CN108107998A - Be gas-cooled radiator - Google Patents

Abstract

This case provides a kind of air cooling radiator, to electronic element radiating.The radiator that is gas-cooled includes carrier and gas pump.Carrier includes air flow passage, air guide end opening and exhaust end opening, wherein carrier the cover electronic component and the electronic component is made to be located in air flow passage.Gas pump is fixedly arranged on carrier, and closing air guide end opening, wherein by driving gas pump, air-flow is imported into the air flow passage via air guide end opening and heat exchange is carried out to electronic component, and the air-flow after heat exchange will be carried out with electronic component via exhaust end opening discharge.

Description

Be gas-cooled radiator

【Technical field】

This case be on a kind of air cooling radiator, it is espespecially a kind of using gas pump to provide certain driving air-flow to radiate Be gas-cooled radiator.

【Background technology】

With the development of science and technology various electronic equipments such as portable computer, tablet computer, industrial computer, portable logical Device, audio and video player etc. are interrogated towards lightening, portable and dynamical trend development, these electronic equipments are limited in its Various high integrations or high-power electronic component must be configured in inner space, in order to make the arithmetic speed of electronic equipment faster With it is with better function, the electronic component of electronic equipment internal will generate more thermal energy when running, and cause high temperature.In addition, These electronic equipments are largely all designed as frivolous, the flat and compact external form of tool, and are used to radiate without additional inner space Cooling, therefore the electronic component in electronic equipment is vulnerable to the influence of thermal energy, high temperature, and then the problems such as cause interference with or be damaged.

In general, the radiating mode of electronic equipment internal can be divided into active heat dissipation and passive heat radiation.It is active to dissipate Hot generally use tube-axial fan or blast type fan are arranged at electronic equipment internal, by tube-axial fan or blast type fan Certain driving air-flow by heat energy transfer caused by electronic equipment internal electronic component, radiates in order to realizing.However, tube-axial fan And blast type fan can generate larger noise in running, and its volume is larger is not easy to be thinned and minimize, moreover axis stream The service life of formula fan and blast type fan is shorter, thus traditional tube-axial fan and blast type fan be not particularly suited for it is frivolous Heat dissipation is realized in change and portable electronic equipment.

Furthermore many electronic components can utilize for example surface mount technology (Surface Mount Technology, SMT), the technologies such as Selective Soldering (Selective Soldering) are welded in printed circuit board (PCB) (Printed Circuit Board, PCB) on, however the electronic component welded using foregoing welding manner, it is in high thermal energy, high temperature ring in through a long time Under border, easily electronic component is made to be separated with printed circuit board (PCB), and most of electronic component also non-refractory, if electronic component is long Time is under high thermal energy, hot environment, easily leads to the decline of performance stability and the reduced lifetime of electronic component.

Fig. 1 is for the structure diagram of traditional heat-dissipating mechanism.As shown in Figure 1, traditional heat-dissipating mechanism is dissipated for a passive type Heat engine structure, including thermal transfer plate 12, which is by a heat-conducting glue 13 and 11 phase of electronic component to be radiated Fitting, by the heat conduction path that heat-conducting glue 13 and thermal transfer plate 12 are formed, electronic component 11 can be made using heat transfer and Free convection mode reaches heat dissipation.However, the radiating efficiency of foregoing cooling mechanism is poor, application demand can not be met.

In view of this, it is really necessary to develop a kind of air cooling radiator, to solve prior art problem encountered.

【The content of the invention】

This case is designed to provide a kind of air cooling radiator, various electronic equipments is can be applied to, to be set to electronics Standby internal electronic component radiates, and in order to heat radiation efficiency, reduces noise, and makes the property of electronic equipment internal electronic component It can stablize and prolong the service life.

The another object of this case is to provide a kind of air cooling radiator, can be according to electronic equipment with function of temperature control The temperature change of internal electronic element controls the running of gas pump, in order to heat radiation efficiency and extends air cooling radiator Service life.

In order to achieve the above object, a broader pattern of implementing of this case is to provide a kind of air cooling radiator, for electronics Element radiating.The radiator that is gas-cooled includes carrier and gas pump.Carrier includes air flow passage, air guide end opening and exhaust End opening, wherein carrier the cover electronic component and the electronic component is made to be located in air flow passage.Gas pump is to be fixedly arranged on load On body, and air guide end opening is closed, wherein by driving gas pump, air-flow is imported into airflow via air guide end opening and is led to Road simultaneously carries out heat exchange to electronic component, and the air-flow after heat exchange will be carried out with electronic component via exhaust end opening discharge.

In order to achieve the above object, another broader implementation pattern of this case is to carry a kind of air cooling radiator, for electronics Element radiating.Air cooling radiator includes:Carrier, radiator and gas pump.Carrier includes air flow passage, air guide end is opened Mouthful and exhaust end opening, wherein carrier the cover electronic component and the electronic component is made to be located in air flow passage.Radiator is It is arranged on the electronic component and positioned at air flow passage.Gas pump is fixedly arranged on carrier, and closes air guide end opening, In by driving gas pump, air-flow is imported into air flow passage via air guide end opening and hot friendship is carried out to the electronic component It changes, and the air-flow after heat exchange will be carried out with the electronic component via exhaust end opening discharge.

【Description of the drawings】

Fig. 1 is the structure diagram of traditional heat-dissipating mechanism.

Fig. 2A is the structure diagram of the air cooling radiator of this case first embodiment.

Fig. 2 B are the air cooling radiator shown in Fig. 2A in the structure diagram of Section A-A.

Fig. 3 is the cross section structure schematic diagram of the air cooling radiator of this case second embodiment.

Fig. 4 A and 4B are respectively decomposition texture schematic diagram of the gas pump in different visual angles of this case preferred embodiment.

Fig. 5 is the cross-sectional view of the piezoelectric actuator shown in Fig. 4 A and 4B.

Fig. 6 is the cross-sectional view of the gas pump shown in Fig. 4 A and 4B.

Fig. 7 A are to the flowage structure figure that 7E figures are gas pump start shown in Fig. 4 A and 4B.

Fig. 8 is the configuration diagram of the air cooling radiator of this case 3rd embodiment.

【Specific embodiment】

Embodying some exemplary embodiments of this case features and advantages will in detail describe in the explanation of back segment.It should be understood that This case can have various variations in different aspects, all not depart from the scope of this case, and explanation therein and diagram It is inherently illustrated as being used, and nand architecture is in limitation this case.

Fig. 2A is the structure diagram of the air cooling radiator of this case first embodiment and Fig. 2 B are gas shown in Fig. 2A Cooling and radiation device is in the structure diagram in AA sections.As shown in figs. 2 a and 2b, the air cooling radiator 2 of this case can be applied to an electricity Sub- equipment, such as, but not limited to portable computer, tablet computer, industrial computer, portable communication device, audio and video player, with It radiates to electronic component 3 to be radiated in electronic equipment.The air cooling radiator 2 of this case includes carrier 20 and gas pump 22, wherein carrier 20 includes air guide end opening 23, exhaust end opening 24 and air ventilation passage 25.Carrier 20 is the cover in electricity Subcomponent 3, and the electronic component 3 is made to be located in air flow passage 25.Gas pump 22 is fixedly arranged on carrier 20, and is assembled and determined Positioned at air guide end opening 23, and close the air guide end opening 23.Wherein by driving gas pump 22, by air-flow via air guide End opening 23 imports air flow passage 25 and carries out heat exchange to electronic component 3, and will carry out heat exchange with the electronic component 3 Air-flow afterwards is discharged via exhaust end opening 24, in order to the heat dissipation realized to electronic component 3.

In some embodiments, carrier 20 is to be connected with group by the plurality of thermal insulation board 27 and formed, and multiple thermal insulation boards 27 are fixed Justice forms the air ventilation passage 25, the air guide end opening 23 and the exhaust end opening 24.Gas pump 22 is to be fixedly arranged on carrier 20 Thermal insulation board 27 on.20 the cover of the carrier electronic component 3, and air guide end opening 23 is correspondingly arranged with electronic component 3.In some In embodiment, wherein electronic component 3 is disposed in thermal transfer plate 4, and the heat conduction path that can pass through thermal transfer plate 4 is dissipated Heat.The thermal insulation board 27 of carrier 20 is connected to thermal transfer plate 4.Thermal transfer plate 4 is made of high heat-conduction coefficient material, which passes It can be to be such as, but not limited to electrographite to lead coefficient material.

In this present embodiment, gas pump 22 is for a piezoelectric actuated gas pump, is moved to drive gas flow, by gas by The outside of air cooling radiator 2 is imported via air guide end opening 23 in air ventilation passage 25.When gas pump 22 introduces gas into During air ventilation passage 25, import gas and carry out heat exchange with the electronic component 3 in carrier 20, and promote air ventilation passage Gas in 25 quickly flows, and promotes the air-flow after heat exchange that thermal energy is drained into air cooling radiator 2 via exhaust end opening 24 It is external.Since gas pump 22 is continuously start to import gas, make electronic component 3 that can carry out heat with the gas being continuously introduced into It exchanges, while the air-flow after heat exchange is made to be discharged via exhaust end opening 24, can realize the heat dissipation to electronic component 3 whereby, and Heat dissipation can be improved, and then increases performance stability and the service life of electronic component 3.

Fig. 3 is the cross section structure schematic diagram of the air cooling radiator of this case second embodiment.As shown in figure 3, the present embodiment Similar and identical to the air cooling radiator 2 shown in Fig. 2 B radiator 2a element numbers of air cooling represent identical structure, Element and function, repeat no more in this.Compared to the air cooling radiator 2 shown in Fig. 2 B, the air cooling radiator of the present embodiment 2a further includes a radiator 29, is connected in the surface of electronic component 3 and in air ventilation passage 25.Radiator 29 wraps A pedestal 291 and multiple cooling fins 292 are included, pedestal 291 is attached at the surface of electronic component 3, and multiple cooling fins 292 are vertically to connect It is connected to pedestal 291.By the setting of radiator 29, heat dissipation area can be increased, make thermal energy caused by electronic component 3 can be via scattered Hot device 29 and in air ventilation passage 25 gas carry out heat exchange, in order to heat radiation efficiency.

Fig. 4 A and 4B are respectively decomposition texture schematic diagram of the gas pump in different visual angles of this case preferred embodiment, and Fig. 5 is The cross-sectional view and Fig. 6 of piezoelectric actuator shown in Fig. 4 A and 4B are the section of the gas pump shown in Fig. 4 A and 4B Structure diagram.As shown in Fig. 4 A, 4B, 5 and 6, gas pump 22 be for a piezoelectric actuated gas pump, and including inlet plate 221, altogether It shakes the structures such as piece 222, piezoelectric actuator 223, insulating trip 2241,2242 and conductive sheet 225, wherein piezoelectric actuator 223 is pair It should be set in resonance plate 222, and make inlet plate 221, resonance plate 222, piezoelectric actuator 223, insulating trip 2241, conductive sheet 225 and 2242 grade of another insulating trip sequentially stack setting, the sectional view being completed is as shown in Figure 6.

In this present embodiment, inlet plate 221 has an at least air admission hole 221a, and wherein the quantity of air admission hole 221a is with 4 To be preferable, but not limited to this.Air admission hole 221a is through inlet plate 221, and atmospheric pressure is complied with from outside device to supplied gas Effect and from an at least air admission hole 221a inflow gas pump 22 among.There is at least one confluence round on inlet plate 221 221b, to this with 221 another surface of inlet plate, at least an air admission hole 221a is correspondingly arranged.In the center of confluence round 221b It is with central recess 221c at exchange, and central recess 221c is connected with confluence round 221b, whereby can will be from this extremely The gas that a few air admission hole 221a enters confluence round 221b guide and converged and is concentrated to central recess 221c, to realize gas biography It passs.In this present embodiment, inlet plate 221 has integrally formed air admission hole 221a, confluence round 221b and central recess 221c, And the confluence chamber of a confluence gas is correspondingly formed at central recess 221c, it is kept in supplied gas.In some embodiments, The material of inlet plate 221 can be formed by such as, but not limited to stainless steel.In other embodiments, by the central recess The depth of the confluence chamber formed at 221c is identical with the depth for the round 221b that converges, and but not limited to this.Resonance plate 222 is It is made of a flexible materials, but not limited to this, and in having a hollow bore 2220 on resonance plate 222, corresponds to The central recess 221c of inlet plate 221 and set so that gas circulate.In other embodiments, resonance plate 222 is can be by one Copper material is formed, and but not limited to this.

Piezoelectric actuator 223 is by a suspension board 2231, at least an outline border 2232, a stent 2233 and a piezoelectric patches 2234 assemble jointly, wherein, which is attached at the first surface 2231c of suspension board 2231, to apply Voltage generate deformation with drive 2231 bending vibration of suspension board and this at least a stent 2233 is to be connected to suspension board 2231 And between outline border 2232, in this present embodiment, which be connected between suspension board 2231 and outline border 2232, Its two-end-point is to be connected to outline border 2232, suspension board 2231, to provide resilient support, and in stent 2233, suspension board With more an at least gap 2235 between 2231 and outline border 2232, at least a gap 2235 is connected with air guide end opening 23 for this It is logical, it circulates to supplied gas.It is emphasized that suspension board 2231, the kenel of outline border 2232 and stent 2233 and quantity not with Previous embodiment is limited, and can change according to practical application request.In addition, outline border 2232 is to surround to be arranged at outside suspension board 2231 Side, and the conductive connecting pin 2232c with an outside projection, to be used for electrical connection, but not limited to this.

Suspension board 2231 is the structure (as shown in Figure 5) for a cascaded surface, is implied that in the second surface of suspension board 2231 2231b has more a protrusion 2231a, and protrusion 2231a can be but not be limited to a circular protrusions structure.The protrusion of suspension board 2231 2231a is the second surface 2232a coplines with outline border 2232, and the second surface 2231b of suspension board 2231 and stent 2233 Second surface 2233a also for copline, and the second surface 2232a of the protrusion 2231a of the suspension board 2231 and outline border 2232 It is that there is a certain depth between the second surface 2231b of suspension board 2231 and the second surface 2233a of stent 2233.It suspends The first surface 2231c of plate 2231 is with the first surface 2232b of outline border 2232 and the first surface 2233b of stent 2233 Smooth coplanar structure, and piezoelectric patches 2234 is then attached at the first surface 2231c of this smooth suspension board 2231.In another In some embodiments, the kenel of suspension board 2231 also can be a two-sided smooth plate square structure, be not limited thereto, can Appoint according to situation is actually applied and apply variation.In some embodiments, suspension board 2231, stent 2233 and outline border 2232 are can The structure being integrally formed, and can be made of a metallic plate, such as, but not limited to stainless steel is formed.Again in other In embodiment, the length of side of piezoelectric patches 2234 is less than the length of side of the suspension board 2231.In other embodiments, piezoelectric patches 2234 length of side is equal to the length of side of suspension board 2231, and same design is and the corresponding square plate knot of suspension board 2231 Structure, but be not limited thereto.

Insulating trip 2241, conductive sheet 225 and another insulating trip 2242 of gas pump 22 are sequentially to be correspondingly arranged in piezoelectricity cause Under dynamic device 223, and its form approximately corresponds to the form of the outline border 2232 of piezoelectric actuator 223.In some embodiments, Insulating trip 2241,2242 is made of isolation material, such as, but not limited to plastic cement, in order to offer insulation function.In other realities It applies in example, conductive sheet 225 can be made of conductive material, such as, but not limited to metal material, and function is conducted to provide.Yu Ben In embodiment, a conductive connecting pin 225a on conductive sheet 225 can be also set, function is conducted to realize.

In this present embodiment, gas pump 22 is sequentially by inlet plate 221, resonance plate 222, piezoelectric actuator 223, insulating trip 2241st, conductive sheet 225 and another insulating trip 2242 etc. stack, and are tools between resonance plate 222 and piezoelectric actuator 223 There is a gap h, be the gap h between resonance plate 222 and 2232 periphery of outline border of piezoelectric actuator 223 in this present embodiment In insert a filling material, such as, but not limited to conducting resinl, so that the suspension board 2231 of resonance plate 222 and piezoelectric actuator 223 Protrusion 2231a between can maintain the depth of gap h, and then air-flow can be guided and more quickly flowed, and because of suspension board 2231 Protrusion 2231a and resonance plate 222 the suitable distance interference that makes to be in contact with each other is kept to reduce, promote noise generation that can be lowered.In It, also can be by the height for the outline border 2232 for increasing piezoelectric actuator 223, so that it is 222 groups with resonance plate in other embodiments Increase by a gap during dress, but not limited to this.

In this present embodiment, after inlet plate 221, resonance plate 222 are with the sequentially corresponding assembling of piezoelectric actuator 223, in altogether The piece 222 that shakes has and can be collectively formed at a movable part 222a and a fixed part 222b, movable part 222a with inlet plate 221 thereon The chamber of one confluence gas, and a first chamber 220 is more formed between resonance plate 222 and piezoelectric actuator 223, it is configured to temporarily store Gas, and first chamber 220 be through resonance plate 222 hollow bore 2220 and at the central recess 221c of inlet plate 221 Chamber be connected, and the both sides of first chamber 220 then by the gap 2235 between the stent 2233 of piezoelectric actuator 223 and with The air guide end opening 23 being arranged under it is connected.

The flowage structure figure for the gas pump start that 7A is 4A to 7E figures and 4B figures are shown.Fig. 6, Fig. 7 A are referred to figure 7E, the start process description of the gas pump of this case are as follows.When gas pump 22 carries out start, piezoelectric actuator 223 is caused by voltage It moves with stent 2233 for fulcrum, carries out the reciprocating vibration of vertical direction.As shown in Figure 7 A, when piezoelectric actuator 223 is by electricity Pressure actuating and when vibrating downwards, since resonance plate 222 is for light, thin laminated structure, vibrated with working as piezoelectric actuator 223 When, resonance plate 222 also can with resonance and carry out vertical reciprocating vibration, be that resonance plate 222 corresponds to central recess 221c Part also can with bending vibration deformation, i.e. the part of correspondence central recess 221c is for the movable part of resonance plate 222 222a is so that when piezoelectric actuator 223 is bent downwardly vibration, resonance plate 222 corresponds to the movable part of central recess 221c at this time 222a can be because of the drive brought into and pushed and piezoelectric actuator 223 vibrates of gas, and as piezoelectric actuator 223 is turned under Qu Zhendong deformation, then gas is entered by at least air admission hole 221a on inlet plate 221, and penetrates at least one confluence round 221b To be pooled at the central recess 221c in center, then via the hollow hole being correspondingly arranged on resonance plate 222 with central recess 221c Hole 2220 is flowed downwardly into first chamber 220.Thereafter, due to being driven by 223 vibration of piezoelectric actuator, resonance plate 222 is also Can with resonance and carry out vertical reciprocating vibration, as shown in Figure 7 B, at this time the movable part 222a of resonance plate 222 also with to Lower vibration, and attach on the protrusion 2231a of the suspension board 2231 for contacting at piezoelectric actuator 223, make the protrusion of suspension board 2231 The spacing of confluence chamber between the fixed part 222b of 222 both sides of region and resonance plate beyond 2231a will not become smaller, and by The deformation of this resonance plate 222 to compress the volume of first chamber 220, and is closed 220 middle flow space of first chamber, is promoted Gas in it is pushed to be flowed to both sides, and then downward by the gap 2235 between the stent 2233 of piezoelectric actuator 223 Pass through flowing.Afterwards, as seen in figure 7 c, the movable part 222a of resonance plate 222 is bent upwards vibration deformation, and returns back to initial bit Put, and piezoelectric actuator 223 is driven by voltage to vibrate upwards, the so similary volume for squeezing first chamber 220, only at this time by It is upward lifting in piezoelectric actuator 223, so that the gas in first chamber 220 can be flowed towards both sides, and gas continues Ground enters from at least air admission hole 221a on inlet plate 221, then flows into the chamber that central recess 221c is formed.Afterwards, As illustrated in fig. 7d, which is resonated upwards by the vibration of 223 upward lifting of piezoelectric actuator, at this time resonance plate 222 Movable part 222a also with upward vibration, and then mitigation of gases constantly from at least air admission hole 221a on inlet plate 221 into Enter, then flow into the chamber that central recess 221c is formed.Finally, as seen in figure 7e, the movable part 222a of resonance plate 222 is also returned Again to initial position, thus knowable to embodiment aspect, when resonance plate 222 carries out vertical reciprocating vibration, being can be by itself and pressure Gap h between electric actuator 223 is to increase the maximum range of its vertical displacement, in other words, is set between two structure Gap h can make resonance plate 222 that can generate upper and lower displacement by a larger margin when resonance.Therefore in the runner through this gas pump 22 Barometric gradient is generated in design, makes gas flow at high rates, and through runner into the resistance difference of outgoing direction, by gas by suction side Outlet side is transmitted to, to complete gas conveying operation, even if in a state that outlet side has air pressure, still has the ability to continue gas Air ventilation passage 25 is pushed into, and can reach mute effect, so repeats gas pump 22 starts of the 7A to 7E figures, you can make Gas pump 22 generates the gas transport of an ecto-entad.

From the above, through the start of above-mentioned gas pump 22, air ventilation passage 25 is introduced gas into, makes imported gas Heat exchange is carried out with electronic component 3, and the gas in air ventilation passage 25 is promoted quickly to flow, promotes the gas after heat exchange It is external that thermal energy by exhaust end opening 24 is drained into air cooling radiator 2, whereby to improve the efficiency of cooling, Jin Erzeng Power up performance stability and the service life of subcomponent 3.

Fig. 8 is the configuration diagram of the air cooling radiator of this case 3rd embodiment.As shown in figure 8, the gas of the present embodiment Element numbers similar and identical to the air cooling radiator 2 shown in Fig. 2 B cooling and radiation device 2b represent identical structure, element With function, repeated no more in this.Compared to the air cooling radiator 2 shown in Fig. 2 B, the air cooling radiator 2c of the present embodiment is With function of temperature control, control system 21 is further included, which includes control unit 211 and temperature sensor 212, Middle control unit 211 is electrically connected with gas pump 22, to control the running of gas pump 22.Temperature sensor 212 is disposed on carrying In body 20, and electronic component 3 is adjacent to, for the temperature near sensing electronic component 3 or is attached directly to electronic component 3 temperature of electronic component is sensed on 3.Temperature sensor 212 is electrically connected to control unit 211, senses the temperature of electronic component 3, And sensing signal is transmitted to control unit 211.Sensing signal of the control unit 211 according to temperature sensor 212, judges the electricity Whether the temperature of subcomponent 3 is higher than a temperature threshold value, when control unit 211 judges that the temperature of the electronic component 3 is higher than the temperature When spending threshold value, a control signal is sent to gas pump 22, is operated with enable gas pump 22, makes 22 certain driving air-flow of gas pump whereby Flowing to electronic component 3 to carry out cooling, so that 3 cooling of electronic component and reducing temperature.When control unit 211 is sentenced When the temperature of the disconnected electronic component 3 is less than the temperature threshold value, a control signal is sent to gas pump 22, to stop gas pump 22 Running, can avoid 22 continued operation of gas pump and cause reduced lifetime, reduce the consume of additional energy whereby.Therefore through The setting of control system 21, make the gas pump 22 of air cooling radiator 2 can carry out radiating when 3 temperature overheating of electronic component it is cold But, and after the reduction of 3 temperature of electronic component stop operating, 22 continued operation of gas pump can be avoided whereby and cause reduced lifetime, The consume of additional energy is reduced, electronic component 3 can also operated under a preferred temperature environment, improves the steady of electronic component 3 Fixed degree.

In conclusion this case provides a kind of air cooling radiator, various electronic equipments are can be applied to its inside Electronic element radiating in order to heat radiation efficiency, reduces noise, and makes the performance of electronic equipment internal electronic component stable and extend Service life.In addition, the air cooling radiator of this case, it, can be according to electronic equipment internal electronic component with function of temperature control Temperature change controls the running of gas pump, in order to heat radiation efficiency and the service life of extension radiator.

This case appointed as person familiar with the technology apply craftsman think and be it is all as modification, it is so neither de- such as attached claim Be intended to Protector.

【Symbol description】

11：Electronic component

12：Thermal transfer plate

13：Heat-conducting glue

2：Be gas-cooled radiator

20：Carrier

22：Gas pump

220：First chamber

221：Inlet plate

221a：Air admission hole

221b：Converge round

221c：Central recess

222：Resonance plate

222a：Movable part

222b：Fixed part

2220：Hollow bore

223：Piezoelectric actuator

2231：Suspension board

2231a：Protrusion

2231b：Second surface

2231c：First surface

2232：Outline border

2232a：Second surface

2232b：First surface

2232c：Conductive connecting pin

2233：Stent

2233a：Second surface

2233b：First surface

2234：Piezoelectric patches

2235：Gap

2241、2242：Insulating trip

225：Conductive sheet

225a：Conductive connecting pin

23：Air guide end opening

24：It is vented end opening

25：Air ventilation passage

27：Thermal insulation board

29：Radiator

291：Pedestal

292：Cooling fin

3：Electronic component

4：Thermal transfer plate

21：Control system

211：Control unit

212：Temperature sensor

Claims (9)

1. a kind of air cooling radiator, to an electronic element radiating, which is characterized in that the air cooling radiator includes：

One carrier, including an air flow passage, an air guide end opening and an exhaust end opening, wherein the carrier the cover electronics Element and the electronic component is made to be located in the air flow passage；And

One gas pump is fixedly arranged on the carrier, and closes the air guide end opening, wherein by the gas pump is driven, by air-flow The air flow passage is imported via air guide end opening and heat exchange is carried out to the electronic component, and will be carried out with the electronic component Air-flow after heat exchange is discharged via the exhaust end opening.

2. air cooling radiator as described in claim 1, which is characterized in that the carrier connects to define including multiple thermal insulation board groups The air flow passage, the air guide end opening and the exhaust end opening are formed, the air guide end opening is corresponding with the electronic component to be set It puts.

3. air cooling radiator as described in claim 1, which is characterized in that the gas pump is a piezoelectric actuated gas pump.

4. air cooling radiator as claimed in claim 3, which is characterized in that the piezoelectric actuated gas pump includes：

One inlet plate has an at least air admission hole, at least one confluence round and the central recess for forming a confluence chamber, wherein For an at least air admission hole for importing air-flow, which corresponds to the air admission hole, and the air-flow of the air admission hole is guided to converge into this The confluence chamber that central recess is formed；

There is one resonance plate a hollow hole to correspond to the confluence chamber, and be a movable part around the hollow hole；And

One piezoelectric actuator, setting corresponding with the resonance plate；

Wherein, between the resonance plate and the piezoelectric actuator there is a gap to form a chamber, so that the piezoelectric actuator is driven When dynamic, air-flow is made to be imported by an at least air admission hole for the inlet plate, the central recess is collected to through at least one confluence round, The hollow hole of the resonance plate is passed through, to enter in the chamber, is generated by the movable part of the piezoelectric actuator and the resonance plate Resonance transfer air-flow.

5. air cooling radiator as claimed in claim 4, which is characterized in that the piezoelectric actuator includes：

One suspension board has a first surface and a second surface, and flexible vibration；

One outline border, around the outside for being arranged at the suspension board；

An at least stent is connected between the suspension board and the outline border, to provide resilient support；And

One piezoelectric patches has a length of side, which is less than or equal to a length of side of the suspension board, and the piezoelectric patches is to be attached at On one first surface of the suspension board, to apply voltage to drive the suspension board bending vibration.

6. air cooling radiator as claimed in claim 5, which is characterized in that the suspension board is a square suspension board, and is had There is a protrusion.

7. as claimed in claim 4 air cooling radiator, which is characterized in that the piezoelectric actuated gas pump include a conductive sheet, One first insulating trip and one second insulating trip, the wherein inlet plate, the resonance plate, the piezoelectric actuator, first insulating trip, The conductive sheet and second insulating trip are sequentially to stack to set.

8. air cooling radiator as described in claim 1, further includes a control system, which includes：

One control unit is electrically connected to the gas pump, the gas pump to be controlled to operate；And

One temperature sensor is electrically connected to the control unit and is adjacent to the electronic component, to sense the one of electronic component temperature It spends to export a sensing signal to the control unit；

Wherein, when the control unit is in receiving the sensing signal, and judge that the temperature of the electronic component is more than a temperature door During threshold value, which makes the gas pump enable, is flowed with certain driving air-flow and when the control unit is in receiving the sensing Signal, and judge the electronic component the temperature be less than the temperature threshold value when, which makes the gas pump stop operating.

9. a kind of air cooling radiator, for an electronic element radiating, which is characterized in that the air cooling radiator includes:

One carrier, including an air flow passage, an air guide end opening and an exhaust end opening, wherein the carrier the cover electronics Element and the electronic component is made to be located in the air flow passage；

One radiator is arranged on the electronic component and positioned at the air flow passage；And

One gas pump is fixedly arranged on the carrier, and closes the air guide end opening, wherein by the gas pump is driven, by air-flow The air flow passage is imported via air guide end opening and heat exchange is carried out to the electronic component, and will be carried out with the electronic component Air-flow after heat exchange is discharged via the exhaust end opening.