13 is grounded, the other end of the second inductor L2 is connected with one end of a fourteenth capacitor C14 and the input end of a radio frequency connector, the other end of the fourteenth capacitor C14 is grounded, the pin 0 of the radio frequency protocol processing chip U9 is grounded, the pin 2 is connected with one end of a fortieth capacitor C44, the other end of the fortieth capacitor C44 is connected, the 3 pin of the radio frequency protocol processing chip U9 is connected with one end of a ninth resistor, the 4 pin is grounded, the 5 pin is connected with one end of a seventh resistor, the 7 pin is connected with one end of a seventeenth resistor R17, the other end of the seventeenth resistor R17 is connected with MCU-3.3V, the 8 pin of the radio frequency protocol processing chip U9 is connected with one end of a nineteenth resistor R19, one end of the nineteenth resistor R19 is connected with MCU-3.3V, the 12 pin of the radio frequency protocol processing chip U9 is grounded, the 13 pin is connected with one end of a thirty-fourth capacitor C34, the other end of the thirty-fourth capacitor C34 is grounded, the 18 pin is connected with the 32 pin of the singlechip U5, the 26 pin is connected with the 30 pin of the radio frequency protocol processing chip U9 and one end of a fourteenth resistor R14, the other end of the fourteenth resistor R14 is connected with one end of the twentieth resistor, the 27 pins and 28 pins are connected with the one end of the twenty-fifth capacitor C25 in parallel connection with MCU-3.3V, the other end of the twenty-fifth capacitor C25 is grounded, the 31 pin of the radio frequency protocol processing chip U9 is connected with one end of the fifteenth resistor R15, the other end of the fifteenth resistor R15 is connected with one end of the twenty first resistor, and the 1 pin, the 6 pin, the 9 pin, the 10 pin, the 11 pin, the 14 pin, the 15 pin, the 16 pin, the 17 pin, the 19 pin, the 20 pin, the 21 pin, the 22 pin, the 23 pin, the 24 pin, the 25 pin, the 28 pin and the 32 pin are overhead; one end of the thirty-second capacitor C32 is grounded, the other end of the thirty-second capacitor C32 is connected with the 1 pin of the voltage stabilizing chip U10 and connected with the power VCC-BAT in parallel, the 2 pin of the voltage stabilizing chip U10 is grounded, the 3 pin of the voltage stabilizing chip U10 is connected with one end of the thirty-fifth capacitor C35, the other end of the thirty-fifth capacitor C35 is grounded, the 4 pin of the voltage stabilizing chip U10 is connected with one end of the twenty-second resistor R22, the 5 pin of the voltage stabilizing chip U10 is connected with one end of the twenty-third resistor R23 and connected with PA_VPD in parallel, the 6 pin of the voltage stabilizing chip is overhead, the 7 pin of the voltage stabilizing chip U5 is connected with one end of the thirty-sixth capacitor C36, one end of the fifth inductor L5 is connected with VCC-3.3,8 pin of the thirty-third capacitor C33 and connected with PA-3.3 in parallel, the other end of the twenty-second resistor R22, the other end of the twenty-third resistor R23, the other end of the thirty-sixth capacitor C36 and the other end of the thirty-third capacitor C33 are grounded, and the other end of the fifth inductor L5 is connected with one end of the thirty-ninth capacitor C39 and connected with MCU-3.3; the other end of the thirty-ninth capacitor C39 is grounded;
The model of the singlechip U5 is STR09, the model of the radio frequency chip U4 is RF7418, the model of the radio frequency protocol processing chip U9 is STR01, the model of the conditioning chip U3 is 0915LP15B026, the model of the radio frequency signal conditioning chip U7 is BD0810J50100AHF, and the model of the voltage stabilizing chip U10 is mic5330;
the main control module comprises a main control chip U8, wherein a pin 1 is connected with one end of a twenty-seventh capacitor C20 and a pin 2 of a sixth chip U6, the other end of the twenty-eighth capacitor C20 is grounded, a pin 1 of the sixth chip U6 is grounded, a pin 3 of the sixth chip U6 is connected with one end of a twenty-second capacitor C22 and is connected with VCC-BAT in parallel, the other end of the twenty-second capacitor C22 is grounded, the pin 2 of the main control chip U8 is grounded, the pin 3 is connected with one end of a twenty-seventh capacitor C27 and one end of a first crystal oscillator Y1, the other end of the twenty-seventh capacitor C27 is grounded, a pin 4 is connected with the other end of the first crystal oscillator Y1 and one end of a twenty-eighth capacitor C28, a pin 5 is connected with one end of an eighteenth resistor 18, one end of a twenty-ninth capacitor C29 and the 1 pin of a passive crystal oscillator Y2, the other end of the twenty-ninth capacitor C29 is grounded, the pin 6 of the main control chip U8 is connected with the other end of the eighteenth resistor 18, one end of the thirty-first capacitor C31 and the pin 3 of the passive crystal oscillator Y2, the other end of the thirty-first capacitor C31 is grounded, the 2 pins and the 4 pins of the passive crystal oscillator Y2 are grounded, the 7 pin of the main control chip U8 is connected with MCU_RESET, the 8 pin is connected with BLPOWER-KZ, the 9 pin is overhead, the 10 pin is connected with POWERLED, the 11 pin is overhead, the 12 pin is grounded, the 13 pin is connected with one end of the thirty-first capacitor C30 and connected with MCU-VCC in parallel, the other end of the thirty-first capacitor C30 is grounded, the 14 pin of the main control chip U8 is connected with the POWER-B-JC, the 15 pins RF_EN, the 16 pin is connected with one end of the twentieth resistor R20, the other end of the twentieth resistor R20 is connected with RXD-TTL, the other end of the twenty-first resistor R21 is connected with TXD-TTL, the 18 pin of the main control chip U8 is grounded, the 19 pin is connected with one end of the thirty-eighth capacitor C38 and connected with MCU-VCC, the other end of the thirty-eighth capacitor C38 is grounded, the main control chip U8 is composed of 20, 21, 22, 23, 24, 26, 30, 38, 45, 51, 54, 62, 25, 27, 28, 29, 30, 31, 32 and 32 feet, 33, 34, 35, 36, 37 feet BL, 39 feet READER, 40 feet are connected with cathode of the first LED D1, anode of the first LED D1 is connected with one end of the sixteenth resistor R16, the other end of the sixteenth resistor R16 is connected with MCU-VCC, the other end of the thirty seventh capacitor C37 is grounded, 33 feet of the main control chip U8 are connected with IDLE, 34 feet BL, 35 feet BL, 36 feet BL, RST,37 feet BL, LED,39 feet READER, MCU,40 feet are connected with cathode of the first LED D1, anode of the first LED D1 is connected with one end of the sixteenth resistor R16, the other end of the sixteenth resistor R16 is connected with MCU-VCC, 41 feet of the main control chip U8 are connected with the fifty seventh resistor R57, the other end of the fifty-seventh resistor R57 is connected with RXD-MCU, the other end of the fifty-sixth resistor R56 is connected with TXD-MCU, the other end of the fifty-sixth resistor R56 is connected with BELL,46 is connected with J_TMS,47 is connected with ground, 48 is connected with one end of the twenty-sixth capacitor C26 and connected with MCU-VCC, the other end of the twenty-sixth capacitor C26 is connected with ground, 49 is connected with J_TCK,50 is connected with J_TDI,52 is connected with POWERLED-B,53 is connected with POWER-B,55 is connected with J_TDO,56 is connected with J_RST,57 is connected with one end of the thirteenth resistor R13, 58 is connected with one end of the twelfth resistor R12, 59 is connected with one end of the eleventh resistor R11, 60 is connected with BOOT0, 61 is connected with one end of the tenth resistor R10, 63 is connected with ground, 64 is connected with two ends of the twenty-fourth capacitor C24 and connected with MCU-VCC, the other end of the tenth resistor R10 is connected with the BAT_L4, the other end BAT_L3 of the eleventh resistor R11, the other end BAT_L2 of the twelfth resistor R12 and the other end BAT_L1 of the thirteenth resistor R13;
The model of the main control chip U8 is STM32F103RCT6, the model of the sixth chip U6 is XC6206P332MR, and Y2 is a passive crystal oscillator;
the first voltage stabilizer chip U1 in the LED control module is connected with one end of a first capacitor C1 and connected with VCC-BAT in parallel, the 2 pin is grounded, the 3 pin is connected with one end of a third capacitor C3, the 4 pin is connected with one end of a twenty-fourth resistor R24 and connected with BLPOWER-KZ in parallel, the 5 pin is connected with one end of an eighty-fifth resistor R85 and connected with POWERLED-B in parallel, the 6 pin is overhead, the 7 pin is connected with one end of a fourth capacitor C4 and one end of a first inductor, the 8 pin is connected with one end of a second capacitor C2 and connected with VCC-LED in parallel, the 9 pin is grounded, the other end of the first inductor L1 is connected with the other end of an eighth capacitor C8 and connected with BL_VCC in parallel, the other end of the first capacitor C1, the other end of the second capacitor C2, the other end of the third capacitor C3, the other end of the fourth capacitor C4, the other end of the eighth capacitor C8, the other end of the twenty-fourth resistor R24 and the other end of the eighty-fifth resistor R85 are grounded;
the model of the first voltage stabilizer chip U1 is mic5330
In the buzzer module, a 1 pin of a buzzer U17 is connected with one end of a fifty-eighth resistor R58, the other end of the fifty-eighth resistor R58 is connected with MCU-VCC, a 2 pin of one end of the buzzer U17 is connected with a C pin of a triode Q1, a B pin of the triode Q1 is connected with one end of a fifty-ninth resistor R59, the other end of the fifty-ninth resistor R59 is connected with BELL, and an E pin of the triode Q1 is grounded; the model of the triode Q1 is S9013;
In the lighting module, pin 1 of the fifth connector P5 is connected with one end of a seventy resistor R70 and one end of a seventy-two resistor R72, the other end of the seventy resistor R70 and the other end of the seventy-two resistor R72 are connected with one end of a fifty-first capacitor C51 and connected with a VCC-LED in parallel, the other end of the fifty-first capacitor C51 is grounded, and pin 2 of the fifth connector P5 is grounded; the pin 1 of the fourth connector P4 is connected with one end of a sixty-sixth resistor R66 and one end of a sixty-eighth resistor R68, the other end of the sixty-sixth resistor R66 and the other end of the sixty-eighth resistor R68 are connected with one end of a fifty-seventh capacitor C50 and connected with a VCC-LED in parallel, the other end of the fifty-seventh capacitor C50 is grounded, and the pin 2 of the fourth connector P4 is grounded; one end of the seventy-third resistor R73 is connected with MCU-VCC, the other end of the seventy-third resistor R73 is connected with one end of the seventh switch S7, one end of the fifty-second capacitor C52 is connected with BL-RST in parallel, and the other end of the fifty-second capacitor C52 is connected with the other end of the seventh switch S7 and is grounded;
in the bluetooth module, pin 1 of the sixteenth chip U16 is connected to one end of the forty-third capacitor C43 and connected with bl_vcc, the other end of the forty-third capacitor C43 is grounded, pin 2, pin 3, pin 4, pin 5, pin 7, pin 8, pin 9, pin 10, pin 11, pin 12, pin 13, pin 14, pin 15, pin 16, pin 17, pin 18 are empty, pin 6 is connected to one end of the fifty-th resistor R50, the other end of the fifty-th resistor R50 is connected to the anode of the ninth light emitting diode D9, the cathode of the ninth light emitting diode D9 is grounded, pin 19 of the sixteenth chip U16 is connected to one end of the forty-fourth resistor R44, the other end of the forty-fourth resistor R44 is connected with bl_txd, the other end of the sixteenth chip U16 is connected with one end of the forty-second resistor R42, the other end of the sixteenth chip U16 is connected with one end of the fifty-second resistor R52, the other end of the fifty-second resistor R52 is connected with the fifty-fifth resistor R55 and connected with the other end of the fifty-fifth resistor bl_55 AT; the pin 22 of the sixteenth chip U16 is connected with one end of a forty-ninth resistor R49, the other end of the forty-ninth resistor R49 is connected with BL_EN, the pin 23 of the sixteenth chip U16 is connected with one end of a forty-seventh resistor R47, the other end of the forty-seventh resistor R47 is connected with one end of a forty-fifth resistor R45 in parallel connection with BL_RST, the other end of the forty-fifth resistor R45 is connected with BL_VCC, and the pin 24 of the sixteenth chip U16 is grounded;
In the power supply module, a pin 1 of a thirteenth chip U13 is connected with one end of a thirty-second resistor R32 and one end of a thirty-fourth resistor R34, a pin 2 is connected with one end of a forty-first resistor R41, a pin 3 is connected with one end of a thirty-seventh resistor R37 and the other end of the thirty-fourth resistor R34, a pin 4 is connected with one end of a forty-third resistor R43, a pin 5 is connected with the other end of the thirty-seventh resistor R37 and one end of a thirty-ninth resistor R39, a pin 6 is connected with one end of a forty-sixth resistor R46, a pin 7 is connected with the other end of the thirty-ninth resistor R39 and one end of a forty-first resistor R40, a pin 8 is connected with one end of a forty-first resistor R51, a pin 9 is connected with the 11 pin of the thirteenth chip U13, the 16 pin of the thirteenth chip U13, one end of a forty-second capacitor C42, the other end of the thirty-second resistor R32 and is connected in parallel with VCC-POWERJC, the other end of the forty-second capacitor C42, the other end of the thirteenth resistor C13, the thirteen pins of the thirteenth chip U13, the thirteen chip U13, and the thirteen pins 13 and the thirteen chips 13 are connected with ground 10; the other end of the forty-first resistor R41 is connected with the cathode of the fourth diode D4, one end of the forty-third resistor R43 is connected with the cathode of the fifth diode D5, one end of the forty-sixth resistor R46 is connected with the cathode of the sixth diode D6, one end of the fifty-first resistor R51 is connected with the cathode of the seventh diode D7, and the anode of the fourth diode D4, the anode of the fifth diode D5, the anode of the sixth diode D6 and the anode of the seventh diode D7 are connected with MCU-VCC;
The thirteenth power detection chip U13 is model CN1185,
in the USB management module, pin 1 of the first chip J1 is connected to one end of a forty-ninth capacitor C49, pin 2 of the fourteenth chip U14 is connected to and connected to usb_vbus, pin 2 is connected to and connected to pin 4 of the fourteenth chip U14, pin 3 is connected to and connected to usb_dp, pin 4 is overhead, pin 5 and pin 6 are grounded, pin 4 of the fourteenth chip U14 and the other end of the forty-ninth capacitor C49 are grounded, pin 1 of the eleventh chip U11 is connected to one end of a forty-first capacitor C41 and connected to usb_vbus, pin 2 and pin 4 are overhead, pin 3 is connected to the cathode of the second diode D2, pin 5 and pin 9 are grounded, pin 6 is connected to one end of a thirty-sixth resistor R36, pin 7 is connected to one end of a thirty-third resistor R33, pin 8 is connected to one end of the forty-capacitor C40, pin 1 of the connector P1, one end of the thirty-fifth resistor R35 is connected to and connected to-BAT, and anode of the second diode D2 is grounded to the other end of the forty-first resistor C35, the forty-third resistor C33, and the other end of the forty-third resistor C2 is connected to the forty-third resistor R33; the fifteenth chip U15 has pins 1, 10, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 27, 4, 5, 6 and 6 pins connected with one end of a forty-fifth capacitor C45 and connected with pin 2 of U6, 7 and one end of a forty-seventh capacitor C47, one end of a forty-eighth capacitor C48, one end of a fifty-third resistor R53, 8 pins of the fifteenth chip U15, 10 and one end of a fifty-third resistor R53, 11 and one end of a fifty-fourth resistor R54, 24 pins RTSB, 25 pins RXD-MCU,26 pins TXD-MCU,28 pins DTRUSB, one end of the forty-fifth capacitor C45, one end of the forty-seventh capacitor C47, one end of the forty-eighth capacitor C48, one end of the fifty-fourth resistor R54, and one end of the fifteenth chip U15, and the fifteenth chip U29 connected with ground;
The first chip J1 is a universal microUSB interface, and the model number of the eleventh chip U11 is SGM4056;
one end of an eighty-second resistor R82 in the POWER control key module is connected with MCU-VCC, the other end of the eighty-second resistor R82 is connected with one end of an eighth key S8, the other end of the eighth key S8 is connected with one end of an eighty-third resistor R83 and one end of a fifty-fourth capacitor C54 in parallel connection with POWER-B-JC, and the other end of the eighty-third resistor R83 and the other end of the fifty-fourth capacitor C54 are grounded;
one end of a first resistor R1 in the tag reading key module is connected with MCU-VCC, the other end of the first resistor R1 is connected with one end of a first key S1 and one end of a tenth capacitor C10 in parallel connection with READER_MCU, and the other end of the tenth capacitor C10 is connected with the other end of the first key S1 and grounded.
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CN106599972A (en) * 2015-10-16 2017-04-26 中国科学院上海高等研究院 Super-high-frequency RFID tag chip impedance self-adaption circuit and realization method thereof
CN208506759U (en) * 2018-05-11 2019-02-15 杭州义益钛迪信息技术有限公司 High-precision ultrahigh frequency RFID near field tag detection system

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Publication number Priority date Publication date Assignee Title
CN101464518A (en) * 2008-12-30 2009-06-24 郑之敏 Detection controller of RFID matrix distributed personnel positioning monitoring system and its monitoring method
CN103839092A (en) * 2014-03-06 2014-06-04 太仓欧卡网络服务有限公司 Ultrahigh-frequency RFID reader-writer
CN104021658A (en) * 2014-05-14 2014-09-03 浙江省农业科学院 GS1010-based Wi-Fi wireless sensor network data acquisition system
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