CN108332174B - Heat dissipation system and method applied to light emitting surface of high-power LED lighting equipment - Google Patents
Heat dissipation system and method applied to light emitting surface of high-power LED lighting equipment Download PDFInfo
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- CN108332174B CN108332174B CN201810124213.3A CN201810124213A CN108332174B CN 108332174 B CN108332174 B CN 108332174B CN 201810124213 A CN201810124213 A CN 201810124213A CN 108332174 B CN108332174 B CN 108332174B
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- 238000010521 absorption reaction Methods 0.000 description 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 4
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 4
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 3
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- 229940072056 alginate Drugs 0.000 description 3
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- 238000002360 preparation method Methods 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
- F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention belongs to the technical field of heat dissipation, and discloses a heat dissipation system and a heat dissipation method applied to a light emitting surface of a high-power LED (light emitting diode) lighting device. The invention solves the problems that an LED device system in the prior art is huge, has high working temperature and can only radiate heat on the backlight surface of the LED, and can control the temperature of the light-emitting surface of a high-power LED device and inhibit the light-emitting quality of the LED device from being reduced.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat dissipation system and a heat dissipation method applied to a light emitting surface of a high-power LED lighting device.
Background
In recent years, with the continuous development of the preparation technology and the heat dissipation technology of the LED, the LED gradually replaces the traditional light source to become the mainstream light source at present, and is widely applied to many industries such as building, medical treatment, military, aerospace and the like. Compared with the traditional light source (such as a fluorescent lamp, a metal halide lamp and a high-pressure mercury lamp), the LED has the advantages of environmental protection, no toxicity, high lighting effect, simple equipment, small volume, good adjustability and the like. However, there are some problems with the development of LEDs, the most prominent of which is the problem of heat dissipation. The heat dissipation mode of the LED can be divided into active heat dissipation and passive heat dissipation. Active heat dissipation is performed by forced heat dissipation through auxiliary devices, such as air cooling, liquid cooling, heat pipe heat dissipation and the like. The passive heat dissipation is heat dissipation by means of heat conduction, and the heat dissipation efficiency can be improved by using a substrate with high heat conductivity coefficient and a thermal interface material, using a heat sink, reasonably arranging LED chips and the like. However, the existing various heat dissipation devices inevitably have the disadvantages of large system and high cost. In addition, due to the limitation of the LED lighting effect, most of the heat dissipation devices can only dissipate heat on the reflective surface thereof, and cannot effectively dissipate heat of the whole LED lighting device, which causes the problem that the light emitting surface of the high-power LED lighting device is hot, and the device is burned out.
Disclosure of Invention
The embodiment of the application provides a heat dissipation system and a heat dissipation method applied to a light emitting surface of a high-power LED lighting device, and solves the problems that an LED device system is huge, the working temperature is high, and heat dissipation can only be performed on an LED backlight surface in the prior art.
The embodiment of the application provides a cooling system for high-power LED lighting device goes out plain noodles, includes: hydrogel and a water replenishing device;
hydrogel is spread on LED lighting apparatus's play plain noodles, the moisturizing device with hydrogel intercommunication, the continuous evaporation back of moisture in the hydrogel, the moisturizing device is right hydrogel carries out the moisturizing.
Preferably, the hydrogel is a double-stranded hydrogel.
Preferably, the water replenishing device comprises a water replenishing pipeline and a water replenishing container, the water replenishing pipeline is made of a capillary material, and two ends of the water replenishing pipeline are respectively communicated with the hydrogel and the water replenishing container.
Preferably, the water replenishing device comprises a water replenishing container, a water conveying pipe and an electric pump, wherein the electric pump is arranged on the water conveying pipe, and two ends of the water conveying pipe are respectively communicated with the hydrogel and the water replenishing container.
Preferably, the edge part of the hydrogel and the light emitting surface of the LED lighting device are bonded together through a heat-conducting silicon adhesive.
The embodiment of the application provides a heat dissipation method applied to a light-emitting surface of a high-power LED lighting device, hydrogel is paved on the light-emitting surface of the LED lighting device, and the heat of the LED lighting device is taken away in time by evaporating the water contained in the hydrogel; and after the water in the hydrogel is continuously evaporated, supplementing water to the hydrogel through a water supplementing device.
Preferably, the hydrogel is a double-stranded hydrogel.
Preferably, the specific implementation manner of paving the hydrogel on the light emitting surface of the LED lighting device is as follows: preparing the hydrogel into a film to obtain a hydrogel film; the area of the hydrogel film is larger than that of the light-emitting surface of the LED lighting equipment; and bonding the edge part of the hydrogel film and the light emitting surface of the LED lighting device together through heat-conducting silicon glue.
Preferably, the water replenishing device comprises a water replenishing pipeline and a water replenishing container, the water replenishing pipeline is made of a capillary material, and two ends of the water replenishing pipeline are respectively communicated with the hydrogel and the water replenishing container.
Preferably, the water replenishing device comprises a water replenishing container, a water conveying pipe and an electric pump, wherein the electric pump is arranged on the water conveying pipe, and two ends of the water conveying pipe are respectively communicated with the hydrogel and the water replenishing container.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
in the embodiment of the application, the hydrogel is directly paved on the light emitting surface of the high-power LED lighting equipment, water contained in the hydrogel film is evaporated when the temperature of the equipment rises, heat is taken away in time, and the continuous rise of the temperature of the LED equipment is inhibited. The invention effectively realizes heat dissipation by using an active phase change heat transfer mode, and the adopted hydrogel has good mechanical and thermal properties, higher transparency and strong reusability, and can contain more than 90 percent of water by weight in a fully swollen state. The hydrogel is used for replenishing water, the long-time working requirement of the LED lighting equipment is met, and compared with the traditional LED heat dissipation technology, the hydrogel does not consume electric energy and has very large energy-saving potential.
Drawings
In order to more clearly illustrate the technical solution of the present embodiment, the drawings needed to be used in the description of the embodiment will be briefly introduced below, and it is obvious that the drawings in the following description are one embodiment of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation system applied to a light emitting surface of a high-power LED lighting device according to an embodiment of the present invention;
fig. 2 is an internal structure diagram of a double-chain hydrogel applied to a heat dissipation system of a light-emitting surface of a high-power LED lighting device according to an embodiment of the present invention;
fig. 3 is a graph showing an experimental effect of the heat dissipation method applied to the light emitting surface of the high-power LED lighting device according to the embodiment of the present invention.
The LED lighting device comprises an LED lighting device 1, a hydrogel 2, a water replenishing pipeline 3 and a water replenishing container 4;
calcium ion crosslinking in 5-alginate gel, N' -methylene bisacrylamide covalent crosslinking in 6-polyacrylamide gel, and covalent crosslinking between carboxyl of 7-alginate chain and amido of polyacrylamide chain;
8-temperature change curve of the LED device when hydrogel is not laid, and 9-temperature change curve of the LED device when hydrogel is laid.
Detailed Description
The embodiment of the application provides a heat dissipation system and a heat dissipation method applied to a light emitting surface of a high-power LED lighting device, and solves the problems that an LED device system is huge, the working temperature is high, and heat dissipation can only be performed on an LED backlight surface in the prior art.
In order to solve the technical problems, the general idea of the embodiment of the application is as follows:
a heat dissipation system applied to a light emitting surface of a high-power LED lighting device comprises: hydrogel and a water replenishing device;
hydrogel is spread on LED lighting apparatus's play plain noodles, the moisturizing device with hydrogel intercommunication, the continuous evaporation back of moisture in the hydrogel, the moisturizing device is right hydrogel carries out the moisturizing.
A heat dissipation method applied to a light emitting surface of a high-power LED lighting device is characterized in that hydrogel is laid on the light emitting surface of the LED lighting device, and the heat of the LED lighting device is taken away in time through the water contained in the hydrogel evaporated interior; and after the water in the hydrogel is continuously evaporated, supplementing water to the hydrogel through a water supplementing device.
According to the invention, the hydrogel is directly paved on the light emitting surface of the high-power LED lighting equipment, and water contained in the hydrogel film is evaporated when the temperature of the equipment rises to take away heat in time, so that the continuous rise of the temperature of the LED equipment is inhibited. The invention effectively realizes heat dissipation by using an active phase change heat transfer mode, and the adopted hydrogel has good mechanical and thermal properties, higher transparency and strong reusability, and can contain more than 90 percent of water by weight in a fully swollen state. The hydrogel is used for replenishing water, the long-time working requirement of the LED lighting equipment is met, and compared with the traditional LED heat dissipation technology, the hydrogel does not consume electric energy and has very large energy-saving potential.
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
The invention aims to provide a heat dissipation technology applied to a light emitting surface of a high-power LED lighting device, and the main body for realizing the heat dissipation function is hydrogel. The hydrogel has good mechanical and thermal properties, transparency and cyclability, when a large-scale LED lighting device works, the hydrogel film containing water is in the condition of high heat flow density, the water in the hydrogel film can be evaporated, and a great deal of heat can be taken away through phase change, so that the heat dissipation effect is achieved.
Preferably, a double-stranded hydrogel is used, which has a higher transparency. A tough, double-network hydrogel film with high transparency can be prepared, the hydrogel film is spread on the outer surface of the glass of the high-power LED lighting device, and water is supplied to the hydrogel film side through a water container. The double-chain hydrogel has better mechanical and thermal properties, high transparency and cyclability, and the cooling power and the water absorption capacity of the double-chain hydrogel are kept at more than 50 cooling cycles. The heat dissipation technology provides a new heat dissipation form for the high-power LED lighting equipment, and the characteristics of high transparency and high water absorption of the heat dissipation technology solve the problem that the traditional heat dissipation technology cannot cool the light emitting surface of the LED lighting equipment, and effectively cool the lighting lamp tube.
Specifically, as shown in fig. 1, the heat dissipation system applied to the light emitting surface of the high-power LED lighting device in the embodiment mainly includes two parts: hydrogel 2 and a water replenishing device, wherein the water replenishing device comprises a water replenishing pipeline 3 and a water replenishing container 4. The hydrogel 2 is used for being paved on a light emitting surface of the LED lighting device 1, and two ends of the water replenishing pipeline 3 are respectively communicated with the hydrogel 2 and the water replenishing container 4.
Preferably, a double-stranded hydrogel is used, and a specific double-stranded hydrogel is provided below.
The invention provides a specific double-chain hydrogel which is prepared by fully mixing sodium alginate and acrylamide as monomers, N, N ' -methylene bisacrylamide as a cross-linking agent, ammonium persulfate as a photoinitiator, and N, N, N ', N ' -tetramethylethylenediamine as a cross-linking accelerator, permeating calcium sulfate suspension, irradiating by ultraviolet light at a certain temperature, and fully cooling.
Specifically, the preparation method of the double-chain hydrogel comprises the following steps:
step one, dissolving sodium alginate and acrylamide in deionized water at the weight ratio of 2%, 12% and 86%, and standing for 24 hours;
preparing a correlation agent of acrylamide, namely an N, N' -methylene bisacrylamide aqueous solution with the mass fraction of 0.06% and a photoinitiator of acrylamide, namely an ammonium persulfate aqueous solution with the mass fraction of 0.17%;
step three, fully mixing the samples obtained in the step one and the step two, vacuumizing, adding a sodium alginate cross-linking agent, namely 13 mass percent of calcium sulfate slurry and a gel cross-linking accelerator, namely 0.25 mass percent of N, N, N ', N' -tetramethylethylenediamine solution, and uniformly mixing;
and step four, pouring the obtained sample into a glass culture dish, curing the sample by using ultraviolet light (lambda is 254nm) at the temperature of 50 ℃ for 1 hour, and then cooling the sample for 24 hours at the normal temperature to stabilize the reaction, thereby finally obtaining the double-chain hydrogel.
The double-chain hydrogel is formed by interweaving matrixes (alginate gel chains and polyacrylamide gel chains) of two types of gels and forming covalent crosslinking. The double-chain hydrogel shows extraordinary toughness and cyclability due to the fact that an interpenetrating ionic and covalent crosslinking network is shown in fig. 2, and specifically relates to calcium ionic crosslinking in alginate gel (shown in a block diagram 5 in fig. 2), N' -methylene bisacrylamide covalent crosslinking in polyacrylamide gel (shown in a block diagram 6 in fig. 2), and covalent crosslinking between carboxyl groups of alginate chains and amine groups of polyacrylamide chains (shown in a block diagram 7 in fig. 2), and the excellent cyclability further proves that the mechanical properties and the water absorption capacity of the hydrogel after multiple cycles are not changed compared with those of a fresh double-chain hydrogel. The water replenishing device is used for replenishing water for the double-chain hydrogel after water in the double-chain hydrogel is continuously evaporated so as to ensure that more water is always contained in the double-chain hydrogel, so that the LED lighting equipment 1 can timely evaporate and take away heat when the working temperature is higher for a long time, and the heat dissipation and cooling performance of the LED lighting equipment is kept.
In the present invention, the double-stranded hydrogel is a functional entity, which has good mechanical and thermal properties and durability and reusability for repeated cooling, and which may contain more than 90% by weight of water in its fully swollen state. Experiments show that the wet hydrogel film and the dry hydrogel film have the transparencies of 92% and 90% respectively, and can be applied to the light-emitting surface of the LED lighting equipment without influencing the use of the LED lighting equipment. It should be noted that the transparency of other hydrogels can also be satisfactory for application on the light emitting surface of the LED lighting device without affecting the use thereof.
In a specific implementation method, the hydrogel 2 is made into a film, the area of the film is slightly larger than the area of the light emitting surface of the LED lighting device 1, and the edge portion of the hydrogel film and the LED lighting device 1 are bonded together by using a heat-conducting silicon adhesive, so that the hydrogel film and the LED lighting device 1 are sufficiently attached without any gap. Alternatively, the hydrogel 2 may be directly formed on the light emitting surface material to form a chemical bond, thereby eliminating the interface material between the two.
The LED lighting equipment 1 is started, after the LED lighting equipment 1 works for a period of time, the temperature can rise rapidly, the heat flux density is increased, water in the hydrogel film in a swelling state is heated and evaporated to actively change phase to take away heat, and the rise of the temperature of the LED lighting equipment 1 is restrained. The hydrogel 2 is connected with the water replenishing container 4 through the water replenishing pipeline 3 made of a capillary material, water in the hydrogel 2 can evaporate continuously along with the continuous increase of the working time of the LED lighting device 1, the water content is reduced, potential differences are formed between the hydrogel 2 and the water replenishing container 4 at two ends of the water replenishing pipeline 3 due to the capillary action of the water replenishing pipeline 3, and the water in the water replenishing container 4 is transported to the hydrogel 2 under the action of the potential differences, so that the water replenishing of the hydrogel 2 is realized. The water source in the water replenishing container 4 is continuously conveyed to the hydrogel 2 due to the potential difference and then is evaporated, and the circulation is carried out, so that the water source is continuously subjected to evaporative cooling. Besides the water replenishing and generating mode adopting the capillary material without driving, the water replenishing can also adopt a power driving mode to replenish water. For example, the water replenishing device may include a water replenishing container, a water delivery pipe, and an electric pump, the electric pump is disposed on the water delivery pipe, two ends of the water delivery pipe are respectively communicated with the hydrogel and the water replenishing container, and power-driven water replenishing is realized by the electric pump.
In the embodiment, when the hydrogel 2 is not coated on the LED lighting device 1, the temperature of the LED lighting device 1 is rapidly increased and forms a higher temperature equilibrium with the working environment, and the temperature change is shown as a curve 8 in fig. 3. When the hydrogel 2 is coated on the LED lighting device 1, the temperature of the hydrogel 2 will increase along with the surface temperature of the LED lighting device 1, the higher the temperature, the more drastic the active phase change, and the larger the amount of heat will be taken away along with the phase change, and the hydrogel 2 and the LED lighting device 1 will form a lower temperature equilibrium with the working environment, and the temperature change is shown as a curve 9 in fig. 3. It can be seen that the heat dissipation technology provided by the invention has a very considerable heat dissipation effect.
In conclusion, the hydrogel fully utilizes the high water absorption capacity, high transparency, good mechanical and thermal properties and reusability of the hydrogel, is applied to the light emitting surface of the high-power LED lighting equipment for heat dissipation, controls the rise of the working temperature of the high-power LED lighting equipment, is simple in equipment, but high in heat dissipation efficiency, low in cost, free of electric energy consumption and has great energy-saving potential.
The heat dissipation system and the heat dissipation method applied to the light-emitting surface of the high-power LED lighting equipment provided by the embodiment of the invention at least have the following technical effects:
in the embodiment of the application, the hydrogel is directly paved on the light emitting surface of the high-power LED lighting equipment, water contained in the hydrogel film is evaporated when the temperature of the equipment rises, heat is taken away in time, and the continuous rise of the temperature of the LED equipment is inhibited. The invention effectively realizes heat dissipation by using an active phase change heat transfer mode, and the adopted hydrogel has good mechanical and thermal properties, higher transparency and strong reusability, and can contain more than 90 percent of water by weight in a fully swollen state. The hydrogel is used for replenishing water, the long-time working requirement of the LED lighting equipment is met, and compared with the traditional LED heat dissipation technology, the hydrogel does not consume electric energy and has very large energy-saving potential.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (8)
1. A heat dissipation system applied to a light emitting surface of a high-power LED lighting device is characterized by comprising: hydrogel and a water replenishing device;
the hydrogel is paved on a light emitting surface of the LED lighting equipment, the water replenishing device is communicated with the hydrogel, and the water replenishing device replenishes water for the hydrogel after water in the hydrogel is continuously evaporated; the edge part of the hydrogel is adhered with the light emitting surface of the LED lighting device through heat-conducting silicon glue.
2. The heat dissipation system applied to the light emitting surface of the high-power LED lighting device as claimed in claim 1, wherein the hydrogel is a double-chain hydrogel.
3. The heat dissipation system applied to the light emitting surface of the high-power LED lighting device as claimed in claim 1, wherein the water supplement device comprises a water supplement pipeline and a water supplement container, the water supplement pipeline is made of a capillary material, and two ends of the water supplement pipeline are respectively communicated with the hydrogel and the water supplement container.
4. The heat dissipation system applied to the light emitting surface of the high-power LED lighting device as recited in claim 1, wherein the water supply device comprises a water supply container, a water supply pipe, and an electric pump, the electric pump is disposed on the water supply pipe, and two ends of the water supply pipe are respectively communicated with the hydrogel and the water supply container.
5. A heat dissipation method applied to a light-emitting surface of a high-power LED lighting device is characterized in that hydrogel is paved on the light-emitting surface of the LED lighting device, and the concrete implementation mode of paving the hydrogel on the light-emitting surface of the LED lighting device is as follows: preparing the hydrogel into a film to obtain a hydrogel film; the area of the hydrogel film is larger than that of the light-emitting surface of the LED lighting equipment; bonding the edge part of the hydrogel film and the light emitting surface of the LED lighting device together through heat-conducting silicon glue; the heat of the LED lighting equipment is timely taken away through the moisture contained in the hydrogel evaporation; and after the water in the hydrogel is continuously evaporated, supplementing water to the hydrogel through a water supplementing device.
6. The method for dissipating heat applied to a light emitting surface of a high-power LED lighting device according to claim 5, wherein the hydrogel is a double-chain hydrogel.
7. The method as claimed in claim 5, wherein the water filling device comprises a water filling line and a water filling container, the water filling line is made of a capillary material, and two ends of the water filling line are respectively connected to the hydrogel and the water filling container.
8. The heat dissipation method applied to the light emitting surface of the high-power LED lighting device as recited in claim 5, wherein the water supply device comprises a water supply container, a water supply pipe and an electric pump, the electric pump is disposed on the water supply pipe, and two ends of the water supply pipe are respectively communicated with the hydrogel and the water supply container.
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| CN201810124213.3A CN108332174B (en) | 2018-02-07 | 2018-02-07 | Heat dissipation system and method applied to light emitting surface of high-power LED lighting equipment |
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| CN201810124213.3A CN108332174B (en) | 2018-02-07 | 2018-02-07 | Heat dissipation system and method applied to light emitting surface of high-power LED lighting equipment |
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|---|---|---|---|---|
| CN115435523B (en) * | 2022-07-20 | 2023-07-07 | 浙江师范大学 | Solid-state passive evaporative cooling system and method |
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