CN108108803B - Modular chip card - Google Patents
Modular chip card Download PDFInfo
- Publication number
- CN108108803B CN108108803B CN201810038066.8A CN201810038066A CN108108803B CN 108108803 B CN108108803 B CN 108108803B CN 201810038066 A CN201810038066 A CN 201810038066A CN 108108803 B CN108108803 B CN 108108803B
- Authority
- CN
- China
- Prior art keywords
- glue
- plate
- chip module
- clamping seat
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003292 glue Substances 0.000 claims abstract description 100
- 238000005034 decoration Methods 0.000 claims abstract description 28
- 230000007704 transition Effects 0.000 claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 210000000988 bone and bone Anatomy 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 16
- 238000003860 storage Methods 0.000 abstract description 29
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000012634 fragment Substances 0.000 description 8
- 238000009434 installation Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses a modular chip card, which comprises a bottom decoration plate, a glue filling plate, a bone frame plate, a top decoration plate, a clamping seat, a chip module, a positioning head, a coil groove and a copper coil, wherein the chip module is slightly pushed down along a bottom plate, pins arranged on the chip module are inserted into the lower end of a transition block, a spring plate is deformed to be contacted with the pins, then, the chip module is pressed into the clamping seat, glue solution is filled into the lower glue storage groove through the glue filling hole, the glue solution flows into the upper glue storage groove through the glue filling groove, after the glue solution is solidified, the glue solution in the lower glue storage groove is used for connecting the clamping seat with the glue filling plate, and the glue solution in the upper glue storage groove is used for fixedly connecting the clamping seat with the chip module, so that the chip module is positioned and fixed. The device has simple structure, adopts the design of a modular chip, can rapidly position and fix, adopts the elastic sheet with large area as the transition piece of the pin, the welding difficulty of pin and copper coil is effectively reduced, welding efficiency is improved, and meanwhile, the structural design convenient for glue filling is adopted, so that production efficiency is effectively improved.
Description
Technical Field
The present disclosure relates to chip cards, and particularly to a module type chip card.
Background
The existing electronic chip card consists of a card body and a chip arranged on the card body, the card body is internally embedded with a sensing coil which is connected with the chip to form conduction, thereby forming an electronic chip card. At present, the chip and the card body are connected in an adhesive mode, namely, the mounting surface of the chip is coated with glue to be connected with the card body, and because the chip has smaller volume, direct gluing is difficult, resulting in lower production efficiency, and simultaneously, because the pins of the chip are very small, the welding with the sensing coil is difficult. In view of the above drawbacks, it is necessary to design a modular chip card.
Disclosure of Invention
The invention aims to provide a modular chip card which adopts a modular chip design, can be rapidly positioned and fixed, improves the installation accuracy, adopts a large-area spring sheet as a transition piece of a pin, effectively reduces the welding difficulty of the pin and a copper coil, improves the welding efficiency, and simultaneously adopts a structural design convenient for glue filling, and effectively improves the production efficiency.
In order to solve the technical problems, the technical scheme of the invention is as follows: the utility model provides a modular chip card, includes bottom decoration board, encapsulating board, bone frame plate, top decoration board, cassette, chip module, positioning head, coil groove, copper coil, encapsulating board be located bottom decoration board upper end, encapsulating board and bottom decoration board bonding link to each other, the bone frame plate be located encapsulating board upper end, bone frame plate and encapsulating board bonding link to each other, top decoration board be located bone frame plate upper end, top decoration board and bone frame plate bonding link to each other, the cassette run through bone frame plate and be located encapsulating board top, cassette and encapsulating board bonding link to each other, chip module be located the cassette inboard and be located top decoration board lower extreme, chip module and cassette bonding link to each other, the cassette still be equipped with positioning head, positioning head and cassette an organic whole link to each other, bone frame plate still be equipped with the coil groove, the coil groove do not run through bone frame plate main part, the coil be located the coil groove, copper coil and chip module welding link to each other.
The chip module still include bottom plate, dop, chip, pin, transition piece, the bottom plate be located the cassette inboard, bottom plate and cassette bonding link to each other, dop quantity be 2, follow the bottom plate bilateral symmetry arranges, the chip be located the bottom plate upper end and be located between the dop of two symmetrical arrangement, the chip still be equipped with the pin, pin and chip welding link to each other, the transition piece be located the bottom plate lower extreme and be located the pin top, transition piece and bottom plate an organic whole link to each other.
The invention is further improved as follows:
furthermore, the glue filling plate is also provided with a positioning hole, and the positioning hole penetrates through the glue filling plate main body.
Furthermore, the glue filling plate is also provided with a glue filling hole, and the glue filling hole penetrates through the glue filling plate main body.
Furthermore, the clamping seat is also provided with a limiting head, the limiting head is positioned at the inner side of the clamping seat, and the limiting head is integrally connected with the clamping seat.
Furthermore, the clamping seat is also provided with a glue filling groove, and the glue filling groove penetrates through the clamping seat.
Further, the clamping seat is also provided with an upper glue storage groove, the upper glue storage groove is positioned at the bottom of the inner side of the clamping seat, and the upper glue storage groove does not penetrate through the clamping seat main body.
Further, the clamping seat is also provided with a lower glue storage groove, the lower glue storage groove is positioned at the bottom of the outer side of the clamping seat, the lower glue storage groove does not penetrate through the clamping seat main body, and the axis of the lower glue storage groove is coincident with the axis of the upper glue storage groove.
Further, the transition piece still include support frame, shell fragment, support frame and bottom plate an organic whole link to each other, the shell fragment run through the support frame and be located the pin top, the shell fragment link to each other with the support frame close-fitting and with copper coil welding link to each other.
Compared with the prior art, this modular chip card, during processing, push down the chip module gently along bottom plate top-down, two symmetrical arrangement's dop is spacing about the chip module and fixed firm, the pin that sets up on the chip module inserts the transition piece lower extreme, at this moment, shell fragment deformation and pin complete contact, afterwards, in impressing the cassette with the chip module, spacing head that sets up on the cassette chucking with the chip module, afterwards, insert the locating head that sets up on the cassette into the locating hole, afterwards, glue solution is poured into the glue solution through glue filling hole downward glue storage inslot, glue solution in the glue filling inslot flows into the glue filling inslot, glue solution solidification back down glue solution in the glue storage inslot is connected cassette and glue filling board, go up glue solution in glue storage inslot and link firmly with the chip module, thereby fix the chip module, fixed, afterwards, fix bone frame plate and glue filling board firm, link with the welding with the copper coil, afterwards, it can to bond with bone frame plate and shell fragment respectively in proper order with the bottom decoration board. The device simple structure adopts the design of modular chip, can fix a position and fix fast, improves the installation accuracy, moreover, adopts the shell fragment that the area is big as the transition piece of pin, effectively reduces the welding degree of difficulty of pin and copper coil, improves welding efficiency, simultaneously, adopts the structural design of being convenient for the encapsulating, effectively improves production efficiency.
Drawings
FIG. 1 shows a schematic view of the structure of the present invention
FIG. 2 shows a top view of the cartridge of the present invention
Fig. 3 shows a top view of a chip module according to the invention
FIG. 4 is a schematic view showing the structure of the transition block according to the present invention
In the figure: bottom decoration plate 1, glue filling plate 2, skeleton board 3, top decoration plate 4, cassette 5, chip module 6, locating head 7, coil groove 8, copper coil 9, locating hole 201, glue filling hole 202, spacing head 501, glue filling groove 502, upper glue storage groove 503, lower glue storage groove 504, bottom plate 601, chuck 602, chip module 603, pin 604, transition piece 605, support frame 606, shell fragment 607.
Detailed Description
As shown in fig. 1, 2, 3 and 4, a modular chip card comprises a bottom decoration plate 1, a glue filling plate 2, a framework plate 3, a top decoration plate 4, a clamping seat 5, a chip module 6, a positioning head 7, a coil groove 8 and a copper coil 9, wherein the glue filling plate 2 is positioned at the upper end of the bottom decoration plate 1, the glue filling plate 2 is in bonding connection with the bottom decoration plate 1, the framework plate 3 is positioned at the upper end of the glue filling plate 2, the framework plate 3 is in bonding connection with the glue filling plate 2, the top decoration plate 4 is positioned at the upper end of the framework plate 3, the top decoration plate 4 is in bonding connection with the framework plate 3, the clamping seat 5 penetrates through the framework plate 3 and is positioned at the top of the glue filling plate 2, the clamping seat 5 is in bonding connection with the glue filling plate 2, the chip module 6 is positioned at the inner side of the clamping seat 5 and is positioned at the lower end of the top decoration plate 4, the chip module 6 is in bonding connection with the clamping seat 5, the clamping seat 5 is also provided with the positioning head 7, the positioning head 7 is integrally connected with the clamping seat 5, the framework plate 3 is also provided with a coil groove 8, the coil groove 8 does not penetrate through the main body of the framework plate 3, the copper coil 9 is positioned in the coil groove 8, the copper coil 9 is connected with the chip module 6 in a welding way, the chip module 6 further comprises a bottom plate 601, clamping heads 602, a chip 603, pins 604 and a transition block 605, the bottom plate 601 is positioned at the inner side of the clamping seat 5, the bottom plate 601 is adhered and connected with the clamping seat 5, the number of the clamping heads is 2, the clamping heads are symmetrically arranged left and right along the bottom plate 601, the chip 603 is positioned at the upper end of the bottom plate 601 and between the clamping heads 602 which are symmetrically arranged, the chip 603 is also provided with pins 604, the pins 604 are connected with the chip 603 in a welding way, the transition block 605 is positioned at the lower end of the bottom plate 601 and at the top of the pins 604, the transition block 605 is integrally connected with the bottom plate 601, the glue filling plate 2 is also provided with a positioning hole 201, the positioning hole 201 penetrates through the main body of the glue filling plate 2, the glue filling plate 2 is also provided with a glue filling hole 202, the glue filling hole 202 penetrates through the main body of the glue filling plate 2, the clamping seat 5 is also provided with a limiting head 501, the limiting head 501 is positioned at the inner side of the clamping seat 5, the clamping seat 5 is also provided with a glue filling groove 502, the glue filling groove 502 penetrates through the clamping seat 5, the clamping seat 5 is also provided with an upper glue storage groove 503, the upper glue storage groove 503 is positioned at the inner bottom of the clamping seat 5, the upper glue storage groove 503 does not penetrate through the main body of the clamping seat 5, the clamping seat 5 is also provided with a lower glue storage groove 504, the lower glue storage groove 504 is positioned at the outer bottom of the clamping seat 5, the lower glue storage groove 504 does not penetrate through the main body of the clamping seat 5, the axis of the lower glue storage groove 504 coincides with the axis of the upper glue storage groove 5, the transition block 605 also comprises a support frame 606 and an elastic sheet, the support frame 606 is integrally connected with the bottom plate 601, the elastic sheet 607 penetrates through the support frame 606 and is positioned at the top of the pin 604, the elastic sheet 607 is tightly connected with the support frame 606 and is welded with the copper coil 9, the modular chip card is characterized in that during processing, the chip module 603 is slightly pushed down from top to bottom along the bottom plate 601, two symmetrical clamping heads 602 limit and fix the chip module 603 left and right firmly, the pin 604 arranged on the chip module 603 is inserted into the lower end of the transition block 605, at the moment, the elastic sheet 607 is deformed and fully contacted with the pin 604, then the chip module 6 is pressed into the clamping seat 5, the limiting head 501 arranged on the clamping seat 5 clamps the chip module 6, then the positioning head 7 arranged on the clamping seat 5 is inserted into the positioning hole 201, and then glue solution is filled into the glue storage groove 504 downwards through the glue filling hole 202, glue solution flows into the upper glue storage groove 503 through the glue filling groove 502, after the glue solution is solidified, the glue solution in the lower glue storage groove 504 connects the clamping seat 5 with the glue filling plate 2, the glue solution in the upper glue storage groove 503 fixedly connects the clamping seat 5 with the chip module 6, so that the chip module 6 is positioned and fixed, then, the framework plate 3 and the glue filling plate 2 are fixedly and firmly fixed, the copper coil 9 and the elastic sheet 607 are welded and connected, and then, the top decoration plate 4 and the bottom decoration plate 1 are respectively and sequentially bonded and fixedly connected with the framework plate 3 and the glue filling plate 2. The device simple structure adopts the design of module type chip, can fix a position and fix fast, improves the installation accuracy, moreover, adopts the large-area shell fragment 607 as the transition piece of pin 604, effectively reduces the welding degree of difficulty of pin 604 and copper coil 9, improves welding efficiency, simultaneously, adopts the structural design of being convenient for the encapsulating, effectively improves production efficiency.
The present invention is not limited to the above-described specific embodiments, and various modifications may be made by those skilled in the art without inventive effort from the above-described concepts, and are within the scope of the present invention.
Claims (6)
1. The utility model provides a modular chip card, its characterized in that includes bottom decoration board, encapsulating board, bone plate, top decoration board, cassette, chip module, locating head, coil groove, copper coil, encapsulating board be located bottom decoration board upper end, encapsulating board and bottom decoration board bonding link to each other, the bone plate be located encapsulating board upper end, bone plate and encapsulating board bonding link to each other, top decoration board be located bone plate upper end, top decoration board and bone plate bonding link to each other, the cassette run through bone plate and be located encapsulating board top, cassette and encapsulating board bonding link to each other, chip module be located the cassette inboard and be located top decoration board lower extreme, chip module and cassette bonding link to each other, the cassette still be equipped with the locating head, locating head and cassette an organic whole link to each other, bone plate still be equipped with the coil groove, the coil groove not run through bone plate main part, copper coil be located the coil groove, copper coil and chip module bonding link to each other;
the chip module also comprises a bottom plate, clamping heads, chips, pins and transition blocks, wherein the bottom plate is positioned at the inner side of the clamping seat, the bottom plate is connected with the clamping seat in an adhering way, the number of the clamping heads is 2, the clamping heads are symmetrically arranged left and right along the bottom plate, the chips are positioned at the upper end of the bottom plate and between the two clamping heads which are symmetrically arranged, the chips are also provided with the pins, the pins are connected with the chips in a welding way, the transition blocks are positioned at the lower end of the bottom plate and at the tops of the pins, and the transition blocks are integrally connected with the bottom plate;
the transition block also comprises a support frame and an elastic piece, wherein the support frame is integrally connected with the bottom plate, the elastic piece penetrates through the support frame and is positioned at the top of the pin, and the elastic piece is tightly connected with the support frame and is welded with the copper coil;
the glue filling plate is also provided with a positioning hole, and the positioning hole penetrates through the glue filling plate main body.
2. The modular chip card of claim 1, wherein the glue-pouring plate is further provided with glue-pouring holes, and the glue-pouring holes penetrate through the main body of the glue-pouring plate.
3. The modular chip card of claim 1, wherein the holder further comprises a positioning head, the positioning head is located inside the holder, and the positioning head is integrally connected with the holder.
4. The modular chip card of claim 1, wherein the holder further comprises a glue slot, the glue slot extending through the holder.
5. The modular chip card of claim 1, wherein the holder further comprises an upper glue reservoir, the upper glue reservoir being located at the bottom of the inside of the holder, the upper glue reservoir not extending through the holder body.
6. The modular chip card of claim 1, wherein the holder further comprises a lower glue reservoir, the lower glue reservoir is located at the bottom of the outside of the holder, the lower glue reservoir does not penetrate the holder body, and the axis of the lower glue reservoir coincides with the axis of the upper glue reservoir.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810038066.8A CN108108803B (en) | 2018-01-16 | 2018-01-16 | Modular chip card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810038066.8A CN108108803B (en) | 2018-01-16 | 2018-01-16 | Modular chip card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108108803A CN108108803A (en) | 2018-06-01 |
| CN108108803B true CN108108803B (en) | 2024-04-16 |
Family
ID=62219353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810038066.8A Active CN108108803B (en) | 2018-01-16 | 2018-01-16 | Modular chip card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108108803B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101341499A (en) * | 2005-12-05 | 2009-01-07 | 斯迈达Ip有限公司 | Chip card and method for production of a chip card |
| CN203706200U (en) * | 2013-12-26 | 2014-07-09 | 武汉光谷电气有限公司 | Simple chip program burning device |
| CN205657905U (en) * | 2016-01-30 | 2016-10-19 | 东洋通信技术（深圳）有限公司 | Modularization multilayer circuit board of accuracy of counterpointing |
| CN106779032A (en) * | 2016-12-28 | 2017-05-31 | 郑州单点科技软件有限公司 | A kind of electronic chip card |
| CN107578083A (en) * | 2017-08-18 | 2018-01-12 | 深圳市文鼎创数据科技有限公司 | Smart card and its manufacture method |
| CN207663471U (en) * | 2018-01-16 | 2018-07-27 | 梵利特智能科技（苏州）有限公司 | A kind of modular chip card |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10058804C2 (en) * | 2000-11-27 | 2002-11-28 | Smart Pac Gmbh Technology Serv | Chip module and chip card module for producing a chip card |
| US7325745B2 (en) * | 2005-04-25 | 2008-02-05 | Alcor Micro, Corp. | Card reader assembly |
-
2018
- 2018-01-16 CN CN201810038066.8A patent/CN108108803B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101341499A (en) * | 2005-12-05 | 2009-01-07 | 斯迈达Ip有限公司 | Chip card and method for production of a chip card |
| CN203706200U (en) * | 2013-12-26 | 2014-07-09 | 武汉光谷电气有限公司 | Simple chip program burning device |
| CN205657905U (en) * | 2016-01-30 | 2016-10-19 | 东洋通信技术（深圳）有限公司 | Modularization multilayer circuit board of accuracy of counterpointing |
| CN106779032A (en) * | 2016-12-28 | 2017-05-31 | 郑州单点科技软件有限公司 | A kind of electronic chip card |
| CN107578083A (en) * | 2017-08-18 | 2018-01-12 | 深圳市文鼎创数据科技有限公司 | Smart card and its manufacture method |
| CN207663471U (en) * | 2018-01-16 | 2018-07-27 | 梵利特智能科技（苏州）有限公司 | A kind of modular chip card |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108108803A (en) | 2018-06-01 |
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