CN108292592B - Imprint apparatus and method - Google Patents

Imprint apparatus and method Download PDF

Info

Publication number
CN108292592B
CN108292592B CN201680068257.8A CN201680068257A CN108292592B CN 108292592 B CN108292592 B CN 108292592B CN 201680068257 A CN201680068257 A CN 201680068257A CN 108292592 B CN108292592 B CN 108292592B
Authority
CN
China
Prior art keywords
mold
substrate
die
plasma treatment
transferring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201680068257.8A
Other languages
Chinese (zh)
Other versions
CN108292592A (en
Inventor
具滋鹏
李眩雨
李南植
丘璜燮
金铉济
郑熙锡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GigaLane Co Ltd
Original Assignee
GigaLane Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160166099A external-priority patent/KR20170067665A/en
Application filed by GigaLane Co Ltd filed Critical GigaLane Co Ltd
Publication of CN108292592A publication Critical patent/CN108292592A/en
Application granted granted Critical
Publication of CN108292592B publication Critical patent/CN108292592B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2632—Stampers; Mountings thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2642—Heating or cooling means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
    • H01L21/02315—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

The invention discloses an embossing device and an embossing method. The imprint apparatus of the present invention includes: a surface modification unit that performs plasma treatment on the surface of the mold on which the pattern is formed; a bonding section that bonds the die and the substrate so that the pattern of the die subjected to the plasma treatment can be pressed against the substrate; and a separating part which separates the bonded mold and the substrate.

Description

Imprint apparatus and method
Technical Field
The present invention relates to an imprint apparatus and method for transferring a pattern by pressing a resin applied to a surface of a substrate with a mold.
Background
Nanoimprint lithography is a technology that is economical and can effectively produce nano-structures (nano-structures), and is a technology that spin-coats (spin-coating) or spot-coats (dispensing) resin on a substrate (superstrate), and transfers (transfer) a pattern by pressing a mold having the pattern formed thereon onto the surface of the resin.
Nanoimprint lithography can be broadly classified into thermal-type (hot-type) and ultraviolet irradiation.
The heating process is called Thermal transfer (Hot Embossing) or Thermal Imprint Lithography (Thermal Imprint Lithography), and is a method of bringing a mold into contact with a substrate on which a polymer layer is formed, heating the mold to impart fluidity to the polymer layer, and applying pressure to the polymer layer to form a desired pattern on the polymer layer. Such a heating process has a problem that it is difficult to perform multi-layer alignment due to thermal deformation, and a problem that a pattern is fragile because a high pressure is required to imprint a resin having a large viscosity.
The nanoimprint lithography process of the ultraviolet irradiation method developed to solve the problem of the heating process is a method using a low-viscosity photocurable resin and ultraviolet rays for curing the resin, and is suitable for multilayering and mass production because the process can be performed at a normal temperature and a low pressure.
In a conventional ultraviolet irradiation type nanoimprint lithography process, after an ultraviolet curing resin is coated on a substrate, a mold is pressed, and the curing resin fills in between patterns of the mold. At this time, since the viscosity is low, the resin can easily fill in between the patterns of the mold even under a low pressure. After that, when the resin is exposed to light by the UV light source through the transparent mold, the resin is cured. Then, if the mold is removed, a residual layer remains between the patterns, and the residual layer is removed by oxygen ashing to complete the process.
In the conventional ultraviolet irradiation method, a self-assembled monolayer is applied to the surface of a mold to improve the mold release property, but the coating treatment time is long, and the productivity of the product is deteriorated.
Further, in the case of performing an additional coating process on the mold, there are disadvantages in that price competitiveness is reduced, and an additionally formed coating layer may be stained when the substrate is separated from the mold, making it difficult to reuse the mold.
Further, since the reusability of the mold is reduced and it is necessary to transfer the mold only in one direction, productivity is reduced, and a resin coating process or the like is performed in another place or equipment, which makes it impossible to perform a continuous process, and thus, there are problems in that a large amount of work space is required and a large amount of work time is required.
The matters described as background above are only for enhancement of understanding of the background of the invention and are not to be construed as belonging to the prior art known to a person of ordinary skill in the art.
Documents of the prior art
Patent document 1: KR 10-2012 0127731(2012.11.23)
Disclosure of Invention
Technical problem
The invention aims to provide an imprint apparatus and method capable of improving mold releasability and reusing a mold.
Technical scheme
The imprint apparatus of the present invention for achieving such an object includes: a surface modification unit that performs plasma treatment on the surface of the mold on which the pattern is formed; a bonding section that bonds the die and the substrate so that the pattern of the die subjected to the plasma treatment can be pressed against the substrate; and a separating part which separates the bonded mold and the substrate.
The imprint apparatus is characterized in that the plasma is generated by applying RF to one or more gases including air, argon, oxygen, and nitrogen.
The imprint apparatus further includes a transfer unit that transfers the mold, and the transfer unit transfers the mold separated by the separation unit to the surface modification unit so that the mold can be reused by performing plasma processing on the mold.
The imprint apparatus further includes a control unit that counts a number of times of coupling or separating the mold with the substrate, and controls the transfer unit to replace the mold with a new mold according to the set number of times.
The imprint apparatus further includes a control unit that checks a surface state of the mold separated by the separation unit, and controls the transfer unit to replace the mold with a new mold according to the surface state.
The imprint apparatus is characterized in that the surface modification section, the bonding section, and the separation section are arranged in order along the transfer direction of the mold at a predetermined pitch.
The imprint apparatus is characterized in that the bonding portion, the surface modification portion, and the separation portion are arranged in order along the transfer direction of the mold at a predetermined pitch.
The mold includes a first mold and a second mold which are provided at a predetermined interval from each other on the transfer portion, the surface modification portion includes a first surface modification portion and a second surface modification portion which are provided at a predetermined interval from each other with the bonding portion interposed therebetween, the separation portion includes a first separation portion and a second separation portion which are provided at a predetermined interval from each other with the bonding portion and the surface modification portion interposed therebetween, and the transfer portion transfers the first or second mold separated by any one of the first and second separation portions to any one of the first and second surface modification portions.
The imprint apparatus further includes a coating portion that coats an upper portion of the substrate with a resin.
The coating portion includes: a spin coating section that coats a liquid resin on the upper portion of the substrate; and a drying section that dries the resin.
The joint portion includes: a chamber maintaining a low vacuum state to be able to prevent inflow of foreign substances; and a curing section that cures the resin on the substrate.
The transfer unit includes: a PET film; a first roll for winding the PET film with one end thereof bonded thereto; and a second roller that is wound with the other end of the PET film joined thereto and is disposed at a predetermined interval from the first roller, wherein the mold is formed on the PET film.
The imprint apparatus includes: a surface modification unit that performs plasma treatment on the surface of the mold on which the pattern is formed; and a working part that punches the die against the substrate so that the pattern of the die subjected to the plasma treatment can be punched against the substrate, and releases the die from the substrate.
An imprint method, comprising: a process of performing plasma treatment to modify the surface of the mold having the pattern formed; a process of punching the pattern of the mold subjected to the plasma treatment on a substrate; and releasing the die from the substrate being punched.
The imprint method is characterized in that the process of the plasma treatment is performed to enable reuse of the mold subjected to the release process.
The imprinting method further includes a process of replacing a die, which has performed the set number of punching or releasing times, of the dies subjected to the releasing process, with a new die.
An imprinting method, comprising: a process of performing plasma treatment to modify the surface of the mold having the pattern formed; a process of transferring the mold to a direction and pressing the pattern of the mold subjected to the plasma treatment on the substrate; a process of transferring the die to a direction to release the die from the substrate to be punched; a process of transferring the mold to another direction and performing plasma treatment to modify the surface of the released mold; a process of transferring the mold to a direction and pressing the pattern of the mold subjected to the plasma treatment on a new substrate; and a process of transferring the mold in one direction to release the mold from the new substrate to be punched, wherein the processes are repeatedly and continuously performed.
An imprinting method, comprising: a process of performing plasma treatment to modify the surface of the mold having the pattern formed; a process of transferring the mold to another direction and punching the pattern of the mold subjected to the plasma treatment on the substrate; a process of transferring the die to a direction to release the die from the substrate to be punched; a process of transferring the mold to another direction and performing plasma treatment on the surface of the released mold; a process of transferring the mold to another direction and punching the pattern of the mold subjected to the plasma treatment on a new substrate; and a process of transferring the mold in one direction to release the mold from the new substrate to be punched, wherein the processes are repeatedly and continuously performed.
An imprint method for stamping two or more substrates with first and second dies having patterns formed thereon, the imprint method comprising performing plasma treatment to modify a surface of the first die and to stamp the first die on a first substrate, performing plasma treatment to modify a surface of the second die, releasing the stamped first die from the first substrate, and simultaneously stamping the plasma-treated second die on a second substrate.
The imprint method is characterized by comprising: a process of performing plasma treatment to modify a surface of the first mold; a step of transferring the first mold in one direction and pressing the first mold pattern subjected to the plasma processing on a first substrate; a process of transferring the first and second molds to a direction and performing plasma treatment to modify the surface of the second mold; a step of transferring the first and second dies in one direction to release the first die from the substrate to be punched, and punching the pattern of the second die, which has been subjected to the plasma processing, on a second substrate; a process of transferring the first and second molds to another direction and performing plasma treatment to modify the surface of the released first mold; and a step of transferring the first and second dies in the other direction to punch the pattern of the first die subjected to the plasma processing on a third substrate and releasing the second die from the punched second substrate, wherein the steps are repeatedly and continuously performed.
The imprinting method is characterized in that the plasma is generated by applying RF to one or more gases including air, argon, oxygen, and nitrogen.
An imprint apparatus, characterized by comprising: a bonding section that can be pressed against a substrate with a pattern of a surface-treated die; a separating part for separating the combined mold and the substrate and combining the mold and the substrate; and a transfer unit that transfers the mold, the transfer unit transferring the mold separated by the separation unit to the joining unit and reusing the mold.
An imprinting method, comprising: a process of pressing the pattern of the surface-treated die onto the substrate; a process of transferring the die to a direction to release the die from the substrate to be punched; a process of transferring the mold to another direction and pressing the pattern of the mold subjected to the surface treatment on a new substrate; and a process of transferring the mold in one direction to release the mold from the new substrate to be punched, wherein the processes are repeatedly and continuously performed.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, the following various effects can be achieved.
First, the mold release properties of the mold are improved.
Second, there is an advantage in that engineering time and cost can be reduced.
Third, there is an advantage in that the mold can be reused.
Drawings
Fig. 1 is a diagram showing an imprint apparatus of embodiment 1 of the present invention;
fig. 2 is a diagram showing an imprint method of embodiment 1 of the present invention;
fig. 3 is a diagram showing an imprint method of embodiment 1 of the present invention;
fig. 4 is a diagram showing an imprint method of embodiment 1 of the present invention;
fig. 5 is a diagram showing an imprint apparatus of embodiment 2 of the present invention; and
fig. 6 is a diagram showing an imprint method of embodiment 2 of the present invention.
Description of the symbols
10-bonding section, 12-pressing section, 14-hardening section, 16-chamber, 20-surface modification section, 22-first surface modification section, 24-second surface modification section, 30-separating section, 32-first separating section, 34-second separating section, 40-transfer section, 50-coating section, 52-spin coating section, 54-drying section, M1-first die, M2-second die, B1-first substrate, B2-second substrate, B3-third substrate, B-substrate, R1, R2-pair of rollers.
Detailed Description
The objects, certain advantages and novel features of the invention will become apparent from the following detailed description and examples when considered in conjunction with the drawings. Note that, in the present specification, when reference numerals are given to components in each drawing, the same components are denoted by the same reference numerals as much as possible in other drawings. The terms first, second, etc. may be used to describe various components, but these components should not be limited to these terms. These terms are used only for the purpose of distinguishing one constituent element from another constituent element. In describing the present invention, when it is determined that a detailed description of the related known art may unnecessarily obscure the gist of the present invention, a detailed description thereof will be omitted.
Embodiments of the present invention will be described below with reference to the drawings.
As illustrated in fig. 1 to 6, the imprint apparatus of the present invention includes a surface modification section 20, a bonding section 10, a separation section 30, and a transfer section 40.
The imprint apparatus and method of the present invention are a technique of modifying the surface of a mold M to improve the releasability between the mold M and a substrate B, and transferring the mold M to and fro so as to reuse the mold M.
The mold M is functionally classified into a Master mold (Master mold) and a replica mold (replica mold), and may be classified into various types according to materials, such as a Si mold, a Ni mold, a Resin mold, and the like.
In the present invention, the mold M may be formed on the PET film, and the mold M may be formed with various patterns or may be made of various materials according to the designer's intention.
The transfer unit 40 functions to transfer the mold M in the forward direction or the reverse direction. In the case where the mold M is formed on the PET film, the transfer unit 40 may be configured to include a pair of rollers R1 and R2, and when the pair of rollers R1 and R2 are rotated from the left to the right (hereinafter, referred to as "forward direction") or from the right to the left (hereinafter, referred to as "reverse direction") in a state where both ends of the PET film are fixed to the pair of rollers R1 and R2, the mold M formed on the PET film is also moved in the forward direction or the reverse direction, that is, the mold M can be transferred back and forth.
At this time, the transfer unit 40 may transfer the mold M separated at the separation unit 30 to the surface modification unit 20 so that the mold M can be reused by performing the plasma treatment.
The transfer unit 40 may be replaced with various mechanisms such as a conveyor belt and a robot arm.
The surface modification unit 20 modifies the surface of the mold M having the pattern formed thereon to improve the mold-release property of the mold M, and functions to perform a plasma treatment on the surface of the mold M under atmospheric pressure, and preferably includes Air (Air), argon (Ar), and oxygen (O)2) Nitrogen (N)2) RF (Radio Frequency) is applied to the gas of any one of the above to form plasma, and the surface of the mold M is modified.
When the plasma treatment is performed, the mold M is melted or bent when the temperature exceeds 80 ℃, and therefore, the plasma treatment is preferably performed at a low temperature of 80 ℃ or lower.
In order to improve the modification effect of the surface of the mold M, it is preferable to apply a plasma matching box (Matcher) between an RF antenna for atmospheric plasma and an RF power supply to match the load impedance and the power supply impedance.
The bonding section 10 includes a pressing section 12 that presses the plasma-treated die M so that the pattern can be transferred to the substrate B.
The separating portion 30 functions to release the mold M from the substrate after the pattern is transferred to the substrate.
Although the coupling portion 10 and the separating portion 30 may be provided separately for coupling and separating the die M and the substrate B, a working portion (not shown) that performs both the pressing and releasing functions may be provided.
For example, if the working unit (not shown) is constituted by a piston rod or a robot arm that can be extended or reduced in length by opening/closing control, the die M presses the substrate by the downward movement of the working unit (not shown) and separates from the substrate by the upward movement.
The working unit (not shown) may be configured to be movable by the transfer unit 40, that is, to perform a pressing process by lowering the die M in an Open (ON) state when the working unit is located in the chamber 16, and to perform a releasing process by returning the die M from a closed (OFF) state to the original position and separating the die M from the substrate B when the working unit is located in the separating unit 30.
On the other hand, the imprint apparatus of the present invention further includes a control unit (not shown).
In order to reuse the mold M, the control section controls the transfer section to replace the existing mold with a new mold. Specifically, the control unit may count the number of times the mold M is coupled to or separated from the substrate, and may replace the mold M with a new mold according to the set number of times. Alternatively, the surface state of the mold M separated by the separating unit 30 may be checked, and the mold M may be replaced with a new mold according to the surface state.
[ example 1]
In the embossing apparatus according to the embodiment of the present invention, as shown in fig. 1, the surface modification unit 20, the coupling unit 10, and the separation unit 30 may be sequentially disposed in the forward direction at a predetermined pitch, and as shown in fig. 2, the coupling unit 10, the surface modification unit 20, and the separation unit 30 may be sequentially disposed in the forward direction of the die M at a predetermined pitch.
As illustrated in fig. 3, the surface modification portion 20 and the separation portion 30 in fig. 1 may be provided in a position that is replaced with each other.
The positions of the surface modification part 20, the joining part 10, and the separation part 30 may be variously modified according to the designer's intention.
On the other hand, the imprint apparatus of the present invention further includes a coating portion 50.
The substrate B is periodically supplied to the bonding part 10 after the coating part 50 is coated, and the coating part 50 coats the upper part of the substrate B with resin, but according to the present invention, there is an advantage that engineering from coating of the substrate B to continuity of pattern transfer can be performed.
The coating section 50 includes a spin coating section 52 and a drying section 54, the spin coating section 52 functioning to rotate the substrate so that the resin is uniformly applied to the substrate B by centrifugal force, and the drying section 54 functioning to dry the resin uniformly applied to the substrate B.
As such, when the resin is uniformly applied to the substrate B and dried, the substrate B is transferred to the bonding part 10.
In addition to the pressed portion 12, the joint portion 10 may include: a chamber 16 maintaining a low vacuum state to prevent inflow of foreign substances; and a curing section 14 for curing the resin on the substrate B.
The imprint method of the present invention is explained below with reference to the drawings.
As illustrated in fig. 1 and 2, the first substrate B1 is rotated in the spin coating section 52 of the coating section 50 so that the resin is uniformly applied to the substrate B by centrifugal force, and the uniformly applied resin is dried in the drying section 54.
In a state where the resin is coated and dried, the first substrate B1 is supplied to the low vacuum chamber 16 of the joint 10.
On the other hand, as the mold M is subjected to the atmospheric plasma treatment by the surface modification section 20, the mold M subjected to the surface modification by the plasma treatment is positioned on the low vacuum chamber 16 as it is transferred in the forward direction, and a pressing process for transferring the pattern of the mold M to the substrate B is performed as the mold M is joined to the substrate B by the operation of the pressing section 12.
The mold M and the substrate B joined in the cavity 16 move in the forward direction again in accordance with the movement of the transfer unit 40, the mold M and the substrate B are positioned in the separation unit 30 in a joined state, and the mold M and the substrate B are separated in the separation unit 30.
Thereafter, the mold M is transferred in the upward-leftward direction (hereinafter, referred to as "reverse direction") to perform the plasma treatment on the surface of the mold M again, the mold M is transferred in the forward direction again to press the pattern of the mold M against the new substrate B, and the mold M is transferred in the forward direction to release the new substrate, which is repeatedly and continuously performed.
On the other hand, an embodiment of the imprint method of the present invention is explained with reference to fig. 3.
As illustrated in fig. 3, the imprinting method of the present invention proceeds as follows: the surface of the mold M having the pattern formed thereon is subjected to plasma treatment, the mold M is moved in the reverse direction to press the M pattern against the substrate B, and then the mold M is moved in the forward direction to release the substrate B.
Thereafter, a process of performing plasma processing is performed to enable reuse of the released process of the mold M.
Specifically, the mold M is transferred in the reverse direction to perform the plasma treatment on the surface of the mold M again, the mold M is transferred in the reverse direction again to press the pattern of the mold M against the new substrate B, and then the mold M is transferred in the forward direction to release the new substrate.
The above processes are repeatedly and continuously performed to shorten the process time and improve the productivity.
Further, the present invention may further include a process of replacing a die, which has performed the set number of punching or releasing times, of the released process dies with a new die. Specifically, to replace the mold, the transfer unit 40 operates to move a new mold adjacent to the existing mold to the position of the existing mold.
On the other hand, fig. 4 is still another embodiment of the imprint method of the present invention. According to the apparatus structure of the above-described embodiment (see fig. 2), such an imprint method differs only in the order of operation, and therefore the description of the above-described embodiment is substituted.
[ example 2]
Hereinafter, in the description of embodiment 2, the description of the same structure as embodiment 1 will be omitted for convenience.
As shown in fig. 5, in the imprint apparatus according to another embodiment of the present invention, the die M includes a first die M1 and a second die M2 provided on the transfer unit 40 at a predetermined interval, the surface modification unit 20 includes a first surface modification unit 22 and a second surface modification unit 24 provided at a predetermined interval with respect to the bonding unit 10, and the separation unit 30 includes a first separation unit 32 and a second separation unit 34 provided at a predetermined interval with respect to the bonding unit 10 and the surface modification unit 20. The transfer unit 40 transfers the first or second mold M1 or M2 separated by one of the first and second separating units 32 and 34 to one of the first and second surface modification units 22 and 24.
Specifically, the second separating portion 34, the second surface-modified portion 24, the joining portion 10, the first surface-modified portion 22, and the first separating portion 32 are fixedly provided in the left-to-right direction (hereinafter referred to as the "positive direction").
The transfer unit 40 reciprocates in the forward direction or the reverse direction on the fixed line, and the first mold M1 and the second mold M2 are provided in the transfer unit 40.
The first and second molds M1 and M2 are surface-modified at the first and second surface-modified parts 22 and 24, and are separated from the substrate B at the first and second separating parts 32 and 34, respectively, after the bonding part 10 is bonded to the substrate B, which is periodically supplied to the bonding part 10 after the coating part 50 is coated.
Another embodiment of the imprint method of the present invention will be described below with reference to fig. 5 and 6 of the drawings.
Another embodiment of the present invention is an imprinting method for stamping two or more substrates using first and second dies M1 and M2 having patterns formed thereon, wherein the process of stamping and the process of releasing the first and second dies M1 and M2, respectively, are simultaneously performed. This can improve productivity.
That is, after the surface of the first mold M1 is modified by plasma treatment and the first substrate B1 is pressed, and the surface of the second mold M2 is modified by plasma treatment, the pressed first mold M1 is released from the first substrate B1, and the second mold M2 subjected to plasma treatment is pressed against the second substrate B2.
The imprint method using the imprint apparatus of fig. 5 will be specifically described in terms of a procedure.
The first substrate B1 is rotated at the spin coating section 52 of the coating section 50 so that the resin is uniformly coated on the substrate B by centrifugal force, and the uniformly coated resin is dried at the drying section 54.
In a state where the resin is coated and dried, the first substrate B1 is supplied to the low vacuum chamber 16 of the joint 10.
On the other hand, as the first mold M1 performs the atmospheric plasma treatment on the first mold M1 by the second surface modification unit 24, the first mold M1, which has been surface-modified by the plasma treatment, is positioned on the low vacuum chamber 16 as it is transferred in the forward direction, and a pressing process is performed in which the pattern of the first mold M1 is transferred to the first substrate B1 as the first mold M1 and the first substrate B1 are joined by the operation of the pressing unit 12.
At this time, the second mold M2, which is provided on the same PET film with a predetermined interval from the first mold M1, is positioned on the second separating part 34, and the second separating part 34 is not separately operated, but is maintained in a waiting state.
The first mold M1 and the first substrate B1 coupled to each other in the chamber 16 move in the forward direction again in accordance with the movement of the transfer unit 40.
If the first mold M1 and the first substrate B1 move to the first surface modification part 22 in a state of being bonded, the second mold M2 will be located at the second surface modification part 24.
At this time, the first surface modification unit 22 is not separately operated, and only the second surface modification unit 24 is operated to perform the plasma treatment on the surface of the second mold M2 to modify the surface.
When the surface of the second mold M2 is modified, the transfer unit 40 operates again to transfer the second mold M2, the first mold M1 and the first substrate B1 in a coupled state, the first mold M1 and the first substrate B1 are positioned in the first separating unit 32 in a coupled state, and the second mold M2 is transferred to the coupling unit 10.
Thereafter, the first mold M1 is separated from the first substrate B1 at the first separation part 32.
While the separation process of the first mold M1 from the first substrate B1 is performed, the second mold M2 is combined with the second substrate B2 waiting inside the chamber 16 while the coating process is performed at the coating part 50, so that the pattern of the second mold M2 is transferred to the second substrate B2.
After the separation of the first mold M1 from the first substrate B1 and the coupling of the second mold M2 to the second substrate B2 are completed, the transfer unit 40 transfers the first mold M1, the coupled second mold M2 and the coupled second substrate B2 in the reverse direction, the first mold M1 is positioned in the first surface modification unit 22, and the second mold M2 and the coupled second substrate B2 are positioned in the second surface modification unit 24.
At this time, the first surface-modified portion 22 is in the ON state, and the surface of the first mold M1 is subjected to plasma treatment. During this process, the second surface-modified portion 24 is in an OFF (OFF) state and does not separately operate.
When the plasma processing of the surface of the first mold M1 is completed, the transfer unit 40 is again moved in the reverse direction, and the first mold M1 is positioned inside the chamber 16 of the bonding unit 10, and the second mold M2 and the second substrate B2 are positioned in the second separating unit 34.
Thereafter, the first mold M1 is coupled to the third substrate B3 waiting inside the chamber 16, and the coupled state of the second mold M2 to the second substrate B2 is released at the second separating portion 34.
On the other hand, the imprint apparatus of still another embodiment of the present invention is technically characterized in that, although a physical means such as plasma treatment is utilized for improving the mold release property, a mold surface-treated by a chemical means such as coating layer formation is utilized.
The imprint apparatus described in detail above includes: a bonding section that bonds the mold and the substrate so that a pattern of the mold, which has been surface-treated by physical or chemical means, can be pressed against the substrate; a separating part for separating the combined mold and substrate; and a transfer section that transfers the mold. The transfer unit is configured to transfer the mold separated by the separation unit to the joining unit and reuse the mold.
An imprint method using such an imprint apparatus includes: a process of pressing a pattern of a mold, which is surface-treated by a physical or chemical means, onto a substrate; a process of moving the die in one direction to release the die from the substrate to be punched; a process of transferring the mold to the other direction and pressing the pattern of the mold subjected to the surface treatment on a new substrate; and a process of moving the mold in a direction to release the mold from the new substrate that is punched. In addition, such respective processes are repeatedly and continuously performed.
Although the above description has been focused on the embodiments of the present invention, the number, arrangement, and the like of the components such as the surface modification portion, the coupling portion, and the separation portion may be variously modified based on the embodiments of the present invention, and it is obvious that such modifications also fall within the scope of the claims of the present invention.

Claims (21)

1. An imprint apparatus, characterized by comprising:
a surface modification unit that performs plasma treatment on the surface of the mold on which the pattern is formed;
a bonding section that bonds the die and the substrate so that the pattern of the die subjected to the plasma treatment can be pressed against the substrate;
a separating part which separates the bonded mold and the substrate; and
a transfer section for transferring the mold,
the transfer unit transfers the mold separated by the separation unit to the surface modification unit so that the mold can be reused by performing plasma treatment on the mold.
2. The embossing apparatus of claim 1,
the plasma is generated by applying RF to one or more gases including air, argon, oxygen, and nitrogen.
3. The embossing apparatus of claim 1,
and a control part for counting the combination or separation times of the mold and the substrate and controlling the transfer part to replace the mold with a new one according to the set times.
4. The embossing apparatus of claim 1,
the mold processing apparatus further includes a control unit for checking a surface state of the mold separated by the separation unit and controlling the transfer unit to replace the mold with a new one based on the surface state.
5. The embossing apparatus of claim 1,
the surface modification portion, the coupling portion, and the separation portion are arranged in order along a transfer direction of the die at a predetermined interval from each other.
6. The embossing apparatus of claim 1,
the joining portion, the surface modification portion, and the separation portion are arranged in order along the transfer direction of the die at a predetermined interval.
7. The embossing apparatus of claim 1,
the die includes a first die and a second die disposed on the transfer portion at a predetermined interval,
the surface-modified portion includes a first surface-modified portion and a second surface-modified portion provided at a predetermined interval with respect to the bonding portion,
the separation part includes a first separation part and a second separation part provided at a predetermined interval with the bonding part and the surface-modified part interposed therebetween,
the transfer section transfers the first or second mold separated by any one of the first and second separation sections to any one of the first and second surface modification sections.
8. The embossing apparatus of claim 1,
also includes a coating portion which coats an upper portion of the substrate with a resin.
9. The embossing apparatus of claim 8,
the coating portion includes:
a spin coating section that coats a liquid resin on the upper portion of the substrate; and
a drying section that dries the resin.
10. The embossing apparatus of claim 1,
the joint portion includes:
a chamber maintaining a low vacuum state to be able to prevent inflow of foreign substances; and
a curing section that cures the resin on the substrate.
11. The embossing apparatus of claim 1,
the transfer unit includes:
a PET film;
a first roll for winding the PET film with one end thereof bonded thereto; and
a second roller which is wound with the other end of the PET film bonded thereto and is disposed at a predetermined interval from the first roller,
the mold is formed on the PET film.
12. An imprint apparatus, characterized by comprising:
a surface modification unit that performs plasma treatment on the surface of the mold on which the pattern is formed;
a working unit that punches the die against the substrate so that the pattern of the die subjected to the plasma treatment can be punched against the substrate, and releases the die from the substrate; and
a transfer section for transferring the mold,
the transfer portion transfers the mold released at the working portion to the surface modification portion so that the mold can be reused by performing plasma treatment.
13. An imprinting method, comprising:
a process of performing plasma treatment to modify the surface of the mold having the pattern formed;
a process of punching the pattern of the mold subjected to the plasma treatment on a substrate; and
releasing the die from the substrate being stamped,
performing a process of the plasma treatment to enable reuse of the mode of the released process.
14. The imprint method according to claim 13,
further, the method comprises a process of replacing the die which is subjected to the releasing process and performs the set punching or releasing times with a new die.
15. An imprinting method, comprising:
a process of performing plasma treatment to modify the surface of the mold having the pattern formed;
a process of transferring the mold to a direction and pressing the pattern of the mold subjected to the plasma treatment on the substrate;
a process of transferring the die to a direction to release the die from the substrate to be punched;
a process of transferring the mold to another direction and performing plasma treatment to modify the surface of the released mold;
a process of transferring the mold to a direction and pressing the pattern of the mold subjected to the plasma treatment on a new substrate; and
a process of transferring the mold in a direction to release the mold from the new substrate which is punched,
the respective processes are repeatedly and continuously performed.
16. An imprinting method, comprising:
a process of performing plasma treatment to modify the surface of the mold having the pattern formed;
a process of transferring the mold to another direction and punching the pattern of the mold subjected to the plasma treatment on the substrate;
a process of transferring the die to a direction to release the die from the substrate to be punched;
a process of transferring the mold to another direction and performing plasma treatment on the surface of the released mold;
a process of transferring the mold to another direction and punching the pattern of the mold subjected to the plasma treatment on a new substrate; and
a process of transferring the mold in a direction to release the mold from the new substrate which is punched,
the respective processes are repeatedly and continuously performed.
17. An imprint method of stamping two or more substrates with first and second dies having patterns formed thereon, the imprint method characterized in that,
and a second substrate pressing step of performing plasma treatment to modify a surface of the first mold to press the first mold against a first substrate, and performing plasma treatment to modify a surface of the second mold, and then releasing the pressed first mold from the first substrate and pressing the plasma-treated second mold against a second substrate.
18. The imprinting method of claim 17, comprising:
a process of performing plasma treatment to modify a surface of the first mold;
a step of transferring the first mold in one direction and pressing the first mold pattern subjected to the plasma processing on a first substrate;
a process of transferring the first and second molds to a direction and performing plasma treatment to modify the surface of the second mold;
a step of transferring the first and second dies in one direction to release the first die from the substrate to be punched, and punching the pattern of the second die, which has been subjected to the plasma processing, on a second substrate;
a process of transferring the first and second molds to another direction and performing plasma treatment to modify the surface of the released first mold; and
and a step of transferring the first and second dies in the other direction to punch the pattern of the first die subjected to the plasma processing on a third substrate and releasing the second die from the punched second substrate, wherein the steps are repeatedly and continuously performed.
19. The imprint method according to any one of claims 13 to 18,
the plasma is generated by applying RF to one or more gases including air, argon, oxygen, and nitrogen.
20. An imprint apparatus, characterized by comprising:
a bonding section that bonds the die and the substrate so that a pattern of the die having a surface treatment can be pressed against the substrate;
a separating part which separates the bonded mold and the substrate; and
a transfer section for transferring the mold,
the transfer unit transfers the mold separated by the separation unit to the joining unit and reuses the mold.
21. An imprinting method, comprising:
a process of pressing the pattern of the surface-treated die onto the substrate;
a process of transferring the die to a direction to release the die from the substrate to be punched;
a process of transferring the mold to another direction and pressing the pattern of the mold subjected to the surface treatment on a new substrate; and
a process of transferring the mold in a direction to release the mold from the new substrate which is punched,
the respective processes are repeatedly and continuously performed.
CN201680068257.8A 2015-12-08 2016-12-08 Imprint apparatus and method Active CN108292592B (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
KR20150174416 2015-12-08
KR10-2015-0174416 2015-12-08
KR10-2015-0174408 2015-12-08
KR20150174408 2015-12-08
KR1020160166099A KR20170067665A (en) 2015-12-08 2016-12-07 Apparatus and method for imprinting
KR10-2016-0166099 2016-12-07
PCT/KR2016/014375 WO2017099492A1 (en) 2015-12-08 2016-12-08 Imprint device and method

Publications (2)

Publication Number Publication Date
CN108292592A CN108292592A (en) 2018-07-17
CN108292592B true CN108292592B (en) 2022-04-01

Family

ID=59012750

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680068257.8A Active CN108292592B (en) 2015-12-08 2016-12-08 Imprint apparatus and method

Country Status (2)

Country Link
CN (1) CN108292592B (en)
WO (1) WO2017099492A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4057066A1 (en) * 2021-03-11 2022-09-14 Obducat AB Apparatus and method for surface treatment of an imprint stamp

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004148494A (en) * 2002-10-24 2004-05-27 Hewlett-Packard Development Co Lp Hardening nano-imprinting stamp
JP2008179034A (en) * 2007-01-24 2008-08-07 Toppan Printing Co Ltd Imprint mold, imprint mold manufacturing method, and surface reforming device
JP2011146447A (en) * 2010-01-12 2011-07-28 Canon Inc Imprint apparatus and article manufacturing method
KR20140081975A (en) * 2012-12-21 2014-07-02 (주) 에이와케이 Apparatus for manufacturing film used micro size pattern and method using the same
CN104094379A (en) * 2012-02-07 2014-10-08 佳能株式会社 Imprint apparatus and method of manufacturing article

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5633744B2 (en) * 2009-02-03 2014-12-03 コニカミノルタ株式会社 Substrate preparation method, nanoimprint lithography method and mold replication method
JP2010184485A (en) * 2009-02-13 2010-08-26 Seiko Epson Corp Mold for imprint, method for manufacturing mold for imprint, and method for reproducing mold for imprint
JP6315904B2 (en) * 2013-06-28 2018-04-25 キヤノン株式会社 Imprint method, imprint apparatus, and device manufacturing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004148494A (en) * 2002-10-24 2004-05-27 Hewlett-Packard Development Co Lp Hardening nano-imprinting stamp
JP2008179034A (en) * 2007-01-24 2008-08-07 Toppan Printing Co Ltd Imprint mold, imprint mold manufacturing method, and surface reforming device
JP2011146447A (en) * 2010-01-12 2011-07-28 Canon Inc Imprint apparatus and article manufacturing method
CN104094379A (en) * 2012-02-07 2014-10-08 佳能株式会社 Imprint apparatus and method of manufacturing article
KR20140081975A (en) * 2012-12-21 2014-07-02 (주) 에이와케이 Apparatus for manufacturing film used micro size pattern and method using the same

Also Published As

Publication number Publication date
WO2017099492A1 (en) 2017-06-15
CN108292592A (en) 2018-07-17

Similar Documents

Publication Publication Date Title
KR100674157B1 (en) Nanoimprint lithograph for fabricating nanoadhesive
CN106142528B (en) Method for stamping and imprinting apparatus
CN105936124B (en) Imprinting apparatus
CN107305261B (en) Imprint apparatus and imprint method
KR102025904B1 (en) Mounting and Demolding Devices
KR101714737B1 (en) Selective transferring method and apparatus using bump type stamp
JP2006289952A (en) Imprint apparatus, system, and method
US8795775B2 (en) Nanoimprint method
US20100072661A1 (en) Method of manufacturing mold for nano imprint and pattern forming method using the mold for nano imprint
CN108292592B (en) Imprint apparatus and method
CN109188863A (en) The method of film pattern
CN106773531B (en) Impression roller in nano impression device and nano impression device
KR100931603B1 (en) Imprint process system and pattern formation method
KR20170067665A (en) Apparatus and method for imprinting
KR100912598B1 (en) Stamp for Nano Imprinting Having Dummmy Nano Patterns, and Method of Nano Imprinting Using the Same
TW201334948A (en) Imprinting apparatus and imprinting method
CN208543927U (en) The manufacturing system of holographic laser composite transferring film
KR101240319B1 (en) Roll imprint method and apparatus with dual stamp
KR100236617B1 (en) Manufacturing method of hologram film using ultraviolet hardening paints
TWM563352U (en) Apparatus for imprinting
KR101413153B1 (en) Fabrication apparatus for micro-scale surface wrinkles and method for fabricating micro-scale surface wrinkles using the same
KR20120067448A (en) Method for treating surface of mold by using plasma
TWI375115B (en)
KR101957493B1 (en) Equipment for fabricating micro-pattern of high aspect ratio and control method thereof
Lee et al. High-throughput step-and-repeat UV-nanoimprint lithography

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant