CN108161250A - Multifocal DYNAMIC DISTRIBUTION laser machines the method and device of brittle transparent material - Google Patents
Multifocal DYNAMIC DISTRIBUTION laser machines the method and device of brittle transparent material Download PDFInfo
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- CN108161250A CN108161250A CN201810088414.2A CN201810088414A CN108161250A CN 108161250 A CN108161250 A CN 108161250A CN 201810088414 A CN201810088414 A CN 201810088414A CN 108161250 A CN108161250 A CN 108161250A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to the method and devices of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, Laser Output Beam, beam expanding lens continuously adjusts the diameter and dispersion angle of light beam, light beam is reflexed to laser beam apparatus for shaping for the first time by the first reflector element, energy is carried out beam shaping to light beam by apparatus for shaping in the laser beam of Gaussian Profile for the first time, beam energy after shaping is distributed in one or more annular regions, light beam is carried out shaping again by light beam secondary reshaping device, to Laser beam energy distribution and big minor adjustment, dynamic control focus distribution range, light beam is incident to focus lamp by the second reflector element, light beam is focused on, light beam forms the multifocal being distributed in limited range, focus distribution range, which includes, is processed object；X Y-axis motion platforms carry and are processed object, moved relative to focus lamp.Extension technology based on the stress induced cutting technique of laser realizes the processing of brittle transparent material by the focus quantity increased along optical axis direction.
Description
Technical field
The present invention relates to multifocal dynamics in the laser processing of brittle transparent material more particularly to a kind of limited range
The method and its device of distribution Laser Processing brittle transparent material, belong to technical field of laser processing.
Background technology
At present, for the laser processing technology of brittle transparent material, material is mainly realized using laser ablation, gasification
Removal, so as to fulfill the processing methods such as cut and drill.Laser ablation is characterized in that, laser focus on material surface (on
Surface or lower surface), by the movement of focal depth range in one's power or above and below focus, inside and outside itself, reach and successively remove material
Purpose, most the material of required figure is separated from substrate at last.This technology is very universal, can pass through galvanometer or movement
The mode of focus lamp realizes that shortcoming is：First, the inefficiency of material is removed, it is such as blue especially for high hardness material
Jewel, quartz etc.；Second, edge of materials there are heat affected area, accumulate to be formed in both sides of edges by the material for being usually expressed as melting
Protrusion；Third, cutting rear wall can not accomplish that vertically angle of inclination is certain for being subsequently equipped with usually at 70~80 degree
It influences；4th, material bending strength is relatively low after cutting, and edge chipping is big.
Processing for straight cuts and part outline border can also be realized using the mode of stress induced cutting,
It is characterized in, laser focuses on material internal, forms burst region in inside, forms the channeling direction of material fracture.Stealth cutting
Damage field will not be formed, therefore material will not be separated really on surface, but needed subsequently through mechanical system, it is such as curved
The actions such as folding, splitting are kept completely separate it.Its feature is：First, material surface is not destroyed, therefore do not have in edge of materials
Double teeming is accumulated；Second, the verticality of side wall is high, can reach 85 ° or more；Its shortcoming is：First, it can not realize for closing
Figure processing, such as drill.Second, for the thicker material of thickness, processing efficiency is relatively low.
It is cut both ways with upper type, each mode all cannot cover and meet well most of processing request.
Invention content
The purpose of the present invention is overcoming the shortcomings of the prior art, multifocal DYNAMIC DISTRIBUTION in a kind of limited range is provided
Laser machine the method and its device of brittle transparent material.
The purpose of the present invention is achieved through the following technical solutions：
Multifocal DYNAMIC DISTRIBUTION laser machines the device of brittle transparent material, and feature is provided with according to optical path direction：
Laser, output beam；
Beam expanding lens continuously adjusts the diameter from Laser Output Beam and dispersion angle；
The light beam that beam expanding lens is emitted is reflexed to laser beam apparatus for shaping for the first time by the first reflector element；
Energy is carried out beam shaping, the light beam after shaping by light beam apparatus for shaping for the first time in the laser beam of Gaussian Profile
Energy distribution is in an annular or multiple annular regions；
Laser beam after shaping for the first time is carried out shaping again, to laser beam energy by light beam secondary reshaping device
Distribution and big minor adjustment, dynamic control focus distribution range；
Laser beam after secondary reshaping is incident to focus lamp by the second reflector element；
The light beam that second reflector element reflects is focused by focus lamp, and laser beam forms what is be distributed in limited range
Multifocal, focus distribution range, which includes, is processed object；
X-Y axis motion platforms carry and are processed object, moved relative to focus lamp.
Further, the device of above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, the laser
Device is pulse width less than 100 nanoseconds, the pulse laser of 343~2000 nanometers of the optional range of wavelength.
Further, the device of above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, the laser
Device is 7~15 picoseconds of pulse duration range, the pulse laser of wavelength 1030nm or 1064nm.
Further, the device of above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, it is described to expand
Mirror is the beam expanding lens with adjustable multiplying power and the change angle of divergence.
Further, the device of above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, described first
Reflector element includes the first speculum and the second speculum arranged according to optical path direction.
Further, the device of above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, the light beam
Apparatus for shaping is spatial light modulator, deformable mirror or diffraction optical lens for the first time.
Further, the device of above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, the light beam
Secondary reshaping device is adjustable diaphragm.
Further, the device of above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, described second
Reflector element includes the third speculum and the 4th speculum being sequentially arranged according to optical path direction.
Further, the device of above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, the focusing
Mirror is installed on Z axis elevating movement unit.
Further, the device of above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, also comprising control
System processed and light beam secondary reshaping device control units, control system are transported with light beam secondary reshaping device control units and X-Y axis
Moving platform control connection, light beam secondary reshaping device control units are connected with the control of light beam secondary reshaping device.
The method of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material of the present invention, laser pool after beam shaping
Multiple focuses being distributed along optical axis direction, and the range that multiple focuses are covered is continuously adjusted in 20~3000 micron ranges,
Adjusting focus makes the coverage area of focus be more than the thickness for being processed object.
Further, the method for above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, it adjusts burnt
Point range makes the coverage area of focus be more than the thickness for being processed object, in processed object upper and lower surface and inside or in quilt
Small point of burst is formed inside processing object, object to be processed is formed relative to focussing movement through processed object upper and lower surface
Surface of rupture, using surface of rupture as be oriented to realize material separation.
Further, the method for above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, with explosion
Face is to be directed through to apply the separation that mechanical external force realizes material.
Further, the method for above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, for song
Line and closed figure realize the separation of material by the method that chemical agent corrodes.
Further, the method for above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, by laser
Device exports pulse laser, and beam expanding lens continuously adjusts the diameter and dispersion angle of light beam；It will be emitted by the first reflector element
Light beam reflex to laser beam apparatus for shaping for the first time, light beam for the first time apparatus for shaping by energy in Gaussian Profile laser beam into
Row beam shaping, the beam energy after shaping are distributed in an annular or multiple annular regions；Light beam secondary reshaping device will
The laser beam after shaping carries out shaping again for the first time, to Laser beam energy distribution and big minor adjustment, dynamic control focus
Distribution forms the laser beam with energy and distribution shape；By the second reflector element, by laser light after secondary reshaping
Beam is incident to focus lamp, and the light beam that the second reflector element reflects is focused by focus lamp, and laser beam is formed in limited range
The multifocal of distribution, focus distribution range, which includes, is processed object；The carrying of X-Y axis motion platform is processed object, relative to poly-
Burnt mirror movement；So as to the section being made of on the surface of processed object and internal formation point of burst, i.e. surface of rupture.
Further, the method for above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, surface of rupture
Height when being more than the thickness for being processed object, be processed the upper and lower surface of object and internal generate point of burst.
Further, the method for above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, light beam two
Secondary apparatus for shaping adjusts the limited range of multifocal distribution, and the height of surface of rupture is less than the thickness for being processed object, passes through adjusting
Focus lamp forms surface of rupture to proper height, being processed inside subject material, and material upper and lower surface is not damaged.
Further, the method for above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, the light
Beam secondary reshaping device is adjustable diaphragm, passes through the control for blocking progress Laser beam energy distribution and size to laser beam
System.
Further, the method for above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, it is described can
Diaphragm is adjusted using the structure of Electronic control pore size or suitching type structure, diaphragm is soft-sided light in suitching type structure
Door screen.
Further, the method for above-mentioned multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, wherein, control system
System sends out control instruction and gives light beam secondary reshaping device control units, and light beam secondary reshaping device control units is driving device,
Motor in light beam secondary reshaping device is driven by light beam secondary reshaping device control units, is realized to light beam secondary reshaping device
The folding of diaphragm or switching action.
The present invention has significant advantages and beneficial effects compared with prior art, embodies in the following areas：
1. the present invention realizes laser scribing and cutting using the method for multifocal distribution Laser Processing in wired range, it is based on
The extension technology of the stress induced cutting technique of laser realizes brittle transparent material by the focus quantity increased along optical axis direction
Processing；Auxiliary realizes the complete parttion of material in a manner of mechanical external force sliver or chemical attack simultaneously；It can be backward compatible
The stress induced cutting method of laser and some drawbacks for improving the stress induced processing of laser；
2. focus is distributed in limited range, the range of distribution can be more than the thickness of machined material, so as to make processing time
Number can be at least reduced to once, and compared to the multiple round-trip cutting used in the stress induced cutting method of laser, cutting efficiency is shown
It writes and is promoted；
3. adjacent focal spots tight distribution, section roughness significantly improves；Relative to the method for ablated surface, can make
Verticality of side wall is more than 89 °, and near vertical, sidewall roughness is greatly improved；
4. on the basis of Laser Processing, the method for being aided with mechanical system or chemical attack carries out material separation, so as to
Realize the cutting separation of arbitrary graphic material, lacking for the closed figures such as drilling processing can not be realized by solving the stress induced cutting of laser
It falls into；The processing request of most of 2-d plane graph is realized and met, includes the various irregularly-shaped holes of processing.
Description of the drawings
Fig. 1：The light channel structure schematic diagram of the present invention；
Fig. 2 a：Laser beam energy is shaped as the schematic diagram of single circular distribution by Gaussian Profile；
Fig. 2 b：Laser beam energy is shaped as the schematic diagram of two circular distributions by Gaussian Profile；
Fig. 3：Laser multifocal distribution schematic diagram is realized in limited range；
Fig. 4：The schematic diagram of laser multifocal distribution dynamic regulation is realized in limited range；
Fig. 5：Material upper and lower surface and the internal schematic diagram for forming point of burst section process；
Fig. 6：In the photo schematic diagram for the point of burst that material surface is formed；
Fig. 7：The photo schematic diagram of laser multifocal distribution is realized in material internal.
Specific embodiment
For a clearer understanding of the technical characteristics, objects and effects of the present invention, specific implementation is now described in detail
Scheme.
The present invention is based on the stress induced stress induced cutting technique of cutting technique laser of laser, the stress induced technology of laser is
Laser focuses on material internal, forms burst region in inside, forms the channeling direction of material fracture.Specifically content is：Swash
Light is usually accumulated into a dot, these points are distributed in the inside of material, when laser power density is more than on focal position
During the damage threshold of material, point of burst will be formed in material internal.Each point of burst is formed by single laser pulse, with being added
Work material can form line of different shapes distribution relative to the displacement of laser spot, and monolayer distribution may be used in line distribution,
The mobile realization Multi-layers distributing above and below focus can also be utilized.Its shortcoming is that point of burst is larger, while layer and lamellar spacing are larger,
It cannot closely arrange, so as to influence the roughness in section.
The Sapphire Substrate of 150um is less than for the material of thinner thickness, such as thickness, individual layer lineal layout shape may be used
Into crackle guide line, it is allowed to be broken under the effect of external force.For thicker material, need repeatedly to cut and with focal position
Move up and down, so as to form the distribution in vertical direction, then apply certain external force and be allowed to be broken.If the number of plies of distribution is not
Foot can be generated when applying external force not along the crackle of cutting track, i.e., random crackle leads to the damage of cutting object.In this technology
On, in order to promote the processing efficiency of the larger material of thickness, using the method for beam splitter, laser can be focused into 2 simultaneously
Or multiple focuses, and direction of these focuses along beam propagation, i.e., it is discontinuously arranged perpendicular to the direction of material incidence surface,
So as to once form multiple incised layers, reach reduction cutting times, reduce the purpose of process time.The quantity of focus by
The limitation quantity of beam splitter eyeglass and laser energy cannot be too many, generally less than 15, and multiple focuses are covered
Range cannot adjust in real time.
On the basis of the above, the present invention is designed optimization for the quantity and distribution that form focus so that burnt
The quantity of point and the distribution of focus are all greatly improved, and realize that the dynamic of multifocal coverage area is adjustable.
Therefore the top/bottom latitude of multifocal covering according to the difference of processed object thickness, can be controlled, is more than this range and is added
The thickness of work object, the upper and lower surface and inside for making machined material are destroyed by laser, are formed and be made of point of burst simultaneously
Section.The character of whole cross section is changed by laser so that the physical strength of section position declines, and makes point of burst
Place section chemical property is different from without machining area.Material is broken by applying mechanical external force to section where point of burst
Separation makes material fracture separation to the method for implementation chemical solvent corrosion in section where point of burst.The chemical solvent of auxiliary
The method of corrosion can realize processing close-shaped on two dimensional surface, the processing of particularly variously-shaped hole.
As shown in Figure 1, the device of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material, is provided with according to optical path direction：
Laser 1, output beam；Laser 1 is less than 100 nanoseconds, the optional range 343~2000 of wavelength using pulse width
The pulse laser of the pulse laser, preferably 7~15 picoseconds of pulse duration range, wavelength 1030nm or 1064nm of nanometer；
Beam expanding lens 4 continuously adjusts the diameter from 1 output beam of laser and dispersion angle；Beam expanding lens 4 is using tool
There is adjustable multiplying power and change the beam expanding lens of the angle of divergence；
Comprising the first speculum 5 and the second speculum 6 arranged according to optical path direction, beam expanding lens 4 is gone out for first reflector element
The light beam penetrated reflexes to laser beam apparatus for shaping 7 for the first time；
Energy is carried out beam shaping, the light beam after shaping by light beam apparatus for shaping 7 for the first time in the laser beam of Gaussian Profile
Energy distribution is in an annular or multiple annular regions；Apparatus for shaping 7 is spatial light modulator, deformable reflection to light beam for the first time
Mirror or diffraction optical lens；
Laser beam after shaping for the first time is carried out shaping again, to laser beam energy by light beam secondary reshaping device 8
Distribution and big minor adjustment, dynamic control focus distribution range；Light beam secondary reshaping device 8 uses adjustable diaphragm；
Second reflector element, will be secondary comprising 9 and the 4th speculum 10 of third speculum being sequentially arranged according to optical path direction
Laser beam is incident to focus lamp 11 after shaping；
Focus lamp 11, focus lamp 11 are installed on Z axis elevating movement unit 3, by the second reflector element reflection light beam into
Line focusing, laser beam form the multifocal being distributed in limited range, and focus distribution range, which includes, is processed object；
X-Y axis motion platform 2 carries and is processed object, moved relative to focus lamp 11.
In addition, control system 100 and light beam secondary reshaping device control units 200 and X-Y axis motion platform 2 and Z axis
The control connection of elevating movement unit 3, light beam secondary reshaping device control units 200 are connected with the control of light beam secondary reshaping device 8.
Control system 100 controls X-Y axis motion platform 2 to link, and realizes the processing of X-Y scheme.Z axis is controlled by control system 100
Elevating movement unit 3 realizes moving up and down for focus.
Light beam secondary reshaping device 8 adjusts the limited range of multifocal distribution, and the height of surface of rupture, which is less than, is processed object
Thickness, by adjusting focus lamp to proper height, surface of rupture is formed being processed inside subject material, and material upper and lower surface
It is not damaged.Light beam secondary reshaping device 8 is adjustable diaphragm, by blocking carry out Laser beam energy distribution to laser beam
With the control of size.Adjustable diaphragm uses the structure of Electronic control pore size or suitching type structure, suitching type structure
Middle diaphragm is soft aperture slot.
Control instruction is sent out to light beam secondary reshaping device control units 200, light beam secondary reshaping dress by control system 100
Control unit 200 is put as driving device, is driven in light beam secondary reshaping device 8 by light beam secondary reshaping device control units 200
Motor realizes folding or the switching action of diaphragm to light beam secondary reshaping device 8.
The method of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material of the present invention, laser pool after beam shaping
Multiple focuses being distributed along optical axis direction, and the range that multiple focuses are covered is continuously adjusted in 20~3000 micron ranges,
Adjusting focus makes the coverage area of focus be more than the thickness for being processed object.In processed object upper and lower surface and inside or
Person forms small point of burst inside processed object, and object to be processed is formed relative to focussing movement on processed object
The surface of rupture of lower surface, using surface of rupture as the separation for being oriented to realization material.
During concrete application, the laser that laser 1 is emitted is pulse laser, and pulse width was less than for 100 nanoseconds.Wavelength can
Select 343~2000 nanometers of range.It is preferable to use ranging from 7~15 picoseconds of laser pulse width, wavelength be 1030nm or 1064nm.Add
Work object has certain transmitance for used optical maser wavelength.
The laser beam that laser 1 is emitted enters beam expanding lens 4, and beam expanding lens has the function of adjustable multiplying power and the angle of divergence, right
The diameter and dispersion angle of outgoing beam are continuously adjusted.
For laser beam by the first speculum 5 after beam expanding lens 4, the second speculum 6 is reflected into light beam shaping for the first time dress
7 are put, energy is carried out beam shaping, the beam energy after shaping to light beam by apparatus for shaping 7 in the laser beam of Gaussian Profile for the first time
It is distributed in an annular or multiple annular regions, the laser beam Transverse mode used is TEM00, therefore before non-shaping
Energy distribution is in Gaussian Profile.Fig. 2 a are the schematic diagrames that laser beam energy is shaped as single circular distribution by Gaussian Profile,
Fig. 2 b are the schematic diagrames that laser beam energy is shaped as two circular distributions by Gaussian Profile.And so on, by Gaussian Profile
It can be shaped as the distribution of multiple annular shapes.
The mode of beam shaping can be geometry diaphragm, and an annular or multiple rings are formed usually using annular slot
Shape region.Spatial light modulator (Spatial Light Modulation, SLM) or deformable mirror can also be used
(Deformable Mirror, DM) changes the distribution mode of laser energy using the mode for changing laser beam phase, is formed
One annular or multiple annular regions.Diffraction optical lens (DOE) can also be used to change laser phase and form an annular
Or multiple annular regions.Spatial light modulator (SLM) and deformable mirror (DM) can flexibly change beam phase distribution,
Various energy profiles are ultimately formed, but higher laser power density cannot be born.Diffraction optical lens (DOE) relative to
Spatial light modulator (SLM) and deformable mirror (DM) with fixed formation single energy distribution, do not have disposable property
Matter, but higher laser power density can be born.Therefore it is preferable to use diffraction optical lens (DOE) to realize the whole of light beam
Shape.
Laser enters light beam secondary reshaping device 8, light beam secondary reshaping device 8 after the light beam outgoing of apparatus for shaping 7 for the first time
It is controlled by light beam secondary reshaping device control units 200, it is real to carrying out shaping again by the laser beam after shaping for the first time
Now to the adjusting of Laser beam energy distribution and its size, and has the characteristics of electronic continuously adjustable.Light beam secondary reshaping
The principle of device 8 is the energy size and distribution of annular spread after controlling through shaping for the first time, so as to fulfill dynamically controlling
The control of focus distribution range processed.Fig. 3 is beam energy through light beam 8 shaping of apparatus for shaping 7 and light beam secondary reshaping device for the first time
Afterwards, focus distribution schematic diagram in limited range is formed.The light beam of laser emitting passes through light beam apparatus for shaping 7 and light beam for the first time
Laser beam L1, light beam L1 line focuses Jing11Hui with certain energy and distribution shape are formed after secondary reshaping device 8
Multifocal distribution is formed after poly- in limited range FL.
Light beam is directly proportional to the range of focus distribution by the energy of light beam secondary reshaping device 8.Meanwhile for polycyclic point
Cloth structure can increase and decrease the range of focus distribution by the quantity for increasing and decreasing ring.In actual use, as shown in figure 4, light beam passes through light
After beam secondary reshaping device 8 increases Energy distribution and size, enter after 9 and the 4th speculum 10 of third speculum and focus on
Mirror 11, focus distribution range increase to FL4 by FL1.On the contrary, Energy distribution and size are reduced by light beam secondary reshaping device 8
Afterwards, focus distribution range is reduced by FL1 to FL2 or FL3.
As shown in figure 5, after laser beam forms the multifocal being distributed in limited range FL, Z is adjusted by control system 100
The height and position of axis elevating movement unit 3 includes focus distribution range FL and is processed object 12, and by control system 100
Control X-Y axis motion platform 2 does the movement relative to focus lamp 11, so as to be formed in processed subject surface and inside by quick-fried
The section of knick point composition, referred to as surface of rupture 14.As shown in figure 5, it in actual use, is processed when the height of surface of rupture 14 is more than
During the thickness of object 12, point of burst can be generated being processed the upper and lower surface of object 12 and inside.It is secondary whole by light beam
After shape dress puts the limited range FL of 8 adjusting multifocals distribution, the height of surface of rupture 14 is smaller than being processed the thickness of object 12.
In this case, adjusting Z axis elevating movement unit 3 to suitable height by control system 100, can only be formed in material internal quick-fried
Broken face 14, and material upper and lower surface is not damaged.
Laser may not break apart, have certain behind processed 12 surface of object and internal formation surface of rupture completely
Bond strength.It needs processed object to be made to break apart completely by external form.A kind of mode is hung down using mechanical external force
Directly acting on surface of rupture is allowed to bend fracture.The figure of rectilinear form can only be handled using the separate mode of mechanical external force, without
Curve or closed figure can be handled.
The thickness of object is processed since the limited focus distribution range that is formed of the present invention can still be more than, it can be
The upper and lower surface of object and internal formation point of burst are processed, so as to be formed through the damage section of material thickness.Before this
It puts, the mode of chemical solvent corrosion, which can be used, is kept completely separate processed object.It will be submerged through the object after Laser Processing
In chemical solvent, since the chemical constitution and surface area of point of burst exist not with surrounding without Laser Processing processing region
Together, therefore chemical solvent is significantly larger than area of the surrounding without Laser Processing processing for the rate of material dissolution in point of burst region
Domain.Course of dissolution is carried out since the point of burst of material surface, along explosion towards material internal, finally so where surface of rupture
Material inside region and its in attachment tiny area dissolves rapidly, and forming gap makes material break apart completely.Material surface palpus
There are laser point of burst, S1 as shown in Figure 6.It is gradually dissolved using this point of burst as starting point to material internal, finally makes material complete
Complete break apart is come.It is detached using chemical solvent and is processed object, the manuscripts such as straight line, curve and closed curve can be handled
Shape contains the strong acid solutions such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, hydrofluoric acid in usual chemical solvent.Can be the acid of single kind
Liquid or the acid solution mixed according to different proportion.
It, can be with material internal visible in detail such as the point of burst photo schematic diagram that Fig. 7, laser are formed inside sapphire
The vertically discrete point of burst core 13 of (optical propagation direction) distribution.Meanwhile it also shows laterally different in material internal
The vertical region of how each point of burst that position is formed.For the laser beam wavelength used for 1064nm, laser pulse width is 12 picoseconds,
100~200uJ of pulse energy.
In conclusion the present invention realizes laser scribing with cutting using the method for multifocal distribution Laser Processing in wired range
It cuts, the extension technology based on the stress induced cutting technique of laser realizes brittle transparent by the focus quantity increased along optical axis direction
The processing of material；Auxiliary realizes the complete parttion of material in a manner of mechanical external force sliver or chemical attack simultaneously.It can be to
The stress induced cutting method of lower compatible laser and some drawbacks for improving the stress induced processing of laser.
Focus is distributed in limited range, and the range of distribution can be more than the thickness of machined material, so as to make processing times
It can at least be reduced to once, compared to the multiple round-trip cutting used in the stress induced cutting method of laser, cutting efficiency is notable
It is promoted.
Adjacent focal spots tight distribution, section roughness significantly improve；Relative to the method for ablated surface, side can be made
Wall verticality is more than 89 °, and near vertical, sidewall roughness is greatly improved.
On the basis of Laser Processing, the method for being aided with mechanical system or chemical attack carries out material separation, so as to real
The cutting separation of existing arbitrary graphic material, lacking for the closed figures such as drilling processing can not be realized by solving the stress induced cutting of laser
It falls into.The processing request of most of 2-d plane graph is realized and met, includes the various irregularly-shaped holes of processing.
It should be noted that：The foregoing is merely the preferred embodiment of the present invention, are not limited to the power of the present invention
Sharp range；Description above simultaneously, should can understand and implement for the special personage of correlative technology field, thus it is other without departing from
The equivalent change or modification completed under disclosed spirit, should be included in claim.
Claims (20)
1. multifocal DYNAMIC DISTRIBUTION laser machines the device of brittle transparent material, it is characterised in that：It is provided with according to optical path direction：
Laser (1), output beam；
Beam expanding lens (4) continuously adjusts the diameter from laser (1) output beam and dispersion angle；
The light beam that beam expanding lens (4) is emitted is reflexed to laser beam apparatus for shaping (7) for the first time by the first reflector element；
Energy is carried out beam shaping, the light beam energy after shaping by light beam apparatus for shaping (7) for the first time in the laser beam of Gaussian Profile
Amount is distributed in an annular or multiple annular regions；
Laser beam after shaping for the first time is carried out shaping again, to laser beam energy point by light beam secondary reshaping device (8)
Cloth and big minor adjustment, dynamic control focus distribution range；
Laser beam after secondary reshaping is incident to focus lamp (11) by the second reflector element；
The light beam that second reflector element reflects is focused by focus lamp (11), and laser beam forms what is be distributed in limited range
Multifocal, focus distribution range, which includes, is processed object；
X-Y axis motion platform (2) carries and is processed object, is moved relative to focus lamp (11).
2. the device of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 1, it is characterised in that：
The laser (1) is pulse width less than 100 nanoseconds, the pulse laser of 343~2000 nanometers of the optional range of wavelength.
3. the device of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 2, it is characterised in that：
The laser (1) is 7~15 picoseconds of pulse duration range, the pulse laser of wavelength 1030nm or 1064nm.
4. the device of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 1, it is characterised in that：
The beam expanding lens (4) is the beam expanding lens with adjustable multiplying power and the change angle of divergence.
5. the device of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 1, it is characterised in that：
First reflector element includes the first speculum (5) arranged according to optical path direction and the second speculum (6).
6. the device of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 1, it is characterised in that：
Apparatus for shaping (7) is spatial light modulator, deformable mirror or diffraction optical lens to the light beam for the first time.
7. the device of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 1, it is characterised in that：
The light beam secondary reshaping device (8) is adjustable diaphragm.
8. the device of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 1, it is characterised in that：
Second reflector element includes the third speculum (9) and the 4th speculum (10) being sequentially arranged according to optical path direction.
9. the device of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 1, it is characterised in that：
The focus lamp (11) is installed on Z axis elevating movement unit (3).
10. the device of multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 1, feature exist
In：Also comprising control system (100) and light beam secondary reshaping device control units (200), control system (100) and light beam are secondary
Apparatus for shaping control unit (200) and X-Y axis motion platform (2) control connection, light beam secondary reshaping device control units (200)
It controls and connects with light beam secondary reshaping device (8).
11. the method that multifocal DYNAMIC DISTRIBUTION laser machines brittle transparent material, it is characterised in that：Laser converges after beam shaping
Multiple focuses being distributed along optical axis direction are polymerized to, and the range that multiple focuses are covered continuously may be used in 20~3000 micron ranges
It adjusts, adjusting focus makes the coverage area of focus be more than the thickness for being processed object.
12. the method for multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 11, feature exist
In：Adjusting focus makes the coverage area of focus be more than the thickness for being processed object, in processed object upper and lower surface and interior
Portion forms small point of burst being processed inside object, and object to be processed is formed relative to focussing movement through processed pair
As the surface of rupture of upper and lower surface, using surface of rupture as the separation for being oriented to realization material.
13. the method for multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 12, feature exist
In：Using surface of rupture to be directed through the separation for applying mechanical external force and realizing material.
14. the method for multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 12, feature exist
In：For curve and closed figure, the separation of material is realized by the method that chemical agent corrodes.
15. the method for multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 11, feature exist
In：Pulse laser is exported by laser (1), beam expanding lens (4) continuously adjusts the diameter and dispersion angle of light beam；By first
The light beam of outgoing is reflexed to laser beam apparatus for shaping (7) for the first time by reflector element, and energy is in light beam by apparatus for shaping (7) for the first time
The laser beam of Gaussian Profile carries out beam shaping, and the beam energy after shaping is distributed in an annular or multiple annular regions
It is interior；Laser beam after shaping for the first time is carried out shaping again by light beam secondary reshaping device (8), to Laser beam energy distribution
And big minor adjustment, dynamic control focus distribution range, form the laser beam with energy and distribution shape；By the second reflection
Laser beam after secondary reshaping is incident to focus lamp (11), focus lamp (11), the light beam that the second reflector element is reflected by unit
It is focused, laser beam forms the multifocal being distributed in limited range, and focus distribution range, which includes, is processed object；X-Y axis
Motion platform (2) carrying is processed object, is moved relative to focus lamp (11)；So as on the surface and inside for being processed object
Form the section being made of point of burst, i.e. surface of rupture.
16. the method for multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 15, feature exist
In：When the height of surface of rupture is more than the thickness for being processed object, it is processed the upper and lower surface of object and internal generation explosion
Point.
17. the method for multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 15, feature exist
In：Light beam secondary reshaping device (8) adjusts the limited range of multifocal distribution, and the height of surface of rupture is less than the thickness for being processed object
By adjusting focus lamp to proper height, surface of rupture is formed being processed inside subject material for degree, and material upper and lower surface is lossless
Wound.
18. the method for multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 15, feature exist
In：The light beam secondary reshaping device (8) is adjustable diaphragm, by carrying out laser beam energy point to blocking for laser beam
The control of cloth and size.
19. the method for multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 18, feature exist
In：The adjustable diaphragm uses the structure of Electronic control pore size or suitching type structure, diaphragm in suitching type structure
For soft aperture slot.
20. the method for multifocal DYNAMIC DISTRIBUTION Laser Processing brittle transparent material according to claim 15, feature exist
In：Control instruction is sent out to light beam secondary reshaping device control units (200), light beam secondary reshaping dress by control system (100)
Control unit (200) is put as driving device, light beam secondary reshaping device is controlled by light beam secondary reshaping device control units (200)
(8) motor in, folding or switching action to the diaphragm of light beam secondary reshaping device (8).
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