CN108122807A - A kind of wafer carrying box, wafer laser marking system and method - Google Patents
A kind of wafer carrying box, wafer laser marking system and method Download PDFInfo
- Publication number
- CN108122807A CN108122807A CN201611082462.8A CN201611082462A CN108122807A CN 108122807 A CN108122807 A CN 108122807A CN 201611082462 A CN201611082462 A CN 201611082462A CN 108122807 A CN108122807 A CN 108122807A
- Authority
- CN
- China
- Prior art keywords
- wafer
- laser
- mark
- plummer
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
- B41J3/4073—Printing on three-dimensional objects not being in sheet or web form, e.g. spherical or cubic objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of wafer carrying box, wafer laser marking system and method, wherein, the method for wafer laser marking includes：Multilayer wafer from top to bottom separately and is set in parallel and is not covered in the default mark region on a plummer, and on each wafer by any wafer set by top successively；Laser transmitting laser beam is controlled, and laser beam is controlled to be moved relative to plummer, so that laser beam carries out laser marking to the default mark region of each wafer successively from top to bottom.The embodiment of the present invention improves the efficiency of wafer laser marking, solves the problems, such as to take when carrying out laser marking to wafer in the prior art longer and less efficient.
Description
Technical field
The present invention relates to a kind of technical field of semiconductors more particularly to wafer carrying box, wafer laser marking system and sides
Method.
Background technology
In the manufacturing process of wafer, it is exactly to carry out laser marking to wafer to throw the first step process after piece.To wafer
During carrying out laser marking, usually first wafer is taken out from wafer bearing device, then by transmission system by wafer
It is sent into chamber, laser marking is proceeded by after wafer alignment laser beam.During laser marking, in order to shorten laser
The time of mark, some transmission systems can successively take out two wafers, and a feeding chamber, another is first-class in delivery platform
It waits.But it remains take the problem of longer and less efficient when carrying out laser marking to wafer in the prior art.
The content of the invention
The object of the present invention is to provide a kind of wafer carrying box, wafer laser marking system and method, to solve existing skill
The problem of longer and less efficient is taken when carrying out laser marking to wafer in art.
In a first aspect, the embodiment of the present invention provides a kind of method of wafer laser marking, including：
Multilayer wafer from top to bottom separately and is set in parallel on a plummer successively, and it is pre- on each wafer
If mark region is not covered by any wafer set by top；
Control laser transmitting laser beam, and control laser beam with respect to plummer movement so that laser beam from top to bottom according to
The secondary default mark region to each wafer carries out laser marking.
Optionally, the control laser transmitting laser beam, and the step that laser beam is controlled to be moved relative to plummer, bag
It includes：Control laser is located at the surface position at the starting mark location in the default mark region that mark wafer is treated in multilayer wafer
When putting, control laser transmitting laser beam；Wherein, treat mark wafer for any wafer in the multilayer wafer；Control laser
Beam is moved relative to plummer according to the default mark track of wafer, to complete the default mark that laser beam treats mark wafer
The laser marking in region；The laser marking to the default mark region of each wafer is sequentially completed from top to bottom.
Optionally, control laser is located at the starting mark location in the default mark region that mark wafer is treated in multilayer wafer
The step of position directly above at place, including：Obtain the starting mark location and laser in the default mark region for treating mark wafer
Between relative horizontal position relation；According to the relative horizontal position relation, wherein one in laser and plummer is controlled
It is a stationary, and another movement in laser and plummer is controlled, so that laser, which is located at, treats the default of mark wafer
Position directly above at the starting mark location in mark region.
Optionally, control laser beam carries out mobile step relative to plummer according to the default mark track of wafer, including：
Control in laser and plummer one of them is stationary, and control another in laser and plummer according to wafer
Default mark track moved, to complete the laser marking that laser beam treats the default mark region of mark wafer.
Second aspect, an embodiment of the present invention provides a kind of wafer carrying box, including：
Box body, one side are provided with opening；
Multiple wafer fixed plates, the at one end of the multiple wafer fixed plate are provided with to plug the wafer grafting of wafer
Slot, the multiple wafer fixed plate are from top to bottom vertically installed in separately and parallelly in the box body and the opening successively
On the opposite bottom plate in direction, and the length of the wafer inserting groove is from top to bottom sequentially increased.
Optionally, the wafer carrying box further includes multiple first partitions and multiple second partitions, the multiple first every
Plate is from top to bottom vertically installed in separately and parallelly on the first side plate adjacent with the bottom plate successively, and the multiple
Any first partition in one partition plate is in vertical direction in two neighboring wafer fixed plate in the multiple wafer fixed plate
Between；The multiple second partition and the multiple first partition one by one it is corresponding be arranged at it is opposite with first side plate
On second side plate.
The third aspect, an embodiment of the present invention provides a kind of wafer laser marking system, the wafer laser marking system
Including the wafer carrying box any one of second aspect, and multiple wafers, the crystalline substance are installed in the wafer carrying box
Circle laser marking system further includes：
Plummer, the wafer carrying box are fixedly installed on the plummer；
For emitting the laser of laser beam, the laser is located at the top of the wafer carrying box；
Controller, the controller are connected with the laser, control the laser transmitting laser beam, and described in control
Laser beam is moved relative to plummer, so that the laser beam default mark to each wafer in wafer carrying box successively from top to bottom
Region carries out laser marking.
Optionally, the position on the laser at Laser emission is equipped with a range sensor, the Distance-sensing
Device is connected with the controller, and the starting in the default mark region that mark wafer is treated in more than one a wafers is sent to the controller
The control signal of relative horizontal position relation between mark location and laser；The controller receives the control signal,
Control laser is moved at the position directly above at the starting mark location in the default mark region for treating mark wafer, and is controlled
The laser emits laser beam, and the laser is controlled to be moved according to the default mark track of wafer.
Optionally, the controller is also connected with the plummer, and the controller receives the control signal, controls institute
It states that laser is stationary, and the plummer is controlled to be moved to laser and is located at rising for the default mark region for the treatment of mark wafer
At position during position directly above at beginning mark location, and the laser transmitting laser beam is controlled, and control the carrying
Platform is moved according to the default mark track of wafer.
Optionally, the wafer laser marking system further includes a closed chamber, the laser, wafer carrying box and institute
Plummer is stated to may be contained in the closed chamber.
The beneficial effects of the invention are as follows：
The method of wafer laser marking provided in an embodiment of the present invention, by by multilayer wafer from top to bottom successively separately
And it is set in parallel in the default mark region on a plummer, and on each wafer not by any wafer institute set by top
Covering, and laser transmitting laser beam and control laser beam is controlled to be moved relative to plummer, so that laser beam can be certainly
Laser marking is carried out to the default mark region of each wafer successively under above.The embodiment of the present invention causes disposably can be to more
A wafer carries out laser marking, and continuously can carry out laser marking to multiple wafers, and the process of wafer transmission is omitted, improves
The efficiency of wafer laser marking, solve taken when carrying out laser marking to wafer in the prior art it is longer and less efficient
Problem.
Description of the drawings
Fig. 1 shows the step flow charts of the method for wafer laser marking in the first embodiment of the present invention；
Fig. 2 represents the step flow chart of the method for wafer laser marking in the second embodiment of the present invention；
Fig. 3 represents the structure diagram of wafer carrying box in the third embodiment of the present invention；
Fig. 4 represents the structure diagram of wafer laser marking system in the fourth embodiment of the present invention；
Fig. 5 represents the control schematic diagram of wafer laser marking system in the fourth embodiment of the present invention.
Specific embodiment
The exemplary embodiment of the disclosure is more fully described below with reference to accompanying drawings.Although the disclosure is shown in attached drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the disclosure without should be by embodiments set forth here
It is limited.On the contrary, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can be by the scope of the present disclosure
Completely it is communicated to those skilled in the art.
First embodiment：
As shown in Figure 1, be the step flow chart of the method for wafer laser marking in the first embodiment of the present invention, this method
Including：
Step 101, multilayer wafer from top to bottom separately and is set in parallel on a plummer successively, and each crystalline substance
Default mark region on circle is not covered by any wafer set by top.
It in this step, can be brilliant by multilayer specifically, during laser marking is carried out to wafer using laser
Circle from top to bottom successively separately and be set in parallel in the default mark region on a plummer, and on each wafer not by
Any wafer set by top is covered.In this way, when laser is used to carry out laser marking to the multilayer wafer, without changing
Become the relative position relation per layer crystal between circle in multilayer wafer, you can realize once to the default mark regions of multiple wafers into
Row mark.
Step 102, laser transmitting laser beam is controlled, and laser beam is controlled to be moved relative to plummer, so that laser beam is certainly
Laser marking is carried out to the default mark region of each wafer successively under above.
In this step, specifically, by multilayer wafer from top to bottom successively separately and be set in parallel in one carrying
On platform, and when the default mark region on each wafer is not covered by any wafer set by top, laser can be controlled
Device emits laser beam, and laser beam is controlled to be moved relative to plummer, so that laser beam can be from top to bottom successively to each
The default mark region of wafer carries out laser marking.In this way, during laser marking, without changing between multiple wafers
Relative position relation need to only control laser beam to be moved with respect to plummer, you can realization disposably to the laser marking of multiple wafers,
The process of wafer transmission is omitted, improves the efficiency of wafer laser marking.
The present embodiment from top to bottom separately and is set in parallel on a plummer successively by multilayer wafer, and each
When default mark region on wafer is not covered by any wafer set by top, control laser transmitting laser beam, and
Laser beam is controlled with respect to plummer movement so that laser beam can from top to bottom successively to the default mark region of each wafer into
Row laser marking so that disposably can multiple wafers be carried out with laser marking, and can continuously carry out multiple wafers
Laser marking is omitted the process of wafer transmission, improves the efficiency of wafer laser marking, solve in the prior art to wafer
It carries out taking the problem of longer and less efficient during laser marking.
Second embodiment：
As shown in Fig. 2, be the step flow chart of the method for wafer laser marking in the second embodiment of the present invention, this method
Including：
Step 201, multilayer wafer from top to bottom separately and is set in parallel on a plummer successively, and each crystalline substance
Default mark region on circle is not covered by any wafer set by top.
It in this step, can be brilliant by multilayer specifically, during laser marking is carried out to wafer using laser
Circle from top to bottom successively separately and be set in parallel in the default mark region on a plummer, and on each wafer not by
Any wafer set by top is covered.In this way, when laser is used to carry out laser marking to the multilayer wafer, without changing
Become the relative position relation per layer crystal between circle in multilayer wafer, you can realize once to the default mark regions of multiple wafers into
Row mark.
Step 202, control laser is located at the starting mark position in the default mark region that mark wafer is treated in multilayer wafer
When putting the position directly above at place, control laser transmitting laser beam.
In this step, specifically, by multilayer wafer from top to bottom successively separately and be set in parallel in one carrying
On platform, and when the default mark region on each wafer is not covered by any wafer set by top, laser can be controlled
When device is located at the position directly above at the starting mark location in the default mark region of mark wafer in multilayer wafer, and control
Laser emits laser beam.
Specifically, this treats that mark wafer can be any wafer in multilayer wafer.Certainly, it is disposable in order to guarantee
Laser marking all is carried out to multiple wafers and ensures the efficiency of laser marking, first in multiple wafers treats mark wafer
It can be the wafer of top layer in multiple wafers, in this manner it is ensured that laser marking from top to bottom is carried out to multiple wafers successively,
And laser can be reduced and treat the relative movement between mark wafer, so as to increase the efficiency of laser marking.
Optionally, in addition, the starting in the default mark region that mark wafer is treated in multilayer wafer is located in control laser
During position directly above at mark location, the starting mark location in the default mark region for treating mark wafer can be first obtained with swashing
Relative horizontal position relation between light device then according to relative horizontal position relation, controls its in laser and plummer
In one it is stationary, and control in laser and plummer another movement so that laser be located at treat mark wafer
Position directly above at the starting mark location in default mark region.In this way, getting the default mark area that treats mark wafer
During the relative horizontal position relation originated between mark location and laser in domain, laser can be selected according to actual conditions
It is mobile with one of them in plummer, so that laser is located at the starting mark in the default mark region for treating mark wafer
At position directly above at position, so as to which the laser marking that mark wafer is treated for laser provides the foundation.
Step 203, control laser beam is moved relative to plummer according to the default mark track of wafer, to complete laser
Beam treats the laser marking in the default mark region of mark wafer.
In this step, specifically, being located at the starting mark location in the default mark region for treating mark wafer in laser
When at the position directly above at place, laser beam can be controlled to be moved relative to plummer according to the default mark track of wafer, from
And complete the laser marking that laser beam treats the default mark region of mark wafer.
Optionally, when laser beam is controlled to be moved relative to plummer according to the default mark track of wafer, can control
One of them in laser and plummer processed is stationary, and controls another in laser and plummer according to wafer
Default mark track is moved, so as to complete the laser marking that laser beam treats the default mark region of mark wafer.In this way,
One of them for only needing to control in laser and plummer is moved according to default mark track, another be in it is static not
Dynamic state, while the operational readiness to laser and plummer is simplified, improves the phase between laser or plummer
To accuracy of the movement locus as default mark track.
Step 204, the laser marking to the default mark region of each wafer is sequentially completed from top to bottom.
In this step, specifically, when by multilayer wafer from top to bottom successively separately and be set in parallel in one carrying
It, can be according to step on platform, and when the default mark region on each wafer is not covered by any wafer set by top
202 and step 203, the laser marking to the default mark region of each wafer is sequentially completed from top to bottom.In this way, it can pass through
The relative movement between relative horizontal position relation and control laser and the plummer between laser and plummer is controlled,
Realize the laser marking being sequentially completed from top to bottom to the default mark region of each wafer so that disposably can be to multiple crystalline substances
Circle carries out laser marking successively, improves the efficiency of laser marking.
The present embodiment from top to bottom separately and is set in parallel on a plummer successively by multilayer wafer, and each
When default mark region on wafer is not covered by any wafer set by top, by the way that laser is controlled to be located at multilayer crystalline substance
In circle when the position directly above originated at mark location in the default mark region of mark wafer, control laser transmitting laser
Beam, and laser beam is controlled to be moved relative to plummer according to the default mark track of wafer, treat mark to complete laser beam
The laser marking in the default mark region of wafer, and the laser to the default mark region of each wafer is sequentially completed from top to bottom
Mark so that by the phase between the relative horizontal position relation between laser and plummer and laser and plummer
To mobile control, realize successively to the laser marking of multiple wafers, the process of wafer transmission is omitted, improves wafer laser
The efficiency of mark solves the problems, such as to take when carrying out laser marking to wafer in the prior art longer and less efficient.
3rd embodiment：
As shown in figure 3, being the schematic diagram of wafer carrying box in the third embodiment of the present invention, which includes：
Box body 11, one side are provided with opening；
Multiple wafer fixed plates 12, the at one end of the multiple wafer fixed plate 12 are provided with to plug the wafer of wafer
Inserting groove, the multiple wafer fixed plate 12 from top to bottom successively separately and be parallelly vertically installed in the box body 11 with
On the opposite bottom plate of the opening direction, and the length of the wafer inserting groove is from top to bottom sequentially increased.
In this way, since multiple wafer fixed plates are from top to bottom vertically installed in separately and parallelly in box body and box successively
On the opposite bottom plate of the opening direction of body, so that the wafer that multiple wafers are plugged in successively in multiple wafer fixed plates is inserted
During access slot, multiple wafers are similarly from top to bottom successively separately and parallel state.Certainly, the extension of multiple wafer fixed plates
Direction is the opening direction of box body, i.e., the extending direction after multiple wafer installations is the opening direction of box body.In addition, wafer grafting
The length of slot is from top to bottom sequentially increased, and can cause default mark region in multiple wafers after installation on each wafer not
It is covered by any wafer set by top.
Specifically, the length that is from top to bottom sequentially increased of wafer inserting groove can be the default mark region of wafer in box body
Opening direction extension length.It in this way, can be in the default mark area on each wafer in multiple wafers after ensureing to install
While domain is not covered by any wafer set by top, reduce the length of wafer inserting groove to greatest extent, so as to subtract
The volume of small wafer carrying box.In addition, specifically, box body can be U-board shape structure, in this way, being inserted successively by multiple wafers
During the wafer inserting groove being located in multiple wafer fixed plates, multiple wafers will not be blocked by box body, be facilitated to multiple wafers
Laser marking.
Further, with continued reference to Fig. 3, wafer carrying box further includes multiple first partitions 13 and multiple second partitions 14,
The multiple first partition 13 is from top to bottom vertically installed in separately and parallelly first side adjacent with the bottom plate successively
On plate, and any first partition in the multiple first partition 13 is in the multiple wafer fixed plate 12 in vertical direction
In between two neighboring wafer fixed plate；The multiple second partition 14 with the multiple first partition 13 is corresponding one by one sets
It is placed on the second side plate opposite with first side plate.
In this way, when being plugged in multiple wafers successively on the wafer inserting groove in multiple wafer fixed plates, multiple wafers
It corresponding can take in the first partition and second partition being placed below plugged wafer fixed plate, improve inserting for wafer
If security.
In this way, wafer carrying box provided in this embodiment, including box body and multiple wafer fixed plates, multiple wafer fixed plates
From top to bottom it is vertically installed in separately and parallelly on opposite with box opening direction bottom plate in box body successively, and multiple crystalline substances
The at one end of circle fixed plate is provided with to plug the wafer inserting groove of wafer, and the length of wafer inserting groove is from top to bottom successively
Increase, so that when on the corresponding wafer inserting groove being plugged in multiple wafer fixed plates of multiple wafers, multiple wafers
It is similarly from top to bottom successively separately and parallel state, and the default mark region in multiple wafers on each wafer will not
It is covered by any wafer set by top, provides the foundation for subsequent wafer laser marking.
Fourth embodiment：
In the present embodiment, referring to Fig. 4 and Fig. 5, which includes：
Wafer carrying box 1；
Plummer 2, the wafer carrying box 1 are fixedly installed on the plummer 2；
For emitting the laser 3 of laser beam, the laser 3 is located at the top of the wafer carrying box 1；
Controller 4, the controller 4 are connected with the laser 3, and the laser 3 is controlled to emit laser beam, and is controlled
The laser beam is moved relative to plummer 2, so that laser beam is from top to bottom successively to the pre- of each wafer in wafer carrying box 1
If mark region carries out laser marking.
In the present embodiment, wafer carrying box is fixedly installed on plummer, and laser is located at the upper of wafer carrying box
Side, so that from top to bottom separately and being arranged in parallel successively by corresponding be plugged in wafer carrying box of multiple wafers
Wafer fixed plate on when, laser can be located at multiple wafers in each wafer top.In addition, controller connects with laser
It connects, laser can be controlled to emit laser beam, and laser beam is controlled to be moved relative to plummer, so as to control laser beam from top to bottom
Laser marking is carried out to the default mark region of each wafer in wafer carrying box successively, so that disposably can be to more
A wafer carries out laser marking, and continuously can carry out laser marking to multiple wafers, and the process of wafer transmission is omitted, improves
The efficiency of wafer laser marking, solve taken when carrying out laser marking to wafer in the prior art it is longer and less efficient
Problem.
Further, with continued reference to Fig. 4 and Fig. 5, the position on laser 3 at Laser emission is equipped with a Distance-sensing
Device 31, range sensor 31 are connected with controller 4, and the default mark that mark wafer is treated in more than one a wafers is sent to controller 4
The control signal of relative horizontal position relation between the starting mark location and laser 3 in region；Controller 4 receives control letter
Number, control laser 3 is moved at the position directly above at the starting mark location in the default mark region for treating mark wafer, and
Laser 3 is controlled to emit laser beam, and laser is controlled to be moved according to the default mark track of wafer.
In this way, the default mark area for treating mark wafer can be got in real time by the range sensor installed on laser
Relative horizontal position relation between the starting mark location and laser in domain.Further, since range sensor is mounted on laser
Position on device at Laser emission, therefore the data obtained by range sensor most can really reflect laser
The laser beam of transmitting and treat mark wafer default mark region starting mark location between relative horizontal position relation, from
And improve the accuracy of laser marking.It is treated in addition, controller controls laser to be moved to by the relative horizontal position relation
At position directly above at the starting mark location in the default mark region of mark wafer, and laser is controlled to emit laser beam,
And laser is controlled to be moved according to the default mark track of wafer, since laser beam sends for laser, can lead to
The movement of control laser is crossed, to control the movement of laser beam, so as to complete to treat that mark wafer swashs to each in multiple wafers
Light mark.The present embodiment only is completed to beat each laser for treating mark wafer in multiple wafers by controlling the movement of laser
Mark, while laser marking efficiency is improved, easy laser marking process.
Further, with continued reference to Fig. 4 and Fig. 5, controller 4 is also connected with plummer 2, and controller 4 receives control signal,
It controls laser 3 stationary, and plummer 2 is controlled to be moved to laser 3 positioned at the default mark region for treating mark wafer
At position when originating the position directly above at mark location, and laser 3 is controlled to emit laser beam, and plummer 2 is controlled to press
It is moved according to the default mark track of wafer.
In the present embodiment, when range sensor treats the default mark of mark wafer into controller more than one a wafers of transmission
During the control signal of the relative horizontal position relation between the starting mark location and laser in region, controller receives the control
Signal, and the relative horizontal position relation in the control signal, control plummer be moved to laser be located at treat mark crystalline substance
At position during the position directly above originated at mark location in round default mark region, and laser is controlled to emit laser
Beam, and plummer is controlled to be moved according to the default mark track of wafer.The present embodiment by controlling plummer mobile and
Laser transmitting laser beam is controlled, to complete, to each laser marking for treating mark wafer in multiple wafers, to avoid laser
Movement, while ensure that the security of laser, improve the efficiency of laser marking.
Further, referring to Fig. 4, wafer laser marking system further includes a closed chamber 5, laser 3, wafer carrying box
1 and plummer 2 may be contained in closed chamber 5.
In this way, laser, wafer carrying box and plummer may be contained in closed chamber, ash can be infected with to avoid wafer
Dirt ensure that the cleanliness of wafer.
Wafer laser marking system in the embodiment of the present invention so that the laser beam that laser is sent can from top to bottom according to
The secondary default mark region to each wafer in multiple wafers carries out laser marking, so that disposably can be to multiple wafers
Laser marking is carried out, and can laser marking continuously be carried out to multiple wafers, the process of wafer transmission is omitted, improves wafer
The efficiency of laser marking solves the problems, such as to take when carrying out laser marking to wafer in the prior art longer and less efficient.
Above-described is the preferred embodiment of the present invention, it should be pointed out that is come for the ordinary person of the art
It says, several improvements and modifications can also be made under the premise of principle of the present invention is not departed from, these improvements and modifications also exist
In protection scope of the present invention.
Claims (10)
- A kind of 1. method of wafer laser marking, which is characterized in that the described method includes：Multilayer wafer from top to bottom separately and is set in parallel on a plummer successively, and default on each wafer beats Mark region is not covered by any wafer set by top；Laser transmitting laser beam is controlled, and laser beam is controlled to be moved relative to plummer, so that laser beam is right successively from top to bottom The default mark region of each wafer carries out laser marking.
- 2. according to the method described in claim 1, it is characterized in that, the control laser transmitting laser beam, and controls laser The step that beam is moved relative to plummer, including：Control laser is located at the surface at the starting mark location in the default mark region that mark wafer is treated in multilayer wafer During position, control laser transmitting laser beam；Wherein, treat mark wafer for any wafer in the multilayer wafer；Control laser beam is moved relative to plummer according to the default mark track of wafer, and mark crystalline substance is treated to complete laser beam The laser marking in round default mark region；The laser marking to the default mark region of each wafer is sequentially completed from top to bottom.
- 3. according to the method described in claim 2, it is characterized in that, control laser, which is located in multilayer wafer, treats mark wafer The step of position directly above originated at mark location in default mark region, including：Obtain the relative horizontal position relation between the starting mark location and laser in the default mark region for treating mark wafer；According to the relative horizontal position relation, one of them in control laser and plummer is stationary, and controls and swash Another movement in light device and plummer, so that laser is located at the starting mark position in the default mark region for treating mark wafer Put the position directly above at place.
- 4. according to the method described in claim 2, it is characterized in that, control laser beam is beaten with respect to plummer according to the default of wafer Mark track carries out mobile step, including：Control in laser and plummer one of them is stationary, and control in laser and plummer another according to The default mark track of wafer is moved, to complete the laser marking that laser beam treats the default mark region of mark wafer.
- 5. a kind of wafer carrying box, which is characterized in that including：Box body, one side are provided with opening；Multiple wafer fixed plates, the at one end of the multiple wafer fixed plate are provided with to plug the wafer inserting groove of wafer, The multiple wafer fixed plate is from top to bottom vertically installed in separately and parallelly in the box body and the opening side successively On opposite bottom plate, and the length of the wafer inserting groove is from top to bottom sequentially increased.
- 6. wafer carrying box according to claim 5, which is characterized in that the wafer carrying box further include multiple first every Plate and multiple second partitions, the multiple first partition are from top to bottom vertically installed in separately and parallelly and the bottom successively On the first adjacent side plate of plate, and any first partition in the multiple first partition is in vertical direction in the multiple In wafer fixed plate between two neighboring wafer fixed plate；The multiple second partition and the multiple first partition are opposite one by one That answers is arranged on the second side plate opposite with first side plate.
- 7. a kind of wafer laser marking system, which is characterized in that the wafer laser marking system includes such as claim 5 and 6 Any one of wafer carrying box, and multiple wafers are installed in the wafer carrying box, the wafer laser marking system System further includes：Plummer, the wafer carrying box are fixedly installed on the plummer；For emitting the laser of laser beam, the laser is located at the top of the wafer carrying box；Controller, the controller are connected with the laser, are controlled the laser transmitting laser beam, and are controlled the laser Beam is moved relative to plummer, so that laser beam is from top to bottom successively to the default mark region of each wafer in wafer carrying box Carry out laser marking.
- 8. wafer laser marking system according to claim 7, which is characterized in that close to Laser emission on the laser The position at place is equipped with a range sensor, and the range sensor is connected with the controller, and more than one are sent to the controller The relative horizontal position relation between the starting mark location in the default mark region of mark wafer and laser is treated in a wafer Control signal；The controller receives the control signal, and control laser is moved to the default mark area for treating mark wafer At position directly above at the starting mark location in domain, and the laser transmitting laser beam is controlled, and control the laser It is moved according to the default mark track of wafer.
- 9. wafer laser marking system according to claim 8, which is characterized in that the controller also with the plummer Connection, the controller receive the control signal, control the laser stationary, and the plummer is controlled to be moved to Laser is located at the position when position directly above originated at mark location in the default mark region of mark wafer, and controls The laser transmitting laser beam is made, and the plummer is controlled to be moved according to the default mark track of wafer.
- 10. wafer laser marking system according to claim 7, which is characterized in that the wafer laser marking system is also Including a closed chamber, the laser, wafer carrying box and the plummer may be contained in the closed chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611082462.8A CN108122807A (en) | 2016-11-30 | 2016-11-30 | A kind of wafer carrying box, wafer laser marking system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611082462.8A CN108122807A (en) | 2016-11-30 | 2016-11-30 | A kind of wafer carrying box, wafer laser marking system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108122807A true CN108122807A (en) | 2018-06-05 |
Family
ID=62226272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611082462.8A Pending CN108122807A (en) | 2016-11-30 | 2016-11-30 | A kind of wafer carrying box, wafer laser marking system and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108122807A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554599A (en) * | 2020-04-27 | 2020-08-18 | 厦门通富微电子有限公司 | Tool for bearing wafer material box, wafer material box device and method for loading wafer |
| CN111900147A (en) * | 2020-06-19 | 2020-11-06 | 中国科学院微电子研究所 | Identification mark for identifying wafer, system and method for forming identification mark on wafer |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08321539A (en) * | 1995-05-24 | 1996-12-03 | Nec Kyushu Ltd | Recognition equipment of identification mark of wafer |
| KR100217331B1 (en) * | 1996-09-23 | 1999-09-01 | 윤종용 | Semiconductor wafer clamping apparatus |
| KR20060039134A (en) * | 2004-11-02 | 2006-05-08 | 삼성전자주식회사 | Wafer cassette align apparatus |
| KR20070076089A (en) * | 2006-01-17 | 2007-07-24 | 삼성전자주식회사 | Method for labeling identification number of semiconductor wafer |
| CN102046377A (en) * | 2008-05-26 | 2011-05-04 | 日本着色配料株式会社 | Multilayer sheet for laser marking |
| CN102873152A (en) * | 2012-09-28 | 2013-01-16 | 苏州大学 | Foamed aluminum sandwich board bend forming method |
| CN103072383A (en) * | 2011-10-26 | 2013-05-01 | 深圳市大族激光科技股份有限公司 | Galvanometric laser marking machine and marking control card thereof |
| CN103112255A (en) * | 2013-01-15 | 2013-05-22 | 安徽康蓝光电股份有限公司 | Distributed type laser marking method of sapphire substrate |
| US20150038313A1 (en) * | 2013-08-02 | 2015-02-05 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
| CN104708206A (en) * | 2015-03-03 | 2015-06-17 | 四川飞阳科技有限公司 | Laser marking device and laser marking method |
-
2016
- 2016-11-30 CN CN201611082462.8A patent/CN108122807A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08321539A (en) * | 1995-05-24 | 1996-12-03 | Nec Kyushu Ltd | Recognition equipment of identification mark of wafer |
| KR100217331B1 (en) * | 1996-09-23 | 1999-09-01 | 윤종용 | Semiconductor wafer clamping apparatus |
| KR20060039134A (en) * | 2004-11-02 | 2006-05-08 | 삼성전자주식회사 | Wafer cassette align apparatus |
| KR20070076089A (en) * | 2006-01-17 | 2007-07-24 | 삼성전자주식회사 | Method for labeling identification number of semiconductor wafer |
| CN102046377A (en) * | 2008-05-26 | 2011-05-04 | 日本着色配料株式会社 | Multilayer sheet for laser marking |
| CN103072383A (en) * | 2011-10-26 | 2013-05-01 | 深圳市大族激光科技股份有限公司 | Galvanometric laser marking machine and marking control card thereof |
| CN102873152A (en) * | 2012-09-28 | 2013-01-16 | 苏州大学 | Foamed aluminum sandwich board bend forming method |
| CN103112255A (en) * | 2013-01-15 | 2013-05-22 | 安徽康蓝光电股份有限公司 | Distributed type laser marking method of sapphire substrate |
| US20150038313A1 (en) * | 2013-08-02 | 2015-02-05 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
| CN104708206A (en) * | 2015-03-03 | 2015-06-17 | 四川飞阳科技有限公司 | Laser marking device and laser marking method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554599A (en) * | 2020-04-27 | 2020-08-18 | 厦门通富微电子有限公司 | Tool for bearing wafer material box, wafer material box device and method for loading wafer |
| CN111554599B (en) * | 2020-04-27 | 2022-07-26 | 厦门通富微电子有限公司 | Tool for bearing wafer material box, wafer material box device and method for loading wafer |
| CN111900147A (en) * | 2020-06-19 | 2020-11-06 | 中国科学院微电子研究所 | Identification mark for identifying wafer, system and method for forming identification mark on wafer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108122807A (en) | A kind of wafer carrying box, wafer laser marking system and method | |
| KR102536254B1 (en) | LED chip mounting apparatus and a method for manufacturing a display device using the LED chip mounting apparatus | |
| US20170216622A1 (en) | Treatment planning device, treatment planning method, control device, and particle beam treatment system | |
| CN102262998B (en) | Ion implantation device | |
| CN108137266A (en) | Suitable for determining the elevator gear of the position of the fixing piece at each floor based on sound | |
| KR20120079961A (en) | Liner assembly and wafer treatment equipment having the same | |
| TW360491B (en) | Bait station for crawling insects | |
| TW200701348A (en) | Nonuniform ion implantation apparatus and method using a wide beam | |
| KR20150056478A (en) | Microwave heating apparatus | |
| KR20170041310A (en) | Deposition sorce and method of manufacturing the same | |
| ATE507868T1 (en) | METHOD FOR FORMING ELECTRICALLY ACTIVE SURFACES OF MEDICAL ELECTRICAL CABLES | |
| AR246442A1 (en) | Vapor horn | |
| KR100746698B1 (en) | Plasma treatment apparatus using dual frequencies and plasma treatment method | |
| KR20050120930A (en) | Bake system | |
| KR101408784B1 (en) | Substrate treating apparatus and substrate treating method | |
| JP7058907B2 (en) | Heat treatment equipment, annealing equipment and heat treatment method | |
| KR102224149B1 (en) | Automated charnel house management system | |
| CN206798885U (en) | A kind of vertical lift hall door area monitoring system attachment structure | |
| CN106304786A (en) | A kind of outdoor communication cabinet | |
| US7968857B2 (en) | Apparatus and method for partial ion implantation using atom vibration | |
| KR101644574B1 (en) | Method for installing crane in the building for nuclear waste | |
| KR102242289B1 (en) | Degassing chamber and semiconductor processing device | |
| KR20100106129A (en) | Substrate processing apparatus | |
| CN206557114U (en) | A kind of orthogonal scope in seabed | |
| KR102331779B1 (en) | Apparatus for injection gas and apparatus for processing substrate including the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180605 |