CN108363229B - Display device and manufacturing method thereof - Google Patents
Display device and manufacturing method thereof Download PDFInfo
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- CN108363229B CN108363229B CN201810168101.8A CN201810168101A CN108363229B CN 108363229 B CN108363229 B CN 108363229B CN 201810168101 A CN201810168101 A CN 201810168101A CN 108363229 B CN108363229 B CN 108363229B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133311—Environmental protection, e.g. against dust or humidity
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
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Abstract
A display device comprises a first substrate, a plurality of signal lines, a second substrate, a display medium layer, a sealant, a plurality of conductive pads and a plurality of water blocking material patterns. The first substrate has a first sidewall. The plurality of signal lines are arranged on the inner surface of the first substrate and extend to the first side wall. The second substrate has a second sidewall. The first side wall and the second side wall are located on the same side of the display device. The conductive pads and the water blocking materials are arranged in a staggered mode along a first direction and cover at least part of the first side wall, at least part of the second side wall and the sealant. The conductive pads are electrically connected with the corresponding signal lines. A method for manufacturing a display device is also provided.
Description
Technical Field
The present invention relates to a display device and a method for manufacturing the same, and more particularly, to a display device with a re-adjusted size having a pattern of a water blocking material and a method for manufacturing the same.
Background
Currently, display panels are widely used in various fields, and a design requirement of a narrow bezel is required to effectively utilize the space of the display panel. However, when the narrow bezel design is implemented, moisture may easily enter the display panel, and electronic components inside the display panel are easily affected by moisture, thereby damaging the electronic components, and further reducing the manufacturing yield and affecting the display quality.
Disclosure of Invention
The invention provides a display device, in particular a display device with a readjusted size, which has good water resistance performance and prevents electronic components from losing efficacy due to moisture.
The invention provides a method for manufacturing a display device, in particular a method for manufacturing a display device requiring size readjustment, which can manufacture a display device with good water resistance and prevent electronic elements from losing efficacy due to moisture.
The display device comprises a first substrate, a plurality of signal lines, a second substrate, a display medium layer, a sealant, a plurality of conductive pads and a plurality of water-blocking material patterns. The first substrate has a first sidewall. The plurality of signal lines are arranged on the inner surface of the first substrate. The plurality of signal lines extend to the first side wall. The second substrate is arranged opposite to the first substrate and is provided with a second side wall. The first side wall and the second side wall are located on the same side of the display device. The display medium layer is positioned between the first substrate and the second substrate. The sealant is positioned between the first substrate and the second substrate, and at least part of the sealant surrounds the display medium layer. The conductive pads are separated from each other, arranged along a first direction, and respectively cover a part of the first side wall of the first portion, a part of the second side wall of the first portion, and a first part of the sealant. The conductive pads are electrically connected with the corresponding signal lines. The water blocking material patterns and the conductive pads are arranged in a staggered mode along a first direction. The plurality of water blocking material patterns cover a part of the first side wall of the second part, a part of the second side wall of the second part and the sealant of the second part.
In an embodiment of the invention, a material of the conductive pads includes conductive silver paste, conductive nanoparticles, or a mixture of one of the conductive silver paste and the conductive nanoparticles and a water blocking material.
In an embodiment of the invention, the display device further includes a plurality of organic layers respectively disposed on an inner surface of at least one of the first substrate and the second substrate.
In an embodiment of the invention, the display device further includes at least one external circuit element. At least one external circuit element is provided with a plurality of connecting pads, and the connecting pads are connected with the corresponding conductive connecting pads. The external circuit element covers a portion of the first sidewall and a portion of the second sidewall.
In an embodiment of the invention, the display device further includes at least one water blocking wall. At least one water blocking wall is arranged on a part of the first side wall or a part of the second side wall along the first direction. At least one water blocking wall is connected with at least one end of the water blocking material patterns.
In an embodiment of the invention, the water blocking wall and two adjacent water blocking material patterns connected to the water blocking wall surround one of the conductive pads.
The manufacturing method of the display device of the invention comprises providing a display panel; cutting the display panel; forming a sealant on one side of the display panel to be cut; removing the first substrate, the second substrate and the sealant to expose a first side wall of the first substrate, a second side wall of the second substrate and at least partial side surfaces of the signal lines; forming a plurality of conductive pads; forming a plurality of water blocking material patterns; and solidifying the conductive pads and the plurality of water blocking material patterns. The display panel comprises a first substrate, a plurality of signal lines arranged on the first substrate, a second substrate and a display medium layer positioned between the first substrate and the second substrate. The sealant is filled between the first substrate and the second substrate. The sealant at least partially surrounds the display medium layer. The first side wall and the second side wall are positioned on one side of the display device for cutting. The conductive pads are arranged along a first direction and respectively cover a part of the first side wall of the first part, a part of the second side wall of the first part and the sealant of the first part. The plurality of water blocking material patterns and the plurality of conductive pads are arranged in a staggered mode along the first direction, and the plurality of water blocking material patterns cover a part of the first side wall of the second portion, a part of the second side wall of the second portion and the sealant of the second portion.
In an embodiment of the invention, the forming of the plurality of conductive pads is performed before the forming of the plurality of water blocking material patterns, or the forming of the plurality of water blocking material patterns is performed between the forming of the plurality of conductive pads.
In an embodiment of the invention, a pre-curing step is further included between the forming of the plurality of conductive pads and the forming of the plurality of water blocking material patterns.
In an embodiment of the invention, the method for forming the plurality of conductive structures or the plurality of water blocking material layers includes transfer printing, screen printing, gravure printing, laser ablation, or inkjet printing.
In an embodiment of the invention, the method for manufacturing the display device further includes providing at least one external circuit element to cover a portion of the first sidewall and a portion of the second sidewall. At least one external circuit element is provided with a plurality of connecting pads, and the connecting pads are connected with the corresponding conductive connecting pads.
In an embodiment of the invention, the method for manufacturing the display device further includes forming at least one water blocking wall. At least one water blocking wall is arranged on a part of the first side wall or a part of the second side wall along the first direction. At least one water blocking wall is connected with at least one end of the water blocking material patterns.
In view of the above, the display device and the manufacturing method of the display device of the invention, particularly, when a display device with a re-adjusted size is required, the display panel without the re-adjusted size is cut and then removed (e.g., ground) to expose the first sidewall and the second sidewall and form a plurality of conductive pads, and a plurality of water blocking material patterns are formed between the conductive pads. In this way, after the display panel is cut, the plurality of water blocking material patterns and the conductive pads cover the exposed sidewalls of the display panel, the partial side surfaces of the signal lines, the sealant, and the organic layer (e.g., an alignment film or other suitable film layer) on the inner surface of the substrate before the external circuit device (e.g., a flexible circuit board) is bonded to the conductive pads. In the above configuration, since the water blocking material pattern is disposed between the conductive pads, the exposed side wall of the display panel between the conductive pads can be covered, thereby enhancing the water blocking property of the display panel. Furthermore, it is able to prevent the problems (e.g., the display quality is degraded) that may occur when the side edges are exposed to organic layers (e.g., alignment films, Color filters, cover layers, etc.). Compared with a common narrow-frame display device (for example, without a water blocking material pattern and/or a water blocking wall), the display device and the manufacturing method thereof can form the water blocking material pattern while forming the conductive connecting pad, have the advantages of simplifying the process, improving the water blocking capability and avoiding the internal electronic elements from being damaged due to damp, thereby increasing the manufacturing yield and improving the display quality. Furthermore, it can also prevent the problems (such as the display quality degradation) that may occur if there are exposed organic layers on the side edges (such as alignment films, Color filters, cover layers, etc.).
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 illustrates a partial perspective view of a display device that is an embodiment of the present invention.
Fig. 2A is a side view of the display device of fig. 1.
Fig. 2B shows a side view of a display device which is another embodiment of the present invention.
Fig. 3A is a partial cross-sectional view of the display device of fig. 2A along section line a-a'.
Fig. 3B shows a partial cross-sectional view of the display device of fig. 2A along section line B-B'.
Fig. 4A is a partial cross-sectional view of the display device of fig. 2B along section line a-a'.
Fig. 4B shows a partial cross-sectional view of the display device of fig. 2B along section line B-B'.
FIG. 5 is a schematic diagram illustrating an embodiment of a display panel without resizing and after resizing.
FIG. 6 is a flow chart illustrating a method of manufacturing a resizing display device, in accordance with an embodiment of the present invention.
Description of reference numerals:
10. 10 a: display device D2: second direction
100: display panel D3: third direction
110: first substrate G: grid electrode
112: first side wall L1: predetermined cutting line
120: second substrate PE: pixel electrode
122: second side wall R1: the first part
130: display medium layer R2: the second part
140: and (3) sealing glue S: source electrode
150: conductive pad SL: signal line
160: pattern SP of water blocking material: sub-pixel
162: the water blocking walls S300, S310, S320, S330,
170: organic layers S340, S350, S360, S370,
200: external circuit elements S380 and S390: step (ii) of
220: a connecting pad T: transistor with a metal gate electrode
D: drain electrode
D1: a first direction
Detailed Description
In the drawings, the thickness of layers, films, panels, regions, etc. have been exaggerated for clarity. Like reference numerals refer to like elements throughout the specification. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Further, "electrically connected" or "coupled" may mean that there are additional elements between the elements.
As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within an acceptable range of deviation of the specified value as determined by one of ordinary skill in the art, taking into account the measurement in question and the specified amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ± 30%, ± 20%, ± 10%, ± 5%. Further, as used herein, "about", "approximately" or "substantially" may be selected based on optical properties, etch properties, or other properties, with a more acceptable range of deviation or standard deviation, and not all properties may be applied with one standard deviation.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Exemplary embodiments are described herein with reference to cross-sectional views that are schematic illustrations of idealized embodiments. Thus, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region shown or described as flat may generally have rough and/or nonlinear features. Further, the acute angles shown may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.
Fig. 1 illustrates a partial perspective view of a display device that is an embodiment of the present invention. Fig. 2A is a side view of the display device of fig. 1. Referring to fig. 1, in the present embodiment, the display device 10 may include a first substrate 110, a plurality of signal lines SL disposed on the first substrate 110, a second substrate 120, a display medium layer 130 disposed between the first substrate 110 and the second substrate 120, and a sealant 140. The display device 10 includes a combination of elements, for example: the first substrate 110, the plurality of signal lines SL, the second substrate 120, the display medium layer 130 between the first substrate 110 and the second substrate 120, and the sealant 140 may also be referred to as a display panel 100. Of course, the present embodiment is only for illustration and the invention is not limited thereto. In addition, the drawings of the present invention are only for illustrating the position and the connection relationship of each element, and the actual shape, size and number of each element are not shown in the drawings.
The display device 10 may further include a plurality of conductive pads 150 and a plurality of water blocking material patterns 160. Referring to fig. 1 and fig. 2A, in the present embodiment, the first substrate 110 has a first sidewall 112. The plurality of signal lines SL are disposed on an inner surface of the first substrate 110, and extend to the first sidewall 112 of the first substrate 110. For example, on the inner surface of the display panel 100, for example: the first substrate 110 further has a plurality of sub-pixels SP arranged in an array on an inner surface thereof. At least one of the sub-pixels SP may selectively include a transistor T, a gate G, a source S, a drain D, and a pixel electrode PE. The transistor T may be a top gate thin film transistor, a bottom gate thin film transistor, a stereoscopic thin film transistor, or other suitable transistors.
For example, the sub-pixels SP are electrically connected to the signal lines SL, respectively. The plurality of signal lines SL include at least one of a scan line, a data line, a common line, or a power line, but the present invention is not limited thereto. In other embodiments, the signal lines SL may include a touch line. For example, the signal lines SL may be classified according to the type of the display medium 130, such as: non-self-luminous materials, or other suitable materials. The plurality of signal lines SL may be electrically connected to the gate G and the source S, respectively, to drive the transistors T in the plurality of sub-pixels SP. For clarity of drawings and reference numerals, fig. 1 of the present invention only schematically illustrates that three signal lines SL extend to the first sidewall 112 along a predetermined direction (e.g., the third direction D3), and a plurality of signal lines (not shown) disposed to be staggered (e.g., interlace) with the signal lines SL are omitted. In addition, fig. 1 only schematically shows that three sub-pixels SP correspond to three signal lines SL, but the number of the sub-pixels SP included in the present embodiment is not limited thereto, and the number of the sub-pixels SP may be determined according to actual requirements (for example, the resolution specification and the number of the signal lines). Those skilled in the art can implement the display device 10 according to the display panel 100 shown in fig. 1 and the following description. For the sake of conductivity, the signal lines SL are generally made of conductive materials, such as: a metallic material, but the present invention is not limited thereto. In other embodiments, the signal line SL may also use, for example: alloys, stacked layers of alloys and metallic materials, or other suitable conductive materials, or stacked layers of at least one of the foregoing materials and other suitable materials, or stacked layers of other suitable conductive materials.
In the present embodiment, the plurality of signal lines SL are separated from each other, may be arranged along a predetermined direction (e.g., the first direction D1), and extend along the predetermined direction (e.g., the third direction D3) to the first sidewall 112 of the first substrate 110. The second substrate 120 is disposed opposite to the first substrate 110, and the second substrate 120 also has a second sidewall 122. Accordingly, the first sidewall 112 of the first substrate 110 and the second sidewall 122 of the second substrate 120 may be located on the same side of the display device 10 (shown in fig. 1). Viewed from another point, in the example illustrated in fig. 1 and fig. 2A, the first sidewall 112 of the first substrate 110 and the second sidewall 122 of the first substrate 120 may be located on the same side, for example: on the same side of the display device 10 or the display panel 100, the plurality of signal lines SL extend to the first sidewall 112 on the same side as the second sidewall 122 and expose side surfaces of the plurality of signal lines SL. In the present embodiment, the side surfaces of the first sidewall 112, the second sidewall 122 and the signal line SL are substantially aligned, but the invention is not limited thereto. In other embodiments, the side surfaces of the signal lines SL may be recessed and may have a space (not shown) with the first sidewall 112 and/or the second sidewall 122, so that the side surfaces of the signal lines SL are not aligned with the first sidewall 112 and/or the second sidewall 122.
Referring to fig. 1 and fig. 2A, a dielectric layer 130 is shown between a first substrate 110 and a second substrate 120. The display medium layer 130 is exemplified by, but not limited to, liquid crystal molecules that are non-self-luminous materials. In the present embodiment, a sealant 140 is formed (e.g., coated) on at least one side of the display panel 100, for example: the sealant 140 is filled between the first sidewall 112 of the first substrate 110 and the second sidewall 122 of the second substrate 120. In another aspect, the sealant 140 may be disposed between the first substrate 110 and the second substrate 120, and the sealant 140 at least partially surrounds the display medium layer 130, but the invention is not limited thereto. For example, the sealant 140 may seal the display medium layer 130 between the first substrate 110, the second substrate 120 and the sealant 140, so as to prevent the display medium layer 130 from being exposed outside the display device 10 or the display panel 100 between the first sidewall 112 and the second sidewall 122.
In the present embodiment, the display device 10 may optionally further include an organic layer or an organic functional layer 170 (e.g., a plurality of alignment films, or other suitable film layers (e.g., color conversion layers, quantum dot/rod films, or other suitable film layers), cover layers, or other suitable film layers), or a combination thereof, wherein the organic layer 170 (e.g., a plurality of alignment films) may be disposed on the inner surface of at least one of the first substrate 110 and the second substrate 120, respectively, and if the organic layer 170 may be an alignment film, the material thereof may be, for example, polyimide (for example, but not limited thereto, as shown in fig. 2A, the organic layer 170 (e.g., two alignment films) may be disposed on the inner surface of the first substrate 110 and the second substrate 120, respectively, and one of the organic layer 170 (e.g., an alignment film) may cover the plurality of signal lines SL, as described in the previous embodiments, the type of the organic layer 170 (e.g., an alignment film) can be selected according to the type of the display medium 130, and can be selectively used as one of the layers of the display panel 100, but is not limited thereto. The display medium layer 130 (not shown in FIG. 2A) and the sealant 140 may be disposed between two organic layers 170 (e.g., alignment films), but the invention is not limited thereto. In other embodiments, only one organic layer 170 (e.g., an alignment film) may be disposed on the first substrate 110 or the second substrate 120, and the organic layer 170 (e.g., the alignment film) is located between the display medium layer 130 and the first substrate 110 or the second substrate 120.
Referring to fig. 1 and fig. 2A, in the present embodiment, the conductive pads 150 are separated from each other and substantially arranged along a predetermined direction (e.g., the first direction D1), and the conductive pads 150 respectively cover the display device 10 or a first portion R1 of the sidewall of the display panel 100. The first sidewall 112 of the first substrate 110, the sealant 140 and the second sidewall 122 of the second substrate 120 have a plurality of first portions R1 and a plurality of second portions R2 extending along a predetermined direction (e.g., the second direction D2). The plurality of first portions R1 and the plurality of second portions R2 are staggered (staggered) or referred to as an offset (aligned) along a predetermined direction (e.g., the first direction D1). For example, the plurality of first portions R1 includes the first sidewalls 112 of the plurality of first portions R1, the sealant 140 of the plurality of first portions R1, and the second sidewalls 120 of the plurality of first portions R1. Likewise, the plurality of second portions R2 includes the first sidewalls 112 of the plurality of second portions R2, the sealant 140 of the plurality of second portions R2, and the second sidewalls 120 of the plurality of second portions R2. The plurality of first portions R1 are separated from each other, the plurality of second portions R2 are separated from each other, and each two adjacent first portions R1 may be separated by at least one second portion R2, but the invention is not limited thereto.
In the present embodiment, the plurality of first portions R1 may be respectively disposed corresponding to side surfaces of the plurality of signal lines SL, for example: each of the first portions R1 may be disposed corresponding to at least one signal line SL, but is not limited thereto. The conductive pads 150 may cover a portion of the first sidewall 112 in the first portion R1, a portion of the second sidewall 122 in the first portion R1, and the sealant 140 in the first portion R1, respectively. Viewed from another direction, each of the conductive pads 150 may cover a portion of the first sidewall 112 in the first portion R1, a portion of the second sidewall 122 in the first portion R1, and the sealant 140 in the first portion R1. In addition, the conductive pads 150 can also cover the signal lines SL exposed on the first sidewall 112 (for example, the side surfaces of the signal lines SL), for example: the conductive pads 150 are connected to the signal lines SL (e.g., the side surfaces of the signal lines SL) of the corresponding first portions R1, but are not limited thereto.
Referring to fig. 1 and 2A, in the embodiment, the water blocking material patterns 160 and the conductive pads 150 are staggered (staggered) along a predetermined direction (e.g., the first direction D1) or referred to as an offset arrangement (aligned arrangement). The plurality of water blocking material patterns 160 cover a portion of the first sidewall 112 in the second portion R2, a portion of the second sidewall 122 in the second portion R2, and the sealant 140 in the second portion R2, respectively, such as: each water blocking material pattern 160 may cover a portion of first sidewall 112 in second portion R2, a portion of second sidewall 122 in second portion R2, and sealant 140 in second portion R2. In another aspect, a plurality of conductive pads 150 may be disposed corresponding to the plurality of first portions R1, a plurality of water blocking material patterns 160 may be disposed corresponding to the plurality of second portions R2, and each two adjacent conductive pads 150 may be separated by one water blocking material pattern 160, but the invention is not limited thereto.
In this embodiment, the material of the conductive pads 150 may include conductive silver paste, conductive nanoparticles, or a mixture of one of the conductive silver paste and the water blocking material, or other suitable materials, and may also have the effect of blocking water. In addition, since the water blocking material pattern 160 is disposed between two adjacent conductive pads 150 and disposed on the first sidewall 112 of the first substrate 110 and the second sidewall 122 of the second substrate 120, the plurality of conductive pads 150 and the plurality of water blocking material patterns 160 can cover one side of the display panel 100 without exposing the sealant 140, the organic layer (e.g., the alignment film 170) or the side surfaces of the plurality of signal lines SL. Under the above configuration, the organic layer (e.g., the alignment layer 170), the sealant 140 and the plurality of signal lines SL are not exposed to the environment, so moisture is not easily introduced into the display panel 100. Based on the above, the display device 10 of the present invention can prevent the internal electronic components from being damaged by moisture, and further improve the yield and display quality of the manufacturing process. Furthermore, the design of the present embodiment can also prevent the problems (e.g., the display quality is degraded) that may occur if the organic layer 170 (e.g., alignment film, Color filter (not shown), cover layer (not shown), etc.) is exposed at the side edge.
Fig. 3A is a partial cross-sectional view of the display device of fig. 2A along section line a-a'. Fig. 3B shows a partial cross-sectional view of the display device of fig. 2A along section line B-B'. Referring to fig. 1, fig. 3A and fig. 3B, in the present embodiment, the display device 10 may optionally further include at least one external circuit element 200. The external circuit device 200 has a plurality of connection pads 220, and the connection pads 220 are connected to the corresponding conductive pads 150. The external circuit device 200 may cover a portion of the first sidewall 112 and a portion of the second sidewall 122. The external circuit element 200 may also be selectively connected to a portion of the water blocking material pattern 160 by a conductive layer (e.g., anisotropic conductive adhesive, or other suitable conductive layer, not shown). The external circuit element 200 of the present embodiment is preferably a flexible circuit board, but is not limited thereto. In other embodiments, the external circuit device 200 may also be a driving circuit device (e.g., an IC) or other suitable conductive layer. The connecting pads 220 of at least one external circuit device 200 (e.g., a flexible circuit board) may also be bonded to the corresponding conductive pads 150 by (e.g., anisotropic conductive adhesive, not shown) to complete electrical connection, but the invention is not limited thereto. In other embodiments, the external circuit element 200 (e.g., a flexible circuit board) may be electrically connected to the conductive pad 150 by heat welding, laser welding, soldering, or other suitable methods.
Referring to fig. 3A, the conductive pad 150 covers a portion of the first sidewall 112, a portion of the second sidewall 122, and a portion of the sealant 140. In some embodiments, the conductive pad 150 may also extend to cover the signal line SL and the at least one organic layer 170 (e.g., an alignment film) of the first sidewall 112. The connecting pads 220 of at least one external circuit device 200 (e.g., a flexible circuit board) are connected to the corresponding conductive pads 150. The connecting pads 220 are electrically connected to the signal lines SL at least through the conductive pads 150, and the external circuit device 200 (e.g., a flexible circuit board) is electrically connected to at least one external electronic device (not shown), such as other circuit boards, driving circuit devices (e.g., ICs), or other suitable external electronic devices. Therefore, the signal line SL may conduct a signal of an external electronic component (not shown) to the sub-pixel SP (shown in fig. 1) to drive the transistor T, or a signal of the display device 10, but the present invention is not limited thereto.
Referring to fig. 3B, in the present embodiment, the water blocking material pattern 160 covers a portion of the first sidewall 112, a portion of the second sidewall 122, and a portion of the sealant 140. In some embodiments, the water blocking material pattern 160 may also cover at least one organic layer 170 (e.g., an alignment film). At least one external circuit component 200 (e.g., a flexible circuit board) covers the water blocking material pattern 160. As shown in fig. 3A and 3B, at least one external circuit component 200 (e.g., a flexible circuit board) covers the plurality of conductive pads 150 and the water blocking material pattern 160, so as to press the external circuit component 200 (e.g., a circuit board) on the sidewall of the display device 10, thereby implementing the requirement of the narrow or frameless display device 10 or the display panel 100.
Since the first portions R1 and the second portions R2 of the first sidewall 112 of the first substrate 110 and the second sidewall 122 of the second substrate 120 can be covered by the conductive pads 150 and the water blocking material patterns 160, respectively, before the display device 10 or the device panel 100 is bonded to the external circuit device 200 (e.g., a flexible circuit board), without exposing the organic layer 170 (e.g., an alignment film), the sealant 140, and the signal lines SL to the environment, moisture is not easily introduced into the display device 10 or the display panel 100 through the organic layer 170 (e.g., the alignment film), the sealant 140, and the signal lines SL. Therefore, the electronic components (e.g., the sub-pixels SP) inside the assembled display device 10 are not damaged by moisture, and thus the manufacturing yield and the display quality can be improved. Furthermore, the design of the present embodiment can also prevent the problems (e.g., the display quality is degraded) that may occur if the side edge has an exposed organic layer (e.g., an alignment film, a Color filter (not shown), a cover layer (not shown), etc.).
FIG. 5 is a schematic diagram illustrating a display panel before and after resizing according to an embodiment of the present invention. FIG. 6 is a flow chart illustrating a method for manufacturing a resizing display device, which is an embodiment of the present invention. Referring to fig. 6, in order to avoid the moisture on the internal electronic components of the resizing display device, the manufacturing method of the present embodiment proposes the manufacturing method of the display device 10 of the previous embodiment requiring resizing, which includes steps S300 to S390.
First, a display panel 100 is provided, which is not resized. The display panel 100 before resizing comprises a first substrate 110, a plurality of signal lines SL disposed on the first substrate 110, a second substrate 120, and a display medium layer 130 disposed between the first substrate 110 and the second substrate 120 (step S300). In addition, the plurality of sub-pixels SP may be disposed on the inner surface of the first substrate 110 in an array arrangement and electrically connected to the plurality of signal lines SL, respectively. In addition, the present embodiment further selectively includes a plurality of organic layers 170 (e.g., alignment films, Color filters, and cover layers). The organic layers 170 (e.g., alignment films) are respectively disposed on the inner surface of at least one of the first substrate 110 and the second substrate 120, covering the signal lines SL, but the invention is not limited thereto. In the present embodiment, the display panel 100 may be of the same type as the display panel in the previous embodiments, and will not be described herein.
After the display panel 100 is manufactured, at least one of other elements (e.g., an optical film, a frame, a backlight module, a housing, or other suitable elements) may be added to manufacture the display device 10. However, if the resizing process needs to be performed on the manufactured display panel 100, the display panel 100 may be cut (step S310). Referring to FIG. 5, the display panel 100 before resizing (e.g., before cutting) has a predetermined cutting line L1 suitable for defining the position for cutting. When the cutting is performed, a portion of the first substrate 110, a portion of the second substrate 120, and a portion of the display medium layer 130 are cut and removed along the predetermined cutting line L1. After resizing (e.g., cutting), the display panel 100 may expose the first sidewall 112 of the first substrate 110 and the second sidewall 122 of the second substrate 120 on one side of the prearranged cut line L1, and the display medium layer 130 between the first substrate 110 and the second substrate 120. In the present embodiment, the manner of cutting the display panel 100 may be mechanical cutting, laser cutting, or other suitable manner, or a combination of at least two of the foregoing, and the present invention is not particularly limited. Moreover, when the display panel 100 of FIG. 5 is not resized, the graphic representation of the display panel 100 includes a solid line portion (e.g., left portion) and an imaginary line portion (e.g., right portion), and when the display panel 100 is resized, the graphic representation of the display panel 100 only includes the solid line portion (e.g., left portion), and the imaginary line portion (e.g., right portion) is regarded as the portion of the display panel 100 removed after being cut. In other embodiments, the removable portion (dotted line portion) of the display panel 100 during resizing can be determined according to the position required to be reserved, for example: a left portion, a lower portion, an upper portion, a middle portion of a portion, or other suitable portion, or a combination of at least two of the foregoing.
Next, as shown in fig. 5, a sealant 140 is formed (e.g., coated) on a side of the display panel 100 cut along the predetermined cutting line L1, and the first substrate 110 is bonded to the second substrate 120 disposed opposite to the first substrate through the sealant 140. In the embodiment, the sealant 140 may be filled between the first substrate 110 and the second substrate 120, and the sealant 140 at least partially surrounds the display medium layer 130. In some embodiments, if the display panel 100 is partially removed (for example, one side, two sides, or three sides of the display panel 100) during resizing, the display panel 100 may have the original sealant (not shown) in the predetermined sealant area (not shown), and the sealant 140 described in this embodiment is called a new sealant or the resizing sealant in another predetermined sealant area (not shown), and the predetermined sealant area (not shown) and the another predetermined sealant area (not shown) may be different sides. Therefore, the sealant 140 filled in the embodiment can prevent the display quality of the display panel 100 from being affected by the reduction (e.g., loss) of the display medium layer 220 (e.g., liquid crystal) during the resizing process. In some embodiments, before filling the sealant 140, a pressure may be applied to the vicinity of the cut portion of the cut display panel (for example, pressing the cut portion of the cut display panel or other suitable methods), so that the display medium layer 220 (for example, liquid crystal) at the cut portion of the cut display panel may be less susceptible to loss (for example, loss). In the process of filling the sealant 140, the sealant 140 may also be partially formed on the outer surface of the first substrate 110 or the second substrate 120 to reliably seal the display medium layer 130 in the display panel 100. The material of the sealant 140 may be, for example, a photo-curable resin, a thermosetting resin, or other suitable materials, but the invention is not limited thereto.
Next, the first substrate 110, the second substrate 120 and the sealant 140 are removed (e.g., polished) to expose a first sidewall 112 of the first substrate 110, a second sidewall 122 of the second substrate 120 and at least a portion of the side surfaces of the signal lines SL, wherein the first sidewall 112 and the second sidewall 122 are located on the cut side of the display panel 100 (step S330). For example, the resizing process of the display panel 100 is performed by removing (e.g., grinding) the cut sides of the first substrate 110, the second substrate 120 and the sealant 140. Since the sealant 140 seals the display medium layer 130 between the first substrate 110 and the second substrate 120, after removing (e.g., polishing), the first sidewall 112, the second sidewall 122 and a portion of the side surfaces of the signal lines SL are exposed, so that the display medium layer 130 is not damaged. In addition, the organic layer 170 (e.g., alignment films) may be exposed to the cut side of the display panel 100 after being removed (e.g., polished). The first sidewall 112, the second sidewall 122, the organic layer 170 (e.g., an alignment film), and a portion of the side surface of each signal line SL are substantially aligned, but the invention is not limited thereto. In other embodiments, the side surfaces of the signal lines SL may be recessed and may have a space (not shown) with the first sidewall 112 and/or the second sidewall 122, so that the side surfaces of the signal lines SL are not aligned with the first sidewall 112 and/or the second sidewall 122.
Then, a plurality of conductive pads 150 are formed (e.g., coated) on the side of the display panel 100 where the cutting is performed. For example, the conductive pads 150 are arranged along a predetermined direction (e.g., the first direction D1), and each of the conductive pads 150 covers a portion of the first sidewall 112, a portion of the second sidewall 122, and the sealant 140 in a first portion R1 of one side of the display panel 100 (step S340), as shown in fig. 1 and 2A. Each of the first portions R1 may be disposed corresponding to at least one signal line SL, and the conductive pad 150 formed (e.g., coated) on the first portion R1 covers at least a portion of a side surface of the signal line SL. The conductive pads 150 are coated along a predetermined direction (e.g., the second direction D2) that is staggered (e.g., perpendicular) to the predetermined direction (e.g., the first direction D1). In addition, the material of the conductive pads 150 includes conductive silver paste, conductive nanoparticles, or a mixture of one of the conductive silver paste and the conductive nanoparticles and a water blocking material, or other suitable materials.
Then, a plurality of water blocking material patterns 160 are formed (e.g., coated) on the cut side of the display panel 100. For example, the water blocking material patterns 160 and the conductive pads 150 are arranged alternately along a predetermined direction (e.g., the first direction D1), and the water blocking material patterns 160 cover a portion of the first sidewall 112, a portion of the second sidewall 122 and the sealant 140 in a second portion R2 of one side of the display panel 100 (step S350), as shown in fig. 1 and fig. 2A. Each of the second portions R2 is located between two adjacent first portions R1 and separates a plurality of first portions R1. The plurality of water blocking material patterns 160 are disposed (e.g., coated) along a predetermined direction (e.g., the second direction D2). In addition, in step S340 and step S350, the method for forming the plurality of conductive pads 150 or the plurality of water blocking material layers 160 includes transferring, screen printing, gravure printing, laser ablation, or inkjet printing, or other suitable methods. In addition, the water blocking material of the conductive pads 150 or the water blocking material patterns 160 may be, for example, PHOTOLEC a-700(Sekisui Chemical co., Ltd), but the invention is not limited thereto.
Next, after step S350, the conductive pads 150 and the water blocking material patterns 160 are cured (step S370). The method for curing the conductive pads 150 and the water blocking material patterns 160 may be, for example, heating, irradiation, or other suitable methods, which is not limited by the invention.
The plurality of conductive pads 150 and the plurality of water blocking material layers 160 may be formed on the cut side of the display panel 100 by forming (e.g., coating) and then curing, thereby simplifying the process and difficulty of manufacturing the display device 10. In addition, since the corresponding (e.g., at least one) water blocking material pattern 160 is disposed between the adjacent conductive pads 150 and disposed on the first sidewall 112 and the second sidewall 122 of the display panel 100, the conductive pads 150 and the water blocking material patterns 160 can cover the cut side of the display panel 100 without exposing the side surfaces of the sealant 140, the organic layer 170 (e.g., an alignment film), or the signal lines SL. Under the above configuration, the organic layer 170 (e.g., alignment layer), the sealant 140 and the plurality of signal lines SL are not exposed to the environment, so moisture is not easily introduced into the display panel 100. Based on the above, the display device 10 of the present invention can prevent the internal electronic components (e.g., the sub-pixels SP) from being damaged due to moisture, and further improve the yield and display quality of the manufacturing process.
In the embodiment, the plurality of conductive pads 150 (step S340) is formed (e.g., coated) before the plurality of water blocking material patterns 160 (step S350) are formed (e.g., coated), but the invention is not limited thereto. In other embodiments, the water blocking material patterns 160 may be formed (e.g., coated) (step S350) before the conductive pads 150 are formed (e.g., coated) (step S340). In addition, a pre-curing step (step S390) may be optionally included between the step of forming (e.g., coating) the plurality of conductive pads 150 (step S340) and the step of forming (e.g., coating) the plurality of water blocking material patterns 160 (step S350). The pre-curing step may cure the conductive pad 150 or the water blocking material pattern 160 to a semi-cured state by, for example, heat, light, or other suitable means. In this embodiment, the conductive pads 150 may be selectively pre-cured to prevent the conductive pads 150 from flowing due to the liquid state before forming (e.g., coating) the water blocking material pattern 160, which may affect the position where the conductive pads 150 are formed and the effect of electrically connecting other devices and blocking water and air, but the invention is not limited thereto. In other embodiments, the water blocking material patterns 160 may be selectively pre-cured to prevent the water blocking material patterns 160 from flowing to affect the position where the water blocking material patterns 160 are formed and the water blocking effect before the conductive pad 150 is formed (e.g., coated). In other embodiments, if the water blocking material pattern 160 and/or the conductive pad 150 can be formed in other ways, for example: in the exposure etching manner, at least one of the steps S390 and/or 370 may be selectively not performed.
Next, at least one external circuit component 200 (e.g., a flexible circuit board or other suitable component) is provided to cover a portion of the first sidewall 112 and a portion of the second sidewall 122, as shown in FIG. 3. At least one external circuit device 200 (e.g., a flexible circuit board) has a plurality of connecting pads 220, and the connecting pads 220 are connected to the corresponding conductive pads 150 (step S380). For example, at least one external circuit device 200 (e.g., a flexible circuit board) may be selectively bonded to the partial water blocking material pattern 160 through a conductive layer (e.g., anisotropic conductive adhesive or other suitable material), and the connecting pads 220 may also be bonded to the corresponding connecting pads 150 through a conductive layer (e.g., anisotropic conductive adhesive) to complete electrical connection to the cut side of the display panel 100, thereby achieving the requirement of a narrow or borderless display panel. However, the invention is not limited thereto, and in other embodiments, the external circuit element 200 (e.g., a flexible circuit board) may be electrically connected to the conductive pad 150 by heat welding, laser welding, soldering, or other suitable methods. Thus, the external circuit device 200 (e.g., a flexible circuit board) is electrically connected to the display panel 100, thereby completing the fabrication of the display device 10 of the present embodiment.
Since the first portions R1 and the second portions R2 of the first sidewall 112 and the second sidewall 122 can be covered by the conductive pads 150 and the water blocking material patterns 160, respectively, before the display panel 100 is bonded to the external circuit device 200 (e.g., a flexible circuit board), without exposing the organic layer 170 (e.g., an alignment film), the sealant 140 and the signal lines SL to the environment, moisture is not easily introduced into the interior of the display panel 100 through the organic layer 170 (e.g., the alignment film), the sealant 140 and the signal lines SL. Therefore, the electronic components (e.g., the sub-pixels SP) inside the assembled display device 10 are not damaged by moisture, and thus the manufacturing yield and the display quality can be improved.
It should be noted that, in the following embodiments, the reference numerals and partial contents of the elements in the foregoing embodiments are used, wherein the same reference numerals are used to indicate the same or similar elements, and the description of the portions with the same technical contents omitted may refer to the foregoing embodiments, and the description in the following embodiments is not repeated.
Fig. 2B shows a side view of a display device which is another embodiment of the present invention. Fig. 4A is a partial cross-sectional view of the display device of fig. 2B along section line a-a'. Fig. 4B shows a partial cross-sectional view of the display device of fig. 2B along section line B-B'. The display device 10a of the present embodiment is similar to the display device 10 of the previous embodiment, and the main difference lies in: at least one water blocking wall 162 is formed (e.g., coated), the water blocking wall 162 is disposed on the first side wall 112 or the second side wall 122 along a predetermined direction (e.g., the first direction D1), and the at least one water blocking wall 162 is connected to at least one end of the plurality of water blocking material patterns 160. The description of the remaining same or similar elements of this embodiment may refer to the description of the elements of the previous embodiment and will not be further described herein.
Referring to fig. 2B, in the present embodiment, for example: the predetermined direction (e.g., the first direction D1) in which the two water blocking walls 162 extend is staggered (e.g., interlace) with the predetermined direction (e.g., the second direction D2) in which the plurality of water blocking material patterns 160 extend. For example, two water blocking walls 162 are respectively connected to the plurality of water blocking material patterns 160 at one end of the first sidewall 112 and at the other end of the second sidewall 122, but the invention is not limited thereto. In other embodiments, only one water blocking wall 162 may be disposed on one of the first sidewall 110 or the second sidewall 120.
Referring to fig. 2B, fig. 4A and fig. 4B, in the present embodiment, the water blocking wall 162 and two adjacent water blocking material patterns 160 connected to the water blocking wall 162 may surround one of the conductive pads 150. For example, a plurality of water blocking walls 162 may be disposed adjacent to one end of the conductive pad 150 on the first sidewall 112 and adjacent to the other end of the conductive pad 150 on the second sidewall 122, as shown in fig. 4A. Another plurality of water blocking walls 162 connecting the plurality of water blocking material patterns 160 may be located at one end of the first side wall 112 and/or at the other end of the second side wall 122, as shown in fig. 4B. Viewed from another aspect, the plurality of water blocking walls 162 connect the plurality of water blocking material patterns 160 around the plurality of conductive pads 150 to form a pattern having a plurality of openings, each opening surrounding a corresponding conductive pad 150. Although the invention is not limited thereto. In other embodiments, the water blocking wall 162 may connect the water blocking material patterns 160 to completely surround the conductive pad 150 and only partially surround the conductive pad 150 and/or the water blocking material patterns 160. For example, the water blocking wall 162 may be a continuous pattern, a segmented pattern, or a combination thereof.
Under the configuration of the embodiment, the exposed first sidewall 112 and the exposed second sidewall 122 of the display device 10a are not exposed to the environment except that the alignment film 170, the sealant 140 and the signal lines SL are covered by the conductive pads 150 and the water blocking material patterns 160, respectively, and the display device 10a further has at least one water blocking wall 162 disposed along a predetermined direction (e.g., the first direction D1). Since the water blocking wall 162 connects the plurality of water blocking material patterns 160 and surrounds the at least one conductive pad 150, moisture is not easy to enter the display device 10a through the alignment film 170, the sealant 140 and the plurality of signal lines SL, and is not easy to enter the interior of the display device 10a through the first sidewall 112 or the second sidewall 122. Therefore, the electronic components (e.g., the sub-pixels SP) inside the display device 10a after the re-sizing and assembling are not damaged by moisture, so that the manufacturing yield and the display quality can be further improved.
Referring to fig. 6, a manufacturing method of the display device 10a of the present embodiment is similar to the manufacturing method of the display device 10 in fig. 6, and the main difference between the two methods lies in: in the manufacturing method of the display device 10a of the present embodiment, after the step S350, the step S370 is not directly performed, but after the step S350, the step S360 is performed, and then the step S370 and the step S380 are performed. The rest of the steps of this embodiment can be referred to the steps (e.g., S300-S350, S370-S380) described in the previous embodiment, and will not be described herein. Step 360: the method of manufacturing the display device 10a may further include coating at least one water blocking wall 162. The at least one water blocking wall 162 is disposed on the first sidewall 112 and/or the second sidewall 122 along a predetermined direction (e.g., the first direction D1), and the at least one water blocking wall 162 is connected to at least one end of the plurality of water blocking material patterns 160. In this embodiment, the display device 10a is not easy to enter the display device 10a through the organic layer 170 (e.g., the alignment layer), the sealant 140 and the plurality of signal lines SL, and is not easy to enter the display device 10a through the first sidewall 112 and/or the second sidewall 122. Therefore, the electronic components (e.g., the sub-pixels SP) inside the assembled display device 10a are not damaged by moisture, and thus the manufacturing yield and the display quality can be further improved.
In the above embodiments, the display medium layer 130 is made of a non-self-luminous material (e.g., a liquid crystal material), but not limited thereto. In some embodiments, the non-self-luminescent material may also include an electrowetting material, an electro-dusting material, an electrochromic material, or other suitable material, and the organic layer 170 (e.g., an alignment film) may be optionally disposed or not disposed as desired. In other embodiments, the display medium layer 130 may be a self-emissive material, such as: inorganic materials, organic materials, or other suitable materials, or combinations thereof, may be used in the embodiments described above, and the organic layer 170 (e.g., alignment film) may be selectively disposed or not disposed as desired.
The display device and the manufacturing method thereof of the invention remove (for example, grind) the display panel after cutting, coat a plurality of conductive pads on the exposed first side wall and the exposed second side wall, form (for example, coat) a plurality of water-blocking material patterns between a plurality of adjacent conductive pads, and then solidify the water-blocking material patterns. In this way, the plurality of water blocking material patterns can be cut into the display panel in a resizing way, and then the process of pressing the external circuit element (such as a flexible circuit board) on the side wall of the narrow or frameless display device is realized. Before the external circuit element (such as a flexible circuit board) is electrically connected to the conductive pad, the exposed part of the first side wall, the exposed part of the second side wall, the exposed part of the sealant and the exposed part of the alignment film are covered by the water blocking material pattern. Therefore, the water blocking material pattern can prevent moisture from entering the display device through the organic layer (e.g., alignment film) and the sealant. In addition, the display device of the invention can further comprise a water blocking wall, and the water blocking wall is connected with the water blocking material pattern to surround the plurality of conductive pads. In the above configuration, the water blocking wall may further prevent moisture from entering the inside of the display device through the first side wall or the second side wall. Therefore, the internal electronic components of the assembled display device are not damaged by being affected with damp, and the manufacturing yield and the display quality can be improved. In addition, compared with a common narrow-frame display device (for example, without a water blocking material pattern and/or a water blocking wall), the display device and the manufacturing method thereof can form the water blocking material pattern when the conductive pads are formed (for example, before, after and simultaneously), have simplified process, improve water blocking capability, and avoid the internal electronic elements (for example, the sub-pixels SP) from being damaged due to moisture, thereby increasing the manufacturing yield and improving the display quality. The manufacturing method of the display device can also comprise a step of pre-curing, so that the effect of water and air resistance of the conductive connecting pad and the water-resistant material pattern is further prevented from being damaged.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (11)
1. A display device, comprising:
a first substrate having a first sidewall;
a plurality of signal lines disposed on an inner surface of the first substrate, the signal lines extending to the first sidewall;
the second substrate is arranged opposite to the first substrate and is provided with a second side wall, wherein the first side wall and the second side wall are positioned on the same side of the display device;
a display medium layer located between the first substrate and the second substrate;
the sealant is positioned between the first substrate and the second substrate, and at least partially surrounds the display medium layer;
a plurality of conductive pads, separated from each other, arranged along a first direction and respectively covering a first portion of the first sidewall, a first portion of the second sidewall and a first portion of the sealant, wherein the conductive pads are electrically connected to the corresponding signal lines, and the conductive pads are made of a conductive silver paste, conductive nanoparticles or a mixture of one of the conductive silver paste and the conductive nanoparticles and a water blocking material; and
the waterproof material patterns and the conductive pads are staggered along the first direction, and the waterproof material patterns respectively cover a part of the first side wall of a second part, a part of the second side wall of the second part and the sealant of the second part.
2. The display device of claim 1, further comprising a plurality of organic layers respectively disposed on an inner surface of at least one of the first substrate and the second substrate.
3. The display device of claim 1, further comprising at least one external circuit element having a plurality of connecting pads connected to the corresponding conductive pads, wherein the external circuit element covers a portion of the first sidewall and a portion of the second sidewall.
4. The display apparatus according to claim 1, further comprising at least one water blocking wall disposed along the first direction on a portion of the first sidewall or a portion of the second sidewall, the at least one water blocking wall being connected to at least one end of the water blocking material patterns.
5. The display device according to claim 4, wherein the water blocking wall and two adjacent water blocking material patterns connected to the water blocking wall surround one of the conductive pads.
6. A method for manufacturing a display device includes:
providing a display panel, which comprises a first substrate, a plurality of signal lines arranged on the first substrate, a second substrate and a display medium layer positioned between the first substrate and the second substrate;
cutting the display panel;
forming a sealant on one side of the display panel, wherein the sealant is filled between the first substrate and the second substrate, and at least part of the sealant surrounds the display medium layer;
removing the first substrate, the second substrate and the sealant to expose a first sidewall of the first substrate, a second sidewall of the second substrate and at least part of side surfaces of the signal lines, wherein the first sidewall and the second sidewall are positioned on one side of the display panel for cutting;
forming a plurality of conductive pads, wherein the conductive pads are arranged along a first direction and respectively cover a first part of the first side wall, a first part of the second side wall and a first part of the sealant, and the conductive pads are made of conductive silver adhesive, conductive nano particles or a mixture of one of the conductive silver adhesive and the conductive nano particles and a water blocking material;
forming a plurality of water blocking material patterns, wherein the water blocking material patterns and the conductive pads are staggered along the first direction, and the water blocking material patterns respectively cover a part of the first side wall of a second part, a part of the second side wall of the second part and a part of the sealant of the second part; and
and curing the conductive pads and the water blocking material patterns.
7. The method for manufacturing a display device according to claim 6, wherein the conductive pads are formed before the water blocking material patterns are formed, or the water blocking material patterns are formed before the conductive pads are formed.
8. The method of claim 7, wherein a pre-curing step is further included between the forming the conductive pads and the forming the water blocking material patterns.
9. The method of claim 6, wherein the conductive pads or the water blocking material patterns are formed by a method selected from the group consisting of transfer printing, screen printing, gravure printing, laser ablation, and inkjet printing.
10. The method as claimed in claim 6, further comprising providing at least one external circuit element covering a portion of the first sidewall and a portion of the second sidewall, wherein the at least one external circuit element has a plurality of connecting pads, and the connecting pads are connected to the corresponding conductive pads.
11. The method of claim 6, further comprising forming at least one water blocking wall disposed along the first direction on a portion of the first sidewall or a portion of the second sidewall, the at least one water blocking wall being connected to at least one end of the water blocking material patterns.
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| KR20200019813A (en) * | 2018-08-14 | 2020-02-25 | 삼성디스플레이 주식회사 | Display apparatus and manufacturing the same |
| TWI687740B (en) * | 2019-01-02 | 2020-03-11 | 友達光電股份有限公司 | Thin film transistor driving circuit and liquid crystal display device |
| CN110136574B (en) * | 2019-05-13 | 2020-10-09 | 友达光电（昆山）有限公司 | Display panel |
| TWI741573B (en) * | 2020-04-28 | 2021-10-01 | 友達光電股份有限公司 | Display panel |
| CN113568224B (en) | 2020-08-14 | 2022-10-21 | 友达光电股份有限公司 | Display device |
| US11963300B2 (en) * | 2020-08-14 | 2024-04-16 | Au Optronics Corporation | Panel device and manufacturing method of panel device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105529348A (en) * | 2014-10-20 | 2016-04-27 | 乐金显示有限公司 | Display apparatus |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000260337A (en) * | 1999-03-11 | 2000-09-22 | Mitsubishi Electric Corp | Gas discharge panel, and forming method and display device for electrode terminal of it |
| KR100970925B1 (en) * | 2006-12-29 | 2010-07-20 | 엘지디스플레이 주식회사 | LCD device and Manufacturing method of the same |
| KR101715896B1 (en) * | 2010-04-01 | 2017-03-13 | 엘지전자 주식회사 | Display Apparatus, Plasma Display Apparatus, Multi Display Apparatus and Multi Plasma Display Apparatus |
| TWI421611B (en) * | 2010-10-08 | 2014-01-01 | Au Optronics Corp | Electrophoretic display structure |
| TWI434249B (en) * | 2010-11-11 | 2014-04-11 | Au Optronics Corp | Display device and method of making the same |
| CN102621734A (en) * | 2012-04-06 | 2012-08-01 | 深圳市巨潮科技有限公司 | Method for manufacturing nonstandard liquid crystal display screen with liquid crystal |
| US8994042B2 (en) * | 2013-05-20 | 2015-03-31 | Lg Electronics Inc. | Display panel and display device |
| KR102044392B1 (en) * | 2013-10-25 | 2019-11-13 | 엘지디스플레이 주식회사 | Display panel and display device having the same |
| KR102230752B1 (en) * | 2013-12-20 | 2021-03-19 | 엘지디스플레이 주식회사 | Display device and its production method |
| KR102386891B1 (en) * | 2015-03-11 | 2022-04-15 | 삼성디스플레이 주식회사 | Display apparatus and method of manufacturing the same |
| CN105549272A (en) * | 2016-01-29 | 2016-05-04 | 武汉华星光电技术有限公司 | Packaging structure and method of display panel |
| CN105572941A (en) * | 2016-02-24 | 2016-05-11 | 京东方科技集团股份有限公司 | Display panel, display device, manufacturing method of display panel and mold |
| CN105892133B (en) * | 2016-06-27 | 2020-04-07 | 京东方科技集团股份有限公司 | TFT-LCD display panel manufacturing method, display panel and display |
| TWI610281B (en) * | 2017-03-09 | 2018-01-01 | 友達光電股份有限公司 | Display panel |
-
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- 2017-12-26 TW TW106145828A patent/TWI646370B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105529348A (en) * | 2014-10-20 | 2016-04-27 | 乐金显示有限公司 | Display apparatus |
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