CN108336002A - The method of clearing apparatus and cleaning wafer, mechanical arm - Google Patents
The method of clearing apparatus and cleaning wafer, mechanical arm Download PDFInfo
- Publication number
- CN108336002A CN108336002A CN201810218343.3A CN201810218343A CN108336002A CN 108336002 A CN108336002 A CN 108336002A CN 201810218343 A CN201810218343 A CN 201810218343A CN 108336002 A CN108336002 A CN 108336002A
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- wafer
- clean
- clearing apparatus
- mechanical arm
- cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/0209—Cleaning of wafer backside
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Technical solution of the present invention discloses a kind of clearing apparatus and cleans the method for wafer, mechanical arm, and the clearing apparatus includes：Adsorption section and cleaning agency；The adsorption section is used to be adsorbed below the crawl section of mechanical arm；The cleaning agency includes support portion, air inlet and clean-out hatch, and the support portion supports the adsorption section, the clean-out hatch to be communicated with the air inlet；The clean-out hatch is used to, when the crawl section of the mechanical arm captures object, purge the back side of the object.Technical solution of the present invention can be cleaned during object transport, both it had been not necessarily to increase the excessive cleaning time, the pollution particle at the object back side can be reduced again, it is therefore prevented that the cross contamination between process equipment and defective workmanship caused by particulate matter, and then improve the production yield of wafer.
Description
Technical field
The invention belongs to semiconductor manufacturing facility technical fields, and in particular to a kind of clearing apparatus and the side for cleaning wafer
Method, mechanical arm.
Background technology
In existing semiconductor technology, wafer (wafer) passes through multiple tracks technique process, inevitably by some
Pollution.For example, in semiconductor puddle development technical process, wafer after glue spreader gluing by being directly sent to litho machine
It is exposed, however, wafer in spin coating, baking, movement and transmit process, will produce particle due to contact friction etc.
(particle) it is adhered to the back side of wafer, these particles may cause the cross contamination of board equipment or draw in exposure
It rises and defocuses the bad problem of the focusing such as (defocus), thereby result in image deflects, influence the yield of wafer production.
Therefore, the particulate matter for how reducing or removing wafer rear becomes urgently to be resolved hurrily at present to avoid drawbacks described above
Problem.
Invention content
What technical solution of the present invention to be solved is in existing semiconductor fabrication process, due to wafer rear adhered particles object
The technical issues of influencing yield.
In order to solve the above technical problems, technical solution of the present invention provides a kind of clearing apparatus, including：Adsorption section and scavenging machine
Structure；The adsorption section is used to be adsorbed below the crawl section of mechanical arm；The cleaning agency includes support portion, air inlet and cleaning
Hole, the support portion support the adsorption section, the clean-out hatch to be communicated with the air inlet；The clean-out hatch is used in the machine
When the crawl section crawl object of tool arm, the back side of the object is purged.
Optionally, the cleaning agency further includes：The gas outlet communicated with the clean-out hatch.
Optionally, the clean-out hatch is tilted relative to the plane where the adsorption section.
Optionally, the clean-out hatch relative to the inclined angular range of plane where the adsorption section be 2.86 degree extremely
5.71 degree.
Optionally, the material of the adsorption section is Teflon, and the material of the support portion is stainless steel.
Optionally, the clearing apparatus further include the rotating part being connect with the mechanical arm and the connection rotating part and
The interconnecting piece of the cleaning agency.
In order to solve the above technical problems, technical solution of the present invention also provides a kind of method cleaning wafer, including：Using sharp
The back side of light detection wafer；When detecting that the particle of the wafer rear is exceeded, the adsorption section of the clearing apparatus is made to adsorb
Below the crawl section of the mechanical arm, the crawl section captures the wafer；Gas is passed through to the air inlet of the clearing apparatus
Body, so that the clean-out hatch communicated with the air inlet purges the back side of the wafer.
Optionally, the back side using laser detection wafer includes：Make laser irradiation at the back side of wafer, passes through reception
Device receives the scattered signal of particle；The amounts of particles and/or ruler of the wafer rear are obtained according to the scattered signal of the particle
It is very little.
Optionally, the cleaning agency further includes：The gas outlet communicated with the clean-out hatch；The method for cleaning wafer
Further include：Make the gas outlet connection vacuum plant, when clean-out hatch purges the back side of the wafer, by described true
Empty device and gas outlet carry out vacuum suction.
Optionally, the clean-out hatch is tilted relative to the plane where the adsorption section.
Optionally, which is characterized in that the clean-out hatch is relative to the inclined angular range of plane where the adsorption section
It is 2.86 degree to 5.71 degree.
Optionally, the gas being passed through is nitrogen, and the pressure limit for being passed through gas is 0.08MPa to 0.12MPa.
Optionally, the clearing apparatus further include the rotating part being connect with the mechanical arm and the connection rotating part and
The interconnecting piece of the cleaning agency；Make the adsorption section of the clearing apparatus be adsorbed below the crawl section of the mechanical arm to include：
Drive the cleaning agency to rotate using the rotating part and interconnecting piece so that the adsorption section supported by the support portion rotate to
It is adsorbed below the crawl section of the mechanical arm.
In order to solve the above technical problems, technical solution of the present invention also provides a kind of mechanical arm, including arm, the connection arm
The crawl section in portion and the above-mentioned clearing apparatus for including rotating part and interconnecting piece, the rotating part of the clearing apparatus and the arm
Connection.
Compared with prior art, technical solution of the present invention has the advantages that：
Clearing apparatus is installed at below mechanical arm using the adsorption section of clearing apparatus, and utilizes the air inlet of clearing apparatus
Mouthful and clean-out hatch object that mechanical arm is captured clean, therefore can be cleaned during object transport, both without
The excessive cleaning time need to be increased, and the pollution particle at the object back side can be reduced, it is therefore prevented that the process equipment caused by particulate matter
Between cross contamination and defective workmanship, and then improve the production yield of wafer.
It is evacuated by vacuum plant in the gas outlet of clearing apparatus, it is ensured that clean gas stream in cleaning process
It is logical, therefore ensure that clean-out hatch has better purging effect, to remove the particle at the object back side.
Clearing apparatus can be made to be rotated relative to mechanical arm using the rotating part of clearing apparatus, need to go to machine when cleaning
It is combined with crawl section below tool arm, not only saves space, but also may be implemented to complete to clean in mechanical arm conveying objects, from
Overall time without influencing technique manufacture.
Before using clearing apparatus, using the particulate matter of laser detection object such as wafer rear, crystalline substance can be accurately judged
Whether the particulate matter at the circle back side can influence subsequent technique, to which in due course is reduced or even removed wafer rear using clearing apparatus
Particulate matter, advanced optimized removal wafer rear particulate matter scheme.
Description of the drawings
Fig. 1 is the cross section structure schematic diagram of the clearing apparatus of the embodiment of the present invention；
Fig. 2 is the clearing apparatus of the embodiment of the present invention and the position relationship schematic top plan view of mechanical arm；
Fig. 3 is partial cross section's structural schematic diagram of the clearing apparatus of the embodiment of the present invention；
Fig. 4 is the flow diagram of the method for the cleaning wafer of the embodiment of the present invention.
Specific implementation mode
Technical solution of the present invention increases particle cleaning function on the mechanical arm (ARM) for transmitting wafer, passes through high pressure
Gas (such as nitrogen) is purged, to prevent the wafer particle that the back side is adsorbed in previous technique board to be brought into next technique
Board, and the problems such as cause board cross contamination, improve production yield.It carries out with reference to the accompanying drawings and examples specifically
It is bright.
The clearing apparatus of the cross section structure schematic diagram of clearing apparatus shown in please referring to Fig.1, the embodiment of the present invention includes：It inhales
Attached portion 10 and cleaning agency；The cleaning agency includes support portion 11, air inlet 12 and clean-out hatch 13.
Adsorption section 10 is used to be adsorbed below the crawl section of mechanical arm.Support portion 11 supports the adsorption section 10, clean-out hatch
13 communicate with air inlet 12.Air inlet 12 is for being passed through gas, such as nitrogen (N2), more preferably High Purity Nitrogen (PN2).Diagram into
There are two gas ports 12, but is not limited thereto, and quantity and the position of air inlet 12 can be arranged according to actual demand.Clean-out hatch 13
For when the crawl section of the mechanical arm captures object, being purged to the back side of the object.The quantity of clean-out hatch 13 and
Position can be arranged according to actual demand, not limit herein.Purging when, by air inlet 12 by nitrogen pass through cleaning
Hole 13 purges object.
The material of adsorption section 10 can select good airproof performance, be not likely to produce the material of particulate matter, such as Teflon
(Teflon).The material that the material of support portion 11 can select wear resistant corrosion resistant roughness low, such as stainless steel (SUS, steel
use stainless)。
In the present embodiment, the cleaning agency further includes：The gas outlet 14 communicated with clean-out hatch 13.In clean-out hatch 13 to object
When the back side of body is purged, gas outlet 14 can be connected to vacuum plant, be carried out by the vacuum plant and gas outlet 14
Vacuum suction.It is evacuated with certain vacuum in gas outlet, clean nitrogen can be kept to circulate during cleaning.
Clearing apparatus can choose whether to be used, that is, be adsorbed in mechanical arm by adsorption section 10 when needing to clean
Lower section.The position relationship schematic top plan view of clearing apparatus and mechanical arm shown in please referring to Fig.2, the present embodiment pass through rotating mechanism
Clearing apparatus is combined with mechanical arm, the clearing apparatus further includes：Rotating part 15 and interconnecting piece 16.Rotating part 15 and machinery
Arm connects, and is connect with the arm of mechanical arm (not shown)；Interconnecting piece 16 connects rotating part 15 and cleaning agency, tool
Body can be the support portion 11 for connecting rotating part 15 and cleaning agency.
When needing to purge the particle of object such as wafer rear, using the rotation of rotating part 15 and interconnecting piece 16, drive clear
Sweeping device is rotated to 20 lower section of crawl section of mechanical arm and is bonded with it, the shape of the geomery and crawl section 20 of adsorption section 10
Size is adapted.After the completion of purging or when need not purge, using the rotation of rotating part 15 and interconnecting piece 16, drives and clean dress
Rotation is set to the position detached with mechanical arm, to not influence mechanical arm transmission wafer.In addition, the mechanical arm of existing board equipment
The adsorption structure 21 being equipped on crawl section 20 has vacuum suction ability mostly, falls so wafer will not occur in purging
The problems such as falling.
Further, in order to preferably be cleaned, the clearing apparatus of the present embodiment also uses special cleaning pore structure, with
Particle is set to be easier to be discharged.Partial cross section's structural schematic diagram of clearing apparatus shown in please referring to Fig.3, it should be noted that Fig. 3
Shown in section and section shown in FIG. 1 be based on different side view angles, Fig. 3 shows clean-out hatch 13 relative to being purged
The structure of plane, clean-out hatch 13 are to tilt upwards at an angle.Specifically, clean-out hatch 13 is relative to 10 place of adsorption section
Plane (plane where reality i.e. the object back side) tilts.It is multiple when the air inlet 12 of both sides is supplied to clean-out hatch 13
Clean-out hatch 13 cleans the object back side at an angle, and the particle at the object back side can be made more easily to be discharged from different angles
To the space of lower section.Clean-out hatch 13 should be appropriate relative to the inclined angle [alpha] of plane where adsorption section 10, and angle is excessive or mistake
It is small all to cause wafer rear that cannot be blown to completely.In the specific implementation, clean-out hatch 13 is relative to flat where adsorption section 10
The range of the inclined angle [alpha] in face can at 2.86 ° to 5.71 °, for example, 2.86 °, 3 °, 3.5 °, 4 °, 4.5 °, 5 °, 5.5 °,
5.71 ° etc..
Using above-mentioned clearing apparatus, wafer can be cleaned, the particle of wafer rear is adhered to removal.Such as Fig. 4
Shown, the method for the cleaning wafer of the embodiment of the present invention includes：
Step S11, using the back side of laser detection wafer；
Step S12 makes the adsorption section of the clearing apparatus be adsorbed on when detecting that the particle of the wafer rear is exceeded
Below the crawl section of the mechanical arm, the crawl section captures the wafer；
Step S13 is passed through gas to the air inlet of the clearing apparatus, so that the clean-out hatch pair communicated with the air inlet
The back side of the wafer is purged；
Step S14 makes the gas outlet connection vacuum plant, when clean-out hatch purges the back side of the wafer,
Vacuum suction is carried out by the vacuum plant and gas outlet.
Each step is described in detail below in conjunction with the accompanying drawings.
Step S11 is executed, using the back side of laser detection wafer.According to laser diffraction and scattering principle, when particle passes through
When laser beam, particle surface can diffraction light.And the angle of light and the grain size of particle are scattered into reversed variation relation, i.e., big
Grain scattering angular is small, and it is big that little particle scatters angular.The presence of particle and big is may determine that by collecting scattered light signal
It is small.
The back side using laser detection wafer can further include：Make laser irradiation at the back side of wafer, passes through
Receiver receives the scattered signal of particle；According to the scattered signal of the particle obtain the wafer rear amounts of particles and/
Or size, whether the particle to judge the wafer rear is exceeded, if so then execute subsequent step, that is, uses clearing apparatus
Wafer rear is cleaned, to avoid wafer from entraining the pellets into subsequent technique board.It is mentioned here it is " exceeded " can
Amounts of particles to refer to wafer rear exceeds preset quantity standard, may also mean that the particle size of wafer rear beyond default
Dimensional standard；Quantity and size setting criterion are can be combined with, as the amounts of particles of wafer rear has exceeded preset quantity
Standard and particle size have exceeded pre-set dimension standard.Wherein, preset quantity standard and pre-set dimension standard are according to actual conditions
It pre-sets, does not limit herein.
In addition, alarm signal can be sent out when detecting that the particle of the wafer rear is exceeded, it will be described clear with control
Sweeping device is adsorbed to below the mechanical arm for capturing the wafer.Detection wafer can carry out in individual detection device, also may be used
To be carried out during mechanical arm transmits wafer.
Execute step S12 makes the adsorption section of the clearing apparatus inhale when detecting that the particle of the wafer rear is exceeded
It is attached to below the crawl section of the mechanical arm, the crawl section captures the wafer.Incorporated by reference to referring to figs. 1 to Fig. 3, mechanical arm
Adsorption structure 21 on crawl section 20 adsorbs the wafer (needing the wafer cleaned) that the back side carries particle, utilizes 15 He of rotating part
Interconnecting piece 16 drives the cleaning agency to rotate, so that the rotation of adsorption section 10 supported by support portion 11 is to being adsorbed on mechanical arm
20 lower section of crawl section, the opening of such clean-out hatch 13 is just against the back side 30 of wafer.
It should be noted that the clearing apparatus of the present embodiment by rotating part 15 and interconnecting piece 16 can more easily with machine
The crawl section of tool arm combines or separation.In other embodiments, rotating part 15 and interconnecting piece 16 can not also be needed, that is, clearly
Sweeping device can be independent device, only need to be by the crawl section of the adsorption section 10 and mechanical arm of clearing apparatus when needing to clean
20 fittings.
Step S13 is executed, gas is passed through to the air inlet of the clearing apparatus, so that the cleaning communicated with the air inlet
Hole purges the back side of the wafer.Incorporated by reference to reference to figure 1 and Fig. 3, the gas of certain pressure, example are passed through to air inlet 12
Such as nitrogen, the back side 30 of wafer is purged by the way of high pressure nitrogen purging, the pressure for being passed through nitrogen should be appropriate, pressure
The too small purging effect that can influence of power causes to purge particle totally, and pressure is excessive, wafer can be caused to fall.Specific implementation
When, be passed through nitrogen pressure limit can in 0.08 megapascal (MPa) to 0.12MPa, for example, 0.08Mpa, 0.09Mpa,
0.1Mpa, 0.11Mpa, 0.12Mpa etc., with the purging effect obtained.
Further, as shown in figure 3, clean-out hatch 13 is tilted relative to the plane where adsorption section 10, i.e. clean-out hatch 13 is opened
Mouth is tiltedly to the back side of wafer 30.When the air inlet 12 of both sides is supplied to clean-out hatch 13, multiple clean-out hatch 13 are at an angle
The back side 30 for purging wafer can make the particle of wafer rear 30 more easily be discharged to the space of lower section from different angles.
In the specific implementation, clean-out hatch 13 may range from 2.86 ° to 5.71 ° relative to the back side 30 inclined angle [alpha] of wafer.
Step S14 can also be performed while executing step S13, make the gas outlet connection vacuum plant, cleaning
When hole purges the back side of the wafer, vacuum suction is carried out by the vacuum plant and gas outlet.Incorporated by reference to reference
Fig. 1, gas outlet 14 are communicated with clean-out hatch 13, and vacuum suction is carried out by the vacuum plant and gas outlet 14.In gas outlet 14
It is evacuated with certain vacuum, it is ensured that clean nitrogen circulation to ensure to have better purging effect, can remove crystalline substance
The particle at the circle back side 30.
Although the present invention discloses as above in a preferred embodiment thereof, it is not for limiting the present invention, any ability
Field technique personnel without departing from the spirit and scope of the present invention, may be by the methods and technical content of the disclosure above to this
Inventive technique scheme makes possible variation and modification, therefore, every content without departing from technical solution of the present invention, according to this hair
Bright technical spirit belongs to the technology of the present invention to any simple modifications, equivalents, and modifications made by embodiment of above
The protection domain of scheme.
Claims (14)
1. a kind of clearing apparatus, which is characterized in that including：Adsorption section and cleaning agency；
The adsorption section is used to be adsorbed below the crawl section of mechanical arm；
The cleaning agency includes support portion, air inlet and clean-out hatch, and the support portion supports the adsorption section, the clean-out hatch
It is communicated with the air inlet；The clean-out hatch is used for when the crawl section of the mechanical arm captures object, to the back of the body of the object
Face is purged.
2. clearing apparatus as described in claim 1, which is characterized in that the cleaning agency further includes：With the clean-out hatch phase
Logical gas outlet.
3. clearing apparatus as described in claim 1, which is characterized in that the clean-out hatch is relative to flat where the adsorption section
Face tilts.
4. clearing apparatus as claimed in claim 3, which is characterized in that the clean-out hatch is relative to flat where the adsorption section
The inclined angular range in face is 2.86 degree to 5.71 degree.
5. clearing apparatus as described in claim 1, which is characterized in that the material of the adsorption section is Teflon, the support
The material in portion is stainless steel.
6. such as clearing apparatus described in any one of claim 1 to 5, which is characterized in that further include being connect with the mechanical arm
The interconnecting piece of rotating part and the connection rotating part and the cleaning agency.
7. a kind of method cleaning wafer, which is characterized in that including：
Using the back side of laser detection wafer；
When detecting that the particle of the wafer rear is exceeded, the adsorption section of clearing apparatus described in claim 1 is made to be adsorbed on
Below the crawl section of the mechanical arm, the crawl section captures the wafer；
Gas is passed through to the air inlet of the clearing apparatus, so that the back of the body of the clean-out hatch communicated with the air inlet to the wafer
Face is purged.
8. the method for cleaning wafer as claimed in claim 7, which is characterized in that wrap at the back side using laser detection wafer
It includes：Make laser irradiation at the back side of wafer, the scattered signal of particle is received by receiver；According to the scattered signal of the particle
Obtain the amounts of particles and/or size of the wafer rear.
9. the method for cleaning wafer as claimed in claim 7, which is characterized in that the cleaning agency further includes：With it is described clear
The gas outlet that cleaning bottom of hole communicates；It is described clean wafer method further include：Make the gas outlet connection vacuum plant, in clean-out hatch pair
When the back side of the wafer is purged, vacuum suction is carried out by the vacuum plant and gas outlet.
10. the method for cleaning wafer as claimed in claim 7, which is characterized in that the clean-out hatch is relative to the adsorption section
The plane at place tilts.
11. the method for cleaning wafer as claimed in claim 10, which is characterized in that the clean-out hatch is relative to the adsorption section
The inclined angular range of plane at place is 2.86 degree to 5.71 degree.
12. the method for cleaning wafer as claimed in claim 7, which is characterized in that the gas being passed through is nitrogen, described logical
The pressure limit for entering gas is 0.08MPa to 0.12MPa.
13. the method for cleaning wafer such as claim 7 to 12 any one of them, which is characterized in that the clearing apparatus also wraps
Include the interconnecting piece of the rotating part being connect with the mechanical arm and the connection rotating part and the cleaning agency；Make the cleaning
The adsorption section of device is adsorbed below the crawl section of the mechanical arm：It is driven using the rotating part and interconnecting piece described clear
Mechanism rotation is swept, so that the adsorption section supported by the support portion is rotated to the crawl section lower section for being adsorbed on the mechanical arm.
14. a kind of mechanical arm, including arm and the crawl section for connecting the arm, which is characterized in that further include claim 6 institute
The clearing apparatus stated, the rotating part of the clearing apparatus are connect with the arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810218343.3A CN108336002A (en) | 2018-03-16 | 2018-03-16 | The method of clearing apparatus and cleaning wafer, mechanical arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810218343.3A CN108336002A (en) | 2018-03-16 | 2018-03-16 | The method of clearing apparatus and cleaning wafer, mechanical arm |
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| Publication Number | Publication Date |
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| CN108336002A true CN108336002A (en) | 2018-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810218343.3A Pending CN108336002A (en) | 2018-03-16 | 2018-03-16 | The method of clearing apparatus and cleaning wafer, mechanical arm |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109671650A (en) * | 2018-12-04 | 2019-04-23 | 芯恩（青岛）集成电路有限公司 | A kind of circulating liquid formula suction nozzle, and its method for removing particle in wafer |
| CN110802081A (en) * | 2018-08-06 | 2020-02-18 | 长鑫存储技术有限公司 | Photomask transportation method and equipment |
| CN111554595A (en) * | 2020-05-11 | 2020-08-18 | 上海果纳半导体技术有限公司 | Semiconductor chip preparation device |
| CN111607783A (en) * | 2020-05-12 | 2020-09-01 | 北京北方华创微电子装备有限公司 | Semiconductor carrier, semiconductor processing equipment and purging method |
| CN113752146A (en) * | 2021-09-08 | 2021-12-07 | 武汉新芯集成电路制造有限公司 | Chuck cleaning device, chuck bearing surface detection method and bonding equipment |
| CN114226388A (en) * | 2021-11-24 | 2022-03-25 | 广东先导微电子科技有限公司 | Cleaning improvement method for wafer |
| CN115178435A (en) * | 2022-09-14 | 2022-10-14 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
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| JPH11260742A (en) * | 1998-03-12 | 1999-09-24 | Kokusai Electric Co Ltd | Heat treating equipment |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110802081A (en) * | 2018-08-06 | 2020-02-18 | 长鑫存储技术有限公司 | Photomask transportation method and equipment |
| CN109671650A (en) * | 2018-12-04 | 2019-04-23 | 芯恩（青岛）集成电路有限公司 | A kind of circulating liquid formula suction nozzle, and its method for removing particle in wafer |
| CN111554595A (en) * | 2020-05-11 | 2020-08-18 | 上海果纳半导体技术有限公司 | Semiconductor chip preparation device |
| CN111607783A (en) * | 2020-05-12 | 2020-09-01 | 北京北方华创微电子装备有限公司 | Semiconductor carrier, semiconductor processing equipment and purging method |
| CN111607783B (en) * | 2020-05-12 | 2022-07-22 | 北京北方华创微电子装备有限公司 | Semiconductor carrier, semiconductor processing equipment and purging method |
| CN113752146A (en) * | 2021-09-08 | 2021-12-07 | 武汉新芯集成电路制造有限公司 | Chuck cleaning device, chuck bearing surface detection method and bonding equipment |
| CN114226388A (en) * | 2021-11-24 | 2022-03-25 | 广东先导微电子科技有限公司 | Cleaning improvement method for wafer |
| CN115178435A (en) * | 2022-09-14 | 2022-10-14 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
| CN115178435B (en) * | 2022-09-14 | 2022-12-30 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
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Application publication date: 20180727 |