CN107968101A - A kind of high definition LED display modular structure and its manufacture method - Google Patents
A kind of high definition LED display modular structure and its manufacture method Download PDFInfo
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- CN107968101A CN107968101A CN201711436805.0A CN201711436805A CN107968101A CN 107968101 A CN107968101 A CN 107968101A CN 201711436805 A CN201711436805 A CN 201711436805A CN 107968101 A CN107968101 A CN 107968101A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The invention discloses a kind of high definition LED display modular structure, including：Substrate；It is arranged on the LED pixel array of the M rows N row in first face of substrate；It is covered in the sealant layer in the first face of the LED pixel array and the substrate；The first light-shielding structure being arranged between LED pixel described in adjacent rows, and the second light-shielding structure being arranged between the adjacent two row LED pixel.
Description
Technical field
The present invention relates to technical field of LED display, more particularly to a kind of high definition LED display modular structure and its manufacturer
Method.
Background technology
Since 2000, China LED shows application industry stable development, and total size rises year by year, at present into
For the important component in LED industry chain, the LED using LED display as representative shows that application product is each in social economy
Field is widely applied, and LED shows the emerging production that application industry has become advantage and characteristic is obvious, development is thriving
Industry.
With the driving of application market, high density, the fine definition Display Technique of LED display become the heat studied at present
Point.But the production method of traditional LED display, using the method as shown in 100 structures in Fig. 1, it is necessary first to by LED core
Piece encapsulation is fabricated to LED light 102, then LED light 102 is installed or pasted is welded to the correspondence position of PCB substrate 101 and (generally deposits
In installation frame), the size of the LED light of this method is larger, can not accomplish that high definition is shown, it is 0.8mm that can not such as accomplish spacing
Or the display screen of more high definition；This kind of method is due to the making of LED light, the making of substrate package frame, its industry produced at the same time
Chain is longer, and cost of manufacture is higher.
The production method of another kind display screen uses COB packing forms at present, is sealed for the COB of full color LED display
Dress, as shown in Fig. 2, first, each pixel is installed on package substrate 201, includes the LED chip of tri- colors of RGB in COB encapsulation,
Then by fluid sealant (such as resin) by chip integral sealing.The packaged chip of this scheme can there are leakage as shown in Figure 3
Optical issue, as shown in figure 3,3 adjacent pixels 2021,2022,2023 (each pixel generally has 3 RGB chips), each
Corresponding region above pixel is 3041,3042,3043, in actual displayed, such as 2022 illuminating state of pixel 2021 and pixel,
And pixel 2023 is non-illuminating state, several leakage problems are there is：The light of pixel 2021 can drain to pixel by fluid sealant 303
2022 region 3042；The light of pixel 2022 can also drain to the region 3042 of pixel 2021 by fluid sealant 303；Pixel 2022
Light can also drain to the region 3043 of pixel 2023 by fluid sealant 303.And the display that leakage problem can directly result in display screen is sharp
Degree is not high, so as to also be difficult to accomplish spacing for 0.8mm or the display effect of more high definition.
Therefore, need a kind of at least part of solution of new high definition LED display structure above-mentioned existing in the prior art
Light leak and be difficult accomplish spacing for 0.8mm or more high definition display effect the problem of.
The content of the invention
For problems of the prior art, according to one embodiment of present invention, there is provided a kind of high definition LED display
Modular structure, including：
Substrate；
It is arranged on the LED pixel array of the M rows N row in first face of substrate；
It is covered in the sealant layer in the first face of the LED pixel array and the substrate；
The first light-shielding structure being arranged between LED pixel described in adjacent rows, and
The second light-shielding structure being arranged between the adjacent two row LED pixel.
In one embodiment of the invention, the first face of the substrate is provided with the weldering for carrying out LED chip patch weldering
Disk or pad array.
In one embodiment of the invention, the second face connection driving opposite with first face of substrate of the substrate
Chip.
In one embodiment of the invention, second face opposite with first face of substrate of the substrate has and is electrically connected
Connect the pad of the LED pixel array leads.
In one embodiment of the invention, the substrate is PCB substrate or glass substrate.
In one embodiment of the invention, in the LED pixel array of the M rows N row, M >=2, N >=2.
In one embodiment of the invention, in the LED pixel array of the M rows N row, each LED pixel at least contains
Three LED chip of red, green, blue.
In one embodiment of the invention, first light-shielding structure and/or second light-shielding structure is substantially not
The curing paint of printing opacity or the glue containing light screening material.
In one embodiment of the invention, the surface energy of first light-shielding structure and/or second light-shielding structure
Enough reflection lights.
In one embodiment of the invention, described in first light-shielding structure and/or second light-shielding structure are embedded to
The depth of sealant layer, the depth more than or equal to the LED pixel array surface to the sealant layer surface.
In one embodiment of the invention, a light-shielding structure and/or second light-shielding structure are through described close
Adhesive layer, and touch the first face of the substrate.
In one embodiment of the invention, a light-shielding structure intersects with second light-shielding structure, in each LED
Pixel side, which is formed, to be surrounded, and the encirclement is vertical with first face of substrate.
In one embodiment of the invention, the section shape of first light-shielding structure and/or second light-shielding structure
Shape is the combination of rectangle, V-type or rectangle and V-type.
In one embodiment of the invention, described surround is surrounded for polygon.
In one embodiment of the invention, described surround is surrounded for circular or ellipse.
According to another embodiment of the invention, there is provided a kind of manufacture method of high definition LED display modular structure, bag
Include：
Substrate with LED chip encapsulation welding tray array is provided；
LED chip is installed on the LED chip encapsulation welding tray array position of substrate and forms pixel array；
Sealing formation sealant layer is carried out to the one side containing LED chip of substrate；
Groove is formed in sealant layer between adjacent rows LED pixel point between adjacent two row LED pixel point；
In the groove and the sealant layer surface forms light screening material；
Remove the light screening material on the fluid sealant aspect surface.
In another embodiment of the present invention, the pad array and/or the line number of the pixel array are more than etc.
It is more than or equal to 2 row in 2 row, column numbers.
In another embodiment of the present invention, between adjacent rows LED pixel point between adjacent two row LED pixel point
The method that groove is formed in sealant layer is paddle-tumble method or mould indent method.
In another embodiment of the present invention, in the groove and the sealant layer surface formed light screening material side
Method is coating, technique is scraped in spray painting or pressure.
In another embodiment of the present invention, the pressure is scraped technique and is carried out under vacuo.
A kind of high definition LED display/display screen module manufacture method provided by the invention by PCB substrate COB seal
Dress, pressure welding encapsulation or patch encapsulate to form full color LED pixel (RGB chips), next, being sealed on LED pixel surface
Glue is protected, and then cutting forms groove in the sealing between LED pixel, is finally filled light screening material in a groove and is polished mill
Unnecessary light screening material above flat LED pixel, forms high definition LED display/display screen module structure.The high definition LED display/
Display screen module structure has the light-blocking member being centered around around each pixel, so that the leakage problem between reducing LED pixel, base
It can reach spacing for 0.8mm or the display effect of more high definition in the LED display of the structure fabrication, such as can accomplish that 500 is micro-
Until 100 microns within rice spacing.
Brief description of the drawings
For the above and other advantages and features of each embodiment that the present invention is furture elucidated, refer to the attached drawing is presented
The more specifically description of various embodiments of the present invention.It is appreciated that these attached drawings only describe the exemplary embodiments of the present invention, therefore
It is restriction on its scope to be not to be regarded as.In the accompanying drawings, in order to cheer and bright, identical or corresponding component will use identical or class
As mark represent.
Fig. 1 shows that a kind of prior art makes the front view of LED display modular structure 100 using LED light.
Fig. 2 shows that a kind of prior art makes the schematic diagram of LED display modular structure 200 using COB chip attachment.
Fig. 3 shows that a kind of prior art makes the light leak principle of LED display modular structure 200 using COB chip attachment
Schematic diagram.
Fig. 4 shows the front view of the high definition LED display modular structure 400 formed according to one embodiment of present invention.
Fig. 5 shows the part section signal of the high definition LED display structure 400 formed according to one embodiment of present invention
Figure.
Fig. 6 shows the part section signal of the high definition LED display structure 600 formed according to one embodiment of present invention
Figure.
Fig. 7 shows the high definition LED display single pixel formed according to other embodiments of the invention and its light-shielding structure
Front view.
Fig. 8 A to Fig. 8 F show to form 400 manufacturing process of high definition LED display structure according to one embodiment of present invention
Diagrammatic cross-section.
Fig. 9 shows to form 400 manufacturing process flow chart of high definition LED display structure according to one embodiment of present invention.
Embodiment
In the following description, with reference to each embodiment, present invention is described.However, those skilled in the art will recognize
Know can in the case of neither one or multiple specific details or with it is other replacement and/or addition method, material or component
Implement each embodiment together.In other situations, it is not shown or known structure, material or operation is not described in detail in order to avoid making this
The aspects of each embodiment of invention is obscure.Similarly, for purposes of explanation, specific quantity, material and configuration are elaborated, with
Comprehensive understanding to the embodiment of the present invention is just provided.However, the present invention can be implemented in the case of no specific detail.This
Outside, it should be understood that each embodiment shown in attached drawing is illustrative expression and is not drawn necessarily to scale.
In the present specification, the reference to " one embodiment " or " embodiment " means to combine embodiment description
A particular feature, structure, or characteristic is included at least one embodiment of the invention.In the short of this specification middle appearance everywhere
Language is not necessarily all referring to the same embodiment " in one embodiment ".
It should be noted that the embodiment of the present invention is described processing step with particular order, but this is simply
Convenience distinguishes each step, and is not the sequencing for limiting each step, in different embodiments of the invention, can be according to work
Skill is adjusted to adjust the sequencing of each step.
A kind of high definition LED display/display screen module manufacture method provided by the invention, this method pass through in PCB substrate
Either patch encapsulation or flip chip bonding encapsulate to form full color LED pixel (RGB chips) for upper COB encapsulation, pressure welding encapsulation, connect down
Come, carry out sealing protection on LED pixel surface, then cutting forms groove in the sealing between LED pixel, finally in groove
Middle filling light screening material and polishing polish light screening material unnecessary above LED pixel, formation high definition LED display/display screen mould
Group structure.High definition LED display/display screen module the structure has the light-blocking member being centered around around each pixel, so as to reduce
Leakage problem between LED pixel, the LED display based on the structure fabrication can reach spacing for the aobvious of 0.8mm or more high definition
Show effect, such as can accomplish within 500 microns of spacing until 100 microns.
4 and Fig. 5 is discussed in detail the high definition LED display formed according to one embodiment of present invention below in conjunction with the accompanying drawings
Modular structure.Fig. 4 shows the front view of the high definition LED display modular structure 400 formed according to one embodiment of present invention；
Fig. 5 shows the partial cutaway schematic of the high definition LED display structure 400 formed according to one embodiment of present invention.
As shown in figure 4, the high definition LED display modular structure 400 further comprises substrate 401, the LED pixel of M rows N row
402nd, it is covered in the fluid sealant 504 (not shown in Fig. 4) of LED pixel 402 and homonymy substrate surface, between every two rows pixel
The first light-shielding structure 403, and the second light-shielding structure 404 between every two row pixel.
Fig. 5 A are illustrated that the partial cutaway schematic for the high definition LED display structure 400 cut along diagram AA ' positions；
Fig. 5 B are illustrated that the partial cutaway schematic for the high definition LED display structure 400 cut along diagram BB ' positions.
Substrate 401 is usually PCB package substrates, while can also be the substrate of other similar materials such as glass.Substrate 401
(501) one side is provided with pad or pad array 503 (not shown in Fig. 4) for carrying out LED chip patch weldering, inside it
Optionally include conducting wire, its back side can be directly connected to driving chip, can also be electrically connected the lead shape of array module
Into backside pads (Fig. 4, Fig. 5 are all not shown).
The LED pixel 402 (502) of M rows N row is connected electrically in pad or the weldering of the LED chip patch weldering of substrate 401 (501)
On point 503.It can be realized by techniques such as flip chip bonding, lead (including but not limited to gold thread, copper wire or other conducting wires) bondings.Its
In each LED pixel 402 (502) include three LED chips encapsulation compositions of RGB (RGB), in addition, each LED pixel 402
(502) can also be compensated outside including tri- chips of RGB, then including a fourth chip (as increased a green light core
Piece or red light chips) to increase color saturation or other performances.In the array of M rows N row, the line number of M >=2, i.e. array is not
Less than 2 rows；The columns of N >=2, i.e. array is also not less than 2 row.
The fluid sealant 504 for being covered in LED pixel 402 (502) and homonymy substrate surface can be resin or other are similar
Light fluid sealant, sealing adhesive process can use pressure injection technique, Self-leveling technique, drop adhesive process etc..After 504 sealing of fluid sealant, it is necessary to
Uniform, smooth LED pixel 402 (502) and homonymy substrate surface can be covered, fixed, guarantor can be played to LED pixel 402 (502)
Shield, insulation, even light etc. act on.
First light-shielding structure 403 is embedded among fluid sealant 504 between every two rows LED pixel.Its depth can basis
It needs to be determined that the most deep inner surface (table contacted with substrate 401 that fluid sealant 504 can be extended to from the outer surface of fluid sealant 504
Face), the material of the first light-shielding structure can be shading paint, glue containing light screening material (such as titanium dioxide) etc., the light screening material
The structure of formation can reach the effect of light tight or substantially impervious light, and preferential also has reflecting effect.
Second light-shielding structure 404 is also embedded among fluid sealant 504 between every two row LED pixel.Its depth also may be used
Determine as needed, the most deep inner surface that fluid sealant 504 can also be extended to from the outer surface of fluid sealant 504 (connects with substrate 401
Tactile surface), the material of the second light-shielding structure is shading paint, the glue containing light screening material (such as titanium dioxide) etc., the lightproof material
The structure that material is formed can reach the effect of light tight or substantially impervious light, and preferential also has reflecting effect.Second light-shielding structure
404 and first light-shielding structure 403 each LED pixel 402 is formed surround together, which vertical with base plan also can may be used
To form certain angle (non-90 degree) with substrate.
Fig. 6 shows it is that the part section of the high definition LED display structure 600 formed according to one embodiment of present invention shows
It is intended to.The cross sectional shape of its first light-shielding structure is excellent unlike the high definition LED display structure 400 formed from previous embodiment
The cross sectional shape for electing V-type or, its second light-shielding structure as can also be preferably V-type.Therefore, those skilled in the art should manage
The cross sectional shape of solution, the first light-shielding structure and/or the second light-shielding structure can be the knot of rectangle, V-type, reverse V-shaped, rectangle and V-type
Close and other similar cross section structures are all in protection scope of the present invention.
Fig. 7 shows the single led pixel of high definition LED display formed according to other embodiments of the invention and its shading knot
The front view of structure.Fig. 7 (a) is illustrated that light-shielding structure forms LED pixel straight-flanked ring around encirclement；Fig. 7 (b) is illustrated that shading
Structure forms LED pixel triangular loop around encirclement；Fig. 7 (c) be illustrated that light-shielding structure to LED pixel formed hexagonal rings around
Surround.In addition light-shielding structure can also form LED pixel circular, ellipse and other loop-likes around encirclement.
With reference to Fig. 8 A to Fig. 8 F and Fig. 9 the mistake of high definition LED display modular structure 400 is formed to be described in detail
Journey.Fig. 8 A to Fig. 8 F show that forming 400 manufacturing process section of high definition LED display structure according to one embodiment of present invention shows
It is intended to.Fig. 9 shows to form 400 manufacturing process flow chart of high definition LED display structure according to one embodiment of present invention.
First, in step 901, as shown in Figure 8 A, there is provided the substrate 801 with LED chip encapsulation welding tray 802.Substrate 801
Usually PCB package substrates, while can also be the substrate of other similar materials such as glass.The one side of substrate 801 is provided with use
In the pad or pad array 802 that carry out LED chip patch weldering, it is internal optionally to include conducting wire, its back side can be with
Driving chip is directly connected to, the lead that can also be electrically connected array module forms backside pads (not shown).
Next, in step 902, as shown in Figure 8 B, electricity is welded on the LED chip encapsulation welding tray position 802 of substrate 801
Connect LED chip and form pixel 803.LED pixel point 803 is generally the pel array of M rows N row.Can by flip chip bonding, draw
The techniques such as line (including but not limited to gold thread, copper wire or other conducting wires) bonding are realized.Each LED pixel point can include RGB
(RGB) three LED chip encapsulation.In addition, in addition to tri- chips of RGB, each LED pixel point can also include fourth chip,
For color compensation (as increased a green light chip or red light chips), to increase color saturation or other performances.In M rows
In the array of N row, the line number of M >=2, i.e. array is not less than 2 rows；The columns of N >=2, i.e. array is also not less than 2 row.
Then, in step 903, as shown in Figure 8 C, the unilateral carry out sealing containing LED core to substrate 801, so that in LED core
Piece and homonymy substrate surface form fluid sealant 804.Fluid sealant 804 can be resin or other similar printing opacity fluid sealants, sealing work
Skill can use pressure injection technique, Self-leveling technique, drop adhesive process etc..After 804 sealing of fluid sealant, it would be desirable to be able to uniform, smooth covering
LED pixel point 803 and homonymy substrate surface, can play the role of LED pixel point 803 fixed, protection, insulation etc..
Next, in step 904, as in fig. 8d, fluid sealant is opened along the white space between LED pixel point 803
Groove, forms groove 805.Specific fluting is included along opening the first groove row LED pixel point, and along opening the second groove between row pixel.
The depth of groove 805 can determine as needed, the most deep inner surface that fluid sealant 804 can be extended to from the outer surface of fluid sealant 804,
The surface contacted with substrate 801.First groove and the second groove, which are together formed each LED pixel 803, to be surrounded, the encirclement and substrate
801 planes are vertical.
Then, in step 905, as illustrated in fig. 8e, the groove 805 opened step 904 and 804 surface of fluid sealant carry out shading
Material 806 is filled.Light screening material can be shading paint, glue containing light screening material (such as titanium dioxide) etc..Specific filling side
Method can be coating, spray painting, press and scrape.In one particular embodiment of the present invention, (an air can be less than in vacuum
Pressure) be filled under environment after carry out back pressure again after dry.The structure that the light screening material is formed can reach light tight or substantially not
The effect of printing opacity, preferential also has reflecting effect.
Finally, in step 906, as shown in Figure 8 F, the more of 804 outer surface of fluid sealant are removed by the technique such as grinding, polishing
Remaining light screening material, light screening material is only retained in groove 805, forms required light-shielding structure 807.The top surface of the light-shielding structure 807
It can be substantially flush with the top surface of fluid sealant 804.
Based on this kind of high definition LED display/display screen module manufacture method provided by the invention, by PCB substrate
COB encapsulation, pressure welding encapsulation or patch encapsulate to form full color LED pixel (RGB chips), next, LED pixel surface into
Row sealing is protected, and then cutting forms groove in the sealing between LED pixel, is finally filled light screening material in a groove and is thrown
Unnecessary light screening material, forms high definition LED display/display screen module structure above the flat LED pixel of tarry matter.High definition LED is shown
Display screen/display screen module structure has the light-blocking member being centered around around each pixel, so that the light leak between reducing LED pixel is asked
Topic, the LED display based on the structure fabrication can reach spacing for 0.8mm or the display effect of more high definition, such as can accomplish
Until 100 microns within 500 microns of spacing.
Although described above is various embodiments of the present invention, however, it is to be understood that they are intended only as example to present
, and without limitation.For those skilled in the relevant art it is readily apparent that various combinations, modification can be made to it
With change without departing from the spirit and scope of the present invention.Therefore, the width of the invention disclosed herein and scope should not be upper
State disclosed exemplary embodiment to be limited, and should be defined according only to the appended claims and its equivalent substitution.
Claims (19)
1. a kind of high definition LED display modular structure, including：
Substrate；
It is arranged on the LED pixel array of the M rows N row in first face of substrate；
It is covered in the sealant layer in the first face of the LED pixel array and the substrate；
The first light-shielding structure being arranged between LED pixel described in adjacent rows, and
The second light-shielding structure being arranged between the adjacent two row LED pixel.
2. high definition LED display modular structure as claimed in claim 1, it is characterised in that the first face of the substrate is set
It is useful for carrying out the pad or pad array of LED chip patch weldering.
3. high definition LED display modular structure as claimed in claim 1, it is characterised in that the substrate with the substrate
Opposite the second face connection driving chip in first face.
4. high definition LED display modular structure as claimed in claim 1, it is characterised in that the substrate with the substrate
The second opposite face of first face has the pad for being electrically connected the LED pixel array leads.
5. high definition LED display modular structure as claimed in claim 1, it is characterised in that the substrate is PCB substrate or glass
Glass substrate.
6. high definition LED display modular structure as claimed in claim 1, it is characterised in that the LED pixel battle array of the M rows N row
In row, M >=2, N >=2.
7. high definition LED display modular structure as claimed in claim 1, it is characterised in that the LED pixel battle array of the M rows N row
In row, each LED pixel at least contains three LED chip of red, green, blue.
8. high definition LED display modular structure as claimed in claim 1, it is characterised in that first light-shielding structure and/or
Second light-shielding structure is the curing paint of substantially impervious light or the glue containing light screening material.
9. high definition LED display modular structure as claimed in claim 1, it is characterised in that first light-shielding structure and/or
The surface of second light-shielding structure being capable of reflection light.
10. high definition LED display modular structure as claimed in claim 1, it is characterised in that first light-shielding structure and/
Or second light-shielding structure is embedded to the depth of the sealant layer, more than or equal to the LED pixel array surface to described close
The depth of sealing layer surface.
11. high definition LED display modular structure as claimed in claim 1, it is characterised in that a light-shielding structure and/or
Second light-shielding structure runs through the sealant layer, and touches the first face of the substrate.
12. high definition LED display modular structure as claimed in claim 1, it is characterised in that a light-shielding structure with it is described
Second light-shielding structure intersects, and is formed and surrounded in each LED pixel side, and the encirclement is vertical with first face of substrate.
13. high definition LED display modular structure as claimed in claim 1, it is characterised in that first light-shielding structure and/
Or the cross sectional shape of second light-shielding structure is the combination of rectangle, V-type or rectangle and V-type.
14. high definition LED display modular structure as claimed in claim 12, it is characterised in that the encirclement is polygon bag
Enclose, circular or ellipse surrounds.
15. a kind of manufacture method of high definition LED display modular structure, including：
Substrate with LED chip encapsulation welding tray array is provided；
LED chip is installed on the LED chip encapsulation welding tray array position of substrate and forms pixel array；
Sealing formation sealant layer is carried out to the one side containing LED chip of substrate；
Groove is formed in sealant layer between adjacent rows LED pixel point between adjacent two row LED pixel point；
In the groove and the sealant layer surface forms light screening material；
Remove the light screening material on the fluid sealant aspect surface.
16. method as claimed in claim 15, it is characterised in that the row of the pad array and/or the pixel array
Number is more than or equal to 2 row, column numbers and is more than or equal to 2 row.
17. method as claimed in claim 15, it is characterised in that between adjacent rows LED pixel point and adjacent two arrange LED pictures
The method that groove is formed in sealant layer between vegetarian refreshments is paddle-tumble method or mould indent method.
18. method as claimed in claim 15, it is characterised in that in the groove and the sealant layer surface forms shading
The method of material is coating, technique is scraped in spray painting or pressure.
19. method as claimed in claim 18, it is characterised in that the pressure is scraped technique and carried out under vacuo.
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| CN109192748A (en) * | 2018-09-26 | 2019-01-11 | 利亚德光电股份有限公司 | LED display module |
| CN109215520A (en) * | 2018-10-11 | 2019-01-15 | 惠州市华星光电技术有限公司 | LED display and preparation method thereof |
| CN109616026A (en) * | 2019-01-30 | 2019-04-12 | 华域视觉科技(上海)有限公司 | Improve the method and LED display of LED static state screen display effect |
| CN109741685A (en) * | 2019-02-18 | 2019-05-10 | 深圳市洲明科技股份有限公司 | A kind of LED display module and preparation method thereof |
| CN110911391A (en) * | 2019-11-21 | 2020-03-24 | 东莞市中麒光电技术有限公司 | Small-space display screen module and manufacturing method thereof |
| CN111161640A (en) * | 2018-11-07 | 2020-05-15 | 深圳Tcl新技术有限公司 | Assembled LED display panel |
| CN111477117A (en) * | 2019-01-24 | 2020-07-31 | 深圳光峰科技股份有限公司 | L ED display screen and preparation method thereof |
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| CN112786742A (en) * | 2021-01-05 | 2021-05-11 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
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